JP5083132B2 - Multilayer printed wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer printed wiring board using a substrate sheet with conductive bumps.

  Conventionally, a flexible screen mask (screen plate) having a hole (through hole) for holding a conductive paste at a predetermined position is stretched on the surface of a substrate to be printed (surface of a base material). The conductive paste placed on the screen mask is filled in the space defined by the holding holes and the surface of the printing medium by moving the squeegee member that presses the surface of the printing body along the surface of the printing body. A method of forming a paste bump in which a conductive paste filled in a space with a tensile force when the screen mask is separated from the surface of the printing body is formed into a substantially conical shape, between the screen mask and the printing body. There is known a method of moving a squeegee member in a state where a hole lower surface and a printing medium are slightly separated from each other by interposing a spacer (see Patent Document 1 and Patent Document 2).

  According to such a method, a conductive bump having a desired height can be formed with a small number of printings, and the manufacturing time of the substrate with conductive bumps can be shortened.

Further, when the number of screen printing process executions is a, and the rate of occurrence of defects in one screen printing process is b, the yield rate is (1−b) ^a ≈1−a × b, and the screen printing process is executed. As the number of times increases, the yield rate in the production of the substrate sheet with conductive bumps decreases. However, according to the method described above, the number of executions of the screen printing process can be reduced, so the yield rate is increased. can do.
Japanese Patent Laid-Open No. 2004-6577 JP 2003-320640 A

  However, in the conventional method described above, a spacer is interposed between the screen mask and the printing medium in order to move the squeegee member in a state where the hole lower surface and the printing medium are slightly separated from each other. For this reason, the spacer may be peeled off when cleaning the screen mask, and it is difficult to continue using the screen mask for a long time. In the first place, it is difficult to manufacture a screen mask with spacers in this way.

  The present invention has been made in consideration of such points, and can reduce the number of steps of applying a conductive paste to the surface of a substrate sheet, and can use a screen plate for a long period of time. A multilayer printed wiring board using a substrate sheet with conductive bumps that can be easily transferred and the conductive paste can be transferred with the screen plate and the substrate slightly spaced apart An object of the present invention is to provide a method of producing

A multilayer printed wiring board manufacturing method according to the present invention includes:
A printing platen holds a base material including a flat plate member having a plurality of flat plate protrusions and a lower substrate sheet placed on the flat plate member and having a substrate protrusion corresponding to the flat plate protrusions. A substrate holding step;
A first positioning step of positioning a screen plate having a plurality of through holes on the substrate;
A base material transfer step of transferring a conductive paste from the through hole of the screen plate to the substrate convex portion of the lower substrate sheet;
A base material curing step for curing the conductive paste transferred onto the lower substrate sheet to form conductive bumps;
A placing step of placing an upper substrate sheet on the conductive bump;
A pressing step of pressing the upper substrate sheet and penetrating the conductive bumps into the lower surface of the upper substrate sheet;
A circuit forming step of forming a circuit by masking a predetermined region of the lower substrate sheet and the upper substrate sheet, and removing a region other than the predetermined region; and
The substrate convex portion of the lower substrate sheet is provided at a position other than the predetermined region, and is removed in the circuit forming step.

In the method for producing a multilayer printed wiring board according to the present invention,
It is preferable to further include a base material positioning step for positioning the base material with respect to the printing surface plate so that a conductive paste is placed between the substrate convex portions.

In the method for producing a multilayer printed wiring board according to the present invention,
The base material positioning step includes a base material image acquisition step of acquiring an image of a base material held on the printing surface plate by an image acquisition device, and a base for displaying an image acquired by the image acquisition device by an image display device. It is preferable to include a material image display step and a base material position adjustment step of adjusting the position of the base material with respect to the printing surface plate based on an image displayed by the image display device.

In the method for producing a multilayer printed wiring board according to the present invention,
The screen plate is preferably used when forming the flat projections of the flat plate member.

In such a multilayer printed wiring board manufacturing method,
A prepared body holding step for holding a flat plate member prepared body by the printing surface plate,
A second positioning step of positioning a screen plate having a plurality of through holes on the flat plate-shaped member preparation;
A preparation body transfer step of transferring a conductive paste from the through hole of the screen plate to a flat member preparation body,
The position of the conductive paste transferred to the flat member preparation preferably corresponds to a position surrounding the position of the conductive paste transferred in the substrate transfer step.

  According to the present invention, the state where the screen plate and the base material are slightly separated is realized by the substrate convex portion of the lower substrate sheet, and the conductive paste is transferred between the substrate convex portions. For this reason, the number of steps of applying the conductive paste to the surface of the lower substrate sheet can be reduced, and the screen plate can be used for a long period of time. It is possible to easily realize the transfer of the conductive paste in a state of being slightly separated from each other.

  Furthermore, according to this invention, the board | substrate convex part of a lower board | substrate sheet | seat is provided in positions other than the predetermined area | region masked by a circuit formation process, and is removed at the time of circuit formation. For this reason, it can prevent that the said board | substrate convex part has a bad influence in a post process.

BEST MODE FOR CARRYING OUT THE INVENTION

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a multilayer printed wiring board manufacturing method according to the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 11 are diagrams showing an embodiment of the present invention.

  In the present embodiment, the substrate sheet manufacturing system with conductive bumps includes a substrate protrusion generating device (see FIGS. 1A and 1B) that forms a substrate protrusion 61a on the substrate, and a substrate protrusion of the lower substrate sheet 61. And a printing device (see FIG. 2) for transferring the conductive paste 70 between the portions 61a.

  As shown in FIGS. 1 (a) and 1 (b), the substrate convex portion generating apparatus includes a holding portion 1 that holds and holds a flat plate member 62 having a plurality of flat plate convex portions 62a by a suction force from the suction holes 1a. Then, pressure is applied to the lower substrate sheet 61 (for example, a metal foil such as a copper foil having a thickness of 18 μm) placed on the flat plate protrusion 62 a of the flat plate member 62, and the flat plate member 62 is applied to the lower substrate sheet 61. The pressure roller (pressure part) 10 which forms the board | substrate convex part 61a corresponding to this flat plate convex part 62a is provided. Note that the flat plate member 62 is provided with an opening (not shown), and the lower substrate sheet 61 is held through an adsorption force through the opening.

  By the way, as the flat member 62, metal sheets, such as copper, SUS, and aluminum, films and resin sheets, such as PET, PP, and PE, can be used. Moreover, as the pressure roller 10, a rubber roll, a metal roll, a resin roll, etc. can be used.

  In the present embodiment, the pressure roller 10 is used as a pressure portion for forming the substrate convex portion 61a corresponding to the flat plate convex portion 62a of the flat plate member 62 on the lower substrate sheet 61 (FIG. 1 ( a) and (b)), without being limited thereto, for example, a flat press may be used.

  As shown in FIG. 2, the printing apparatus includes a printing platen 30 that holds the base 60, a screen plate 27 such as a metal mask provided with a plurality of through holes 27 a having a predetermined pattern, and the screen. A holding portion 26 for holding the plate 27 and a conductive paste 70 (see FIG. 8) such as a silver paste or a solder paste, which is scanned on the screen plate 27 and is placed on the screen plate 27, are formed through the through holes 27a. And a squeegee 22 to be transferred onto the lower substrate sheet 61 of the material 60. The squeegee mechanism 20 includes the squeegee 22 described above and the guide member 21 that guides the squeegee 22. Here, the substrate 60 is a flat plate member 62 having a plurality of flat plate protrusions 62a, and a lower substrate sheet 61 that is placed on the flat plate member 62 and has a substrate protrusion 61a corresponding to the flat plate protrusions 62a. It is made up of.

  As shown in FIG. 2, a CCD camera (image acquisition device) 11 that acquires an image of the substrate 60 held on the printing surface plate 30 is disposed on the upstream side of the squeegee mechanism 20. The CCD camera 11 is connected to a display screen (image display device) 12 for displaying an image acquired by the CCD camera 11.

  As shown in FIG. 2, the printing surface plate 30 includes a position adjusting device 35 that adjusts the position of the base material 60 with respect to the printing surface plate 30. The position adjustment unit 35 is connected to a position instruction unit 16 that transmits an instruction input by an operator. The base material 60 is provided with an alignment mark (not shown), and the position of the base material 60 relative to the printing surface plate 30 is positioned by photographing the alignment mark with the CCD camera 11.

  In the present embodiment, a positioning mechanism that is positioned from the CCD camera 11, the display screen 12, the position adjustment device 35, and the position instruction unit 16 is configured. A guide member 31 for guiding the printing surface plate 30 extends in the horizontal direction below the printing surface plate 30.

  Further, as shown in FIGS. 3A and 3B, the position adjusting device 35 is provided with a suction hole 35a, and the base material 60 is sucked and held by the suction force from the suction hole 35a. It will be. In the present embodiment, a description will be given using a mode in which the base material 60 is adsorbed and held by the suction holes 35a of the position adjusting device 35 as described above. However, the present invention is not limited to this. A suction plate may be provided on the position adjustment device 35, and the base member 60 may be sucked and held by the suction force from the suction plate.

  Next, the operation of the present embodiment having such a configuration will be described.

(Generation of lower substrate sheet 61 having substrate convex portion 61a)
First, a process of generating the lower substrate sheet 61 having the substrate convex portion 61a will be described.

  First, the flat plate member 62 having a plurality of flat plate protrusions 62a is sucked and held by the suction force from the suction hole 1a of the holding portion 1 (see FIG. 1A). Next, the plurality of flat plate protrusions 62a of the flat plate member 62 and the lower substrate sheet 61 are brought into contact (contact step). More specifically, the lower substrate sheet 61 is placed on the flat plate member 62 (see FIG. 1A).

  Next, the pressure roller 10 is moved in the horizontal direction with the lower substrate sheet 61 pressed against the flat plate member 62 (see FIG. 1A). At this time, pressure is applied to the lower substrate sheet 61 by the pressure roller 10, and substrate protrusions 61 a corresponding to the plurality of flat plate protrusions 62 a of the flat plate member 62 are formed on the lower substrate sheet 61 (substrate protrusions). Part formation step) (see FIG. 1B).

(Generation of substrate sheet with conductive bumps)
Next, a process of generating a substrate sheet with conductive bumps will be described.

  First, a base material 60 comprising a flat plate member 62 having a plurality of flat plate convex portions 62a and a lower substrate sheet 61 having a substrate convex portion 61a corresponding to the flat plate convex portions 62a by the position adjusting device 35 of the printing surface plate 30. Is adsorbed and held (base material holding step) (see FIG. 2). The substrate 60 is placed on the printing surface plate 30 such that the flat plate member 62 is positioned below and the lower substrate sheet 61 is positioned above.

  Next, the base material 60 is positioned with respect to the printing surface plate 30 so that the conductive paste 70 transferred by the squeegee mechanism 20 is placed between the substrate convex portions 61a of the lower substrate sheet 61 (base). Material positioning step) (see FIG. 2).

  Specifically, first, an image of the substrate 60 held on the printing surface plate 30 is taken by the CCD camera 11 (substrate image acquisition step). Next, the image of the base material 60 thus captured by the CCD camera 11 is displayed on the display screen 12 (base material image display step).

  Next, the operator inputs an instruction to the position instruction unit 16 so as to move the printing surface plate 30 to a predetermined position based on the image displayed on the display screen 12. Then, according to this instruction, the position adjusting device 35 is driven, and the position of the substrate 60 with respect to the printing surface plate 30 is adjusted. For example, the operator inputs an instruction to the position instruction unit 16 so that the alignment mark on the base material 60 is photographed at the center position of the CCD camera 11. Then, in accordance with this instruction, the position adjusting device 35 is driven, and the position of the substrate 60 relative to the printing surface plate 30 is adjusted so that the alignment mark is at the center position of the CCD camera 11 (substrate position adjusting step).

  Next, the printing surface plate 30 is moved in the horizontal direction (right side in FIG. 7) along the guide member 31 by a driving force applied from a driving unit (not shown) (see FIG. 7). As a result, the screen plate 27 having a plurality of through holes 27a is positioned on the substrate 60 (first positioning step) (see FIG. 3A).

  Next, the squeegee 22 is scanned on the screen plate 27 along the guide member 21, and the conductive paste 70 placed on the screen plate 27 is placed on the lower substrate sheet 61 of the substrate 60 through the through holes 27a. Transferred (base material transfer step) (see FIG. 3B and FIG. 8).

  Here, according to the present embodiment, as described above, the printing surface plate 30 can be moved to a predetermined position based on the image displayed on the display screen 12 before the substrate transfer step. Therefore, in this base material transfer step, the conductive paste 70 transferred through the through hole 27a of the screen plate 27 by the squeegee 22 of the squeegee mechanism 20 is transferred between the substrate convex portions 61a of the lower substrate sheet 61. The substrate convex portion 61a can reliably transfer the image with the gap provided between the substrate sheet 61 and the screen plate 27. In addition, since a considerable portion of the transferred conductive paste 70 is not in contact with the screen plate 27, the amount of the conductive paste 70 taken away by the screen plate 27 when the screen plate 27 is released from the substrate sheet 61 is reduced. Can be reduced.

  Therefore, the height and amount of the conductive bumps 71 (see FIGS. 4A to 4C) can be sufficiently increased by transferring the conductive paste 70 onto the lower substrate sheet 61 once by the squeegee 22 of the squeegee mechanism 20. Can be made. As a result, the number of steps of applying the conductive paste 70 to the surface of the lower substrate sheet 61 can be reduced, and as a result, the manufacturing time of the substrate with conductive bumps can be shortened. Moreover, the yield rate in manufacture of a board | substrate sheet | seat with an electroconductive bump can also be made high.

  As described above, when the conductive paste 70 is placed between the substrate convex portions 61a of the lower substrate sheet 61, the printing surface plate 30 moves in the horizontal direction (left side in FIG. 9) and returns to the initial position. (See FIG. 9). At this time, the squeegee mechanism 20 also returns to the initial position (see FIG. 9).

  Next, the lower substrate sheet 61 is peeled from the flat plate member 62. Thereafter, the conductive paste 70 provided between the substrate convex portions 61a of the lower substrate sheet 61 is dried and cured (base material curing step). As a result, a substantially conical conductive bump 71 is formed on the lower substrate sheet 61 (for example, the lower surface has a diameter of about 0.2 mm) to generate a substrate sheet with conductive bumps (FIG. 4 ( a)). In the case where the conductive paste 70 is made of an ultraviolet curable material, instead of drying the conductive paste 70, the conductive paste 70 may be cured by irradiating with ultraviolet rays.

  When the substrate sheet with conductive bumps is generated as described above, the uncured insulating sheet 65 is placed on the substrate sheet with conductive bumps and pressed. As a result, the conductive bumps 71 penetrate the insulating sheet 65, and the insulating sheet 65 is positioned on the lower substrate sheet 61 (see FIG. 4B).

  Next, the upper substrate sheet 61 'is placed on the conductive bumps 71 of the lower substrate sheet 61 and the uncured insulating sheet 65 (placement step) (see FIG. 4B). Thereafter, the upper substrate sheet 61 'is pressed, and the conductive bumps 71 are penetrated into the lower surface of the upper substrate sheet 61' (pressing step) (see FIG. 4B). According to the present embodiment, since the amount of the conductive paste 70 transferred at a time is large, the electrical resistance between the substrate sheet 61 located below and the substrate sheet 61 located above is reduced. Can be small.

  Next, the insulating sheet 65 is cured, and thereafter, land regions (predetermined regions) of the lower substrate sheet 61 and the upper substrate sheet 61 'are masked. Next, by etching or the like, portions other than the land regions of the lower substrate sheet 61 and the upper substrate sheet 61 'are removed, and a circuit is formed (circuit formation step) (see FIG. 4C).

  Here, according to the present embodiment, the substrate convex portion 61a of the lower substrate sheet 61 is provided at a position other than the land area (outside the land diameter (for example, 300 μm)) (more specifically, the through hole 27a). Distance A between (see FIG. 3A) <Width R of land area (see FIG. 4C) <Distance B between substrate protrusions 61a (see FIG. 3A)), adjacent land areas A substrate convex portion 61a is provided therebetween. For this reason, the board | substrate convex part 61a of the lower board | substrate sheet | seat 61 will be removed by a circuit formation process, and it can prevent the board | substrate convex part 61a having a bad influence at a post process (for example, core printing).

  That is, as shown in FIGS. 5A and 5B and FIGS. 6A to 6C, the distance A between the through holes 27a (see FIG. 5A) <the distance B between the substrate convex portions 61a ( 5 (a)) <land area width R (see FIG. 6 (c)), and when the substrate convex portion 61a of the lower substrate sheet 61 is provided in the land area, circuit formation is performed. Even if a portion other than the land region of the lower substrate sheet 61 and the upper substrate sheet 61 ′ is removed in the process, the substrate convex portion 61a of the lower substrate sheet 61 remains. For this reason, there is an undeniable possibility that the substrate convex portion 61a will adversely affect the subsequent process. On the other hand, according to the present embodiment, since the substrate protrusion 61a is completely removed in the circuit forming process, such a possibility can be eliminated.

  By the way, according to the present embodiment, as shown in FIGS. 3A and 3B, the screen projection 27 and the base material 60 can be slightly separated by the substrate convex portion 61a (gap). Since G is provided), it is not necessary to use a spacer as in the prior art. For this reason, the spacer is not peeled off when the screen plate 27 is washed, and the screen plate 27 can be used for a long time.

  Further, according to the present embodiment, each conductive bump 71 is from the time when the conductive paste 70 is transferred between the substrate protrusions 61 a to the time when the conductive paste 70 is dried and the conductive bump 71 is formed. The board | substrate convex part 61a will be arrange | positioned between these. For this reason, even when the diameter of the conductive paste 70 is large, it is possible to prevent the adjacent conductive pastes 70 from being connected to each other, and thus to prevent a short circuit from occurring in the multilayer printed wiring board. can do. In addition, when the flat plate protrusion 62a of the flat plate member 62 is formed by a method as described later, the conductive paste 70 transferred in the base material transfer step is surrounded by about two or three substrate protrusions 61a. Become.

  As a method for forming such a substrate convex portion 61 a, it is preferable to use a screen plate 27 that is used when the conductive paste 70 is transferred between the substrate convex portions 61 a of the lower substrate sheet 61.

  Specifically, first, the plate-shaped member preparation body 62b is held by the printing surface plate 30 (preparation body holding step) (see FIG. 10). Next, the flat member preparation body 62b is positioned with respect to the printing surface plate 30 (preparation body positioning step) (see FIG. 2). At this time, the plate-shaped member preparation body 62b is shifted by a half pitch compared to the alignment (base material positioning step) when transferring the conductive paste 70 between the substrate convex portions 61a. In addition, the CCD camera 11, the display screen 12, and the position instruction | indication part 16 are used for the alignment at this time similarly to the base material positioning process mentioned above.

  Next, the printing surface plate 30 is moved in the horizontal direction (right side in FIG. 11) along the guide member 31 by a driving force applied from a driving unit (not shown) (see FIG. 11). As a result, the screen plate 27 having the plurality of through holes 27a is positioned on the flat plate-like member preparation body 62b (second positioning step).

  Next, the squeegee 22 is scanned on the screen plate 27 along the guide member 21, and the conductive paste 70 placed on the screen plate 27 is transferred onto the plate-like member preparation body 62b through the through hole 27a. (Preparator transfer step) (see FIG. 11).

  Here, as described above, the plate-shaped member preparation body 62b is compared to the alignment (base material positioning step) when the conductive paste 70 is transferred between the substrate convex portions 61a with respect to the printing surface plate 30. Since the positions are shifted by a half pitch, the conductive paste 70 can be transferred to the flat plate member preparation body 62b corresponding to the position surrounding the conductive paste 70 transferred in the base material transfer step described above. .

  After that, the conductive paste 70 transferred in this way is cured to form the flat plate protrusion 62a. And as above-mentioned, it has the board | substrate convex part 61a by mounting the lower board | substrate sheet 61 on the flat plate-like member 62 which has the flat board convex part 62a, and pressing the said lower board | substrate sheet 61 with the pressure roller 10. A lower substrate sheet 61 can be obtained (see FIG. 1).

  Thus, according to the present embodiment, it is possible to manufacture the flat plate member 62 having the flat plate protrusions 62a by using the same screen plate 27 as the screen plate 27 used in the base material transfer step. For this reason, the board | substrate convex part 61a which spaces apart the screen plate 27 and the base material 60 can be manufactured easily. As a result, the conductive paste 70 can be easily formed in a state where the screen plate 27 and the substrate 60 are slightly separated without using a screen mask with a spacer (screen plate) that is difficult to manufacture as in the prior art. It is possible to achieve transfer.

  In addition, as a material which produces | generates the flat convex part 62a, not only a silver paste and a solder paste but a thermosetting resin, UV curable resin, etc. can be used, The screen (using the screen plate 27 and the squeegee 22) mentioned above. Not only a printing method but also an optical molding method can be used. Moreover, when producing | generating the flat convex part 62a from a metal, an etching process, an electroforming method, etc. can also be used.

  By the way, it is desirable that the size of the substrate convex portion 61a is about the same as or smaller than the diameter of the conductive bump (the diameter of the through hole 27a). Further, the shape of the flat plate protrusion 62a may be a cone, a truncated cone, or a column, but preferably has a shape that does not easily break through the substrate sheet 61 (for example, a truncated cone, a column). In addition, the board | substrate convex part 61a needs to have the hardness of the grade which is not torn even with the pressure (about 0.25 MPa) from the squeegee 22 added to the screen plate 27.

The schematic side view which shows the structure of the board | substrate convex part production | generation apparatus by embodiment of this invention. 1 is a schematic side view of a printing apparatus according to an embodiment of the present invention as viewed from the side. The expanded side view which showed the 1st positioning process and the base-material transfer process in the squeegee mechanism by embodiment of this invention. The schematic side view which showed the base material hardening process by the embodiment of this invention, the mounting process, the press process, and the circuit formation process. The enlarged side view which showed the 1st positioning process and base-material transfer process in the squeegee mechanism by a reference example. The schematic side view which showed the base-material hardening process by the reference example, the mounting process, the press process, and the circuit formation process. FIG. 3 is a schematic side view showing one driving state of the printing apparatus according to the embodiment of the present invention. The schematic side view which showed the printing apparatus in the state advanced from the state shown in FIG. The schematic side view which showed the printing apparatus in the state advanced from the state shown in FIG. The schematic side view which showed the one drive state of the printing apparatus at the time of forming a flat plate convex part using the printing apparatus by embodiment of this invention. FIG. 11 is a schematic side view showing the printing apparatus in a state advanced from the state shown in FIG. 10.

Explanation of symbols

1 Holding part 10 Pressure roller (Pressure part)
11 CCD camera (image acquisition device)
DESCRIPTION OF SYMBOLS 12 Image display apparatus 22 Squeegee 27 Screen plate 27a Through-hole 30 Printing surface plate 35 Position adjustment apparatus 60 Base material 61 Lower substrate sheet 61a Substrate convex part 61 'Upper substrate sheet 62 Flat plate member 62a Flat plate convex part 62b Flat plate member preparation 65 Insulating sheet 70 Conductive paste 71 Conductive bump

Claims (5)

A printing platen holds a base material including a flat plate member having a plurality of flat plate protrusions and a lower substrate sheet placed on the flat plate member and having a substrate protrusion corresponding to the flat plate protrusions. A substrate holding step;
A first positioning step of positioning a screen plate having a plurality of through holes on the substrate;
A base material transfer step of transferring a conductive paste from the through hole of the screen plate to the substrate convex portion of the lower substrate sheet;
A base material curing step for curing the conductive paste transferred onto the lower substrate sheet to form conductive bumps;
A placing step of placing an upper substrate sheet on the conductive bump;
A pressing step of pressing the upper substrate sheet and penetrating the conductive bumps into the lower surface of the upper substrate sheet;
A circuit forming step of forming a circuit by masking a predetermined region of the lower substrate sheet and the upper substrate sheet, and removing a region other than the predetermined region; and
The method for producing a multilayer printed wiring board, wherein the substrate convex portion of the lower substrate sheet is provided at a position other than the predetermined region and is removed in the circuit forming step.   The base material positioning process of positioning the said base material with respect to the said printing surface plate so that an electrically conductive paste may be mounted between the said board | substrate convex parts, The further characterized by the above-mentioned. Multilayer printed wiring board manufacturing method.   The base material positioning step includes a base material image acquisition step of acquiring an image of a base material held on the printing surface plate by an image acquisition device, and a base for displaying an image acquired by the image acquisition device by an image display device. The material image display step and a substrate position adjustment step of adjusting a position of the substrate with respect to the printing surface plate based on an image displayed by the image display device. Multilayer printed wiring board manufacturing method.   The method for producing a multilayer printed wiring board according to claim 1, wherein the screen plate is used when the flat plate protrusions of the flat plate member are formed. A prepared body holding step for holding a flat plate member prepared body by the printing surface plate,
A second positioning step of positioning a screen plate having a plurality of through holes on the flat plate-shaped member preparation;
A preparation body transfer step of transferring a conductive paste from the through hole of the screen plate to a flat member preparation body,
5. The multilayer printed wiring according to claim 4, wherein a position of the conductive paste transferred to the flat member preparation corresponds to a position surrounding the position of the conductive paste transferred in the base material transfer step. Plate manufacturing method.

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