JP5081471B2 - Device for bonding workpieces - Google Patents

Description

  The present invention relates to an apparatus for bonding workpieces including a film and a substrate together.

Patent Document 1 discloses a film sticking apparatus for sticking a film to a substrate surface. This film tensioning device guides a continuous film wound around a film supply roll to a front end of a substrate conveyed by a conveying means through a guide roll, and temporarily attached to the front end of the substrate by a temporary attaching means. The film is attached to the substrate surface by conveying the substrate while the film is pressed onto the substrate by a lamination roll.
JP-A-7-266427

  In the manufacturing process of a liquid crystal panel, a printed wiring board, and the like, there are cases where it is required to bond fixed workpieces such as a sheet-like film or a substrate. In addition to the bonding of the flexible film and the hard substrate, it may be required to bond the flexible films or the hard substrates. For this reason, there is a need for an apparatus for laminating fixed workpieces including films and substrates.

  In the field of liquid crystal panels, printed wiring boards, and the like, if foreign matter such as dust enters between the workpieces, there is a risk of a defective product. For this reason, in an apparatus for bonding workpieces, it is important to prevent dust and the like from adhering to the bonding surface of the workpieces, and it is required to bond the workpieces in close contact with each other.

  One embodiment of the present invention is an apparatus for bonding workpieces, that is, an apparatus for bonding a first workpiece and a second workpiece. In this apparatus, the first support means having the first support surface for sucking and supporting the first work, and the first work and the second work are separated by a minute distance, for example, several mm to 1 cm. A second support means having a second support surface for sucking and supporting a portion excluding one end of the second workpiece in a state of facing each other at a certain interval; In a state where a distance between the roller for pressing the one end portion against the first work from the side opposite to the first work and the first support means and the second support means is maintained, And moving means for moving the position of the first support means relative to the position of the second support means and the roller. In this apparatus, the roller presses one end of the second workpiece against the one end of the first workpiece and presses the second workpiece against the first workpiece. Is moved relative to the other end of the first work supported by the first support means, so that the second work is attached to the first work.

  According to this apparatus, the first and second supporting means are opposed to each other with the first and second supporting means spaced apart from each other while keeping the first and second workpieces not bonded to the bonded area. It can be held in the On the other hand, the region to which these workpieces are bonded can be pressed against the first workpiece by the roller from the side opposite to the surface to be bonded, starting from one end of the second workpiece. Then, the position of the second support means and the roller is moved relative to the other end of the first work by the moving means while the second work is pressed against the first work by the roller. Thus, when the second work is flexible, the second work is detached from the second support means while sliding on the second support surface, and is pressed against the first work by the roller. In close contact. As a result, the first workpiece and the second workpiece are attached while preventing air from entering between them.

  Therefore, according to this apparatus, fixed or sheet-like workpieces (workpieces) that are not wound in a roll shape can be bonded together. That is, sheet-like films can be bonded together, or a sheet-like film can be attached to a substrate.

In this apparatus, when relatively hard workpieces, for example, substrates are bonded together, the apparatus presses one end of the second workpiece against one end of the first workpiece by a roller. In addition, a spacer that contacts the other end of the second workpiece and maintains the distance between the other end of the second workpiece and the other end of the first workpiece is provided . The spacer is moved relative to the second support means together with the first support means by the moving means, and the apparatus for laminating the spacer is the second support with respect to the first support surface. further comprising a first state in which the projecting side of the support means, the spacer driving means for moving the second state not protruding with respect to the first supporting surface.

  When the second workpiece is a flexible workpiece such as a film, when the roller presses one end of the second workpiece against one end of the first workpiece, the second workpiece One end is bent and a part is removed from the second support means, and most of the second work except the one end is held while being sucked and supported by the second support means. Then, the second workpiece is detached while sliding on the second support surface along with the movement of the roller and the second support means, and is bonded to the first workpiece. Therefore, by moving the position of the roller relative to the other end of the first workpiece, air is prevented from entering between the first workpiece and the second workpiece. The second workpiece can be pasted.

  When the second workpiece is a relatively hard workpiece such as a substrate, when the roller presses one end of the second workpiece against one end of the first workpiece, the second workpiece is thereby There is a possibility that the second work and the first work will be pasted apart from the second support surface. Even in such a case, the surfaces to be bonded are kept clean, and then the air that has entered between these workpieces is pushed out by pressing from one end to the other end with a roller. Is possible. However, the roller is gradually (in order) pressed from one end to the other while maintaining a gap between the workpieces, so that the gap between the first and second workpieces is increased. The effect of preventing air from entering is difficult to obtain.

  If the spacer as described above is provided, even if the roller presses one end of the second workpiece against one end of the first workpiece, the other end of the second workpiece and the first The distance from the other end of the workpiece is maintained. Therefore, by moving the position of the roller relative to the other end of the first workpiece, air is prevented from entering between the first workpiece and the second workpiece. The second workpiece can be pasted.

  In the case described above, in the second work, an area other than the other end of the second work becomes a bonding area with the first work. Since the spacer is in contact with the other end of the second workpiece, which is a region other than the bonding region with the first workpiece, the spacer touches the region where the first workpiece and the second workpiece are bonded. Absent. Accordingly, it is difficult for foreign matters such as dust to adhere to the bonding region between the first workpiece and the second workpiece.

  Furthermore, in the above case, it is preferable that the spacer driving unit moves the spacer from the first state to the second state in conjunction with the operation of the moving unit. By doing in this way, as the position of the roller relatively moves from one end of the first workpiece to the other end, the other end of the second workpiece is moved away from the first workpiece. Approach the other end. Therefore, the second workpiece can be attached to the first workpiece while extruding the air between the first workpiece and the second workpiece. Moreover, as the position of the roller relatively moves from one end of the first workpiece to the other end, the other end of the second workpiece moves to the other end of the first workpiece. Therefore, even if the roller presses the second workpiece, the second workpiece is hardly distorted.

  In the above case, for example, a pin type spacer can be used as the spacer. By using a pin type spacer, the contact area between the spacer and the second workpiece can be reduced. The smaller the contact area between the spacer and the second workpiece, the better because foreign matters such as dust are less likely to adhere to the second workpiece.

  When the other end of the second workpiece is supported by the spacer and the distance between the other end of the second workpiece and the other end of the first workpiece is maintained, for example, The first workpiece and the second workpiece may be opposed to each other so that the other end projects slightly from the other end of the first workpiece, and these are bonded together. By doing so, the spacer can be brought into contact with the other end portion (non-bonding region) of the second workpiece projecting from the other end portion of the first workpiece.

  Therefore, in this apparatus, an overhanging portion that protrudes beyond the end opposite to the roller of the first support means is provided at the end opposite to the roller of the second support means, and the spacer is In the first state, it is preferable to face the overhanging portion. By doing in this way, the 1st work and the 2nd work can be made to oppose so that the other end of the 2nd work may protrude from the other end of the 1st work. The spacer contacts the other end (non-bonding region) of the second workpiece projecting from the other end of the first workpiece, and the other end of the second workpiece and the first workpiece Maintain the distance from the other end. That is, the spacer does not touch the area where the first work and the second work are attached. Accordingly, it is difficult for foreign matters such as dust to adhere to the bonding area between the first workpiece and the second workpiece.

  Moreover, in this apparatus, it is preferable that the first support means includes a porous elastic member (elastomer) that forms the first support surface. As the elastic member, a breathable elastic member is used so that the first work is sucked and supported by the first support means by a vacuum pump or the like. Therefore, for example, the elastic member may be a non-breathable elastic member having a plurality of holes, or may be a foaming elastic member.

  In this way, when the second workpiece is attached to the first workpiece with the roller, that is, in a state where the second workpiece is pressed against the first workpiece by the roller, the position of the roller is moved by the moving means. When the first elastic member is moved relative to the other end of the first workpiece, the porous elastic member is deformed and the first workpiece and / or the second workpiece is distorted. To prevent.

  This configuration is suitable when the second work is relatively hard, for example, when a relatively hard work is affixed between the substrates, for example, while pressing the second work with the roller, Even if the position is relatively moved from one end portion of the first workpiece to the other end portion, it is difficult for both the workpieces to be distorted. Therefore, even if the hardness of both workpieces to be bonded is high, the workpieces will not be damaged, the workpieces will not be damaged, and the workpieces will be sandwiched between air, dust, and dust. Can be bonded while keeping

  Further, the first workpiece and the second workpiece are respectively formed on the second surface opposite to the first surface supported by the first support surface and the second support surface, that is, the bonding surface. In some cases, a protective film for protecting the surface from dust or the like is attached. For this reason, it may be required to peel off the protective film from the second surfaces of the first and second workpieces immediately before the bonding between the first workpiece and the second workpiece.

Accordingly, in one apparatus according to another aspect of the present invention, a first head that peels a protective film from a second surface of a first work that is sucked and supported by a first support surface, and a second support surface. further comprising a second head peeling the protective film from the second surface of the second workpiece sucked supported. By doing in this way, a protective film can be peeled off from the 1st and 2nd workpiece | work just before bonding of a 1st workpiece | work and a 2nd workpiece | work.

  As described above, when the protective film is peeled off from the second surface of the first and second workpieces immediately before the bonding of the first workpiece and the second workpiece, the first surface of the workpiece is It is preferable that almost the entire region is supported by the support means.

Therefore, in this apparatus, the third support surface includes a third support means having a third support surface for sucking and supporting one end portion of the second workpiece, and the third support surface has from a first position for sucking supporting the second work together with the second supporting surface, further comprising a means for moving from one end of the second work to a second position where the third supporting means away.

  By placing the third support means at the first position until the second work is bonded to the first work, one end of the second work is supported by the third support means. be able to. Therefore, the protective film can be peeled off from the second surface of the second workpiece while the substantially entire area of the first surface of the second workpiece is supported by the second support means and the third support means. Further, when the bonding of the first workpiece and the second workpiece is started, the third support means is moved (retracted) to the second position, so that one end of the second workpiece is moved by the roller. A space for pressing the part against one end of the first workpiece can be secured.

  Further, when the protective film is peeled off from the second surface of the first and second workpieces immediately before the bonding between the first workpiece and the second workpiece, the second support means and / or the first support is performed. It is preferable to further include means for rotating the means from a position where the protective film is peeled off to a position where the second surface of the second workpiece and the second surface of the first workpiece face each other.

  When the second support means and / or the first support means faces the position where the second surface of the second work and the second face of the first work face each other, the second work and In some cases, it is difficult to remove the protective film from the first workpiece, or it may be difficult to ensure the area to be removed. By providing the rotating means, the protective film can be peeled off from the second surface of the first and second workpieces at a position where it can be easily peeled off.

  For example, in a state where both the first and second workpieces have the second surface facing upward, the second support means is provided by means for peeling off the protective film from the first and second workpieces and then rotating them. And / or rotating the first support means to a position where the second surface of the second workpiece and the second surface of the first workpiece face each other, and bonding the first workpiece and the second workpiece together Can be combined.

  In this case, the first support means supports the first workpiece with the second surface facing upward, and the means for rotating the second support means rotates the second surface of the second workpiece. It is preferable that the second surface is moved from a position where the second surface is downward to a position where the second surface is downward.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the first embodiment, a description will be given by taking as an example an apparatus for bonding flexible works (flexible films) or a flexible film to a hard substrate (hereinafter referred to as a film bonding apparatus). 1 to 8 show a process of bonding a first workpiece and a second workpiece by the apparatus according to the first embodiment of the present invention.

  The film laminating apparatus 1a of the present example includes a flexible first fixed work (hereinafter referred to as a first film) 11 and a flexible second fixed work (hereinafter referred to as a second work). Film) 12 is a device for bonding. Note that the first workpiece 11 may be a hard substrate such as a glass substrate. In this example, the first film 11 and the second film 12 are approximately the same size. As for the 1st and 2nd films 11 and 12, one surface (1st surface) 11a and 12a turns into a to-be-supported surface supported by the film bonding apparatus 1a, respectively, and the other surface (2nd surface) 11b and 12b become a bonding surface. In addition, before the first film 11 and the second film 12 are bonded together, foreign matters such as dust are not attached to the bonding surface 11b of the first film 11 and the bonding surface 12b of the second film 12. Thus, the protective films 13 and 14 are bonded to the bonding surface (second surface) 11b of the first film 11 and the bonding surface (second surface) 12b of the second film 12, respectively. ing.

  As shown in FIGS. 1 and 2, the film laminating apparatus 1 a includes a first support means (first stage) 21 having a first support surface 21 a for sucking and supporting the first film 11. A second support means (second stage) 22 having a second support surface 22a for sucking and supporting a portion excluding one end 12c of the second film 12, and a second film And third support means (third stage) 23 having a third support surface 23a for sucking and supporting one end portion 12c of twelve. Furthermore, the film laminating apparatus 1a supports the first stage 21 and moves the first stage 21 in the horizontal direction (left and right in the drawing) 30 and a second stage. And a rotating device 40 that rotates the second support surface 22a so as to face up and down, an air cylinder 50 that supports the third stage 23, and moves the third stage 23 in the horizontal direction. It has. Further, the film laminating apparatus 1a is substantially perpendicular to the roller 60 for pressing the second film 12 against the first film 11 and the roller 60 toward the second film 12. Is provided with a roller air cylinder 61 that protrudes slightly obliquely downward, and a support column 62 that extends in the vertical direction to support the air cylinder 50 and the roller air cylinder 61. Further, the laminating apparatus 1a includes a first head 71 that peels the protective film 13 from the second surface 11b of the first film 11 that is sucked and supported by the first support surface 21a, and a second support surface 22a. And a second head 72 that peels off the protective film 14 from the second surface 12b of the second film 12 that is sucked and supported by the third support surface 23a.

  The first stage (table) 21 as the first support means has the first support surface 21 a in contact with the entire area of the first surface 11 a of the first film 11, and supports the first film 11 by suction. The first stage 21 includes a plurality of suction ports 21b on the first support surface 21a. By driving a mechanism for sucking air, such as a vacuum pump (not shown), and sucking air from the suction port 21b, the vicinity of the first support surface 21a is made negative with respect to atmospheric pressure, and the first film 11 is supported by adsorption. In this example, the first stage 21 supports the first film 11 with the second surface 11b facing upward.

  The second stage (table) 22 serving as the second support means has a second support surface 22a in contact with the first surface 12a of the second film 12 excluding one end 12c, The part excluding one end 12c of the film 12 is supported by suction. The second stage 22 also includes a plurality of suction ports 22b on the second support surface 22a. Therefore, by driving a mechanism for sucking air, such as the above vacuum pump, and sucking air from the suction port 22b, one end portion 12c of the second film 12 is placed on the second support surface 22a. The removed part can be adsorbed and supported.

  The third stage (table) 23 serving as the third support means has a third support surface 23 a in contact with the first surface 12 a of one end 12 c of the second film 12, and the second film 12. One end 12c is supported by suction. The third stage 23 includes a plurality of suction ports 23b on the third support surface 23a, drives a mechanism for sucking air, such as the vacuum pump, and sucks air from the suction ports 23b. Thus, one end portion 12c of the second film 12 is sucked and supported on the third support surface 23a.

  The moving device 30 that moves the first stage 21 is located along the rail 31 so that the first stage 21 faces the second stage 22 from a position that does not face the second stage 22 (right side in the drawing). It is moved in the horizontal first direction (left and right in the figure) to the left side of the drawing. That is, the moving device 30 determines the position of the first stage 21 and the position of the second stage 22 and the roller 60 in a state where the vertical distance between the first stage 21 and the second stage 22 is maintained. Move against.

  The rotating device 40 that rotates the second stage 22 includes a motor 41, and the shaft 41 a of the motor 41 is third with respect to the left end of the second stage 22, that is, the second stage 22. Is connected to an end opposite to the stage 23 (an end opposite to the roller 60). The motor 41 is fixed to a support column 42 provided along the vertical direction. The rotating device 40 drives the motor 41 to rotate the second stage 22, and from the position where the second support surface 22 a is peeled off the protective film 14 facing upward, the second of the second film 12 facing downward. The surface 12b of the first film 11 and the second surface 11b of the first film 11 are moved to a position where they face each other in the vertical direction with a gap therebetween. In other words, in this example, the rotating device 40 rotates the second stage 22, and moves the second film 12 from the position where the second surface 12b faces upward to the position where the second surface 12b faces downward. Move to.

  The air cylinder 50 for moving the third stage 23 has one of the second films 12 from the first position where the third support surface 23a sucks and supports the second film 12 together with the second support surface 22a. The third stage 23 is moved in the first horizontal direction (left-right direction in the figure) to the second position where the third stage 23 is separated from the end 12c. In the air cylinder 50, the cylinder body 51 is fixed substantially horizontally to the support 62, and the third stage 23 is connected to the tip of a rod 52 that protrudes and retracts from the cylinder body 51.

  The roller 60 for pressing the second film 12 against the first film 11 is configured so that one end 12c of the second film 12 is moved from the side opposite to the first film 11 to the first film 11. 11 is pressed. The roller 60 is moved from a position at which one end 12 c of the second film 12 is pressed by the roller air cylinder 61 to a position away from the one end 12 c of the second film 12. The air cylinder 61 for rollers is being fixed to the support | pillar 62 provided along the perpendicular direction.

  The first head 71 that peels the protective film 13 from the first film 11 that is sucked and supported by the first support surface 21 a adheres to the protective film 13 rather than the adhesive force between the first film 11 and the protective film 13. An adhesive tape 71a is provided which is wound in a roll shape and coated with a high strength adhesive. The first head 71 applies the film 13 to the corner portion of the protective film 13 of the first film 11 by the adhesive tape 71a, specifically, at one corner portion of the two corner portions on the center side of the device 1a. The protective film 13 is peeled from the first film 11 by moving the first head 71 in the diagonal direction of the first film 11 (outside the apparatus 1 a) in a state where the adhesive is held.

  Similarly, the second head 72 that peels the protective film 14 from the second film 12 that is sucked and supported by the second support surface 22 a has a protective film 14 that is more adhesive than the adhesive force between the second film 12 and the protective film 14. A pressure-sensitive adhesive tape 72a is applied to the surface and is wound in a roll shape. The second head 72 causes the adhesive film 72 to attach the film 14 at the corner portion of the protective film 14 of the second film 12, specifically, at one corner portion of the two corner portions on the center side of the device 1a. The protective film 14 is peeled from the second film 12 by moving the second head 72 in the diagonal direction of the second film 12 (outside the apparatus 1 a) with the adhesive held.

  The film laminating apparatus 1a peels off the protective films 13 and 14 from the first and second films 11 and 12, respectively, and then reverses the second film 12 so that one end 12c of the second film 12 is reversed. Is pressed against one end 11 c of the first film 11. Further, in a state where the second film 12 is pressed against the first film 11, the positions of the second stage 22 and the roller 60 are supported by the first stage 21 by the moving device 30. The second film 12 is affixed to the first film 11 by being moved relative to the other end 11d of the first film 11. In the apparatus 1 a of this example, the first stage 21 is moved by the moving device 30.

  Specifically, FIG. 1 to FIG. 8 show the process of film bonding using the film bonding apparatus 1a.

  First, as shown in FIG. 1, the moving device 30 moves the first stage 21 to a position away from the second stage 22, and the first film 21 is moved to the first stage 21 and the second stage 22. 11 and the second film 12 are mounted. The films 11 and 12 are handled automatically by a film loader (not shown).

  Next, as shown in FIG. 2, the first film 11 is sucked and supported on the first support surface 21 a of the first stage 21. Further, the second stage 22 is set at a position where the second support surface 22a faces upward by the rotating device 40. Further, the air cylinder 50 moves the third stage 23 to the first position (position where the third support surface 23a sucks and supports the second film 12 together with the second support surface 22a). Then, the second film 12 is sucked and supported on the second support surface 22 a of the second stage 22 and the third support surface 23 a of the third stage 23.

  Thereafter, the protective film 13 is peeled off from the second surface 11 b of the first film 11 that is sucked and supported by the first support surface 21 a by the first head 71. At the same time, the protective film 14 is peeled off from the second surface 12 b of the second film 12 sucked and supported by the second support surface 22 a and the third support surface 23 a by the second head 72.

  Next, as shown in FIG. 3, the suction of the third stage 23 is stopped, and the third stage 23 is moved from the second position (from one end 12 c of the second film 12 to the second position by the air cylinder 50. 3 stage 23 is separated) and separated from the second stage 22. As a result, the third stage 23 is separated from the one end 12 c of the second film 12, and the second film 12 is supported only by the second stage 22. Next, the rotating device 40 rotates the second stage 22 so that the second support surface 22a supporting the film 12 faces downward. Thereby, the second surface 12b of the second film 12 faces downward. Further, the first stage 21 is moved from the right to the left by the moving device 30.

  As shown in FIG. 4, by these operations, the first stage 21 moves to a position facing the second stage 22, and the second surface 12 b of the second film 12 and the first film 11 are moved. The second surface 11b faces each other.

  Thereafter, as shown in FIG. 5, the roller 60 is moved obliquely downward by the roller air cylinder 61 so that the roller 60 comes into contact with one end portion 12 c of the second film 12. The end portion 12c is an end portion of the second film 12 which is freed by moving the third stage 23.

  When the roller 60 is further moved by the air cylinder 61 and the second film 12 is pressed against the first film 11, one end 12c of the second film 12 is bent as shown in FIG. One end 11c of one film 11 is contacted. Accordingly, the roller 60 presses one end 12c of the second film 12 against the first film 11 from the upper side (the side opposite to the first film 11), and the second film 12 The first film 11 is sandwiched between the roller 60 and the first stage 21 or is pressed.

  As shown in FIG. 7, the position of the first stage 21 is moved to the position of the second stage 22 and the roller 60 by the moving device 30 while the second film 12 is pressed against the first film 11 by the roller 60. The roller 60 is moved relative to the other end 11 d from the one end 11 c of the first film 11. That is, in FIG. 7, the first stage 21 is moved from the left to the right with the roller 60 and the first stage 21 sandwiching the second film 12 and the first film 11 from above and below. Thereby, the position of the roller 60 moves relatively from one end portion 11c of the first film 11 supported by the first stage 21 to the other end portion 11d.

  By doing in this way, the 2nd film 12 is affixed on the 1st film 11 while the air between the 1st film 11 and the 2nd film 12 is extruded by the roller 60. Finally, the second film 12 is pressed against the first film 11 by the roller 60, and the first stage 21 is moved by the moving device 30 while the films 11 and 12 are sandwiched between the roller 60 and the stage 21. As shown in FIG. 8, it is moved to a position away from the second stage 22. The second film 12 supported by the second stage 22 is attached to the first film 11 and moves together with the first stage 21. With these operations, the second film 12 can be attached to the first film 11. In other words, the second film 12 pressed against the first film 11 by the roller 60 slides on the support surface 22a of the second stage 22 as the first stage 21 moves, and the first stage 21 horizontally moves. It will be pulled by.

  The second support surface 22a supports the second film 12 by suction, and it is difficult to peel off the second film 12 from the second support surface 22a. However, it is easy to move (pull) the film 12 in a direction perpendicular to the suction force or suction force (shear direction). By moving the first stage 21, the second stage 22 moves to the second stage 22. The film 12 can be easily transferred onto the first film 11. In this way, by using the second stage 22 provided with the support surface 22a for sucking and supporting the film 12 by sucking air, the second film 12 is directed downward by the second stage 22, and the second stage 22 is used. The film 12 can be supported so as not to fall off. Further, when the second film 12 is stuck to the first film 11 while being pressed, the second film 12 does not fall off the support surface 22a, and the first film 11 and the second film 12 An appropriate interval, for example, a minute interval of several mm to 1 cm can be maintained.

  On the other hand, the second film 12 slides with respect to the support surface 22 a by being pulled by the movement of the first film 11, and finally the second film 12 is automatically detached from the second stage 22. It is like that. For this reason, the second film 12 can be gradually stuck on the first film 11 by the movement of the roller 60. Therefore, the apparatus 1a prevents the air from entering between the first film 11 and the second film 12 between the films 11 and 12, and the films 11 and 12 are inclined such as skew and wrinkles. The films 11 and 12 can be adhered to each other with high accuracy in the absence of the film.

  As described above, according to the film laminating apparatus 1a, the second film 12 is attached to the first film 11 while preventing air from entering between the first film 11 and the second film 12. Can be pasted. Moreover, according to this film bonding apparatus 1a, a film can also be bonded to a board | substrate by the same method by preparing a board | substrate as a 1st workpiece | work and preparing a film as a 2nd workpiece | work.

  Furthermore, according to the film laminating apparatus 1a, the first head 71 for peeling the protective film 13 from the second surface 11b of the first film 11 sucked and supported by the first support surface 21a, and the second head And a second head 72 that peels the protective film 14 from the second surface 12b of the second film 12 that is sucked and supported by the support surface 22a and the third support surface 23a. From the peeling of 14 to the bonding of the films 11 and 12 can be performed automatically.

  Moreover, according to this film bonding apparatus 1a, immediately before bonding the 1st film 11 and the 2nd film 12, the protective films 13 and 14 are peeled off from the 1st and 2nd films 11 and 12, respectively. Can do. Further, after the protective films 13 and 14 are peeled off, the surface 11b of the first film 11 and the second film 12 that become the bonding region until just before the first film 11 and the second film 12 are bonded. No device touches the surface 12b. Accordingly, it is difficult for foreign matters such as dust to enter between the first film 11 and the second film 12.

  Moreover, according to the film laminating apparatus 1a, the third stage 23 having the third support surface 23a for sucking and supporting one end portion 12c of the second film 12, and the third stage 23 The third stage 23 is separated from the one end 12c of the second film 12 from the first position where the third support surface 23a supports the second film 12 together with the second support surface 22a by suction. And moving the second film 12 to the second position, the second stage 22 and the third stage 23 support the substantially entire area of the first surface 12a of the second film 12, while The protective film 14 can be peeled off from the second surface 12 b of the film 12. In particular, since one end 12c of the second film 12 is supported by the third stage 23, the adhesive tape 72a of the second head 72 is attached to the second film 12 when the protective film 14 starts to be peeled off. The end of the protective film 14 is easily peeled off by the adhesive tape 72a by pressing against the portion corresponding to the one end 12c. Therefore, the second head 72 can be moved from the one end 12 c side of the second film 12 to the other end 12 d side, and the protective film 14 can be peeled off from the second film 12.

  Further, when the bonding of the first film 11 and the second film 12 is started, by moving the third stage 23 to the second position, one of the second films 12 is moved by the roller 60. A space for pressing the end portion 12 c against one end portion 11 c of the first film 11 can be secured.

  Further, in this film laminating apparatus 1a, the second stage 22 is moved from the position where the protective film 14 is peeled off, from the second surface 12b of the second film 12 to the second surface 11b of the first film 11. Since the rotating device 40 that rotates to the position to face is provided, the protective film 14 is moved from the second film 12 to a position where it can be easily peeled (in this example, upward), and the protective film 14 is peeled off from the second film 12. be able to.

  In the second embodiment, a description will be given by taking as an example an apparatus (hereinafter referred to as a substrate bonding apparatus) for bonding relatively hard workpieces (substrates) that are hardly bent. 9 to 15 show a process of bonding the first workpiece and the second workpiece by the apparatus according to the second embodiment of the present invention.

  As shown in FIG. 9, the substrate bonding apparatus of this example is an apparatus for bonding a first substrate 81 as a first workpiece and a second substrate 82 as a second workpiece. The first substrate 81 is, for example, a glass plate, and the second substrate is, for example, a resin plate. In the first and second substrates 81 and 82, one surface (first surface) 81a and 82a are supported surfaces supported by the substrate bonding apparatus, and the other surface (second surface) 81b. And 82b are bonded surfaces. In addition, before the first substrate 81 and the second substrate 82 are bonded to each other, foreign matter such as dust is attached to the surfaces to be bonded to the first substrate 81 and the second substrate 82, so that an obstacle at the time of bonding is obtained. Therefore, protective films 83 and 84 are attached to the second surface 81b of the first substrate 81 and the second surface 82b of the second substrate 82, respectively. Further, in this example, as shown in FIGS. 11 and 12, the second substrate 82 is slightly larger than the first substrate 81, and the second substrate 82 is attached to the first substrate 81. In addition, the other end 82 d is arranged to slightly protrude from the other end 81 d of the first substrate 81.

  Returning to FIG. 9, the substrate bonding apparatus 1 b includes a first stage 21, a second stage 22, a third stage 23, a moving apparatus 30, and a rotating apparatus having the same configuration as the film bonding apparatus 1 a described above. 40, a third stage air cylinder 50, a roller 60, a roller air cylinder 61, a support 62, a first head 71 and a second head 72 for peeling off the protective film, and the like. The substrate bonding apparatus 1b further includes a spacer 90 and a spacer driving apparatus 100 for moving the spacer 90. The spacer 90 and the spacer driving device 100 are attached to the first stage 21. For this reason, the spacer 90 and the spacer driving device 100 slide together with the first stage 21 by the moving device 30.

  The spacer 90 contacts the other end 82 d of the second substrate 82 when the roller 60 presses one end 82 c of the second substrate 82 against the one end 81 c of the first substrate 81. Thus, the distance between the other end portion 82 d of the second substrate 82 and the other end portion 81 d of the first substrate 81 is maintained. In this example, as the spacer 90, a pin type spacer (a type protruding in a needle shape or a rod shape) that supports the second substrate 82 in contact with a narrow area where the upper end is limited to the second substrate 82 is used. Yes.

  The spacer driving device 100 includes a motor 101, a gear 102, and a cam link 103. The lower end of the spacer 90 is connected to the tip of the cam link 103. Therefore, by moving the motor 101, the spacer 90 protrudes toward the second stage 22 with respect to the first support surface 21a via the gear 102 and the cam link 103 (see FIGS. 12 and 12). 13) and a second state (see FIGS. 10, 11, and 14) that does not protrude from the first support surface 21a.

  Further, in this substrate bonding apparatus 1b, in order to support the second substrate 82 in a state facing the spacer 90, the end of the second stage 22 opposite to the roller 60 is the end of the first stage 21. An overhang portion 22c that is set so as to project outward from the end is provided. In the first state, the spacer 90 supports the other end 82d of the second substrate 82 so as to be sandwiched between the protruding portion 22c of the second stage 22 once. Thereafter, when the second substrate 82 is detached (peeled) from the second stage 22, the spacer 90 alone contacts and supports the other end portion 82 d of the second substrate 82.

  Further, in the substrate bonding apparatus 1b, the first stage 21 includes a porous elastic member (elastomer) 110 that forms the first support surface 21a. As the elastic member 110, for example, a porous rubber plate in which a plurality of holes 111 are formed can be used. The plurality of holes 111 function as the suction port 21b. As the elastic member 110, a foamable rubber plate or the like may be used. In addition, since the other structure of the board | substrate bonding apparatus 1b is the same as that of the film bonding apparatus 1a demonstrated in 1st Embodiment, the overlapping description attaches | subjects the same code | symbol and abbreviate | omits.

  In this substrate bonding apparatus, after the protective films 83 and 84 are peeled off from the first and second substrates 81 and 82, one end 82c of the second substrate 82 is connected to one end of the first substrate 81. In the state where the second substrate 82 is pressed against the first substrate 81 by pressing against the first substrate 81, the position of the roller 60 is moved by the moving device 30 to the other of the first substrates 81 supported by the first stage 21. The second substrate 82 is attached to the first substrate 81 by being moved relative to the end portion 81d.

  Specifically, FIGS. 9 to 15 show a process of bonding substrates using the substrate bonding apparatus 1b.

  First, as shown in FIG. 9, the protective film 83 is peeled off from the second surface 81 b of the first substrate 81 as in the first embodiment. At the same time, the protective film 84 is peeled off from the second surface 82 b of the second substrate 82. At this time, the spacer 90 is in the second state that does not protrude from the first support surface 21a.

  Next, as shown in FIG. 10, first, the suction of the third stage 23 is stopped, the third stage 23 is retracted to the second position by the air cylinder 50, and the second stage 22 is moved away from the second stage 22. 3 stage 23 is released. Further, the rotating device 40 moves (rotates) the second stage 22 to a position where the second surface 82b of the second substrate 82 faces downward while holding the second substrate 82 by suction. Further, the moving device 30 moves the first stage 21 to a position facing the second stage 22 (in FIG. 10, the first stage 21 is moved from right to left).

  After that, as shown in FIG. 11, the spacer 90 is moved from the second state where the spacer 90 does not protrude from the first support surface 21a to the second stage relative to the first support surface 21a. It moves to the 1st state which protruded in the 22 side. As a result, the spacer 90 is brought into contact with the other end 82d of the second substrate 82 that is sucked and supported by the second stage 22 so as to face downward in the vertical direction, and is supported upward in the vertical direction.

  In this example, the first stage 21 and the second stage 22 are positioned so that the other end portion 82d of the second substrate 82 protrudes beyond the other end portion 81d of the first substrate 81. ing. A portion excluding the other end portion 82 d of the second substrate 82 becomes a bonding region with the first substrate 81. Therefore, the spacer 90 is not in contact with the bonding region, and even when the spacer 90 is moved to the first position, the first substrate 81 and the second substrate 82 are bonded to each other through the spacer 90. Foreign matter such as dust does not adhere to the mating region.

  Similarly to the bonding apparatus 1 a described above, the first stage 21 and the second stage 22 are the first surface (back surface) 81 a of the first substrate 81 and the first surface of the second substrate 82. 82a is adsorbed and supported. Therefore, in order to bond the second surface (front surface) 81b of the first substrate 81 and the second surface 82b of the second substrate 82, these surfaces 81b and 82b are made to have a minute size of several mm to 1 cm. Until the surfaces 81b and 82b are bonded to each other, the bonding area of the surfaces 81b and 82b includes objects (members, arms, etc.) related to the device 1b. Etc.) are not touching. Therefore, when these substrates 81 and 82 are bonded together, foreign matter is not sandwiched between the substrates 81 and 82 due to the apparatus 1b.

  After the substrates 81 and 82 face each other, the roller 60 is moved obliquely downward by the roller air cylinder 61. When the roller 60 is moved, as shown in FIG. 12, one end portion 82c of the second substrate 82 is pushed downward. When the roller 60 is further moved, as shown in FIG. 13, one end portion 82 c of the second substrate 82 is moved to one end portion 81 c of the first substrate 81 supported by the first stage 21. Contact. Accordingly, the first substrate 81 and the second substrate 82 are sandwiched between the roller 60 and the first stage 21, and one end portion 82 c of the second substrate 82 is positioned on the upper side (first From the side opposite to the substrate 81) against the first substrate 81.

  Since the second substrate 82 has relatively high rigidity and little bending, when one end 82c of the second substrate 82 is pressed by the roller 60, the entire second substrate 82 becomes the second support surface. There is a possibility that the second substrate 82 is detached from the second stage 22 due to peeling from the second stage 22a. At this time, the spacer 90 is in a first state protruding to the second stage 22 side with respect to the first support surface 21a. For this reason, the other end 82d of the second substrate 82 is supported by the spacer 90, and the distance between the other end 82d of the second substrate 82 and the other end 81d of the first substrate 81 is maintained. it can. Further, the second substrate 82 peeled from the second stage 22 is supported by the first stage 21 via the first substrate 81 and the spacer 90 and moves together with the first stage 21. Therefore, after that, the suction of the second stage 22 may be continued or may be stopped.

  As shown in FIG. 14, the distance between the first stage 21 and the second stage 22 is changed by the moving device (conveyor) 30 while the second substrate 82 is pressed against the first substrate 81 by the roller 60. In the state kept, the position of the first stage 21 is moved with respect to the positions of the second stage 22 and the roller 60. That is, in FIG. 14, the first stage 21 is moved from left to right. As a result, the position of the roller 60 moves relative to the other end portions 81 d and 82 d of the first substrate 81 and the second substrate 82 supported by the first stage 21. At the same time, the spacer driving device 100 moves the spacer 90 from the first state to the second state in conjunction with the moving distance of the moving device 30.

  Finally, the first stage 21 is moved to the position shown in FIG. 15 by the moving device 30 while the second substrate 82 is pressed against the first substrate 81 by the roller 60. As a result, the second substrate 82 is attached to the first substrate 81. In this substrate bonding apparatus 1b, as the position of the roller 60 moves relatively from one end 81c of the first substrate 81 to the other end 81d, the spacer 90 is lowered, and the second substrate The other end portion 82 d of 82 approaches the other end portion 81 d of the first substrate 81. For this reason, even if the roller 60 presses the second substrate 82, the second substrate 82 is not easily distorted, and the first substrate 81 and the second substrate 82 gradually move as the roller 60 moves. Since they are bonded together, the air can be extracted from between the substrates 81 and 82.

  Moreover, since the support surface 21a of the first stage 21 is a rubber sheet 110 as an elastic member, the support surface 21a is recessed when the substrates 81 and 82 are pushed from above by the roller 60, and the substrates 81 and 82 are provided. Can be prevented from bending or bending. For this reason, even if the position of the roller 60 is relatively moved from one end 81c of the first substrate 81 to the other end 81d while pressing the second substrate 82 by the roller 60, the second The hard substrates 81 and 82 can be bonded to each other without distortion of only the substrate 82 or stress concentration on the second substrate 82.

  As described above, according to the substrate bonding apparatus 1b, the hard first substrate 81 is fixed to the hard second substrate 81 while air is prevented from entering between the first substrate 81 and the second substrate 82. The substrate 82 can be attached.

  Moreover, according to this board | substrate bonding apparatus 1b, the overhang | projection which protrudes from the edge on the opposite side to the roller 60 of the 2nd support means 22 rather than the edge on the opposite side to the roller 60 of the 1st support means 21 is carried out. A portion 22c is provided. Therefore, the first substrate 81 and the second substrate 82 can be opposed so that the other end portion 82 d of the second substrate 82 protrudes from the other end portion 81 d of the first substrate 81. . And according to this board | substrate bonding apparatus 1b, the spacer 90 is made to oppose the overhang | projection part 22c in the said 1st state. The spacer 90 contacts the other end 82d of the second substrate 82 that protrudes from the other end 81d of the first substrate 81, and the other end 82d of the second substrate 82 and the first substrate 82 The distance from the other end 81d of 81 is maintained. The spacer 90 that supports the substrate 82 when bonded is in contact with only the overhanging portion 22c, and the overhanging portion 22c is a portion (region) that is out of the bonding region. Therefore, the spacer 90 does not touch the region where the first substrate 81 and the second substrate 82 are attached. Thus, even when the hard substrates 81 and 82 are bonded together, there is no member or device that touches the region to be bonded. For this reason, due to the apparatus 1b, foreign matter such as dust hardly adheres to the bonding region of the first substrate 81 and the second substrate 82.

  Furthermore, according to this substrate bonding apparatus 1b, since a pin-type spacer is used as the spacer 90, the contact area between the spacer 90 and the second substrate 82 can be reduced. Therefore, foreign matters such as dust are less likely to adhere to the second substrate 82.

  Further, according to the substrate bonding apparatus 1b, the spacer driving device 100 moves the spacer 90 from the first state to the second state in conjunction with the operation of the moving device 30. That is, as the position of the roller 60 moves relatively from one end 81c of the first substrate 81 to the other end 81d, the other end 82d of the second substrate 82 becomes the first substrate. The other end 81d of 81 is approached. Therefore, even if the roller 60 presses the second substrate 82, the second substrate 82 is hardly distorted.

  Moreover, according to the substrate bonding apparatus 1b, the first support means 21 includes the porous elastic member 110 that forms the first support surface 21a. When affixed to the first substrate 81, the porous elastic member 110 is deformed to absorb the distortion of the first substrate 81 and / or the second substrate 82. Accordingly, the first substrate 81 and / or the second substrate 82 is unlikely to be distorted.

  In this example, a substrate larger than the first substrate 81 is used as the second substrate 82. However, the first substrate 81 and the second substrate 82 having substantially the same shape are prepared, and these substrates are prepared. By arranging the substrates 81 and 82 to be slightly shifted, the other end portion 82 d of the second substrate 82 may protrude from the other end portion 81 d of the first substrate 81. Therefore, the first support means 21 and the second support means 22 may be slightly shifted as long as they can be confronted with a small interval.

  In this example, the other end portion 82d of the second substrate 82 protrudes from the other end portion 81d of the first substrate 81, but the other end portion 82d of the second substrate 82 is It does not necessarily have to protrude beyond the other end 81d of the first substrate 81. For example, a notch or opening may be formed in the first support means 21 and the first substrate 81, and the spacer 90 may be protruded and submerged through the notch or opening.

  Further, the spacer 90 is not limited to the pin type, but contacts the other end 82d of the second substrate 82 and the other end 82d of the second substrate 82 and the other end of the first substrate 81. Any shape can be used as long as the distance from the end portion 81d is maintained.

  Further, in the first and second embodiments, the first support means 21 is moved by the moving device 30. However, the moving device (moving means) 30 includes the first support means 21 and the first support means 21. What is necessary is just to move the position of the 1st support means 21 relatively with respect to the position of the 2nd support means 22 and the roller 60 in the state which maintained the space | interval with the 2 support means 22. FIG. That is, if the position of the first support means 21 moves relative to the positions of the second support means 22 and the roller 60 as the entire apparatus, the second support means 22 and the roller 60 are moved by the moving means. The position of may be moved. Further, all of the first support means 21, the second support means 22, and the roller 60 may be movable.

  Furthermore, in the said 1st and 2nd embodiment, the 2nd surface is rotated from the position which rotates the 2nd support means 22 as the rotation apparatus 40, and the 2nd surface of a 2nd workpiece | work faces upwards. Although what used to move to the position which turns down was used, rotation device (rotating means) 40 moves the position so that it may be easy to peel off a protective film from the 1st work and / or the 2nd work, The operation is not limited to the embodiment. In the rotating means, the second surface of the second workpiece and the second surface of the first workpiece are opposed to each other from the position where the second support means 22 and / or the first support means 21 is peeled off the protective film. What is necessary is just to rotate to the position to do. Note that the rotating means may be omitted.

It is an apparatus for bonding the workpiece | work concerning the 1st Embodiment of this invention, Comprising: The figure which shows a mode that the 1st workpiece | work and the 2nd workpiece | work are mounted in the 1st stage and the 2nd stage, respectively. It is the apparatus of FIG. 1, Comprising: The figure which shows the state which has peeled off each protective film from the 1st and 2nd workpiece | work. The figure for demonstrating the 1st process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 2nd process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 3rd process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 4th process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 5th process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure which shows the state which bonded the 1st workpiece | work and the 2nd workpiece | work in the apparatus of FIG. It is an apparatus for bonding the workpiece | work concerning the 2nd Embodiment of this invention, Comprising: The figure which shows the state which has peeled off the protective film from the 1st and 2nd workpiece | work, respectively. The figure for demonstrating the 1st process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 2nd process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 3rd process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 4th process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure for demonstrating the 5th process of bonding a 1st workpiece | work and a 2nd workpiece | work in the apparatus of FIG. The figure which shows the state which bonded the 1st workpiece | work and the 2nd workpiece | work in the apparatus of FIG.

Explanation of symbols

1a Film bonding device (device for bonding workpieces)
1b Substrate bonding device (device for bonding workpieces)
11 First film (first workpiece)
11a (first film) first surface 11b (first film) second surface 11c (first film) one end 11d (first film) other end 12 Second film (second work)
12a (second film) first surface, 12b (second film) second surface 12c (second film) one end 12d (second film) other end 13 , 14, 83, 84 Protective film 21 First stage (first support means), 21a First support surface 22 Second stage (second support means), 22a Second support surface 22c (second 3rd stage (third support means), 23a third support surface 30 moving device (moving device), 40 rotating device (rotating device)
50 air cylinders (means for moving the third support means), 60 rollers,
71 1st head, 72 2nd head 81 1st board | substrate (1st workpiece | work)
81a (first substrate) first surface, 81b (first substrate) second surface 81c (first substrate) one end, 81d (first substrate) other end 82 Second substrate (second workpiece)
82a (second substrate) first surface, 82b (second substrate) second surface 82c (second substrate) one end, 82d (second substrate) other end 90 spacer, 100 spacer driving device (spacer driving means)
110 Elastic member

Claims (8)

An apparatus for bonding a first workpiece and a second workpiece,
First support means having a first support surface for sucking and supporting the first workpiece;
A second support surface for sucking and supporting a portion excluding one end of the second workpiece in a state where the first workpiece and the second workpiece are opposed to each other with a minute gap therebetween. A second support means provided;
A roller for pressing the one end of the second workpiece against the first workpiece from the side opposite to the first workpiece;
The position of the first support means is moved relative to the position of the second support means and the roller in a state where the distance between the first support means and the second support means is maintained. Moving means for causing
In the state where the roller presses the one end of the second workpiece against the one end of the first workpiece and presses the second workpiece against the first workpiece. By moving the position of the roller relative to the other end of the first work supported by the first support means, the second work is attached to the first work. In addition,
When the one end of the second work is pressed against the one end of the first work by the roller, the second work comes into contact with the other end of the second work. A spacer for maintaining a distance between the other end of the workpiece and the other end of the first workpiece, and the second support means together with the first support means by the moving means. A spacer that moves relative to
To move the spacer between a first state that protrudes toward the second support means with respect to the first support surface and a second state that does not protrude with respect to the first support surface. And a spacer driving means . 2. The apparatus according to claim 1 , wherein the spacer driving unit moves the spacer from the first state to the second state in conjunction with an operation of the moving unit. 3. The device according to claim 1 or 2 , wherein the spacer is of a pin type. In any one of claims 1 to 3, the opposite end from said roller of the second support means, said protruding portion protruding from the end opposite the roller of the first support means Has
The said spacer is an apparatus which opposes the said overhang | projection part in the said 1st state. In any one of claims 1 to 4, wherein the first support means includes a porous elastic member forming the first supporting surface, device. An apparatus for bonding a first workpiece and a second workpiece,
First support means having a first support surface for sucking and supporting the first workpiece;
A second support surface for sucking and supporting a portion of the second workpiece excluding one end portion in a state where the first workpiece and the second workpiece are opposed to each other with a minute gap therebetween. A second support means;
A roller that presses the one end of the second workpiece against the first workpiece from the side opposite to the first workpiece;
The position of the first support means is moved relative to the position of the second support means and the roller in a state where the distance between the first support means and the second support means is maintained. Moving means for causing
In the state where the roller presses the one end of the second workpiece against the one end of the first workpiece and presses the second workpiece against the first workpiece. By moving the position of the roller relative to the other end of the first work supported by the first support means, the second work is attached to the first work. In addition,
Each of the first workpiece and the second workpiece is supported by the first support surface and the second support surface, respectively.
A first head for peeling a protective film from a second surface of the first work supported by suction on the first support surface;
A second head for peeling off the protective film from the second surface of the second workpiece supported by suction on the second support surface ;
Third support means comprising a third support surface for sucking and supporting the one end of the second workpiece;
From the first position where the third support surface sucks and supports the second workpiece together with the second support surface from the one end of the second workpiece, the third support means Means for moving the third support means to a distant second position . 7. The second surface of the second workpiece and the second surface of the first workpiece according to claim 6 , wherein the second support means and / or the first support means are separated from the position where the protective film is peeled off. The apparatus further includes means for rotating the surface to a position facing the surface of the device. In claim 7 ,
The first support means supports the first work with the second surface facing upward,
The rotating means rotates the second support means and moves the second support means from a position where the second surface of the second workpiece is upward to a position where the second surface is downward.

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