JP5040255B2 - Chip type solid electrolytic capacitor - Google Patents

Description

  The present invention relates to a chip-type solid electrolytic capacitor that uses a conductive polymer as a solid electrolyte and is surface mountable among capacitors used in various electronic devices.

  Along with the higher frequency of electronic equipment, capacitors that are one of the electronic components have been required to have better impedance characteristics in the high frequency range than before, and electrical conductivity has been increased to meet these requirements. Various solid electrolytic capacitors using a highly conductive polymer as a solid electrolyte have been studied.

  In recent years, a solid electrolytic capacitor used around a CPU of a personal computer has been strongly demanded to have a small size and a large capacity. Further, not only a low ESR (equivalent series resistance) is reduced in response to a higher frequency but also a noise. There is a strong demand for low ESL (equivalent series inductance) excellent in removal and transient response, and various studies have been made to meet such demand.

  FIG. 13 is a perspective view showing the configuration of this type of conventional chip-type solid electrolytic capacitor, FIG. 14 is a perspective view showing the internal structure of the chip-type solid electrolytic capacitor, and in FIG. 13 and FIG. A capacitor element constituting a solid electrolytic capacitor using a conductive polymer as a solid electrolyte, 21 is an anode part of the capacitor element 20, 22 is the cathode part, and 23 is the insulating part. A plurality of capacitor elements 20 are arranged so as to overlap each other in the opposite direction.

  24 is an anode lead terminal having one end connected to the anode portion 21 of the capacitor element 20, 25 is a cathode lead terminal to which the cathode portion 22 of the capacitor element 20 is also connected, and 26 is an exterior resin obtained by molding them. A solid electrolytic capacitor is formed by this, and the anode lead terminal 24 and the cathode lead terminal 25 are exposed to the side and bottom of the solid electrolytic capacitor so as to constitute a four-terminal chip type solid electrolytic capacitor, respectively. It is.

  The conventional chip-type solid electrolytic capacitor configured as described above has excellent high-frequency characteristics and noise absorption, and can achieve low ESL.

As prior art document information related to the invention of this application, for example, Patent Document 1 is known.
Japanese Patent Laid-Open No. 6-120088

  However, the conventional chip-type solid electrolytic capacitor is compared with a general two-terminal structure in which one capacitor element or a plurality of capacitor elements are stacked, molded with an exterior resin, and the anode / cathode terminal is drawn out. Although it has excellent high-frequency characteristics and low ESL, this structure has a limit of suppressing ESL to about 500 pH. However, there was a problem that further ESL reduction is necessary.

  Therefore, in order to realize such further reduction in ESL, the present inventors have disclosed in Japanese Patent Application No. 2006-26812 a chip-type solid electrolysis having a structure as shown in FIGS. 15 (a) to 15 (d). A capacitor is proposed.

  15A to 15D are a plan sectional view, a front sectional view, a bottom sectional view, and a bottom view showing the configuration of the chip-type solid electrolytic capacitor proposed by the present inventors. In FIG. Represents a capacitor element, and this capacitor element 31 is provided with an insulating portion (not shown) at a predetermined position of an anode body made of a valve metal having a roughened surface and formed with a dielectric oxide film layer, and an anode electrode portion 32. And a cathode forming portion (not shown), and a solid electrolyte layer made of a conductive polymer and a cathode layer made of carbon and silver paste (all not shown) on the dielectric oxide film layer of the cathode forming portion. The cathode electrode portion 33 is formed by sequentially stacking and forming.

  Reference numeral 34 denotes a capacitor element laminate in which a plurality of capacitor elements 31 are laminated. The capacitor element laminate 34 is laminated in such a manner that the anode electrode portions 32 of the capacitor elements 31 are alternately arranged in opposite directions. It is constituted by doing.

  35 is an anode comb frame in which the anode electrode portions 32 of the capacitor element laminate 34 are integrally joined, and 36 is a cathode comb frame in which the cathode electrode portions 33 of the capacitor element laminate 34 are joined together.

  Reference numeral 37 denotes an anode comb terminal in which the anode comb frame 35 is bonded to the upper surface. The anode comb terminal 37 is provided with thin portions 37b at both ends in the width direction, and a central portion excluding the thin portion 37b is an anode when mounted. This is the terminal portion 37a.

  Reference numeral 38 denotes a cathode comb terminal obtained by bonding the cathode comb frame 36 to the upper surface. The cathode comb terminal 38 is provided with a thin portion 38b at the center in the width direction, and both end portions excluding the thin portion 38b are cathodes when mounted. This is the terminal portion 38a.

  39 is an insulating exterior resin integrally covering the capacitor element laminate 34, the anode comb frame 35, the cathode comb frame 36, the anode comb terminal 37, and the cathode comb terminal 38. The anode comb terminal 37, the cathode comb terminal The thin-walled portions 37b and 38b respectively provided on the plate 38 are also integrally covered with the exterior resin 39, and the anode terminal portion 37a and the cathode terminal portion 38a are opposed to the lower surface, which is the mounting surface of the chip-type solid electrolytic capacitor, respectively. A four-terminal structure is exposed at the location.

  The thus configured chip-type solid electrolytic capacitor has a four-terminal structure in which the anode terminal portion 37a and the cathode terminal portion 38a are exposed on the lower surface serving as the mounting surface, and flows between the terminals. The magnetic flux generated by the current cancels each other and the ESL can be greatly reduced. Further, the distance between the terminals is made as close as possible to reduce the loop area of the current, thereby further reducing the ESL. The ESL can be reduced to about 1/5 or less from the 522 pH of the conventional product to 98 pH.

  However, the chip-type solid electrolytic capacitor configured as described above has a problem that it is extremely difficult to further reduce the ESL although the ESL is greatly reduced.

  An object of the present invention is to provide a chip-type solid electrolytic capacitor capable of solving such a conventional problem and realizing further reduction in ESL.

In order to solve the above problems, the present invention provides an element unit in which a plurality of flat capacitor elements are laminated, a unit laminate in which the element units are alternately arranged on opposite sides, and the unit laminate. A cathode comb terminal joined to the lower surface of the cathode electrode part located at the center of the laminate, and a pair of terminal parts joined to the lower surface of the anode electrode part located at both ends of the unit laminate, respectively. An anode terminal connected by a plate-shaped inductor section; a terminal section of a pair of cathode terminals joined to both ends of the lower surface of the cathode comb terminal in a direction intersecting the direction connecting the terminal sections of the anode terminal; and the anode these made of insulating sheathing resin coated together in a state in which the lower surface is exposed terminal portions of the pair of terminal portions and the cathode terminal provided in the terminal, the inductor section, the anode terminal Is connected to the inner side surface of the terminal portion, an inter-terminal portion of the cathode terminal, which is disposed below the cathode lead terminal is obtained by the structure forming the π-type filter.

  As described above, the chip-type solid electrolytic capacitor according to the present invention is generated by the current flowing between the terminals, with the structure of the four-terminal structure in which the anode terminal and the cathode terminal are exposed at the two opposite surfaces on the bottom surface. ESL can be greatly reduced by canceling out the magnetic fluxes that are generated, and a pair of terminal portions provided on the anode terminal are connected by a plate-shaped inductor portion to form a π-type filter. The effect that further lowering of ESL can be achieved is obtained, and the use of the element unit in which the capacitor elements are stacked makes it possible to simplify the assembly process and stabilize the assembly accuracy. An effect can also be obtained.

(Embodiment 1)
Hereinafter, the first and sixth aspects of the present invention will be described with reference to the first embodiment.

  1A to 1F are a plan sectional view, a front sectional view, a left side sectional view, a right side sectional view, a bottom sectional view, showing a configuration of a chip-type solid electrolytic capacitor according to Embodiment 1 of the present invention. 1 is a bottom view. In FIG. 1, reference numeral 1 denotes a capacitor element. The capacitor element 1 is illustrated at a predetermined position of an anode body made of a valve metal having a roughened surface and a dielectric oxide film layer formed thereon. An insulating portion that is not provided is separated into an anode electrode portion 2 and a cathode forming portion (not shown), and a solid electrolyte layer made of a conductive polymer, carbon and silver paste is formed on the dielectric oxide film layer of the cathode forming portion. A cathode electrode portion 3 is formed by sequentially laminating and forming cathode layers (all not shown) to be configured in a flat plate shape.

  Reference numeral 4 denotes an element unit in which a plurality of capacitor elements 1 are stacked. The element unit 4 is configured by stacking a plurality of (three in the present embodiment) capacitor elements 1 in the same direction. The cathode electrode portions 3 are bonded to each other by a conductive silver paste (not shown), and each anode electrode portion 2 is bound so that the anode comb terminal 5 is wound around the outer periphery of the anode electrode portion 2 and bundled. The terminal 5 and the anode electrode part 2 are connected by means such as resistance welding. The anode comb terminal 5 is not an indispensable member, and the anode electrode portions 2 may be directly coupled by means such as resistance welding.

  6a and 6b show a state in which a unit laminate body is formed by laminating the element unit 4 in a plurality of stages (two stages in the present embodiment) so that the anode electrode portions 2 are alternately arranged in opposite directions. It is a spacer for joining the anode comb terminal 5 which bound the anode electrode part 2 and the anode terminal mentioned later, These joining is performed by means, such as resistance welding. The spacers 6a and 6b are not indispensable members, and the anode electrode portion 2 or the anode comb terminal 5 and the anode terminal may be directly coupled by means such as resistance welding.

  7 is a cathode comb terminal, and this cathode comb terminal 7 is joined to the lower surface of the cathode electrode portion 3 located at the center of the unit laminate body via a conductive silver paste (not shown). Reference numerals 7a denote guide walls respectively provided at both ends of the cathode comb terminal 7. By electrically connecting the inner surface of the guide wall 7a and the cathode electrode portion 3 via a conductive silver paste, ESL is reduced. Further reduction is made.

  Reference numeral 8 denotes an anode terminal. The anode terminal 8 has a pair of terminal portions 8a joined to the lower surfaces of the spacers 6a and 6b, and the terminal portions 8a are connected to each other by a plate-like inductor portion 8b. A part of the anode terminal 8 is extended so as to protrude from an exterior resin, which will be described later, in a top view, and a bent portion 8c is formed by bending the extended portion upward along the side surface of the exterior resin. It is configured. Further, both ends of the terminal portion 8a are provided with an upward step.

  Reference numeral 9 denotes a pair of cathode terminals. The cathode terminals 9 are bonded to both ends of the lower surface of the cathode comb terminal 7, respectively, and a part of the cathode terminal 9 is projected from an exterior resin, which will be described later, in a top view. It is constructed by providing a bent portion 9a that is extended and bent upward along the side surface of the exterior resin.

  Reference numeral 10 denotes an insulating exterior resin. The exterior resin 10 integrates the element unit 4, the anode comb terminal 5, the spacers 6 a and 6 b, the cathode comb terminal 7, a part of the anode terminal 8, and a part of the cathode terminal 9. By covering the surface, a four-terminal structure in which the terminal portion 8a of the anode terminal 8 and the cathode terminal 9 are exposed at two locations facing each other is formed on the lower surface serving as a mounting surface, and the inductor provided on the anode terminal 8 The portion 8b is covered with the exterior resin 10 so as not to appear on the appearance.

  The chip-type solid electrolytic capacitor according to the present embodiment configured as described above improves the workability and the assembly accuracy by stacking a plurality of capacitor elements 1 to form an element unit 4. Further, the element unit 4 Are stacked in a plurality of stages so that the anode electrode portions 2 are alternately arranged in opposite directions, and have a four-terminal structure in which the anode terminal 8 and the cathode terminal 9 are exposed at two locations facing each other on the lower surface serving as the mounting surface Thus, the magnetic flux generated by the current flowing between the terminals can be canceled out to greatly reduce ESL, and the pair of terminal portions 8a provided on the anode terminal 8 can be replaced with a plate-shaped inductor portion 8b. With the structure connected in (4), a π-type filter can be configured to achieve a further lower ESL.

  Further, the configuration in which the bent portions 8c and 9a bent upward along the side surface of the exterior resin 10 are provided in part of the anode terminal 8 and the cathode terminal 9 makes it easy to form a solder fillet during the soldering operation. In addition, an effect that the soldering state can be confirmed from the upper surface can be obtained, and a highly reliable soldering operation can be performed.

  In the present embodiment, description has been made using an example in which the element unit 4 is configured by stacking three capacitor elements 1. However, the present invention is not limited to this, and the number of stacked capacitor elements 1 is not limited thereto. Can be appropriately determined according to the required specifications and workability. The number of stacked layers of the element unit 4 may be an odd number, but it can be said that the number of stacked layers is even more preferable because the magnetic fluxes generated by the currents flowing through the capacitor elements 1 can be canceled out by setting the number of stacked layers to an even number. It is.

(Embodiment 2)
The second aspect of the present invention will be described below with reference to the second embodiment.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the first embodiment with reference to FIG. 1 is partially different, and other configurations are different from those of the first embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  2A to 2F are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to a second embodiment of the present invention. FIG. 2 is a bottom view, and in FIG. 2, 11 is an anode terminal, and this anode terminal 11 is bonded to the lower surface of the anode comb terminal 5 in the same manner as the anode terminal 8 described with reference to FIG. The terminal portions 11a are integrated by connecting the terminal portions 11a with a plate-like inductor portion 11b, and a part of the anode terminal 11 is projected from the exterior resin 10 in a top view. It is the same that the bent portion 11c is provided by bending the extended portion upward along the side surface of the exterior resin 10, but the inductor portion 1 in which the terminal portions 11a are connected to each other is the same. Point b is so exposed to the lower surface of the mounting surface is different from the first embodiment.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment displays the inductor portion 11b in which the terminal portions 11a are connected in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the first embodiment. With this configuration, it is possible to achieve a special effect that heat dissipation can be improved.

(Embodiment 3)
The third embodiment of the present invention will be described below in particular.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the first embodiment with reference to FIG. 1 is partially different, and other configurations are different from those of the first embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  3 (a) to 3 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, and a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to Embodiment 3 of the present invention. 3 is a bottom view, and in FIG. 3, 12 is an anode terminal, and this anode terminal 12 is joined to the lower surface of the anode comb terminal 5 in the same manner as the anode terminal 8 described with reference to FIG. The terminal portions 12a are integrated by connecting the terminal portions 12a with a plate-like inductor portion 12b, and a part of the anode terminal 12 is projected from the exterior resin 10 in a top view. It is the same that the bent portion 12c is provided by bending the extended portion upward along the side surface of the exterior resin 10, but the inductor portion 1 in which the terminal portions 12a are connected to each other is the same. From forming a b in a bellows is different from the first embodiment.

  In the chip-type solid electrolytic capacitor according to the present embodiment configured as described above, in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the first embodiment, the inductor portion 12b in which the terminal portions 12a are connected to each other is formed in a bellows shape. By forming, the degree of freedom to change the inductance value of the inductor portion 12b is increased, so that it is possible to easily control the ESL.

(Embodiment 4)
Hereinafter, with reference to the fourth embodiment, the present invention described in claims 2 and 3 will be described.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the third embodiment with reference to FIG. 3 is partially different, and other configurations are different from those of the third embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  4 (a) to 4 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, and a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to Embodiment 4 of the present invention. 4 is a bottom view. In FIG. 4, reference numeral 13 denotes an anode terminal, and the anode terminal 13 is joined to the lower surface of the anode comb terminal 5 in the same manner as the anode terminal 12 described with reference to FIG. The terminal portions 13a are integrated by connecting the terminal portions 13a with a bellows-shaped inductor portion 13b, and a part of the anode terminal 13 is projected from the exterior resin 10 in a top view. It is the same that the extended portion is provided with a bent portion 13c that is bent upward along the side surface of the exterior resin 10, but the bellows-like shape in which the terminal portions 13a are connected to each other is the same. I That inductor portion 13b was made to expose the lower surface of the mounting surface is different from the third embodiment.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment, in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the third embodiment, exposes the inductor portion 13b in which the terminal portions 13a are connected to each other. With this configuration, it is possible to achieve a special effect that heat dissipation can be improved.

(Embodiment 5)
Hereinafter, the invention according to the fourth aspect of the present invention will be described with reference to the fifth embodiment.

  In the present embodiment, the configuration of the cathode terminal of the chip-type solid electrolytic capacitor described in the first embodiment with reference to FIG. 1 is partially different, and other configurations are different from those of the first embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  5 (a) to 5 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, and a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to a fifth embodiment of the present invention. 5 is a bottom view, and in FIG. 5, reference numeral 14 denotes a cathode terminal. The cathode terminal 14 is provided with a pair of terminal portions 14 a respectively bonded to both ends of the lower surface of the cathode comb terminal 7, and the cathode terminal 14. The above-described embodiment is configured such that a part thereof is extended so as to protrude from the exterior resin 10 and is formed as an integrated product provided with a bent portion 14b that is bent upward along the side surface of the exterior resin 10. This is different from Form 1.

  In addition, in the state covered with the exterior resin 10, as in the first embodiment, the pair of terminal portions 14a are exposed at two locations facing the lower surface serving as the mounting surface.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment is intended to reduce costs by reducing the number of parts and the number of assembly steps in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the first embodiment. It has a special effect of being able to.

(Embodiment 6)
In the following, the sixth aspect of the present invention will be described with reference to the second and fourth aspects of the present invention.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the fifth embodiment with reference to FIG. 5 is partially different, and other configurations are different from those of the fifth embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  6 (a) to 6 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, and a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to Embodiment 6 of the present invention. 6 is a bottom view. In FIG. 6, reference numeral 11 denotes an anode terminal. This anode terminal 11 is the same as the anode terminal 11 described with reference to FIG. Each of the terminal portions 11a is joined by a plate-shaped inductor portion 11b, and a part of the anode terminal 11 is viewed from the top, and the exterior resin 10 is provided. The inductor 11b has a configuration in which a bent portion 11c is formed by extending the extended portion along the side surface of the exterior resin 10 and projecting from the terminal portion 11a. It is obtained so as to expose the lower surface of the Somen.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment displays the inductor portion 11b in which the terminal portions 11a are connected in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the fifth embodiment. With this configuration, it is possible to achieve a special effect that heat dissipation can be improved.

(Embodiment 7)
Hereinafter, the seventh embodiment of the present invention will be described with reference to the third and fourth aspects of the present invention.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the fifth embodiment with reference to FIG. 5 is partially different, and other configurations are different from those of the fifth embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  7A to 7F are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to a seventh embodiment of the present invention. 7 is a bottom view. In FIG. 7, reference numeral 12 denotes an anode terminal. This anode terminal 12 is the same as the anode terminal 12 described with reference to FIG. Each of the terminal portions 12a to be joined is integrated by connecting the terminal portions 12a with a bellows-shaped inductor portion 12b, and a part of the anode terminal 12 is viewed from above, and the exterior resin 10 The bent portion 12c is provided so that the extended portion is bent upward along the side surface of the exterior resin 10.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment has an inductor portion 12b in which the terminal portions 12a are connected in a bellows shape in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the fifth embodiment. By forming, the degree of freedom to change the inductance value of the inductor portion 12b is increased, so that it is possible to easily control the ESL.

(Embodiment 8)
Hereinafter, the invention according to the second to fourth aspects of the present invention will be described with reference to the eighth embodiment.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the seventh embodiment with reference to FIG. 7 is partially different. Other configurations are different from those of the seventh embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  8 (a) to 8 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, a bottom sectional view, showing the configuration of a chip-type solid electrolytic capacitor according to an eighth embodiment of the present invention. 8 is a bottom view. In FIG. 8, reference numeral 13 denotes an anode terminal. This anode terminal 13 is the same as the anode terminal 13 described with reference to FIG. A pair of terminal portions 13a to be joined are integrated by connecting the terminal portions 13a with a bellows-shaped inductor portion 13b, and a part of the anode terminal 13 is viewed from the top surface and from the exterior resin 10. The inductor portion 13b is provided with a bent portion 13c that is extended so as to protrude, and the extended portion is bent upward along the side surface of the exterior resin 10, and the terminal portion 13a is connected to each other. It is obtained so as to expose the lower surface of the plane.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment displays the inductor portion 13b in which the terminal portions 13a are connected in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the seventh embodiment. With this configuration, it is possible to achieve a special effect that heat dissipation can be improved.

(Embodiment 9)
The ninth aspect of the present invention will be described below with reference to the fifth aspect of the present invention.

  In the present embodiment, the cathode comb terminal of the chip-type solid electrolytic capacitor described with reference to FIG. 1 in the first embodiment is eliminated, and the cathode terminal is directly joined to the lower surface of the cathode electrode portion of the element unit. Since the other configurations are the same as those of the first embodiment, the same reference numerals are given to the same parts and the detailed description thereof is omitted, and only the different parts are described below with reference to the drawings. explain.

  9 (a) to 9 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, a bottom sectional view, showing a configuration of a chip-type solid electrolytic capacitor according to a ninth embodiment of the present invention. 9 is a bottom view. In FIG. 9, reference numeral 15 denotes a pair of cathode terminals. The cathode terminals 15 are directly joined to both ends of the lower surface of the cathode electrode portion 3 located at the center of the element unit 4, and the cathode terminals. A portion 15 is extended so as to protrude from the exterior resin 10 in a top view, and a bent portion 15 a is formed by bending the extended portion upward along the side surface of the exterior resin 10.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment is intended to reduce costs by reducing the number of parts and the number of assembly steps in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the first embodiment. It has a special effect of being able to.

(Embodiment 10)
The tenth embodiment of the present invention will be described below with reference to the second and fifth aspects of the present invention.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the ninth embodiment with reference to FIG. 9 is partially different, and other configurations are different from those of the ninth embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  10A to 10F are a plan sectional view, a front sectional view, a left side sectional view, a right side sectional view, a bottom sectional view, showing the configuration of a chip-type solid electrolytic capacitor according to Embodiment 10 of the present invention. FIG. 10 is a bottom view, and in FIG. 10, 11 is an anode terminal, and this anode terminal 11 is the same as the anode terminal 11 described with reference to FIG. Each of the terminal portions 11a is joined by a plate-shaped inductor portion 11b, and a part of the anode terminal 11 is viewed from the top, and the exterior resin 10 is provided. And a bent portion 11c bent upward along the side surface of the inductor portion, and the inductor portion 11b in which the terminal portions 11a are connected to each other is exposed to the lower surface serving as a mounting surface.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment displays the inductor portion 11b in which the terminal portions 11a are connected in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the ninth embodiment. With this configuration, it is possible to achieve a special effect that heat dissipation can be improved.

(Embodiment 11)
Hereinafter, the invention described in claims 3 and 5 of the present invention will be described using the eleventh embodiment.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the ninth embodiment with reference to FIG. 9 is partially different, and other configurations are different from those of the ninth embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  11 (a) to 11 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, and a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to an eleventh embodiment of the present invention. 11 is a bottom view, and in FIG. 11, 12 is an anode terminal, and this anode terminal 12 is the same as the anode terminal 12 described with reference to FIG. Each of the terminal portions 12a to be joined is integrated by connecting the terminal portions 12a with a bellows-shaped inductor portion 12b, and a part of the anode terminal 12 is viewed from above, and the exterior resin 10 The bent portion 12c is provided so that the extended portion is bent upward along the side surface of the exterior resin 10.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment has, in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the ninth embodiment, an inductor portion 12b in which the terminal portions 12a are connected to each other in a bellows shape. By forming, the degree of freedom to change the inductance value of the inductor portion 12b is increased, so that it is possible to easily control the ESL.

(Embodiment 12)
Hereinafter, the invention described in the second, third, and fifth aspects of the present invention will be described using the twelfth embodiment.

  In the present embodiment, the configuration of the anode terminal of the chip-type solid electrolytic capacitor described in the eleventh embodiment with reference to FIG. 11 is partially different, and other configurations are different from those of the eleventh embodiment. For the same reason, the same reference numerals are given to the same parts, and detailed description thereof is omitted, and only different parts will be described below with reference to the drawings.

  12 (a) to 12 (f) are a plan sectional view, a front sectional view, a left sectional view, a right sectional view, and a bottom sectional view showing the configuration of a chip-type solid electrolytic capacitor according to a twelfth embodiment of the present invention. 12 is a bottom view. In FIG. 12, reference numeral 13 denotes an anode terminal. This anode terminal 13 is the same as the anode terminal 13 described with reference to FIG. A pair of terminal portions 13a are joined to each other, and the terminal portions 13a are integrated by connecting them with a bellows-shaped inductor portion 13b. And an inductor portion in which the extended portion is bent upward along the side surface of the exterior resin 10 and the terminal portions 13a are connected to each other. 3b is that so as to expose the lower surface of the mounting surface.

  The thus configured chip-type solid electrolytic capacitor according to the present embodiment displays the inductor portion 13b in which the terminal portions 13a are connected in addition to the effects obtained by the chip-type solid electrolytic capacitor according to the eleventh embodiment. With this configuration, it is possible to achieve a special effect that heat dissipation can be improved.

  The results of measuring the ESL characteristics of the chip-type solid electrolytic capacitors according to Embodiments 1 to 12 of the present invention configured as described above are shown in Table 1 together with conventional products as comparative examples.

  As is clear from Table 1, the chip-type solid electrolytic capacitor according to the present invention can reduce ESL to 1/5 or less of the conventional product and its variation is small. It is possible to sufficiently meet the high demands.

  The chip-type solid electrolytic capacitor according to the present invention has an effect that ESL can be greatly reduced, and is particularly useful as a capacitor in fields where high-frequency response is required.

(A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 1 of the present invention, (b) The front sectional view, (c) The left side sectional view, (d) The right side sectional view, (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 2 of the present invention, (b) The front sectional view, (c) The left side sectional view, (d) The right side sectional view, (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 3 of the present invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 4 of the present invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 5 of the present invention, (b) The front sectional view, (c) The left side sectional view, (d) The right side sectional view, (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 6 of the present invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 7 of the present invention, (b) The front sectional view, (c) The left side sectional view, (d) The right side sectional view, (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 8 of the present invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 9 of the present invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view, (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the structure of the chip-type solid electrolytic capacitor by Embodiment 10 of this invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view, (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the structure of the chip-type solid electrolytic capacitor by Embodiment 11 of this invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view, (E) Cross-sectional view of the bottom, (f) Bottom view of the same (A) Plan sectional drawing which showed the composition of the chip type solid electrolytic capacitor by Embodiment 12 of the present invention, (b) Same front sectional view, (c) Same left side sectional view, (d) Same right side sectional view (E) Cross-sectional view of the bottom, (f) Bottom view of the same The perspective view which showed the composition of the conventional chip type solid electrolytic capacitor A perspective view showing the internal structure of the chip-type solid electrolytic capacitor (A) Plan sectional drawing which showed composition of other conventional chip type solid electrolytic capacitors, (b) Same front sectional view, (c) Same bottom sectional view, (d) Same bottom view

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Capacitor element 2 Anode electrode part 3 Cathode electrode part 4 Element unit 5 Anode comb terminal 6a, 6b Spacer 7 Cathode comb terminal 7a Guide wall 8, 11, 12, 13 Anode terminal 8a, 11a, 12a, 13a, 14a Terminal part 8b 11b, 12b, 13b Inductor portion 8c, 9a, 11c, 12c, 13c, 14b, 15a Bending portion 9, 14, 15 Cathode terminal 10 Exterior resin

Claims (10)

An element unit in which a plurality of flat capacitor elements each having an anode electrode part and a cathode electrode part are laminated in the same direction, and a unit lamination in which this element unit is alternately arranged on opposite sides and laminated in even units. And a pair of terminal portions joined to the lower surface of the anode electrode portion located at both ends of the unit laminate body, and a cathode comb terminal joined to the lower surface of the cathode electrode portion located at the center of the unit laminate body. And a pair of cathode terminals joined to the anode terminal in which the terminal portions are connected by a plate-shaped inductor portion and the lower end of the cathode comb terminal in a direction intersecting the direction connecting the terminal portions of the anode terminals . and the terminal unit, the unit laminate in a state in which the lower surface of the pair of mounting surfaces of the terminal portions of the pair of terminal portions and the cathode terminal provided on the anode terminal is respectively exposed, the cathode lead terminal Made of insulating sheathing resin coated body, the inductor unit is connected to the side surface of the inside of the terminal portions of the anode terminal, a between said terminal portion of said cathode terminal, below the cathode lead terminal A chip-type solid electrolytic capacitor that forms a π-type filter placed in 2. The chip-type solid electrolytic capacitor according to claim 1, wherein a lower surface of the inductor portion provided so as to connect the terminal portions of the anode terminal is exposed to the mounting surface. The chip-type solid electrolytic capacitor according to claim 1, wherein the inductor portion provided so as to connect the terminal portions of the anode terminal is formed in a bellows shape. 2. The chip-type solid electrolytic capacitor according to claim 1, wherein terminal portions of a pair of cathode terminals respectively joined to both ends of the lower surface of the cathode comb terminal are formed as a single body. 2. The chip-type solid electrolytic capacitor according to claim 1, wherein a terminal portion of the cathode terminal is directly joined to the lower surface of the cathode electrode portion located at the center of the unit laminate. 2. The chip-type solid electrolytic capacitor according to claim 1, further comprising an anode comb terminal for binding the anode electrode portion of the element unit. 7. The chip-type solid electrolytic capacitor according to claim 1, further comprising a spacer for joining the anode electrode portion of the element unit or the anode comb terminal obtained by binding the anode electrode portion of the element unit and the terminal portion of the anode terminal. 2. The chip type according to claim 1, wherein guide walls that are electrically connected to the cathode electrode portion of the unit laminate are provided at the terminal portions at both ends of the cathode comb terminal in a direction intersecting with the direction connecting the terminal portions of the anode terminal. Solid electrolytic capacitor. 2. The chip-type solid electrolytic capacitor according to claim 1, wherein a part of the anode terminal and / or the cathode terminal is extended so as to protrude from the top view exterior resin, and the extended portion is bent upward along the side surface of the exterior resin. As a capacitor element, an insulating portion is provided at a predetermined position of an anode body made of a valve metal having a roughened surface and a dielectric oxide film layer formed thereon, and separated into an anode electrode portion and a cathode forming portion, and this cathode formation The capacitor element in which the cathode electrode portion is formed by sequentially laminating a solid electrolyte layer made of a conductive polymer and a cathode layer made of carbon and silver paste on the dielectric oxide film layer of the portion is used. The chip-type solid electrolytic capacitor as described.

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