JP5084693B2 - Light emitting device and light emitting element mounting substrate - Google Patents

Description

  The present invention relates to a light emitting device in which a light emitting element such as a light emitting diode chip is mounted on the surface of a substrate, and a light emitting element mounting substrate used therefor. This light-emitting device is particularly useful as a light-emitting element panel, a light-emitting element package, and the like of a low-power light and thin lighting device.

  Conventionally, ceramic substrates made of aluminum nitride or the like have been widely used as substrates for LED packages on which chip LEDs or the like are mounted because they are excellent in heat transfer, heat resistance, ultraviolet resistance, and the like. However, the ceramic substrate has a problem that it is inferior in mass productivity and manufacturing cost as compared with the resin substrate.

  Therefore, resin-made substrates for mounting LEDs have been developed, and several techniques for improving heat dissipation and heat transfer are known. For example, in Patent Document 1 below, a metal protrusion is formed on the upper surface of a metal substrate, an insulating resin layer having the same height as the metal protrusion is formed around the metal protrusion, and the upper surface of the metal protrusion is formed. A light-emitting element mounting substrate is known in which a heat-feeding pattern and a power-feeding pattern are plated on the upper surface of an insulating resin layer so that the light-emitting element can be mounted on the upper surface of a metal projection via the heat-dissipating pattern.

Japanese Patent Laying-Open No. 2005-167086

  However, the substrate of Patent Document 1 is formed of an insulating resin layer in which the periphery of the upper surface of the metal convex portion that is the mounting position of the light emitting element is exposed. For this reason, when a light emitting element is mounted, the resin surface exposed in the vicinity of the periphery of the light emitting element is directly irradiated with the light of the light emitting element, and this deterioration of the insulating resin layer becomes a problem. Further, since the resin surface is exposed, the reflection of light on the surface is weak, and there is a concern about the problem of reflection efficiency.

  In view of the above points, a method for improving the reflection efficiency by adding a white filler to the resin layer has been proposed. However, even if a white filler is added, the effect of preventing deterioration due to light is low, so it cannot be said to be sufficient.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a light emitting device and a light emitting element mounting substrate that can prevent deterioration of an insulating resin layer and improve light reflection of the light emitting element.

  The above object can be achieved by the present invention as described below.

That is, the light emitting element mounting substrate of the present invention is
A light emitting device having at least one electrode on a bottom surface;
An upper surface metal layer having a pad at a position facing the electrode and having a peripheral pattern portion provided around the pad with a non-pattern portion around the periphery;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion below the pad;
A lower surface side metal layer connected to the interlayer connection part,
The electrode of the light emitting element is electrically connected to the pad in a state where the non-pattern part is disposed inside the outer shape projected from the light emitting element.

  According to this configuration, since the interlayer connection portion for supplying power is provided below the pad for connection with the electrode, the pad can be made small, and the non-pattern portion around it can be made small, so that the light emitting element A non-pattern part can be arranged inside the outer shape projected. As a result, a metal peripheral pattern part is formed outside the projected shape of the light emitting element (there is almost no irradiation from the bottom surface), so that the light from the light emitting element is not exposed to the resin exposed from the non-pattern part. Almost no irradiation is performed, and only the peripheral pattern portion of the metal is irradiated, so that deterioration of the insulating resin layer can be prevented and light reflection can be improved.

Further, another light emitting element mounting substrate of the present invention,
A light emitting device having at least one electrode on a bottom surface;
Around the position facing the electrode, an upper surface metal layer having a peripheral pattern portion provided all around the non-pattern portion;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion where the upper surface is exposed inside the non-patterned portion;
A lower surface side metal layer connected to the interlayer connection part,
The electrode of the light emitting element is electrically connected to the upper surface of the interlayer connection part in a state where the non-pattern part is disposed inside the outer shape projected from the light emitting element.

  According to this configuration, since the interlayer connection portion for feeding power is exposed for connection with the electrode, the upper surface can be reduced, and the non-patterned portion around it can also be reduced to emit light. The non-pattern part can be arranged inside the outer shape on which the element is projected. As a result, a metal peripheral pattern portion is formed outside the projected shape of the light emitting element, so that light from the light emitting element is hardly irradiated to the resin exposed from the non-patterned portion, and the metal peripheral pattern is formed. Only the portion is irradiated, so that the deterioration of the insulating resin layer can be prevented and the light reflection can be improved.

  In the above, the light emitting element is preferably a light emitting diode chip or a light emitting diode package having two electrodes on a bottom surface. A light-emitting element having two electrodes on the bottom surface does not need to be separately connected by a wire or the like, and can be connected simultaneously by solder connection or the like, so that the mounting process becomes easier.

  At this time, it is preferable that one electrode of the light emitting element is solder-connected to the upper surface of the pad or the interlayer connection portion, and the other electrode is solder-connected to the peripheral pattern portion.

On the other hand, the light emitting element mounting substrate of the present invention is
A light emitting element mounting substrate for mounting a light emitting element having at least one electrode on a bottom surface,
An upper surface metal layer having a pad at a position facing the electrode and having a peripheral pattern portion provided around the pad with a non-pattern portion around the periphery;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion below the pad;
A lower surface side metal layer connected to the interlayer connection part,
The electrode of the light emitting element is used by being electrically connected to the pad in a state where the non-pattern part is disposed inside the outer shape projected from the light emitting element.

  According to the light emitting element mounting substrate of the present invention, since the interlayer connection portion for feeding power is provided below the pad for connection to the electrode, the pad can be made small, and the non-pattern portion around it can also be made small. Thereby, a non-pattern part can be arrange | positioned inside the external shape which projected the light emitting element. As a result, a metal peripheral pattern part is formed outside the projected shape of the light emitting element (there is almost no irradiation from the bottom surface), so that the light from the light emitting element is not exposed to the resin exposed from the non-pattern part. Almost no irradiation is performed, and only the peripheral pattern portion of the metal is irradiated, so that deterioration of the insulating resin layer can be prevented and light reflection can be improved.

Further, another light emitting element mounting substrate of the present invention,
A light emitting element mounting substrate for mounting a light emitting element having at least one electrode on a bottom surface,
Around the position facing the electrode, an upper surface metal layer having a peripheral pattern portion provided all around the non-pattern portion;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion where the upper surface is exposed inside the non-patterned portion;
A lower surface side metal layer connected to the interlayer connection part,
The electrode of the light emitting element is used by being electrically connected to the upper surface of the interlayer connection part in a state where the non-pattern part is disposed inside the outer shape projected from the light emitting element.

  According to another light emitting element mounting substrate of the present invention, since the interlayer connection portion for feeding is exposed for connection with the electrode, the upper surface thereof can be reduced, and the surrounding non-pattern portion The non-pattern part can be arranged inside the outer shape projected with the light emitting element. As a result, a metal peripheral pattern portion is formed outside the projected shape of the light emitting element, so that light from the light emitting element is hardly irradiated to the resin exposed from the non-patterned portion, and the metal peripheral pattern is formed. Only the portion is irradiated, so that the deterioration of the insulating resin layer can be prevented and the light reflection can be improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A and 1B are diagrams illustrating an example of a light-emitting device according to the present invention, in which FIG. 1A is a longitudinal sectional view, and FIG. 1B is a plan view. 2 to 4 are drawings showing an example of a manufacturing process flow of the light emitting element mounting substrate of the present invention.

  As shown in FIG. 1, the light emitting device of the present invention has a light emitting element 30 having at least one electrode 32 on the bottom surface, a pad 20b at a position facing the electrode 32, and a non-pattern around the pad 20b. An upper surface metal layer having a peripheral pattern portion 20a provided all around the portion 16a, an insulating resin layer 16 provided below the upper surface metal layer, and having an interlayer connection portion 14 below the pad 20b; A lower-surface-side metal layer 10 connected to the interlayer connection portion 14.

  In the present embodiment, an example in which the light emitting element 30 has two electrodes 31 and 32 on the bottom surface is shown. Further, in the present embodiment, an example is shown in which the lower surface side metal layer 10 is not patterned and an interlayer connection portion 14 is formed on the upper surface via a protective metal layer 12.

  In the light emitting device of the present invention, the electrode 32 of the light emitting element 30 is electrically connected to the pad 20b in a state where the non-pattern part 16a is disposed inside the outer shape PL on which the light emitting element 30 is projected. In such a structure, the light from the side surface of the light emitting element 30 does not directly hit the non-patterned portion 16 a of the insulating resin layer 16, so that the insulating resin layer 16 is not deteriorated by the light of the light emitting element 30. Moreover, since the peripheral pattern part 20a becomes a reflective surface, the light emission efficiency of the light emitting element 30 becomes high. Therefore, the luminous efficiency can be further increased by performing noble metal plating such as gold on the peripheral pattern portion 20a.

  As shown in FIG. 1, the light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting a light emitting element 30 having at least one electrode 32 on the bottom surface, and a position facing the electrode 32. The upper surface metal layer having a peripheral pattern portion 20a provided around the non-pattern portion 16a around the pad 20b, and the pad 20b. Is provided with an insulating resin layer 16 having an interlayer connection portion 14 and a lower-surface-side metal layer 10 connected to the interlayer connection portion 14, and the non-pattern portion 16 a is disposed on the inner side of the outer shape PL on which the light emitting element 30 is projected. In this state, the electrode 32 of the light emitting element 30 is used by being electrically connected to the pad 20b.

  Next, an example of the manufacturing method of the light emitting element mounting substrate of this invention is demonstrated according to the manufacturing process flow shown in FIGS.

  (1) The columnar metal part 14 is formed on the metal substrate (the lower surface side metal layer 10) (step S1). As shown in FIGS. 3A to 3C, the surface metal layer 4 stacked on the metal substrate is selectively etched to form the columnar metal portion 14 at a position facing the electrode 32 of the light emitting element 30. . This surface metal layer 4 shows an example in which the surface metal layer 4 is laminated on a metal substrate via another protective metal layer 2 that exhibits resistance during the etching. The protective metal layer 2 can be omitted. In this case, the columnar metal portion 14 can be formed on the metal substrate by controlling the etching amount.

  A laminated plate SP in which a metal substrate, a protective metal layer 2 and a surface metal layer 4 for forming a columnar metal portion 14 are laminated as shown in FIG. The laminated plate SP may be manufactured by any method, and for example, any of those manufactured using electrolytic plating, electroless plating, sputtering, vapor deposition, or a clad material can be used. Regarding the thickness of each layer of the laminated plate SP, for example, the thickness of the metal substrate is 10 to 5000 μm, the thickness of the protective metal layer 2 is 1 to 20 μm, and the thickness of the surface metal layer 4 is 10 to 500 μm.

  The metal substrate may be either a single layer or a laminate, and any metal may be used as a constituent metal, and for example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, and the like can be used. Of these, copper and aluminum are preferable from the viewpoint of thermal conductivity and electrical conductivity. With the structure including the metal substrate with good heat dissipation as described above, the temperature rise of the light emitting element 30 can be prevented, so that more driving current can be flowed and the amount of light emission can be increased.

  As the metal constituting the surface metal layer 4, copper, copper alloy, nickel, tin and the like can be usually used, and copper is particularly preferable from the viewpoint of thermal conductivity and electrical conductivity.

  As the metal constituting the protective metal layer 2, a metal different from the metal substrate and the surface metal layer 4 is used, and another metal exhibiting resistance when etching these metals can be used. Specifically, when these metals are copper, another metal constituting the protective metal layer 2 is gold, silver, zinc, palladium, ruthenium, nickel, rhodium, lead-tin solder alloy, or nickel. -A gold alloy or the like is used. However, the present invention is not limited to the combination of these metals, and any combination with another metal exhibiting resistance when the metal is etched can be used. In addition, when not forming the protective metal layer 2, the surface metal layer 4 which is another metal can also be directly formed in a metal substrate.

  Next, as shown in FIG. 3B, the surface metal layer 4 is selectively etched using the etching resist M. Thereby, the columnar metal part 14 is formed at the mounting position of the light emitting element 30. The size of the columnar metal portion 14 needs to be smaller than the size of the light emitting element 30 to be mounted. For example, the upper surface has a diameter of 0.1 to 0.6 mm. The shape of the upper surface of the columnar metal portion 14 may be any of a square shape, a circular shape, and the like.

  As the etching resist M, a photosensitive resin, a dry film resist (photoresist), or the like can be used. In addition, when a metal substrate is etched simultaneously with the surface metal layer 4, it is preferable to provide the mask material for preventing this on the lower surface of a metal substrate (illustration omitted).

  Examples of the etching method include etching methods using various etching solutions according to the types of each metal constituting the protective metal layer 2 and the surface metal layer 4. For example, when the surface metal layer 4 is copper and the protective metal layer 2 is the aforementioned metal (including a metal resist), a commercially available alkaline etching solution, ammonium persulfate, hydrogen peroxide / sulfuric acid, or the like can be used. After the etching, the etching resist M is removed.

  Next, as shown in FIGS. 3C and 3D, the exposed protective metal layer 2 is removed, but the insulating resin layer 16 can be formed without removing the protective metal layer 2. The protective metal layer 2 can be removed by etching to form the protective metal layer 12. Specifically, when the surface metal layer 4 is copper and the protective metal layer 2 is the above-mentioned metal, an acid-based etching solution such as nitric acid, sulfuric acid, or cyan is commercially available for solder removal. Etc. are preferably used.

  When the protective metal layer 2 exposed in advance is removed, the surface of the metal substrate is exposed from the removed portion. In order to improve the adhesion between this and the insulating resin layer 16, surface treatment such as blackening treatment and roughening treatment is performed. It is preferable to carry out.

  (2) Next, the insulating resin material and the metal foil are laminated, and the convex portion A is formed on the surface (step S2). Below, the case where copper foil is used as metal foil is demonstrated. As shown in FIG. 3E, the insulating resin material and the copper foil are laminated and integrated to form the insulating resin layer 16 and the metal layer 19 at the same time. The insulating resin material and the copper foil are heated and pressed by the pressing surface, and as shown in FIG. 3 (f), the convex portion A is formed at a position corresponding to the columnar metal portion 14, and the metal layer 19 is formed on the uppermost surface. A laminated body is obtained. At this time, it is preferable to arrange at least a sheet material that allows concave deformation between the press surface and the laminated body. Moreover, you may use the press surface which has a recessed part in the position corresponding to the columnar metal part 14. FIG.

  Various types of the above-mentioned insulating resin material and copper foil are commercially available, and any of them can be used. Further, the insulating resin material forming material and the copper foil forming material may be arranged separately. In this step, since the sheet material is deformed in a concave shape during the heat press due to the presence of the columnar metal portion 14, the corresponding convex portion A is formed in the laminate.

  As a heating press method, a heating / pressurizing apparatus (thermal laminator, heating press) or the like may be used. In this case, the atmosphere may be set to a vacuum (vacuum laminator or the like) in order to avoid air contamination. Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the insulating resin layer forming material and the metal layer forming material, but the pressure is preferably 0.5 to 30 MPa.

  The insulating resin layer forming material may be any material as long as it is deformed during lamination and solidified by heating or the like and has the heat resistance required for the wiring board. Specific examples include various reaction curable resins such as polyimide resins, phenol resins, and epoxy resins, and composites (prepregs) of the same with glass fibers, ceramic fibers, aramid fibers, and the like.

  The insulating resin layer forming material of the insulating resin layer 16 is preferably made of a material having high thermal conductivity, and examples thereof include a resin containing a thermal conductive filler.

  In this case, the insulating resin layer 16 has a thermal conductivity of 1.0 W / mK or higher, preferably has a thermal conductivity of 1.2 W / mK or higher, and has a thermal conductivity of 1.5 W / mK or higher. More preferably. Thereby, the heat from the metal convex part 14 can be efficiently radiated to the metal substrate side. Here, the thermal conductivity of the insulating resin layer 16 is appropriately determined by selecting a formulation in consideration of the blending amount and particle size distribution of the thermally conductive filler, but the applicability of the insulating adhesive before curing. In general, the upper limit is preferably about 10 W / mK.

  The insulating resin layer 16 is preferably composed of a thermally conductive filler that is a metal oxide and / or metal nitride and a resin (insulating adhesive). Metal oxides and metal nitrides are preferably excellent in thermal conductivity and electrically insulating. Aluminum oxide, silicon oxide, beryllium oxide, and magnesium oxide are selected as the metal oxide, and boron nitride, silicon nitride, and aluminum nitride are selected as the metal nitride. These can be used alone or in combination of two or more. . In particular, among the metal oxides, aluminum oxide can easily obtain an insulating adhesive layer having good electrical insulation and thermal conductivity, and can be obtained at low cost. Of these materials, boron nitride is preferable because it is excellent in electrical insulation and thermal conductivity and has a low dielectric constant.

  As a heat conductive filler, what contains a small diameter filler and a large diameter filler is preferable. Thus, by using two or more kinds of particles having different sizes (particles having different particle size distributions), the heat transfer function by the large-diameter filler itself and the function of increasing the heat transfer property of the resin between the large-diameter fillers by the small-diameter filler Further, the thermal conductivity of the insulating resin layer 16 can be further improved. From such a viewpoint, the median diameter of the small-diameter filler is preferably 0.5 to 2 μm, and more preferably 0.5 to 1 μm. Moreover, 10-40 micrometers is preferable and, as for the median diameter of a large diameter filler, 15-20 micrometers is more preferable.

  The resin constituting the insulating resin layer 16 includes a metal oxide and / or a metal nitride, but has a bonding strength with a metal substrate (the protective metal layer 12 if present) in a cured state. Those which are excellent and do not impair the withstand voltage characteristics are selected. As such a resin, an epoxy resin, a phenol resin, a polyimide resin, and various engineering plastics can be used singly or as a mixture of two or more, and among them, an epoxy resin is excellent in bonding strength between metals. preferable. In particular, among epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, hydrogenated bisphenol A-type epoxy resins, hydrogenated, which have high fluidity and excellent mixing properties with the above metal oxides and metal nitrides. Bisphenol F type epoxy resin, triblock polymer having bisphenol A type epoxy resin structure at both ends, and triblock polymer having bisphenol F type epoxy resin structure at both ends are more preferable resins.

  The sheet material may be any material that allows concave deformation at the time of heating press, such as cushion paper, rubber sheet, elastomer sheet, nonwoven fabric, woven fabric, porous sheet, foam sheet, metal foil, and composites thereof. Can be mentioned. In particular, those that can be elastically deformed, such as cushion paper, rubber sheets, elastomer sheets, foam sheets, and composites thereof, are preferable.

  (3) The convex part A above the columnar metal part 14 is removed to expose the columnar metal part 14 (step S3). As shown in FIG. 3G, the convex portion A is removed, the columnar metal portion 14 is exposed, and a flat surface B is formed. When removing the convex portion A, it is preferable to remove and flatten the metal layer 19 and the columnar metal portion 14 so that the height thereof coincides.

  As a method for removing the convex portion A, a method by grinding or polishing is preferable. A method using a grinding device having a hard rotating blade in which a plurality of hard blades made of diamond or the like are arranged in the radial direction of the rotating plate, a sander, a belt sander , A method using a grinder, a surface grinder, a hard abrasive molded article, or the like. When the grinding apparatus is used, the upper surface can be flattened by moving the hard rotary blade along the upper surface of the fixedly supported wiring board while rotating the hard rotary blade. Moreover, as a grinding | polishing method, the method of lightly grind | polishing by a belt sander, buff grinding | polishing, etc. is mentioned. When the protrusion A is formed on the laminate as in the present invention, it becomes easy to grind only that portion, and the entire flattening can be performed more reliably.

  (4) The metal foil (metal layer 19) is etched with a predetermined pattern (step S4). Further, as shown in FIG. 3H, the exposed columnar metal portion 14 and the metal layer 19 are metal-plated to form a metal-plated layer 20 before the process of etching the metal layer 19 with a predetermined pattern. . Alternatively, at least the exposed columnar metal portion 14 may be metal-plated. As the metal species for metal plating, for example, copper, silver, Ni and the like are preferable. Examples of the method for forming the metal plating layer 20 include a panel plating method in which a pattern is formed using an etching resist, a pattern plating method in which a pattern plating resist is used for plating, and the like.

  Next, as shown in FIGS. 4I to 4J, by using the etching resist M, the metal plating layer 20 and the metal layer 19 are etched in a predetermined pattern, so that the pad 20b and the peripheral pattern portion 20a are formed. An upper surface metal layer is formed. As a result, the insulating resin layer 16 is exposed from the non-patterned portion 16a. The size of the pad 20b needs to be smaller than the size of the light emitting element 30 to be mounted. For example, the upper surface has a diameter of 0.1 to 0.6 mm. The shape of the upper surface of the pad 20b may be any of a quadrangle and a circle. The width of the non-pattern part 16a is preferably 20 to 200 μm from the viewpoint of accommodating the non-pattern part 16a inside the outer shape PL while preventing a short circuit.

  The removal of the etching resist M may be appropriately selected according to the type of the etching resist M, such as chemical removal or peeling removal. For example, in the case of photosensitive ink formed by screen printing, it is removed with chemicals such as alkali.

  As another manufacturing method, after heat-pressing the insulating resin material and the copper foil with the ceramic layer, the metal layer 19 above the columnar metal portion 14 is removed by etching, and then grinding or the like is performed in the same manner. Good. Further, in the above description, an example in which the metal layer 19 is deformed into a convex shape by arranging a sheet material that allows concave deformation between the press surface and the stacked body has been shown. By laminating a dry film resist on the upper surface of the metal layer 19 and performing pattern exposure and development to form a dry film resist having an opening above the columnar metal portion 14, It is also possible to deform the metal layer 19 into a convex shape.

  The pad 20b and the peripheral pattern portion 20a are preferably plated with a noble metal such as gold, nickel, or silver in order to increase reflection efficiency. Further, a solder resist may be formed as in the case of a conventional wiring board, or solder plating may be partially performed.

  Next, as shown in FIG. 1, the light emitting element 30 is mounted. As a mounting method of the light emitting element 30, a method in which at least one electrode 32 of the light emitting element 30 is connected to the upper surface of the pad 20b by a solder 35 is preferable. When the light emitting element 30 having two electrodes on the bottom surface is used, it is preferable that the other electrode 31 is also connected to the peripheral pattern portion 20a by the solder 35. When the light emitting element 30 having one electrode on the bottom surface is used, for example, the connection between the other electrode and the peripheral pattern portion 20a can be performed by wire bonding or the like. Note that the electrode 32 and the pad 20b can be electrically connected by a conductive paste, an anisotropic conductive film, or the like.

  The light emitting element 30 only needs to have at least one electrode on the bottom surface, and is a light emitting diode chip (flip chip, bare chip) that emits light on the opposite side of the electrode formation surface, or a packaged surface mount type light emitting diode (chip). LED), semiconductor laser chip, and the like. As the light emitting diode chip having one electrode on the bottom surface, there are two types of the bottom surface of the cathode type and the anode type.

  In the present invention, a dam 201 having a reflector function may be formed around the columnar metal portion 14 as shown in FIG. The dam 201 is bonded to the upper surface of the peripheral pattern portion 20a with an adhesive 202. The dam 201 can be formed by applying a dam-shaped hole to an Al plate having a predetermined thickness. The reflective surface of the dam 202 can be further plated with Ni, Ag, Cu, or the like. The inside of the dam 201 can be covered with a transparent resin, a fluorescent color resin, or the like. Furthermore, a convex transparent resin lens can be provided above the surface. Since the transparent resin lens has a convex surface, light can be efficiently emitted upward from the substrate. The transparent resin lens may be colored.

  Thus, the inside of the dam 201 can be covered (sealed) with the transparent resin, and the transparent resin lens can be provided to constitute the light emitting element package or the light emitting element panel. The light emitting element package generally has a package configuration in which one light emitting element is mounted on a substrate on which a wiring pattern is formed. The light emitting element package is mounted on a circuit board. A light emitting element panel generally has a configuration in which a plurality of light emitting elements are mounted on a substrate on which a wiring pattern is formed.

  Further, as shown in FIG. 6, an insulating resin dam 203 can be formed by interposing an adhesive 202 on the upper surface of the peripheral pattern portion 20a, and the reflecting surface 204 is plated with, for example, Ni, Cu, Ag or the like. Thus, it is preferable to exhibit the reflector function. The insulating resin dam 203 can be formed by applying a dam-shaped hole to an insulating resin plate having a predetermined thickness. A circuit board whose base is an insulating resin may be used as the insulating resin plate.

(Embodiment of another invention)
As shown in FIG. 7, another light-emitting device of the present invention has a light-emitting element 30 having at least one electrode 32 on the bottom surface, and a perimeter around a position facing the electrode 32 with a non-pattern portion 16a therebetween. An upper surface metal layer having a peripheral pattern portion 20a provided on the insulating resin layer 16 provided below the upper surface metal layer and having an interlayer connection portion 14 with an upper surface exposed inside the non-pattern portion 16a; And a lower surface side metal layer 10 connected to the interlayer connection portion 16. Further, the electrode 32 of the light emitting element 30 is electrically connected to the upper surface of the interlayer connection part 14 in a state where the non-pattern part 16 a is disposed inside the outer shape PL on which the light emitting element 30 is projected.

  That is, the difference between the light-emitting device of another invention and the light-emitting device shown in FIG. 1 is that the peripheral pattern portion 20a is formed on the upper surface of the metal layer 19 and the pad 20b is formed on the upper surface of the interlayer connection portion 14 in the latter. On the other hand, the light emitting device of another invention shown in FIG. 7 is different only in that the peripheral pattern portion 20 is formed by the metal layer 19 and the pad 20b is not formed.

  For this reason, another light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting a light emitting element 30 having at least one electrode 32 on the bottom surface, as shown in FIG. 32, a top surface metal layer having a peripheral pattern portion 20a provided around the non-pattern portion 16a around the non-pattern portion 16a, and a lower metal layer provided below the top surface metal layer. An insulating resin layer 16 having an interlayer connection portion 14 whose upper surface is exposed, and a lower surface side metal layer 10 connected to the interlayer connection portion 14 are provided. Further, the electrode 32 of the light emitting element 30 is used by being electrically connected to the upper surface of the interlayer connection part 14 in a state where the non-pattern part 16a is disposed inside the outer shape PL on which the light emitting element 30 is projected.

  Hereinafter, only differences from the light-emitting device shown in FIG. 1 will be described, but the description of the light-emitting device shown in FIG.

  First, the manufacturing method eliminates the step of forming the metal plating layer 20 by plating as shown in FIG. Therefore, the substrate shown in FIG. 3 (i) can be used as it is as a substrate for mounting a light emitting element of another invention. Further, in the substrate shown in FIG. 3I, when the peripheral pattern portion 20a and the upper surface of the interlayer connection portion 14 are too close (when the width of the non-pattern portion 16a is too narrow), FIGS. As shown in (j), it is possible to use the etching resist M to etch the metal plating layer 20 and the metal layer 19 in a predetermined pattern, thereby increasing the width of the non-pattern portion 16a.

  Regarding the mounting of the light emitting element 30, as shown in FIG. 7, a method of connecting at least one electrode 32 of the light emitting element 30 to the upper surface of the interlayer connection portion 14 with a solder 35 is preferable. When the light emitting element 30 having two electrodes on the bottom surface is used, it is preferable that the other electrode 31 is also connected to the peripheral pattern portion 20 a which is the metal layer 19 by the solder 35.

(Another embodiment)
(1) In the above-described embodiment, an example in which the lower surface side metal layer is not patterned but is a panel-shaped lower surface side metal layer is shown. However, the lower surface side metal layer is formed in a circuit in a predetermined pattern. Also good. In that case, a pattern may be formed in which a plurality of light emitting elements are mounted and the interlayer connection portions below the adjacent light emitting elements are connected so that they can be connected in series. In that case, the cathode electrode is connected to one interlayer connection, and the anode electrode is connected to the other interlayer connection. Moreover, you may use together serial connection and parallel connection.

  (2) In the above-described embodiment, the example in which the light emitting element mounting substrate is configured by the light emitting element mounting and the electrode has been described. However, in the present invention, other electronic circuits may be formed on the same substrate. . For example, it is preferable to form a drive circuit for a light emitting diode. In this case, wiring, lands, pads for bonding, pads for electrical connection to the outside, etc. are patterned in the periphery of the substrate, particularly in the corner and the vicinity thereof, and components such as chip capacitors, chip resistors and printing resistors, A transistor, a diode, an IC, or the like may be provided.

  (3) In the above-described embodiment, the example in which the lower surface side metal layer is formed on the lowermost surface and the wiring layer has a two-layer structure is shown. However, the present invention provides a lower wiring layer. A multilayer wiring board having three or more wiring layers may be used. Details of a method for forming a conductive connection structure between wiring layers in that case are described in International Publication No. WO 00/52977, and any of these can be applied.

  (4) In the above-described embodiment, an example in which the light emitting element has two electrodes on the bottom surface is shown. However, in the present invention, as shown in FIG. 8, the light emitting element 30 may have one electrode 32 on the bottom surface. Good. In that case, for example, the connection between the other electrode 31 and the peripheral pattern portion 20a can be performed by wire bonding or the like. For wire bonding, a fine metal wire such as gold can be used, and the wire can be connected by a method using ultrasonic waves and heating together.

  In this embodiment, the columnar metal portion 14 is formed on the metal substrate (the lower surface side metal layer 10) by omitting the protective metal layer and controlling the etching amount without interposing it. Show.

  (5) In this invention, after mounting a light emitting element on a board | substrate or after forming a reflector, you may coat | cover or seal the surface using the light-resistant film of 1 layer or multiple layers. As the light-resistant film, a resin composition containing a fluororesin and a methacrylic ester resin can be used.

  Examples of the fluororesin include homopolymers and copolymers of polyvinylidene fluoride, polytetrafluoroethylene, polychlorotrifluoroethylene, polyhexafluoropropylene, and polyvinyl fluoride. The methacrylic ester resin refers to a homopolymer of methyl methacrylate (MMA), a copolymer of a monomer copolymerizable with methyl methacrylate, a blend of polymethyl methacrylate and acrylic rubber, or the like. Examples of the copolymerizable monomer include methacrylic acid esters having 2 to 4 carbon atoms, acrylate esters having 1 to 8 carbon atoms such as butyl acrylate, styrene, α-methylstyrene, acrylonitrile, acrylic acid, and the like. Examples include ethylenically unsaturated monomers.

A phosphor may be contained in at least one layer constituting the light-resistant film. As the phosphor, YAG: Ce phosphor in which the activator cerium is introduced into the phosphor matrix yttrium aluminate, and the activator europium is introduced in the phosphor matrix strontium barium silicate (Sr, Ba) ₂ SiO ₄ : Eu. There are oxide phosphors such as phosphors, nitride phosphors such as α-sialon phosphors and β-sialon phosphors, and zinc sulfide activated by copper, copper, aluminum, and magnesium. The particle size of the phosphor can vary within a wide range, for example, within a range of 0.001 to 20 μm. Since light scattering can increase in direct proportion to the particle size, particles on the order of 1-2 μm or less are preferred, and particles on the order of 0.01-0.4 μm or less are more desirable.

  Moreover, an ultraviolet absorber, antioxidant, a dispersing agent, a coupling agent, etc. can also be used for at least 1 layer which comprises a light-resistant film.

The figure which shows an example of the light-emitting device of this invention The figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention The figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention The figure which shows an example of the manufacturing process flow of the light emitting element mounting substrate of this invention The figure which shows an example of the light-emitting device of this invention The figure which shows the other example of the light-emitting device of this invention. The figure which shows an example of another light-emitting device of this invention The figure which shows an example of another light-emitting device of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Lower surface side metal layer 12 Protective metal layer 14 Columnar metal part 16 Insulating resin layer 20 Metal plating layer 20a Peripheral pattern part 20b Pad 30 Light emitting element 32 Electrode 35 Solder A Convex part B Flat surface

Claims (6)

A light emitting device having at least one electrode on a bottom surface;
An upper surface metal layer having a pad at a position facing the electrode and having a peripheral pattern portion provided around the pad with a non-pattern portion around the periphery;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion below the pad;
A lower surface side metal layer connected to the interlayer connection part,
The light emitting device in which the electrode of the light emitting element is electrically connected to the pad in a state in which the non-patterned portion is disposed inside the outer shape projected from the light emitting element. A light emitting device having at least one electrode on a bottom surface;
Around the position facing the electrode, an upper surface metal layer having a peripheral pattern portion provided all around the non-pattern portion;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion where the upper surface is exposed inside the non-patterned portion;
A lower surface side metal layer connected to the interlayer connection part,
The light emitting device in which the electrode of the light emitting element is electrically connected to the upper surface of the interlayer connection part in a state in which the non-pattern part is disposed inside the outer shape projected from the light emitting element.   The light emitting device according to claim 1, wherein the light emitting element is a light emitting diode chip or a light emitting diode package having two electrodes on a bottom surface.   4. The light emitting device according to claim 3, wherein one electrode of the light emitting element is solder-connected to an upper surface of the pad or the interlayer connection portion, and the other electrode is solder-connected to the peripheral pattern portion. A light emitting element mounting substrate for mounting a light emitting element having at least one electrode on a bottom surface,
An upper surface metal layer having a pad at a position facing the electrode and having a peripheral pattern portion provided around the pad with a non-pattern portion around the periphery;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion below the pad;
A lower surface side metal layer connected to the interlayer connection part,
A light-emitting element mounting substrate used in such a manner that the electrodes of the light-emitting elements are electrically connected to the pads in a state where the non-pattern part is disposed on the inner side of the outer shape projected from the light-emitting elements. A light emitting element mounting substrate for mounting a light emitting element having at least one electrode on a bottom surface,
Around the position facing the electrode, an upper surface metal layer having a peripheral pattern portion provided all around the non-pattern portion;
An insulating resin layer provided below the upper surface metal layer, and having an interlayer connection portion where the upper surface is exposed inside the non-patterned portion;
A lower surface side metal layer connected to the interlayer connection part,
A light-emitting element mounting substrate that is used while the non-pattern part is disposed on the inner side of the projected outer shape of the light-emitting element and the electrode of the light-emitting element is electrically connected to the upper surface of the interlayer connection part.

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