JP5061572B2 - Illumination device and imaging device - Google Patents

Description

  The present invention relates to an illumination device that illuminates a subject and an imaging device including the illumination device.

  An illumination device using a light emitting diode is known as an illumination device for an imaging device that illuminates a subject during photographing. As the illumination device, for example, there is a strobe device disclosed in Patent Document 1. This illuminating device has a variable light distribution control mechanism for obtaining an optimum illumination angle for an image frame corresponding to the lens zoom position.

  The variable light distribution control mechanism is complicated and increases the number of parts. In addition, with this control mechanism, it is impossible to emit light to an arbitrary irradiation range with a higher degree of freedom. For example, at least a subject in a distance range where auxiliary light does not reach can be used to emit unnecessary power. Is wasted.

  Patent Documents 2 to 4 illustrate illumination devices that can emit light in an irradiation range with a higher degree of freedom.

  The illuminating device of Patent Document 2 has a plurality of light emitting diodes having different light distribution characteristics arranged concentrically or linearly on the front side of the imaging device to individually turn on and off, and individually emit light amounts. It is variable.

  The illumination device of Patent Document 3 obtains a necessary irradiation angle by changing the number of light emitting diodes to be lit by arranging a plurality of light emitting diodes in a circular shape. The irradiation angle is determined according to the focal length information of the photographing lens so as to properly illuminate the photographing field angle.

In the illumination device of Patent Document 4, a plurality of light emitting diodes that can be individually turned on and off are arranged in a planar shape so as to uniformly illuminate a subject while suppressing uneven illumination.
JP 2004-226509 A JP 2003-114462 A JP 2005-338280 A JP2006-10746

  Since the illumination devices of Patent Documents 2 to 4 require as many types of light emitting diodes as the number of irradiating ranges, an increase in the number of components and an increase in the size of the light emitting surface are inevitable. By irradiating the flash auxiliary light within the image frame according to the zoom position and irradiating the amount of light that can obtain the optimum exposure for each subject area, the necessary and sufficient auxiliary light effect can be obtained with the minimum power. There is no technology that can be easily realized.

Accordingly, the illumination device of the present invention is an illumination device for an imaging device , and includes a substrate, a light emitting element chip, a plurality of first electrodes, a plurality of first extraction electrodes, a second extraction electrode, and a plurality of electrode terminals. And comprising.
The light-emitting element chip has a conductive layer and an epitaxial layer formed on the conductive layer, and emits light when power is supplied from the substrate. The plurality of first electrodes are formed on the epitaxial layer and partition the light emitting surface of the light emitting element chip into a plurality of light emitting regions. The plurality of first extraction electrodes are connected to each first electrode. The second extraction electrode is formed on the conductive layer. The plurality of electrode terminals are provided on the substrate and connected to each of the first extraction electrode or the second extraction electrode. In addition, one of the light emitting areas emits light according to the angle of view of the imaging device.

The imaging device of the present invention includes a lighting device, and the lighting device includes a substrate, a light emitting element chip, a plurality of first electrodes, a plurality of first extraction electrodes, a second extraction electrode, and a plurality of extraction electrodes. An electrode terminal.
The light-emitting element chip has a conductive layer and an epitaxial layer formed on the conductive layer, and emits light when power is supplied from the substrate. The plurality of first electrodes are formed on the epitaxial layer and partition the light emitting surface of the light emitting element chip into a plurality of light emitting regions. The plurality of first extraction electrodes are connected to each first electrode. The second extraction electrode is formed on the conductive layer. The plurality of electrode terminals are provided on the substrate and connected to each of the first extraction electrode or the second extraction electrode. In addition, one of the light emitting areas emits light according to the angle of view of the imaging device.

  According to the above invention, since the irradiation angle region can be changed according to the angle of view of imaging, the illumination system of the imaging apparatus can be configured extremely small.

Further, a plurality of the predetermined light emitting region of the light emitting region emits light, can emit light is limited to necessary and sufficient image frame area according to the arrangement state of the object in accordance with the focal length of the imaging lens of the imaging device.

If a predetermined light emitting region of the multiple light-emitting region in accordance with the zoom operation position of the imaging lens of the imaging device emits light, it can emit light is limited to necessary and sufficient image frame area according to the zoom position of the imaging device.

If a predetermined light emitting area of the light emitting region of the multiple emits light based on the detection of Prin emission, capable of emitting light is limited to necessary and sufficient image frame area in accordance with the flash reach distance of each object.

The regulators of light emission quantity of the light emitting region, there is a current value and the energization time to be subjected to the first electrodes corresponding to the light-emitting region to the light emission.

  As the arrangement form of the plurality of light emitting regions, there are, for example, a concentric arrangement, a matrix arrangement, and an X arrangement on the main surface of the light emitting element chip.

Also, a package for sealing a plurality of light emitting regions is provided, and when the upper surface of the package forms a concave lens surface, the light emitted from the plurality of light emitting regions is separated from the center of the package. Since the light is emitted from the lens interface having a relatively large refraction angle, the light is emitted within a relatively wide radiation angle.

  According to the above-described invention, flash light emission can be performed only in a necessary and sufficient image frame area according to the zoom position of the image pickup apparatus and the arrangement state of the subject, so that a camera capable of obtaining optimum exposure with less energy can be realized. As a result, the battery life of the imaging device and the lighting device is extended. In addition, since the irradiation angle variable effect can be obtained with at least one light emitting element per color, the number of parts can be reduced and the light emitting surface can be downsized.

  FIG. 1 is a perspective view of a lighting device according to an embodiment of the invention. FIG. 2 is a front view of a digital still camera according to an embodiment of an imaging apparatus provided with the illumination device. FIG. 3 is a perspective view of the imaging apparatus.

  As shown in FIG. 2, the digital still camera 5 includes a flash unit 51, a lens barrel 52, a finder window 53, and a finger hook 54 on the front surface of the camera body 50. Further, as shown in FIGS. 2 and 3, a shutter button 55 is provided substantially on the left side of the upper surface of the camera body 50. As shown in FIG. 3, the lens barrel 52 protrudes from the camera body 50 when the digital still camera 52 is activated, and can be stored in the camera body 50 when the digital still camera 52 is stopped.

  FIG. 4 is a block diagram showing a system configuration of the digital still camera 5.

  The system configuration of the digital still camera 5 includes a control unit (CPU) 61, a flash unit 62, a lens driving unit 63, an imaging unit 64, an internal memory 65, an external memory (for example, a memory card) 66, and a display unit (for example, an LCD) 67. Prepare. The lens driving unit 63 includes at least a lens, a zoom operation unit, a focus operation unit, and an iris operation unit. The imaging unit 64 includes a CCD (imaging device) and a CH (camera head). The control unit 61 also has a DSP (Digital Signal Processor) function. The zoom position information obtained by the lens driving unit 63 is managed by the control unit 61. The flash unit 62 is also controlled in light emission timing and light emission time by the control unit 61.

  The lighting device 1 illustrated in FIG. 1 according to an embodiment of the invention is applied to the flash unit 62. The illumination device 1 includes a light emitting element chip 2, a substrate 3, and a package 4. The light emitting element chip 2 includes a plurality of light emitting elements (LEDs). The light emitting element chip 2 is installed at the center of the upper surface of the substrate 3. The light emitting element chip 2 is supplied with power for light emission from the substrate 3. A package 4 for sealing the light emitting element chip 2 is provided on the substrate 3. The package 4 may be formed so as to include an optical lens and a reflection plate. The illumination device 1 may be applied to a single flash unit attached to the outside of the camera body 50 shown in FIG.

  FIG. 5 is a circuit configuration diagram showing an example of a driving circuit for instantaneously driving the light emitting element.

  The drive circuit 68 is a form in which two light emitting elements are driven to emit light. The drive circuit 68 includes a booster circuit 69, a storage element 70, a light emitting element chip 71, constant current circuits 72 a and 72 b, and a control circuit 73. The light emitting element chip 71 includes light emitting elements 711 and 712. The light emitting elements 711 and 712 are electrically connected to the control circuit 73 via constant current circuits 72a and 72b, respectively.

  The charge supplied from the battery 74 is boosted by the booster circuit 69 and then supplied to the storage element 70 such as a capacitor. The control circuit 73 can control energization ON / OFF. The control circuit 73 performs charge operation control of the power storage element 70 and operation control of the light emitting element chip 71 in accordance with instructions from the control unit 61. The constant current circuits 72a and 72a drive the light emitting elements 711 and 712 at a constant current, respectively. The constant current circuits 72a and 72b independently control the light emission of the light emitting elements 711 and 712 based on the control signal of the control circuit 73.

  In the illuminating device 1, as shown in FIG. 1, cathode electrodes are independently formed in a plurality of sections with respect to a single light emitting element chip 2. That is, the cathode electrode which is a light emitting element is independently formed in two sections with respect to the single light emitting element chip 2. The cathode electrode is a transparent electrode made of a material exemplified by ITO (Indium Tin Oxide), and consists of two regions of a first cathode 21 and a second cathode 22.

  The light emitting element chip 2 is provided with a first cathode lead electrode 23 and a second cathode lead electrode 24 that are independently connected to the first cathode 21 and the second cathode 22, respectively. According to such a configuration, the light emitting area in the light emitting surface of the light emitting element chip 2 can be divided into a plurality of parts to emit light for each area. The first cathode lead electrode 23 and the second cathode lead electrode 24 may be formed of a metal oxide film or a metal film.

  On the other hand, on the side of the substrate 3 on which the light emitting element chip 2 is provided, electrode terminals 31 and 32 corresponding to the first cathode lead electrode 23 and the second cathode lead electrode 24 are provided. A voltage can be applied. In the region immediately below the electrode to which the forward voltage is applied, the current density is higher than in other regions, and this region is selectively activated to emit light.

  The cathode electrode is preferably made of a highly transparent conductive material made of a metal oxide film, but is preferably formed locally in combination with a metal film in order to reduce the current-carrying impedance. The light emitting element chip 2 shown in FIG. 1 has a form in which the cathode electrode side is divided into a plurality of electrode surfaces. Instead of this form, the anode electrode side has a plurality of electrode surfaces made of ITO. The light may be emitted (the same applies to the light emitting element chip 6 in FIG. 10 and the light emitting element chip 7 in FIG. 11).

  FIG. 6A is a plan view showing the configuration of the light emitting element chip according to the first embodiment. FIG. 6B is a cross-sectional view showing a configuration of the light emitting element chip.

  As shown in FIGS. 6A and 6B, the first cathode 21 is formed in a plate shape having a substantially square main surface. The second cathode 22 is formed in a ring-shaped plate shape surrounding the periphery of the first cathode 21 on the same plane. The first cathode 21 and the second cathode 22 are electrically connected to the first cathode lead electrode 23 and the second cathode lead electrode 24, respectively. The first cathode 21 and the second cathode 22 are formed on the epitaxial layer 25 as electrically independent electrodes as shown in the cross-sectional structure of FIG. As illustrated, the epitaxial layer 25 is formed on the upper surface of the silicon substrate 26 via the conductive layer 27. An anode lead electrode 28 is formed on the conductive layer 27 near the end of the light emitting element chip 2. Although depending on the material of the light emitting element chip 2, light rays emitted from the light emitting surfaces of the cathode electrode, that is, the first cathode 21 and the second cathode 22, are emitted mainly at a narrow spread angle in the perpendicular direction of the light emitting surface.

  The light emitting element chip 2 is installed at the center of the upper surface of the substrate 3 as shown in FIG. The first cathode lead electrode 23, the second cathode lead electrode 24, and the anode lead electrode 28 of the light emitting element 2 are electrically connected to the electrode terminal 31, the electrode terminal 32, and the electrode terminal 33 on the substrate 3 by bonding wires 34, 35, and 36, respectively. Connected to. The light emitting element chip 2 on the substrate 3 is embedded in a package 4. The package 4 is molded so as to have a lens function using a known resin that is light transmissive. Specifically, the package 4 is formed to have a concave lens function by forming the upper surface thereof as a concave surface.

  FIG. 7 is a cross-sectional view of the substrate 3 in which the light emitting element chip 2 is enclosed by the package 4.

  On the upper surface of the package 4, a lens surface 10 that forms a lens-shaped radiation surface is formed from the viewpoint of assembly accuracy in optical design using the light emitting element chip 2 as a light source. The form of the lens surface 10 is a concave lens surface with respect to the emission direction, and the irradiation range is expanded.

  In order to obtain the symmetry of the light distribution characteristic required as the flash auxiliary light, the center point of the light emitting surface of the light emitting element chip 2 should be on the central axis of the lens surface 40 of the package 4 as shown in FIG. preferable. When the light emitting element chip 2 is used, the emitted light emitted from the region of the first cathode 21 is emitted from the vicinity of the center of the lens surface 40 of the package 4, so that the refraction angle at the lens interface is relatively small. It is emitted within a relatively narrow radiation angle. Since the emitted light emitted from the region of the second cathode 22 is emitted from the lens interface having a relatively large refraction angle away from the center of the package 4, it is emitted within a relatively wide radiation angle.

  FIG. 8 shows the radiation intensity distribution with respect to the radiation angle on the evaluation line including the central axis of the lens surface.

  The vertical axis Y is the central axis of the lens surface 40 of the package 4. The horizontal axis X is an axis that is on the same plane as the light emitting surfaces of the first cathode 21 and the second cathode 22. The intensity distribution indicated by the solid line is the intensity distribution of the emitted light emitted from the first cathode 21 region. On the other hand, the intensity distribution indicated by the broken line is the intensity distribution of the emitted light emitted from the region of the second cathode 22.

  A specific example in which this characteristic is applied to flash auxiliary light of a digital still camera will be described with reference to FIGS.

  Regarding the zoom mechanism of the lens barrel 52 of the digital still camera 5 shown in FIG. 9, the photographic image frame changes according to the zoom position, and FIG. The light emission of the first cathode 21 and the second cathode 22 of the lighting device 1 shown in FIG. For example, as shown in FIG. 9, when the zoom position of the lens barrel 52 is the telephoto position where the “thin solid line” is the limit, the irradiation apparatus 1 emits light only in the region of the first cathode 21 shown in FIG. As shown in FIG. 9, an irradiation range with a “thick solid line” as a limit is secured. On the other hand, when the zoom position is at the wide-angle position where the “thin broken line” is the limit, the illumination device 1 causes both the first cathode 21 and the second cathode 22 shown in FIG. An irradiation range with a “thick broken line” as shown in FIG. In this example, the zoom position is used as a determination condition, but it is also effective to use flash dimming detection information as a determination condition.

  Further, as another embodiment of the light emitting element chip, as in the light emitting element chips 6 and 7 illustrated in the plan views of FIGS. 10 and 11, three or more cathode electrodes are provided on a single silicon substrate. The cathodes may be divided and arranged.

  In the light-emitting element chip 6 shown in FIG. 10, an epitaxial layer 81 is provided on the upper surface of a single silicon substrate whose main surface is rectangular via a conductive layer 80, and the epitaxial layer 81 has six plate-like shapes. The cathodes are arranged in a matrix. Here, the cathodes are arranged in a matrix of “2 rows and 3 columns” on the epitaxial layer 81. The main surfaces of the respective cathodes, that is, the first cathode 82a to the sixth cathode 82f are not limited to a substantially rectangular shape as illustrated, and may be formed into, for example, a substantially square shape, a circle shape, an ellipse shape, or an oval shape. Good.

  The first cathode 82a to the sixth cathode 82f are arranged in a matrix of “2 rows and 3 columns” so as not to contact each other. That is, the first cathode 82a is arranged at the position of the first row and the first column. The second cathode 82b is disposed at the position of the first row and the second column. The third cathode 82c is disposed at the position of the first row and the third column. The fourth cathode 82d is disposed at the position of the second row and the first column. The fifth cathode 82e is arranged at the position of the second row and the second column. The sixth cathode 82f is arranged at the position of the second row and the third column.

  The first cathode 82 a is electrically connected to a first cathode lead electrode 83 a provided in the conductive layer 80 near the upper side of the epitaxial layer 81. The second cathode 82b is electrically connected to a second cathode lead electrode 83b installed in the conductive layer 80 near the upper side. The third cathode 82c is electrically connected to a third cathode lead electrode 83c installed in the conductive layer 80 near the upper side. The fourth cathode 82d is electrically connected to a fourth cathode lead electrode 83d provided in the conductive layer 80 near the lower side of the epitaxial layer 81. The fifth cathode 82e is electrically connected to a fifth cathode lead electrode 83e installed on the conductive layer 80 near the lower side. The sixth cathode 82f is electrically connected to a sixth cathode lead electrode 83f installed in the conductive layer 80 near the lower side. The anode electrode 84 is provided near the corner of the conductive layer 80.

  In the light emitting element chip 7 shown in FIG. 11, five plate-like cathodes are arranged in an X shape on the epitaxial layer 91. Here, the second cathode 92b is provided at the center of an epitaxial layer 91 provided on the upper surface of a single silicon substrate having a rectangular main surface via a conductive layer 90. The first cathode 92a, the third cathode 92c, the fourth cathode 92d, and the fifth cathode 92e are disposed so as to surround the second cathode 92b. The second cathode 92b is formed in a circular shape, an elliptical shape, or an oval shape. The first cathode 92a, the third cathode 92c, the fourth cathode 92d, and the fifth cathode 92e are formed so as not to contact at least the second cathode 92b.

  The first cathode 92 a is electrically connected to a first cathode lead electrode 93 a provided on the conductive layer 90 near the upper side of the epitaxial layer 91. The second cathode 92b is electrically connected to a second cathode lead electrode 93b installed in the conductive layer 90 near the upper side. The third cathode 92c is electrically connected to a third cathode lead electrode 93c provided on the conductive layer 90 near the upper side. The fourth cathode 92d is electrically connected to a fourth cathode lead electrode 93d provided on the conductive layer 90 near the lower side of the epitaxial layer 91. The fifth cathode 92e is electrically connected to a fifth cathode lead electrode 93e installed on the conductive layer 90 near the lower side. The anode electrode 94 is provided near the corner of the conductive layer 90.

  As described above, each electrode region of the light emitting element chip of the embodiment illustrated as described above, that is, the radiation angle region of the light emitted from each cathode corresponds to a specific region obtained by dividing the image frame region. And it can selectively irradiate with respect to the specific area | region in an image frame by carrying out light emission control independently for every cathode. The flash irradiation area is selectively dimmed based on the image frame area detection information and the zoom position information in the flash dimming detection information.

  FIG. 12 is a block diagram illustrating a system configuration of the imaging apparatus 8 in which the light emitting element chip according to the third embodiment is applied to the illumination apparatus.

  The image sensor 100 converts an image of a subject captured through the lens 105 of the lens barrel 104 into an electrical signal. The image processing unit 101 introduces the image of the subject converted into the electric signal through the amplification unit 106 and the signal processing unit 107 and performs image processing. In addition to the internal memory 108, an external memory 110 is electrically connected to the image processing unit 101 from a memory slot 109 via an interface circuit 111. The driving units 102a to 102e cause the first cathode 92a to the fifth cathode 92e included in the light emitting element chip 7 to emit light. The control unit 103 controls the operation of the image processing unit 101 and operates the drive units 102a to 102e based on the operation signal of the operation unit 112 having a function such as a shutter release button and the result of the image processing in the image processing unit 101. Control.

  FIG. 13 is a flowchart illustrating an operation example of the imaging device 8. An operation example of the imaging device 8 will be described with reference to FIGS. 12 and 13.

  In step S1, it is determined whether or not the shutter release button has been pressed. In step S <b> 2, the control unit 103 operates any of the drive units 102 a to 102 e to cause one of the first cathode 92 a to the fifth cathode 92 e of the light emitting element chip 7 to emit pre-light. In step S3, the image processing unit 102 performs image processing on the image of the subject captured by the pre-emission. In step S4, a light emitting region to emit light (in this case, any one of the first cathode 92a to the fifth cathode 92e) and its light amount are determined based on the result of the image processing. Here, the light emission time that defines the amount of light is determined. In step S5, a predetermined light emitting region (in this case, any one or some combination of the first cathode 92a to the fifth cathode 92e) is photographed in step 6 while being lit for a predetermined time that defines the determined light amount. .

  Next, an example of light emission control of the imaging apparatus will be described with reference to FIGS. 12 and 14 for a scene where a relatively close subject, a relatively far subject, and a subject beyond the flash reach range coexist within the flash reach distance.

  First, the imaging device 8 shown in FIG. 12 causes one of the first cathode 92a to the fifth cathode 92e of the light emitting element chip 7 to emit a small amount of light as pre-dimmed light emission. Reflected light from the subject is captured by the image sensor 100 of the imaging device 5. The illuminance at this time is detected for each image frame division area as in the detection image of FIG. 14B, and the light emission amount is determined for each light emission area. As an example of the determination condition, an overexposure amount is applied to a light emitting region (for example, the light emitting region of the second cathode 92b) corresponding to the image frame division region where the relatively close subject 141 shown in FIG. Therefore, the light emission amount is set low. On the other hand, the light emission amount corresponding to the region where the subject 142 is relatively far away (for example, the light emission regions of the third cathode 92c and the fifth cathode 92e) is not underexposed so that the light emission amount is set to be large. . In addition, light emission areas corresponding to the subject 143 that is longer than the flash reach distance (for example, the light emission areas of the first cathode 92a and the fourth cathode 92d) are prohibited from emitting light. The amount of light emission is controlled by the current value supplied to the light emitting element or the energization time.

  Referring to the time chart shown in FIG. 15, while the shutter is open, each light emitting region is caused to emit light independently for the light emission time determined from the detection amount. For example, the second light emitting region (second cathode 92b) corresponding to a relatively close subject shortens the light emission time, and the third light emitting region (third cathode 92c) and the fifth light emitting region (first cathode) corresponding to a relatively far subject. The 5 cathode 92e) makes the light emission time longer. The first light-emitting area (first cathode 92a) and the fourth light-emitting area (fourth cathode 92d) corresponding to the subject beyond the flash reach distance are not allowed to emit light.

  Further, as another embodiment of the illumination device according to the invention, illumination devices 161 and 162 that emit blue, green, and red light, which are the three primary colors of light, to the flash unit as in the imaging device 9 shown in FIG. , 163 may be applied. As an embodiment of these lighting devices, the light emitting element chip illustrated in FIGS. 1, 10, and 11 may be adopted, and a filter for exhibiting a predetermined color may be applied to the light emitting element. Alternatively, a package for sealing the light emitting element may be formed to exhibit a predetermined color. In order to reduce parallax between the illumination device 161 that exhibits blue light, the illumination device 162 that exhibits green light, and the illumination device 163 that exhibits red light and the imaging lens of the lens barrel 52, the illumination devices 161, 162, It is preferable to arrange 163 close to each other.

The perspective view of the illuminating device which concerns on one Embodiment of invention. The front view of the imaging device provided with the said illuminating device. The perspective view of an imaging device provided with the said illuminating device. The block diagram which showed the system configuration | structure of the said imaging device. The circuit block diagram which showed an example of the drive circuit for carrying out the instantaneous light emission drive of the light emitting element. (A) The top view of the light emitting element chip which concerns on 1st embodiment, (b) Sectional drawing which showed the structure of the said light emitting element chip. Sectional drawing of the board | substrate with which the light emitting element chip | tip was enclosed with the package. Radiation intensity distribution with respect to radiation angle on the evaluation line including the central axis of the lens surface. Explanatory drawing explaining the zoom range of an imaging lens, and the irradiation range of an illuminating device. The top view of the light emitting element chip which concerns on 2nd embodiment. The top view of the light emitting element chip which concerns on 3rd embodiment. The block diagram which showed the system configuration | structure of the imaging device with which the light emitting element chip which concerns on 3rd embodiment was applied to the illuminating device. The flowchart explaining the operation example of the imaging device by which the light emitting element chip which concerns on 3rd embodiment was applied to the illuminating device. (A) Schematic diagram of subject image, (b) Schematic diagram of detection image. The operation | movement sequence diagram explaining the operation example of the illuminating device to which the light emitting element chip | tip which concerns on 3rd embodiment was applied with the time chart. The front view of the imaging device provided with the illuminating device which concerns on other embodiment of invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,161,162,163 ... Lighting device 2,6,7 ... Light emitting element chip 3 ... Board | substrate 4 ... Package 5, 8, 9 ... Imaging device 21 ... 1st cathode, 22 ... 2nd cathode, 23 ... 1st cathode Lead electrode, 24 ... second cathode lead electrode, 25 ... epitaxial layer, 26 ... silicon substrate, 27 ... conductive layer 28 ... anode lead electrodes 31, 32, 33 ... electrode terminals 34, 35, 36 ... bonding wire 40 ... lens surface

Claims (11)

In the illumination device of the imaging device,
A substrate,
A light emitting element chip that has a conductive layer and an epitaxial layer formed on the conductive layer, and emits light upon receiving power from the substrate;
A plurality of first electrodes formed on the epitaxial layer and partitioning a light emitting surface of the light emitting element chip into a plurality of light emitting regions;
A plurality of first extraction electrodes connected to each first electrode;
A second lead electrode formed on the conductive layer;
A plurality of electrode terminals provided on the substrate and connected to each of the first extraction electrodes or the second extraction electrodes;
With
One of the light emitting areas emits light according to the angle of view of the imaging device.
Lighting device. Predetermined light emitting region among the plurality of light emitting region emits light in accordance with the focal length of the imaging lens in the front Stories imaging apparatus
The illumination device according to 請 Motomeko 1. Predetermined light emitting region among the plurality of light emitting region emits light in response to the zooming operation position of the imaging lens in the front Stories imaging apparatus
The illumination device according to 請 Motomeko 1. Predetermined light emitting region among the plurality of light emitting areas to emit light based on the detection of pli emission
The illumination device according to 請 Motomeko 1. Emission amount before Symbol Luminous areas that are controlled by a current value to be supplied to the first electrodes corresponding to the light emitting region that emits light
Lighting device according to any one of 請 Motomeko 1 to 4. Emission amount before Symbol Luminous areas that are controlled by the energization time of the first electrodes corresponding to the light emitting region that emits light
Lighting device according to any one of 請 Motomeko 1 to 4. Wherein the plurality of light emitting regions Ru disposed concentrically
Lighting device according to any one of 請 Motomeko 1 to 6. The plurality of light emitting regions Ru arranged in a matrix
Lighting device according to any one of 請 Motomeko 1 to 6. The plurality of light emitting regions Ru are arranged in X shape in the main surface of the light-emitting element chips
Lighting device according to any one of 請 Motomeko 1 to 6. Comprising a package for sealing the front Symbol plurality of light emitting regions,
The upper surface of the package is that not make concave surface
Lighting device according to any one of 請 Motomeko 1-9. An imaging device including an illumination device,
The lighting device includes:
A substrate,
A light emitting element chip that has a conductive layer and an epitaxial layer formed on the conductive layer, and emits light upon receiving power from the substrate;
A plurality of first electrodes formed on the epitaxial layer and partitioning a light emitting surface of the light emitting element chip into a plurality of light emitting regions;
A plurality of first extraction electrodes connected to each brother 1 electrode;
A second lead electrode formed on the conductive layer;
A plurality of electrode terminals provided on the substrate and connected to each of the first extraction electrodes or the second extraction electrodes;
With
An imaging device in which one of the light emitting regions emits light according to the angle of view of the imaging device.

Images