JP5065892B2 - Bonding equipment - Google Patents

Description

  The present invention relates to a bonding apparatus for mounting a chip component such as an electronic component on a workpiece made of a glass, resin, and metal substrate.

  A conventional bonding apparatus for mounting a chip component with a bump electrode on a substrate as a workpiece face-up includes both an alignment mark for the chip component and an alignment mark for identifying a mounting portion of the substrate from the upper side of the chip component. It has recognized. Specifically, a prism is used for the head portion that holds the chip component by suction, and the images of both members including both the chip component and the substrate alignment mark are reflected by the slope of the prism, and the head side is independent of the head. And projected onto a fixed CCD camera. Also, when correcting the relative displacement of the chip component mounting position based on the recognition result of both alignment marks, the holding table for holding the substrate is moved horizontally and vertically and around the center axis of the chip component. (See, for example, Patent Document 1).

WO2003 / 041478

  In recent years, the substrate size tends to increase for the purpose of increasing mass production efficiency, and substrates that require high-density mounting have also become targets. The conventional bonding apparatus includes a mechanism for moving the chip holding head in the vertical direction and a mechanism for moving the substrate holding table in the horizontal direction and the rotation direction. Therefore, when the conventional structure is followed to support a large substrate and chip components are mounted on the entire substrate with a chip holding head, the stroke is twice the substrate mounting area and the diagonal length of the substrate is the rotation area. Therefore, there is a problem that the apparatus becomes large.

  In order to solve this problem, it is effective to rotate the head side. However, the shape of the alignment mark on the chip and the substrate changes as the relative relationship between the CCD camera and the prism changes. Further, there is a problem that even if the relative relationship between the CCD camera and the prism is corrected, the obtained position measurement result is deteriorated.

  In order to solve this problem, when the CCD camera unit is mounted on the rotation axis so that the relative relationship between the CCD camera and the prism matches, the load on the rotation axis (θ axis) of the head increases, Increases in cost and size are problematic, for example, a large space around the head is required.

  The present invention has been made in view of such circumstances, and a main object of the present invention is to provide a bonding apparatus that has a simple apparatus configuration and can improve mounting accuracy.

  Therefore, the present invention has the following configuration in order to achieve the above object.

That is, the bonding apparatus of the present invention is a bonding apparatus for mounting a chip component on a work held by a work holding means, and is a box-shaped frame having at least a part of a side surface and a lower surface opened, and the frame. A chip that is attached to the lower surface opening portion of the head and includes a transparent chip holding means for holding the chip component; and a chip that moves forward and backward toward the opening on the side surface of the frame body of the head and is held by the chip holding means Recognizing means for recognizing a component and a mounting position of a chip part of a work held by the work holding means through the chip holding means, and a central vertical axis of the chip part holding the chip part First driving means for rotating the head, second driving means for moving the head and the work holding means relatively up and down, the head and the work Based on the recognition result of the third driving means for relatively horizontally moving the holding means and the recognition means, a relative positional deviation between the reference position of the chip part and the workpiece is detected, and the positional deviation is corrected. Control means for driving and controlling the first drive means and the third drive means , wherein the recognition means further includes two CCD cameras for recognizing both reference positions of the chip part and the workpiece, and the CCD camera. In the forward and backward direction, the chip part and the reference position of the workpiece are respectively divided and projected to project onto the two CCD cameras .

  According to the bonding apparatus of the present invention, it is not necessary to rotate the substrate by driving the head so as to rotate around the central axis of the chip component. That is, it is not necessary to secure a space for rotation in consideration of a diagonal length longer than the vertical and horizontal length of the workpiece. As a result, the apparatus configuration is simplified. In addition, since the recognition means moves back and forth at the side opening of the head and can always recognize the chip component and the workpiece at a constant angle and a constant distance, the image changes (distortion) due to changes in the optical projection angle, etc. Does not happen. Therefore, it is possible to accurately recognize the positions of the chip component and the workpiece and to increase the mounting accuracy.

Further , according to this configuration, it is not necessary to retract the recognition means at the time of mounting after receiving the chip component, and the operation time can be shortened.

The projecting means reflects a pair of first mirrors that reflect both the reference positions of the chip part and the workpiece, and a pair of first mirrors that reflects and projects the image of the reference position reflected on the first mirror onto the CCD camera. It can consist of two mirrors.

  Furthermore, when the reference positions of both the chip part and the workpiece are alignment marks provided at two locations on each corner, the alignment marks on one corner are reflected on one first mirror, and the second mirror is used. It is preferable that the image is reflected and projected onto one CCD camera, and the alignment marks at the other corners are projected onto the other first mirror and reflected onto the second mirror and projected onto the other CCD camera.

  According to this configuration, since each of the chip part and the workpiece is recognized by the individual projection means, the reference positions of both members can be accurately recognized with a wide field of view even within the narrow opening of the head. For example, when there are a plurality of reference positions (alignment marks) that are separated from each other in the chip component, all the alignment marks can be recognized by one process. The reference position of the chip component can use a bump formed on the chip component when mounted in a face-up state.

  In order to simplify the apparatus, the head is moved up and down over the working position where the chip component is mounted on the board and the standby position above it, or the head is moved horizontally with respect to the board surface. It is preferable to combine these configurations.

  The second drive means is preferably an actuator that includes a piston that slides in the cylinder and a rod that extends from the tip of the piston, and that allows the piston to rotate about its axis in the cylinder. Further, it is preferable that the rod of the cylinder of the second driving means and the first driving means are connected by a link mechanism so that the driving force of the second driving means is converted into the rotational force of the first driving means.

  That is, according to this configuration, since the rotational force of the piston rod of the second driving means is indirectly transmitted to the first driving means via the link mechanism, when the first driving means is provided in the head, The configuration on the head side can be simplified. That is, since the configuration on the head side can be reduced in weight, for example, when the head side is moved up and down, elevating adjustment is facilitated, and there is no possibility of excessively pressurizing the chip component.

  The rod is provided with a guide on the outer peripheral surface thereof, and the link mechanism slides the link portions of the two link bars in conjunction with the bending operation of the two link bars and the two link bars. It is preferable that it is comprised from the expansion-contraction guide which makes constant length.

  Furthermore, a scale fixed to the tip of the link bar connected to the rod side is provided, and detecting means for detecting the rotation angle of the scale interlocking with the rotation of the link bar, and positioning of the head based on the detection result by the detecting means It is preferable to include control means for performing the above.

  According to this configuration, it is possible to improve the head alignment accuracy.

  In the bonding apparatus of the present invention, the control means uses a master substrate having a scale associated with the mounting position of the chip component, and the position information of each mounting position recognized by the recognition means and the first to third positions. Correlation with the drive shaft of the drive means is obtained and stored in advance, and when mounting a chip component on the workpiece, each drive means is offset so as to offset the deviation of the drive shaft of each drive means using the correlation. It is preferable to be configured so as to control the drive.

  According to this configuration, it is possible to improve the mounting accuracy of the chip component on the workpiece.

  In the bonding apparatus according to the present invention, it is not necessary to rotate the substrate by driving the head so as to rotate around the central axis of the chip component. Therefore, it is necessary to secure a space for rotating a workpiece larger than the chip component. Absent. As a result, the apparatus configuration is simplified. Further, since the recognition means moves forward and backward at the side opening of the head and can always recognize the chip component and the workpiece at a constant angle and a constant distance, a change (distortion) of the image due to a change in the optical projection angle occurs. Absent. Therefore, it is possible to accurately recognize the positions of the chip component and the workpiece and to increase the mounting accuracy.

It is a perspective view of the bonding system which concerns on an Example. It is the front view which showed schematic structure of the mounting unit. It is a top view which shows the structure of a link mechanism. It is a side surface which shows schematic structure of a recognition part. It is a top view which shows schematic structure of a projection part. It is a figure which shows the image projected on a CCD camera.

Explanation of symbols

W ... Substrate 3 ... Mounting unit 11 ... Chip component 14 ... Substrate holding stage 15 ... Movable table 17 ... Head 18 ... Horizontal drive mechanism 19 ... Lifting drive mechanism 20 ... Rotation drive mechanism 22 ... Adsorption part 29A, 29B ... Control part 37 ... CCD camera 39a ... first mirror 39b ... second mirror

  Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a case where an electronic component with a bump is mounted on a substrate as a chip component will be described as an example. In addition, as the chip component, for example, all forms on the side to be bonded to the substrate are shown regardless of the type and size of an IC chip, a semiconductor chip, an optical element, a surface mount component, a wafer, and the like.

  Moreover, as a board | substrate, all the forms of the side joined to chip components, such as a resin substrate, a glass substrate, a film substrate, a metal substrate (for example, copper substrate), are shown, for example.

  FIG. 1 is a perspective view of the bonding system according to the present embodiment.

  The chip mounting apparatus according to the present embodiment is roughly divided into an apparatus base 1, a substrate supply unit 2 disposed on the front side (left end in FIG. 1) of the apparatus base 1, and the back of the apparatus base 1. The mounting unit 3 is disposed on the side, and the chip component supply unit 4 is disposed on the left side of the mounting unit 3.

  The substrate supply unit 2 has a box-like shape having an opening / closing door 5 that can be opened and closed up and down at the top, a mounting table 6 on which a substrate W as a workpiece is mounted, and the mounting table 6. And a transport mechanism 7 for attracting and holding the substrate W placed on the surface to a substrate holding stage 14 provided on a movable table 15 on the mounting unit 3 side to be described later.

On the surface of the mounting table 6, positioning pins 8 for inserting through positioning holes formed in the substrate W are erected at a predetermined interval.

  The transport mechanism 7 includes an adsorption plate 9 that can adsorb the surface of the substrate W, and can move the adsorption plate 9 in a uniaxial (Y) direction above the placement table 6 and above the substrate holding stage 14. Further, it can be moved up and down (in the Z-axis direction) at a position where the mounting table 6 and the substrate holding stage 14 face each other. The suction plate 9 is connected to a pump through a pipe (not shown).

  As shown in FIGS. 1 to 4, the mounting unit 3 includes a holding unit 10 that holds the substrate W transported by the transport mechanism 7, a crimping unit 12 that holds the chip component 11 by suction and mounts it on the substrate W, The recognition unit 13 is configured to recognize an alignment mark provided in advance on the substrate W and the chip component 11.

  The holding unit 10 includes a substrate holding stage 14 that holds and holds the substrate W, the surface of which is sucked and held by the suction plate 9 of the transfer mechanism 7, in a horizontal posture, and the substrate holding stage 14 in the horizontal uniaxial (Y) direction. A movable table 15 is provided. The movable table 15 is moved forward and backward along the guide rail 16 by driving a motor (not shown) forward and reverse. The holding unit 10 may be a linear table.

Further, a heater (not shown) is incorporated in the lower part of the substrate holding stage 14 so that the substrate W can be heated from the back surface.

  The crimping unit 12 includes a head 17 that holds the chip component 11 by suction, a horizontal drive mechanism 18 that moves the head 17 in the horizontal one-axis (X) direction, a lift drive mechanism 19 that moves in the vertical (Z) direction, and Z The rotary drive mechanism 20 rotates around the axis (θ), and the CCD camera 37 advances and retreats within the opening of the head 17. The horizontal drive mechanism 18 corresponds to the third drive means of the present invention, the elevation drive mechanism 19 corresponds to the second drive means, the rotational drive mechanism 20 corresponds to the first drive means, and the CCD camera 37. Corresponds to a recognition means.

  The head 17 is attached to the lower end of an elevating drive mechanism 19 fixed to a movable base 25 that is movable along a guide rail 24 of a frame 23 erected on the apparatus base 1 by a horizontal drive mechanism 18. The head 17 includes a frame body 21 having an inverted concave shape, and a suction portion 22 made of a transparent glass plate attached to an opening at the bottom of the frame body. The suction part 22 is formed with a flow path that connects an opening formed in the center of the lower surface and an opening formed in the side part, and is connected in communication via a pump and a hose (not shown). That is, the opening of the lower surface acts as a suction hole by the operation of the pump, and holds the chip component 11 by suction. Note that an attachment made of a transparent glass plate or the like corresponding to the shape of the chip component 11 may be attached to the lower surface of the suction portion 22. The suction unit 22 corresponds to the chip holding means of the present invention.

The horizontal drive mechanism 18 reciprocates the movable base 25 in the horizontal (X) direction along the guide rail 24 by driving the motor M1 to rotate forward and backward. The horizontal drive mechanism 18 may be a linear table.

  The lift drive mechanism 19 is an actuator composed of a cylinder 26, a piston 27 that moves in the cylinder, and a rod 28 that extends from the tip of the piston 27. The piston 27 and the rod 28 are rotatable around the axis within the cylinder. Furthermore, a flow path for supplying or exhausting fluid is formed in the pressure chamber between the cylinder 26 and the piston 27, and the supply and exhaust of gas from the pump can be controlled by the control unit 29A. it can. Note that the control unit 29A and a control unit 29B described later correspond to the control means of the present invention.

  A motor M2 constituting the rotary drive mechanism 20 is attached to the lift drive mechanism 19 on the left side in FIG. A link mechanism 32 connected to the rod 28 of the actuator via a rod guide G is provided on the rotating shaft of the motor M2.

  As shown in FIG. 3, the link mechanism 32 is provided with an extendable guide 34 at the connecting portion of the two link bars 33a and 33b. The tip of one link bar 33a is connected to the motor M2 and the other link bar 33b is connected to the link mechanism 33. The tip is connected to the rod guide G of the rod 28 of the actuator. That is, as the motor M2 is driven forward / reversely, both link bars 33a and 33b are swung left and right, the rotational power is transmitted to the rod 28, and the piston 27 rotates in the cylinder. When the link bars 33a and 33b swing, the telescopic guide 34 extends and contracts so as to follow the change in the distance between the rotation shaft of the motor M2 and the rod 28. Further, the link bar 33b is configured to maintain a constant height without following the advance / retreat of the rod 28 by the rod guide G.

  Further, a fan-shaped scale 35 is attached to the link bar 33b, and a memory provided on the side surface of the scale is read by an encoder 36 disposed in the vicinity. That is, the rotational angle of the head 17 around the Z axis can be read by reading the rotational angle of the piston 27 and transmitting the result to the control unit 29B. The encoder 36 corresponds to the detection unit of the present invention, and the control unit 29B corresponds to the control unit.

  As shown in FIGS. 4 to 6, the recognizing unit 13 includes two CCD cameras 37, an alignment mark R 2 of the chip component 11 held by the head 17 at the tip of each CCD camera 37, and an alignment mark of the substrate W. And a projection unit 38 that captures R1 and projects it onto the CCD camera 37.

  The projection unit 38 projects the first mirror 39a that reflects the alignment mark of the chip component 11 positioned below, and the alignment mark that is reflected on the first mirror 39a, and projects the image onto the CCD camera 37 that is 90 degrees behind. And a mirror 39b.

  As shown in FIG. 4, the projection unit 38 is provided on the lower surface of the movable table 25 by forward / reverse driving of the motor M <b> 3, and is configured to be movable back and forth along the guide rail 40. That is, the projection unit is configured to advance and retract within the opening of the head 17.

  As shown in FIG. 1, the chip component supply unit 4 mounts a chip component 11 held on a ring-shaped frame after a semiconductor wafer is diced, or a chip component 11 aligned on a chip tray. It comprises a table 41, a chip component transport mechanism 42 that sucks and holds the chip component 11, a relay unit that receives the transported chip component 11 and relays it to the head 17, and a slide table 43.

The chip component transport mechanism 42 is horizontally (Y) along a movable frame 45 movable back and forth on a guide rail 44 extending in the Y direction of the apparatus base 1 and a guide rail 46 directed to the front surface of the movable frame 45. ), And a suction head 48 capable of sucking and holding the chip component 11 is provided on the movable base 47 so as to be movable up and down. That is, the chip component 11 placed on the placement table 41 is sucked and held by the suction head 48, delivered to the relay unit 50, and further delivered to the slide table 43.

The slide table 43 is movable in the horizontal (Y) direction of the frame erected on the apparatus base 1 and is configured to receive the chip component 11 conveyed to the relay unit 50 by the chip component conveying mechanism 42. Has been. That is, the slide table 43 conveys the chip component 11 to a position where the head 17 can be sucked.

  Next, the operation of the bonding apparatus having the above-described configuration will be described with reference to FIGS. In this embodiment, the semiconductor wafer held at the center of the ring-shaped frame from the back surface of the ring-shaped frame is diced, and the chip component 11 in a state where the bump electrode is on the surface, that is, the face-up state, is sheeted. A case where a plurality of resin substrates are mounted on the substrate will be described as an example. In this case, when the chip component 11 is sucked and held from the ring-shaped frame, a thermosetting adhesive material is transferred to the back surface of the chip component 11.

  First, before mounting on the mounting table 6 of the substrate supply unit 2, a master substrate in which a reference scale associated with the mounting portion of the substrate W is engraved is mounted on the mounting table and aligned by the pins 9. . Thereafter, the master substrate is transported by the transport mechanism 7 and placed on the substrate holding stage 14 of the mounting unit 3, and the mounting unit 3 and the recognition unit 13 are actuated to drive the master substrate from the projection unit 38 fed into the opening of the head 17. The reference scale on the substrate is reflected in order, the image data is taken from the CCD camera, and obtained from the coordinates of the drive axes (X, Y, Z) such as the CCD camera 37 and the substrate holding stage 14 and the image data. The correlation between the CCD camera 37 and each axis is obtained from the coordinates of each drive axis (X, Y, Z), and stored in advance in the apparatus main body as a correlation function.

  Next, a process of mounting the chip component 11 on the substrate W to be mounted is performed. First, the ring-shaped frame holding the semiconductor wafer after dicing is set on the mounting table 41 of the chip component supply unit 4. Next, the open / close door 5 of the substrate supply unit 2 is opened, the substrate W is aligned and placed on the placement table 6, and then the open / close door 5 is closed. When the open / close door 5 is closed, the suction plate 9 operates, descends at a position facing the substrate W, sucks and holds the substrate W from the surface, and transports it to the substrate holding stage 14.

  When the suction plate moves above the substrate holding stage 14, the suction plate 9 is lowered, the back surface of the substrate W is brought into contact with the substrate holding stage 14, and then the suction on the suction plate side is released. The suction plate 9 that has released the suction returns to the standby position. Simultaneously with the release of the suction of the suction plate, the suction of the substrate holding stage 14 is operated to hold the substrate W by suction.

  At the same time that the substrate W is transported to the substrate holding stage 14, the chip component 11 is transferred from the chip component supply unit 4 to the head 17 of the mounting unit 3. Specifically, the movable frame 45 and the movable table 47 on which the suction head 48 is mounted move in the horizontal (X, Y) direction, and hold a predetermined chip component 11 in a face-up state. The suction head 48 that sucks and holds the chip component 11 is moved to the right end in the figure by the movable base 47 and delivers the chip component 11 to the relay unit 50, so that the relay unit 50 places the chip component 11 on the slide table 43. Deliver.

  The slide table 47 that has received the chip component 11 moves to a position where the chip component 11 is transferred to the head 17 along the guide rail.

  As the movable table 25 moves, the chip part 11 is moved along the guide rail 24 to a position where it is mounted. The head 17 sucks and holds the chip component 11 conveyed to the mounting position by the slide table 43.

As shown in FIG. 6, the projection unit 38 in the opening of the head 17 in advance uses the alignment mark R1 written on the substrate W and the two bumps R2 at the diagonal positions of the chip component 11 as alignment marks. The right and left alignment marks R1 of the substrate W are shown on one CCD camera 37 and the left alignment mark R1 of the substrate W is shown on the other CCD camera 37. Project.

  Next, the alignment mark R2 on the right side of the chip part 11 in the figure is projected onto one CCD camera 37, and the alignment mark R2 on the left side of the chip part 11 in the figure is projected onto the CCD camera 37.

  The control unit 29B compares both alignment marks acquired by the CCD camera 37 with a previously stored reference position. If a positional deviation occurs as a result of the comparison, a correction value is calculated using the correlation function acquired by the master substrate.

  Further, based on this correction value, the control unit 29B rotates (θ) the movable table 15 in the horizontal (Y) direction, the movable table in the horizontal (X) direction, and the head 17 around the Z axis. Perform alignment.

  When the alignment is completed, the actuator is operated to lower the head 17 and press the chip component 11 against the mounting portion of the substrate W. At this time, since the pressure in the pressure chamber of the cylinder is kept constant by the control unit 29A, a predetermined pressure is applied to the chip component 11. Simultaneously with this pressing, the pressure sensitive adhesive on the back surface of the chip component 11 is heated by the heater built in the substrate holding stage 14 to promote the polymerization reaction. When the polymerization reaction of the adhesive is completed, the head 17 returns to the upper standby position. When the polymerization reaction is completed, the chip component 11 is fixed to the substrate W.

  After this series of operations is performed for all the mounting positions of the chip component 11 on the substrate W, the suction plate 9 is operated and moved toward the substrate holding stage 14 to suck the substrate W on which the chip component 11 is mounted. It is held and conveyed to the mounting table 6 of the substrate supply unit 2. When this substrate is taken out from the substrate supply unit 2, a series of processes for mounting the chip component 11 on the substrate W is completed.

  Since the bonding apparatus according to the above-described embodiment rotates the head 17 around the axis, it is not necessary to rotate the substrate W larger than the chip component 11. In other words, since the rotation radius of the head 17 is smaller than the rotation radius of the square or rectangular substrate W, the apparatus can be miniaturized. Further, since the projection portion is moved back and forth within the opening of the head 17 to recognize the alignment marks of the substrate W and the chip component 11, the optical imaging conditions are always constant and a constant distance is maintained from the mirror to the CCD camera. The projected image is projected onto the CCD camera. As a result, since it is not affected by the change in the projected image such as the prism due to the change in the projection angle, the alignment mark projected onto the CCD camera 37 can be accurately recognized without being deformed. Implementation errors can be suppressed.

  In addition, since the first and second mirrors 39a and 39b and the CCD camera 37 are separately provided so that the projection unit recognizes the alignment marks of the substrate W and the chip component 11 individually, the image data for each CCD camera 37 is included in the image data. Based on this, positioning processing can be performed in parallel. That is, the mounting speed can be improved by performing the parallel positioning process. In this case, it functions effectively when the distance between the alignment mark of the substrate W and the chip component 11 is long.

  Further, the link mechanism 32 can perform highly accurate rotation control that is not affected by a loss error due to deterioration of the link mechanism 32, by the guide rod center, the concentric angle detection scale 35 and the encoder 36. Further, since only the head 17 is rotated, the rotation mechanism can be reduced in size and weight.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above embodiment, the movable table 15 is moved only in the horizontal (Y) direction. However, the movable table 15 may be moved in the X direction. In this case, the moving radius can be made smaller than when the substrate W is rotated.

  (2) In the above embodiment, the first and second mirrors 39a and 38b and the CCD camera 37 are separately provided so that the projection unit recognizes the alignment marks of the substrate W and the chip component 11 individually. One configuration may be used. Note that the single case is preferable when the chip component 11 is small and the alignment mark with the substrate W is close.

  (3) The chip mounting apparatus according to the present invention includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.

  (4) In the embodiment, the chip 2 is stored in the chip tray in a face-up state. However, the present invention is not limited to this, and the wafer may be supplied in a state where the wafer is diced and face-up.

  (5) The recognition means is not limited to the CCD camera 37, and a CMOS or an imaging tube may be applied.

  As described above, the present invention is suitable for mounting a chip component such as an electronic component on a workpiece made of a glass or resin substrate.

Claims (11)

A bonding apparatus for mounting chip parts on a work held by a work holding means,
A box-shaped frame having at least a part of a side surface and a lower surface opened;
A head that is attached to the lower surface opening of the frame and includes a transparent chip holding means for holding the chip component;
A reference position for identifying a chip part held in the chip holding means and a mounting part of the chip part of the work held in the work holding means, which advances and retreats into the opening on the side surface of the frame of the head, A recognition means for recognizing through the chip holding means;
First driving means for rotating the head around the longitudinal axis of the chip component holding the chip component;
Second driving means for moving the head and the work holding means relatively up and down;
Third driving means for horizontally moving the head and the work holding means;
Based on the recognition result by the recognition means, a relative positional deviation between the chip component and the reference position of the workpiece is detected, and the first driving means and the third driving means are driven and controlled so as to correct the positional deviation. Control means ,
The recognition means further includes two CCD cameras for recognizing both reference positions of the chip part and the workpiece,
The front side of the CCD camera is composed of projection means for projecting the chip part and the reference position of the workpiece onto the two CCD cameras separately.
A bonding apparatus characterized by that. The bonding apparatus according to claim 1 ,
The projection means includes a pair of first mirrors that reflect both reference positions of the chip part and the workpiece,
A bonding apparatus comprising: a pair of second mirrors that reflect an image of a reference position reflected on the first mirror and projects the image onto the CCD camera. The bonding apparatus according to claim 2 ,
Both the reference positions of the chip part and the workpiece are alignment marks provided at two positions at each corner,
The alignment marks at one corner are reflected on one first mirror, reflected by the second mirror and projected onto one CCD camera, and the alignment marks at the other corner are projected on the other first mirror, A bonding apparatus characterized in that it is reflected by a second mirror and projected onto the other CCD camera. The bonding apparatus according to claim 1,
The reference position of the chip component is a bump formed on the chip component when mounted in a face-up state. The bonding apparatus according to claim 1,
The bonding device characterized in that the second driving means is configured to raise and lower the head over an operation position for mounting a chip component on a substrate and a standby position above the operation position. The bonding apparatus according to claim 1,
The bonding apparatus, wherein the third driving unit is configured to move the head horizontally relative to the substrate surface. The bonding apparatus according to claim 1,
The chip holding means is formed with a suction hole for sucking the chip. The bonding apparatus according to claim 1,
The second driving means is an actuator that includes a piston that slides in a cylinder and a rod that extends from the tip of the piston, and the piston can rotate around an axis in the cylinder.
The rod of the cylinder of the second driving means and the first driving means are connected by a link mechanism, and the driving force of the second driving means is converted into the rotational force of the first driving means. Bonding equipment. The bonding apparatus according to claim 8 , wherein
The rod includes a guide on an outer peripheral surface thereof, and the link mechanism includes two link bars,
A bonding apparatus comprising: an expansion / contraction guide that slides a joint portion of both link bars in conjunction with the bending operation of the two link bars to make the lengths of both link bars constant. The bonding apparatus according to claim 8 , wherein
A scale fixed to the tip of a link bar connected to the rod side;
Detecting means for detecting a rotation angle of the scale interlocking with the rotation of the link bar;
Control means for positioning the head based on a detection result by the detection means;
A bonding apparatus comprising: The bonding apparatus according to claim 1,
The control means uses a master substrate having a scale associated with the mounting position of the chip component, and the positional information of each mounting position recognized by the recognition means and the drive shafts of the first to third driving means Pre-stored for correlation
A bonding apparatus characterized in that when a chip part is mounted on the workpiece, each drive unit is driven and controlled so as to offset a shift of a drive shaft of each drive unit using a correlation.

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