JP5080509B2 - IC inlet built-in paper manufacturing method - Google Patents

Description

 The present invention relates to a method for producing IC inlet built-in paper.

  In recent years, RFID (Radio Frequency Identification) systems capable of writing and reading information without contact have become widespread in product management and document management. As an interface of the RFID system, an IC tag or IC in which an IC inlet having a semiconductor (IC) chip and an antenna for transmitting and receiving information electrically connected to the IC chip is inserted into a substrate such as paper IC inlet built-in paper such as recording paper with an inlet is often used.

  As a method of manufacturing a paper with a built-in IC inlet, a method of making an IC inlet between paper layers is known. When the IC inlet is made between the paper layers, the IC inlet is pasted from above the first wet paper while the first paper (wet paper) and the second paper (wet paper) are made together. A method of attaching an IC inlet from below the first wet paper has been studied.

However, in the method of attaching the IC inlet from the lower side of the first wet paper, a method of attaching the IC inlet from the upper side of the first wet paper has been proposed (for example, a patent) Reference 1).
In Patent Document 1, the first wet paper is formed on the paper web a, and then the IC inlet is installed on the surface of the first wet paper from above the first wet paper. A method is disclosed in which the second wet paper provided on the different papermaking nets b and the first wet paper are made together. Further, as a combination of the papermaking a and the papermaking b, a long network and a circular network, a short network and a circular network, a combination of a circular network and a circular network, and the like are disclosed.

JP 2007-122222 A

  However, as described in Patent Document 1, in the method of attaching the IC inlet from above the first wet paper, the second wet paper is used to combine the first wet paper and the second wet paper. However, it is necessary to make paper using a papermaking net different from that of the first wet paper (that is, by using a papermaking machine installed in parallel with a long web for making the first wet paper).

  In addition, when the first wet paper is made with a circular mesh, usually, the first wet paper is transferred onto the endless felt. Face) is facing down. Therefore, in order to attach the IC inlet from the upper side of the first wet paper, the first wet paper has to be reversed with a guide roll or the like so that the wire surface faces upward.

For the reasons described above, the method of attaching the IC inlet from above the first wet paper requires a certain amount of space for installation of the apparatus, and is not suitable for space saving. In addition, the device tends to be complicated.
Therefore, the present inventors have made a plurality of circular nets (circular circles) arranged in series along the traveling direction of the endless felt, both in the first wet paper and the second wet paper, from the viewpoint of space saving and simplification of the apparatus. A papermaking machine was used to make paper, and during that time, the method of attaching the IC inlet from below the first wet paper was examined again.

  However, in order to prevent the IC inlet from falling, the IC inlet must be positively pressed against the first wet paper. However, when the IC inlet is pressed, a so-called disturbance of the texture such as a mark that remains pressed on the wet paper tends to occur, and the appearance failure of the obtained IC inlet built-in paper tends to occur.

  The present invention has been made in view of the circumstances described above, and is a method for manufacturing a paper with a built-in IC inlet in which space saving and simplification of the apparatus are possible, and the disturbance of the texture is suppressed without dropping the IC inlet. The purpose is to provide.

  As a result of intensive studies, the present inventors have found that the first wet paper is used while making the first wet paper and the second wet paper using a circular paper machine in which a plurality of circular nets are arranged in series. It was found that by applying air from below to attach the IC inlet, it was possible to suppress the disturbance of the texture while preventing the IC inlet from falling, and the present invention was completed.

The present invention employs the following configuration.
[1] A method for producing a paper with a built-in IC inlet, in which an IC inlet having an antenna and an IC chip provided on the base material is provided between wet papers, the first circular net A first step of transferring the first wet paper formed on the endless felt; and on the downstream side in the traveling direction of the endless felt, on the wire surface of the first wet paper from the lower side of the wire surface A second step of attaching an IC inlet, and a second circular net arranged in series downstream of the first circular net in the traveling direction of the endless felt after the second step. And a third step of combining the second wet paper with the wire surface of the first wet paper on the endless felt, and the second step is configured such that air directed from below to the wire surface is transferred to the IC. Characterized by the process of spraying on the inlet Method of manufacturing the IC inlet built-in paper.
[2] The IC inlet built-in paper manufacturing method according to [1], wherein the IC inlet further includes an adhesive layer provided on a substrate.
[3] The IC inlet built-in paper manufacturing method according to [2], further including a fourth step of applying an adhesive to the IC inlet from the side opposite to the adhesive layer.
[4] In the second step, before the step of blowing air to the IC inlet, a plurality of IC inlets are continuously attached to the release paper through the adhesive layer, and the release paper with the inlet is wound into a roll. A step of unwinding the release paper with an inlet from the taken-up inlet roll, and a step of peeling the IC inlet from the release paper with an inlet immediately before air is blown, and the fourth step is with the inlet The method for producing paper with a built-in IC inlet according to [3], wherein the process is performed after the release paper is fed from the inlet roll until the IC inlet is peeled off.
[5] Any of [2] to [4], wherein the second step is a step of blowing air from the opposite side of the adhesive layer to the IC inlet with the adhesive layer facing the wire surface. A method for producing a paper with a built-in IC inlet according to claim 1.
[6] The method for producing an IC inlet built-in paper according to any one of [1] to [5], wherein the air is continuously blown.

  According to the method for producing a paper with a built-in IC inlet of the present invention, it is possible to save space and simplify the apparatus, and it is possible to produce a paper with a built-in IC inlet in which the disturbance of the texture is suppressed without dropping the IC inlet.

It is a figure which shows typically an example of the manufacturing apparatus of IC inlet built-in paper used with the manufacturing method of IC inlet built-in paper of this invention. It is an enlarged view of the sticking means with which the IC inlet built-in paper manufacturing apparatus of FIG. 1 is equipped. It is a figure which shows an example of the release paper with an inlet, Comprising: (a) is a top view, (b) is A-A 'sectional drawing of (a). It is a principal part enlarged view of the sticking means of FIG. It is an enlarged view which shows the other example of a sticking means.

An embodiment of a method for producing a paper with a built-in IC inlet according to the present invention will be described.
The IC inlet built-in paper manufacturing method of the present invention includes a first step of transferring the first wet paper formed by the first circular net onto the endless felt, and a downstream side in the traveling direction of the endless felt. A second step of attaching the IC inlet to the wire surface of the first wet paper from below the wire surface, and a second wet paper formed by a second circular net after the second step. And a third step of making a sheet on the wire surface of the first wet paper on the endless felt.

FIG. 1 shows an example of an IC inlet built-in paper manufacturing apparatus used in the IC inlet built-in paper manufacturing method of this embodiment. An IC inlet built-in paper manufacturing apparatus 1 in this example includes an endless felt 10, a first paper making means 20 for forming and transferring a first wet paper on the endless felt 10, and an IC inlet on the first wet paper. Pasting means 30, a second paper making means 40 for making a second wet paper on the first wet paper via an IC inlet, and a third wet paper on the second wet paper. A third paper making means 50 is provided.
1 to 5, the dimensional ratio is different from the actual one for convenience of explanation.

The first paper making means 20 includes a first circular net 21, a first couch roll 22, and a first paper making tank 23. In the first paper making tank 23, a stock serving as a raw material for the first wet paper is stored.
The second paper making means 40 includes a second circular net 41, a second couch roll 42, and a second paper making tank 43. In the second papermaking tank 43, a stock serving as a raw material for the second wet paper is stored.
The third paper making means 50 includes a third circular net 51, a third couch roll 52, and a third paper making tank 53. In the third papermaking tank 53, a stock serving as a raw material for the third wet paper is stored.
As the circular net and the couch roll provided in each paper making means, known circular nets and couch rolls used in a circular net paper machine can be used.

The second paper making means 40 is arranged in series with the first paper making means 20 downstream of the first paper making means 20 in the traveling direction of the endless felt 10.
The third paper making means 50 is arranged in series with the first paper making means 20 and the second paper making means 40 on the downstream side in the traveling direction of the endless felt 10 from the second paper making means 40.

The material used as the raw material for the first wet paper, the second wet paper, and the third wet paper may be the same type or different types. It may be appropriately selected and used accordingly. As such a paper material, a pulp that can be used for a laminated paper is preferable.
The material of the pulp is not particularly limited. For example, chemical pulp such as hardwood bleached kraft pulp (LBKP) and softwood bleached kraft pulp (NBKP); Stone Grand Pulp (GP), Pressurized Stone Grand Pulp (PGW), Refiner Grand Pulp (RGP), Chemi-Grand Pulp (CGP), Thermomechanical Pulp (TMP) and other mechanical pulp; Deinked waste paper pulp; Synthetic pulp and the like. These pulps may be used alone or in combination of two or more.

As shown in FIG. 1, the sticking means 30 is provided between the first paper making means 20 and the second paper making means 40 arranged in series along the traveling direction of the endless felt 10.
For example, as shown in FIG. 2, the sticking means 30 includes a release paper feed roll 32 that feeds the release paper 31 with the inlet attached to the release paper 315 by the IC inlet 310, and an inlet that is fed from the release paper feed roll 32. A guide roll 33 that supports the running of the release paper 31, an inlet peeling jig 34 that is used to peel the IC inlet 310 from the release paper 31 with an inlet, and a release paper that is separated by the inlet peeling jig 34. Air is blown to the IC inlet 310 peeled off by the release paper winding roll 35 for winding 315 and the inlet peeling jig 34, and the IC inlet 310 is attached to the first wet paper 24 on the endless felt 10 by air pressure. And an air supply head 36 for attaching an inlet.

As shown in FIG. 2, the release paper 31 with an inlet has a piece of IC inlet 310 continuously adhered to the release paper 315, and the release paper is fed out as an inlet roll wound up in a roll shape. Attached to the roll 32.
FIG. 3 shows an example of the release paper 31 with an inlet. 3A is a top view of the release paper 31 with an inlet, and FIG. 3B is a cross-sectional view taken along line AA ′ of FIG. In FIG. 3A, an adhesive layer 314 and a release paper 315 described later are omitted for convenience.
In this example of the release paper 31 with an inlet, an IC inlet 310 having an antenna 312, an IC chip 313, and an adhesive layer 314 provided on the base material 311 is provided via the adhesive layer 314. It is stuck on.
Hereinafter, in the present invention, the surface of the substrate 311 on the side where the antenna 312, the IC chip 313, and the adhesive layer 314 are provided is referred to as “the inner surface of the substrate”, and the antenna 312, the IC chip 313, and the adhesive layer 314 are provided. The surface of the substrate 311 on the non-side is referred to as the “outer surface of the substrate”.

Each member constituting the IC inlet 310 is as follows.
Examples of the base material 311 include paper, plastic laminated paper, and plastic film. Among these, a plastic film is preferable from the viewpoint of excellent smoothness and a thin thickness.
The thickness of the base material 311 is generally about 10 to 200 μm, but if the base material 311 is thin, the IC inlet 310 is difficult to peel from the release paper 31 with an inlet. On the other hand, when the base material is thick, winding of the release paper 31 with the inlet becomes large in a limited installation space, so that the number of inlets affixed to the winding is reduced and the replacement frequency of the winding is increased. Decreases. Therefore, the thickness of the base material 311 is preferably 20 to 100 μm, and more preferably 20 to 60 μm.

As the antenna 312, a metal foil such as aluminum or a metal wire such as silver, copper, or aluminum patterned by an etching method, a printing method, or the like so as to increase sensitivity can be used. Further, as the antenna 312, for example, a substantially flat antenna coil as shown in FIG. 1 may be used, and its thickness is generally about 10 to 30 μm, but the thickness of the paper finally obtained is As the thickness of the antenna 312 decreases, it is preferable to reduce the thickness of the antenna 312 within a usable range.
In the case of the IC inlet 310 shown in FIG. 3, the antenna 312 is connected to an IC chip 313 to be described later, and is arranged so as to be spread left and right on the inner surface of the base material 311. The antenna 312 has a slit 316 along the connection portion with the IC chip 313.

Examples of the IC chip 313 include those that can be applied to all frequency bands that are permitted to be used for IC tags. Specifically, IC chips that can handle frequencies such as 13.56 MHz band, UHF band, and 2.45 GHz band. Is mentioned. As such an IC chip 313, for example, an IC chip sold by Infineon, Fujitsu, Philips or the like can be used.
The IC chip 313 is generally commercially available with a thickness of 150 μm or less, but is preferably one third or less of the thickness of the paper finally obtained. For example, when paper is made on thin paper (wet paper) such as office paper, the thickness of the IC chip 313 is generally about 45 μm. However, if the IC chip 313 is too thin, the IC chip 313 may preferably have a thickness of 30 to 100 μm because it may not be able to withstand the pressing pressure of the roll necessary for manufacturing the built-in paper.
The vertical and horizontal lengths of the IC chip 313 are generally about 0.4 to 10 mm. However, if the vertical and horizontal lengths are too long, the IC inlet built-in paper is wound into a roll in the manufacture of the IC inlet built-in paper. Since the IC inlet is stressed and communication is not possible, it is preferable that the vertical and horizontal lengths of the IC chip 313 are short.

The adhesive layer 314 is a layer made of an adhesive. Examples of the pressure-sensitive adhesive include acrylic, rubber-based, vinyl ether-based, urethane-based, and polyester-based pressure-sensitive adhesives. As the acrylic pressure-sensitive adhesive, there are an emulsion type, a solvent type, a hot melt type and the like, and any type can be used. Among these pressure-sensitive adhesives, hot-melt pressure-sensitive adhesives that can be thermocompression bonded when the wet paper is dried are suitable.
The thickness of the adhesive layer 314 is generally 1 to 30 μm, but is not particularly limited.

The thickness of the IC inlet 310 is usually about 60 to 250 μm, but is preferably less than or equal to half of the thickness of the paper finally obtained. What is necessary is just to determine, adjusting each thickness of the material 311, the antenna 312, the IC chip 313, and the adhesion layer 314.
The size of the IC inlet 310 is usually about 40 to 100 mm for the long side and about 4 to 20 mm for the short side, but is not limited thereto. However, a smaller size is preferable because it does not affect the dehydration of the wet paper when it is made between the wet paper.

  The IC inlet is not limited to the structure shown in FIG. 3, for example, an IC inlet in which an IC chip is interposed between the base material and the antenna, or after providing the antenna and IC chip on the inner side surface of the base material, An IC inlet or the like that is covered with a second base material such as a film and has an adhesive layer on the second base material may be used.

Examples of the release paper 315 include high-density paper such as glassine paper, clay-coated paper, kraft paper, high-quality paper, or the like, so-called polylaminate paper obtained by laminating a resin film such as polyethylene.
The thickness of the release paper 315 is generally about 5 to 300 μm, but if it is too thick, the release paper 315 is less likely to become an acute angle at a later-described release point 34a, so that the IC inlet 310 is released from the release paper 31 with an inlet. May be difficult. Therefore, the release paper 315 is easily bent at the release point 34a, and the IC inlet 310 is easily peeled off, and the release paper 315 after the IC inlet is peeled off is less bulky when the release paper 315 is taken up by the release paper take-up roll 35. Considering this point, it is preferable that the release paper 315 is thin. However, if the release paper 315 is too thin, the release paper 315 may be stretched, and the interval between the IC inlets 310 continuously attached to the release paper 315 is not constant. In this case, it may be difficult to attach the first wet paper 24 to the first wet paper 24. Therefore, the thickness of the release paper 315 is preferably 30 to 70 μm.

  The release paper 31 with an inlet can be manufactured by a known method. A commercially available product may also be used.

Inlet peeling jig 34 shown in FIG. 2, the vertical distance _{D 1} of the the separation point 34a of the IC inlet 310 is peeled off from the inlet with release paper 31 until the wire surface 24a of the first wet paper web 24 is 3~30mm It is preferable to be installed so that If the distance D ₁ is 3mm or more, without interfering with the running of the first wet paper web 24, and without causing the disturbance of the formation, it is possible to paste the IC inlet 310. On the other hand, the distance _{D 1} is equal to 30mm or less, when paste IC inlet 310, can be prevented from falling. The distance _{D 1} is 5~15mm is more preferable. In consideration of the peelability when the IC inlet 310 is peeled from the release paper 31 with the inlet, the angle θ at the peeling point 34a of the inlet peeling jig 34 is preferably an acute angle, specifically, the angle θ is 5 to 30 ° is preferable.
Here, the “wire surface of the first wet paper” is a surface on the side where the first wet paper comes into contact with the first circular net.

As shown in FIG. 4, the inlet-attached air supply head 36 has a vertical distance D2 of ₁ to 20 mm from the tip opening 36b of the nozzle 36a to the outer surface of the base of the IC inlet 310 to which air is blown. It is preferable to be installed. If the distance _{D 2} is 1mm or more, without interfering with the travel of the inlet with release paper 31, it is possible to blow air to the IC inlet 310. On the other hand, if the distance D ₂ is too long, it shifted or sticking direction and attaching position of the IC inlet 310, which may IC inlet 310 to the first of the wet paper is lost or without being stuck. However, if the distance D ₂ is 20mm or less, there is no need to increase the supply amount of the air. The distance _{D 2} is 1~5mm is more preferable.
4 is an enlarged view of a portion surrounded by a dotted line in FIG. 2 and a diagram immediately after the IC inlet 310 is completely peeled from the release paper 31 with the inlet at the peeling point 34a from the state shown in FIG. is there. In FIG. 4, the same components as those in FIGS.

In addition, the inlet attachment air supply head 36 has, on the outer side surface of the base material, the end portion 311a of the both ends and the portion located directly above the center 36c of the nozzle 36a and the upper portion 311b. The length L ₁ from the upper part 311b to the end 311a is the length of the substrate in the running direction of the release paper 31 with the inlet (that is, the IC inlet 310 in the running direction of the release paper 31 with the inlet). length) preferably is installed such that 20 to 80% of the _{L 2.} Within the length L ₁ is within the above range, IC inlet 310 is set to be substantially parallel to the first wet paper 24 can be pasted on the wire surface 24a of the first wet paper web 24. The length _{L 1} is 40 to 60% of the length _{L 2} of the long side is more preferable.
Moreover, it is preferable that the upper part 311b is a center position in the width direction of the release paper 31 with an inlet.

The shape of the nozzle opening of the nozzle 36a is not particularly limited, and examples thereof include a round shape and a polygonal shape. If the nozzle 36a has a nozzle opening that is too small, air may be concentrated on one point of the first wet paper and the texture may be disturbed. Therefore, it is preferable that the diameter of the nozzle opening is not less than the length of the IC inlet 310 in the width direction. However, if the aperture is too large, the outlets of adjacent IC inlets tend to overlap. Therefore, the diameter of the nozzle opening is preferably 2 mm or more and 100 to 150% of the length of the IC inlet 310 in the width direction.
The diameter of the nozzle opening means the diameter when the shape is round, and the diameter of the circle circumscribed by the nozzle opening when the shape is polygonal.

Examples of the air blown from the inlet attachment air supply head 36 include air and compressed air.
The range in which air hits the base material of the IC inlet is not particularly limited. However, if the range is too narrow, air will be concentrated on one point, and there is a risk of disturbance of the formation.

  In the IC inlet built-in paper manufacturing method using the IC inlet built-in paper manufacturing apparatus 1 shown in FIG. 1, first, the first circular net 21 provided in the first paper making means 20 is rotated in the first paper making tank 23. Accordingly, the stock layer generated on the first circular net 21 is sucked through the endless felt 10 by the first couch roll 22, and the formed first wet paper is transferred onto the endless felt 10. (First step).

  On the other hand, the inlet-attached release paper 31 is fed out from the inlet roll attached to the release paper feed roll 32 of the sticking means 30 shown in FIG. For example, when the sticking means 30 includes the guide roll 33, the guide roll 33 supports the running of the release paper 31 with the inlet while traveling to the peeling point 34a of the inlet peeling jig 34, and the inlet peeling is performed at the peeling point 34a. The release paper 31 with an inlet is sharply bent by the jig 34, and the IC inlet 310 and the release paper 315 are separated. The release paper 315 is taken up by a release paper take-up roll 35. On the other hand, the IC inlet 310 is exposed so that the adhesive layer provided on the inner side surface of the substrate faces the wire surface 24 a of the first wet paper 24. The peeling of the IC inlet 310 can be adjusted by the angle θ at the peeling point 34a of the inlet peeling jig 34, the adhesiveness of the adhesive layer of the IC inlet 310, the rigidity of the substrate, the peeling performance of the release paper 315, and the like.

Then, air is blown out from the air supply head 36 for attaching an inlet, air is blown to the outer surface of the base material of the separated IC inlet 310, and the wire surface 24 a of the first wet paper 24 on the endless felt 10 is The IC inlet 310 is pasted from below 24a (second step). At this time, since the adhesive layer of the IC inlet 310 faces the wire surface 24a of the first wet paper 24, the IC inlet 310 sticks to the first wet paper 24 so that the adhesive layer and the wire surface 24a are in contact with each other. .
Note that “below the wire surface” means the lower side in the vertical direction with respect to the wire surface.

The direction in which air is blown onto the outer surface of the substrate of the IC inlet 310 may be completely along the vertical line or may be an oblique direction inclined from the vertical line. However, since the wire surface is a substantially horizontal surface that faces downward until it passes through the third paper making means 50, it is possible to apply the IC inlet to the wire surface at equal intervals by spraying in the direction along the vertical line. Is preferable.
Further, when the moving speed when the first wet paper 24 passes through the sticking means 30 is fast, the first wet paper 24 may be sprayed obliquely from the rear side in the traveling direction of the first wet paper 24.

In the second step, the IC inlet 310 is attached to the first wet paper 24 while being pressed by air pressure by blowing air onto the IC inlet 310. Therefore, the IC inlet can be prevented from dropping. In addition, since the IC inlet is affixed by air pressure, the load on the first wet paper sheet 24 is less likely to be applied compared to the method of pressing the IC inlet with a solid jig such as a pressing plate. Hard to occur.
Conditions for preventing disturbance of texture and IC inlet application conditions vary depending on the moisture content of the wet paper, as will be described later. Furthermore, it tends to be different depending on the diameter and shape of the nozzle opening and the distance in the vertical direction from the nozzle opening to the wire surface of the first wet paper. When a nozzle with a nozzle diameter of 4 mm is used for one wet paper and the air is blown from a position where the distance from the tip of the nozzle to the wire surface of the first wet paper is 10 mm, the air wind speed is 5 to 5 mm. The speed is preferably about 200 m / second. If the air wind speed is within the above range, the disturbance of the texture can be effectively prevented and the IC inlet can be attached to the first wet paper without dropping.

Also, in the second step, the release paper with the inlet is continuously fed out, and the IC inlet is attached to the wire surface of the first paper making, so that the wire surface of the traveling first wet paper is continuously IC inlet can be pasted. At that time, it is preferable to continuously blow air. By continuously blowing air, air is always applied to the wire surface 24a of the traveling first wet paper 24, so that air pressure is easily applied uniformly, and disturbance of the texture can be further suppressed.
In the present invention, “continually blowing air” means that air is continuously blown out from the air supply head for attaching an inlet, and the air is supplied only when the IC inlet is above the air supply head for attaching an inlet. Is not to blow out.

  After the second step, the second circular net 41 provided in the second paper making means 40 shown in FIG. 1 is rotated in the second paper making tank 43, and is generated on the second circular net 41 accordingly. The stock layer is sucked by the second couch roll 42 through the endless felt 10 and the first wet paper, and the second wet paper is put on the wire surface of the first wet paper on the endless felt 10 ( Third step).

  Further, after the third step, the third circular net 51 provided in the third paper making means 50 is rotated in the third paper making tank 53, and the paper material generated on the third circular net 51 in accordance therewith is rotated. The layer is sucked by the third couch roll 52 through the endless felt 10, the first wet paper and the second wet paper, and the third wet paper is put on the wire surface of the second wet paper on the endless felt 10. Combine.

Through the above-described steps, the IC inlet is incorporated between the first wet paper and the second wet paper.
Since the IC inlet is moistened immediately after the paper is drawn between the wet papers, it is usually squeezed and dehydrated via a roll or felt and dried with a multi-cylinder dryer or Yankee dryer. To do. Moreover, you may apply | coat solutions, such as starch, to the paper surface after drying dryer as needed (size press process). By the size pressing process, surface strength and water resistance can be imparted to the resulting IC inlet built-in paper. The obtained IC inlet built-in paper is wound up by a winder or the like, stored and transported.

  The IC inlet built-in paper obtained as described above may be subjected to a coating treatment on the surface as necessary. Since the IC fiber built-in paper usually has exposed pulp fibers, the surface tends to be uneven. By applying a coating on the surface and applying a coating, and providing a coating layer having a function according to the purpose, a paper with a built-in IC inlet having a uniform surface, high smoothness and excellent printability can be obtained. . As the coating material, a known coating material used for coating treatment can be used.

The method for producing the IC inlet built-in paper of the present invention is not limited to the above-described method. For example, another paper making means equipped with a paper making net is provided upstream of the first paper making means 20 in the IC inlet built-in paper producing apparatus 1. One or more wet paper webs may be arranged to form one or two or more wet paper webs before the first step and transferred onto the endless felt.
Examples of papermaking nets provided in other papermaking means include circular nets, long nets, and short nets. However, if a circular net is used as the papermaking net, other papermaking means can be arranged in series upstream of the first papermaking means 20 in the direction of travel of the endless felt 10, which saves space and simplifies the apparatus. It is preferable in terms of conversion.

Further, the IC inlet built-in paper may be manufactured using a manufacturing apparatus in which the third paper making means 50 is not installed, and one or more other paper making means are further provided downstream of the third paper making means 50. After forming the third wet paper, one or two or more layers of wet paper may be made on the wire surface of the third wet paper.
Examples of papermaking nets provided in other papermaking means provided downstream of the third papermaking means 50 include a circular net, a long net, and a short net. However, if a circular net is used as the papermaking net, other papermaking means can be arranged in series downstream of the third papermaking means 50 in the traveling direction of the endless felt 10, so that the apparatus can be saved in space and simplified. It is preferable in terms of conversion.

  Thus, by performing papermaking before the first step or after the third step, an IC inlet built-in paper in which three or more layers of wet paper are laminated is obtained. The number of wet paper layers may be set as appropriate according to the application of the IC inlet built-in paper. For example, when the thickness of the IC inlet built-in paper is increased, the number of wet paper webs may be increased. However, delamination tends to occur more easily as the number of wet paper layers on which paper is made increases.

In addition, in the method for manufacturing the IC inlet built-in paper of the present invention, when the IC inlet 310 is separated from the release paper 31 with the inlet in the second step, for example, as shown in FIG. A sticking means 30 in which a release paper feed roll 32, a guide roll 33, an inlet peeling jig 34, and a release paper take-up roll 35 are disposed so as to face the wire surface 24a of one wet paper 24 may be used. . Then, the IC inlet 310 may be attached to the wire surface 24 a of the first wet paper 24 by blowing air from the adhesive layer side provided on the inner side surface of the substrate. In this case, the IC inlet 310 is attached to the first wet paper 24 so that the outer surface of the substrate and the wire surface 24a are in contact with each other.
In FIG. 5, the same components as those in FIGS. Moreover, although the sticking means 30 shown in FIG. 5 includes the guide roll 33, the sticking means 30 may or may not include the guide roll.

  By the way, in order for the IC inlet to adhere to the first wet paper regardless of the adhesive strength of the adhesive layer, the surface tension due to the moisture of the first wet paper is important. In order to obtain an appropriate surface tension of water, the wet paper was formed by the first paper making means so that the moisture content of the wet paper was 70 to 95% by mass (that is, the paper stock concentration was 5 to 30% by mass). It is preferred to transfer the first wet paper onto the endless felt. When the moisture content is 70% by mass or more, the IC inlet can be prevented from falling from the first wet paper. On the other hand, if the moisture content is 95% by mass or less, the first wet paper web can be prevented from falling from the endless felt. In particular, a moisture content of 70 to 85% by mass is preferable because disturbance of the texture of the wet paper due to air pressure can be more easily prevented.

Furthermore, in the method for producing a paper with a built-in IC inlet of the present invention, it is preferable to apply a pressure-sensitive adhesive or an adhesive to the IC inlet from the side opposite to the pressure-sensitive adhesive layer (that is, on the outer surface of the substrate).
As shown in FIG. 2, in the case where the second step is a step of blowing air from the outer surface of the base material to the IC inlet 310 having the adhesive layer facing the wire surface 24a of the first wet paper 24, between the wet papers. In the IC inlet to be made, the adhesive layer and the first wet paper are in contact with each other, and the outer surface of the base material is in contact with the second wet paper. It is preferable to apply a pressure-sensitive adhesive or an adhesive on the outer surface of the base material because the adhesiveness between the IC inlet of the IC inlet built-in paper finally obtained and the surrounding pulp is improved.
On the other hand, as shown in FIG. 5, when the second step is a step of blowing air from the adhesive layer side to the IC inlet 310 with the outer surface of the substrate facing the wire surface 24a of the first wet paper 24, In the IC inlet that is made between papers, the outer surface of the substrate and the first wet paper are in contact with each other, and the adhesive layer and the second wet paper are in contact with each other. It is preferable to apply a pressure-sensitive adhesive or an adhesive on the outer surface of the base material because the adhesiveness between the IC inlet of the IC inlet built-in paper finally obtained and the surrounding pulp is improved.

In order to apply the pressure-sensitive adhesive or adhesive on the outer surface of the substrate of the IC inlet, for example, a fourth step of applying the pressure-sensitive adhesive from the side opposite to the pressure-sensitive adhesive layer may be provided on the IC inlet.
The fourth step may be carried out at any stage as long as it is at least before the third step, but at the peeling point of the inlet peeling jig after feeding the release paper with the inlet from the inlet winding body. It is preferable to be performed before the IC inlet is peeled off. By performing the fourth step during this period, the release paper with the inlet can be stably fed out from the inlet roll. For example, as shown in FIGS. 2 and 5, when the sticking means 30 includes the guide roll 33, if the fourth step is performed after the release paper with the inlet has passed through the guide roll 33, the guide roll 33 may become dirty. Can be suppressed.

As a method for applying the adhesive in the fourth step, for example, as shown in FIGS. 2 and 5, in the case where the sticking means 30 includes a guide roll 33, an adhesive application is performed in which the adhesive is applied instead of the guide roll 33. There is a method of applying a pressure-sensitive adhesive on the outer surface of the substrate of the IC inlet 310 when the inlet-attached release paper 31 provided with the roll passes through the pressure-sensitive adhesive application roll. .
In addition, as shown in FIG. 2, in the case where the second step is a step of blowing air from the outer surface of the base material to the IC inlet 310 having the adhesive layer facing the wire surface 24a of the first wet paper 24, an inlet is attached. Along with the air supplied from the air supply head 36, the adhesive may be sprayed onto the outer surface of the substrate of the IC inlet 310. In this case, air and adhesive may be blown out from one nozzle 36a, or air and adhesive may be blown out from each nozzle. Further, an adhesive supply head may be provided adjacent to the air supply head 36 for attaching an inlet.
The method for applying the pressure-sensitive adhesive is not limited to the above-described method, and examples thereof include brush coating, bar coating, and dry lamination. From the viewpoint of reducing the flow and scattering of the adhesive, the dry laminating method is suitable.

As the pressure-sensitive adhesive used in the fourth step, one or more kinds of pressure-sensitive adhesives exemplified above in the description of the pressure-sensitive adhesive layer of the IC inlet can be selected and used. An adhesive such as an acrylic adhesive may be used instead of the adhesive. However, since the adhesive requires heat treatment such as application of heat in order to exhibit its adhesive performance, the adhesive is suitable from the viewpoint of workability, and a hot-melt adhesive is particularly preferable.
As for the application quantity of an adhesive, 1-15 g / m < ² > is preferable.

Further, instead of the fourth step described above, an IC inlet in which an adhesive layer is provided on the outer surface of the base material in advance may be prepared, and an IC inlet built-in paper may be manufactured using the IC inlet.
Examples of the adhesive constituting the adhesive layer provided on the outer surface of the substrate include acrylic, rubber, water swelling, vinyl ether, urethane, and polyester adhesives. Examples of the acrylic adhesive include an emulsion type, a solvent type, and a hot melt type. Examples of the water swelling adhesive include a water dispersion type and an emulsion type. Any of these types can be used.
As the water-swelling adhesive, polyvinyl alcohol or starch can be used as long as the molecular weight is set high.

  Alternatively, an adhesive such as an acrylic adhesive may be applied instead of the adhesive, and an adhesive layer may be provided on the outer surface of the substrate. However, in the case of an IC inlet in which an adhesive is preliminarily applied on the outer surface of the substrate, the release paper on the side in contact with the adhesive layer on the outer surface of the substrate when the release paper with the inlet is fed out from the inlet roll It is conceivable that an IC inlet is taken. Therefore, it is necessary to sandwich the IC inlet between the release paper and the release paper (between the release layers). For example, it is preferable to use a double-sided release paper or to provide two separate release papers. . In addition, by making the peelability of the release layer on the outer surface of the base material in contact with the adhesive layer lighter than the peelability of the release layer on the inner surface of the base material in contact with the adhesive layer, stable IC Inlet supply is possible.

  However, when double-sided release paper is used, the release layer of the release paper must be treated on both sides, and the thickness of the release paper increases accordingly, and the release paper 315 has an acute angle at the release point 34a shown in FIG. It becomes difficult to become, and it becomes difficult to peel. When two release papers are used, the IC inlet is sandwiched between the two release papers. Therefore, when the release paper with the inlet is rolled up by the amount of the release paper on the outer surface of the substrate, Easy to be bulky. Furthermore, when the IC inlet is peeled from the release paper with the inlet, a release paper take-up roll for winding up the release paper provided on the outer surface of the substrate must be newly installed in the sticking means. These will also lead to increased costs.

For these reasons, an adhesive layer composed of an adhesive is preferable as the layer previously provided on the outer surface of the substrate. In particular, the adhesive is preferably a hot-melt adhesive that melts when the wet paper is dried and then can be bonded at room temperature.
The thickness of the adhesive layer is preferably 1 to 10 μm, but is not particularly limited. However, if the pressure-sensitive adhesive layer is too thick, the winding diameter tends to be large or the length tends to be difficult. If the thickness of the adhesive layer is within the above range, the winding diameter can be easily reduced or lengthened.

In the manufacturing method of the IC inlet built-in paper of the present invention, the IC inlet of the first wet paper is pasted before the second step according to the interval of the IC inlet pasted on the wire surface. Alternatively, after the second step, a hole may be provided by a mark or the like attached to the cylinder surface at a location in contact with the IC inlet of the second wet paper. As a result, the thickness of the portion where the IC inlet of the obtained IC inlet built-in paper is made and the portion where the paper is not made are likely to be uniform. Furthermore, if the hole provided in the first wet paper or the second wet paper is appropriately set according to the thickness of the IC inlet by adjusting the rice paper weight of the first wet paper or the second wet paper, This is preferable because the thickness of the obtained IC inlet built-in paper becomes more uniform.
The hole may penetrate the first wet paper or the second wet paper. However, when penetrating the first wet paper, other pre-formed wet paper is transferred onto the endless felt before forming the first wet paper. On the other hand, when penetrating the second wet paper, after forming the second wet paper, other wet papers are combined.

In addition, for the purpose of keeping the IC inlet spacing on the wire surface constant, a sensor is installed at a predetermined location so that the feeding speed of the release paper with the inlet can follow the paper making speed of the first paper making means. Also good.
For example, if a measuring instrument such as a rotary encoder or a Doppler velocimeter is installed on the endless felt, the IC inlet can be attached at regular intervals by reading the speed of the endless felt.
Also, if a bright plate is installed at the edge of the circular mesh of each papermaking means, the position where the IC inlet is attached is detected by irradiating the bright plate with a spotlight or the like and reading the reflected light with a photoelectric tube. can do.
Further, a metal timing mark having a thickness of several millimeters or a timing mark that can be identified by color may be installed on the circular net, and a sensor such as a metal detection sensor, a reflective sensor, or a gloss sensor may be installed.
In addition, a sensor that can read a hole provided in the first wet paper with a mark or the like attached to the cylinder surface as described above and attach an IC inlet to the read portion may be installed.

  As described above, according to the present invention, during the making of the first wet paper and the second wet paper, by blowing air from the lower surface of the first wet paper and pasting the IC inlet, The IC inlet can be imprinted between the wet papers while preventing the IC inlet from falling and suppressing disturbance of the texture. In addition, since each paper making means for making the first wet paper and the second wet paper employs the form of a circular paper machine arranged in series with respect to the traveling direction of the endless felt, the apparatus can be saved. Space and simplification can be realized.

  1: IC inlet built-in paper manufacturing apparatus, 10: endless felt, 20: first paper making means, 21: first circular net, 22: first couch roll, 23: first paper making tank, 24: first Wet paper, 24a: wire surface, 30: sticking means, 31: release paper with inlet, 32: release paper feed roll, 33: guide roll, 34: jig for inlet peeling, 34a: release point, 35: release paper winding Take-up roll, 36: Air supply head for attachment of inlet, 36a: Nozzle, 36b: Tip port, 36c: Center of nozzle, 310: IC inlet, 311: Base material, 311a: End, 311b: Directly above, 312: Antenna, 313: IC chip, 314: adhesive layer, 315: release paper, 316: slit, 40: second paper making means, 41: second circular net, 42: second couch roll, 43: second Papermaking tank, 50: third papermaking means, 51: third circular net, 52: third couch roll, 53: third papermaking tank.

Claims (6)

An IC inlet built-in paper manufacturing method in which an IC inlet having an antenna and an IC chip provided on the base material and the base material is formed between wet papers,
A first step of transferring the first wet paper formed by the first circular net onto the endless felt, and the wire on the wire surface of the first wet paper on the downstream side in the traveling direction of the endless felt. A second step of attaching the IC inlet from below the surface, and a second circle disposed in series downstream of the first circular net in the traveling direction of the endless felt after the second step. A third step of combining the second wet paper formed by the net with the wire surface of the first wet paper on the endless felt;
Said 2nd process is a process of spraying the air which goes to the said wire surface from the downward direction to said IC inlet, The manufacturing method of IC inlet built-in paper characterized by the above-mentioned.   The method for producing a paper with a built-in IC inlet according to claim 1, wherein the IC inlet further has an adhesive layer provided on a substrate.   The method for producing an IC inlet built-in paper according to claim 2, further comprising a fourth step of applying an adhesive to the IC inlet from the side opposite to the adhesive layer.   In the second step, before the step of blowing air to the IC inlet, the release paper with an inlet in which a plurality of IC inlets are continuously attached to the release paper through the adhesive layer was wound into a roll shape. A step of unwinding the release paper with an inlet from an inlet roll, and a step of peeling the IC inlet from the release paper with an inlet immediately before air is blown; and the fourth step includes removing the release paper with an inlet. 4. The method for producing a paper with a built-in IC inlet according to claim 3, wherein the process is performed from the time when the IC inlet is rolled out until the IC inlet is peeled off.   5. The IC according to claim 2, wherein the second step is a step of blowing air from an opposite side of the adhesive layer to an IC inlet having the adhesive layer facing the wire surface. Manufacturing method for paper with built-in inlet.   6. The method for producing an IC inlet built-in paper according to claim 1, wherein the air is continuously blown.

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