JP5074693B2 - Micro electromechanical device - Google Patents

Description

  The present invention relates to a microelectromechanical device.

  Conventionally, a gyro sensor is known as an example of a microelectromechanical device formed by using a micromachining technique (see, for example, Patent Document 1). In addition, as this kind of micro electro mechanical device, not only a gyro sensor but various devices such as an acceleration sensor, a pressure sensor, a micro actuator, a micro valve, and a micro relay are known.

  The gyro sensor (gyroscope) disclosed in Patent Document 1 is, for example, as shown in FIG. 7, a rectangular frame shape that is disposed apart from the support substrate 55 in the Z direction on one surface side of the support substrate 55. The outer frame (first mass body) 54 and the inner frame (second mass body) 52 disposed inside the outer frame 54, and four support portions (outer frame 54 fixed to the support substrate 55 ( Each of the anchors 53 is connected via a flexure 56 extended in the X direction, and the inner frame 52 is connected to the outer frame 54 via four flexures 62 extended in the Y direction. In this case, a plurality of sensing movable electrode pieces 67 arranged in the Y direction and a plurality of the movable electrode pieces 67 arranged in the Y direction are arranged on the opposing surfaces of both sides along the Y direction of the inner frame 52. A driving movable electrode piece 66 is formed continuously and integrally. In the opening window 64 of the inner frame 52, a movable portion for sensing is formed integrally with a support portion (anchor) 65 fixed to the support substrate 55. A plurality of sensing fixed electrode pieces 69 respectively opposed to the piece 67 are arranged in the Y direction, and are continuously formed integrally with a support portion (anchor) 63 fixed to the support substrate 55 to be a movable electrode piece for driving. A plurality of driving fixed electrode pieces 68 respectively facing 66 are arranged in the Y direction. Therefore, in the gyro sensor having the configuration shown in FIG. 7, the capacitance accompanying the change in the facing area between the sensing movable electrode piece 67 and the sensing fixed electrode piece 69 in a state where the inner frame 52 is vibrated in the X direction. Thus, the vibration in the X direction of the inner frame 52 can be feedback controlled.

  In addition, a plurality of detection movable electrode pieces 70 arranged in the Y direction are continuously and integrally formed on the outer peripheral surface of the outer frame 54, and are fixed to the support substrate 55 on the outer side of the outer frame 54. In addition, a large number of detection fixed electrode pieces 72 and 74 that are continuously formed integrally with the support portions (anchors) 73 and 75 and face the detection movable electrode pieces 70 are arranged in the Y direction. In use, different DC voltage sources are connected to the detection fixed electrode piece 72 and the detection fixed electrode piece 74.

  In the gyro sensor having the configuration shown in FIG. 7 described above, when the driving voltage is applied to the driving fixed electrode piece 68 and the inner frame 52 is vibrated in the X direction, the angular velocity around the axis in the Y direction acts. Since Coriolis force is generated in the frame 54, the outer frame 54 and the inner frame 52 are displaced in the Y direction. Since the displacement amount of the outer frame 54 in the Y direction can be measured by the output of the outer frame 54 (the output of the movable electrode piece 70 for detection), the vibration in the X direction applied to the inner frame 52 and the output of the outer frame 54 are used. The Coriolis force can be calculated, and when the Coriolis force is calculated, a value corresponding to the angular velocity can be obtained. The integrated circuit chip cooperating with the above-described gyro sensor is mounted in a separate package from the gyro sensor.

In the gyro sensor described above, an oxide film, which is mostly a sacrificial layer, is formed on the support substrate 55, then a polycrystalline silicon layer is formed on the oxide film, and the polycrystalline silicon layer is surface micromachined. Each component is formed by processing with technology.
JP-T-2001-515201 (paragraphs [0015] to [0022], [0043] to [0045], and FIGS. 2 and 8)

  In the microelectromechanical device disclosed in Patent Document 1 above, a plurality of components of the gyro sensor are separately formed on one surface side of the support substrate 55 and are electrically insulated from each other. In the assembly process, in order to electrically connect each component to other components and external electrodes, one end of the bonding wire is connected to each component pad (not shown) by, for example, an ultrasonic thermocompression method or an ultrasonic method. In this case, when one end of the bonding wire is connected to a component separated from the support substrate 55, the component is easily damaged. In addition, the microelectromechanical device disclosed in Patent Document 1 needs to be further sealed after being mounted on a package or the like, and it has been difficult to reduce the size.

  The present invention has been made in view of the above reasons, and an object of the present invention is to provide a microelectromechanical device in which components of the microelectromechanical device are not easily damaged during manufacture and the entire device can be miniaturized. .

  A microelectromechanical device different from the present invention includes a frame-like frame in which components of the microelectromechanical device are arranged inside, and a semiconductor substrate bonded to the frame over the entire circumference of the frame on one surface side of the frame. The sealing substrate includes at least a wiring electrically connected to a component of the microelectric machine, and cooperates with the microelectric machine on one surface side to be joined to the frame. An integrated circuit is formed, the integrated circuit is electrically connected to the wiring, and the wiring is an external connection electrode formed on the other surface side opposite to the one surface side on which the integrated circuit is formed. The contact electrode formed on the one surface side and facing the external connection electrode, and the external connection electrode and the contact electrode facing the external connection electrode are interposed between and electrically connected to each other A through wire that is characterized by comprising a metal wire for electrically connecting the integrated circuit and the contact electrode. Here, the micro electromechanical means a micro electro mechanical system (MEMS) or a nano electro mechanical system (NEMS) in a narrow sense in which integrated circuits are not integrated.

  According to this microelectromechanical device, the components of the microelectromechanical device are electrically connected to the wiring formed on the sealing substrate by bonding the sealing substrate to the frame. Since there is no need to bond a bonding wire to the micro electromechanical component, it is difficult to damage the components of the micro electro mechanical device during manufacturing, and an integrated circuit that cooperates with the micro electro mechanical device is formed on one surface side of the sealing substrate that is bonded to the frame. Since the integrated circuit is electrically connected to the wiring, the entire micro electromechanical device including the integrated circuit cooperating with the micro electro machine can be reduced in size and integrated with the micro electro machine. The length of wiring with the circuit can be shortened. Further, according to the microelectromechanical device, the sealing substrate includes, as the wiring, the external connection electrode formed on the other surface side opposite to the one surface side on which the integrated circuit is formed, and the one surface side. An electrode for contact opposite to the electrode for external connection, a through wiring interposed between the electrode for external connection and the electrode for contact opposite to the electrode for external connection, and electrically connecting both, and an integrated circuit Since the outer peripheral shape of the sealing substrate can be aligned with the outer peripheral shape of the frame, the entire microelectromechanical device can be further reduced in size. It becomes possible.

According to the first aspect of the present invention, there are provided a support substrate, a plurality of components of the microelectromechanical device, each of the plurality of components separately and independently arranged on one surface side of the support substrate, A frame-shaped frame connected to the one surface of the support substrate, and a sealing substrate made of a semiconductor substrate disposed opposite to the support substrate with the frame interposed therebetween and bonded to the frame over the entire periphery of the frame. The sealing substrate includes at least a plurality of wirings that are electrically connected to the components of the microelectric machine, and an integrated circuit that cooperates with the microelectric machine on one surface facing the support substrate. The integrated circuit is formed and electrically connected to a part of the plurality of wirings, and the wiring connected to the component of the microelectromechanical device is a component bonded to a support substrate. A first contact electrode that is electrically connected to overlap the pads formed on the side opposite to the bonding surface of the supporting substrate, a first metal wiring which is electrically connected to a first contact electrode the provided, as a pre-Symbol part of the wiring, and the one surface on which an integrated circuit is formed and the external connection electrodes formed on the other surface side opposite to the external connection formed on said one surface a second co Ntakuto electrode you face the use electrode, and a through wiring for electrically connecting interposed both between the second co Ntakuto electrode you face the external connection electrode and the external connection electrode characterized by comprising a second metals interconnection you electrically connecting the integrated circuit and the second co Ntakuto electrode. Here, the micro electric machine means a MEMS or NEMS in a narrow sense in which an integrated circuit is not integrated.

According to this invention, the plurality of constituent elements of the micro electric machine are electrically connected to the plurality of wirings formed on the sealing substrate by joining the sealing substrate to the frame, and the constituent elements of the micro electric machine are arranged. Since the wiring connected to the substrate overlaps with the pad formed on the side opposite to the bonding surface with the support substrate in the component bonded to the support substrate, the wiring is electrically connected. Since there is no need to bond a bonding wire to the component pad, the component of the microelectromechanical device is less likely to be damaged during manufacturing. Since a separate package is not required, the entire device can be downsized, and one surface side of the sealing substrate that faces the support substrate An integrated circuit that cooperates with a micro-electro machine is formed, and the integrated circuit is electrically connected to a part of the plurality of wirings. Therefore, the micro-electro-mechanical device including the integrated circuit that cooperates with the micro-electro machine The overall size can be reduced, and the wiring length between the micro electric machine and the integrated circuit can be shortened. Further, according to the present invention, the sealing substrate, and the previous SL part before Symbol wiring, external connection electrodes formed on the other surface side opposite to said one surface on which an integrated circuit is formed If, interposed between the second co Ntakuto electrode formed on the one surface side you face the electrode for external connection, the second co Ntakuto electrode you face the electrode and the external connection electrode for external connection and a through wiring for electrically connecting both, is provided with the second metals interconnection you electrically connecting the integrated circuit and the second co Ntakuto electrode, the frame peripheral shape of the sealing substrate The outer peripheral shape can be made uniform, and further miniaturization of the entire microelectromechanical device can be achieved.

  The invention of claim 2 is characterized in that, in the invention of claim 1, the space surrounded by the sealing substrate, the support substrate and the frame is maintained in a vacuum.

  According to the present invention, compared to the case where the space surrounded by the sealing substrate, the support substrate, and the frame is an air atmosphere, the component that becomes the movable part among the plurality of components of the micro-electric machine becomes easy to move. . Therefore, if the micro electrical machine is a sensor such as a gyro sensor or an acceleration sensor, the sensitivity of the sensor can be increased.

  According to the first aspect of the present invention, there are effects that the components of the micro-electric machine are hardly damaged at the time of manufacture and that the entire device can be downsized.

  The microelectromechanical device of this embodiment will be described with reference to FIGS.

  In this embodiment, as shown in FIGS. 1 to 3, a micro electro mechanical device in which a gyro sensor 1 that is a micro electro machine and an integrated circuit 4 that cooperates with the gyro sensor 1 is integrated is illustrated. Here, the integrated circuit 4 includes a control circuit that controls the operation of the gyro sensor 1, a signal processing circuit that performs appropriate signal processing on the output signal of the gyro sensor 1, and the like.

  The microelectromechanical device of this embodiment is formed by performing bulk micromachining on a semiconductor substrate (hereinafter referred to as a first semiconductor substrate) made of a silicon substrate on one surface side of a support substrate 2 made of a glass substrate. Most of the components of the gyro sensor 1 are arranged.

  In the gyro sensor 1, a driving mass body 11 and a detection mass body 12 whose outer peripheral shape is rectangular in a plan view are arranged along one surface of the support substrate 2 on one surface side of the rectangular plate-like support substrate 2. In addition, a frame 10 (rectangular frame shape in the present embodiment) surrounding the periphery of the drive mass body 11 and the detection mass body 12 is formed. 1 and 4, the direction in which the drive mass body 11 and the detection mass body 12 are aligned is the Y direction, and one surface of the support substrate 2 (upper surface in FIG. 1). The direction perpendicular to the Y direction in the plane along the direction X is defined as the X direction, and the direction perpendicular to the X direction and the Y direction (that is, the thickness direction of the support substrate 2) is defined as the Z direction. A similar orthogonal coordinate system is also illustrated in each of FIGS. 2, 3, 5, and 6. FIG.

  The drive mass body 11 and the detection mass body 12 are continuously and integrally connected via a pair of drive springs 13 extended in the X direction. That is, the slit groove 14a that is slightly shorter than the entire length of the detection mass body 12 in the X direction, and the two slit grooves 14b that are open on one side edge of the driving mass body 11 in the X direction and are aligned on a straight line in the X direction. The drive springs 13 are formed between the slit grooves 14a and the respective slit grooves 14b. One end of each drive spring 13 is continuous between each end of the slit groove 14a and the side edge of the detection mass body 12, and the other end of each drive spring 13 is driven at a portion between the two slit grooves 14b. Each of the mass bodies 11 is continuous. The drive spring 13 is a torsion spring capable of torsional deformation, and the drive mass body 11 is displaceable around the drive spring 13 with respect to the detection mass body 12. That is, it can be said that the driving mass body 11 can translate in the Z direction and rotate around the axis in the X direction with respect to the detection mass body 12. Further, since a torsion spring is used as the drive spring 13, it is not necessary to reduce the size of the drive spring 13 in the thickness direction of the first semiconductor substrate (the thickness direction of the support substrate 2), and the drive spring 13 is formed. It is easy to process.

  One end of the detection spring 15 extended in the Y direction is connected to each side edge in the X direction of the detection mass body 12, and the other ends of the detection springs 15 are connected to the connecting pieces 16 extended in the X direction. Are connected continuously and integrally. That is, the pair of detection springs 15 and the connecting piece 16 form a U-shaped member in plan view. However, the connecting piece 16 is designed to be sufficiently rigid as compared with the drive spring 13 and the detection spring 15. A fixing piece 17 projects from an intermediate portion of the connecting piece 16 in the longitudinal direction, and the fixing piece 17 is joined to the support substrate 2 and fixed at a fixed position. The drive mass body 11 and the detection mass body 12 are separated from the detection spring 15 and the connecting piece 16 by a U-shaped slit groove 14c, and one end of the slit groove 14b is continuous with the slit groove 14c. The detection spring 15 can be bent and deformed in the X direction, and the drive mass body 11 and the detection mass body 12 can be displaced in the X direction with respect to the fixed piece 17.

  By the way, the detection mass body 12 has four cutout holes 18 penetrating in the thickness direction, and a stator 20 is arranged inside each cutout hole 18. The stator 20 has electrode pieces 21 arranged near both ends of the detection mass body 12 in the X direction. A comb piece 22 is extended from the electrode piece 21 in the X direction, and the electrode piece 21 and the comb piece 22 are extended. And L-shaped. The electrode piece 21 and the comb piece 22 are joined to the support substrate 2, and the stator 20 is fixed in place. The inner peripheral surface of the cutout hole 18 has a shape that follows the shape of the outer peripheral surface of the stator 20, and a gap is formed between the cutout hole 18 and the stator 20. Two electrode pieces 21 are arranged at both ends in the X direction of the detection mass body 12. As shown in FIG. 5, a large number of fixed comb teeth 23 are arranged in the X direction on both end surfaces of the comb bone pieces 22 in the width direction. On the other hand, on the inner surface of the cutout hole 18 and the surface facing the comb bone piece 22, as shown in FIG. 5, a large number of movable comb tooth pieces 24 respectively facing the fixed comb tooth pieces 23 are arranged in the X direction. It is lined up. Each fixed comb tooth piece 23 and each movable comb tooth piece 24 are separated from each other, and the distance between the fixed comb tooth piece 23 and the movable comb tooth piece 24 is changed when the detection mass body 12 is displaced in the X direction. A change in capacitance can be detected. That is, the fixed comb tooth piece 23 and the movable comb tooth piece 24 constitute a detection means for detecting the displacement of the detection mass body 12.

  The gyro sensor 1 is connected to the support substrate 2 by joining the frame 10, the fixed piece 17, and the stator 20 to the support substrate 2. On the other hand, the drive mass body 11 and the detection mass body 12 must be displaceable in the Z direction in the gap formed between the support substrate 2 and, as shown in FIG. A recess 29 is formed on the surface facing the mass body 11 to secure a gap between the driving mass body 11 and the support substrate 2, and the surface facing the support substrate 2 in the detection mass body 12 is retracted from the support substrate 2. (Actually, the concave portion 30 is formed by bulk micromachining on the surface of the first semiconductor substrate that is the basis of the gyro sensor 1 on the surface that faces the support substrate 2). 2 is secured. In other words, a gap 30 is secured between the detection mass body 12 and the support substrate 2 by forming the concave portion 30 by bulk micromachining on the surface of the first semiconductor substrate that is the basis of the gyro sensor 1 facing the support substrate 2. When the gap between the fixed comb tooth piece 23 and the movable comb tooth piece 24 is shortened by providing such a recess 30, the fixed comb tooth piece 23 and the movable comb tooth piece 24 by bulk micromachining are used. The separation process of separating the is facilitated. In such bulk micromachining processing, for example, an anisotropic dry etching technique using an inductively coupled plasma type dry etching apparatus capable of vertical deep digging may be used.

  A fixed drive electrode 25 (see FIG. 1) made of a conductive metal thin film such as an aluminum thin film is formed on the surface of the support substrate 2 facing the drive mass body 11. The gyro sensor 1 includes an electrode piece 26 joined to the support substrate 2 through a portion of the fixed drive electrode 25 that extends to the peripheral portion of the recess 29 of the support substrate 2. A pad 28 made of, for example, an Al—Si film is formed on the surface of each of the electrode pieces 21 and 26. Further, in the illustrated example, a pair of ground pieces 19 are formed in the frame 10 in the vicinity of the fixed piece 17 so as to sandwich the fixed piece 17, and a pad 28 is also formed on one ground piece 19. As described above, each pad 28 of the gyro sensor 1 is formed on each of the fixed piece 17, the four electrode pieces 21, the one electrode piece 26, and the one ground piece 19 joined to the support substrate 2. Yes. Here, one fixed piece 17, four electrode pieces 21, one electrode piece 26, and one ground piece 19 are arranged separately and independently on the one surface side of the support substrate 2. In a state where 3 is not joined to the frame 10, they are electrically insulated from each other.

  Here, the operation of the above-described gyro sensor 1 will be described.

  The gyro sensor 1 applies a prescribed vibration to the drive mass body 11 and detects the displacement of the detection mass body 12 when an angular velocity due to an external force is applied. Here, in order to vibrate the driving mass body 11, a sinusoidal or rectangular oscillation voltage may be applied between the fixed driving electrode 25 and the driving mass body 11. The oscillating voltage is preferably an alternating voltage, but it is not essential to reverse the polarity. The drive mass body 11 is electrically connected to the fixed piece 17 through the drive spring 13, the detection mass body 12, the detection spring 15, and the connecting piece 16, and a pad 28 is formed on the surface of the fixed piece 17. Further, since the fixed drive electrode 25 is electrically connected to the electrode piece 26 and the pad 28 is formed on the surface of the electrode piece 26, the pad 28 on the fixed piece 17 and the pad 28 on the electrode piece 26 are connected. If an oscillating voltage is applied between the driving mass body 11 and the fixed driving electrode 25, an electrostatic force can be applied between the driving mass body 11 and the support substrate 2 to vibrate in the Z direction. If the frequency of the oscillating voltage coincides with the resonance frequency determined by the mass of the drive mass body 11 and the detection mass body 12 and the spring constant of the drive spring 13 and the detection spring 15, a large amplitude can be obtained with a relatively small driving force. Can do.

  In a state where the driving mass body 11 is vibrated, when an angular velocity around the axis in the Y direction acts on the gyro sensor 1, a Coriolis force is generated in the X direction, and the detection mass body 12 (and the driving mass body 11) It is displaced in the X direction with respect to the stator 20. When the movable comb tooth piece 24 is displaced with respect to the fixed comb tooth piece 23, the distance between the movable comb tooth piece 24 and the fixed comb tooth piece 23 is changed, and as a result, the movable comb tooth piece 24 and the fixed comb tooth piece 23 are changed. The capacitance between and changes. Since the change in capacitance can be taken out from the pads 28 connected to the four stators 20, the above gyro sensor 1 can be regarded as having four variable edge capacitance capacitors formed. The displacement of the detection mass body 12 can be detected by detecting the capacitance of each variable capacitor or by detecting the combined capacitance in which the variable capacitors are connected in parallel. Since the vibration of the driving mass body 11 is known, the Coriolis force can be obtained by detecting the displacement of the detection mass body 12.

  Here, since the displacement of the movable comb tooth piece 24 is proportional to (mass of the driving mass body 11) / (mass of the driving mass body 11 + mass of the detection mass body 12), the mass of the driving mass body 11 is detected mass. The larger the mass of the body 12 is, the larger the displacement of the movable comb tooth piece 24 is. As a result, the sensitivity is improved. Therefore, in the present embodiment, the thickness dimension of the drive mass body 11 is made larger than the thickness dimension of the detection mass body 12.

  In manufacturing the above-described gyro sensor 1, after forming the above-described recess 30 on the back surface side of the first semiconductor substrate that is the basis of the gyro sensor 1, the back surface of the semiconductor substrate, the above-described recess 29, and fixing The support substrate 2 on which the drive electrode 25 is formed is joined by anodic bonding, and then the pads 28 are formed, and then the grooves for separating the frame 10, the slit grooves 14a to 14c, and the grooves for separating the stator 20 are formed as described above. A bulk micromachining process is performed in which the semiconductor substrate is formed from the main surface side opposite to the support substrate 2 and separated into each part (each component). At this stage, since the fixed piece 17 is joined to the support substrate 2, the driving mass body 11 and the detection mass body 12 continuing to the fixed piece 17 are held by the support substrate 2, and the stator 20 is also supported. Bonded to the substrate 2. In short, at this stage, the three-dimensional structure of the gyro sensor 1 which is a micro electric machine is completed.

  By the way, the microelectromechanical device of the present embodiment is disposed so as to face the support substrate 2 with the frame 10 interposed therebetween, and is joined to the frame 10 over the entire circumference of the frame 10 on one surface side (the upper surface side in FIG. 1). A sealing substrate 3 made of a semiconductor substrate such as a silicon substrate (hereinafter referred to as a second semiconductor substrate) is provided. A silicon substrate having a relatively low resistivity is used as the first semiconductor substrate serving as the basis of the gyro sensor 1, and silicon having a relatively high resistivity is used as the second semiconductor substrate serving as the sealing substrate 3. A substrate is used. Here, the resistivity of the first semiconductor substrate is set to 0.2 Ωcm, and the resistivity of the second semiconductor substrate is set to 20 Ωcm. However, these numerical values are not particularly limited.

  One integrated circuit 4 and ten contact electrodes 38 are formed on one surface side of the rectangular plate-shaped sealing substrate 3 facing the support substrate 2, and the contact electrode 38 or the integrated circuit 4 is formed. A metal wiring 39 electrically connected to the pad 48 is formed, and three external connection electrodes 36 are formed on the other surface opposite to the surface facing the support substrate 2. Here, each contact electrode 38, each metal wiring 39, and each pad 48 are formed of an Al-Si film. The sealing substrate 3 includes three through-wirings 37 made of a metal material that are interposed between the external connection electrode 36 and the contact electrode 38 facing the external connection electrode 36 to electrically connect them. Is formed. Thus, by bonding the sealing substrate 3 to the frame 10 of the gyro sensor 1, the predetermined pad 28 of the gyro sensor 1 and the predetermined pad 48 of the integrated circuit 4 are electrically connected to each other, as shown in FIGS. A microelectromechanical device having the structure shown is obtained.

  Hereinafter, in describing the electrical connection relationship in the microelectromechanical device of the present embodiment, for convenience of explanation, as shown in FIG. Each code is 38A, 38B, 38C, 38D, 38CC, 38F, 38E, 38AA, 38BB, 38G, and for each external connection as shown in FIG. 2 in order to distinguish the three external connection electrodes 36. The electrode 36 is denoted by 36AA, 36BB, and 36CC, and each pad 28 is denoted by 28A, 28B, 28C, 28D, 28E, 28F, as shown in FIG. This will be described as 28G.

In the present embodiment, the sealing substrate 3 is bonded to the frame 10 on the support substrate 2 so that the pads 28A and 28B of the gyro sensor 1 are contact electrodes 38A and 38B (first contact electrodes 38A and 38B), respectively. And electrically connected. Here, the contact electrode 38A and the contact electrode 38B are more electrically connected to the metal wiring 3 9 interposed therebetween (the first metal wiring 39), a contact electrode 38B are metal wires 3 9 It is electrically connected to the pad 48 (the lower left pad 48 in FIG. 6 ) of the integrated circuit 4 via the (first metal wiring 39) . The pads 28C and 28D of the gyro sensor 1 are electrically connected to contact electrodes 38C and 38D (first contact electrodes 38C and 38D), respectively . Here, the contact electrode 38C and the contact electrode 38D are more electrically connected to the metal wiring 3 9 interposed therebetween (the first metal wiring 39), a contact electrode 38D are metal wires 3 9 It is electrically connected to the pad 48 (the upper left pad 48 in FIG. 6 ) of the integrated circuit 4 via the (first metal wiring 39) . The other pads 28E, 28F, 28G of the gyro sensor 1 are electrically connected to the contact electrodes 38E, 38F, 38G (first contact electrodes 38E, 38F, 38G), respectively . Here, the contact electrodes 38E, 38F, and 38G are electrically connected to the pad 48 of the integrated circuit 4 through the metal wiring 39 (first metal wiring 39), respectively. The remaining contact electrodes 38AA, 38BB, and 38CC (second contact electrodes 38AA, 38BB, and 38CC) are electrically connected to the pad 48 of the integrated circuit 4 through the metal wiring 39 (second metal wiring 39) , respectively. And are electrically connected to the external connection electrodes 36AA, 36BB, and 36CC through the through wirings 37, respectively. The thickness dimensions of the contact electrodes 38 </ b> A to 38 </ b> G may be set so that the electrical connection is ensured by contacting the corresponding pads 28 </ b> A to 28 </ b> G when the sealing substrate 3 is joined to the frame 10. In the present embodiment, a combination of the contact electrode 38 and the metal wiring 39 or a combination of the contact electrode 38, the through wiring 37 and the external connection electrode 36 is electrically connected to the constituent elements of the micro electromechanical device. Wiring is configured.

  In the microelectromechanical device of the present embodiment described above, a plurality of constituent elements of the support substrate 2 and the gyro sensor 1 that are separately and independently arranged on the one surface side of the support substrate 2. (Four stators 20, two grounding pieces 19, one electrode piece 26, a driving mass body 11, two driving springs 13, a detection mass body 12, two detection springs 15, a connecting piece 16 and a fixing piece 17. A single structural body), a rectangular frame 10 in which the plurality of components are arranged on the inside and connected to the one surface of the support substrate 2, and the support substrate 2 across the frame 10 And a sealing substrate 3 bonded to the frame 10 over the entire periphery of the frame 10, and the plurality of wirings electrically connected to the components of the gyro sensor 1 are formed on the sealing substrate 3. The Therefore, since the components of the gyro sensor 1 are electrically connected to the wiring formed on the sealing substrate 3 by bonding the sealing substrate 3 to the frame 10, the pads of the components of the gyro sensor 1 are connected. It is not necessary to bond a bonding wire to 28, so that the components of the gyro sensor 1 are not easily damaged at the time of manufacture, and the gyro sensor 1 is in a sealed space surrounded by the support substrate 2, the frame 10, and the sealing substrate 3. Since the above-described components are housed, a separate package is not required, and the entire device can be downsized. In the present embodiment, when the sealing substrate 3 is joined to the frame 10, vacuum sealing is performed so that the space surrounded by the sealing substrate 3, the support substrate 2, and the frame 10 is maintained in a vacuum. Therefore, compared with the case where the space surrounded by the sealing substrate 3, the support substrate 2, and the frame 10 is an air atmosphere, among the plurality of components of the gyro sensor 1, the movable portion (the driving mass body 11, the detection The component which becomes the mass body 12 or the like) can easily move, and the sensitivity can be increased.

  In the present embodiment, an integrated circuit 4 that cooperates with the gyro sensor 1 is formed on the one surface side of the sealing substrate 3 facing the support substrate 2, and a part of the plurality of wirings is integrated with the integrated circuit 4. Since it is electrically connected, the entire micro electromechanical device including the integrated circuit 4 that cooperates with the gyro sensor 1 can be reduced in size, and the wiring length between the gyro sensor 1 and the integrated circuit 4 can be reduced. There is an advantage that can be shortened. In the present embodiment, the sealing substrate 3 has the external connection electrode 36 formed on the other surface side opposite to the one surface side on which the integrated circuit 4 is formed as the wiring. Since the through-wiring 37 that electrically connects the electrode 4 and the external connection electrode 36 is provided in the thickness direction, the outer peripheral shape of the sealing substrate 3 can be aligned with the outer peripheral shape of the frame 10. It becomes possible to further reduce the size of the entire device.

  In addition, since the microelectromechanical device of the present embodiment forms the gyro sensor 1 by bulk micromachining, the gyro sensor formed by surface micromachining like the gyro sensor described in Patent Document 1 is used. Compared to this, it is possible to form a high-performance gyro sensor 1.

  In the above-described embodiment, the micro electric machine is configured by MEMS in a narrow sense, but the micro electrical machine may be configured by NEMS in a narrow sense. The microelectric machine is not limited to a gyro sensor, and may be, for example, a capacitance type acceleration sensor having a fixed electrode and a movable electrode, or another sensor. In the above-described embodiment, a glass substrate is used as the support substrate 2 and a silicon substrate is used as the first semiconductor substrate that is the basis of the gyro sensor 1 that is a microelectromechanical machine. In other words, one of the SOI substrates in which the silicon substrates are bonded to each other via an insulating film made of a silicon oxide film is used as the support substrate 2, and the other silicon substrate is used as a semiconductor substrate that is the basis of the microelectromechanical system. Is possible.

It is a schematic sectional drawing of the microelectromechanical device in embodiment. It is a schematic plan view of the microelectromechanical device in the same as the above. It is a schematic front view of the microelectromechanical device in the same as the above. It is a schematic plan view before joining a sealing substrate in the same as the above. It is a principal part enlarged view in the same as the above. It is a schematic bottom view of the sealing substrate in the same as the above. It is a schematic plan view which shows a prior art example.

DESCRIPTION OF SYMBOLS 1 Gyro sensor 2 Support substrate 3 Sealing substrate 4 Integrated circuit 10 Frame 11 Drive mass body 12 Detection mass body 13 Drive spring 16 Connection piece 17 Fixed piece 19 Ground piece 20 Stator 23 Fixed comb tooth piece 24 Movable comb tooth piece 25 Fixed Drive electrode 28 Pad 29 Recess 30 Recess 36 External connection electrode 37 Through wiring 38 Contact electrode 39 Metal wiring 48 Pad

Claims (2)

A support substrate, a plurality of components of the micro-electromechanical device, each of which is separated and independently disposed on one surface side of the support substrate, and the plurality of components are disposed on the inner side of the support substrate. A frame-like frame connected to the one surface, and a sealing substrate made of a semiconductor substrate that is arranged to face the support substrate across the frame and is bonded to the frame over the entire periphery of the frame, and the sealing substrate includes at least In addition, a plurality of wirings that are electrically connected to the constituent elements of the micro electric machine are formed, and an integrated circuit that cooperates with the micro electric machine is formed on one surface side facing the support substrate. The wiring that is electrically connected to a part of the plurality of wirings and that is connected to the component of the microelectromechanical device is bonded to the support substrate in the component bonded to the support substrate. Comprising a first contact electrode connected overlaps the pads formed on the opposite side electrically, and a first metal wiring which is electrically connected to a first contact electrode and, of the wiring as a pre-Symbol part, you face the opposite and external connection electrodes formed on the other surface side, the external connection electrodes formed on the one surface side to the one surface on which an integrated circuit is formed a second co Ntakuto electrode, a through wiring for electrically connecting interposed both between the second co Ntakuto electrode you face the external connection electrode and the external connection electrodes, the integrated circuit and the second micro-electromechanical device, characterized by comprising a second metals interconnection you electrically connecting the co Ntakuto electrode.   2. The microelectromechanical device according to claim 1, wherein a space surrounded by the sealing substrate, the support substrate, and the frame is maintained in a vacuum.

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