JP5082882B2 - Connection device for flexible substrates - Google Patents

Description

  The present invention relates to an apparatus and method for electrical connection with a high-frequency signal pattern formed on a flexible substrate, and in particular, a connection device for a flexible substrate capable of stably passing a high-frequency electrical signal from an inspection apparatus to a flexible substrate. And a connection method.

  The flexible substrate on which the high frequency device is formed is inspected. At this time, a connection device for connecting the flexible substrate and the inspection device is used. As such a connection device, conventionally, a coplanar type high-frequency probe in which two or more probes are arranged in the lateral direction, or a spring type probe in which a non-flat surface can be probed by incorporating a spring has been used. In addition, a method has been proposed in which a device is pressed against a flexible substrate while the flexible substrate is placed on rubber (see, for example, Patent Document 1).

WO00 / 04394

  However, unevenness occurs between the surface of the base film of the flexible substrate and the surface of the conductor pattern formed thereon, and the flexible substrate itself warps with a slight external force, so that the flexible substrate has poor flatness. Therefore, it has been difficult to obtain a stable contact with the coplanar type high frequency probe. The method of Patent Document 1 can absorb large warps of the flexible substrate and device irregularities, but cannot absorb the fine irregularities of the conductor pattern of the flexible substrate, making it difficult to achieve stable contact.

  In addition, impedance matching cannot be secured in a high frequency region of, for example, about 500 MHz or more with a spring type probe. Furthermore, when the high-frequency signal pattern of the flexible substrate is brought into direct contact with the electrode pattern formed on the dielectric substrate connected to the inspection apparatus, the surface contact cannot be obtained well due to the above-described poor flatness, and the high-frequency signal It was difficult to pass through stably. Therefore, it is difficult to stably pass a high-frequency electrical signal through the flexible substrate without using a method such as soldering or wire bonding, and inspection of a product having a high-frequency device mounted on the flexible substrate cannot be performed with high accuracy and efficiency. There was a problem.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a connecting device and a connecting method for a flexible substrate that can stably pass a high-frequency electric signal from the inspection device to the flexible substrate. Is.

A connecting device for a flexible substrate according to the present invention is a device for performing electrical connection with a high-frequency signal pattern formed on a flexible substrate, and covers a dielectric substrate on which an electrode pattern is formed and the electrode pattern. Provided with a contactor having conductivity and flexibility, and a metal stage having a recess and electrically grounded, and two grounding patterns so as to sandwich a high-frequency signal pattern on the flexible substrate The dielectric substrate and the contactor are disposed in the recess, and the width of the recess is narrower than the interval between the two grounding patterns .

  A connection method for a flexible substrate according to the present invention is a method for electrical connection with a high-frequency signal pattern formed on a flexible substrate, and covers an electrode pattern formed on a dielectric substrate, A conductive and flexible contactor is provided, and the high-frequency signal pattern on the flexible substrate is detachably pressed against the contactor, so that the high-frequency signal pattern on the flexible substrate and the electrode pattern on the dielectric substrate are electrically connected via the contactor. Connect to. Other features of the present invention will become apparent below.

  According to the present invention, it is possible to stably pass a high-frequency electric signal from the inspection apparatus to the flexible substrate.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing a connection device for a flexible substrate according to Embodiment 1 of the present invention, and FIG. 2 is a perspective view showing a state in which the flexible substrate is connected to the connection device of FIG. The coaxial connector 10 of the connection device 14 is connected to an inspection device (not shown). The flexible substrate 11 is inspected by connecting the flexible substrate 11 having the high-frequency discrete element 9 to the connection device 14. Hereinafter, the configuration of each unit will be described in detail.

  FIG. 3 is a perspective view of the flexible substrate according to Embodiment 1 of the present invention as viewed from the front side. On the flexible substrate 11, a high-frequency signal pattern 12 is formed, and two grounding patterns 13a and 13b are formed so as to sandwich the high-frequency signal pattern 12. That is, a GSG (Ground Signal Ground) structure is formed as an electrode pattern. This GSG structure is used, for example, to send a high-frequency signal to a laser module.

  4 is an enlarged perspective view of a portion surrounded by a dotted line in FIG. 1, and FIG. 5 is a perspective view showing a dielectric substrate of the connection device in FIG. The connection device 14 for the flexible substrate is a device that electrically connects the high-frequency signal pattern 12 and the grounding patterns 13a and 13b formed on the flexible substrate 11.

  An electrode pattern 16 is formed on the dielectric substrate 15 at a position corresponding to the high-frequency signal pattern 12 of the flexible substrate 11. The electrode pattern 16 is connected to a core wire side terminal (not shown) of the coaxial connector 10. A contactor 17 is provided so as to cover the electrode pattern 16. The contactor 17 has conductivity and flexibility.

  The metal stage 18 is grounded and connected to a ground side terminal (not shown) of the coaxial connector 10. A recess 19 is formed on the upper surface of the metal stage 18. The width W of the concave portion 19 is narrower than the inner space S between the two grounding patterns 13a and 13b. Thereby, electrical contact between the grounding patterns 13a and 13b and the metal stage 18 can be ensured. The dielectric substrate 15 and the contactor 17 are disposed in the recess 19. However, since the depth of the recess 19 is slightly shallower than the thickness of the dielectric substrate 15 and the contactor 17 overlapped, a part of the contactor 17 protrudes from the upper end of the recess 19.

  The distance S between the two grounding patterns 13a and 13b refers to the distance between the opposing inner surfaces of the grounding patterns 13a and 13b, and is typically about 0.5 mm to 10 mm. The width W of the recess 19 is typically about 0.3 mm to 9 mm. The thickness of the contactor 17 is typically about 0.2 mm to 3 mm. The height at which a part of the contactor 17 protrudes from the recess 19 is desirably at least higher than the thickness of the ground pattern of the flexible substrate, and is typically about 0.005 mm to 1 mm. The thickness of the flexible substrate is typically about 0.01 mm to 0.2 mm, and the thickness of the conductor pattern on the flexible substrate is typically about 0.005 mm to 0.1 mm. The width of the flexible substrate is, for example, about 3 mm to 10 mm, but is not limited to this because it depends on the mounting form and the presence or absence of other wiring.

  Next, a method for performing electrical connection with the high-frequency signal pattern 12 formed on the flexible substrate 11 using the connection device 14 will be described.

  As shown in FIG. 6, the flexible substrate 11 is placed on the connection device 14 with the surface on which the high-frequency signal pattern 12 is formed facing the connection device 14 side. Then, a load is applied to the flexible substrate 11 from above, and the high-frequency signal pattern 12 of the flexible substrate 11 is detachably pressed against the contactor 17, so that the high-frequency signal pattern 12 of the flexible substrate 11 and the electrode pattern of the dielectric substrate 15 are pressed. 16 are electrically connected to each other through a contactor 17. At this time, the contactor 17 is contracted by the load, and the two grounding patterns 13 a and 13 b of the flexible substrate 11 are brought into contact with the metal stage 18 around the recess 19. Here, since the back surface of the dielectric substrate 15 is in contact with the concave portion 19 of the grounded metal stage 18, the transmission line formed by the electrode pattern 16 on the surface of the dielectric substrate 15 has a certain impedance.

  FIG. 7 is an enlarged cross-sectional view of a part of FIG. A contactor 17 shown in FIG. 7 is a resin (anisotropic conductive sheet) in which conductive particles 21 are embedded in a columnar shape in the approximate thickness direction of the contactor 17, and a high-frequency signal is transmitted only in the approximate thickness direction of the contactor 17. Flowing. When the contactor 17 is sandwiched and contracted by the high frequency signal pattern 12 on the flexible substrate 11 and the electrode pattern 16 on the dielectric substrate 15, the high frequency signal pattern 12 and the electrode pattern 16 are interposed via the conductive particles 21 contained in the contactor 17. Are electrically connected. In the direction perpendicular to the thickness of the contactor 17, the conductive particles 21 are electrically insulated from each other by the resin. Therefore, the portion of the contactor 17 not sandwiched between the high-frequency signal pattern 12 and the electrode pattern 16 Electrical insulation is taken from the pattern 12 and the electrode pattern 16. Therefore, the high-frequency signal flows between the high-frequency signal pattern 12 and the electrode pattern 16, and the high-frequency signal does not leak to the installed metal stage 18, and the high-frequency signal pattern 12 and the electrode pattern 16 are connected in a state where impedance is matched. Can be electrically connected.

  FIG. 8 is an enlarged cross-sectional view showing another example of the connection device for flexible substrates according to Embodiment 1 of the present invention. The contactor 17 is a resin (anisotropic conductive sheet) in which a thin metal wire 21 ′ is embedded along the substantially thickness direction of the contactor 17, and a high-frequency signal flows only in the approximately thickness direction of the contactor 17. Therefore, the high frequency signal flows only between the high frequency signal pattern 12 and the electrode pattern 16. Therefore, the high-frequency signal leaking to the metal stage can be suppressed, and the high-frequency signal pattern 12 and the electrode pattern can be metallically connected with the impedance matched.

  As described above, in the present invention, the flexible contactor 17 is provided between the high-frequency signal pattern 12 of the flexible substrate 11 and the electrode pattern 16 of the dielectric substrate 15 so as to be fitted into the recess of the metal stage 18. ing. The contactor 17 absorbs the unevenness of the high-frequency signal line, the ground pattern and the base film in the flexible substrate 11, the unevenness in the pattern of the high-frequency signal line 12, and the warp of the flexible substrate 11, thereby 12 and the electrode pattern 16 of the dielectric substrate 15 can be improved, and good electrical connection can be ensured. Thereby, it is possible to stably pass a high-frequency electric signal from the inspection apparatus to the flexible substrate without performing soldering or wire bonding.

Embodiment 2. FIG.
FIG. 9 is a perspective view of the flexible substrate according to Embodiment 2 of the present invention as viewed from the front side. Two high-frequency signal patterns 12a and 12b are formed on the flexible substrate 11, and two grounding patterns 13a and 13b are formed so as to sandwich the two high-frequency signal patterns 12a and 12b. . That is, a GSSG (Ground Signal Signal Ground) structure is formed as an electrode pattern.

  FIG. 10 is a perspective view showing a flexible substrate connecting apparatus according to Embodiment 2 of the present invention, and FIG. 11 is a perspective view showing a dielectric substrate of the connecting apparatus shown in FIG. Two electrode patterns 16 a and 16 b are formed on the dielectric substrate 15. Other configurations are the same as those of the first embodiment.

  Next, a method for electrically connecting the two high-frequency signal patterns 12a and 12b formed on the flexible substrate 11 using the connection device 14 will be described. As shown in FIG. 12, the two high-frequency signal patterns 12 a and 12 b on the flexible substrate 11 and the two electrode patterns 16 a and 16 b on the dielectric substrate 15 are electrically connected via the contactor 17. Other steps are the same as those in the first embodiment.

  As described above, even when the GSSG structure is adopted as the electrode pattern of the flexible substrate, the same effect as in the first embodiment can be obtained.

Embodiment 3 FIG.
FIG. 13 is a perspective view of the flexible substrate according to Embodiment 3 of the present invention as viewed from the front side. Similar to the first embodiment, a GSG structure is formed as an electrode pattern. FIG. 14 is a perspective view of the flexible substrate according to Embodiment 3 of the present invention as seen from the back side. DC bias patterns 23a and 23b are formed on the surface (back surface) opposite to the surface (front surface) on which the high-frequency signal pattern 12 of the flexible substrate 11 is formed. The DC bias patterns 23 a and 23 b are electrode patterns for applying a DC bias (DC current or DC voltage) to the flexible substrate 11. Here, the DC bias patterns 23a and 23b are arranged outside the GSG structure so as not to block the electromagnetic field of the high-frequency signal transmitted through the GSG structure. The configuration of the connection device is the same as that of the first embodiment.

  Next, a method for electrical connection with the high-frequency signal pattern 12 formed on the flexible substrate 11 will be described. As shown in FIG. 15, the flexible substrate 11 is placed on the connection device 14 with the surface on which the high-frequency signal pattern 12 is formed facing the connection device 14. The electrode probes 24a and 24b are brought into contact with the DC bias patterns 23a and 23b, respectively, and a DC bias is applied. At the same time, a load is applied to the flexible substrate 11 from above by the electrode probes 24a and 24b, and the high-frequency signal pattern 12 of the flexible substrate 11 is detachably pressed against the contactor 17. Here, since the electrode probes 24 a and 24 b do not flow a high-frequency signal, the electrode probes 24 a and 24 b can be set to a thickness suitable for applying a load to the flexible substrate 11.

  According to the present embodiment, a load can be applied to the flexible substrate 11 by the DC bias patterns 23a and 23b for applying a DC bias. In addition, the same effects as those of the first embodiment can be obtained.

Embodiment 4 FIG.
FIG. 16 is a perspective view of a flexible substrate according to Embodiment 4 of the present invention as viewed from the front side. A high-frequency signal pattern 12 is formed on the flexible substrate 11. FIG. 17 is a perspective view of the flexible substrate according to the fourth embodiment of the present invention as seen from the back side. A grounding pattern 22 is partially formed on the surface (back surface) opposite to the surface (front surface) on which the high-frequency signal pattern 12 of the flexible substrate 11 is formed.

  18 is a perspective view showing a connecting device for a flexible substrate according to Embodiment 4 of the present invention, and FIG. 19 is a perspective view showing a dielectric substrate of the connecting device of FIG. The connection device 14 for the flexible substrate is a device that performs electrical connection with the high-frequency signal pattern 12 formed on the flexible substrate 11.

An electrode pattern 16 is formed on the dielectric substrate 15 at a position corresponding to the high-frequency signal pattern 12 of the flexible substrate 11. The electrode pattern 16 is connected to an inspection device (not shown) for inspecting the flexible substrate 11. A contactor 17 is provided on one side so as to cover the electrode pattern 16. The contactor 17 has conductivity.
The dielectric substrate 15 and the contactor 17 can be provided on a grounded metal stage 18 having a recess 19 on the upper surface, as in the first embodiment shown in FIG. In this case, the metal stage 18 is connected to the ground side terminal of the coaxial connector 10, and the electrode pattern 16 of the dielectric substrate 15 is connected to the core line side terminal of the coaxial connector 10. The width of the flexible substrate 11 may be narrower or wider than the width W of the concave portion 19 of the metal stage 18.
The dielectric substrate 15 and the contactor 17 can be provided on a flat surface of a grounded metal stage (not shown) that does not have a recess on the upper surface. In this case, the metal stage is connected to the ground side terminal of the coaxial connector 10, and the electrode pattern 16 of the dielectric substrate 15 is connected to the core line side terminal of the coaxial connector 10.
Further, when a ground pattern (not shown) is formed on the back surface of the dielectric substrate 15, impedance matching can be achieved with respect to the electrode pattern on the surface of the dielectric substrate 15, so that the dielectric material can be used without using a metal stage. The ground pattern is connected to the ground side terminal of the coaxial connector 10 on the back surface of the substrate 15, the electrode pattern 16 of the dielectric substrate 15 is connected to the core line side terminal of the coaxial connector 10, and the contactor 17 is placed on one side so as to cover the electrode pattern 16. By providing in, it can be set as the apparatus which electrically connects with the pattern 12 for high frequency signals formed on the flexible substrate 11. FIG.

  Next, a method for performing electrical connection with the high-frequency signal pattern 12 formed on the flexible substrate 11 using the connection device 14 will be described. As shown in FIG. 20, the flexible substrate 11 is placed on the connection device 14 with the surface on which the high-frequency signal pattern 12 is formed facing the connection device 14 side. Then, the electrically grounded metal component 25 is brought into contact with the grounding pattern 22. Then, a load is applied to the flexible substrate 11 from above due to the weight of the metal component 25 or external pressure, and the high-frequency signal pattern 12 of the flexible substrate 11 is detachably pressed against the contactor 17.

  According to the present embodiment, it is possible to apply a load to the flexible substrate 11 using the metal component 25 for securing electrical ground as a weight. In addition, the contactor 17 absorbs the unevenness between the high-frequency signal line and the base film in the flexible substrate 11, the unevenness in the pattern of the high-frequency signal line 12, and the warp of the flexible substrate 11. 12 and the electrode pattern 16 of the dielectric substrate 15 can be improved, and good electrical connection can be ensured. Thereby, it is possible to stably pass a high-frequency electric signal from the inspection apparatus to the flexible substrate without performing soldering or wire bonding.

Embodiment 5 FIG.
FIG. 21 is a perspective view of the flexible substrate according to the fifth embodiment of the present invention as viewed from the front side. A high-frequency signal pattern 12 is formed on the flexible substrate 11. FIG. 22 is a perspective view of the flexible substrate according to Embodiment 5 of the present invention viewed from the back side. A grounding pattern 22 and DC bias patterns 23a and 23b are formed on the surface (back surface) opposite to the surface (front surface) on which the high-frequency signal pattern 12 is formed on the flexible substrate 11. The DC bias patterns 23 a and 23 b are electrode patterns for applying a DC bias (DC current or DC voltage) to the flexible substrate 11. The configuration of the connection device is the same as that of the fourth embodiment.

  Next, a method for electrical connection with the high-frequency signal pattern 12 formed on the flexible substrate 11 will be described. As shown in FIG. 23, the flexible substrate 11 is placed on the connection device 14 with the surface on which the high-frequency signal pattern 12 is formed facing the connection device 14 side. The electrode probes 24a and 24b are brought into contact with the DC bias patterns 23a and 23b, respectively, and a DC bias is applied. At the same time, a load is applied to the flexible substrate 11 from above by the electrode probes 24a and 24b, and the high-frequency signal pattern 12 of the flexible substrate 11 is detachably pressed against the contactor 17.

  According to the present embodiment, a load can be applied to the flexible substrate 11 by the DC bias patterns 23a and 23b for applying a DC bias. In addition, the same effects as in the fourth embodiment can be obtained.

It is a perspective view which shows the connection apparatus for flexible substrates which concerns on Embodiment 1 of this invention. It is a perspective view which shows the state which connected the flexible substrate to the connection apparatus of FIG. It is the perspective view which looked at the flexible substrate concerning Embodiment 1 of the present invention from the surface side. It is the perspective view which expanded the part enclosed with the dotted line of FIG. FIG. 5 is a perspective view showing a dielectric substrate of the connection device of FIG. 4. It is a perspective view for demonstrating the connection method for flexible substrates which concerns on Embodiment 1 of this invention. It is sectional drawing to which a part of FIG. 6 was expanded. It is an expanded sectional view which shows the other example of the connection apparatus for flexible substrates which concerns on Embodiment 1 of this invention. It is the perspective view which looked at the flexible substrate which concerns on Embodiment 2 of this invention from the surface side. It is a perspective view which shows the connection apparatus for flexible substrates which concerns on Embodiment 2 of this invention. It is a perspective view which shows the dielectric substrate of the connection apparatus of FIG. It is a perspective view for demonstrating the connection method for flexible substrates which concerns on Embodiment 2 of this invention. It is the perspective view which looked at the flexible substrate which concerns on Embodiment 3 of this invention from the surface side. It is the perspective view which looked at the flexible substrate which concerns on Embodiment 3 of this invention from the back surface side. It is a perspective view for demonstrating the connection method for flexible substrates which concerns on Embodiment 3 of this invention. It is the perspective view which looked at the flexible substrate which concerns on Embodiment 4 of this invention from the surface side. It is the perspective view which looked at the flexible substrate which concerns on Embodiment 4 of this invention from the back surface side. It is a perspective view which shows the connection apparatus for flexible substrates which concerns on Embodiment 4 of this invention. It is a perspective view which shows the dielectric substrate of the connection apparatus of FIG. It is a perspective view for demonstrating the connection method for flexible substrates which concerns on Embodiment 4 of this invention. It is the perspective view which looked at the flexible substrate which concerns on Embodiment 5 of this invention from the surface side. It is the perspective view which looked at the flexible substrate which concerns on Embodiment 5 of this invention from the back surface side. It is a perspective view for demonstrating the connection method for flexible substrates which concerns on Embodiment 5 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Flexible substrate; 12, 12a, 12b High frequency signal pattern; 13a, 13b, 22 Ground pattern; 14 Flexible substrate connection device; 15 Dielectric substrate; 16, 16a, 16b Electrode pattern; 17 Contactor; 19 recesses; 21 conductive particles; 21 'fine metal wires; 23a and 23b DC bias patterns; 24a and 24b electrode probes; 25 metal parts

Claims (3)

An apparatus for electrical connection with a high-frequency signal pattern formed on a flexible substrate,
A dielectric substrate on which an electrode pattern is formed;
A contactor provided to cover the electrode pattern and having conductivity and flexibility ;
A metal stage having a recess and electrically grounded ,
Two grounding patterns are formed on the flexible substrate so as to sandwich the high-frequency signal pattern,
The dielectric substrate and the contactor are disposed in the recess,
The connecting device for a flexible substrate, wherein the width of the concave portion is narrower than the interval between the two grounding patterns . The connection device according to claim 1 , wherein the contactor is a resin in which conductive particles are embedded. The connection device according to claim 1 , wherein the contactor is a resin in which a thin metal wire is embedded in a substantially thickness direction of the contactor .

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