JP5062652B2

JP5062652B2 - Sensor mounting structure and flow sensor mounting structure

Info

Publication number: JP5062652B2
Application number: JP2006030203A
Authority: JP
Inventors: 信一池; 正憲安西; 健西; 昭司上運天; 信彦図師
Original assignee: Azbil Corp
Current assignee: Azbil Corp
Priority date: 2006-02-07
Filing date: 2006-02-07
Publication date: 2012-10-31
Anticipated expiration: 2026-02-07
Also published as: JP2007212197A

Description

本発明は、半導体製造装置などのガスラインにおいて、高シール性、クリーン（低アウトガス）性、耐腐食性などが要求されるところに使用する圧力、温度、濃度、組成などのセンサの取付構造及びフローセンサの取付構造に関する。 The present invention relates to a sensor mounting structure such as pressure, temperature, concentration, composition, etc. used in a gas line such as a semiconductor manufacturing apparatus where high sealing performance, clean (low outgas) property, corrosion resistance, etc. are required. The present invention relates to a flow sensor mounting structure.

例えば、半導体製造装置に使用するガス等の流体の流量を検出する流量測定装置（フローセンサ）として、流体に熱を付与して所定位置における流体の温度差を測定することにより流量を測定する熱式の流量測定装置がある（例えば、特許文献１、特許文献２参照。）。これらの流量測定装置は、シリコン基板上に流量検出部が形成されたセンサチップと、前記流量検出部を収容すると共に前記流量検出部を流れる流体の流路（溝）が形成された流路チップとしてのガラス（硼珪酸ガラス）又はシリコン基板とを接合して形成されている。
特開平５−９９７２２号公報（３−４頁、図１）特開平２００２−３４０６４６号公報（３−４頁、図３） For example, as a flow measurement device (flow sensor) that detects the flow rate of a fluid such as a gas used in a semiconductor manufacturing apparatus, heat that measures the flow rate by applying heat to the fluid and measuring the temperature difference of the fluid at a predetermined position (For example, refer to Patent Document 1 and Patent Document 2). These flow rate measuring devices include a sensor chip in which a flow rate detection unit is formed on a silicon substrate, and a flow channel chip in which a flow channel (groove) of a fluid that houses the flow rate detection unit and flows through the flow rate detection unit is formed. It is formed by bonding a glass (borosilicate glass) or a silicon substrate.
JP-A-5-99722 (page 3-4, FIG. 1) Japanese Unexamined Patent Publication No. 2002-340646 (page 3-4, FIG. 3)

上記構成の流量測定装置を一般的に流路ボディがステンレス部材で形成されたマスフローメータ、マスフローコントローラ等の流量計や流量制御機器に搭載するためには流量測定装置とステンレス部材との接続が不可欠である。また、微少流量を測定する流量測定装置と流路ボディとの間の流体のシール性を確保するために接続部材が重要である。特に高シール性、クリーン（低アウトガス）性、耐腐食性などが要求される場合接続部材として樹脂製ではなくステンレス部材等で形成されたメタルシールを採用することが必要となる。 In order to mount a flow rate measuring device with the above configuration on a flow meter or flow control device such as a mass flow meter or mass flow controller whose channel body is generally made of stainless steel, it is essential to connect the flow rate measuring device to the stainless steel member. It is. In addition, a connecting member is important in order to ensure a fluid sealing property between the flow rate measuring device for measuring a minute flow rate and the flow path body. In particular, when high sealing performance, clean (low outgas) properties, corrosion resistance, and the like are required, it is necessary to employ a metal seal formed of a stainless steel member or the like as a connecting member instead of a resin.

しかしながら、メタルシールを採用した場合ガラス部材で形成した流路チップやシリコン基板をメタルシールに押し付けた際にこれらの流路チップやシリコン基板が破損してしまう。低融点ガラスやろう材等によってガラス部材で形成した流路チップを直接ステンレス部材で形成した流路ボディに接合することも考えられるが、接合部を数百度の高温にする必要があるため作業性が悪く、流路ボディへの悪影響もあり、取り外しもできなくなるためメンテナンス性が非常に悪いものとなってしまう。また、これら両部材の熱膨張係数の差に起因する歪によって流路チップと流路ボディが剥離してしまうおそれもある。 However, when a metal seal is employed, when the flow path chip or silicon substrate formed of a glass member is pressed against the metal seal, the flow path chip or silicon substrate is damaged. Although it is conceivable to join a flow channel chip formed of a glass member with a low melting point glass or brazing material directly to a flow channel body formed of a stainless steel member, workability is required because the bonded portion needs to be heated to several hundred degrees. However, there is also an adverse effect on the flow path body, and it is impossible to remove the flow path body, so that the maintainability becomes very bad. Moreover, there is a possibility that the flow channel chip and the flow channel body may be peeled off due to distortion caused by the difference in thermal expansion coefficient between these two members.

本発明の目的は、ガス等の圧力、温度、濃度、組成などや微少な流量を測定するセンサを金属部材で形成した導通路ボディあるいは流路ボディに搭載して高シール性、クリーン（低アウトガス）、耐食性などを確保するようにしたセンサの取付構造及びフローセンサの取付構造を提供することにある。 The object of the present invention is to mount a sensor for measuring the pressure, temperature, concentration, composition, etc. of gas, etc. and a minute flow rate on a conductive body or channel body formed of a metal member, and to achieve high sealing performance and clean (low outgassing). ), And a sensor mounting structure and a flow sensor mounting structure that ensure corrosion resistance and the like.

上述した課題を解決するために、本発明の請求項１に係るセンサの取付構造は、
基板上に検出部が形成されたセンサチップに前記検出部を収容すると共に前記検出部への流体の導通路が形成された導通路付チップが接合されて形成されたセンサと、
前記導通路付チップの導通路に連通する導通路が形成され前記導通路付チップに接合された板状の押付部材と、
前記センサを搭載しかつ前記押付部材の導通路に接続される流入側導通路と流出側導通路が形成され、前記押付部材が当該流入側導通路及び流出側導通路の開口部側に取り付けられる導通路ボディと、
前記導通路ボディと押付部材との間に介在され前記押付部材により押し付けられるメタルシールとを備え、
前記メタルシールは、前記流入側導通路の開口部とこれに対応する前記押付部材の導通路との接続部分を周囲からシールするメタルシールと、前記流出側導通路の開口部とこれに対応する前記押付部材の導通路との接続部分を周囲からシールするメタルシールからなり、
前記２つのメタルシールは、前記押付部材を前記導通路ボディに押しつけることで共に押し潰されるようになっており、
前記導通路付チップは、前記押付部材と前記センサチップのそれぞれに低融点ガラスを介して接続されていることを特徴としている。 In order to solve the above-described problem, a sensor mounting structure according to claim 1 of the present invention is
A sensor formed by joining a chip with a conduction path in which the detection section is housed in a sensor chip having a detection section formed on a substrate and a fluid conduction path to the detection section is formed;
A plate-like pressing member in which a conduction path communicating with the conduction path of the chip with the conduction path is formed and joined to the chip with the conduction path;
An inflow side conduction path and an outflow side conduction path that are mounted with the sensor and connected to the conduction path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side conduction path and the outflow side conduction path. A conduction path body;
And a metal seal et been Zaisa through pressing by the pressing member is between the conduction path body and the pressing member,
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow-side conduction path and the corresponding conduction path of the pressing member from the periphery, and an opening of the outflow-side conduction path. It consists of a metal seal that seals the connection part with the conduction path of the pressing member from the surroundings,
The two metal seals are crushed together by pressing the pressing member against the conduction path body,
The chip with a conduction path is connected to each of the pressing member and the sensor chip via low-melting glass .

センサを導通路ボディに搭載し、導通路付チップに接合されている押付部材と導通路ボディとの間かつこれらの導通路の接続部にメタルシールを介在させ、押付部材によりメタルシールを押し付けて導通路付チップの導通路と導通路ボディの導通路とを接続する。押付板は、メタルシールに密着して導通路の接続部のシール性を確保すると共に導通路付チップの破損を防止する。メタルシールは、高シール性、クリーン（低アウトガス）性を持ち、耐食性を有する部材を使用することにより流体として腐食性のガス等を使用した場合でもシール性能が確保される。
特にメタルシールが、流入側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールと、流出側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールからなり、２つのメタルシールは、板状の押付部材を導通路ボディに押しつけることで共に押し潰されることにより、流入側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からを確実にシールすると共に、流出側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールすることができる。
また、導通路付チップが、押付部材とセンサチップのそれぞれに低融点ガラスを介して接続されていることで、押付部材が流入側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールと、流出側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールを共に押し潰すことにより、センサチップを破損することなくこれら２つの接続部分の周囲に対するシール性を確保することができる。 The sensor is mounted on the conduction path body, a metal seal is interposed between the pressing member joined to the chip with the conduction path and the conduction path body and at the connection portion of these conduction paths, and the metal seal is pressed by the pressing member. The conduction path of the chip with the conduction path is connected to the conduction path of the conduction path body. The pressing plate is in close contact with the metal seal to ensure the sealing property of the connection portion of the conduction path and prevent the breakage of the chip with the conduction path. Metal seals have high sealing properties, clean (low outgas) properties, and use of a corrosion-resistant member ensures sealing performance even when corrosive gas or the like is used as a fluid.
In particular, the metal seal seals the connection portion between the opening portion of the inflow side conduction path and the corresponding conduction path of the pressing member from the periphery, and the opening portion of the outflow side conduction path and the pressing member corresponding thereto. It consists of a metal seal that seals the connection part with the conduction path from the surroundings, and the two metal seals are crushed together by pressing a plate-like pressing member against the conduction path body, so that the opening part of the inflow side conduction path The connection part of the pressing member corresponding to this with the conduction path is surely sealed from the periphery, and the connection part between the opening part of the outflow side conduction path and the corresponding conduction path of the pressing member is sealed from the periphery. Can do.
In addition, since the chip with a conduction path is connected to each of the pressing member and the sensor chip via low-melting glass, the pressing member has an opening part of the inflow side conduction path and a conduction path of the pressing member corresponding thereto. By crushing together the metal seal that seals the connection part of the sensor from the periphery, and the metal seal that seals the connection part of the opening of the outflow side conduction path and the conduction path of the corresponding pressing member from the periphery, the sensor chip The sealability with respect to the periphery of these two connecting portions can be ensured without breakage.

また、本発明の請求項２に記載のセンサの取付構造は、
基板上に検出部と該検出部への流体の導通孔が形成されたセンサチップに前記検出部を収容する導通路付チップが接合されて形成されたセンサと、
前記センサチップの導通孔に連通する導通路が形成され前記センサチップに接合される板状の押付部材と、
前記センサを搭載しかつ前記押付部材の導通路に接続される流入側導通路と流出側導通路が形成され、前記押付部材が当該流入側導通路及び流出側導通路の開口部側に取り付けられる導通路ボディと、
前記導通路ボディと押付部材との間に介在され前記押付部材により押し付けられるメタルシールとを備え、
前記メタルシールは、前記流入側導通路の開口部とこれに対応する前記押付部材の導通路との接続部分を周囲からシールするメタルシールと、前記流出側導通路の開口部とこれに対応する前記押付部材の導通路との接続部分を周囲からシールするメタルシールからなり、
前記２つのメタルシールは、前記押付部材を前記導通路ボディに押し付けることで共に押し潰されるようになっており、
前記センサチップは、前記押付部材と前記導通路付チップのそれぞれに低融点ガラスを介して接続されていることを特徴としている。 The sensor mounting structure according to claim 2 of the present invention is
A sensor formed by bonding a chip with a conduction path that accommodates the detection unit to a sensor chip in which a detection unit and a fluid conduction hole to the detection unit are formed on a substrate;
A plate-shaped pressing member guide path is formed is bonded to the sensor chip which communicates with the through hole of the sensor chip,
An inflow side conduction path and an outflow side conduction path that are mounted with the sensor and connected to the conduction path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side conduction path and the outflow side conduction path. A conduction path body;
A metal seal interposed between the conduction path body and the pressing member and pressed by the pressing member;
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow-side conduction path and the corresponding conduction path of the pressing member from the periphery, and an opening of the outflow-side conduction path. It consists of a metal seal that seals the connection part with the conduction path of the pressing member from the surroundings,
The two metal seals are crushed together by pressing the pressing member against the conduction path body,
The sensor chip is characterized in that it is connected to each of the pressing member and the chip with conduction path via low melting point glass.

センサを導通路ボディに搭載し、センサチップに接合されている押付部材と導通路ボディとの間かつこれらの導通路の接続部にメタルシールを介在させ、押付部材によりメタルシールを押し付けてセンサチップの導通孔と導通路ボディの導通路とを接続する。
特にメタルシールが、流入側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールと、流出側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールからなり、２つのメタルシールは、板状の押付部材を導通路ボディに押しつけることで共に押し潰されることにより、流入側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からを確実にシールすると共に、流出側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールすることができる。
また、センサチップが、押付部材と導通路付チップのそれぞれに低融点ガラスを介して接続されていることで、押付部材が流入側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールと、流出側導通路の開口部とこれに対応する押付部材の導通路との接続部分を周囲からシールするメタルシールを共に押し潰すことにより、センサチップを破損することなくこれら２つの接続部分の周囲に対するシール性を確保することができる。 The sensor is mounted on the conduction path body, a metal seal is interposed between the pressing member joined to the sensor chip and the conduction path body, and at the connection portion of these conduction paths, and the metal seal is pressed by the pressing member to form the sensor chip. The conduction hole of the conduction path and the conduction path of the conduction path body are connected.
In particular, the metal seal seals the connection portion between the opening portion of the inflow side conduction path and the corresponding conduction path of the pressing member from the periphery, and the opening portion of the outflow side conduction path and the pressing member corresponding thereto. It consists of a metal seal that seals the connection part with the conduction path from the surroundings, and the two metal seals are crushed together by pressing a plate-like pressing member against the conduction path body, so that the opening part of the inflow side conduction path The connection part of the pressing member corresponding to this with the conduction path is surely sealed from the periphery, and the connection part between the opening part of the outflow side conduction path and the corresponding conduction path of the pressing member is sealed from the periphery. Can do.
In addition, the sensor chip is connected to each of the pressing member and the chip with the conduction path via the low melting point glass, so that the pressing member has an opening portion of the inflow side conduction path and a conduction path of the pressing member corresponding thereto. By crushing together the metal seal that seals the connection part of the sensor from the periphery, and the metal seal that seals the connection part of the opening of the outflow side conduction path and the conduction path of the corresponding pressing member from the periphery, the sensor chip The sealability with respect to the periphery of these two connecting portions can be ensured without breakage.

また、本発明の請求項３に記載のフローセンサの取付構造は、
基板上に流量検出部が形成されたセンサチップに前記流量検出部を収容すると共に前記流量検出部を流れる流体の流路が形成された流路付チップが接合されて形成されたフローセンサと、
前記流路付チップの流路に連通する流路が形成され前記流路付チップに接合される板状の押付部材と、
前記フローセンサを搭載しかつ前記押付部材の流路に接続される流入側流路と流出側流路が形成され、前記押付部材が当該流入側流路及び流出側流路の開口部側に取り付けられる流路ボディと、
前記流路ボディと押付部材との間に介在され前記押付板により押し付けられるメタルシールとを備え、
前記メタルシールは、前記流入側流路の開口部とこれに対応する前記押付部材の流路との接続部分を周囲からシールするメタルシールと、前記流出側流路の開口部とこれに対応する前記押付部材の流路との接続部分を周囲からシールするメタルシールからなり、
前記２つのシールは、前記押付部材を前記流路ボディに押し付けることで共に押し潰されるようになっており、
前記流路付チップは、前記押付部材と前記センサチップのそれぞれに低融点ガラスを介して接続されていることを特徴としている。 Moreover, the mounting structure of the flow sensor according to claim 3 of the present invention is
A flow sensor formed by joining the flow rate detection unit in a sensor chip having a flow rate detection unit formed on a substrate and joining a chip with a flow channel in which a flow path of fluid flowing through the flow rate detection unit is formed;
A plate-shaped pressing member flow passage communicating with the flow path of the chip with the passage Ru is formed is joined to the attached channel chip,
An inflow side flow path and an outflow side flow path mounted with the flow sensor and connected to the flow path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side flow path and the outflow side flow path A flow path body,
And a metal seal et pressed by interposed said pressing plate is between the flow path body and the pressing member,
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow side flow path and the flow path of the pressing member corresponding to the opening, and the opening of the outflow side flow path. It consists of a metal seal that seals the connection part with the flow path of the pressing member from the surroundings,
The two seals are adapted to be crushed together by pressing the pressing member against the flow path body,
The chip with a flow path is characterized in that it is connected to each of the pressing member and the sensor chip via low melting point glass .

フローセンサを流路ボディに搭載し、流路付チップに接合されている押付部材と流路ボディとの間かつこれらの流路の接続部にメタルシールを介在させ、押付部材によりメタルシールを押し付けて流路付チップの流路と流路ボディの流路とを接続する。押付部材は、メタルシールに密着して流路の接続部のシール性を確保すると共に流路付チップの破損を防止する。メタルシールは、高シール性、クリーン（低アウトガス）性を持ち、耐食性を有する部材を使用することにより流体として腐食性のガス等を使用した場合でもシール性能が確保される。
特にメタルシールが、流入側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールと、流出側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールからなり、２つのメタルシールは、板状の押付部材を流路ボディに押しつけることで共に押し潰されることにより、流入側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からを確実にシールすると共に、流出側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールすることができる。
また、流路付チップが、押付部材とセンサチップのそれぞれに低融点ガラスを介して接続されていることで、押付部材が流入側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールと、流出側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールを共に押し潰すことにより、センサチップを破損することなくこれら２つの接続部分の周囲に対するシール性を確保することができる。 A flow sensor is mounted on the flow channel body, and a metal seal is interposed between the pressure member joined to the chip with flow channel and the flow channel body and at the connection part of these flow channels, and the metal seal is pressed by the pressure member. The flow path of the chip with flow path is connected to the flow path of the flow path body. The pressing member is in close contact with the metal seal to ensure the sealing property of the connection portion of the flow path and prevent the breakage of the chip with the flow path. Metal seals have high sealing properties, clean (low outgas) properties, and use of a corrosion-resistant member ensures sealing performance even when corrosive gas or the like is used as a fluid.
In particular, the metal seal includes a metal seal that seals the connection portion between the opening portion of the inflow side flow passage and the flow passage of the pressing member corresponding thereto, and the opening portion of the outflow side flow passage and the pressing member corresponding thereto. It consists of a metal seal that seals the connection part with the flow path from the surroundings, and the two metal seals are crushed together by pressing a plate-like pressing member against the flow path body, and thereby the opening of the flow path on the inflow side The connection part of the pressing member corresponding to this with the flow path of the pressing member is surely sealed from the periphery, and the connection part of the opening part of the outflow side flow path and the flow path of the pressing member corresponding thereto is sealed from the periphery. Can do.
In addition, since the chip with flow path is connected to each of the pressing member and the sensor chip via low melting point glass, the pressing member has an opening of the inflow side flow path and the flow path of the pressing member corresponding thereto. By crushing the metal seal that seals the connection part of the sensor from the periphery and the metal seal that seals the connection part of the opening part of the outflow side flow path and the flow path of the corresponding pressing member from the periphery, the sensor chip The sealability with respect to the periphery of these two connecting portions can be ensured without breakage.

また、本発明の請求項４に記載のフローセンサの取付構造は、
基板上に流量検出部と該流量検出部への流体の導通孔が形成されたセンサチップに前記流量検出部を収容する流路付チップが接合されて形成されたフローセンサと、
前記センサチップの導通孔に連通する流路が形成され前記センサチップに接合される板状の押付部材と、
前記フローセンサを搭載しかつ前記押付部材の流路に接続される流入側流路と流出側流路が形成され、前記押付部材が当該流入側流路及び流出側流路の開口部側に取り付けられる流路ボディと、
前記流路ボディと押付部材との間に介在され前記押付板により押し付けられるメタルシールとを備え、
前記メタルシールは、前記流入側流路の開口部とこれに対応する前記押付部材の流路との接続部分を周囲からシールするメタルシールと、前記流出側流路の開口部とこれに対応する前記押付部材の流路との接続部分を周囲からシールするメタルシールからなり、
前記２つのシールは、前記押付部材を前記流路ボディに押し付けることで共に押し潰されるようになっており、
前記センサチップは、前記押付部材と前記流路付チップのそれぞれに低融点ガラスを介して接続されていることを特徴としている。 Moreover, the mounting structure of the flow sensor according to claim 4 of the present invention is
A flow sensor formed by bonding a chip with a flow path for housing the flow rate detection unit to a sensor chip in which a flow rate detection unit and a fluid conduction hole to the flow rate detection unit are formed on a substrate;
A plate-shaped pressing member flow passage communicating with the through hole of the sensor chip is formed is bonded to the sensor chip,
An inflow side flow path and an outflow side flow path mounted with the flow sensor and connected to the flow path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side flow path and the outflow side flow path A flow path body,
A metal seal interposed between the flow path body and the pressing member and pressed by the pressing plate;
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow side flow path and the flow path of the pressing member corresponding to the opening, and the opening of the outflow side flow path. It consists of a metal seal that seals the connection part with the flow path of the pressing member from the surroundings,
The two seals are adapted to be crushed together by pressing the pressing member against the flow path body,
The sensor chip is characterized in that it is connected to each of the pressing member and the chip with flow path via low melting point glass.

フローセンサを流路ボディに搭載し、センサチップに接合されている押付部材と流路ボディとの間かつこれらの流路の接続部にメタルシールを介在させ、押付部材によりメタルシールを押し付けてセンサチップの導通路と流路ボディの流路とを接続する。
特にメタルシールが、流入側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールと、流出側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールからなり、２つのメタルシールは、板状の押付部材を流路ボディに押しつけることで共に押し潰されることにより、流入側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からを確実にシールすると共に、流出側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールすることができる。
また、センサチップが、押付部材と導通路付チップのそれぞれに低融点ガラスを介して接続されていることで、押付部材が流入側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールと、流出側流路の開口部とこれに対応する押付部材の流路との接続部分を周囲からシールするメタルシールを共に押し潰すことにより、センサチップを破損することなくこれら２つの接続部分の周囲に対するシール性を確保することができる。 A flow sensor is mounted on the flow path body, a metal seal is interposed between the pressing member joined to the sensor chip and the flow path body, and at the connection portion of these flow paths, and the metal seal is pressed by the pressing member to thereby detect the sensor. The conduction path of the chip and the flow path of the flow path body are connected.
In particular, the metal seal includes a metal seal that seals the connection portion between the opening portion of the inflow side flow passage and the flow passage of the pressing member corresponding thereto, and the opening portion of the outflow side flow passage and the pressing member corresponding thereto. It consists of a metal seal that seals the connection part with the flow path from the surroundings, and the two metal seals are crushed together by pressing a plate-like pressing member against the flow path body, and thereby the opening of the flow path on the inflow side The connection part of the pressing member corresponding to this with the flow path of the pressing member is surely sealed from the periphery, and the connection part of the opening part of the outflow side flow path and the flow path of the pressing member corresponding thereto is sealed from the periphery. Can do.
Further, the sensor chip is connected to each of the pressing member and the chip with the conduction path via low melting point glass, so that the pressing member has an opening of the inflow side channel and a channel of the pressing member corresponding thereto. By crushing the metal seal that seals the connection part of the sensor from the periphery and the metal seal that seals the connection part of the opening part of the outflow side flow path and the flow path of the corresponding pressing member from the periphery, the sensor chip The sealability with respect to the periphery of these two connecting portions can be ensured without breakage.

また、本発明の請求項５に記載のセンサの取付構造は、請求項１又は請求項２において、前記押付部材はコバールでできており、前記導通路付チップは硼珪酸ガラスでできていることを特徴としている。 The sensor mounting structure according to claim 5 of the present invention is the sensor mounting structure according to claim 1 or 2, wherein the pressing member is made of Kovar, and the chip with conduction path is made of borosilicate glass. It is characterized by.

また、本発明の請求項６に記載のフローセンサの取付構造は、請求項３又は請求項４において、前記押付部材はコバールでできており、前記流路付チップは硼珪酸ガラスでできていることを特徴としている。 The flow sensor mounting structure according to claim 6 of the present invention is the flow sensor mounting structure according to claim 3 or 4, wherein the pressing member is made of Kovar, and the tip with flow path is made of borosilicate glass. It is characterized by that.

センサの導通路付きチップ又はフローセンサの流路付チップに接合する押付部材としてこれらチップの熱膨張係数に近い熱膨張係数を有する部材を使用し、これらを接合したときの熱膨張係数の差を緩和する。これにより、熱膨張係数差に起因する歪を小さくして導通路付きチップ又は流路付チップと押付部材との接合部の剥離や流路付チップの破損を防止する。 Use a member having a thermal expansion coefficient close to the thermal expansion coefficient of these chips as the pressing member to be joined to the chip with the conduction path of the sensor or the chip with the flow path of the flow sensor, and calculate the difference in thermal expansion coefficient when these are joined. ease. Thereby, the distortion resulting from the difference in thermal expansion coefficient is reduced to prevent peeling of the joint portion between the chip with conduction path or the chip with flow path and the pressing member and the breakage of the chip with flow path.

また、前記導通路付チップ又は流路付チップを硼珪酸ガラスまたはシリコンあるいはそれらの複合で形成し、前記流路ボディをステンレス部材で形成し、前記メタルシールをステンレス部材で形成された中空のメタルＯリングとし、前記押付部材を熱膨張係数が硼珪酸ガラスやシリコンの熱膨張係数に近くかつステンレス部材で形成された中空のメタルＯリングを押し付けて密着することができる強度を有する炭化珪素（SiC）またはコバール等で形成することにより、導通路付チップ又は流路付チップと押付部材との間の熱膨張係数の差を緩和して流路付チップと押付部材との接合部の剥離や流路付チップの破損を防止すると共にシール性を確保することが可能であり、流路ボディがステンレス部材で形成されたマスフローメータ、マスフローコントローラ等の流量計や流量制御機器にフローセンサを接続しかつ高シール性、クリーン（低アウトガス）性を確保することができる。また、腐食性を有するガス等に対処することができる。なお、コバールの場合は耐食性メッキやコーティングが必要である。 Further, the chip with a conduction path or the chip with a flow path is formed of borosilicate glass or silicon or a composite thereof, the flow path body is formed of a stainless steel member, and the metal seal is a hollow metal formed of a stainless steel member. A silicon carbide (SiC) having a strength that allows the pressing member to have a thermal expansion coefficient close to the thermal expansion coefficient of borosilicate glass or silicon and to press and attach a hollow metal O-ring formed of a stainless steel member. ) Or Kovar, etc. to alleviate the difference in thermal expansion coefficient between the chip with conduction path or the chip with flow path and the pressing member, and the separation or flow of the joint between the chip with flow path and the pressing member It is possible to prevent breakage of the channel tip and ensure sealing performance, and a mass flow meter and a mass flow meter in which the flow path body is formed of a stainless steel member. Connect the flow sensor in the flow meter and flow control devices such as a controller and a high sealing property can be secured a clean (low outgassing) properties. Further, it is possible to cope with corrosive gases and the like. In the case of Kovar, corrosion resistant plating or coating is required.

本発明によると、センサの流路付チップの流路に押付部材を接合し、センサを搭載する流路ボディとの間の流路の接続部に介在させたメタルシールを押し付けることで、流路付チップを損傷することなく接続部のシール性を確保することが可能となり、流路ボディがステンレス部材で形成されたマスフローメータ、マスフローコントローラ等の流量計や流量制御機器にセンサを接続しかつ高シール性、クリーン（低アウトガス）性を確保することができる。また、押付部材をステンレス、インコネル、ハステロイ、炭化珪素（SiC）などの耐食性部材で製作すれば、腐食性を有するガス等に対処することができる。 According to the present invention, the pressing member is joined to the flow path of the chip with the flow path of the sensor, and the metal seal interposed between the flow path body and the flow path body on which the sensor is mounted presses the flow path. It is possible to ensure the sealing performance of the connection part without damaging the attached tip, and connect the sensor to a flow meter such as a mass flow meter or a mass flow controller whose flow path body is made of a stainless steel member and a flow control device and Sealability and cleanness (low outgas) can be ensured. If the pressing member is made of a corrosion-resistant member such as stainless steel, inconel, hastelloy, or silicon carbide (SiC), it can cope with corrosive gases.

また、押付部材として熱膨張係数が流路付チップの熱膨張係数に近い部材を使用することで、これら両部材間及び押付部材と流路ボディとの間の熱膨張係数差を緩和することができ、熱膨張係数差に起因する歪による流路付チップの破損や、流路付チップと押付部材との接合部の剥離等を防止することができる。 Further, by using a member having a thermal expansion coefficient close to that of the chip with flow path as the pressing member, the difference in thermal expansion coefficient between these members and between the pressing member and the flow path body can be reduced. It is possible to prevent breakage of the chip with flow passage due to distortion caused by the difference in thermal expansion coefficient, separation of the joint portion between the chip with flow passage and the pressing member, and the like.

以下、本発明の一実施形態に係るフローセンサの取付構造について図面に基づいて説明する。図１は、本発明に係るフローセンサの取付構造を適用したフローセンサユニットと流路ボディの一部の断面図を示す。フローセンサユニット１は、フローセンサ２と枠体１６、蓋体１７及び押付部材（中間部材）としての押付板１９からなり、例えば半導体製造装置などに使用されるマスフローメータ或いはマスフローコントローラ等の流量計或いは流量制御装置の一部を構成する流路ボディ（導通路ボディ）１５に取り付けられる。 Hereinafter, a flow sensor mounting structure according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a part of a flow sensor unit and a flow path body to which a flow sensor mounting structure according to the present invention is applied. The flow sensor unit 1 includes a flow sensor 2, a frame 16, a lid 17, and a pressing plate 19 as a pressing member (intermediate member). For example, a flow meter such as a mass flow meter or a mass flow controller used in a semiconductor manufacturing apparatus or the like. Or it attaches to the flow path body (conduction path body) 15 which comprises a part of flow control apparatus.

フローセンサ２は、センサチップ５と、このセンサチップ５の下面に接合された流路付チップ（導通路付チップ）としてのガラスチップ６とにより構成されている。センサチップ５は、例えばシリコン基板８の下面に全面に亘り形成された窒化シリコン又は二酸化シリコンの絶縁膜（薄膜）９の中央位置に流量検出部１０が形成され、更に流量検出部１０が前記窒化シリコン又は二酸化シリコンの絶縁膜（薄膜）９により被覆された構成とされている。 The flow sensor 2 includes a sensor chip 5 and a glass chip 6 as a chip with a flow path (chip with a conductive path) bonded to the lower surface of the sensor chip 5. In the sensor chip 5, for example, a flow rate detection unit 10 is formed at the center of a silicon nitride or silicon dioxide insulating film (thin film) 9 formed on the entire lower surface of the silicon substrate 8, and the flow rate detection unit 10 is further nitrided. The structure is covered with an insulating film (thin film) 9 of silicon or silicon dioxide.

流量検出部１０は、図示しない例えば白金薄膜でできた発熱素子としてのヒータと、このヒータの上流側及び下流側に等間隔で例えば白金薄膜でできた抵抗素子としての２つの測温素子及びこれらのリードパターンにより形成されている。 The flow rate detector 10 includes a heater (not shown) as a heating element made of, for example, a platinum thin film, two temperature measuring elements as resistance elements made of, for example, a platinum thin film at equal intervals on the upstream side and the downstream side of the heater, and these The lead pattern is formed.

シリコン基板８の下面には流量検出部１０の上方位置に凹部８ａが形成されており、絶縁膜９の凹部８ａを覆う部位はダイアフラムとされている。これにより、流量検出部１０とシリコン基板８とが熱的に遮断されている。なお、凹部８ａは、ここでは詳細には示さないが、絶縁膜９の箇所に多数のスリットをフォトリソグラフィーとエッチングにより形成し、このスリットを介して異方性エッチングをシリコン基板８に施すことによって形成される。 A recess 8 a is formed on the lower surface of the silicon substrate 8 at a position above the flow rate detection unit 10, and a portion covering the recess 8 a of the insulating film 9 is a diaphragm. Thereby, the flow volume detection part 10 and the silicon substrate 8 are thermally interrupted. Although not shown in detail here, the recess 8a is formed by forming a large number of slits at the location of the insulating film 9 by photolithography and etching, and performing anisotropic etching on the silicon substrate 8 through the slits. It is formed.

ガラスチップ６は、例えば硼珪酸ガラスで形成され、上面中央にガス等の流体を流すための溝状の流路（導通路）１２が形成されている。ガラスチップ６の流路１２の両端部近傍には各一端が当該流路１２に連通し、各他端が夫々下面に開口する流体導入口１２ａ、流体導出口１２ｂが形成されている。そして、流路１２は、センサチップ５に形成されている流量検出部１０を収容しかつこの流量検出部１０に前記上流側の測温素子からヒータ及び下流側の測温素子に向かって流体を流すようになっている。 The glass chip 6 is made of, for example, borosilicate glass, and a groove-like flow path (conduction path) 12 for flowing a fluid such as gas is formed at the center of the upper surface. In the vicinity of both ends of the flow path 12 of the glass chip 6, a fluid inlet 12a and a fluid outlet 12b are formed with one end communicating with the flow path 12 and the other end opening on the lower surface. The flow path 12 accommodates the flow rate detection unit 10 formed in the sensor chip 5 and allows the fluid to flow into the flow rate detection unit 10 from the upstream temperature measuring element toward the heater and the downstream temperature measuring element. It is supposed to flow.

なお、硼珪酸ガラスとして例えばパイレックス（登録商標）ガラス或いはテンパックスガラスと称するガラスなどがある。 Examples of the borosilicate glass include a glass called Pyrex (registered trademark) glass or Tempax glass.

ガラスチップ６は、センサチップ５上に流路１２が流量検出部１０の下方かつ前記上流側の測温素子、ヒータ、下流側の測温素子の配列方向に沿ってこれらを収容するように配置され、前記ヒータ及び測温素子の各リードパターンが両側部から側方に延出され、更に上方にピンや配線などで延出されて図示しない電気回路に接続されている。そして、センサチップ５の下面とガラスチップ６の上面とが例えば低融点ガラス１３により接合されている。このようにしてフローセンサ２が形成されている。 The glass chip 6 is arranged on the sensor chip 5 such that the flow path 12 accommodates them below the flow rate detection unit 10 and along the arrangement direction of the upstream temperature measuring element, the heater, and the downstream temperature measuring element. The lead patterns of the heater and the temperature measuring element are extended from both sides to the side, and further extended upward by pins or wirings and connected to an electric circuit (not shown). Then, the lower surface of the sensor chip 5 and the upper surface of the glass chip 6 are joined by, for example, a low melting point glass 13. In this way, the flow sensor 2 is formed.

センサチップ５の基板をシリコンとし、ガラスチップ６をパイレックス（登録商標）ガラスとした場合、シリコンの熱膨張係数は、２.３×１０^−６／℃、パイレックス（登録商標）ガラスの熱膨張係数は、３.２×１０^−６／℃で近似しており、これらの接合部の熱応力に起因する歪みが緩和されてフローセンサ２の破損が防止されると共に検出精度が安定する。 When the substrate of the sensor chip 5 is made of silicon and the glass chip 6 is made of Pyrex (registered trademark) glass, the thermal expansion coefficient of silicon is 2.3 × 10 ⁻⁶ / ° C., and the thermal expansion coefficient of Pyrex (registered trademark) glass. Is approximated at 3.2 × 10 ⁻⁶ / ° C., distortion caused by thermal stress at these joints is alleviated to prevent the flow sensor 2 from being damaged and the detection accuracy is stabilized.

流路ボディ１５は、例えば角柱状とされ、上面中央位置にフローセンサ２を載置可能とされており、ガラスチップ６の流路１２の流体導入口１２ａ、流体導出口１２ｂと対応する位置にこれらと連通する流体導入用の流路１５ａ、流体導出用の流路１５ｂが上面から図示しない下面または側面の配管接続部へと形成されている。 The flow channel body 15 has, for example, a prismatic shape, and the flow sensor 2 can be placed at the center of the upper surface. The flow channel body 15 is located at a position corresponding to the fluid inlet 12 a and the fluid outlet 12 b of the flow channel 12 of the glass chip 6. A fluid introduction flow channel 15a and a fluid discharge flow channel 15b communicating with these are formed from the upper surface to a pipe connection portion on the lower surface or side surface (not shown).

そして、流路１５ａ，１５ｂの回りに同心的に環状溝１５ｃ、１５ｄが形成されている。また、上面の四隅にねじ穴１５ｅが形成されている。そして、環状溝１５ｃ，１５ｄには耐食性及びシール性に優れたメタルシール例えばステンレス部材で形成された中空のメタルＯリング１８，１８が装着される。 And the annular grooves 15c and 15d are formed concentrically around the flow paths 15a and 15b. Screw holes 15e are formed at the four corners of the upper surface. The annular grooves 15c and 15d are fitted with metal seals excellent in corrosion resistance and sealing performance, for example, hollow metal O-rings 18 and 18 formed of a stainless steel member.

枠体１６は、上方から見ると例えば正方形をなし、中央にフローセンサ２がその外周に空間を存して収容可能な収容部１６ａが形成されている。枠体１６の高さ（厚さ）は、フローセンサ２の高さ（厚さ）よりも高く収容部１６ａの上面側開口端の周縁部が全周に亘り段差状をなして切り欠かれて凹部１６ｂを形成している。そして、収容部１６ａの深さは、フローセンサ２の高さと略同じに設定されている。枠体１６は、上面の四隅に流路ボディ１５のねじ穴１５ｅと対応してボルト挿通孔１６ｃが穿設され、凹部１６ｂの周縁部にねじ穴１６ｄが等間隔で複数形成されている。 The frame body 16 has, for example, a square shape when viewed from above, and an accommodating portion 16a is formed at the center where the flow sensor 2 can be accommodated with a space around the outer periphery thereof. The height (thickness) of the frame body 16 is higher than the height (thickness) of the flow sensor 2, and the peripheral edge of the upper surface side opening end of the housing portion 16a is cut out in a step shape over the entire circumference. A recess 16b is formed. The depth of the accommodating portion 16a is set to be substantially the same as the height of the flow sensor 2. The frame 16 is formed with bolt insertion holes 16c corresponding to the screw holes 15e of the flow channel body 15 at the four corners of the upper surface, and a plurality of screw holes 16d formed at equal intervals on the peripheral edge of the recess 16b.

蓋体１７は、枠体１６の凹部１６ｂに嵌合可能とされ、周縁部にねじ穴１６ｄと対応してボルト挿通孔１７ａが穿設されている。これらの枠体１６及び蓋体１７は、例えばステンレスやアルミ、セラミックス、樹脂などの部材により形成されている。 The lid body 17 can be fitted into the concave portion 16b of the frame body 16, and a bolt insertion hole 17a is formed in the peripheral portion corresponding to the screw hole 16d. The frame body 16 and the lid body 17 are formed of members such as stainless steel, aluminum, ceramics, and resin.

押付板１９は、フローセンサ２のガラスチップ６に接合され枠体１６と流路ボディ１５との間に介在されてガラスチップ６を損傷することなく中空のメタルＯリング１８を押し付けて気密性を確保するための中間板としての機能を有している。押付板１９は、中央部にガラスチップ６の流路１２の流体導入口１２ａ、流体導出口１２ｂ、及び基板１５の流体導入用の流路１５ａ、流体導出用の流路１５ｂと対応する位置にこれらと連通する流体導入用の流路１９ａ、流体導出用の流路１９ｂが貫通して形成されている。また、四隅に流路ボディ１５のねじ穴１５ｅ、及び枠体１６のボルト挿通孔１６ｃと対応してボルト挿通孔１９ｃが穿設されている。 The pressing plate 19 is joined to the glass chip 6 of the flow sensor 2 and is interposed between the frame body 16 and the flow path body 15 so as to press the hollow metal O-ring 18 without damaging the glass chip 6 to improve the airtightness. It has a function as an intermediate plate for securing. The pressing plate 19 is located at a position corresponding to the fluid introducing port 12a and the fluid outlet 12b of the channel 12 of the glass chip 6 and the fluid introducing channel 15a and the fluid guiding channel 15b of the substrate 15 at the center. A fluid introduction flow channel 19a and a fluid discharge flow channel 19b communicating therewith are formed so as to penetrate therethrough. In addition, bolt insertion holes 19 c are formed at the four corners corresponding to the screw holes 15 e of the flow path body 15 and the bolt insertion holes 16 c of the frame body 16.

押付板１９は、熱膨張係数がガラスチップ６の熱膨張係数に近く、ステンレス部材で形成された中空のメタルＯリング１８を押し潰すことができる強度を有する硬い部材例えばコバール（Ｆｅ―２９Ｎｉ―１７Ｃｏ）により形成されている。コバールは、低熱膨張率の合金で熱膨張係数が５.２×１０^−６／℃であり、前記パイレックス（登録商標）ガラスの熱膨張係数３.２×１０^−６／℃と近似している。また、その硬さ（ブリネル硬さ（ＨＢ））が１４０〜１６０であり、ステンレス部材の硬さ１５０〜１６０と略同じである。 The pressing plate 19 has a thermal expansion coefficient close to that of the glass chip 6 and has a strength that can crush the hollow metal O-ring 18 formed of a stainless steel member, such as Kovar (Fe-29Ni-17Co ). Kovar is a low thermal expansion alloy with a thermal expansion coefficient of 5.2 × 10 ⁻⁶ / ° C., which is close to the thermal expansion coefficient of 3.2 × 10 ⁻⁶ / ° C. of the Pyrex (registered trademark) glass. . Moreover, the hardness (Brinell hardness (HB)) is 140-160, and is substantially the same as the hardness 150-160 of a stainless steel member.

従って、ガラスチップ６にパイレックス（登録商標）ガラスを採用し、ステンレス部材で形成された中空のメタルＯリング１８を採用した場合、コバールは、ガラスチップ６との熱膨張係数差が小さくかつ中空のメタルＯリング１８を押し潰すことができる強度を有しており、押付板として好適である。なお、押付板１９は、メタルシールと同等以上の硬さを有することが好ましい。 Therefore, when Pyrex (registered trademark) glass is used for the glass chip 6 and a hollow metal O-ring 18 formed of a stainless steel member is used, Kovar has a small difference in thermal expansion coefficient from the glass chip 6 and is hollow. The metal O-ring 18 is strong enough to be crushed and is suitable as a pressing plate. The pressing plate 19 preferably has a hardness equal to or higher than that of a metal seal.

この押付板１９は、フローセンサ２のガラスチップ６の下面に、流路１２の流体導入口１２ａ、流体導出口１２ｂと流体導入用の流路１９ａ、流体導出用の流路１９ｂとが整合されて配置され、例えば前述したフリットガラス等の低融点ガラス１３により気密に接合されている。なお、ガラスチップ６と押付板１９との接合としては、上記低融点ガラス１３の他にガラスチップ６にメタライズを施してハンダやろう付け等により接合する方法も考えられる。 The pressing plate 19 is aligned with the lower surface of the glass chip 6 of the flow sensor 2 with the fluid introduction port 12a, the fluid outlet 12b of the flow channel 12, the fluid introduction channel 19a, and the fluid outlet channel 19b. And is hermetically bonded by the low melting point glass 13 such as the frit glass described above. In addition, as a joining of the glass chip 6 and the pressing plate 19, the method of metalizing the glass chip 6 other than the said low melting glass 13, and joining by soldering, brazing, etc. can also be considered.

以下に上記構成のフローセンサユニット１の組付手順を説明する。流路ボディ１５の環状溝１５ｃ，１５ｄに中空のメタルＯリング１８，１８を装着した後流路ボディ１５にフローセンサ２が接合された押付板１９を載置し、基板１５の流路１５ａ，１５ｂと押付板１９の流路１９ａ，１９ｂ、及びねじ穴１５ｅとボルト挿通孔１９ｃとを整合させる。この状態においてメタルＯリング１８の上面が流路ボディ１５の上面よりも僅かに高くなっている。 The procedure for assembling the flow sensor unit 1 having the above configuration will be described below. After mounting hollow metal O-rings 18, 18 in the annular grooves 15 c, 15 d of the flow channel body 15, the pressing plate 19 to which the flow sensor 2 is joined is placed on the flow channel body 15, and the flow channels 15 a, 15 a, 15b and the flow paths 19a and 19b of the pressing plate 19, and the screw hole 15e and the bolt insertion hole 19c are aligned. In this state, the upper surface of the metal O-ring 18 is slightly higher than the upper surface of the flow path body 15.

次いで、枠体１６を押付板１９に載置して押付板１９のボルト挿通孔１９ｃに枠体１６のボルト挿通孔１６ｃを整合させてステンレス部材で形成されたボルト２１により押付板１９と共に流路ボディ１５に締め付け固定する。押付板１９は、ボルト２１の締め付けに伴い中空のメタルＯリング１８を押し付けて潰し、基板１５の流路１５ａ，１５ｂと押付板１９の流路１９ａ，１９ｂとの接続部をシールする。この状態において、流路ボディ１５と押付板１９と枠体１６が密着している。 Next, the frame body 16 is placed on the pressing plate 19, and the bolt insertion hole 16 c of the frame body 16 is aligned with the bolt insertion hole 19 c of the pressing plate 19. Fastened and fixed to the body 15. As the bolt 21 is tightened, the pressing plate 19 presses and crushes the hollow metal O-ring 18, and seals the connection between the flow paths 15 a and 15 b of the substrate 15 and the flow paths 19 a and 19 b of the pressing plate 19. In this state, the flow path body 15, the pressing plate 19, and the frame body 16 are in close contact.

これにより、フローセンサ２の流体導入口１２ａ、流体導出口１２ｂと流路ボディ１５の流体導入用の流路１５ａ、流体導出用の流路１５ｂが連通される。そして、押付板１９により中空のメタルＯリング１８を押し付けて潰すことによりガラスチップ６を破損することなく前記接続部のシール性を確保することができる。 As a result, the fluid inlet 12a and the fluid outlet 12b of the flow sensor 2 and the fluid inlet passage 15a and the fluid outlet passage 15b of the passage body 15 communicate with each other. And the sealing property of the said connection part can be ensured, without damaging the glass chip 6 by pressing and crushing the hollow metal O-ring 18 with the pressing plate 19.

次いで、枠体１６の凹部１６ｂに蓋体１７を装着し、ボルト挿通孔１７ａを通してねじ穴１６ｄにボルト２２を螺合して固定する。この状態において蓋体１７の裏面がフローセンサ２の上面に当接している。これにより、センサを押さえることでフローセンサ２内に導入される圧力によりフローセンサ２の浮き上がり即ち、センサチップ５とガラスチップ6との接合部や、ガラスチップ6と押付板１９との接合部が剥離することが防止され、耐圧を高めることができる。なお、蓋体１７とフローセンサ２との間にバネ、樹脂などの弾性を持つ部材を入れることにより、フローセンサ２が損傷するのを防ぎ、収容部１６ａの深さとフローセンサ２の高さのばらつきを吸収するようにしても良い。 Next, the lid body 17 is attached to the recess 16b of the frame body 16, and the bolts 22 are screwed and fixed to the screw holes 16d through the bolt insertion holes 17a. In this state, the back surface of the lid body 17 is in contact with the upper surface of the flow sensor 2. Thus, the flow sensor 2 is lifted by the pressure introduced into the flow sensor 2 by pressing the sensor, that is, the joint between the sensor chip 5 and the glass chip 6 or the joint between the glass chip 6 and the pressing plate 19 is formed. Peeling is prevented and the withstand voltage can be increased. In addition, by inserting a member having elasticity such as a spring or a resin between the lid 17 and the flow sensor 2, the flow sensor 2 is prevented from being damaged, and the depth of the accommodating portion 16a and the height of the flow sensor 2 are reduced. Variations may be absorbed.

フローセンサ２の流量検出部１０を形成している前記ヒータ及び測温素子の各リードパターンは、蓋体１７に形成された図示しない小孔を挿通されて外部に延出されている。このようにして、フローセンサ２と枠体１６及び蓋体１７からフローセンサユニット１が形成されている。 The heater and temperature measuring element lead patterns forming the flow rate detection unit 10 of the flow sensor 2 are inserted through small holes (not shown) formed in the lid 17 and extended to the outside. In this way, the flow sensor unit 1 is formed from the flow sensor 2, the frame body 16 and the lid body 17.

なお、中空のメタルＯリング１８に代えて例えば断面Ｃ字状又はＳ字状のメタルＯリング等を使用しても良い。また、枠体１６の凹部１６ｂと蓋体１７との間にメタルシールなどのシール部材を介在させて枠体１６の収容部１６ａを蓋体１７とで塞いでフローセンサ２を気密封止するようにしても良い。この場合は、上述の蓋体１７に形成されたリード配線用の図示しない小孔も気密に封止する。これにより、センサが破損してガスがリークしてしまった場合でも、収容部１６ａ内にガスを留めることができ外部へのリークを防ぐことができる。 Instead of the hollow metal O-ring 18, for example, a metal O-ring having a C-shaped or S-shaped cross section may be used. Further, a seal member such as a metal seal is interposed between the recess 16b of the frame body 16 and the lid body 17 so that the housing portion 16a of the frame body 16 is closed with the lid body 17 so that the flow sensor 2 is hermetically sealed. Anyway. In this case, a small hole (not shown) for the lead wiring formed in the lid body 17 is also hermetically sealed. Thereby, even when the sensor is broken and the gas leaks, the gas can be retained in the accommodating portion 16a, and leakage to the outside can be prevented.

押付板１９の熱膨張係数とフローセンサ２のガラスチップ６の熱膨張係数が近いことでこれらの熱膨張係数に起因する熱歪みを緩和することができる。また、メタルシールを採用することにより高シール性、クリーン（低アウトガス）性、耐食性などを持たせることが可能となる。 Since the thermal expansion coefficient of the pressing plate 19 and the thermal expansion coefficient of the glass chip 6 of the flow sensor 2 are close to each other, thermal distortion caused by these thermal expansion coefficients can be reduced. Further, by adopting a metal seal, it becomes possible to provide high sealing performance, clean (low outgas) properties, corrosion resistance, and the like.

次にフローセンサ２の作用を説明する。フローセンサ２のガラスチップ６の流路１２に流路ボディ１５の流体導入用流路１５ａから例えばガス等の流体を導入し、流体導出用流路１５ｂから導出させて流量検出部１０に矢印で示すように前記ガスを流し、流量検出部１０のヒータに通電する。前記ヒータは、ヒータ制御回路によりシリコン基板８に設けられた図示しない周囲温度センサで測定された流体温度よりもある一定温度高く加熱され、流量検出部１０及び流路１２を流れるガスを加熱する。 Next, the operation of the flow sensor 2 will be described. For example, a fluid such as a gas is introduced into the flow path 12 of the glass chip 6 of the flow sensor 2 from the fluid introduction flow path 15a of the flow path body 15 and is led out from the fluid discharge flow path 15b. As shown, the gas is flowed and the heater of the flow rate detector 10 is energized. The heater is heated at a certain temperature higher than the fluid temperature measured by an ambient temperature sensor (not shown) provided on the silicon substrate 8 by the heater control circuit, and heats the gas flowing through the flow rate detection unit 10 and the flow path 12.

ガスの流れがないときは、ヒータの上流側／下流側に均一の温度分布が形成されており、上流側の測温素子と下流側の測温素子は、略等しい温度に対応する抵抗値を示す。一方、ガスの流れがあるときは、ヒータの上流側／下流側の均一な温度分布がくずれ、上流側の温度が低くなり、下流側の温度が高くなる。 When there is no gas flow, a uniform temperature distribution is formed on the upstream / downstream side of the heater, and the upstream temperature measuring element and the downstream temperature measuring element have resistance values corresponding to substantially equal temperatures. Show. On the other hand, when there is a gas flow, the uniform temperature distribution on the upstream / downstream side of the heater is disrupted, the upstream temperature is lowered, and the downstream temperature is raised.

そして、ここでは詳細には説明しないが上流側の測温素子と下流側の測温素子により構成されるホイーストンブリッジ回路により上流側の測温素子と下流側の測温素子の抵抗値差つまり温度差を検出し、流路１２内を流れるガスの流量を測定する。 Although not described in detail here, a resistance value difference between the upstream temperature measuring element and the downstream temperature measuring element by the Wheatstone bridge circuit constituted by the upstream temperature measuring element and the downstream temperature measuring element, that is, A temperature difference is detected and the flow rate of the gas flowing in the flow path 12 is measured.

なお、上記実施形態においてはガラスチップ６の下面に流路１２の流体導入口１２ａ、流体導出口１２ｂを形成して押付板１９に接合する構造を説明したが、これに限らず、ガラスチップ６の下面ではなくセンサチップ５の基板８に流体導入口、流体導出口を形成して押付板１９に接合してもよい。 In the above embodiment, the structure in which the fluid inlet 12a and the fluid outlet 12b of the flow path 12 are formed on the lower surface of the glass chip 6 and joined to the pressing plate 19 has been described. A fluid inlet and a fluid outlet may be formed on the substrate 8 of the sensor chip 5 instead of the lower surface of the sensor chip 5 and joined to the pressing plate 19.

また、センサチップ５の基板としてシリコンを使用したが、これに限るものではなく、セラミックスやサファイアや金属などを使用しても良い。また、ガラスチップ６の材質は、ガラスのみに限定されるものではなくシリコン、セラミックス、サファイアなどでも良く、あるいはそれらを複合したものでも良い。さらに、押付板１９は、耐腐食性の点ではSUS、インコネル、ハステロイ、炭化珪素（SiC）など、線膨張率の点ではコバール、炭化珪素（SiC）、窒化珪素（Si₃N₄）、窒化アルミ（AlN）などが好ましい。炭化珪素（SiC）は、その両方の点で優れている。なお、コバールの場合は耐食性メッキやコーティングが必要である。 Further, although silicon is used as the substrate of the sensor chip 5, the present invention is not limited to this, and ceramics, sapphire, metal, or the like may be used. The material of the glass chip 6 is not limited to glass, but may be silicon, ceramics, sapphire, or a composite of them. Further, the pressing plate 19 is made of SUS, Inconel, Hastelloy, silicon carbide (SiC) or the like in terms of corrosion resistance, and Kovar, silicon carbide (SiC), silicon nitride (Si ₃ N ₄ ), or nitride in terms of linear expansion coefficient. Aluminum (AlN) or the like is preferable. Silicon carbide (SiC) is superior in both respects. In the case of Kovar, corrosion resistant plating or coating is required.

更に流量検出部１０の構造は、上記実施形態のように絶縁膜９がシリコン基板８の凹部８ａを覆うようなダイアフラム構造でもよく、或いは絶縁膜９がシリコン基板８の凹部８ａの少なくとも一部を覆うようなブリッジ構造でも良い。 Further, the structure of the flow rate detection unit 10 may be a diaphragm structure in which the insulating film 9 covers the concave portion 8a of the silicon substrate 8 as in the above embodiment, or the insulating film 9 covers at least a part of the concave portion 8a of the silicon substrate 8. A covering bridge structure may be used.

また、上記実施形態においてはフローセンサ２を流路ボディ３に搭載したパッケージ構造について記述したが、これに限るものではなくフローセンサに代えて圧力、温度、濃度、組成などのセンサを同様の流路ボディに搭載してパッケージ構造とする場合にも適用し得ることは勿論である。この場合、上述した流路がそれらのセンサに圧力を導く導通路としての役目を果たす。そして、それらのセンサをパッケージした場合、蓋体１７により圧力センサを押さえることでセンサ内に導入される圧力によりセンサチップとガラスチップとの接合部や、ガラスチップと押付板との接合部の剥離等を抑えることができ、センサの耐圧を高めることができる。 In the above embodiment, the package structure in which the flow sensor 2 is mounted on the flow path body 3 has been described. However, the present invention is not limited to this, and sensors such as pressure, temperature, concentration, and composition are used instead of the flow sensor. Needless to say, the present invention can also be applied to a package structure mounted on a road body. In this case, the above-described flow path serves as a conduction path for introducing pressure to these sensors. When these sensors are packaged, the pressure sensor is pressed by the lid 17 so that the joint between the sensor chip and the glass chip or the joint between the glass chip and the pressing plate is peeled off by the pressure introduced into the sensor. Etc., and the withstand voltage of the sensor can be increased.

なお、上記実施形態においては１つのヒータ（発熱素子）と、このヒータの両側に配置した２つの測温素子とにより傍熱型の流量検出部を構成した場合について記述したが、これに限るものではなく、発熱素子兼測温素子が１つ、即ち１つのヒータで自己発熱型の流量検出部を構成しても良く、或いは、発熱素子兼測温素子が２つ、即ち２つのヒータで自己発熱型の流量検出部を構成しても良い。 In the above-described embodiment, the case where the indirectly heated flow rate detection unit is configured by one heater (heating element) and two temperature measuring elements arranged on both sides of the heater has been described. Instead, a self-heating type flow rate detection unit may be configured by one heating element / temperature measuring element, that is, one heater, or two heating elements / temperature measuring elements, that is, two heaters. A heat generation type flow rate detection unit may be configured.

また、圧力、温度、濃度、組成などを検出するセンサのチップに熱膨張係数差が小さい中間部材を固定し、この中間部材を制御装置本体に固定することによりセンサと本体との熱膨張係数差が緩和され、センサのチップと中間部材との関係も良好となる。 In addition, an intermediate member having a small difference in thermal expansion coefficient is fixed to the sensor chip for detecting pressure, temperature, concentration, composition, etc., and the intermediate member is fixed to the control device main body, whereby the difference in thermal expansion coefficient between the sensor and the main body. Is relaxed, and the relationship between the sensor chip and the intermediate member is improved.

また、基板上に検出部と該検出部への流体の導通路が形成されたセンサチップに前記検出部を収容する導通路付チップが接合されて形成されたセンサにおいては、前記センサチップの導通路に連通する導通路が形成された押付部材を前記センサチップに接合する構成として、押付部材を介してセンサを本体に取り付けることによりセンサと本体との間の熱膨張係数差が緩和される。 In addition, in a sensor formed by joining a chip with a conduction path that accommodates the detection unit to a sensor chip in which a detection unit and a fluid conduction path to the detection unit are formed on a substrate, the sensor chip is guided. As a configuration in which a pressing member formed with a conduction path communicating with the passage is joined to the sensor chip, a difference in thermal expansion coefficient between the sensor and the main body is reduced by attaching the sensor to the main body via the pressing member.

また、フローセンサの熱膨張係数に近い熱膨張係数を有する中間部材を当該フローセンサに固定し、この中間部材を介して制御装置本体に取り付けることによりフローセンサと本体との熱膨張係数差が緩和され、センサのチップと中間部材との関係も良好となる。 In addition, an intermediate member having a thermal expansion coefficient close to the thermal expansion coefficient of the flow sensor is fixed to the flow sensor, and attached to the control device main body via the intermediate member, thereby reducing the difference in thermal expansion coefficient between the flow sensor and the main body. In addition, the relationship between the sensor chip and the intermediate member is improved.

また、基板上に流量検出部と該流量検出部への流体の流路が形成されたセンサチップに前記流量検出部を収容する流路付チップが接合されて形成されたセンサにおいては、前記センサチップの流路に連通する流路が形成された押付部材を前記センサチップに接合する構成として、押付部材を介してセンサを本体に取り付けることによりセンサと本体との間の熱膨張係数差が緩和され、センサのチップと押付部材との関係も良好となる。 Further, in the sensor formed by joining a chip with a flow path for housing the flow rate detection unit to a sensor chip in which a flow rate detection unit and a flow path of fluid to the flow rate detection unit are formed on a substrate, the sensor As a configuration in which a pressing member formed with a flow channel communicating with the chip flow channel is joined to the sensor chip, the difference in thermal expansion coefficient between the sensor and the main body is reduced by attaching the sensor to the main body via the pressing member. In addition, the relationship between the sensor chip and the pressing member is also improved.

本発明の一実施形態に係るフローセンサの取付構造を適用したフローセンサユニットの断面図である。It is sectional drawing of the flow sensor unit to which the attachment structure of the flow sensor which concerns on one Embodiment of this invention is applied.

Explanation of symbols

１フローセンサユニット
２フローセンサ
５センサチップ
６ガラスチップ（流路付チップ、導通路付チップ）
８シリコン基板（基板）
８ａ凹部
９絶縁膜
１０流量検出部
１２流路（導通路）
１２ａ流体導入口
１２ｂ流体導出口
１３低融点ガラス
１５流路ボディ（導通路ボディ、本体）
１５ａ，１５ｂ流路
１５ｃ，１５ｄ環状溝
１５ｅねじ穴
１６枠体
１６ａ収容部
１６ｂ凹部
１６ｃボルト挿通孔
１６ｄねじ穴
１７蓋体
１７ａボルト挿通孔
１８メタルＯリング（メタルシール）
１９押付板（押付部材、中間部材）
１９ａ，１９ｂ流路
１９ｃボルト挿通孔
２１，２２ボルト 1 Flow sensor unit 2 Flow sensor 5 Sensor chip 6 Glass chip (chip with flow path, chip with conduction path)
8 Silicon substrate (substrate)
8a Concave part 9 Insulating film 10 Flow rate detection part 12 Flow path (conduction path)
12a Fluid inlet port 12b Fluid outlet port 13 Low melting point glass 15 Channel body (conducting channel body, main body)
15a, 15b Flow path 15c, 15d Annular groove 15e Screw hole 16 Frame body 16a Receiving part 16b Recessed part 16c Bolt insertion hole 16d Screw hole 17 Lid body 17a Bolt insertion hole 18 Metal O-ring (metal seal)
19 Pressing plate (pressing member, intermediate member)
19a, 19b Channel 19c Bolt insertion hole 21, 22 Bolt

Claims

A sensor formed by joining a chip with a conduction path in which the detection section is housed in a sensor chip having a detection section formed on a substrate and a fluid conduction path to the detection section is formed;
A plate-like pressing member in which a conduction path communicating with the conduction path of the chip with the conduction path is formed and joined to the chip with the conduction path;
An inflow side conduction path and an outflow side conduction path that are mounted with the sensor and connected to the conduction path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side conduction path and the outflow side conduction path. A conduction path body;
A metal seal interposed between the conduction path body and the pressing member and pressed by the pressing member;
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow-side conduction path and the corresponding conduction path of the pressing member from the periphery, and an opening of the outflow-side conduction path. It consists of a metal seal that seals the connection part with the conduction path of the pressing member from the surroundings,
The two metal seals are crushed together by pressing the pressing member against the conduction path body,
The sensor attachment structure, wherein the chip with a conduction path is connected to each of the pressing member and the sensor chip via low melting point glass.

A sensor formed by bonding a chip with a conduction path that accommodates the detection unit to a sensor chip in which a detection unit and a fluid conduction hole to the detection unit are formed on a substrate;
A plate-shaped pressing member through hole communicating with the through hole of the sensor chip is bonded is formed on the sensor chip,
An inflow side conduction path and an outflow side conduction path that are mounted with the sensor and connected to the conduction path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side conduction path and the outflow side conduction path. A conduction path body;
A metal seal interposed between the conduction path body and the pressing member and pressed by the pressing member;
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow-side conduction path and the corresponding conduction path of the pressing member from the periphery, and an opening of the outflow-side conduction path. It consists of a metal seal that seals the connection part with the conduction path of the pressing member from the surroundings,
The two metal seals are crushed together by pressing the pressing member against the conduction path body,
A sensor mounting structure, wherein the sensor chip is connected to each of the pressing member and the chip with a conduction path via low-melting glass.

A flow sensor formed by joining the flow rate detection unit in a sensor chip having a flow rate detection unit formed on a substrate and joining a chip with a flow channel in which a flow path of fluid flowing through the flow rate detection unit is formed;
A plate-like pressing member that is formed with a channel communicating with the channel of the chip with a channel and is joined to the chip with the channel;
An inflow side flow path and an outflow side flow path mounted with the flow sensor and connected to the flow path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side flow path and the outflow side flow path A flow path body,
A metal seal interposed between the flow path body and the pressing member and pressed by the pressing plate;
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow side flow path and the flow path of the pressing member corresponding to the opening, and the opening of the outflow side flow path. It consists of a metal seal that seals the connection part with the flow path of the pressing member from the surroundings,
The two seals are adapted to be crushed together by pressing the pressing member against the flow path body,
The flow sensor mounting structure is characterized in that the chip with flow path is connected to each of the pressing member and the sensor chip via low melting point glass.

A flow sensor formed by bonding a chip with a flow path for housing the flow rate detection unit to a sensor chip in which a flow rate detection unit and a fluid conduction hole to the flow rate detection unit are formed on a substrate;
A plate-shaped pressing member flow passage communicating with the through hole of the sensor chip is formed is bonded to the sensor chip,
An inflow side flow path and an outflow side flow path mounted with the flow sensor and connected to the flow path of the pressing member are formed, and the pressing member is attached to the opening side of the inflow side flow path and the outflow side flow path A flow path body,
A metal seal interposed between the flow path body and the pressing member and pressed by the pressing plate;
The metal seal corresponds to a metal seal that seals a connection portion between the opening of the inflow side flow path and the flow path of the pressing member corresponding to the opening, and the opening of the outflow side flow path. It consists of a metal seal that seals the connection part with the flow path of the pressing member from the surroundings,
The two seals are adapted to be crushed together by pressing the pressing member against the flow path body,
The flow sensor mounting structure, wherein the sensor chip is connected to each of the pressing member and the channel-equipped chip via low-melting glass.

3. The sensor mounting structure according to claim 1, wherein the pressing member is made of Kovar, and the chip with a conduction path is made of borosilicate glass. 4.

5. The flow sensor mounting structure according to claim 3, wherein the pressing member is made of Kovar, and the tip with flow path is made of borosilicate glass. 6.