JP5091998B2 - Laser processing machine - Google Patents

Description

  The present invention relates to a laser processing machine that performs laser scribing or ablation of a thin film in a manufacturing process of a solar cell panel, an organic EL display, a plasma display, or the like.

  This type of laser processing machine has a main task of irradiating a single layer or a laminated thin film formed on a processing surface of a substrate with laser light for removal processing. In general, a laser processing machine (for example, refer to the following patent document) includes a plurality of processing nozzles that can irradiate a laser beam toward a processing surface of a substrate, and these processing nozzles move relative to the substrate, or a substrate And a moving mechanism for moving the workpiece with respect to the processing nozzle.

  When patterning is performed using a laser processing machine, a laser beam is often shielded by interposing a shielding mask corresponding to the pattern shape formed on the processing surface between the substrate and the processing nozzle. However, a problem may arise when a large number of grooves have to be cut in parallel in a narrow area on the work surface. For example, a groove is consistently continuous, but the adjacent groove is intermittent (do not irradiate the laser beam at the point where the groove is cut off), and the adjacent groove is consistent. Even if an attempt is made to form a pattern that is continuous, it is practically difficult to install a shielding mask corresponding to such a pattern shape.

Japanese Patent Application No. 2009-160442 Japanese Patent No. 4231538

  The present invention made in view of the above is intended to provide a laser processing machine capable of suitably forming a complicated pattern without using a shielding mask.

  In the present invention, a plurality of machining nozzles capable of irradiating a laser beam toward the workpiece, a moving mechanism for moving the machining nozzle relative to the workpiece, and the machining of the machining nozzle A position detection mechanism for detecting a relative position with respect to the object and a movement mechanism controller for controlling the movement mechanism are provided separately, and laser light emission from each of the plurality of processing nozzles is individually turned on / off. A position signal receiving unit that includes a dedicated processing nozzle control controller for performing OFF control, and the processing nozzle control controller receives a signal output from the position detection mechanism without passing through the movement mechanism control controller. Information defining the relationship between the relative position of the processing nozzle with respect to the processing object and the ON / OFF of laser light emission for each processing nozzle. In response to the information stored in the pattern information storage unit based on the signal received by the pattern information storage unit and the position signal reception unit, the laser beam emission from each processing nozzle is individually performed The laser processing machine provided with the irradiation control part which performs ON / OFF control was comprised.

  The laser processing machine according to the present invention individually controls ON / OFF of the laser light emitted from each processing nozzle in accordance with the pattern shape stored in the pattern information storage unit. In particular, since the processing nozzle control controller directly receives the signal output from the position detection mechanism without passing through the movement mechanism control controller, it is possible to turn on / off laser light emission relative to the relative movement of the processing nozzle. OFF delay is reduced. As a result, it is possible to reliably irradiate the laser beam only on the portion to be irradiated with the laser beam on the processing surface.

  If you want to perform patterning using multiple types of laser light with different wavelengths, output power, output mode, laser diameter, projection shape, etc., a processing nozzle that can irradiate multiple types of laser light toward the workpiece , A movement mechanism for moving the machining nozzle relative to the workpiece, a position detection mechanism for detecting a relative position of the machining nozzle with respect to the workpiece, and a movement for controlling the movement mechanism Provided separately from a mechanism control controller, comprising a dedicated processing nozzle control controller for ON / OFF control of emission of a plurality of types of laser light from the processing nozzles for each type, the processing nozzle control controller comprising: A position signal receiving unit for receiving a signal output from the position detecting mechanism without passing through the moving mechanism control controller; Based on a signal received by the position signal receiving unit and a pattern information storage unit for storing information defining the relationship between the relative position of the laser beam to the object to be processed and ON / OFF of laser light emission for each type In response to the information stored in the pattern information storage unit, the laser processing machine includes an irradiation control unit that individually controls ON / OFF of the emission of each type of laser light from the processing nozzle. That's fine.

  If the moving mechanism is a linear motor carriage that conveys the machining nozzle relative to the workpiece, a linear scale (or linear encoder) attached to the linear motor carriage is used as the position detection mechanism. It is preferable to use it.

  The position detection mechanism may use a photo sensor.

  According to the present invention, a laser beam machine capable of suitably forming a complicated pattern without using a shielding mask is realized.

1 is an overall perspective view showing a laser beam machine according to an embodiment of the present invention. The disassembled perspective view which shows the process nozzle of the same laser processing machine, a support mechanism, and a dust collection nozzle. The exploded perspective view which omitted the dust collection nozzle of the laser beam machine. The fragmentary perspective view which shows the dust collection nozzle and dust collection connection mechanism of the laser beam machine. The front view which shows the process nozzle and movement mechanism of the laser beam machine. The front view which shows the dust collection nozzle of the laser processing machine. The front sectional view showing the dust collection connection mechanism of the laser beam machine. The sectional side view which shows the dust collection connection mechanism of the laser beam machine. The fragmentary sectional side view which shows the state which has located the suction opening of the dust collection nozzle of the laser processing machine directly above a laser beam irradiation site | part. The figure which shows the relationship of the moving mechanism of the same laser processing machine, a moving mechanism control controller, and a process nozzle control controller. The figure which shows the structure of the process nozzle control controller of the laser beam machine. The figure which illustrates the pattern shape which the laser beam machine patterns.

  Embodiments of the present invention will be described with reference to the drawings. The laser beam machine 1 according to the present embodiment is used in a manufacturing process of a thin film solar cell, and is a thin film (for example, transparent) formed on an upper surface that is a processing surface of a glass substrate 9 that is an object to be processed. A conductive film, a photoelectric conversion film, a back electrode film, etc.) are irradiated with laser light to pattern separation grooves and the like for dividing the thin film.

  For simplification of explanation, the direction in which the machining nozzle 3 and the dust collection nozzle 5 reciprocate to form a separation groove in the thin film (Y-axis direction) is the front-rear direction, and the direction in which the machining nozzle 3 and the dust collection nozzle 5 feed the pitch. (X-axis direction) is defined as the left-right direction. As shown in FIGS. 1 to 4, the laser processing machine 1 of the present embodiment includes a main body including a gantry 7, a support mechanism 4 and a retaining mechanism 2, a processing nozzle 3 disposed below the support mechanism 4, and a support. And a dust collection nozzle 5 suspended above the mechanism 4.

  The support mechanism 4 supports the substrate 9 carried into the laser processing machine 1 and mainly includes a frame. The frame 4 is raised to a height at which it does not collide with the machining nozzle 3, the XY stage 32, and the like by a main body frame 71 fixed to the frame 7. The underframe 4 has a shape in which a plurality of opening windows 41 extending in the front-rear direction and penetrating vertically are arranged in the left-right direction. The number of opening windows 41 is equal to the number of processing nozzles 3. Laser light emitted from the processing nozzle 3 passes through the opening window 41. A large number of rolling elements 42 that can freely rotate are provided on the periphery of the opening window 41 of the underframe 4 so as to be spread in the front-rear and left-right directions. The rolling element 42 is, for example, a so-called ball bear. The loaded substrate 9 is placed on these rolling elements 42.

  The underframe 4 is movable in the left-right direction via a rail mechanism 43 provided at the front and rear ends thereof. Between the frame 4 and the main body frame 71, a screw feed mechanism 44 that causes the horizontal movement of the frame 4 is interposed. The screw feed mechanism 44 is driven by a pitch feed motor 45 to move the frame 4 in the left-right direction.

  The retaining mechanism 2 retains the substrate 9 so as not to move during laser processing, and mainly includes a retaining pressing plate provided beside the support mechanism 4. The retaining pressing plates 2 form a pair on the left and right sides, and are located on the outer side of the frame 4 and at a height facing the upper surface of the frame 4 (the rolling element 42). The retaining pressing plate 2 is mounted on left and right plates 72 fixed to the main body frame 71. These retaining pressing plates 2 are driven by an air cylinder to approach or separate in the left-right direction, abut against the side end surface of the substrate 9 and sandwich the substrate 9 from the left and right. Instead of the retaining pressing plate 2 or together with the retaining pressing plate 2, a clamp, a suction cup, or the like may be employed.

  As shown in FIGS. 3 and 5, the processing nozzle 3 is supported by an XY stage 32. The XY stage 32 includes a Y-axis rail 321 extending in the front-rear direction, an X-axis unit that is guided by the Y-axis rail 321 and travels in the front-rear direction and extends in the left-right direction and is provided with an X-axis rail 323 on the upper side. 322 and a carriage 324 guided by the X-axis rail 323 and moved in a pitch direction in the left-right direction. Both the X-axis unit 322 and the carriage 324 are linear motor carriages that use a linear servo mover as a drive source. In the present embodiment, a plurality of carriages 324 are arranged on the X-axis unit 322, and the machining nozzle 3 is mounted on each carriage 324. The X-axis unit 322 and the carriage 324 constitute a moving mechanism that moves the machining nozzle 3 relative to the substrate 9 in the X-axis direction and the Y-axis direction, respectively.

  Linear scales 33 and 34 are attached to the XY stage 32. The X axis linear scale 33 is a position detection mechanism for detecting the position of the machining nozzle 3 in the X axis direction, and the Y axis linear scale 34 is a position detection mechanism for detecting the position of the machining nozzle 3 in the Y axis direction. is there. The X-axis linear scale 33 includes, for example, a magnetic sensor head provided on each of the carriages 324 that support the nozzles 3 and a magnetic ribbon scale provided on the X-axis unit 322 with a magnetic lattice stripe as a scale. Then, by reading the scale of the ribbon scale with the magnetic sensor head, the position of each carriage 324 and consequently the nozzle 3 in the X-axis direction is detected, and a signal indicating the position is output. Similarly, the Y-axis linear scale 34 also includes a magnetic sensor head provided on the X-axis unit 322 and a magnetic ribbon scale provided along the Y-axis rail 321, and the X-axis unit 322 and the Y axis of the nozzle 3. A direction position is detected and a signal indicating the position is output.

  The processing nozzle 3 irradiates the thin film with a plurality of types of laser light, for example, an infrared laser beam with a wavelength of 1064 nm, a green laser beam with a wavelength of 532 nm, or the like. Each processing nozzle 3 is connected to a plurality of optical fibers 31 for guiding a plurality of types of laser beams supplied from a laser oscillator (not shown). The laser beam supplied from the laser oscillator is introduced into the processing nozzle 3 through the optical fiber 31 and is emitted vertically upward from the emission end of the upper part of the nozzle through an optical system such as a condenser lens in the processing nozzle 3.

  The dust collection nozzle 5 exists for sucking dust generated by patterning a thin film. As shown in FIG. 6, the dust collection nozzle 5 has a suction port 511 that opens downward close to the surface of the substrate 9 to be processed. More specifically, the dust collection nozzle 5 is formed by connecting a plurality of nozzle members 51 in the left-right direction by welding or the like. The lower part of each nozzle member 51 expands in the left-right direction as it goes downward, but is gradually throttled in the front-rear direction. At the lower end of the nozzle member 51, a lip 512 that is refracted so as to be separated from each other protrudes forward and backward from the lower ends of the opposed front and rear walls forming the suction port 511. The lip 512 serves to create an airflow that flows in the direction of the suction port 511 in the gap between the lower surface of the lip 512 and the surface to be processed of the substrate 9 and improves the dust suction performance. The nozzle members 51 arranged side by side in the left-right direction form an elongated hole-like suction port 511 extending in the left-right direction as a whole. The overall size of the suction port 511 in the left-right direction is substantially equal to or larger than the width of the substrate 9.

  An air damper (or flow control valve) 513 is provided in the middle of each nozzle member 51. The air damper 513 can manually adjust the amount of air flowing through the nozzle member 51. The upper part of each nozzle member 51 is connected to a single collecting pipe 52 extending in the left-right direction. The collecting pipe 52 is a connector 521 whose central portion protrudes upward. The connector 521 is a dust suction port and is connected to a dust collector (not shown) through the connector 521. The inner dimension of the collecting pipe 52, particularly the inner dimension in the vertical direction, is the largest in the central part, smaller in the parts adjacent to the left and right, and smallest in the left and right end parts. This is because the suction airflow generated in the vicinity of the suction port 511 of each nozzle member 51 has the same flow velocity or suction pressure. The air damper 513 is provided for each nozzle member 51 for the same purpose.

  A dust collection connection mechanism 6 is interposed between the dust collection nozzle 5 and the dust collector. As shown in FIGS. 4, 7, and 8, the dust collection connection mechanism 6 includes a pair of rollers 61 that are spaced apart along the front-rear direction, and is disposed between the rollers 61 and extends along the front-rear direction and is in the same direction. A chamber 62 having an opening that is extended to the belt, a belt 63 that is wound around a roller 61 to close the opening of the chamber 62 and partially has a through hole 631, and one end joined to the connector 521 of the dust collecting nozzle 5. And a duct 64 whose other end is joined to the through hole 631 of the belt 63.

  In this embodiment, the chamber 62 is a long box-shaped member that opens upward, and opens upward. The upper end portions 622 of the left and right side walls 621 of the chamber 62 are bent so as to be close to each other and extend inward, so that the opening width of the chamber 62 is slightly narrowed. A sliding member 623 is mounted on the upper surface of these bent pieces 622. The sliding member 623 is a thin plate material made of hard resin, for example, and plays a role of reducing friction with the belt 63. The front roller 61 is located in front of the front wall 625 of the chamber 62, and the rear roller 61 is located behind the rear wall 626 of the chamber 62. A bearing 628 that pivotally supports the rollers 61 is provided. The front and rear ends of the chamber 62 are fixed. Moreover, the left and right side walls 621 of the chamber 62 hang down below the bottom wall 627 of the chamber 62, and the lower end portions 624 thereof also bend and extend inward so as to be close to each other.

  The belt 63 is, for example, a steel belt, and is an endless track that wraps around the front and rear rollers 61 and encloses the chamber 62. In the upper part of the endless track, the belt 63 abuts against the sliding member 623 and shields the opening of the chamber 62 from above. Below the endless track, the belt 63 passes through the space between the bottom wall 627 of the chamber 62 and the lower bent piece 624. The through hole 631 is provided in the upper part of the endless track. The chamber 62, the roller 61, and the belt 63 are disposed on the outer side than the frame 4.

  A dust suction port is provided at a predetermined portion of the chamber 62 (in the illustrated example, the outer wall 621 at the front portion of the chamber 62). A hose 65 is connected to the suction port, and the hose 65 is connected to a dust collector. Therefore, the dust sucked from the suction port 511 of the dust collection nozzle 5 passes through the inner space of the duct 64 and the chamber 62 and reaches the dust collector via the hose 65. Due to the suction of the dust collector, the inside of the chamber 62 becomes negative pressure, and the belt 63 sucks on the bent piece 622 above the chamber 62 to suitably close the opening.

  The dust collection nozzle 5 and the duct 64 can reciprocate in the front-rear direction following the processing nozzle 3. The suspended structure that serves as the dust collection nozzle 5 and the like includes columns 73 that rise from the four corners of the plate 72, and side beams 74, front beams 75, and rear beams 76 that connect the upper ends of the columns 73. . The chamber 62 described above has a front portion fixed to the front beam 75 and a rear portion fixed to the rear beam 76. The dust collection nozzle 5 and the duct 64 are carried on a horizontal frame 53 extending in the left-right direction. The left end portion of the horizontal frame 53 is supported by a conveyance rail provided on the left beam 74 via a carriage 531, and the right end portion of the horizontal frame 53 is also supported by a conveyance rail provided in the chamber 62 via a carriage 532. Let As a result, the horizontal frame 53 can travel in the front-rear direction along the left beam 74 and the chamber 62. Further, the right end portion of the horizontal frame 53 is attached to a portion near the through hole 631 of the belt 63 together with the duct 64.

  In the present embodiment, the belt 63 also serves as a traveling drive mechanism for the horizontal frame 53 and the dust collection nozzle 5. That is, one of the rollers 61 around which the belt 63 is wound (the front roller 61 in the illustrated example) is rotationally driven by the servo motor 66, and the belt 63 is driven by the rotation of the roller 61. It moves back and forth, and the horizontal frame 53 and the like are reciprocated in the front-rear direction by the movement of the belt 63. However, it is also conceivable that the left or right carts 531 and 532 of the horizontal frame 53 are linear motor movable elements, and the dust collecting nozzle 5 is driven to travel using the carts 531 and 532 as a drive source.

  In executing laser processing, first, a substrate 9 having a processed surface on which a thin film is formed is loaded from the front. That is, a transport unit (not shown) is driven while clamping a side edge of the substrate 9 with a transport clamper (not shown), and the substrate 9 is fed onto the frame 4 and placed on the frame 4. Next, the retaining pressing plate 2 is pressed against both side end surfaces of the substrate 9 to sandwich the substrate 9 from both sides, and the substrate 9 is retained with respect to the gantry 7.

  Thereafter, the processing nozzle 3 is moved to a required processing site, laser light is emitted upward, the substrate 9 is transmitted, and the thin film on the processing surface is irradiated. Specifically, a pulsed laser is continuously irradiated while the X-axis unit 322 is traveling in the front-rear direction to form a separation groove extending in the front-rear direction in the thin film. At the same time, by moving the horizontal frame 53 in the front-rear direction, the dust collection nozzle 5 follows the X-axis unit 322, and as shown in FIG. 9, the suction port 511 is constantly directly above the irradiation part L of the laser beam. Position it. Then, the dust collector is operated to collect dust generated from the irradiation site L.

  Further, the carriage 324 mounted with the machining nozzle 3 is pitch-moved in the left-right direction, and the formation position of the separation groove is changed. At the same time, the frame 4 is also moved in the left-right direction in conjunction with the carriage 324 so that the laser optical axis does not interfere with the frame 4. At this time, the frame 4 supporting the substrate 9 is displaced relative to the substrate 9, but the rolling element 42 is interposed between the lower surface of the substrate 9 and the upper surface of the frame 4, and this rotates. Therefore, the movement of the underframe 4 is not hindered. While the pitch feed of the machining nozzle 3 by the linear motor carriage 324 is instantaneous, the pitch feed of the base frame 4 by the screw feed mechanism 44 is a substantially constant speed motion including during the running of the machining nozzle 3. The optical axis is always in the opening window 41.

  It is also possible to form a groove extending in the left-right direction in the thin film by continuously irradiating the pulse laser while moving both the carriage 324 and the frame 4 in the left-right direction.

  When the laser processing is completed, the substrate 9 is unloaded. That is, the holding of the substrate 9 by the holding pressing plate 2 is released, and the transfer unit is driven while clamping the side edge of the substrate 9 with the transfer clamper, so that the substrate 9 is sent out from the frame 4.

  In the present embodiment, as shown in FIG. 10, the laser light emitted from each processing nozzle 3 is individually turned on / off for each nozzle 3 and for each laser light type (here, wavelength). A dedicated machining nozzle controller 8 is provided separately from the moving mechanism controller 0 that controls the moving mechanisms 322 and 324.

  The processing nozzle control controller 8 is mainly a personal computer, a workstation, or a programmable controller. As shown in FIG. 11, the processing nozzle control controller 8 includes a processor 81, a memory 82, I / O interfaces 83 and 84, and the like, and these operate in cooperation with each other. The memory 82 includes an auxiliary storage device such as a flash memory and a hard disk drive in addition to the main storage device.

  A program to be executed by the machining nozzle controller 8 is stored in the memory 82 and is decoded by the processor 81 when the program is executed. And the process nozzle control controller 8 exhibits the function as a position signal receiving part, a pattern information storage part, and an irradiation control part according to a program.

  The position signal receiving unit receives signals output from the X-axis linear scale 33 and the Y-axis linear scale 34 via the I / O interface 83. At this time, the signal is not received indirectly from the moving mechanism control controller, but is directly received in the form of intercepting the signals sent from the linear scales 33 and 34 toward the moving mechanism control controller.

  The pattern information storage unit defines the relationship between the X-axis direction position and the Y-axis direction position of each processing nozzle 3 with respect to the substrate 9 and the ON / OFF of laser light emission for each nozzle 3 and / or each type. Information is stored in a required storage area of the memory 82. This information stored in the pattern information storage unit defines a pattern to be formed on the processing surface (the thin film) of the substrate 9 and may be data referred to by the control program, or may be a program (or script). ) May be described in the program. FIG. 12 shows an example of a pattern to be formed on the processed surface of the substrate 9. In the illustrated example, grooves 911, 912, 913 cut by the first nozzle 3, grooves 921, 922, 923 cut by the second nozzle 3, grooves 931, 932, 933 ... cut by the third nozzle 3 are formed. Are stretched side by side in parallel while being close to each other. Laser light is emitted from the nozzle 3 that has reached the position (XY coordinate) immediately below the location where the grooves 911, 912, 913, 921, 922, 923, 931, 932, and 933 are cut on the surface to be processed. Must be (outgoing ON). On the other hand, the laser beam is emitted from the nozzle 3 that has reached the position (XY coordinate) immediately below the portion where the grooves 911, 912, 913, 921, 922, 923, 931, 932, 933 are not cut. Not (outgoing OFF). Further, since the grooves 911, 921, and 931 are cut by irradiating a laser beam having a wavelength of 532 nm, the wavelength of 532 nm is reached from the nozzle 3 that has reached directly below the cutting position (XY coordinates) of these grooves 911, 921, and 931. The laser beam with the wavelength of 1064 nm is turned off. In turn, since the grooves 912, 913, 922, 923, 932, and 933 are cut by irradiating with a laser beam having a wavelength of 1064 nm, the grooves 912, 913, 922, 923, 932, and 933 are directly below. From the nozzle 3 that has reached (XY coordinates), laser light with a wavelength of 1064 nm is emitted ON, and laser light with a wavelength of 532 nm is emitted OFF.

  The irradiation control unit individually controls ON / OFF the emission of each processing nozzle 3 and / or each type of laser beam. The irradiation control unit knows the current position of each nozzle 3 based on the signal received by the position signal receiving unit, and then turns on / off laser light emission corresponding to the information stored in the pattern information storage unit. A control signal for switching OFF is transmitted to each nozzle 3 via the I / O interface 84. Based on the control signal, the emission of various laser beams from each nozzle 3 is controlled by, for example, operating a micromirror or other optical element built in each nozzle 3.

  Incidentally, the moving mechanism control controller 0 is mainly a personal computer, a workstation, or a programmable controller. After receiving the output signals of the linear scales 33 and 34, the operation of the XY stage 32, the operation of the transport carriages 531 and 532 of the dust collection nozzle 5, the operation of the servo motor 66 of the dust collection connection mechanism 6, and the support mechanism 4 controls the operation of the pitch feed motor 45 and the operation of the dust collector.

  According to the present embodiment, a plurality of machining nozzles 3 that can irradiate the workpiece 9 with laser light, and a moving mechanism 322 for moving the machining nozzle 3 relative to the workpiece 9. 324, position detection mechanisms 33 and 34 for detecting a relative position of the processing nozzle 3 with respect to the processing object 9, and a movement mechanism controller 0 for controlling the movement mechanisms 322 and 324, A dedicated processing nozzle control controller 8 for individually controlling ON / OFF of the emission of the laser beam from each of the plurality of processing nozzles 3, and the processing nozzle control controller 8 detects the position. A position signal receiving unit that receives signals output from the mechanisms 33 and 34 without passing through the moving mechanism controller 0, and the processing object 9 of the processing nozzle 3 A pattern information storage unit that stores information that defines the relationship between the relative position of each processing nozzle 3 and the ON / OFF of laser beam emission for each processing nozzle 3, and the pattern information based on the signal received by the position signal reception unit. Corresponding to the information stored in the storage unit, the laser processing machine 1 including the irradiation control unit that individually controls ON / OFF of the emission of the laser light from each processing nozzle 3 is configured. According to the pattern shape memorize | stored in the memory | storage part, the laser beam radiate | emitted from each process nozzle 3 can be controlled individually on / off. Further, since the processing nozzle controller 8 directly receives signals output from the position detection mechanisms 33 and 34 without passing through the movement mechanism controller 0, the laser beam is emitted relative to the relative movement of the processing nozzle. The ON / OFF delay is reduced. Therefore, it is possible to reliably irradiate only the portion on the processing surface where the laser beam is to be irradiated.

  In addition, the processing nozzle 3 capable of irradiating a plurality of types of laser beams toward the processing object 9, the moving mechanisms 322 and 324 for moving the processing nozzle 3 relative to the processing object 9, Position detection mechanisms 33 and 34 for detecting the relative position of the machining nozzle 3 with respect to the workpiece 9 and a movement mechanism controller 0 for controlling the movement mechanisms 322 and 324 are provided separately from the machining nozzle 3. And a dedicated processing nozzle control controller 8 for ON / OFF control of the emission of the plurality of types of laser light according to the type. The processing nozzle control controller 8 is output from the position detection mechanisms 33 and 34. A position signal receiving unit that receives the signal without passing through the moving mechanism controller 0, and a relative position of the processing nozzle 3 with respect to the processing object 9 And a pattern information storage unit that stores information defining the relationship between ON / OFF of laser light emission for each type, and a signal received by the position signal reception unit, and stored in the pattern information storage unit Since the laser processing machine 1 including the irradiation control unit that individually controls ON / OFF of the emission of each type of laser light from the processing nozzle 3 is configured in accordance with the information that is stored in the pattern information storage unit. Various laser beams emitted from the processing nozzle 3 can be individually turned on / off according to the stored pattern shape. Further, since the processing nozzle controller 8 directly receives signals output from the position detection mechanisms 33 and 34 without passing through the movement mechanism controller 0, the laser beam is emitted relative to the relative movement of the processing nozzle. The ON / OFF delay is reduced. Therefore, it is possible to reliably irradiate a desired type of laser light only on the portion to be irradiated with laser light on the processing surface.

  The moving mechanisms 322 and 324 are linear motor carriages 322 and 324 that convey the processing nozzle 3 relative to the workpiece 9, and the position detection mechanisms 33 and 34 are connected to the linear motor carriages 322 and 324. Since the linear scales 33 and 34 attached to the linear motor carts 322 and 324 are originally used for the position feedback control of the linear motor carriages 322 and 324, the linear scales 33 and 34 can be used as they are. Not invited.

  Note that the present invention is not limited to the embodiment described in detail above. For example, the linear scales 33 and 34 may be optical types using photosensors. In this case, the X-axis linear scale 33 includes a light source provided on the carriage 324 that supports each nozzle 3, light transmission holes provided at a predetermined pitch in the X-axis unit 322, and a photo arranged below each light transmission hole. The sensor is used as an element, and light from a light source provided on the carriage 324 is detected by a photo sensor via light transmission light, thereby detecting the position in the X-axis direction of each carriage 324 and thus each nozzle 3. A signal indicating is output. Similarly, the Y-axis linear scale 34 also includes a light source provided in the X-axis unit 322, light transmission holes provided at a predetermined pitch along the Y-axis rail 321 and a photo sensor disposed below the light transmission holes. And the position of the X-axis unit 322 and thus the nozzle 3 in the Y-axis direction is detected and a signal indicating the position is output.

  It is also acceptable to employ a known position detection mechanism other than the linear scales 33 and 34.

  Although the processing machine 1 in the said embodiment was a thing of the aspect which moves the process nozzle 3 with respect to the workpiece 9 at the time of a process, it is a processing machine of the aspect which moves a process target with respect to a process nozzle at the time of a process. Of course, the idea of the present invention can be applied.

  Other specific configurations of each part can be variously modified without departing from the spirit of the present invention.

  The present invention can be used as a processing machine for performing laser scribing or ablation of a thin film in a manufacturing process of a solar cell panel, an organic EL display, a plasma display, or the like.

DESCRIPTION OF SYMBOLS 1 ... Laser processing machine 3 ... Processing nozzle 322, 324 ... Movement mechanism 33, 34 ... Position detection mechanism 8 ... Processing nozzle control controller 9 ... Object to be processed 0 ... Movement mechanism control controller

Claims (4)

A plurality of processing nozzles capable of irradiating a laser beam toward the processing object;
A movement mechanism for moving the machining nozzle relative to the workpiece;
A position detection mechanism for detecting a relative position of the processing nozzle with respect to the processing object;
Provided separately from a moving mechanism control controller that controls the moving mechanism, and includes a dedicated processing nozzle control controller for individually controlling ON / OFF of the emission of laser light from each of the plurality of processing nozzles. A laser processing machine,
The processing nozzle control controller
A position signal receiving unit that receives a signal output from the position detection mechanism without going through the moving mechanism control controller;
A pattern information storage unit for storing information that defines a relationship between a relative position of the processing nozzle with respect to the processing object and ON / OFF of laser light emission for each processing nozzle;
An irradiation control unit that individually controls ON / OFF of the emission of the laser light from each processing nozzle in accordance with the information stored in the pattern information storage unit based on the signal received by the position signal receiving unit; Laser processing machine equipped with. A machining nozzle capable of irradiating a plurality of types of laser beams toward the workpiece;
A movement mechanism for moving the machining nozzle relative to the workpiece;
A position detection mechanism for detecting a relative position of the processing nozzle with respect to the processing object;
Laser processing provided separately from a moving mechanism control controller for controlling the moving mechanism, and having a dedicated processing nozzle control controller for ON / OFF control of emission of a plurality of types of laser light from the processing nozzles for each type Machine,
The processing nozzle control controller
A position signal receiving unit that receives a signal output from the position detection mechanism without going through the moving mechanism control controller;
A pattern information storage unit for storing information defining a relationship between a relative position of the processing nozzle with respect to the processing object and ON / OFF of laser light emission for each type;
Irradiation control that individually controls ON / OFF of the emission of each type of laser light from the processing nozzle in accordance with information stored in the pattern information storage unit based on the signal received by the position signal receiving unit And a laser processing machine. The moving mechanism is a linear motor carriage that conveys the machining nozzle relative to the workpiece;
The laser processing machine according to claim 1 or 2, wherein the position detection mechanism uses a linear scale attached to the linear motor carriage. The laser processing machine according to claim 1, wherein the position detection mechanism uses a photosensor.

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