JP5046967B2 - Heat transfer tube forming method and structure thereof - Google Patents
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- JP5046967B2 JP5046967B2 JP2008007576A JP2008007576A JP5046967B2 JP 5046967 B2 JP5046967 B2 JP 5046967B2 JP 2008007576 A JP2008007576 A JP 2008007576A JP 2008007576 A JP2008007576 A JP 2008007576A JP 5046967 B2 JP5046967 B2 JP 5046967B2
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- 238000000034 method Methods 0.000 title claims description 25
- 238000012546 transfer Methods 0.000 title claims description 20
- 230000000903 blocking effect Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 5
- 230000020169 heat generation Effects 0.000 claims description 3
- 230000017260 vegetative to reproductive phase transition of meristem Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000000465 moulding Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
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Description
本発明は導熱管成型方法及びその構造に関する。特に高い導熱性能を備える導熱管製造方法に係る。 The present invention relates to a heat conducting tube forming method and its structure. In particular, the present invention relates to a method for manufacturing a heat conducting tube having high heat conducting performance.
電子部品の単位面積当たりのトランジスター数の増加に伴い、その作動時に発生する熱エネルギーも増加している。また、電子部品の作動周波数もますます高くなっているため、トランジスター作動時ON/OFF切り替えで生じる熱量(Switch Loss)もまた電子部品発熱量増加の主因の一つである。近年、半導体製造工程とIC封入技術の急速な発展により、チップの演算速度も大幅に上昇しており、それに対応しチップ作動時には、熱エネルギーがクロック周波数の増加に従い上昇する。もしこれら熱量を適当に処理しなければ、チップ演算速度の低下を招き、ひどい場合にはチップの寿命にも影響を及ぼす。 As the number of transistors per unit area of an electronic component increases, the thermal energy generated during the operation also increases. In addition, since the operating frequency of electronic components is becoming higher and higher, the amount of heat (Switch Loss) generated by ON / OFF switching during transistor operation is also one of the main causes of the increase in heat generation of electronic components. In recent years, due to the rapid development of the semiconductor manufacturing process and IC encapsulation technology, the calculation speed of the chip has also increased significantly. Correspondingly, when the chip is operating, the thermal energy increases as the clock frequency increases. If these amounts of heat are not properly processed, the chip calculation speed is reduced, and if it is severe, the life of the chip is also affected.
公知の導熱管の製造方法は少なくとも以下のステップを含む。
先ず、導熱管を提供し、該導熱管は熱伝導係数が優れた任意の材料で、しかも成型棒材を導熱管中に挿入し、これにより導熱管の管壁と成型棒材の間には固定間隙を備えた空間を形成する。続いて、銅粉を充填し、銅粉を導管管壁と成型棒の間の間隙空間に充填する。その後、毛細構造を形成するため、焼結、粘着、充填、沈積等方式を行い、続いて、成型棒材と導管を分離するステップを行う。さらに、その後に作動液体注入及び真空作業を行い、導管の反対端を封鎖後、導熱管の製造工程を完了する。
公知の散熱モジュールの立体分解図及び組合せ図である図1、2に示すように、該散熱モジュール1は散熱フィン組11、少なくとも一個以上の導熱管12により構成する。内、該散熱フィン組11は複数の散熱フィン111及びベース112により構成され、該各散熱フィン111は相互に係合し、該ベース112の一面上に溶接結合される。かつ、該フィン本体上には少なくとも一個の孔113を開設し、該孔113は該導熱管12により穿設される。
上記のベース112の上には該散熱フィン111との溶接結合位置に凹槽を設置し、或いはベース上に結合孔を設置することができ、これにより該導熱管12を穿設する。該導熱管は公知の湾管或いはU管型態で(ここでは詳述しない)、上記の組合せにより公知の散熱モジュールを構成する。
A known method for manufacturing a heat conducting tube includes at least the following steps.
First, a heat transfer tube is provided, and the heat transfer tube is made of any material having an excellent heat conduction coefficient, and a molded bar is inserted into the heat transfer tube, so that a space between the tube wall of the heat transfer tube and the molded bar is inserted. A space with a fixed gap is formed. Subsequently, the copper powder is filled, and the copper powder is filled into the gap space between the conduit tube wall and the molding rod. Thereafter, in order to form a capillary structure, a method such as sintering, adhesion, filling, and deposition is performed, and then a step of separating the molded bar and the conduit is performed. Further, after that, the working liquid is injected and the vacuum operation is performed. After the opposite end of the conduit is sealed, the manufacturing process of the heat conducting tube is completed.
As shown in FIGS. 1 and 2, which are a three-dimensional exploded view and a combination diagram of a known heat dissipation module, the heat dissipation module 1 includes a heat dissipation fin set 11 and at least one
On the
散熱を行う時には、該公知の散熱モジュール1は該ベース112底部の平面発熱源14と密着接触し、発熱源が発生する熱源を伝導し、さらに導熱管を通して熱源を該散熱フィン組に伝え、散熱作動を行う。しかし、熱源は全て先ずベース112上に伝導され、後に該導熱管12に伝導されるため、設計上からも該導熱管12は発熱源14と直接接触することができない。しかも各散熱部品が相互に結合する時、間隙発生の現象は熱抵抗現象を形成するため、熱伝導係数は大きく低下する。
公知技術の欠点を以下にまとめる。
1.生産コストが高い。
2.散熱部品間の結合が不安定で間隙が生じ易い。
3.熱抵抗の問題が存在する。
4.部品を個別に生産後組み立てる必要があるため、生産効率が低い。
上記公知構造の問題と欠点の解決は、本発明人及び関連業者が目指すところである。
The disadvantages of the known techniques are summarized below.
1. Production cost is high.
2. The coupling between heat dissipating parts is unstable and gaps are likely to occur.
3. There is a problem of thermal resistance.
4. Production efficiency is low because parts must be assembled individually after production.
The solution of the problems and drawbacks of the known structure is the aim of the inventor and related companies.
本発明人は、上記欠点に鑑み、多方面にわたる評価と考量を重ね、同業界における多年の経験を生かし、絶えず試作と修正を繰り返し、ついに本発明に想到し成功した。
本発明が解決しようとする第一の課題は、導熱管が直接発熱源と接触し、直接熱源を伝導可能な導熱管を加工可能な導熱管成型方法及びその構造を提供することであり、本発明が解決しようとする第二の課題は、公知導熱管に比べ散熱性能を大幅に向上させることができる導熱管成型方法及びその構造を提供することである。
In view of the above-mentioned drawbacks, the inventor repeatedly evaluated and considered in various fields, made use of his many years of experience in the industry, continuously repeated trial production and correction, and finally arrived at the present invention and succeeded.
The first problem to be solved by the present invention is to provide a heat conducting tube molding method and a structure thereof capable of processing a heat conducting tube that can directly conduct the heat source by contacting the heat conducting tube directly with the heat source. The second problem to be solved by the invention is to provide a heat transfer tube molding method and its structure capable of greatly improving the heat dissipation performance as compared with known heat transfer tubes.
上記課題を解決するため、本発明は下記の導熱管成型方法及びその構造を提供する。
先ず必要な長さの導熱管を裁断し、該裁断された長さは封鎖端、接触部分及び封鎖部を含み、該封鎖部と該封鎖端内には毛細構造を実施し、さらに該両端の内の一端を封鎖管とし、作動流体を加え真空作業を施し、次に反対端を封鎖し、こうして該部分を完成された導熱管構造とし、その後該接触部分を軸方向に数部に分け、該各カット部を外向きに折り返し接触部として成型し、これにより該接触部はより大きな接触面積を獲得し、直接発熱源と接触或いは結合するため、熱源は直接該接触部より導熱管本体に伝わり、熱エネルギー伝導と散熱の機能を達成することができる。
In order to solve the above problems, the present invention provides the following heat transfer tube forming method and the structure thereof.
First, a heat conducting tube having a necessary length is cut, and the cut length includes a sealed end, a contact portion, and a sealed portion, and a capillary structure is implemented in the sealed portion and the sealed end. One end of the inside is a sealed tube, a working fluid is added to perform a vacuum operation, the opposite end is then sealed, and the portion is thus completed as a heat conducting tube structure, and then the contact portion is divided into several parts in the axial direction, Each of the cut portions is formed outwardly as a folded contact portion, whereby the contact portion acquires a larger contact area and directly contacts or couples with the heat generation source, so that the heat source is directly connected to the heat transfer tube body from the contact portion. Conducted, can achieve the functions of thermal energy conduction and heat dissipation.
すなわち、請求項1の発明は、導熱管成型方法において、導熱管成型方法は以下のステップを含み、導熱管を使用者の必要に応じて一定長さに裁断し、該長さは封鎖端及び少なくとも一個の接触部分及び封鎖部を含み、該封鎖端の開口及び封鎖部位置の管徑をそれぞれ封鎖し、完全な導熱管を形成し、その後、前記接触部分は軸方向にカットして、複数の接触部分を形成し、接触面積がより大きく発熱源と直接接触可能な導熱管を構成したことを特徴とする。
請求項2の発明は、請求項1記載の導熱管成型方法において、前記形成した複数の接触部分は湾折させることができることを特徴とする。
請求項3の発明は、請求項1記載の導熱管成型方法において、前記形成した複数の接触部分は外向きに湾折させ十字状或いはその他開花状を形成することができることを特徴とする。
That is, the invention of claim 1 is a heat conducting tube forming method, wherein the heat conducting tube forming method includes the following steps, the heat conducting tube is cut into a certain length according to the user's needs, and the length is the sealed end and Including at least one contact part and a sealing part, respectively sealing the opening of the sealing end and the tube tube at the position of the sealing part to form a complete heat-conducting tube, and then cutting the contact part in the axial direction, The contact portion is formed, and a heat conducting tube that has a larger contact area and can be in direct contact with the heat source is configured.
According to a second aspect of the present invention, in the heat conducting tube forming method according to the first aspect, the plurality of formed contact portions can be folded.
According to a third aspect of the present invention, in the heat transfer tube molding method according to the first aspect, the plurality of contact portions formed can be folded outward to form a cross or other flowering shapes.
請求項4の発明は、導熱管の構造において、導熱管の構造の導熱管は少なくとも一個の端を扁平状の接触部分とし、該接触部分は軸方向にカットし複数等分として、発熱源と接触させ、導熱効果を達成することを特徴とする。 According to a fourth aspect of the present invention, in the heat transfer tube structure, the heat transfer tube of the heat transfer tube structure has at least one end as a flat contact portion, the contact portion is cut in the axial direction into a plurality of equal parts, It is characterized by being brought into contact and achieving a heat conduction effect.
上記のように、本発明の導熱管成型方法、および、その導熱管の構造によれば発熱源と直接接触可能であるので、電子部品等の発熱源に用いた場合に、熱抵抗が低減し、空間を節減でき、コストの節約を達成することができる。さらに組み立てに便利で、散熱効果が高いという長所をも備える。 As described above, according to the heat-conducting tube molding method and the structure of the heat-conducting tube of the present invention, direct contact with the heat source is possible, so that when used as a heat source such as an electronic component, the thermal resistance is reduced. , Can save space and achieve cost savings. In addition, it is convenient for assembly and has the advantage of high heat dissipation effect.
上記目的及び機能を達成するために、本発明が採用する技術手段及び構造について、図示と本発明の最適実施例の詳細説明を用い、その特徴と機能を以下に説明する。
本発明の実施例の導熱管成型方法の工程指示図である図3に示すように、本発明の実施例の導熱管成型方法は、少なくとも以下のステップ(31〜35)の工程からなり、導熱管に対して加工を行う。
ステップ31では、成型する導熱管を準備する(図4参照)。
ステップ32では、使用者の必要に応じて一定の長さに裁断する(図5参照)。
この際、使用者の必要に応じて、成型する該導熱管Aを加工しようとする導熱管材A1に裁断する。該加工しようとする導熱管材A1は、封鎖端43、封鎖部42及び接触部分41を構成する。
ステップ33では、該封鎖端43の開口及び封鎖部位置の管徑を封鎖し、導熱管を形成する(図5参照)。
該加工しようとする導熱管材A1上において、必要な封鎖端43が必要な長度を定めた後、それぞれ該封鎖端43の開口及び封鎖部42位置の管徑を封鎖し、導熱管4を構成する(もちろん管内には既に毛細構造が設置され、作動流体が充填され、真空作業が行われている。公知の技術に属するため、詳述しない)。
ステップ34 では、選択的に該接触部分を圧迫し扁平とすることができる(図7参照)。
該接触部分41を圧迫し扁平とし、接触部分41の接触面積を拡大し、こうしてより速く熱源から熱を導出することが可能となる。
ステップ35では、前記封鎖部を湾折し、導熱管をL型とする(図8参照)。
該封鎖端43を約90度湾折させ、導熱管4をL型とすることで、該接触部分41と発熱源5は直接接触し熱源を伝導可能となる。
In order to achieve the above objects and functions, the technical means and structure employed by the present invention will be described below with reference to the drawings and the detailed description of the preferred embodiments of the present invention, and the features and functions thereof.
As shown in FIG. 3 which is a process instruction diagram of the heat conducting tube forming method according to the embodiment of the present invention, the heat conducting tube forming method according to the embodiment of the present invention includes at least the following steps (31 to 35). Process the tube.
In
In
At this time, the heat conducting tube A to be molded is cut into the heat conducting tube material A1 to be processed according to the needs of the user. The heat conducting tube A1 to be processed constitutes a blocking
In
On the heat conducting tube A1 to be processed, after determining the required length of the necessary sealed
In
The
In
By making the closed
図9、10、11に示すように、別の応用実施例で、前記導熱管4の接触部分41の管徑は軸方向にカットし複数等分することができる(図9参照)。図は四等分であるが、六等分、八等分或いはより多い等分とすることができる。カット後、カット部位を外側へと湾折させ、該接触部分41を放射十字状とする(図10参照)。該接触部分41を放射十字状を呈する方式で展開することにより、該接触部分41と発熱源5の接触時の接触面積を増大することができ、これにより該発熱源5の上に直接設置し(図11参照)、熱源の直接伝導を行うことができる。こうして熱源の伝導はよりスムーズにかつスピーディーとなる。
As shown in FIGS. 9, 10, and 11, in another application example, the tube rod of the
本発明の更に別の実施例を図12に示して説明するが、前記接触部分41を軸方向に複数等分にカット後、該複数等分の接触部分41は直接多数の発熱源5と接触し、該熱源を該接触部分41を通して該封鎖端43に伝達し、散熱の効果を達成することができる。
Still another embodiment of the present invention will be described with reference to FIG. 12. After the
上記のように、本発明の各実施例では、加工しようとする導熱管材上に封鎖端、封鎖部及び接触部分を構成し、それぞれ該封鎖端の開口及び封鎖部位置の管徑を封鎖し、完全な導熱管を構成し、端部を扁平にして熱源に接着するか、或いは、接触部分の管徑上において軸方向にカットし複数等分とした後、該各カット部を外へと湾折させ放射状とし、熱源と接触時の接触面積を拡大して熱源に接触する。したがって、上記の本発明の各最適実施例は、以下のような長所と性能を備える。
1.その他散熱部品によらず、直接発熱源と接触し、直接熱源を伝導し散熱を行うことができる。
2.熱抵抗が低減する。
3.部品が節約でき、コストが節減可能。
4.組立等の製造が簡単で生産効率が高い。
以上は本発明の最適実施例に過ぎず、本発明を限定するものではない。本発明の構想に基づく改変、本発明の精神を離脱しない範囲内で行われる形状或いは設置型態に対する変換、各種変化、修飾と応用で同等効果作用は生じるものはすべて本発明の特許範囲に含まれるものとする。
As described above, in each of the embodiments of the present invention, a sealed end, a sealed portion, and a contact portion are formed on the heat conducting tube material to be processed, and the opening of the sealed end and the tube cage at the sealed portion position are respectively sealed. Construct a complete heat-conducting tube, flatten the end and bond it to the heat source, or cut it in the axial direction on the tube tube of the contact portion and divide it into multiple equal parts, Fold and radiate, expand the contact area when contacting the heat source and contact the heat source. Therefore, each optimum embodiment of the present invention described above has the following advantages and performance.
1. Regardless of other heat dissipating parts, it can be in direct contact with the heat source and conducted directly through the heat source.
2. Thermal resistance is reduced.
3. Parts can be saved and cost can be saved.
4. Easy assembly and high production efficiency.
The above is only an optimum embodiment of the present invention and does not limit the present invention. Modifications based on the concept of the present invention, conversion to shapes or installation forms performed within a range not departing from the spirit of the present invention, various changes, modifications and applications that produce equivalent effects are all included in the patent scope of the present invention. Shall be.
A 成型導熱管
A1 加工しようとする導熱管材
1 散熱モジュール
11 散熱フィン組
111 散熱フィン
112 ベース
113 孔
12 導熱管
14 発熱源
4 導熱管
41 接触部分
42 封鎖部
43 封鎖端
5 発熱源
A Molded heat transfer tube
A1 Heat conducting tube material to be processed
1 Heat dissipation module
11 Heat dissipation fin assembly
111 Heat dissipation fin
112 base
113 holes
12 Heat transfer tube
14 Heat source
4 Heat transfer tube
41 Contact area
42 Blockade
43 Blockade Edge
5 Heat source
Claims (4)
導熱管を使用者の必要に応じて一定長さに裁断し、該長さは封鎖端及び少なくとも一個の接触部分及び封鎖部を含み、
該封鎖端の開口及び封鎖部位置の管徑をそれぞれ封鎖し、完全な導熱管を形成し、
その後、前記接触部分は軸方向にカットして、複数の接触部分を形成し、接触面積がより大きく発熱源と直接接触可能な導熱管を構成したことを特徴とする導熱管成型方法。 The heat transfer tube forming method includes the following steps:
Cutting the heat conducting tube into a certain length as required by the user, the length including a sealed end and at least one contact portion and a sealed portion;
Each of the opening of the blocking end and the tube tub at the position of the blocking portion are respectively closed to form a complete heat conducting tube;
Thereafter, the contact portion is cut in the axial direction to form a plurality of contact portions, and the heat transfer tube forming method is characterized in that a heat transfer tube having a larger contact area and capable of being in direct contact with the heat generation source is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008007576A JP5046967B2 (en) | 2008-01-17 | 2008-01-17 | Heat transfer tube forming method and structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008007576A JP5046967B2 (en) | 2008-01-17 | 2008-01-17 | Heat transfer tube forming method and structure thereof |
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| Publication Number | Publication Date |
|---|---|
| JP2009168354A JP2009168354A (en) | 2009-07-30 |
| JP5046967B2 true JP5046967B2 (en) | 2012-10-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2008007576A Expired - Fee Related JP5046967B2 (en) | 2008-01-17 | 2008-01-17 | Heat transfer tube forming method and structure thereof |
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| JP5323614B2 (en) * | 2009-08-27 | 2013-10-23 | 古河電気工業株式会社 | Heat pipe and manufacturing method thereof |
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| JPS58153452U (en) * | 1982-04-07 | 1983-10-14 | 日立電線株式会社 | Heat pipe type semiconductor heat sink |
| JPS59145046U (en) * | 1983-03-18 | 1984-09-28 | 日本無線株式会社 | Heat dissipation device for semiconductor devices |
| JPS6324894U (en) * | 1986-07-31 | 1988-02-18 | ||
| JPH04282857A (en) * | 1991-03-11 | 1992-10-07 | Furukawa Electric Co Ltd:The | Heat pipe type heat radiator |
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