JP5037133B2 - 電極の調製方法及び電極 - Google Patents
電極の調製方法及び電極 Download PDFInfo
- Publication number
- JP5037133B2 JP5037133B2 JP2006532238A JP2006532238A JP5037133B2 JP 5037133 B2 JP5037133 B2 JP 5037133B2 JP 2006532238 A JP2006532238 A JP 2006532238A JP 2006532238 A JP2006532238 A JP 2006532238A JP 5037133 B2 JP5037133 B2 JP 5037133B2
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- JP
- Japan
- Prior art keywords
- electrode
- metal oxide
- platinum
- oxide
- coating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/052—Electrodes comprising one or more electrocatalytic coatings on a substrate
- C25B11/053—Electrodes comprising one or more electrocatalytic coatings on a substrate characterised by multilayer electrocatalytic coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1225—Deposition of multilayers of inorganic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/055—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the substrate or carrier material
- C25B11/057—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the substrate or carrier material consisting of a single element or compound
- C25B11/061—Metal or alloy
- C25B11/063—Valve metal, e.g. titanium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
- C25B11/00—Electrodes; Manufacture thereof not otherwise provided for
- C25B11/04—Electrodes; Manufacture thereof not otherwise provided for characterised by the material
- C25B11/051—Electrodes formed of electrocatalysts on a substrate or carrier
- C25B11/073—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material
- C25B11/091—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds
- C25B11/093—Electrodes formed of electrocatalysts on a substrate or carrier characterised by the electrocatalyst material consisting of at least one catalytic element and at least one catalytic compound; consisting of two or more catalytic elements or catalytic compounds at least one noble metal or noble metal oxide and at least one non-noble metal oxide
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Ceramic Engineering (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Chemically Coating (AREA)
- Hybrid Cells (AREA)
- Electroluminescent Light Sources (AREA)
Description
19-27及びR.F. Savinellら, J.
Electrochem. Soc. 137(1990) 489-494に見られる。
前記電極支持体は本明細書に記載されるとおりであることが好ましい。特に、この電極支持体は好適には多孔にされ、又は約1mmから約10mmまで、好ましくは約2mmから約5mmまでの直径を有する開口部を有するメッシュの形状を有する。この特定範囲内の開口部を有する電極は運転電解槽に浸漬された場合に発生ガスの小さい気泡を生じ、これが順に、特に膜電解槽中で増大された均一な電流分布及び一層低い抵抗損をもたらすことがわかった。
Claims (10)
- 電極支持体を用意し、前記電極支持体にバルブメタル酸化物及び少なくとも2種の白金族金属酸化物の水溶性の前駆体を含む第一の実質的に水性の被覆溶液(該溶液中の溶媒が少なくとも70容積%の水を含む)を付着し、この第一の被覆溶液を処理して前記電極支持体上に第一の金属酸化物被覆層を得、前記第一の被覆層にバルブメタル酸化物及び少なくとも一種の白金族金属酸化物の前駆体を含む第二の実質的に有機の被覆溶液(該溶液中の溶媒が少なくとも70容積%の有機溶媒を含む)を付着することを含む電極の調製方法であって、前記第二の実質的に有機の被覆溶液の前記前駆体の少なくとも一種が有機形態であり、前記第二の被覆溶液を処理して前記第一の被覆層の上に第二の金属酸化物被覆層を得ることを特徴とする電極の調製方法。
- 前記白金族金属酸化物の前駆体がイリジウム、パラジウム、白金、ロジウム、オスミウム、及びルテニウムの少なくとも一種の可溶性化合物を含む、請求項1に記載の方法。
- 前記バルブメタル酸化物の前駆体がアルミニウム、ジルコニウム、ビスマス、タングステン、ニオブ、チタン、ケイ素及びタンタルの少なくとも一種の可溶性化合物である、請求項1又は2に記載の方法。
- 前記白金族金属酸化物の前駆体が一種の可溶性ルテニウム化合物並びにイリジウム、パラジウム、白金、ロジウム、及びオスミウムの少なくとも一種の可溶性化合物を含む、請求項1から3のいずれかに記載の方法。
- 前記電極支持体の材料がチタン、タンタル、ジルコニウム、ニオブ、タングステン、及びケイ素の少なくとも一種のバルブメタルを含む、請求項1から4のいずれかに記載の方法。
- 請求項1から5のいずれかに記載の方法により得られる電極。
- 請求項1から5のいずれかに記載の方法により得られる電極であって、電極支持体、10mC/cm2から200mC/cm2までの電荷/投影面積を有する第一の金属酸化物被覆層、前記電極支持体に付着されたバルブメタル酸化物及び少なくとも2種の白金族金属酸化物を含む前記第一の被覆層、及び前記第一の層に付着されたバルブメタル酸化物及び少なくとも一種の白金族金属酸化物を含む210mC/cm2から1000mC/cm2までの電荷/投影面積を有する第二の金属酸化物被覆層を含むことを特徴とする電極。
- 前記白金族金属酸化物がイリジウム、白金、パラジウム、ロジウム、オスミウム、及びルテニウムの少なくとも一種の酸化物を含む、請求項7に記載の電極。
- 前記白金族金属酸化物が酸化ルテニウム並びにイリジウム、白金、パラジウム、ロジウム、及びオスミウムの少なくとも一種の酸化物から選ばれる、請求項7又は8に記載の電極。
- 電解槽中での請求項6から9のいずれかに記載の電極の使用。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP03445107.0 | 2003-10-08 | ||
| EP03445107 | 2003-10-08 | ||
| PCT/SE2004/001428 WO2005033367A1 (en) | 2003-10-08 | 2004-10-06 | Electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007507612A JP2007507612A (ja) | 2007-03-29 |
| JP5037133B2 true JP5037133B2 (ja) | 2012-09-26 |
Family
ID=34400645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006532238A Expired - Fee Related JP5037133B2 (ja) | 2003-10-08 | 2004-10-06 | 電極の調製方法及び電極 |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP1670973B1 (ja) |
| JP (1) | JP5037133B2 (ja) |
| KR (1) | KR100787276B1 (ja) |
| CN (2) | CN101942673A (ja) |
| AU (1) | AU2004277578B2 (ja) |
| CA (1) | CA2541311C (ja) |
| PL (1) | PL1670973T3 (ja) |
| WO (1) | WO2005033367A1 (ja) |
| ZA (1) | ZA200601219B (ja) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100812990B1 (ko) * | 2006-11-08 | 2008-03-13 | 고등기술연구원연구조합 | 모노-폴라형 전극의 제조방법 |
| EP2390385B1 (en) * | 2010-05-25 | 2015-05-06 | Permelec Electrode Ltd. | Anode for electrolysis and manufacturing method thereof |
| JP5456744B2 (ja) * | 2010-11-04 | 2014-04-02 | ペルメレック電極株式会社 | 金属電解採取方法 |
| IT1403585B1 (it) * | 2010-11-26 | 2013-10-31 | Industrie De Nora Spa | Anodo per evoluzione elettrolitica di cloro |
| CN102400203B (zh) * | 2011-11-09 | 2014-06-18 | 广东达志环保科技股份有限公司 | 一种三价铬氯化物体系镀铬阳极 |
| AU2015340814B2 (en) * | 2014-10-27 | 2019-12-05 | Industrie De Nora S.P.A. | Electrode for electrochlorination processes and method of manufacturing thereof |
| AR106069A1 (es) * | 2015-09-25 | 2017-12-06 | Akzo Nobel Chemicals Int Bv | Electrodo y proceso para su manufactura |
| AR106068A1 (es) * | 2015-09-25 | 2017-12-06 | Akzo Nobel Chemicals Int Bv | Electrodo y proceso para su manufactura |
| CN108299868A (zh) * | 2016-08-25 | 2018-07-20 | 先丰通讯股份有限公司 | 触媒涂料及使用其的阳极 |
| CN106367779A (zh) * | 2016-11-07 | 2017-02-01 | 南昌专腾科技有限公司 | 一种多孔钛基电极材料及其制备方法 |
| CN107142496A (zh) * | 2017-04-10 | 2017-09-08 | 广东卓信环境科技股份有限公司 | 一种内层活性涂液及其制备方法 |
| CN109790634B (zh) * | 2017-08-11 | 2021-02-23 | 株式会社Lg化学 | 电解用电极及其制备方法 |
| KR101950465B1 (ko) | 2017-08-11 | 2019-05-02 | 주식회사 엘지화학 | 전해용 전극 및 이의 제조방법 |
| CN108070877B (zh) * | 2017-11-09 | 2020-07-07 | 江苏安凯特科技股份有限公司 | 一种用于电解生产的阴极及其制备方法 |
| CN108048862B (zh) * | 2017-11-16 | 2020-04-28 | 江苏安凯特科技股份有限公司 | 一种析氯用阳极及其制备方法 |
| CN108048865B (zh) * | 2017-11-17 | 2020-04-28 | 江苏安凯特科技股份有限公司 | 一种电极及其制备方法和应用 |
| EP3758582A1 (en) | 2018-02-26 | 2021-01-06 | T&W Engineering A/S | Electrode for detecting bioelectrical signals |
| WO2019240200A1 (ja) * | 2018-06-12 | 2019-12-19 | 国立研究開発法人科学技術振興機構 | 触媒及びその使用方法 |
| KR102347982B1 (ko) | 2018-06-12 | 2022-01-07 | 주식회사 엘지화학 | 전기분해용 양극 및 이의 제조방법 |
| KR102503040B1 (ko) * | 2018-12-21 | 2023-02-23 | 주식회사 엘지화학 | 복합 금속 인화물을 포함하는 산화 전극 및 이의 제조방법 |
| EP3748042A1 (en) | 2019-06-03 | 2020-12-09 | Permascand Ab | Electrode assembly for electrochemical processes and method of restoring the same |
| CN113151885B (zh) * | 2021-03-15 | 2023-03-21 | 广州鸿葳科技股份有限公司 | 一种电镀用钛阳极及其制备方法 |
| EP4636134A1 (en) * | 2022-12-14 | 2025-10-22 | De Nora Permelec Ltd | Positive electrode for chlorine generation electrolysis |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4070504A (en) * | 1968-10-29 | 1978-01-24 | Diamond Shamrock Technologies, S.A. | Method of producing a valve metal electrode with valve metal oxide semi-conductor face and methods of manufacture and use |
| GB1294373A (en) * | 1970-03-18 | 1972-10-25 | Ici Ltd | Electrodes for electrochemical processes |
| BR8006373A (pt) * | 1979-10-08 | 1981-04-14 | Diamond Shamrock Corp | Eletrodo para uso em processos eletroliticos, processo para sua fabricacao, e uso do eletrodo |
| GB2083837B (en) * | 1980-08-18 | 1984-06-27 | Diamond Shamrock Corp | Manufacture of electrode with manganese dioxide coating valve metal base intermediate semiconducting layer |
| JPS5861286A (ja) * | 1981-10-08 | 1983-04-12 | Tdk Corp | 電解用電極およびその製造方法 |
| JPH0660427B2 (ja) * | 1988-05-31 | 1994-08-10 | ティーディーケイ株式会社 | 酸素発生用電極及びその製造方法 |
| JPH05209299A (ja) * | 1992-01-28 | 1993-08-20 | Nippon Steel Corp | 不溶性電極及びその製造方法 |
| US5503663A (en) * | 1994-11-30 | 1996-04-02 | The Dow Chemical Company | Sable coating solutions for coating valve metal anodes |
| US5587058A (en) * | 1995-09-21 | 1996-12-24 | Karpov Institute Of Physical Chemicstry | Electrode and method of preparation thereof |
| EP0867527B1 (fr) * | 1997-02-27 | 2001-03-21 | Aragonesas Industrias Y Energia, S.A. | Electrode à recouvrement catalytique pour des processus électrochimiques et procédé de fabrication de celle-ci |
| JP3725685B2 (ja) * | 1997-11-21 | 2005-12-14 | ペルメレック電極株式会社 | 過酸化水素製造装置 |
| US6217729B1 (en) * | 1999-04-08 | 2001-04-17 | United States Filter Corporation | Anode formulation and methods of manufacture |
| CN1179068C (zh) * | 2000-08-22 | 2004-12-08 | 黄永昌 | 不溶性电极和制备方法及用途 |
-
2004
- 2004-10-06 CN CN2010102936821A patent/CN101942673A/zh active Pending
- 2004-10-06 CN CN2004800264108A patent/CN1849414B/zh not_active Expired - Fee Related
- 2004-10-06 ZA ZA200601219A patent/ZA200601219B/en unknown
- 2004-10-06 PL PL04775517T patent/PL1670973T3/pl unknown
- 2004-10-06 CA CA2541311A patent/CA2541311C/en not_active Expired - Fee Related
- 2004-10-06 KR KR1020067006852A patent/KR100787276B1/ko not_active Expired - Fee Related
- 2004-10-06 JP JP2006532238A patent/JP5037133B2/ja not_active Expired - Fee Related
- 2004-10-06 EP EP04775517.8A patent/EP1670973B1/en not_active Expired - Lifetime
- 2004-10-06 WO PCT/SE2004/001428 patent/WO2005033367A1/en not_active Ceased
- 2004-10-06 AU AU2004277578A patent/AU2004277578B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN1849414A (zh) | 2006-10-18 |
| CA2541311C (en) | 2010-06-01 |
| EP1670973A1 (en) | 2006-06-21 |
| EP1670973B1 (en) | 2018-04-11 |
| JP2007507612A (ja) | 2007-03-29 |
| PL1670973T3 (pl) | 2018-09-28 |
| CN1849414B (zh) | 2011-01-26 |
| CN101942673A (zh) | 2011-01-12 |
| AU2004277578B2 (en) | 2008-07-17 |
| WO2005033367A1 (en) | 2005-04-14 |
| WO2005033367A8 (en) | 2006-04-06 |
| CA2541311A1 (en) | 2005-04-14 |
| ZA200601219B (en) | 2007-05-30 |
| KR100787276B1 (ko) | 2007-12-20 |
| KR20060085676A (ko) | 2006-07-27 |
| AU2004277578A1 (en) | 2005-04-14 |
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