JP5066559B2 - Hologram laser device manufacturing apparatus and hologram laser device - Google Patents

Description

  The present invention relates to a hologram laser device manufacturing apparatus and a hologram laser device for manufacturing a hologram laser device by fixing a hologram element to a device body including a light source element and a light receiving element, and more specifically, recording information on an optical recording medium, The present invention relates to a hologram laser device manufacturing apparatus and a hologram laser device for adjusting a fixed position of a hologram element with respect to a device body when manufacturing a hologram laser device which is a semiconductor laser device used for signal processing and a light source of an optical pickup device that performs reproduction or erasure .

  A semiconductor laser device is used in an optical pickup device capable of reproducing, recording or erasing information on an information recording medium such as a CD (Compact Disk), an MD (Mini Disc), or a DVD (Digital Versatile Disk). Further, in recent years, there is a so-called hologram laser device configured by incorporating a semiconductor laser element as a light source element, a hologram element that diffracts light, and a signal detection light-receiving element as a light-receiving element in one package. . This hologram laser device emits a light beam from a semiconductor laser element, diffracts the light beam reflected and returned from the optical disk, which is an optical recording medium, and diffracts the light beam by a hologram element so as to receive light for signal detection. It has a mechanism that leads to the element.

  Conventionally, a hologram element mounted on a hologram laser device has been obtained by patterning a soda glass or quartz glass substrate by a photoetching technique. As described in Patent Documents 1 and 2, in recent years, plastic hologram elements and the like that have been subjected to pattern molding by a resin molding technique have been developed for the purpose of cost reduction.

  A hologram laser device manufacturing apparatus manufactures a hologram laser device by assembling a light source element and a light receiving element as a device body and fixing the hologram element to the device body. In the hologram element positioning apparatus described in Patent Document 3, when the hologram element is fixed to the device body, the light source element actually emits light, and the signal light from the optical disk is received by the light receiving element, and the focus error signal or the like The characteristic signal is detected. Further, the hologram element positioning device finely adjusts the position of the hologram element relative to the device body while obtaining a real-time characteristic signal detected by the light receiving element, and places the hologram element at the position where the desired characteristic signal is obtained. Secure to the body.

  The hologram laser manufacturing apparatus described in Patent Document 4 uses a reflection mirror instead of an optical disk to adjust the position of the hologram element with respect to the device body for the purpose of simplifying the manufacturing process. Also, in other hologram laser device manufacturing apparatuses, the supply of device bodies and hologram elements is automated for the purpose of mass production. As a bonding material for fixing the hologram element to the device body, an ultraviolet curable resin is generally used. After completing the position adjustment as described above, UV (Ultraviolet) irradiation is performed to attach the hologram element to the device body. It is fixed.

JP-A-10-187014 JP 10-254335 A JP 2002-190135 A JP 2001-118283 A

  The positioning device for a hologram element described in Patent Document 3 can adjust the hologram element to an intended position in the optical design when the optical characteristics of the hologram pattern are uniform in a region where the hologram pattern of the hologram element is formed. Is possible.

  However, there are many actual hologram elements in which the optical characteristics of the hologram pattern are not uniform and there are variations. Therefore, the hologram element positioning device described in Patent Document 3 often cannot place the hologram element at the optimum position intended in the optical design. As a result, the hologram laser device has an adverse effect on all characteristics such as focus signal balance, radial signal balance, jitter, temperature characteristics, and the like due to the loss of the balance of the optical arrangement. Therefore, the hologram laser device has variations in characteristics and the quality level is lowered.

  In addition, before the hologram element is fixed to the device body, the optical characteristics of the hologram pattern are inspected. The hologram laser device manufacturing apparatus performs pass / fail determination based on the inspected optical characteristics, discards defective hologram elements, and fixes only good hologram elements to the device body to manufacture a hologram laser device. However, even if the hologram laser device manufacturing apparatus inspects the optical characteristics, the yield rate cannot be increased, and the production efficiency of the hologram laser device cannot be improved.

  An object of the present invention is to provide a hologram laser device manufacturing apparatus and a hologram laser device capable of accurately adjusting the position of the hologram element with respect to the device body and further improving the production efficiency when manufacturing the hologram laser device. .

The present invention provides a device body including a light source element that emits laser light and a light receiving element that receives reflected light of the laser light emitted from the light source element, and a hologram pattern that transmits the laser light and diffracts the reflected light. When fixing the hologram element formed by being divided into a plurality of divided regions, the reflected light diffracted by the hologram element is received by the light receiving element, and the value of the characteristic signal indicated by the output of the received light receiving element Is a hologram laser device manufacturing apparatus that adjusts the position of the hologram element with respect to the device main body so as to match a predetermined threshold value,
A holding unit for holding the hologram element;
A measuring light source element for emitting a measuring laser beam and a measuring light source element for receiving the measuring laser beam emitted from the measuring light source element and held by the holding unit. Measurement laser light is emitted from the element, the measurement laser light diffracted by the hologram element is received by the measurement light receiving element, and the optical characteristics of the hologram pattern are measured based on the received output of the measurement light receiving element And
Based on the optical characteristics of the hologram pattern measured by the measurement unit, a correction threshold value obtained by correcting the predetermined threshold value is calculated, and the value of the characteristic signal indicated by the output of the light receiving element included in the device body is calculated as the correction threshold value. And a position adjusting unit that adjusts the position of the hologram element with respect to the device main body so as to coincide with each other.

  According to the present invention, the holding portion is capable of pressing the hologram element in a direction perpendicular to the one surface on which the hologram pattern is formed, and opening in a direction perpendicular to the one surface in the region where the hologram pattern is formed. It is characterized by that.

  In the invention, it is preferable that the measurement laser light emitted from the measurement light source element has substantially the same wavelength as the laser light that can be emitted from the light source element provided in the device body.

Further, the present invention provides a pass / fail determination unit for determining pass / fail of a hologram element based on the optical characteristics of the hologram element measured by the measurement unit;
A storage section capable of storing the hologram element;
When the quality determination unit determines that the hologram element is defective, the holding unit releases the hold on the hologram element and stores the hologram element in the storage unit, and the quality determination unit determines that the hologram element is non-defective. When the determination is made, the holding unit maintains the holding of the hologram element, and the position adjusting unit adjusts the position of the hologram element with respect to the device body.

  Further, in the invention, the measurement unit further includes a condensing lens that condenses the measurement laser light emitted from the measurement light emitting element, and irradiates a divided region of the hologram element using the condensing lens. The area of the measurement laser beam to be measured is smaller than the area of the divided region.

  According to the present invention, the optical characteristic of the hologram element measured by the measurement unit is for measurement that is first-order diffracted by the hologram pattern formed in the divided area with respect to the light amount of the measurement laser light irradiated on the divided area. The first-order diffraction efficiency indicates the ratio of the amount of laser light.

  According to the present invention, the optical characteristic of the hologram element measured by the measurement unit is for measurement that is first-order diffracted by the hologram pattern formed in the divided area with respect to the light amount of the measurement laser light irradiated on the divided area. The ratio of the amount of laser light is defined as the first-order diffraction efficiency, and the first-order diffraction efficiency ratio is a ratio of the first-order diffraction efficiency between hologram patterns in each divided region.

In the present invention, the hologram pattern formed in each of the divided regions has a different direction of diffracting the measurement laser beam,
The measurement unit has one light receiving element for measurement,
The measurement unit sequentially receives light diffracted by the hologram pattern formed in each divided region using one measurement light receiving element, and performs first-order diffraction efficiency between the hologram patterns in the divided regions. It is characterized by measuring the ratio.

According to the present invention, the divided region is divided by a straight line that bisects at least the region where the hologram pattern is formed, and is divided into two in the surface direction of one surface of the hologram element on which the hologram pattern is formed. A direction perpendicular to a straight line is defined as a first direction, a surface direction of the one surface, and a direction parallel to the line divided into two is defined as a second direction.
The direction in which the position adjusting unit adjusts the position of the hologram element relative to the device body is at least one of a first direction and a second direction.

  Further, the present invention is a hologram laser device manufactured by the hologram laser device manufacturing apparatus.

  According to the present invention, a hologram laser device manufacturing apparatus transmits and reflects laser light to a device body including a light source element that emits laser light and a light receiving element that receives reflected light of the laser light emitted from the light source element. When fixing a hologram element formed by dividing a hologram pattern that diffracts light into a plurality of divided regions, reflected light diffracted by the hologram element is received by the light receiving element, and is indicated by the output of the received light receiving element The position of the hologram element relative to the device body is adjusted so that the value of the characteristic signal matches a predetermined threshold value. The hologram laser device manufacturing apparatus includes a holding unit, a measuring unit, and a position adjusting unit. The holding unit holds the hologram element. The measurement unit includes a measurement light source element that emits measurement laser light and a measurement light receiving element that receives the measurement laser light emitted from the measurement light source element. The measurement unit emits measurement laser light from the measurement light source element to the hologram element held by the holding unit, receives the measurement laser light diffracted by the hologram element by the measurement light receiving element, and receives the measurement The optical characteristics of the hologram pattern are measured based on the output of the light receiving element. The position adjustment unit calculates a correction threshold value obtained by correcting a predetermined threshold value based on the optical characteristics of the hologram pattern measured by the measurement unit, and the characteristic signal indicated by the output of the light receiving element provided in the device main body as the correction threshold value The position of the hologram element with respect to the device main body is adjusted so that the values of.

  The hologram laser device manufacturing apparatus adjusts the position of the hologram element relative to the device body with the target position in the optical design, that is, the position where the center point of the laser beam substantially coincides with the center point of the hologram element. The predetermined threshold value used when adjusting the position of the hologram element is set on the assumption that the optical characteristics of the hologram pattern are uniform in each divided region of the hologram element.

  The measurement unit can measure the optical characteristics of the hologram element and detect variations in the optical characteristics in each divided region. Thereby, the position adjusting unit can correct the predetermined threshold value based on the variation in the optical characteristics of the hologram element. Therefore, the position adjustment unit can individually correct the threshold value determined in advance for each hologram element, and can determine the fixed position of the hologram element according to the optical characteristics of the hologram element.

  Accordingly, the hologram laser device manufacturing apparatus can appropriately adjust the hologram element and the device body so that the hologram element and the device main body are fixed at the intended positions in the optical design even if the hologram element has a variation in optical characteristics. Therefore, the hologram laser device manufacturing apparatus can manufacture a high-quality hologram laser device having excellent characteristics such as focus signal balance, radial signal balance, and jitter.

  In addition, the hologram laser device manufacturing apparatus manufactures high-quality hologram laser devices by appropriately adjusting the position of the hologram elements with respect to the device body, with respect to the hologram elements that have been discarded in the past due to variations in optical characteristics. can do. Thereby, the hologram laser device manufacturing apparatus can improve the yield rate when manufacturing the hologram laser device and improve the production efficiency.

  According to the present invention, the holding portion can press the hologram element in a direction perpendicular to the one surface on which the hologram pattern is formed, and opens in a direction perpendicular to the one surface in the region on which the hologram pattern is formed. ing.

  Accordingly, the holding unit can cause the measurement unit to measure the optical characteristics of the hologram element without interfering with the measurement laser light from the measurement light source element and the measurement laser light diffracted by the hologram element. In addition, the holding unit stabilizes the position of the hologram element and the device book by pressing the hologram element near a position where the device body is to be fixed, and appropriately adjusts the position of the hologram element to the position adjustment unit. Can be adjusted.

  Therefore, the holding unit can sequentially perform the measurement of the optical characteristics by the measurement unit and the adjustment of the position by the position adjustment unit while holding the hologram element. Thereby, the hologram laser device manufacturing apparatus can manufacture a hologram laser device efficiently.

  According to the invention, the measurement laser light emitted from the measurement light source element has substantially the same wavelength as the laser light that can be emitted from the light source element provided in the device body. Although the optical characteristics of the hologram pattern vary depending on the wavelength of light, the measurement unit can accurately obtain the same measurement result as that measured using the light source element of the device body. As a result, the position adjustment unit can calculate the correction threshold based on the measured optical characteristics, and can accurately adjust the position of the hologram element.

  According to the invention, the hologram laser device manufacturing apparatus further includes a pass / fail determination unit and a storage unit. The pass / fail determination unit performs pass / fail determination of the hologram element based on the optical characteristics of the hologram element measured by the measurement unit. The storage unit can store the hologram element. When the quality determination unit determines that the hologram element is defective, the holding unit releases the holding of the hologram element and stores the hologram element in the storage unit. When the hologram element is determined to be non-defective by the pass / fail determination unit, the holding unit maintains the holding of the hologram element, and the position adjusting unit adjusts the position of the hologram element with respect to the device body.

  Accordingly, the holding unit can efficiently sort non-defective products and defective products by maintaining or releasing the holding of the hologram element according to the result of the quality determination. Further, the hologram laser device manufacturing apparatus can use the measurement result of the optical characteristics of the hologram element obtained by the measurement unit for the quality determination of the hologram element by the quality determination unit and the correction of the predetermined threshold value by the position adjustment unit. it can. Accordingly, the hologram laser device manufacturing apparatus can increase the production efficiency of the hologram laser device by effectively utilizing the measured optical characteristics.

  According to the invention, the measurement unit further includes a condenser lens that condenses the measurement laser light emitted from the measurement light emitting element. The measurement unit uses the condensing lens to make the area of the measurement laser light irradiated to the divided area of the hologram element smaller than the area of the divided area.

  Accordingly, the measurement unit can irradiate the measurement laser light for each divided region, and cause the measurement light receiving element to receive the measurement laser light diffracted by the hologram pattern formed in each divided region. Therefore, the measurement unit can accurately measure the optical characteristics of the hologram element for each divided region.

  According to the invention, the optical characteristic of the hologram element measured by the measuring unit is the first-order diffraction efficiency. The first-order diffraction efficiency indicates the ratio of the light amount of the measurement laser light that is first-order diffracted by the hologram pattern formed in the divided region to the light amount of the measurement laser light irradiated to the divided region.

  Thereby, the hologram laser device manufacturing apparatus knows the ratio of the amount of light that is first-order diffracted by the hologram element and irradiated to the light receiving element out of the amount of reflected light from the optical disk when the hologram laser device reads a signal from the optical disk. be able to.

  According to the invention, the optical characteristic of the hologram element measured by the measuring unit is a first-order diffraction efficiency ratio. The first-order diffraction efficiency ratio indicates the ratio of the first-order diffraction efficiency between hologram patterns in each divided region. The first-order diffraction efficiency is a ratio of the light amount of the measurement laser light that is first-order diffracted by the hologram pattern formed in the divided region to the light amount of the measurement laser light irradiated to the divided region.

  Thereby, the measurement unit can digitize the difference in the first-order diffraction efficiency between the hologram patterns in the respective divided regions. Therefore, the position adjustment unit can appropriately adjust the position of the hologram element with respect to the device body based on the first-order diffraction efficiency ratio, that is, the value indicating the variation in the first-order diffraction efficiency between the hologram patterns in each divided region. .

  According to the invention, the hologram pattern formed in each divided region has a different direction for diffracting the measurement laser beam. The measurement unit has one measurement light receiving element. The measurement unit sequentially receives light diffracted by the hologram pattern formed in each divided region using one measuring light receiving element, and measures the first-order diffraction efficiency ratio between the hologram patterns in the divided regions. To do.

  If the first-order diffraction efficiency of each divided region is measured using a plurality of measurement light receiving elements, it is difficult to make the light reception sensitivities of the plurality of measurement light receiving elements completely the same, resulting in errors in measurement results. Occurs. Since the measurement unit is configured to use one light-receiving element for measurement, the first-order diffraction efficiency ratio between the hologram patterns in the divided regions can be accurately measured.

  Further, in the configuration using one measurement light receiving element, the number of parts can be reduced as compared with the configuration using a plurality of measurement light receiving elements. Thereby, the cost of the hologram laser device manufacturing apparatus and the hologram laser device can be reduced.

  According to the invention, the divided region is divided by a straight line that bisects at least the region where the hologram pattern is formed. The first direction is the surface direction of one surface of the hologram element on which the hologram pattern is formed, and the direction perpendicular to the line that divides into two is the first direction, and the direction that is parallel to the surface direction of one surface and the line that divides into two is the first direction. The direction is 2. The direction in which the position adjusting unit adjusts the position of the hologram element with respect to the device main body is at least one of the first direction and the second direction.

  In some hologram elements, for example, a region where a hologram pattern is formed is divided into two or three by one straight line or two straight lines orthogonal to each other. If the first-order diffraction efficiency of each divided region is different, the position of the hologram element with respect to the device body is shifted in the direction perpendicular to the straight line dividing the hologram pattern region and in the surface direction of one surface on which the hologram pattern is formed.

  Therefore, the position adjusting unit can correct the hologram element having a variation in the first-order diffraction efficiency in each divided region in a direction in which a position shift of the hologram element with respect to the device body is expected. Accordingly, the position adjusting unit can surely correct the fixed position of the hologram element with respect to the device body to the fixed position intended by the optical design.

  According to the invention, the hologram laser device is manufactured by the hologram laser device manufacturing apparatus. Thus, in the hologram laser device, the hologram element and the device body are adjusted and fixed at the positions intended by the optical design. Therefore, the hologram laser device can stably exhibit excellent characteristics such as focus signal balance, radial signal balance, and jitter. Further, since the hologram laser device is manufactured by a hologram laser device manufacturing apparatus with high production efficiency, the cost can be kept low.

It is a front view which shows the hologram laser device 1 manufactured by the hologram laser device manufacturing apparatus 2 which concerns on embodiment of this invention. It is a top view which shows the hologram laser device 1 manufactured by the hologram laser device manufacturing apparatus 2. FIG. 4 is a flowchart for explaining a process for manufacturing the hologram laser device 1. It is a figure which shows the structure of the hologram laser device manufacturing apparatus. FIG. 4 is a front view showing a part of a chucking mechanism of a holding conveyance unit 22. 4 is a plan view showing a part of the chucking mechanism of the holding and conveying unit 22. FIG. 3 is a front view showing a configuration of a measurement unit 23. FIG. 3 is a plan view showing a configuration of a measurement unit 23. FIG. 6 is a perspective view for explaining measurement of optical characteristics of the hologram element 13 by a measurement unit 23. FIG. It is a perspective view which shows the adjustment of the position with respect to the device main body of the hologram element 13 in which the 3 division | segmentation hologram pattern formed by the position adjustment fixing unit 25 is formed. It is a top view which shows the state which the light receiving element 12 has received the laser beam diffracted by the 3 division | segmentation hologram pattern. It is a top view which shows the 1st comparative example which performed the position adjustment of the hologram element 13 in which a 3 division | segmentation hologram pattern is formed, without calculating the correction threshold value of MSB. It is a top view which shows the 1st comparative example which performed the position adjustment of the hologram element 13 in which a 3 division | segmentation hologram pattern is formed, without calculating the correction threshold value of SSB. It is a perspective view which shows adjustment of the position with respect to the device main body of the hologram element 13 in which the 2 division | segmentation hologram pattern formed by the position adjustment fixing unit 25 is formed. It is a top view which shows the state in which the light receiving element 12 has received the laser beam diffracted by the 2-part dividing hologram pattern. It is a top view which shows the 2nd comparative example which adjusted the position of the hologram element 13 in which a 2 division | segmentation hologram pattern is formed, without calculating the correction threshold value of MSB. It is a front view which shows a part of chucking mechanism of the holding | maintenance conveyance unit 22 which concerns on other embodiment of this invention. It is a top view which shows a part of chucking mechanism of the holding | maintenance conveyance unit 22 which concerns on other embodiment of this invention. It is a perspective view for demonstrating the measurement of the optical characteristic of the hologram element 13 by the measurement unit 23 which concerns on other embodiment of this invention.

  FIG. 1 is a front view showing a hologram laser device 1 manufactured by a hologram laser device manufacturing apparatus 2 according to an embodiment of the present invention. FIG. 2 is a plan view showing the hologram laser device 1 manufactured by the hologram laser device manufacturing apparatus 2.

  The hologram laser device 1 includes a light source element 11, a light receiving element 12, a hologram element 13, a submount 14, a stem 15, and a cap 16. The direction in which laser light is emitted from the light source element 11 to the hologram element 13 is defined as the Z1 direction, and the direction opposite to the Z1 direction is defined as the Z2 direction. The Z1 direction and the Z2 direction are collectively referred to simply as the Z direction. The direction perpendicular to the Z direction and viewed from the light source element 11 toward the light receiving element 12 when viewed in the Z direction is defined as the X1 direction, and the direction opposite to the X1 direction is defined as the X2 direction. The X1 direction and the X2 direction are also simply referred to as the X direction. A direction perpendicular to the X direction and the Z direction is a Y direction, a direction toward one is a Y1 direction, and a direction toward the other is a Y2 direction.

  On the upper surface of the hologram element 13, that is, the surface facing the Z1 direction, a hologram pattern 18 for diffracting the laser light is formed. Laser light emitted from a light source element 11 such as an LD (Laser Diode) chip passes through the hologram element 13 and proceeds in the Z1 direction. The laser beam reflected by the disk or the like travels in the Z2 direction and is applied to the hologram element 13. The hologram pattern 18 diffracts the laser light irradiated from the Z2 direction. The light receiving element 12 receives laser light diffracted by the hologram pattern 18 at a predetermined angle in the X1 direction.

  FIG. 3 is a flowchart for explaining a process for manufacturing the hologram laser device 1. The hologram laser device manufacturing apparatus 2 is an apparatus that manufactures the hologram laser device 1.

  When the hologram laser device manufacturing apparatus 2 manufactures the hologram laser device 1, the process proceeds to step S0 and processing is started. The processing of steps S1 to S10 is performed by the hologram laser device manufacturing apparatus 2. In step S <b> 1, the semiconductor laser element that is the light source element 11 is bonded to the submount 14. In step S <b> 2, the submount 14 to which the semiconductor laser element is bonded is bonded to a predetermined position of the stem 15. In step S3, the light receiving element 12 is mounted on the stem 15, and in step S4, electrodes such as the semiconductor laser element and the light receiving element 12 are electrically connected by wires.

  In step S <b> 5, the side on which the optical component of the stem 15 is mounted is covered with the cap 16. A window is provided on the top of the cap 16. The window may have any shape as long as it does not hinder the bonding strength and optical path of the hologram element 13. A device in which the semiconductor laser element, the submount 14, the stem 15, the light receiving element 12, and the like are assembled in steps S1 to S5 is referred to as a “device body”. In step S6, a burn-in inspection is performed on the device body in order to remove initial defects in advance. In step S7, a laser characteristic inspection of the device body is performed.

  In step S8, the optical characteristics of the hologram element 13 are measured. Based on this measurement result, the quality of the hologram element 13 is determined, and the hologram element 13 determined to be non-defective is fixed to the device body. The hologram element 13 is fixed to the upper part of the window of the cap 16 of the device body. The hologram laser device 1 is completed by fixing the hologram element 13 to the device body. In step S9, a characteristic inspection is performed on the completed hologram laser device 1. In step S10, an appearance inspection of the hologram laser device 1 is performed. In step S11, the hologram laser device 1 is shipped, and the process proceeds to step S12 and the process ends.

  FIG. 4 is a diagram showing a configuration of the hologram laser device manufacturing apparatus 2. The process in step S8 shown in FIG. 3 performed by the hologram laser device manufacturing apparatus 2 will be described. The device manufacturing apparatus includes a hologram element supply unit 21, a holding conveyance unit 22 that is a holding unit, a measurement unit 23 that is a measurement unit and a quality determination unit, a discard unit 24 that is a storage unit, and a position adjustment unit. The position adjustment fixing unit 25 and the main body supply / recovery unit 26 are included.

  The hologram element supply unit 21 can store a plurality of hologram elements 13 and supplies the hologram element 13 to the holding and conveying unit 22. The holding and conveying unit 22 has a chucking mechanism for chucking, that is, holding the hologram element 13. Further, the holding and conveying unit 22 has a three-dimensional movement axis in the X direction, the Y direction, and the Z direction, and a rotational movement axis perpendicular to the surface on which the hologram pattern 18 of the chucked hologram element 13 is formed. Yes.

  The measurement unit 23 emits measurement laser light from the measurement light source element 36 to the hologram element 13 held by the holding and conveying unit 22, and the measurement laser light diffracted by the hologram element 13 is measured. The optical characteristics of the hologram pattern 18 are measured on the basis of the received light receiving element 37 for measurement. The measurement unit 23 sends data relating to the measured optical characteristics of the hologram pattern 18 to the position adjustment fixing unit 25.

  The optical characteristics of the hologram pattern 18 are the first-order diffraction efficiency and the first-order diffraction efficiency ratio of the hologram pattern 18 formed on the hologram element 13. Further, the measurement unit 23 determines the quality of the hologram element 13 based on the measurement result of the optical characteristics of the hologram element 13. This pass / fail judgment is made based on whether or not at least one of the first-order diffraction efficiency and the first-order diffraction efficiency ratio is within a predetermined range.

  The disposal unit 24 includes a disposal container for collecting the hologram element 13 that is determined as a defective product by the measurement unit 23. The position adjustment fixing unit 25 adjusts the position of the hologram element 13 with respect to the device body, and fixes the hologram element 13 to the device body.

  The main body supply / recovery unit 26 can store a plurality of device main bodies, and supplies the device main bodies to the position adjustment fixing unit 25. Further, the main body supply / recovery unit 26 recovers the hologram laser device 1 which is a completed product in which the hologram element 13 and the device main body are fixed by the position adjustment fixing unit 25.

  In the hologram laser device manufacturing apparatus 2, the holding and conveying unit 22 chucks, holds, and receives the hologram element 13 supplied from the hologram element supply unit 21. The holding and conveying unit 22 moves the received hologram element 13 to the measuring unit 23. The holding and conveying unit 22 moves the hologram element 13 whose optical characteristics have been measured by the measuring unit 23 to the disposal unit 24. The holding and conveying unit 22 releases and holds the hologram element 13 determined to be defective by the measuring unit 23 and stores it in the disposal container of the disposal unit 24. The holding and conveying unit 22 maintains the holding of the hologram element 13 determined to be a non-defective product by the measuring unit 23 and moves it to the position adjusting and fixing unit 25.

  The position adjustment fixing unit 25 calculates a correction threshold value obtained by correcting a predetermined threshold value based on the optical characteristics of the hologram element 13 measured by the measurement unit 23. The position adjustment fixing unit 25 adjusts the position of the hologram element 13 relative to the device body so that the value of the characteristic signal indicated by the output of the light receiving element 12 provided in the device body matches the calculated correction threshold value. The device main body is supplied from the main body supply / recovery unit 26 to the position adjustment fixing unit 25 and is held by the position adjustment fixing unit 25. The hologram element 13 is held by a holding and conveying unit 22. The position adjustment fixing unit 25 fixes the hologram element 13 to the device body at the adjusted position using, for example, an ultraviolet curable adhesive.

  The holding and conveying unit 22 releases the holding of the hologram element 13 and opens the hologram element 13 when the fixing of the hologram element 13 and the device body by the position adjustment fixing unit 25 is completed. The main body supply / recovery unit 26 recovers from the position adjustment fixing unit 25 the hologram laser unit in which the hologram element 13 and the device main body are fixed.

  FIG. 5 is a front view showing a part of the chucking mechanism of the holding conveyance unit 22. FIG. 6 is a plan view showing a part of the chucking mechanism of the holding and conveying unit 22. The chucking mechanism includes a first chucking claw 31 and a second chucking claw 32.

  The holding and conveying unit 22 can press the hologram element 13 in the Z2 direction, which is a direction perpendicular to the upper surface where the hologram pattern 18 is formed, and in the region where the hologram pattern 18 is formed, the direction Z is perpendicular to the upper surface. Open in the direction.

  A hologram pattern 18 is formed on the upper surface of the hologram element 13, that is, the surface facing the Z1 direction. The hologram pattern 18 is formed in a circular shape having a diameter of 1.1 millimeters (abbreviation: “mm”), for example, and is equally divided into two regions by a straight line in the X direction. The hologram pattern 18 constituted by the two half-circle regions divided into two equal parts is referred to as “two-divided hologram pattern”.

  The first chucking claw 31 and the second chucking claw 32 hold the hologram element 13 by sandwiching the side surface of the hologram element 13 from the Y direction, that is, the direction orthogonal to the light diffraction direction by the hologram pattern 18. The first chucking claw 31 covers and abuts the surface facing the Z1 direction of the hologram element 13 and the surface facing the Y2 direction. The second chucking claw 32 covers and contacts the surface of the hologram element 13 facing the Y1 direction.

  The first chucking claw 31 and the second chucking claw 32 hold the hologram element 13 and the hologram element 13 is pressed against the device body by a pressure of, for example, several tens of grams (abbreviation: “gf”). Can be pressed in the Z2 direction. The first chucking claw 31 and the second chucking claw 32 are configured in a shape that can uniformly press the upper surface of the hologram element 13, that is, the surface on which the hologram pattern 18 is formed.

  Thus, the position adjustment fixing unit 25 presses the hologram element 13 against the device body by the first chucking claw 31 and the second chucking claw 32 when adjusting and fixing the position of the hologram element 13 with respect to the device body. In this state, processing can be performed stably.

  The first chucking claw 31 has a chucking opening 33 at a portion covering the upper surface of the hologram element 13. The chucking opening 33 forms a cylindrical opening region having a diameter larger than the diameter of the hologram pattern 18. The opening region is a hole that penetrates the first chucking claw 31 in the Z direction. The chucking opening 33 is formed at a position where the cylinder axis of the chucking opening 33 and the axis of the diameter of the hologram pattern 18 substantially coincide.

  The size of the diameter of the chucking opening 33 is such that the diffracted light diffracted at an angle of 45 to 60 degrees with respect to the axis of the laser light when the laser beam traveling in the Z1 direction is irradiated onto the hologram pattern 18 The portion 33 is formed in a size that does not obstruct the optical path.

  FIG. 7 is a front view showing the configuration of the measurement unit 23. FIG. 8 is a plan view showing the configuration of the measurement unit 23. The measurement unit 23 measures the optical characteristics of the hologram element 13 held by the first chucking claw 31 and the second chucking claw 32.

The measurement unit 23 includes a measurement light source element 36, a measurement light receiving element 37, and a condenser lens 38. The measurement light source element 36 emits measurement laser light having substantially the same wavelength as the laser light that can be emitted by the light source element 11 of the hologram laser device 1. The wavelength of the laser light emitted from the light source element 11 is determined according to the application of the hologram laser device 1. The wavelength of this laser beam is, for example, CD (Compact Disk), CD-R (Compact Disk).
When used for a disc such as Recordable), it is 780 to 805 nanometers (abbreviation: “nm”), and when used for a disc such as a DVD (Digital Versatile Disk) and a writable DVD, it is 640 to 675 nm.

  The measurement light receiving element 37 receives the measurement laser light diffracted by the hologram pattern 18 and outputs a voltage corresponding to the received light quantity. The condensing lens 38 condenses the measurement laser light emitted from the measurement light source element 36 and irradiates the hologram pattern 18. The measurement laser light condensed by the condenser lens 38 and irradiated on the hologram element is indicated by an arrow L1, and the measurement laser light diffracted by the hologram pattern 18 is indicated by an arrow L2.

  FIG. 9 is a perspective view for explaining the measurement of the optical characteristics of the hologram element 13 by the measurement unit 23. A hologram pattern 18 divided into three is formed on the hologram element 13. This three-divided hologram pattern 18 is referred to as a “three-divided hologram pattern”. In the three-division hologram pattern, one of the two half-circle areas formed in the two-division hologram pattern is divided into two equal parts by a straight line in the Y direction, and two quarter-circle areas are formed. It is formed.

  The measurement light source element 36 emits measurement laser light to the condenser lens 38 in the Z1 direction. The condenser lens 38 condenses the measurement laser light emitted from the measurement laser light and irradiates the hologram element 13 with the measurement laser light in the Z1 direction. The measurement laser beam from the measurement light source element 36 is incident from the lower surface of the hologram element 13, that is, the surface facing in the Z <b> 2 direction, and is a half-circle region of the hologram pattern 18 formed on the upper surface of the hologram element 13. Is irradiated.

  The condensing lens 38 makes the area of the measurement laser light irradiated to the divided area of the hologram element 13 smaller than the area of the divided area. The hologram pattern 18 has a diameter of 1.1 mm, for example, and the laser beam spot irradiated on the hologram pattern 18 has a diameter of 0.2 mm, for example. The hologram pattern 18 diffracts the laser beam having the axis line in the Z1 direction at a predetermined angle from the axis line in the X1 direction. The measurement light receiving element 37 receives the laser light diffracted by the hologram pattern 18 and measures the amount of the received laser light.

  Although the hologram element 13 shown in FIG. 9 is formed with a three-division hologram pattern, the measurement unit 23 similarly applies a measurement laser beam to each divided area for the hologram element 13 with a two-division hologram pattern. The amount of light can be measured by the light receiving element 37 for measurement.

  The optical characteristic of the hologram element 13 measured by the measurement unit 23 is first-order diffraction efficiency. The first-order diffraction efficiency indicates the ratio of the light amount of the measurement laser light that is first-order diffracted by the hologram pattern 18 formed in the divided region to the light amount of the measurement laser light irradiated to the divided region.

  The first-order diffraction efficiency is calculated as follows. The measurement unit 23 emits laser light so that the output of the measurement laser light source is constant by an APC (Auto Power Control) driving method. The amount of incident light that is the amount of laser light for measurement at the position where the hologram element 13 is disposed is measured in advance. The first-order diffraction efficiency is determined by assigning the amount of the first-order diffracted light obtained from the measurement light-receiving element 37 with the amount of incident light.

  Since the first-order diffraction efficiency is the ratio of first-order diffraction of incident light, when viewed as the hologram laser device 1, the disc signal light reflected from the disc is converted into the light receiving element 12 in the hologram laser device 1. This shows the efficiency of the incident light. Therefore, the first-order diffraction efficiency and the disk signal output intensity of the device are directly proportional, and the hologram element 13 having the first-order diffraction efficiency that does not match the output intensity of the signal defined by the hologram laser device 1 The quality can be determined by measurement. In addition, by individually measuring the first-order diffraction efficiency of each pattern in the hologram pattern 18, that is, each divided region, it is possible to individually determine pass / fail for the corresponding device signal ranges. it can.

  In the present embodiment, the measurement unit 23 is configured to include one condensing lens 38, but is not limited to such a configuration. In other embodiments, the condensing unit includes two or more condensing lenses 38. The structure provided may be sufficient.

  Further, the optical characteristic of the hologram element 13 measured by the measurement unit 23 is a first-order diffraction efficiency ratio indicating a ratio of the first-order diffraction efficiency between hologram patterns in each divided region. The measurement unit 23 moves the hologram element 13 parallel to the upper surface in a state where the positions of the measurement laser light source, the condensing lens 38 and the measurement light receiving element 37 are fixed, so that 1 of each divided region of the hologram pattern 18 is obtained. The next diffraction efficiency is measured. The measurement unit 23 measures the individual first-order diffraction efficiency for the hologram pattern 18 in each divided region, calculates the difference in the first-order diffraction efficiency between the hologram patterns 18 as a ratio of the first-order diffraction efficiency ratio, and the first-order diffraction efficiency ratio. To do.

  As described above, the first-order diffraction efficiency is calculated by assigning the first-order diffracted light amount by the incident light amount. When the incident light amount is the same as in this embodiment, the first-order diffraction efficiency ratio is It can be calculated as the ratio of the first-order diffracted light quantity of the hologram pattern 18. Therefore, in the case of the present embodiment, the first-order diffraction efficiency ratio is calculated by assigning the first-order diffraction light amounts of the patterns obtained by the measurement light receiving element 37 to each other.

  The measurement unit 23 has one measurement light receiving element 37, and the measurement unit 23 sequentially uses the one measurement light reception element 37 to sequentially diffract the light diffracted by the hologram pattern 18 formed in each divided region. The first order diffraction efficiency ratio between the hologram patterns in the divided areas is measured. Further, the diffraction directions of the light that is first-order diffracted by the hologram pattern 18 in each divided region are different from each other.

  The movement of the hologram element 13 when the measurement unit 23 measures the optical characteristics of the hologram element 13 is performed by the holding and conveying unit 22. The holding and conveying unit 22 moves the hologram element 13 in the X direction and the Y direction parallel to the upper surface of the hologram element 13 using two operation axes orthogonal to the X direction and the Y direction. This operation axis can be shared with the operation axis for moving the hologram element 13 when adjusting the position of the hologram element 13 with respect to the device body. Thereby, the number of parts can be reduced and the cost can be reduced.

  FIG. 10 is a perspective view showing the adjustment of the position of the hologram element 13 on which the three-division hologram pattern is formed performed by the position adjustment fixing unit 25 with respect to the device body. FIG. 11 is a plan view showing a state in which the light receiving element 12 receives the laser light diffracted by the three-part hologram pattern.

  The position adjustment fixing unit 25 calculates a correction threshold value obtained by correcting a predetermined threshold value based on the optical characteristics of the hologram pattern 18 measured by the measurement unit 23, and the output of the light receiving element 12 provided in the device body is used as the correction threshold value. The position of the hologram element 13 with respect to the device main body is adjusted so that the values of the characteristic signals indicated by.

  The hologram element 13 is formed with a three-divided hologram pattern. Of the divided areas of the hologram pattern 18, a half-circle area is a hologram pattern 18a, and one of the quarter-circle areas is a hologram pattern 18b. The other one-quarter circle region is a hologram pattern 18c.

  The reflected light of the laser light emitted from the light source element 11 is indicated by an arrow L11, the laser light diffracted by the hologram pattern 18a is indicated by an arrow L12, and the laser light diffracted by the hologram pattern 18b is indicated by an arrow L13. The laser beam diffracted by the hologram pattern 18c is indicated by an arrow L14.

  The hologram patterns 18a, 18b, and 18c have different diffraction directions of laser light. The laser beams L12, L13, and L14 are received by the light receiving element 12, respectively. Of the light receiving region 41 of the light receiving element 12, regions that receive the laser light L12 from the hologram pattern 18a are light receiving regions 41a and 41b, and regions that receive the laser light L13 from the hologram pattern 18b are light receiving regions 41c. A region for receiving the laser beam L14 from 18c is defined as a light receiving region 41d. The light receiving areas 41 a and 41 b are divided from each other by a linear light receiving area dividing line 42.

When fixing the hologram element 13 on which the three-divided hologram pattern is formed to the device body, the position adjustment fixing unit 25 emits the light source element and measures the three characteristic signals in real time. Thus, the position of the hologram element 13 is adjusted. The three characteristic signals are FES (Focus Error Signal) and MSB (Main Spot).
Balance) and SSB (Sub Spot Balance), which are defined by the following equations, respectively.
FES = V _a −V _b
MSB = (V _a + V _b ) ÷ (V _c + V _d )
SSB = V _c ÷ V _d

Here, V _a indicates an output voltage value from the light receiving region 41a, V _b indicates an output voltage value from the light receiving region 41b, V _c indicates an output voltage value from the light receiving region 41c, and V _d Indicates an output voltage value from the light receiving region 41d.

  MSB is the output voltage ratio from the light receiving element 12 by the laser beam L12 diffracted by the hologram pattern 18a in each half-circle region and the hologram patterns 18b and 18c, and SSB is each 1/4. This is the output voltage ratio from the light receiving element 12 by the laser beams L13 and L14 diffracted by the hologram patterns 18b and 18c in the circular region. MSB and SSB are used when the hologram element 13 is fixed as an index of the relative position of the hologram pattern with respect to the laser beam. Further, the MSB and SSB are used for position adjustment as an index indicating the relative position of the hologram laser device 1 with respect to the pickup optical system when the hologram laser device 1 is mounted on the pickup.

  For FES, zero volt (Volt: abbreviation “V”) is set as a predetermined threshold value, and is rotated in the W direction parallel to the upper surface on which the hologram pattern 18 is formed with the center of the hologram pattern 18 as an axis. Thus, the position of the hologram element 13 is adjusted so that the beam falls on the dividing line between PD_A and PD_B.

  For the MSB and SSB, “1” is set as a predetermined threshold value, and the position of the hologram element 13 is adjusted. In the case of MSB, the hologram element 13 is placed on the upper surface in the Y direction perpendicular to the dividing line between the hologram pattern 18a and the hologram patterns 18b and 18c, and in the X direction parallel to the dividing line between the hologram pattern 18b and 18c in the case of SSB. The position of the hologram element 13 is adjusted by changing the ratio of the laser light applied to the hologram pattern 18 in each divided region. The X direction and the Y direction are orthogonal to each other.

  The position adjustment fixing unit 25 corrects the predetermined threshold “1” for the MSB and SSB based on the first-order diffraction efficiency ratio of each hologram pattern 18. The position adjustment fixing unit 25 calculates the MSB correction threshold based on the ratio between the first-order diffraction efficiency value of the hologram pattern 18a and the average value of the first-order diffraction efficiency values of the hologram patterns 18b and 18c. The MSB correction threshold value is calculated by “first-order diffraction efficiency value of hologram pattern 18a ÷ {(first-order diffraction efficiency value of hologram pattern 18b + first-order diffraction efficiency value of hologram pattern 18c) ÷ 2}”.

  The position adjustment fixing unit 25 calculates the SSB correction threshold value based on the ratio between the first-order diffraction efficiency value of the hologram pattern 18b and the first-order diffraction efficiency value of the hologram pattern 18c. The SSB correction threshold value is calculated by “first-order diffraction efficiency value of hologram pattern 18b ÷ first-order diffraction efficiency value of hologram pattern 18c”.

  For example, the first-order diffraction efficiency of the hologram pattern 18a is “0.8”, the first-order diffraction efficiency of the hologram pattern 18b is “0.4”, and the first-order diffraction efficiency of the hologram pattern 18c is “1.6”. In this case, the MSB correction threshold is calculated as “0.8” by “0.8 ÷ {(0.4 + 1.6) / 2}”, and the SSB correction threshold is “0.4 ÷ 1. .6 ”,“ 0.25 ”is calculated.

  In the position adjustment of the hologram element 13 performed by the position adjustment fixing unit 25, the characteristic signals of FES, MSB, and SSB are confirmed in real time, and the FES, MSB, and SSB are repeatedly repeated so as to approach the predetermined threshold. By performing the adjustment, the hologram element 13 is driven to an optimum position and fixed to the device body. Thereby, the position adjustment fixing unit 25 can arrange the light source element 11, the light receiving element 12, and the hologram element 13 at a position intended in the optical design.

  FIG. 12 is a plan view showing a first comparative example in which the position of the hologram element 13 on which the three-part hologram pattern is formed is calculated without calculating the MSB correction threshold value. FIG. 13 is a plan view showing a first comparative example in which the position of the hologram element 13 on which the three-division hologram pattern is formed is calculated without calculating the SSB correction threshold value.

  In the first comparative example, when the first-order diffraction efficiencies of the hologram patterns 18a, 18b, and 18c are not uniform, the position adjustment fixing unit 25 determines the position of the hologram element 13 according to the predetermined threshold “1” of the MSB and SSB. The result of adjusting is shown. The first-order diffraction efficiency of the hologram pattern 18a is “0.8”, the first-order diffraction efficiency of the hologram pattern 18b is “0.4”, and the first-order diffraction efficiency of the hologram pattern 18c is “1.6”. And

  In the first comparative example shown in FIG. 12, the center C1 of the hologram pattern 18 is adjusted to a position shifted in the Y2 direction from the center C2 of the laser beam. In the first specific example shown in FIG. 13, the center C1 of the hologram pattern 18 is adjusted to a position shifted in the X2 direction from the center C2 of the laser beam. This is a result of adjusting the position of the hologram element 13 so that the hologram pattern 18 having relatively low first-order diffracted light efficiency receives more laser light than the hologram pattern 18 having higher first-order diffracted light efficiency. .

  If the center of the hologram pattern 18 and the center of the laser beam are fixed at different positions, for example, characteristics such as focus signal balance, radial signal balance, and jitter vary, and the quality of the hologram laser device 1 deteriorates. Therefore, when the position of the hologram element 13 is adjusted without correcting the predetermined threshold value, the allowable range of the first-order diffraction efficiency ratio of the hologram pattern 18 is set to, for example, “1 ± 0.1” and is outside the allowable range. The hologram element 13 is discarded.

  On the other hand, since the position adjustment fixing unit 25 of the present embodiment adjusts the position of the hologram element 13 using the correction threshold, the allowable range of the first-order diffraction efficiency ratio of the hologram pattern 18 is set to, for example, “1 ± 0. .4 ". As a result, the hologram laser device manufacturing apparatus 2 can expand the allowable range of the characteristics of the hologram element 13 and improve the yield rate, thereby reducing cost and improving productivity. In addition, the hologram laser device 1 manufacturing apparatus stabilizes the incident position of the outward light from the disk on the light receiving element 12 to reduce variations, so that the characteristics of the hologram laser device 1 can be stabilized and the quality can be improved. it can.

  FIG. 14 is a perspective view showing the adjustment of the position of the hologram element 13 on which the two-divided hologram pattern is formed performed by the position adjustment fixing unit 25 with respect to the device body. FIG. 15 is a plan view showing a state in which the light receiving element 12 receives the laser light diffracted by the two-divided hologram pattern. The position adjustment fixing unit 25 performs the same position adjustment as the position adjustment of the hologram element 13 having the three-division hologram pattern described with reference to FIGS. 14 and 15, the same reference numerals are given to the same components as those shown in FIGS. 10 and 11, and the description thereof is omitted to avoid duplication.

  A two-divided hologram pattern is formed on the hologram element 13, and one of the half-circle regions among the divided regions of the hologram pattern 18 is a hologram pattern 18 a and the other is a hologram pattern 18 d. The laser light diffracted by the hologram pattern 18a is indicated by an arrow L12, and the laser light diffracted by the hologram pattern 18d is indicated by an arrow L15. A region that receives the laser beam L15 diffracted by the hologram pattern 18d is defined as a light receiving region 41e.

The position adjustment fixing unit 25 uses two characteristic signals of FES and MSB to adjust the position at which the hologram element 13 on which the two-part hologram pattern is formed is fixed to the device body. FES and MSB are respectively defined by the following equations.
FES = V _a −V _b
MSB = (V _a + V _b ) ÷ V _e
Here, V _e indicates an output voltage value from the light receiving region 41 _e .

  The position adjustment fixing unit 25 corrects the predetermined threshold “1” for the MSB based on the first-order diffraction efficiency ratio of each hologram pattern 18. The position adjustment fixing unit 25 calculates the MSB correction threshold based on the ratio between the first-order diffraction efficiency value of the hologram pattern 18a and the first-order diffraction efficiency value of the hologram pattern 18d. The MSB correction threshold value is calculated by “first-order diffraction efficiency value of hologram pattern 18a ÷ first-order diffraction efficiency value of hologram pattern 18d”.

  For example, when the first-order diffraction efficiency of the hologram pattern 18a is “0.8” and the first-order diffraction efficiency of the hologram pattern 18d is “1.0”, the MSB correction threshold value is “0.8 ÷ 1. “0” is calculated as “0.8”.

  FIG. 16 is a plan view showing a second comparative example in which the position of the hologram element 13 on which the two-part hologram pattern is formed is calculated without calculating the MSB correction threshold value. In the second comparative example, when the first-order diffraction efficiencies of the hologram patterns 18a and 18d are not uniform, the position adjustment and fixing unit 25 adjusts the position of the hologram element 13 by the predetermined threshold value “1” of the MSB. Indicates. It is assumed that the first-order diffraction efficiency of the hologram pattern 18a is “0.8” and the first-order diffraction efficiency of the hologram pattern 18d is “1.0”.

  In the second comparative example shown in FIG. 16, the center C1 of the hologram pattern 18 is adjusted to a position shifted in the Y2 direction from the center C2 of the laser beam. This is a result of adjusting the position of the hologram element 13 so that the hologram pattern 18a having relatively low first-order diffracted light efficiency receives more laser light than the hologram pattern 18d having higher first-order diffracted light efficiency. .

  FIG. 17 is a front view showing a part of the chucking mechanism of the holding and conveying unit 22 according to another embodiment of the present invention. FIG. 18 is a plan view showing a part of the chucking mechanism of the holding and conveying unit 22 according to another embodiment of the present invention. In the other embodiments shown in FIGS. 17 and 18, the same components as those in the embodiments shown in FIGS. 5 and 6 are denoted by the same reference numerals, and the description thereof is omitted to avoid duplication.

  The chucking mechanism includes a first chucking claw 46 and a second chucking claw 47. The holding and conveying unit 22 can press the hologram element 13 in the Z2 direction, which is a direction perpendicular to the upper surface where the hologram pattern 18 is formed, and in the region where the hologram pattern 18 is formed, the direction Z is perpendicular to the upper surface. Open in the direction.

  The first chucking claw 46 and the second chucking claw 47 hold the hologram element 13 by sandwiching the side surface of the hologram element 13 from the Y direction, that is, the direction orthogonal to the light diffraction direction by the hologram pattern 18. The first chucking claw 46 and the second chucking claw 47 are in contact with each other so as to cover the Y-direction end of the surface facing the Z1 direction of the hologram element 13 and the surface facing the Y2 direction.

  The first chucking claw 46 and the second chucking claw 47 can press the hologram element 13 against the device body in the Z2 direction with a pressure of several tens of gf, for example, while holding the hologram element 13. . The first chucking claw 46 and the second chucking claw 47 are formed in a shape that can uniformly press the upper surface of the hologram element 13, that is, the end in the Y direction of the surface on which the hologram pattern 18 is formed.

  The first chucking claw 46 and the second chucking claw 47 open in the Z1 direction and the Z2 direction of the region where the hologram pattern 18 of the hologram element 13 is formed in a state where the hologram element 13 is held. Thus, the first chucking claw 46 and the second chucking claw 47 are diffracted at an angle of 45 to 60 degrees with respect to the axis of the laser light when the laser light traveling in the Z1 direction is irradiated onto the hologram pattern 18. Does not obstruct the optical path of the diffracted light.

  FIG. 19 is a perspective view for explaining the measurement of the optical characteristics of the hologram element 13 by the measurement unit 23 according to another embodiment of the present invention. In the other embodiment shown in FIG. 19, the same components as those in the embodiment shown in FIG. 9 are denoted by the same reference numerals, and description thereof is omitted to avoid duplication.

  The measurement unit 23 is configured to further include an aperture 51 between the condenser lens 38 and the hologram element 13. The aperture 51 is formed in a plate shape and is installed in parallel to the upper surface and the lower surface of the hologram element 13. A circular aperture opening 52 is formed in the aperture 51. The laser beam for measurement focused by the condenser lens 38 and directed in the Z1 direction is blocked by the aperture 51 and travels toward the hologram element 13 from the opening region defined by the aperture opening 52.

  The aperture 51 and the condensing lens 38 make the area of the measurement laser light irradiated to the divided area of the hologram element 13 smaller than the area of the divided area. The hologram pattern 18 has a diameter of 1.1 mm, for example, and the laser beam spot irradiated on the hologram pattern 18 has a diameter of 0.2 mm, for example.

  In another embodiment, a light source unit including a laser light source, a condensing lens 38 and an aperture 51 is arranged in parallel with the upper surface of the hologram element 13 with the held hologram element 13 and measurement light receiving element 37 fixed in position. By moving, the measurement light spot is individually incident on each hologram pattern 18 in the divided area, and the light quantity of the first-order diffracted light is measured by the measurement light receiving element 37.

  The operation of the light source unit is performed using the operation axes arranged in the light source unit, which are movable in parallel to the upper surface on which the hologram pattern 18 is formed and which are orthogonal to each other. The resolution of the operation axis for position adjustment of the hologram element 13 is, for example, 0.1 micrometer (abbreviation: “μm”) / pulse, and the operation axis at the time of optical measurement is, for example, 1 μm / pulse. In order to arrange two types of operation axes with different resolutions in the limited dimensional configuration of the holding and conveying unit 22, the structure is complicated and the dimensional arrangement is difficult, so the resolution of 1 μm / pulse is provided on the light source unit side. The operation axis is arranged.

  As described above, the hologram laser device manufacturing apparatus 2 transmits the laser light to the device body including the light source element 11 that emits the laser light and the light receiving element 12 that receives the reflected light of the laser light emitted from the light source element 11. When the hologram element 13 formed by dividing the hologram pattern 18 that diffracts the reflected light into a plurality of divided regions is fixed, the reflected light diffracted by the hologram element 13 is received by the light receiving element 12, and the received light is received. The position of the hologram element 13 relative to the device body is adjusted so that the value of the characteristic signal indicated by the output of the element 12 matches a predetermined threshold value. The hologram laser device manufacturing apparatus 2 includes a holding and conveying unit 22, a measuring unit 23, and a position adjusting and fixing unit 25. The holding and conveying unit 22 holds the hologram element 13. The measurement unit 23 includes a measurement light source element 36 that emits measurement laser light and a measurement light receiving element 37 that receives the measurement laser light emitted from the measurement light source element 36. The measurement unit 23 emits measurement laser light from the measurement light source element 36 to the hologram element 13 held by the holding and conveying unit 22, and the measurement laser light diffracted by the hologram element 13 is measured. The optical characteristics of the hologram pattern 18 are measured on the basis of the received light receiving element 37 for measurement. The position adjustment fixing unit 25 calculates a correction threshold value obtained by correcting a predetermined threshold value based on the optical characteristics of the hologram pattern 18 measured by the measurement unit 23, and the output of the light receiving element 12 provided in the device body is used as the correction threshold value. The position of the hologram element 13 with respect to the device main body is adjusted so that the values of the characteristic signals indicated by.

  The hologram laser device manufacturing apparatus 2 adjusts the position of the hologram element 13 relative to the device body with the target position in the optical design, that is, the position where the center point of the laser beam and the center point of the hologram element 13 substantially coincide with each other. . The predetermined threshold value used when adjusting the position of the hologram element 13 is set on the assumption that the optical characteristics of the hologram pattern 18 are uniform in each divided region of the hologram element 13.

  The measurement unit 23 can measure the optical characteristics of the hologram element 13 and detect variations in the optical characteristics in each divided region. Accordingly, the position adjustment fixing unit 25 can correct the predetermined threshold value based on the variation in the optical characteristics of the hologram element 13. Therefore, the position adjustment / fixing unit 25 can individually correct the predetermined threshold value for each hologram element 13 and determine the fixed position of the hologram element 13 according to the optical characteristics of the hologram element 13.

  Accordingly, the hologram laser device manufacturing apparatus 2 appropriately adjusts the hologram element 13 and the device body so that the hologram element 13 and the device main body are fixed at the intended positions in the optical design even if the hologram element 13 has a variation in optical characteristics. Can do. Therefore, the hologram laser device manufacturing apparatus 2 can manufacture a high-quality hologram laser device 1 having excellent characteristics such as focus signal balance, radial signal balance, and jitter.

  Further, the hologram laser device manufacturing apparatus 2 appropriately adjusts the position of the hologram element 13 relative to the device main body with respect to the hologram element 13 that has been discarded in the past due to variations in optical characteristics. The device 1 can be manufactured. Thereby, the hologram laser device manufacturing apparatus 2 can improve the yield rate when manufacturing the hologram laser device 1 and improve the production efficiency.

  Further, the holding and conveying unit 22 can press the hologram element 13 in a direction perpendicular to the upper surface, which is one surface on which the hologram pattern 18 is formed, and in a direction perpendicular to the upper surface in the region where the hologram pattern 18 is formed. It is open.

  Accordingly, the holding and conveying unit 22 causes the measurement unit 23 to measure the optical characteristics of the hologram element 13 without interfering with the measurement laser light from the measurement light source element 36 and the measurement laser light diffracted by the hologram element 13. be able to. Further, the holding and conveying unit 22 stabilizes the position of the hologram element 13 and the device book by pressing the hologram element 13 in the vicinity of the position where the device main body is to be fixed, so that the hologram is transferred to the position adjustment fixing unit 25. The position of the element 13 can be adjusted appropriately.

  Accordingly, the holding and conveying unit 22 can sequentially perform the measurement of the optical characteristics by the measurement unit 23 and the adjustment of the position by the position adjustment fixing unit 25 while holding the hologram element 13. Thereby, the hologram laser device manufacturing apparatus 2 can manufacture the hologram laser device 1 efficiently.

  Further, the measurement laser light emitted from the measurement light source element 36 has substantially the same wavelength as the laser light that can be emitted from the light source element 11 provided in the device body. Although the optical characteristics of the hologram pattern 18 vary depending on the wavelength of light, the measurement unit 23 can accurately obtain the same measurement result as that measured using the light source element 11 of the device body. Accordingly, the position adjustment fixing unit 25 can calculate the correction threshold value based on the measured optical characteristics, and can accurately adjust the position of the hologram element 13.

  Furthermore, the hologram laser device manufacturing apparatus 2 further includes a measurement unit 23 that is a pass / fail determination unit and a discard unit 24. The pass / fail determination unit determines pass / fail of the hologram element 13 based on the optical characteristics of the hologram element 13 measured by the measurement unit 23. The discard unit 24 can store the hologram element 13. When the hologram element 13 is determined to be defective by the quality determination unit, the holding and conveying unit 22 releases the holding of the hologram element 13 and stores the hologram element 13 in the discard unit 24. When the hologram element 13 is determined to be a non-defective product by the quality determination unit, the holding and conveying unit 22 maintains the holding with respect to the hologram element 13 and the position adjustment fixing unit 25 adjusts the position of the hologram element 13 with respect to the device body.

  As a result, the holding and conveying unit 22 can efficiently sort non-defective products and defective products by maintaining or releasing the holding of the hologram element 13 according to the result of the quality determination. Further, the hologram laser device manufacturing apparatus 2 uses the measurement result of the optical characteristics of the hologram element 13 obtained by the measurement unit 23 to determine whether the hologram element 13 is good or bad by the good or bad judgment unit, and a predetermined threshold value by the position adjustment fixing unit 25. It can be used for correction. Therefore, the hologram laser device manufacturing apparatus 2 can increase the production efficiency of the hologram laser device 1 by effectively utilizing the measured optical characteristics.

  Furthermore, the measurement unit 23 further includes a condenser lens 38 that condenses the measurement laser light emitted from the measurement light emitting element. The measurement unit 23 uses the condensing lens 38 to make the area of the measurement laser light irradiated to the divided area of the hologram element 13 smaller than the area of the divided area.

  As a result, the measurement unit 23 irradiates the measurement laser light for each divided region and causes the measurement light receiving element 37 to receive the measurement laser light diffracted by the hologram pattern 18 formed in each divided region. it can. Therefore, the measurement unit 23 can accurately measure the optical characteristics of the hologram element 13 for each divided region.

  Furthermore, the optical characteristic of the hologram element 13 measured by the measurement unit 23 is first-order diffraction efficiency. The first-order diffraction efficiency indicates the ratio of the light amount of the measurement laser light that is first-order diffracted by the hologram pattern 18 formed in the divided region to the light amount of the measurement laser light irradiated to the divided region.

  As a result, the hologram laser device manufacturing apparatus 2 receives the light that is first-order diffracted by the hologram element 13 and is applied to the light receiving element 12 out of the amount of reflected light from the optical disk when the hologram laser device 1 reads a signal from the optical disk. You can know the ratio of.

  Furthermore, the optical characteristic of the hologram element 13 measured by the measurement unit 23 is a first-order diffraction efficiency ratio. The first-order diffraction efficiency ratio indicates the ratio of the first-order diffraction efficiency between hologram patterns in each divided region. The first-order diffraction efficiency is a ratio of the light quantity of the measurement laser light that is first-order diffracted by the hologram pattern 18 formed in the divided area to the light quantity of the measurement laser light irradiated to the divided area.

  As a result, the measurement unit 23 can digitize the difference in the first-order diffraction efficiency between the hologram patterns in each divided region. Therefore, the position adjustment fixing unit 25 appropriately adjusts the position of the hologram element 13 with respect to the device body based on the first-order diffraction efficiency ratio, that is, the value indicating the variation in the first-order diffraction efficiency between the hologram patterns in each divided region. be able to.

  Further, the hologram pattern 18 formed in each divided region is different in the direction in which the measurement laser beam is diffracted. The measurement unit 23 has one measurement light receiving element 37. The measurement unit 23 sequentially receives the light diffracted by the hologram pattern 18 formed in each divided region using one measurement light receiving element 37, and the first-order diffraction efficiency between the hologram patterns in the divided regions. Measure the ratio.

  If the first-order diffraction efficiency of each divided region is measured using a plurality of measurement light receiving elements 37, it is difficult to make the light reception sensitivities of the plurality of measurement light reception elements 37 completely the same, and the measurement results An error occurs. Since the measurement unit 23 is configured to use one measurement light receiving element 37, it is possible to accurately measure the first-order diffraction efficiency ratio between the hologram patterns in the divided regions.

  Further, in the configuration using one measurement light receiving element 37, the number of parts can be reduced as compared with the configuration using a plurality of measurement light receiving elements 37. Thereby, the cost of the hologram laser device manufacturing apparatus 2 and the hologram laser device 1 can be reduced.

  Further, the divided region is divided by a straight line that bisects at least the region where the hologram pattern 18 is formed. The first direction is the surface direction of the top surface of the hologram element 13 on which the hologram pattern 18 is formed, and the direction perpendicular to the straight line that divides into two is the first direction, and the direction that is parallel to the straight line that divides into two is the first direction. The direction is 2. The direction in which the position adjustment fixing unit 25 adjusts the position of the hologram element 13 with respect to the device body is at least one of the first direction and the second direction.

  In the hologram element 13, for example, there is one in which a region where the hologram pattern 18 is formed is divided into two or three by one straight line or two straight lines orthogonal to each other. If the first-order diffraction efficiency of each divided region is different, the position of the hologram element 13 with respect to the device body is shifted in the direction perpendicular to the straight line dividing the hologram pattern 18 region and in the surface direction of the upper surface on which the hologram pattern 18 is formed. .

  Therefore, the position adjustment fixing unit 25 can correct the hologram element 13 having a variation in the first-order diffraction efficiency in each divided region in a direction in which the position shift of the hologram element 13 with respect to the device body is expected. Thereby, the position adjustment fixing unit 25 can surely correct the fixing position of the hologram element 13 with respect to the device main body to the fixing position intended by the optical design.

  Further, the hologram laser device 1 is manufactured by the hologram laser device manufacturing apparatus 2. Thus, in the hologram laser device 1, the hologram element 13 and the device body are adjusted and fixed at the intended positions by optical design. Therefore, the hologram laser device 1 can stably exhibit excellent characteristics such as focus signal balance, radial signal balance, and jitter. Moreover, since the hologram laser device 1 is manufactured by the hologram laser device manufacturing apparatus 2 with high production efficiency, the cost can be kept low.

DESCRIPTION OF SYMBOLS 1 Hologram laser device 2 Hologram laser device manufacturing apparatus 11 Light source element 12 Light receiving element 13 Hologram element 14 Submount 15 Stem 16 Cap 18 Hologram pattern 21 Hologram element supply unit 22 Holding conveyance unit 23 Measurement unit 24 Disposal unit 25 Position adjustment fixing unit 26 Main body supply / recovery unit 31 First chucking claw 32 Second chucking claw 33 Chucking opening 36 Measuring light source element 37 Measuring light receiving element 38 Condensing lens 41 Light receiving area 42 Light receiving area dividing line 46 First chucking claw 47 Second chucking claw 51 Aperture 52 Aperture opening

Claims (10)

A device body comprising a light source element that emits laser light and a light receiving element that receives reflected light of the laser light emitted from the light source element, and a hologram pattern that transmits the laser light and diffracts the reflected light has a plurality of divided regions When the hologram element formed by being divided into two is fixed, the reflected light diffracted by the hologram element is received by the light receiving element, and the value of the characteristic signal indicated by the output of the received light receiving element is a predetermined threshold value A hologram laser device manufacturing apparatus that adjusts the position of the hologram element relative to the device body so as to match
A holding unit for holding the hologram element;
A measuring light source element for emitting a measuring laser beam and a measuring light source element for receiving the measuring laser beam emitted from the measuring light source element and held by the holding unit. Measurement laser light is emitted from the element, the measurement laser light diffracted by the hologram element is received by the measurement light receiving element, and the optical characteristics of the hologram pattern are measured based on the received output of the measurement light receiving element And
Based on the optical characteristics of the hologram pattern measured by the measurement unit, a correction threshold value obtained by correcting the predetermined threshold value is calculated, and the value of the characteristic signal indicated by the output of the light receiving element included in the device body is calculated as the correction threshold value. And a position adjusting unit that adjusts the position of the hologram element with respect to the device main body so that they coincide with each other.   The holding portion is capable of pressing the hologram element in a direction perpendicular to the one surface on which the hologram pattern is formed, and is open in a direction perpendicular to the one surface in the region where the hologram pattern is formed. The hologram laser device manufacturing apparatus according to claim 1, wherein:   3. The hologram laser according to claim 1, wherein the measurement laser light emitted from the measurement light source element has substantially the same wavelength as the laser light that can be emitted from the light source element provided in the device main body. Device manufacturing equipment. Based on the optical characteristics of the hologram element measured by the measurement unit, a pass / fail determination unit for determining pass / fail of the hologram element;
A storage section capable of storing the hologram element;
When the quality determination unit determines that the hologram element is defective, the holding unit releases the hold on the hologram element and stores the hologram element in the storage unit, and the quality determination unit determines that the hologram element is non-defective. When it is determined, the holding unit maintains the holding of the hologram element, and the position adjusting unit adjusts the position of the hologram element with respect to the device main body. The hologram laser device manufacturing apparatus as described.   The measuring unit further includes a condensing lens that condenses the measuring laser light emitted from the measuring light emitting element, and the measuring laser is applied to the divided region of the hologram element using the condensing lens. The hologram laser device manufacturing apparatus according to claim 1, wherein an area of light is smaller than an area of the divided region.   The optical characteristic of the hologram element measured by the measurement unit is the amount of light of the measurement laser light that is first-order diffracted by the hologram pattern formed in the divided region with respect to the amount of measurement laser light irradiated to the divided region. The hologram laser device manufacturing apparatus according to any one of claims 1 to 5, wherein the hologram laser device has a first-order diffraction efficiency indicating a ratio.   The optical characteristic of the hologram element measured by the measurement unit is the amount of light of the measurement laser light that is first-order diffracted by the hologram pattern formed in the divided region with respect to the amount of measurement laser light irradiated to the divided region. The hologram according to any one of claims 1 to 5, wherein the ratio is a first-order diffraction efficiency ratio indicating a ratio of the first-order diffraction efficiency between hologram patterns in each divided region, where the ratio is a first-order diffraction efficiency. Laser device manufacturing equipment. The hologram pattern formed in each of the divided regions has different directions for diffracting the measurement laser beam,
The measurement unit has one light receiving element for measurement,
The measurement unit sequentially receives light diffracted by the hologram pattern formed in each divided region using one measurement light receiving element, and performs first-order diffraction efficiency between the hologram patterns in the divided regions. The hologram laser device manufacturing apparatus according to claim 7, wherein the ratio is measured. The divided region is divided by a straight line that bisects at least the region where the hologram pattern is formed, and is in the surface direction of one surface of the hologram element on which the hologram pattern is formed and in a direction perpendicular to the straight line that is divided into two As the first direction, the surface direction of the one surface, and the direction parallel to the straight line divided into two as the second direction,
The hologram according to claim 7 or 8, wherein a direction in which the position adjusting unit adjusts the position of the hologram element with respect to the device body is at least one of a first direction and a second direction. Laser device manufacturing equipment.   A hologram laser device manufactured by the hologram laser device manufacturing apparatus according to claim 1.

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