JP5084477B2 - Probe card - Google Patents

Description

  The present invention relates to a probe card, and more particularly to an improvement of a probe card used when a plurality of inspection areas are inspected simultaneously.

  A probe card is used as an electrical connection means when inspecting a semiconductor device at a stage before being cut out from the wafer. The probe card is provided with a number of probes that come into contact with the electrodes of the semiconductor device, through which power is supplied to the electrodes of the semiconductor device and signals generated at the electrodes of the semiconductor device by other probes are received. It is configured.

Further, in order to increase the inspection efficiency, a probe card has been proposed in which probe units corresponding to a plurality of inspection areas are arranged on a card substrate so that a plurality of devices can be inspected at one time (see, for example, Patent Document 1). .
Japanese Patent Laid-Open No. 11-16963

  However, when a plurality of probe units are arranged on the card substrate, a minute positional deviation of each probe unit with respect to the arrangement of devices on the wafer to be inspected becomes a problem. That is, when the wafer is inspected at a high temperature, the relative position between the probe units slightly changes due to the influence of heat from the wafer, so that the probe protrudes from the electrode pad of the device. It was.

  An object of the present invention is to provide a probe card free from the above-mentioned problems by minimizing the influence of heat during inspection on the relative positional relationship between a plurality of probe units.

To achieve this object, a probe card of the present invention includes a card substrate having a plurality of through holes provided independently , a plurality of probe units disposed on the main surface side of the card substrate, A reinforcing plate disposed on the back side of the card substrate, wherein the probe unit is in contact with an object to be inspected and serves as an electrical signal path, and a support in which the inspection needle is fixed on a table And the support base is fixed to the reinforcing plate via the through hole, and the plurality of probe units are attached to the card substrate via the common reinforcing plate. And

  With this configuration, the position of the plurality of probe units is determined by the reinforcing plate, and since the reinforcing plate is on the back side of the card substrate, the influence of the heat received from the wafer during inspection is small, and the position in the device inspection The problem of misalignment is solved.

  The probe unit support base is fixed to the reinforcing plate so as to directly follow the thermal deformation behavior of the reinforcing plate.

With this configuration, since the positional relationship of the probe unit is determined according to the design specification of the reinforcing plate, the probe card can be designed according to the inspection environment given in advance.

  According to the present invention, the positional relationship of the plurality of probe units arranged on the card substrate is determined by the reinforcing plate that is arranged on the back surface side of the card substrate and has a small thermal effect. The displacement of the position of the probe unit with respect to the inspection object can be reduced.

Embodiment 1 FIG.
FIG. 1 is a diagram showing an example of a probe card according to Embodiment 1 of the present invention. FIG. 1A is a cross-sectional view of the probe card, and a reinforcing plate 2 is attached to the back surface of the card substrate 1. The probe unit 3 is provided on the main surface of the card substrate 1. FIG. 1B is a plan view of the probe card viewed from the back side of the card substrate 1 and shows a state where the reinforcing plate 2 is attached to the back side of the card substrate 1.

  The reinforcing plate 2 is fixed to the back side of the card substrate 1 by screwing. The card substrate 1 is provided with a plurality of through holes 4, and the reinforcing plate 2 has a plurality of protrusions 5 inserted into the through holes 4 on the surface facing the card substrate 1. The part 5 is exposed from the through hole 4 to the surface side of the card substrate 1. The probe unit 3 is fixed to the end surface of the protruding portion 5 by screwing.

  As shown in the perspective view of the probe unit in FIG. 2, the probe unit 3 has an inspection needle (hereinafter referred to as a “probe”) for contacting an electrode of a semiconductor wafer as an inspection object on the upper surface of a square frame-shaped support base 31. A number of 32) are attached.

  A normal cantilever type probe is used as the probe 32 in the probe unit 3, and these probes 32 are fixed on the support base 31 with resin.

  In this way, in order to correspond to a plurality of inspection target areas in the configuration of the card substrate 1, the reinforcing plate 2 and the probe unit 3, as shown in FIG. 3, the card substrate 1 is penetrated corresponding to the plurality of inspection target areas. Protrusions 5 are formed in the reinforcing plate 2 so as to correspond to the through-holes 4, and the protruding portions 5 of the reinforcing plate 2 are exposed from the through-holes 4 to the exposed portions. The support base 31 of the probe unit 3 is fixed.

  FIG. 3 shows a state of a part of the card board 1, and the actual card board 1 is a multilayer wiring board and has a rectangular or circular flat plate shape.

  In this embodiment, since the plurality of probe units 3 are fixed to the protruding portion 5 of the reinforcing plate 2 arranged on the back surface of the card substrate 1, the temperature of the probe unit 3 is increased by heat from the wafer to be inspected at the time of inspection. Even if it rises, since the reinforcing plate 2 is arranged on the back side of the card substrate 1, the reinforcing plate 2 itself is not affected by heat so much. As a result, the relative positional deviation between the probe units 31 can be minimized.

  Furthermore, in this embodiment, the probe units 3 are not fixed to the reinforcing plate 2 by connecting the plurality of probe units 3 on the main surface side of the card substrate 1 by connecting members, but each probe unit 3 is independent. Then, it is fixed to the protruding portion 5 of the reinforcing plate 2. As a result, it is possible to suppress the position of the probe unit from being greatly displaced due to the influence of heat on the connecting member that connects the probe unit 3, and to reduce the number of parts. In addition, the number of probe units 3 corresponding to the number of protrusions 5 corresponding to the design specifications formed on the reinforcing plate 2 can be prepared, and these probe units 3 can be fixed to the reinforcing plate 2. Manufacturing and parts management are simplified. That is, it is not necessary to bother to manufacture a probe unit connected to the number of protrusions according to the design specifications. Furthermore, the positioning of each probe unit with respect to the reinforcing plate 2 becomes easy, and the mounting operation can be performed well. Further, when the probe unit is replaced, it is only necessary to replace the individual probe unit 3, so that maintenance work is facilitated.

  1 to 3 of this embodiment, the front surface (main surface) side on which the probe unit 3 of the card board 1 is provided is described as the upper side, and the back surface side on which the reinforcing plate 2 is provided is illustrated as the lower side. The present invention is not limited to the one used in such a state, and may be used with the surface side of the probe unit 3 facing down.

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram of the probe card by Embodiment 1 of this invention, (a) is sectional drawing of a schematic probe card, (b) is the top view seen from the back surface side of the card substrate. It is a perspective view which shows the outline | summary of a probe unit. It is a perspective view which shows the structure of a part of probe card.

Explanation of symbols

1 Card Board 2 Reinforcing Plate 3 Probe Unit 31 Support Base 32 Inspection Needle (Probe)
4 Through hole 5 Projection

Claims (2)

A card substrate having a plurality of through holes provided independently;
A plurality of probe units arranged on the main surface side of the card substrate;
A reinforcing plate disposed on the back side of the card substrate,
The probe unit has a plurality of inspection needles that come into contact with an object to be inspected to form an electrical signal path, and a support base on which the inspection needles are fixed on a base,
The support base is fixed to the reinforcing plate through the through hole,
A probe card, wherein a plurality of the probe units are attached to the card substrate via the common reinforcing plate .   The probe card according to claim 1, wherein the support base is fixed to the reinforcing plate so as to directly follow the behavior of thermal deformation of the reinforcing plate.

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