JP5046008B2 - Non-contact transfer system using vacuum - Google Patents
Non-contact transfer system using vacuum Download PDFInfo
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- JP5046008B2 JP5046008B2 JP2007153324A JP2007153324A JP5046008B2 JP 5046008 B2 JP5046008 B2 JP 5046008B2 JP 2007153324 A JP2007153324 A JP 2007153324A JP 2007153324 A JP2007153324 A JP 2007153324A JP 5046008 B2 JP5046008 B2 JP 5046008B2
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- contact
- control algorithm
- contact transfer
- transfer
- vacuum
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明は、半導体製造装置や液晶製造装置に搭載されて、ウエハや液晶ガラスなどのワークを非接触で吊上げ搬送する搬送機器に関するものである。The present invention relates to a transfer device that is mounted on a semiconductor manufacturing apparatus or a liquid crystal manufacturing apparatus and lifts and transfers a workpiece such as a wafer or liquid crystal glass in a non-contact manner.
従来、半導体製造装置や液晶製造装置など、コンタミネーション(汚染)を極度に嫌う分野では、図4に示すように、エジェクタ効果を用いて非接触で吊上げ搬送を行なうノンコンタクト搬送パッドが使用されている。正圧を用いているため、吊上げ力が小さいなど多くの欠点を有していた。Conventionally, in a field where contamination (contamination) is extremely unfavorable, such as a semiconductor manufacturing apparatus and a liquid crystal manufacturing apparatus, a non-contact transfer pad that uses a ejector effect for non-contact lifting transfer is used as shown in FIG. Yes. Since positive pressure was used, it had many drawbacks such as small lifting force.
従来のノンコンタクト搬送では圧縮空気(正圧)を用い、次の欠点を有している。
○ 吸着力が非常に小さい。
○ 消費空気流量が多い(→容量の大きなコンプレッサが必要)。
○ 圧縮空気を用いるためエネルギー効率が悪い(搬送の仕事/電気)
○ 放出される圧縮空気によりクリーンルーム内の空気の流れが乱される(→クリーン度の低下)。
○ 放出される空気の質(パーティクル、湿度)を管理する必要がある。
○ 多量な空気流により静電気を発生する。Conventional non-contact conveyance uses compressed air (positive pressure) and has the following drawbacks.
○ Adsorption power is very small.
○ High air flow (→ High capacity compressor required).
○ Energy efficiency is low due to the use of compressed air (conveyance work / electricity)
○ The flow of air in the clean room is disturbed by the released compressed air (→ decrease in cleanliness).
○ It is necessary to control the quality of air released (particles, humidity).
○ Static electricity is generated by a large air flow.
そこで、この発明は、吸着力が弱いなどの課題を解決するノンコンタクト搬送システムを提供することを目的とする。In view of the above, an object of the present invention is to provide a non-contact conveyance system that solves problems such as weak adsorption force.
図1を用いて説明する。近接センサ2とロードセル3でそれぞれワーク――パッドの距離および吊上げ力を測定し、制御アルゴリズム8で操作量(バルブ4、ACサーボモータ4)が計算され出力される。
これにより、ワーク9とパッド1の間に空隙を維持しながら吊上げ搬送が行なえる。This will be described with reference to FIG. The
As a result, lifting and conveying can be performed while maintaining a gap between the
図1のロードセル3は、搬送時は、パッド1及び吊上げているワークの重量を示すことになる。The load cell 3 in FIG. 1 indicates the weight of the
図1のバルブ4は、真空ポンプ6につながる開度を調整し、吊上げの用いる真空圧力を調整している。1 adjusts the opening degree connected to the
制御アルゴリズムを図2および図3に示す。図2は基本的な制御アルゴリズムである。図3のようにロードセルの信号をもとに力に関するマイナーフィードバックループを形成するとより制御性が向上する。The control algorithm is shown in FIGS. FIG. 2 shows a basic control algorithm. As shown in FIG. 3, when a minor feedback loop relating to force is formed based on the load cell signal, controllability is further improved.
以上説明したように、この発明によれば、高吊上げ力のノンコンタクト搬送システムが実現できる。As described above, according to the present invention, a non-contact conveyance system having a high lifting force can be realized.
図1を用いて本発明の実施例を説明する。近接センサ2とロードセル3でそれぞれワーク――パッドの距離および吊上げ力を測定し、制御アルゴリズム8で操作量(バルブ4、ACサーボモータ4)が計算され出力される。制御アルゴリズムは、図2および図3に示す。
これにより、ワーク9とパッド1の間に空隙を維持しながら吊上げ搬送が行なえる。An embodiment of the present invention will be described with reference to FIG. The
As a result, lifting and conveying can be performed while maintaining a gap between the
1 パッド
2 近接センサ
3 ロードセル
4 バルブ
5 ACサーボモータ
6 真空ポンプ
7 ロボット先端
8 制御アルゴリズム
9 ワーク
10 圧縮空気1
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007153324A JP5046008B2 (en) | 2007-05-15 | 2007-05-15 | Non-contact transfer system using vacuum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007153324A JP5046008B2 (en) | 2007-05-15 | 2007-05-15 | Non-contact transfer system using vacuum |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008284670A JP2008284670A (en) | 2008-11-27 |
| JP5046008B2 true JP5046008B2 (en) | 2012-10-10 |
Family
ID=40144879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007153324A Expired - Fee Related JP5046008B2 (en) | 2007-05-15 | 2007-05-15 | Non-contact transfer system using vacuum |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5046008B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI647779B (en) * | 2011-08-30 | 2019-01-11 | 日商尼康股份有限公司 | Object conveying device, object processing device, exposure device, manufacturing method of flat panel display, component manufacturing method, object conveying method, and object exchange method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH115630A (en) * | 1997-06-13 | 1999-01-12 | Kokusai Electric Co Ltd | Substrate transfer device |
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2007
- 2007-05-15 JP JP2007153324A patent/JP5046008B2/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| JP2008284670A (en) | 2008-11-27 |
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