JP5069960B2 - Semiconductor light emitting device - Google Patents

Description

  The present invention relates to a semiconductor light emitting device including a semiconductor light emitting element as a light source.

  FIG. 5 shows an example of a conventional semiconductor light emitting device (see, for example, Patent Document 1). The semiconductor light emitting device X shown in the figure includes leads 91A and 91B, an LED chip 92, and a resin package 93, and is configured as a so-called bullet-type LED lamp. An LED chip 92 is mounted on the lead 91A. The LED chip 92 is connected to the lead 91B by a wire. The resin package 93 is made of a material that transmits light from the LED chip 92, and covers the LED chip 92 and each of the leads 91A and 91B. A lens 93 a is formed on the resin package 93. The lens 93a plays a role of directing light from the LED chip 92 toward the optical axis L. Portions of the leads 91A and 91B exposed from the resin package 93 are terminals 91Aa and 91Ba. The semiconductor light emitting device X is mounted by solder S in a state where the terminals 91Aa and 91Ba are inserted through the substrate B. Thus, the semiconductor light emitting device X is used as a so-called top view type light source that emits light in a direction perpendicular to the direction in which the substrate B spreads.

  However, in a state where the semiconductor light emitting device X is mounted, only the relatively thin terminals 91Aa and 91Ba support the resin package 93 which is a relatively large portion. For example, when an external force is applied to the resin package 93 from a direction perpendicular to the direction in which the leads 91Aa and 91Ba are arranged, the leads 91Aa and 91Ba are easily bent. In such a case, problems such as a large shift in the direction of light emitted from the semiconductor light emitting device X occurred.

JP 2003-188418 A

  The present invention has been conceived under the circumstances described above, and an object thereof is to provide a semiconductor light emitting device that can be mounted in a posture in which it does not easily fall.

The semiconductor light emitting device provided by the present invention includes a semiconductor light emitting element having a first pole and a second pole, a first lead conducting to the first pole of the semiconductor light emitting element, and the second pole of the semiconductor light emitting element. A semiconductor light emitting device comprising: a second lead that is electrically connected to the semiconductor light emitting device; and a resin package that covers the semiconductor light emitting element, the first lead, and a part of the second lead, and includes a lens positioned in front of the semiconductor light emitting element. In the apparatus, each of the first lead and the second lead is formed in an L shape continuously with the strip-like column portion protruding from the opposite side of the lens in the resin package and the column portion. A band-shaped surface mounting portion for surface mounting, and the surface mounting portion of the first lead and the surface mounting portion of the second lead are arranged in the optical axis direction of the lens. And in the direction of the vertical, it is characterized by extending so differ from each other toward the inside of the resin package in the optical axis direction as viewed.

According to such a configuration, the semiconductor light emitting device can be surface mounted on the circuit board by using the respective surface mounting portions formed on the first and second leads . The first and second leads are not easily bent even when an external force is applied from any direction. Therefore, the semiconductor light emitting device can be mounted on a circuit board or the like so as not to easily fall down.

In a preferred embodiment of the present invention, the first lead and the second lead further have an upright portion that is bent and extended from the front end of the surface mounting portion toward the resin package . According to such a configuration, it is possible to more firmly support the semiconductor light emitting device by forming a good solder fillet with the upright portion. This is advantageous for preventing the semiconductor light emitting device from collapsing.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 4 show a first embodiment of a semiconductor light emitting device according to the present invention. The semiconductor light emitting device A of this embodiment includes leads 1A and 1B, an LED chip 2, and a resin package 3, and is configured as a bullet-type LED lamp.

The leads 1A and 1B are used for mounting the semiconductor light emitting device A on a circuit board and supplying power to the LED chip 2, and are made of, for example, a Cu alloy. A part of each of the first and second leads 1A and 1B is covered with the resin package 3. As shown in FIGS. 1 and 2, a bonding cup 10 is formed on the first lead 1A. The bonding cup 10 is a cone-shaped portion having a bottom surface, and the first pole side of the LED chip 2 is mounted on the bottom surface.

The portions of the first and second leads 1A and 1B exposed from the resin package 3 are surface mount portions 11A and 11B and standing portions 12A and 12B. As shown in FIG. 3, the surface mounting portions 11A and 11B are substantially band-like portions extending in the direction y, and are parallel to each other. As can be understood from FIGS. 3 and 4, the first and second leads 1 </ b > A and 1 </ b > B are exposed to the resin package 3 at different positions in the direction y. That is, the surface mounting portion 11A and the surface mounting portion 11B are opposite to each other in the direction in which the front ends thereof face each other. The standing portions 12A and 12B are portions extending from the surface mounting portions 11A and 11B in the direction z. The standing portions 12A and 12B are portions that promote the formation of so-called solder fillets when the semiconductor light emitting device A is surface-mounted. In the present embodiment, the upright portions 12A and 12B are substantially U-shaped.

The LED chip 2 is a light source of the semiconductor light emitting device A, and is a semiconductor light emitting element having, for example, an n-type semiconductor layer and a p-type semiconductor layer, and an active layer sandwiched between them. As electrons and holes recombine in the active layer, the LED chip 2 emits light having a wavelength determined by the material. The LED chip 2 is bonded to the bottom surface of the bonding cup 10. The second pole on the upper surface of the LED chip 2 is electrically connected to the second lead 1 </ b > B via the wire 4. Light emitted from the LED chip 2 in the direction x or the direction y travels in the direction z by being reflected by the side surface of the bonding cup 10.

The resin package 3 covers the LED chip 2 and each of the first and second leads 1A and 1B, and is made of, for example, epoxy resin or silicone resin that can transmit light from the LED chip 2. A lens 3 a is formed on the resin package 3. The lens 3a is located in front of the LED chip 2, and its optical axis L extends along the direction z. The lens 3 a is for increasing the directivity of light from the LED chip 2.

  Next, the operation of the semiconductor light emitting device A will be described.

According to the present embodiment, the semiconductor light emitting device A can be surface mounted on the circuit board by using the surface mounting portions 11A and 11B. Further, the first and second leads 1A and 1B are not easily bent even if an external force is applied from either the direction x or the direction y. Therefore, the semiconductor light emitting device A can be mounted on a circuit board or the like so as not to easily fall down.

  In addition, the semiconductor light emitting device A can be supported more firmly by forming a good solder fillet with the upright portions 12A and 12B. This is advantageous in preventing the semiconductor light emitting device A from falling.

  The semiconductor light emitting device according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the semiconductor light emitting device according to the present invention can be varied in design in various ways.

1 is a plan view showing a first embodiment of a semiconductor light emitting device according to the present invention. It is sectional drawing which follows the II-II line | wire of FIG. It is a bottom view of the semiconductor light-emitting device shown in FIG. It is a front view of the semiconductor light-emitting device shown in FIG. It is sectional drawing which shows an example of the conventional semiconductor light-emitting device.

A Semiconductor light emitting device L Optical axis 1A First lead
2B Second lead 2 LED chip (semiconductor light emitting device)
3 Resin package 3a Lens 4 Wire 10 Bonding cup 11A, 11B Mounting part 12A, 12B Standing part

Claims (5)

A semiconductor light emitting device having a first pole and a second pole ;
A first lead conducting to the first pole of the semiconductor light emitting device and a second lead conducting to the second pole of the semiconductor light emitting device;
A resin package that covers the semiconductor light emitting element and a part of each of the first lead and the second lead, and has a lens positioned in front of the semiconductor light emitting element;
A semiconductor light emitting device comprising:
Each of the first lead and the second lead is a surface-mount formed by forming a strip-like column portion projecting from the opposite side of the lens in the resin package and an L shape continuously with the column portion. A band-shaped surface mounting portion for,
The surface mounting portion of the first lead and the surface mounting portion of the second lead are different from each other in the direction perpendicular to the optical axis direction of the lens toward the inside of the resin package in the optical axis direction view. A semiconductor light emitting device characterized by extending in the manner described above . 2. The semiconductor light emitting device according to claim 1, wherein each of the first lead and the second lead further includes an upright portion that is bent and extended from a front end of the surface mounting portion toward the resin package . The semiconductor light emitting device according to claim 2, wherein each of the first lead and the second lead has a through hole in a continuous portion of the surface mounting portion and the upright portion. The first lead has a bonding cup for mounting the first pole side of the semiconductor light emitting element inside the resin package, and the second lead is the semiconductor light emitting inside the resin package. The semiconductor light-emitting device according to claim 1, wherein the semiconductor light-emitting device is connected to the second pole side of the element via a wire. 5. The semiconductor light emitting device according to claim 4, wherein a portion of the first lead that extends from the bonding cup to a side different from the support portion protrudes from the opposite side of the lens in the resin package.

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