JP5095482B2 - Substrate positioning apparatus, substrate processing apparatus, substrate positioning method, and substrate processing method - Google Patents

Description

  The present invention relates to a substrate positioning apparatus for positioning a circuit board, a substrate processing apparatus using the substrate positioning apparatus, a substrate positioning method, and a substrate processing method using the substrate positioning method.

  In the screen printing machine, after the circuit board on the conveyor is lifted from the carry-in position to the printing position, the cream solder is printed on the circuit board. Backup pins are used to lift the circuit board. A plurality of backup pins are arranged. The plurality of backup pins support a predetermined position on the lower surface of the circuit board. However, due to non-uniformity such as the placement of the backup pins, the height of the backup pins, the weight balance of the circuit board, and the shape balance of the circuit board, the circuit board may not be lifted vertically while ensuring a horizontal state. In this case, the desired printing position and the actual circuit board position are shifted. As a result, accurate substrate clamping at the printing position cannot be performed, and printing failure occurs.

In view of this point, the screen printing machine includes a substrate positioning device. That is, after the circuit board is positioned in the horizontal direction by the board positioning device, the circuit board is lifted by the backup pins. Specifically, the substrate positioning device includes a reference clamp member and a movable clamp member. The circuit board is interposed between the reference clamp member and the movable clamp member. When positioning the circuit board, the movable clamp member is moved to the reference clamp member side. Then, the circuit board is sandwiched between the reference clamp member and the movable clamp member. For this reason, clamping force is applied to the circuit board from the reference clamp member and the movable clamp member. In this state, the circuit board is lifted to the printing position. And cream solder is printed on a circuit board.
JP 2006-103073 A JP 2007-15233 A

  Incidentally, the movable clamp member is driven by an air cylinder as disclosed in [0012] of Patent Document 1 and [0026] of Patent Document 2. The air cylinder includes a cylinder member, a piston member, and a guide member. The piston member can enter and exit from the cylinder member.

  However, the piston member is driven by the air supplied into the cylinder member. In order to suppress air leakage, the piston member and the cylinder member are in airtight contact. For this reason, when driving the piston member, frictional force is inevitably generated between the piston member and the cylinder member. Therefore, precise control of the piston member is difficult. If precise control of the piston member is difficult, it becomes difficult to precisely control the operation of the movable clamp member. That is, it becomes difficult to precisely control the clamping force applied to the circuit board. For example, if the actual clamping force is too large for the desired clamping force, the circuit board may be deformed. On the other hand, if the actual clamping force is too small relative to the desired clamping force, the position of the circuit board may be shifted during printing.

  Further, the circuit board originally has a rectangular shape. That is, both edges in the width direction of the circuit board sandwiched between the reference clamp member and the movable clamp member are essentially parallel to each other. However, some circuit boards have both edges in the width direction that are not parallel to each other (hereinafter, such circuit boards are referred to as “defective circuit boards” as appropriate). On the other hand, the moving direction of the piston member is restricted only in the width direction by the guide member. For this reason, when the movable clamp member is stationary with respect to the piston member, the movable clamp member cannot swing in the horizontal plane while moving in the width direction. Therefore, both edges in the width direction of the defective circuit board cannot be firmly clamped by the reference clamp member and the movable clamp member.

  In view of this point, [0019] of Patent Document 1 discloses a screen printing machine having a movable clamp member that can swing in a horizontal plane. According to the screen printing machine described in this document, even in the case of a defective circuit board, both edges in the width direction can be clamped by the reference clamp member and the movable clamp member.

  However, the movable clamp member of the screen printing machine described in the document swings around a specific swing shaft. For this reason, when the defective circuit board is sandwiched, a force in the rotational direction is applied to the defective circuit board. In other words, a component force acting in a direction other than the width direction is applied to the defective circuit board. Therefore, the clamping force tends to vary.

  The substrate positioning apparatus, substrate processing apparatus, substrate positioning method, and substrate processing method of the present invention have been completed in view of the above problems. Therefore, the present invention enables precise control of the clamping force between the pair of clamp members, and the substrate positioning device, the substrate processing apparatus, and the substrate positioning method in which the clamping force is unlikely to vary even when a defective circuit board is clamped. An object of the present invention is to provide a substrate processing method.

  (1) In order to solve the above problems, a board positioning device of the present invention includes a pair of clamp members disposed on both sides in the width direction of the circuit board, and reduces the width between the pair of clamp members. The at least one of the pair of clamp members is supported by the base and the base from below, and is close to the other clamp member with respect to the base. A movable portion that is movable in a narrow direction and capable of pressing the circuit board, and a non-contact force that is one or more kinds of forces selected from a gas discharge force, a gas suction force, a magnetic repulsion force, and a magnetic tension force, A non-contact drive mechanism for positioning the circuit board by moving the movable part in the narrow direction relative to the base by acting between the base and the movable part. To do.

  According to the substrate positioning device of the present invention, the movable part is moved by the non-contact force acting between the base part and the movable part. For this reason, compared with the case where a clamp member itself is moved with an air cylinder, the moving amount | distance of a movable part can be controlled precisely. Therefore, the clamping force between the pair of clamp members can be precisely controlled.

  Further, according to the substrate positioning device of the present invention, the movable part is moved by a non-contact force. For example, when a gas discharge force is used as the non-contact force, the movable part is moved by blowing gas. Further, when a gas suction force is used as the non-contact force, the movable part is moved by sucking the gas. Moreover, when using a magnetic tensile force as a non-contact force, the movable part is moved by making the polarities of the sections in which the magnetic tensile force acts between the base and the movable part differ from each other. Moreover, when using a magnetic repulsive force as a non-contact force, the movable part is moved by making the polarities of the sections in which the magnetic repulsive force acts between the base and the movable part coincide with each other.

  For this reason, a guide member is unnecessary compared with the case where the clamp member itself is moved by an air cylinder. Therefore, the moving direction of the movable part is not restricted only in the narrow direction. Therefore, the movable part can be tilted in a substantially horizontal plane without providing a specific swing axis. That is, even when a defective circuit board is sandwiched, a pair of clamp members can be arranged along both edges in the width direction. Further, since the force in the rotational direction is unlikely to act on the defective circuit board, both edges in the width direction can be firmly clamped.

  (2) Preferably, in the configuration of the above (1), the non-contact driving mechanism further causes the non-contact force to act between the base and the movable part, thereby to the base. The movable part is preferably configured to move in the wide direction away from the other clamp member.

  According to this configuration, the movable portion can be moved in the narrow direction and the wide direction only by the non-contact drive mechanism. For this reason, the structure of the board | substrate positioning apparatus becomes simple compared with the case where a non-contact drive mechanism and an air cylinder are used together, for example.

  (3) Preferably, in the configuration of (1) or (2), the base and the movable part each have a width direction facing surface that faces each other in the width direction, and the non-contact drive mechanism is It is better to have a structure having a moving gas passage opening in the width direction facing surface of the base.

  According to this structure, a movable part can be moved by making at least one of gas discharge force and gas suction force act between a pair of width direction opposing surfaces. For example, when the gas discharge force is applied, the movable portion can be moved by blowing gas from the opening of the moving gas passage on the width direction facing surface of the base portion to the width direction facing surface of the movable portion. Moreover, when applying gas suction force, a movable part can be moved by sucking gas from the opening of the gas passage for a movement of the width direction opposing surface of a base.

  (3-1) Preferably, in the configuration of (3) above, when the gas discharge force is used as the non-contact force, a gap between the pair of width direction facing surfaces is open to the outside. Better. According to this structure, the gas sprayed on the width direction opposing surface of a movable part can be leaked outside as it is. For this reason, it is not necessary to provide a separate exhaust passage in the substrate positioning device. Therefore, the structure of the substrate positioning device is simplified.

  (4) Preferably, in any one of the configurations (1) to (3), the non-contact driving mechanism includes a plurality of moving magnets arranged in the width direction so as to be shifted from the base portion and the movable portion. It is better to have a configuration.

  According to this configuration, the movable portion can be moved by applying at least one of a magnetic tensile force and a magnetic repulsive force between the base portion and the movable portion (may be used in combination with (3) above). According to this configuration, a gas passage is not necessary for a portion on which at least one of a magnetic tensile force and a magnetic repulsive force acts. This simplifies the structure of the substrate positioning device by extending the base.

  (4-1) Preferably, in the configuration of (4), at least one of the plurality of moving magnets is an electromagnet. According to this configuration, the magnitude of the magnetic tensile force and the magnetic repulsive force can be controlled by changing the magnitude of the voltage and current with respect to the electromagnet. For this reason, compared with the case where a permanent magnet is used as a moving magnet, the movement of a movable part can be controlled more precisely.

  Moreover, according to this structure, the polarity of an electromagnet can be reversed by changing the direction of the voltage and electric current with respect to an electromagnet. For this reason, a magnetic tensile force and a magnetic repulsive force can be switched. Therefore, compared with the case where all the moving magnets are permanent magnets, the number of magnets is reduced.

  (5) Preferably, in any one of the configurations (1) to (4), when the non-contact drive mechanism moves the movable part in the narrow direction with respect to the base, the base It is better to have a friction adjustment mechanism that reduces the frictional force between the base and the movable part by applying the non-contact force in the direction of floating the movable part.

  Part of the non-contact force applied to the movable part to move the movable part in the narrow direction is consumed by friction between the base and the movable part. For this reason, when the frictional force between the base and the movable part is large, the part that acts as the clamping force of the pair of clamp members among the non-contact forces becomes small. That is, the loss of non-contact force is increased. In this regard, according to the present configuration, buoyancy is applied to the movable part. For this reason, the frictional force between the base and the movable part can be reduced. Therefore, the loss of non-contact force for moving the movable part in the narrow direction is reduced.

  In addition, when the frictional force between the base and the movable part is large, the movable part may not move if the non-contact force for moving the movable part in the narrow direction is small. On the other hand, if the non-contact force for moving the movable part in the narrow direction is large, the movable part may suddenly start moving. Thus, when the frictional force between the base and the movable part is large, it may be difficult to control the non-contact force at the time of the initial movement of the movable part. In this regard, according to the present configuration, the frictional force between the base and the movable part can be reduced. For this reason, the control of the non-contact force at the time of the initial movement of the movable part is simple.

  (6) Preferably, in the configuration of the above (5), the friction adjustment mechanism further includes a non-contact driving mechanism that moves the movable part in the narrow direction relative to the base, and On the other hand, it is preferable that the non-contact force is applied in the direction in which the movable portion is lowered to increase the frictional force between the base portion and the movable portion. According to this configuration, it is possible to prevent the movable portion from moving again after the circuit board is positioned. For this reason, it can suppress that the circuit board after positioning rattles.

  (7) Preferably, in the configuration of (6), the friction adjustment mechanism may be configured so that the non-contact driving mechanism moves the movable part in the narrow direction relative to the base, and then It is preferable that the non-contact force be applied only in the direction in which the movable part is lowered.

  According to this configuration, after the circuit board is positioned, the clamping force applied to the circuit board from the pair of clamp members is released. For this reason, it can suppress that a circuit board deform | transforms with the said clamping force. Therefore, this configuration is particularly suitable for a thin circuit board.

  Even if the clamping force is released, the elastic restoring force due to the clamping force may remain on the circuit board. However, even in this case, it is possible to suppress the deformation of the circuit board as compared with the case where the clamping force is continuously applied after the circuit board is positioned.

  (8) Preferably, in any one of the above configurations (5) to (7), the base portion and the movable portion each have a vertical facing surface that faces each other in the vertical direction, and the friction adjustment mechanism Is preferably configured to have a friction adjusting gas passage that opens in the vertically opposite surface of the base.

  According to this configuration, the frictional force between the base portion and the movable portion can be adjusted by applying at least one of the gas discharge force and the gas suction force between the pair of vertically opposed surfaces. For example, when a gas discharge force is applied, the frictional force can be reduced by blowing gas from the opening of the friction adjustment gas passage on the vertically facing surface of the base portion to the vertically facing surface of the movable portion. . In addition, when a gas suction force is applied, the friction force can be increased by sucking the gas from the opening of the friction adjustment gas passage on the surface facing the vertical direction of the base.

  (8-1) Preferably, in the configuration of (8) above, when the gas discharge force is used as the non-contact force, a gap between the pair of vertically opposed surfaces is open to the outside. Better. According to this structure, the gas sprayed on the up-down direction opposing surface of the movable part can be leaked to the outside as it is. For this reason, it is not necessary to provide a separate exhaust passage in the substrate positioning device. Therefore, the structure of the substrate positioning device is simplified.

  (9) Preferably, in the configuration according to any one of (5) to (8), the friction adjustment mechanism includes a plurality of friction adjustment magnets arranged to be shifted vertically in the base portion and the movable portion. It is better to have a configuration.

  According to this configuration, the movable portion can be moved by applying at least one of a magnetic tensile force and a magnetic repulsive force between the base portion and the movable portion (may be used in combination with the above (8)). According to this configuration, a gas passage is not necessary for a portion on which at least one of a magnetic tensile force and a magnetic repulsive force acts. This simplifies the structure of the substrate positioning device by extending the base.

  (9-1) Preferably, in the configuration of (9), at least one of the plurality of friction adjustment magnets is an electromagnet. According to this configuration, the magnitude of the magnetic tensile force and the magnetic repulsive force can be controlled by changing the magnitude of the voltage and current with respect to the electromagnet. For this reason, compared with the case where a permanent magnet is used as a friction adjustment magnet, the movement of a movable part can be controlled more precisely.

  Moreover, according to this structure, the polarity of an electromagnet can be reversed by changing the direction of the voltage and electric current with respect to an electromagnet. For this reason, a magnetic tensile force and a magnetic repulsive force can be switched. Therefore, the number of magnets arranged is reduced as compared with the case where all the friction adjusting magnets are permanent magnets.

  (10) In order to solve the above-described problem, a substrate processing apparatus of the present invention includes the substrate positioning apparatus according to any one of (1) to (9).

  According to the substrate processing apparatus of the present invention, it is possible to precisely control the clamping force between a pair of clamp members. Even when a defective circuit board is clamped, the clamping force is unlikely to vary. For this reason, the positioning accuracy of the circuit board is high. Therefore, the processing accuracy when performing predetermined processing on the circuit board is increased.

  (11) Further, in order to solve the above-described problem, the substrate positioning method of the present invention is a substrate positioning in which the circuit board is positioned by narrowing the width between a pair of clamp members arranged on both sides of the circuit board in the width direction. The clamp member is at least one of a pair of the clamp members, and is movable in a narrow direction near the base and the base supported by the base from below. A movable part capable of pressing the circuit board, and a non-contact force which is one or more kinds of forces selected from a gas discharge force, a gas suction force, a magnetic repulsive force, and a magnetic tensile force, and the base part and the movable part And a board positioning step of positioning the circuit board by moving the movable part in the narrow direction relative to the base.

  According to the substrate positioning method of the present invention, the movable part is moved by the non-contact force acting between the base part and the movable part. For this reason, compared with the case where a clamp member itself is moved with an air cylinder, the moving amount | distance of a movable part can be controlled precisely. Therefore, the clamping force between the pair of clamp members can be precisely controlled.

  Further, according to the substrate positioning method of the present invention, the movable part is moved by a non-contact force. For example, when a gas discharge force is used as the non-contact force, the movable part is moved by blowing gas. Further, when a gas suction force is used as the non-contact force, the movable part is moved by sucking the gas. Moreover, when using a magnetic tensile force as a non-contact force, the movable part is moved by making the polarities of the sections in which the magnetic tensile force acts between the base and the movable part differ from each other. Moreover, when using a magnetic repulsive force as a non-contact force, the movable part is moved by making the polarities of the sections in which the magnetic repulsive force acts between the base and the movable part coincide with each other.

  For this reason, a guide member is unnecessary compared with the case where the clamp member itself is moved by an air cylinder. Therefore, the moving direction of the movable part is not restricted only in the narrow direction. Therefore, the movable part can be tilted in a substantially horizontal plane without providing a specific swing axis. That is, even when a defective circuit board is sandwiched, a pair of clamp members can be arranged along both edges in the width direction. Further, since the force in the rotational direction is unlikely to act on the defective circuit board, both edges in the width direction can be firmly clamped.

  (12) Preferably, in the configuration of (11) above, in the substrate positioning step, the non-contact force is applied to the base portion in a direction in which the movable portion is levitated, and the base portion and the movable portion are It is better to have a configuration that reduces the frictional force between them.

  Part of the non-contact force applied to the movable part to move the movable part in the narrow direction is consumed by friction between the base and the movable part. For this reason, when the frictional force between the base and the movable part is large, the part that acts as the clamping force of the pair of clamp members among the non-contact forces becomes small. That is, the loss of non-contact force is increased. In this regard, according to the present configuration, buoyancy is applied to the movable part. For this reason, the frictional force between the base and the movable part can be reduced. Therefore, the loss of non-contact force for moving the movable part in the narrow direction is reduced.

  Moreover, when the frictional force between the base and the movable part is large, the movable part may pop out when the movable part starts to move. In this regard, according to the present configuration, the frictional force between the base and the movable part can be reduced. For this reason, when a movable part starts moving, there is little possibility that a movable part will jump out.

  (13) Preferably, in the configuration of (11) or (12), after the substrate positioning step, the non-contact force is applied to the base in a direction in which the movable part is lowered, and the base It is better to have a configuration including a substrate position fixing step for increasing the frictional force with the movable portion. According to this configuration, it is possible to prevent the movable portion from moving again after the circuit board is positioned. For this reason, it can suppress that the circuit board after positioning rattles.

  (14) Preferably, in the configuration of (13), the substrate position fixing step may be configured to apply the non-contact force only in a direction in which the movable portion is lowered with respect to the base portion.

  According to this configuration, after the circuit board is positioned, the clamping force applied to the circuit board from the pair of clamp members is released. For this reason, it can suppress that a circuit board deform | transforms with the said clamping force. Therefore, this configuration is particularly suitable for a thin circuit board.

  Even if the clamping force is released, the elastic restoring force due to the clamping force may remain on the circuit board. However, even in this case, it is possible to suppress the deformation of the circuit board as compared with the case where the clamping force is continuously applied after the circuit board is positioned.

  (15) In order to solve the above-described problem, the substrate processing method of the present invention raises the circuit board between the substrate positioning method of any one of (11) to (14) and a pair of the clamp members. And a processing step of performing a predetermined processing on the circuit board.

  According to the substrate processing method of the present invention, it is possible to precisely control the clamping force between a pair of clamp members. Even when a defective circuit board is clamped, the clamping force is unlikely to vary. For this reason, the positioning accuracy of the circuit board is high. Therefore, in the processing step, processing accuracy when performing predetermined processing on the circuit board is increased.

  (16) Preferably, in the configuration of (15), the processing step is a printing step of printing solder on a top surface of the circuit board through a screen mask, and further after the printing step, the movable It is preferable to have a peeling process in which the screen mask is peeled off from the circuit board in a state where the non-contact force is applied to the circuit board in a narrow direction via a portion.

  In this configuration, the substrate processing method of the present invention is used as a printing method for a screen printer. According to this configuration, the screen mask can be peeled from the circuit board by sandwiching the circuit board using a non-contact force.

  (17) Preferably, in the configuration of (16), after the peeling step, the non-contact force is further exerted between the base and the movable part, whereby the base is It is preferable that the movable portion is moved in a wide direction away from the other clamp member to have a substrate positioning release step for releasing the positioning of the circuit board. According to this configuration, the positioning of the circuit board can be released using a non-contact force. That is, a series of steps of the substrate processing method can be performed using a non-contact force.

  According to the present invention, precise control of the clamping force between a pair of clamp members is possible, and even when a defective circuit board is clamped, the substrate positioning device, the substrate processing apparatus, the substrate positioning method, A substrate processing method can be provided.

  Hereinafter, embodiments in which the substrate processing apparatus and the substrate processing method of the present invention are embodied in a screen printer and a printing method will be described. The substrate positioning apparatus of the present invention will be described as a part of a screen printer. The substrate positioning method of the present invention will be described as a part of the printing method.

<First embodiment>
[Configuration of screen printer]
First, the configuration of the screen printing machine of this embodiment will be described. In the following drawings, the left-right direction is defined as the X direction, the front-rear direction is defined as the Y direction, the up-down direction is defined as the Z direction, and the rotation direction in the XY plane is defined as the θ direction. The X direction corresponds to the substrate transport direction. FIG. 1 shows a side view of the screen printing machine of the present embodiment. As shown in FIG. 1, the screen printing machine 1 of the present embodiment mainly includes a printing device 2, a substrate positioning device 3, a substrate pressing device 4, and a frame 5.

(Substrate positioning device)
The substrate positioning device 3 is disposed inside the frame 5. The substrate positioning device 3 is supported by a support portion (not shown) so as to be movable in the Z direction. The substrate positioning device 3 mainly includes a lower table 30, an intermediate table 31, an upper table 32, and a pair of clamp members 33 and 34.

  The lower table 30 has a rectangular plate shape. The lower table 30 is supported by the support portion via a ball bearing (not shown) so as to be movable in the X direction, the Y direction, and the θ direction.

  The middle table 31 has a rectangular plate shape. The middle table 31 is disposed approximately at the center and above the lower table 30. The middle table 31 is guided by the guide rod 310 and can be moved in the Z direction by a cam mechanism (not shown). In addition, the middle table 31 is movable independently of the lower table 30.

  The upper table 32 has a rectangular plate shape. The upper table 32 is disposed substantially at the center and above the middle table 31. The upper table 32 is supported by the guide rod 310. The upper table 32 can be moved in the Z direction by a motor (not shown). Further, the upper table 32 can move independently of the middle table 31. A plurality of backup pins 320 are mounted on the upper surface of the upper table 32.

  The pair of clamp members 33 and 34 are disposed to face each other in the Y direction. That is, the clamp member 33 is disposed at the front edge of the middle table 31 and the clamp member 34 is disposed at the rear edge of the middle table 31.

  The clamp member 33 includes a base portion 330 and a belt conveyor portion 331. The base 330 is fixed to the front edge of the middle table 31. For this reason, the clamp member 33 is immovable. The base 330 has a rectangular plate shape extending in the XZ direction. The belt conveyor 331 is disposed near the upper end of the rear surface of the base 330. The belt conveyor unit 331 extends in the X direction.

  The clamp member 34 includes a base portion 35, a belt conveyor portion 36, a movable portion 37, a non-contact drive mechanism, and a friction adjustment mechanism. The base 35 is movable in the Y direction with respect to the rear edge of the middle table 31 by a feed screw mechanism (not shown). The belt conveyor unit 36 is disposed near the upper end of the front surface of the base 330. The belt conveyor unit 36 extends in the X direction. The belt conveyor unit 36 faces the belt conveyor unit 331 in the Y direction. Between the pair of belt conveyor portions 331 and 36, a rectangular plate-like circuit board 100 is placed in a bridging manner. The movable part 37 is disposed above the base part 35. The configuration of the clamp member 34 will be described in detail later.

(Printer)
The printing apparatus 2 includes a screen device 20 and a squeegee device 21. The screen device 20 is disposed above the substrate positioning device 3. The screen device 20 is disposed on the frame 5. The screen device 20 includes a frame 200 and a screen mask 201. The screen mask 201 is stretched on the frame 200 with a predetermined tension. A plurality of holes are opened in the screen mask 201 in accordance with the solder printing position of the circuit board 100. Also, cream solder is mounted on the upper surface of the screen mask 201.

  The squeegee device 21 is disposed above the screen device 20. The squeegee device 21 is disposed on the frame 5. The squeegee device 21 includes a pair of squeegees 210, a pair of air cylinders 211, and a guide member 212. The guide member 212 extends in the Y direction. The pair of air cylinders 211 is movable in the Y direction along the guide member 212. The pair of squeegees 210 can move in the Z direction by a pair of air cylinders 211.

(Substrate holding device)
The substrate pressing device 4 includes an apparatus main body 40, an X-direction moving member 41, and a pair of X-direction guide rails 42. The substrate pressing device 4 is disposed between the printing device 2 and the substrate positioning device 3.

  The pair of X direction guide rails 42 are disposed on the frame 5. Each of the pair of X-direction guide rails 42 extends in the X direction. Further, the total length in the X direction of the pair of X direction guide rails 42 is set to be longer than the total length in the X direction of the printing apparatus 2. The pair of X-direction guide rails 42 are arranged to face each other in the Y direction with the substrate positioning device 3 interposed therebetween.

  The X direction moving member 41 is placed between the pair of X direction guide rails 42 in a bridging manner. The X direction moving member 41 is movable in the X direction along the X direction guide rail 42 by a motor (not shown). For this reason, the X-direction moving member 41 can advance and retreat in the X direction with respect to the gap between the printing device 2 and the substrate positioning device 3.

  The apparatus main body 40 is disposed on the X-direction moving member 41. For this reason, similarly to the X-direction moving member 41, the apparatus main body 40 can advance and retreat in the X direction with respect to the gap between the printing apparatus 2 and the substrate positioning apparatus 3. Further, the apparatus main body 40 is movable in the Y direction along the X direction moving member 41 by a feed screw mechanism mechanism (not shown).

[Configuration of clamp member]
Next, the configuration of the clamp member 34 of the substrate positioning device 3 of the screen printing machine 1 according to the present embodiment will be described in detail. FIG. 2 is a perspective view of a clamp member of the substrate positioning device of the screen printing machine according to the present embodiment. In FIG. 3, the perspective view seen from the back downward direction of the clamp member is shown. FIG. 4 shows an exploded perspective view of the clamp member. FIG. 5 shows a cross-sectional view in the VV direction of FIG. FIG. 6 is a cross-sectional view in the VI-VI direction of FIG. FIG. 7 shows a cross-sectional view in the VII-VII direction of FIG. FIG. 8 shows a partially exploded perspective view of the clamp member highlighting the moving first gas passage. FIG. 9 is a partially exploded perspective view of the clamp member highlighting the second gas passage for movement. FIG. 10 shows a partially exploded perspective view of the clamp member in which the friction adjusting gas passage is emphasized.

(movable part)
As shown in FIGS. 2 to 10, the movable portion 37 is made of steel, and integrally includes a substrate pressing portion 370, an anchor portion 371, and a connecting portion 372. The substrate pressing portion 370 has a rectangular plate shape that extends in the XY direction and extends in the X direction.

  The anchor portion 371 has a rectangular plate shape extending in the XY direction and extending in the X direction. The anchor portion 371 extends substantially in parallel below the substrate pressing portion 370. On the lower surface of the anchor portion 371, a vertical facing surface 371a is disposed.

  The connecting portion 372 has a prismatic shape extending in the X direction. The connecting portion 372 connects the approximate center in the Y direction on the lower surface of the substrate pressing portion 370 and the approximate center in the Y direction on the upper surface of the anchor portion 371 in the vertical direction. A width direction facing surface 372 a is disposed on the front surface of the connecting portion 372. A width direction facing surface 372 b is disposed on the rear surface of the connecting portion 372.

(base)
The base 35 includes a main body 350, a front end plate 351, a rear first end plate 352, a rear second end plate 353, a left end plate 354, a right end plate 355, and a porous member 356. I have.

  The main body 350 is made of an aluminum alloy and has a rectangular parallelepiped shape extending in the XZ direction and extending in the X direction. On the upper surface of the main body 350, a vertical facing surface 350a is disposed. The vertical facing surface 350 a is disposed below the vertical facing surface 371 a of the movable portion 37. That is, the pair of vertical facing surfaces 350a and 371a are opposed to each other in the vertical direction.

  As shown mainly by hatching in FIGS. 9 and 10, the main body 350 is formed with three vertical holes 350b to 350d, a recess 350e, and two horizontal holes 350f and 350g. The recessed part 350e is recessedly provided in the up-down direction opposing surface 350a. The recess 350e extends in the X direction. The upper end openings of the three vertical holes 350b to 350d are opened on the bottom surface of the recess 350e. On the other hand, lower end openings of the three vertical holes 350 b to 350 d are opened on the lower surface of the main body 350. The lower end openings of the three vertical holes 350b to 350d communicate with an air pipe (not shown). The three vertical holes 350b to 350d are arranged at predetermined intervals in the left-right direction. The two horizontal holes 350f and 350g penetrate the front and rear surfaces of the main body 350. The rear end openings of the two horizontal holes 350f and 350g communicate with an air pipe (not shown). The two horizontal holes 350f and 350g are arranged at a predetermined interval in the left-right direction so as not to interfere with the three vertical holes 350b to 350d.

  The porous member 356 is made of sintered brass and has a rectangular plate shape extending in the XY direction and extending in the X direction. The porous member 356 has air permeability in the Z direction. The porous member 356 is accommodated in the recess 350e.

  The front end plate 351 is made of an aluminum alloy and has a rectangular plate shape extending in the XZ direction and extending in the X direction. The front end plate 351 is disposed in front of the main body 350. A belt conveyor unit 36 is disposed near the upper edge of the front face of the front end plate 351. A rear protrusion 351 a is formed at the upper end of the front end plate 351. The rear protruding portion 351a is inserted between the lower surface of the substrate pressing portion 370 and the upper surface of the anchor portion 371 of the movable portion 37. A width direction facing surface 351b is disposed on the rear surface of the rearward protruding portion 351a. The width direction facing surface 351b faces the width direction facing surface 372a in front of the movable portion 37 in the Y direction.

  As indicated mainly by hatching in FIG. 9, the front end plate 351 is formed with three bent holes 351c to 351e and a recess 351f. The recess 351f is recessed below the rear surface of the front end plate 351. The recess 351f is sealed by the front surface of the main body 350. Further, the recess 351f is continuous with the front end openings of the two horizontal holes 350f and 350g of the main body 350. The three bent holes 351c to 351e extend upward from the recess 351f and are bent backward. That is, the lower end openings of the three bent holes 351c to 351e are opened on the inner surface of the recess 351f. On the other hand, the rear end openings of the three bent holes 351c to 351e are opened in the width direction facing surface 351b of the rear protrusion 351a.

  The rear first end plate 352 is made of an aluminum alloy and has a rectangular plate shape extending in the XZ direction and extending in the X direction. The rear first end plate 352 is disposed behind the main body 350. A front protrusion 352 a is formed at the upper end of the rear first end plate 352. The front protrusion 352 a is inserted between the lower surface of the substrate pressing portion 370 and the upper surface of the anchor portion 371 of the movable portion 37. A width direction facing surface 352b is disposed on the front surface of the front protrusion 352a. The width direction facing surface 352b faces the width direction facing surface 372b behind the movable portion 37 in the Y direction.

  As shown mainly by hatching in FIG. 8, the rear first end plate 352 is formed with seven lateral holes 352c to 352i and a recess 352k. The recess 352k is recessed above the rear surface of the rear first end plate 352. The seven horizontal holes 352c to 352i extend forward from the recess 352k. That is, the rear end openings of the seven horizontal holes 352c to 352i are opened on the front bottom surface of the recess 352k. On the other hand, the front end openings of the seven horizontal holes 352c to 352i are opened in the width direction facing surface 352b of the front protrusion 352a.

  The rear second end plate 353 is made of an aluminum alloy and has a rectangular plate shape extending in the XZ direction and extending in the X direction. The rear second end plate 353 is disposed behind the rear first end plate 352.

  As shown mainly by hatching in FIG. 8, three lateral holes 353 a to 353 c are formed in the rear second end plate 353. The three horizontal holes 353 a to 353 c penetrate the front and rear surfaces of the rear second end plate 353. The rear end openings of the three horizontal holes 353a to 353c communicate with an air pipe (not shown). The front end openings of the three horizontal holes 353 a to 353 c are continuous with the recess 352 k of the rear first end plate 352.

  The left end plate 354 is made of an aluminum alloy and has a rectangular plate shape extending in the YZ direction. The left end plate 354 is disposed on the left side of the main body 350, the anchor portion 371, and the connecting portion 372. The left end plate 354 suppresses the anchor portion 371 and the connecting portion 372 from dropping off to the left with respect to the main body 350.

  The right end plate 355 is made of an aluminum alloy and has a rectangular plate shape extending in the YZ direction. The right end plate 355 is disposed on the right side of the main body 350, the anchor portion 371, and the connecting portion 372. The right end plate 355 suppresses the anchor portion 371 and the connecting portion 372 from dropping to the right with respect to the main body 350.

[Moving cost of moving parts]
Next, the movement allowance of the movable portion 37 of the clamp member 34 of the substrate positioning device 3 of the screen printing machine 1 of the present embodiment will be described. First, the movement margin in the Y direction of the movable part 37 will be described. As shown in FIGS. 5 to 7, a gap C <b> 1 is defined between the forward width direction facing surface 372 a of the movable portion 37 and the rear width direction facing surface 351 b of the front end plate 351. Further, a gap C <b> 2 is defined between the rearward facing width direction facing surface 372 b of the movable part 37 and the forward facing width direction facing surface 352 b of the rear first end plate 352. The movable portion 37 can move in the Y direction with respect to the base portion 35 by the gaps C1 and C2.

  Next, the movement margin in the X direction of the movable part 37 will be described. As shown in FIG. 5, a gap C <b> 3 (which is emphasized and shown in FIG. 5 is very small) between the left end surface of the movable portion 37 (connecting portion 372) and the right surface of the left end plate 354. It is partitioned. In addition, a gap C4 (which is shown in a highlighted manner in FIG. 5 but minute) is defined between the right end surface of the movable portion 37 (connecting portion 372) and the left end surface of the right end plate 355. The movable portion 37 can move in the X direction with respect to the base portion 35 by the gaps C3 and C4.

  Thus, the movable part 37 can move in the Y direction by the gaps C1 and C2. In addition, the movable portion 37 can move by a minute amount in the X direction by the gaps C3 and C4. Therefore, the movable portion 37 can tilt in the XY plane using the gaps C3 and C4 while moving in the Y direction using the gaps C1 and C2.

  Next, the movement margin in the Z direction of the movable part 37 will be described. As shown in FIGS. 6 and 7, a gap C <b> 5 is defined between the upper surface of the anchor portion 371 of the movable portion 37 and the lower surface of the rear protrusion 351 a and the lower surface of the front protrusion 352 a. The movable portion 37 can move in the Z direction with respect to the base portion 35 by the gap C5.

[Configuration of non-contact drive mechanism]
Next, the configuration of the non-contact drive mechanism of the clamp member 34 of the substrate positioning device 3 of the screen printing machine 1 according to the present embodiment will be described. As shown in FIGS. 8 and 9, the non-contact drive mechanism 6 includes a moving first gas passage 90 and a moving second gas passage 91. The moving first gas passage 90 and the moving second gas passage 91 are both formed in the clamp member 34.

  First, the moving first gas passage 90 will be described. The moving first gas passage 90 is used to move the movable portion 37 in the narrow direction (forward in the Y direction). The first gas passage 90 for movement has three horizontal holes 353a to 353c, a recess 352k, and seven horizontal holes 352c from the upstream side toward the downstream side, as shown by hatching in FIG. -352i. Air is supplied from the rear end openings of the three horizontal holes 353a to 353c. The air is opposed to the width direction facing surface 352b on the front surface of the rear first end plate 352 and the width direction facing the rear surface of the movable portion 37 through the three horizontal holes 353a to 353c → the recess 352k → the seven horizontal holes 352c to 352i. It is supplied to a gap C2 (see FIGS. 5 to 7) between the surface 372b. The flow rate of air supplied to the gap C2, that is, the flow rate of air flowing through the seven horizontal holes 352c to 352i is adjusted to be substantially equal by passing through the recess 352k. Air is supplied toward the front. That is, air is supplied to the base 35 in the direction in which the movable portion 37 is moved forward.

  Next, the moving second gas passage 91 will be described. The second moving gas passage 91 is used to move the movable portion 37 in the wide direction (rear in the Y direction). As shown by hatching in FIG. 9, the second gas passage 91 for movement has two horizontal holes 350f, 350g, a recess 351f, and three bent holes 351c from the upstream side toward the downstream side. ˜351e. Air is supplied from the rear end openings of the two horizontal holes 350f and 350g. The air passes through the two horizontal holes 350f, 350g → the recess 351f → the three bent holes 351c to 351e, and the width direction facing surface 351b on the rear surface of the front end plate 351 and the width direction facing surface 372a on the front surface of the movable portion 37. To the gap C1 (see FIGS. 5 to 7). The flow rate of air supplied to the gap C1, that is, the flow rate of air flowing through the three bent holes 351c to 351e, is adjusted to be substantially equal by passing through the recess 351f. Air is supplied toward the rear. That is, the air is supplied to the base 35 in the direction in which the movable portion 37 is moved backward.

[Configuration of friction adjustment mechanism]
Next, the configuration of the friction adjustment mechanism of the clamp member 34 of the substrate positioning device 3 of the screen printing machine 1 according to the present embodiment will be described. As shown in FIG. 10, the friction adjustment mechanism 7 includes a friction adjustment gas passage 92. The friction adjusting gas passage 92 is formed in the clamp member 34.

  The friction adjusting gas passage 92 is used to move the movable portion 37 in the Z direction. As shown by hatching in FIG. 10, the friction adjustment gas passage 92 includes three vertical holes 350 b to 350 d and a recess 350 e from the upstream side toward the downstream side.

  When reducing the frictional force between the base part 35 and the movable part 37, air is supplied from the lower end openings of the three vertical holes 350b to 350d. Air is supplied between the vertical facing surface 350a on the top surface of the main body 350 and the vertical facing surface 371a on the bottom surface of the movable portion 37 via the three vertical holes 350b to 350d → the concave portion 350e → the porous member 356. Is done. The pressure of the supplied air is adjusted by passing through the recess 350e and the porous member 356. Air is supplied upward. That is, air is supplied to the base 35 in the direction in which the movable portion 37 is moved upward.

  On the other hand, when the frictional force between the base portion 35 and the movable portion 37 is increased, air is sucked from the lower end openings of the three vertical holes 350b to 350d. Air is sucked from between the vertical facing surface 350a on the upper surface of the main body 350 and the vertical facing surface 371a on the lower surface of the movable portion 37 through the porous member 356 → the recess 350e → the three vertical holes 350b to 350d. Is done. That is, the air flows in a direction in which the movable portion 37 is moved downward with respect to the base portion 35.

[Printing method]
Next, a printing method of the screen printer 1 according to the present embodiment will be described. The printing method of the screen printing machine 1 according to the present embodiment includes a substrate carry-in process, a substrate positioning process, a substrate position fixing process, a printing process, a peeling process, and a substrate positioning releasing process. The printing process is included in the processing process of the present invention.

(Substrate loading process)
FIG. 11 is a schematic view of the substrate carrying-in process of the printing method of the screen printing machine according to the present embodiment as viewed from the right side. As shown in FIG. 11, in the board carrying-in process, the circuit board 100 is carried into a predetermined position of the screen printing machine 1 from the left in the X direction (the back side of the paper) by the pair of belt conveyor units 331 and 36.

(Board positioning process)
FIG. 12 is a schematic view of the first stage of the substrate positioning process of the printing method of the screen printing machine according to the present embodiment as viewed from the right side. FIG. 13 shows a schematic view of the middle stage of the process as viewed from the right side. FIG. 14 shows a schematic view of the latter stage of the process as viewed from the right side.

  A gap C6 is formed between the front edge of the circuit board 100 carried in by the board carrying-in process and the base 330. A gap C <b> 7 is formed between the rear edge of the circuit board 100 and the movable portion 37. In order to improve printing accuracy in a printing process to be described later, it is necessary to align the positions of the circuit board 100 and the screen mask 201 (see FIG. 1) in the X and Y directions. Therefore, in this step, the circuit board 100 is moved forward by the movable portion 37. Then, the circuit board 100 is brought into contact with the front clamp member 33.

  Specifically, first, air is supplied between the base portion 35 and the movable portion 37 via the friction adjustment gas passage 92 (see FIG. 10), as shown by hatching in FIG. 12. That is, buoyancy is applied to the movable portion 37 by air. And the frictional force between the base 35 and the movable part 37 is reduced. The supplied air is leaked to the outside through a gap between the base portion 35 and the movable portion 37.

  Subsequently, as shown by hatching in FIG. 13, air is supplied to the rear gap between the base portion 35 and the movable portion 37 via the first moving gas passage 90 (see FIG. 8). . That is, the movable part 37 is moved forward with respect to the base part 35 by air. Then, the circuit board 100 is pushed forward by the movable portion 37 until the gaps C6 and C7 in FIG. 12 disappear. In other words, the movable portion 37 is moved between the pair of clamp members 33 and 34 until the circuit board 100 is accommodated without a gap. The supplied air is leaked to the outside through a gap between the base portion 35 and the movable portion 37.

  Subsequently, as shown in FIG. 14 with emphasis by hatching, the direction of the air flowing through the friction adjustment gas passage 92 (see FIG. 10) is reversed from upward to downward. That is, the movable portion 37 is sucked to the base portion 35 through the friction adjusting gas passage 92. And the frictional force between the base 35 and the movable part 37 is increased.

  As described above, in this step, first, buoyancy is applied to the movable portion 37 by the air from the friction adjusting gas passage 92, and then the movable portion 37 is moved forward by the air from the moving first gas passage 90. Finally, the movable portion 37 is sucked downward from the friction adjustment gas passage 92 to thereby position the circuit board 100 in the X and Y directions.

(Board position fixing process)
FIG. 15 is a schematic view of the substrate position fixing process of the printing method of the screen printing machine according to the present embodiment as viewed from the right side. In this step, first, the supply of air from the moving first gas passage 90 (see FIG. 8) is stopped. That is, as shown by hatching in FIG. 15, only the downward suction force from the friction adjustment gas passage 92 (see FIG. 10) is applied to the movable portion 37. By applying a downward suction force to the movable portion 37, the position in the XY direction of the circuit board 100 set in the previous process is fixed.

  Subsequently, the apparatus main body 40 of the board pressing apparatus 4 shown in FIG. 1 is moved above the circuit board 100. The height of the lower surface of the apparatus main body 40 and the height of the upper surfaces of the pair of clamp members 33 and 34 are substantially the same. Then, the upper table 32 is raised, and the circuit board 100 is lifted from the pair of belt conveyor portions 331 and 36 by the plurality of backup pins 320. Then, by bringing the upper surface of the circuit board 100 into contact with the lower surface of the apparatus main body 40, the upper surface of the circuit board 100 and the upper surfaces of the pair of clamp members 33 and 34 are substantially flush with each other.

(Printing process)
FIG. 16 is a schematic view of the printing process of the printing method of the screen printing machine according to the present embodiment as viewed from the right side. In this step, first, the apparatus main body 40 is withdrawn from above the circuit board 100. Next, in a state where the positional relationship between the circuit board 100, the pair of clamp members 33 and 34, and the backup pin 320 is fixed, these members are raised together with the middle table 31 shown in FIG. Subsequently, the upper surface of the circuit board 100 is brought into contact with the lower surface of the screen mask 201. Then, the squeegee 210 shown in FIG. 1 is lowered to the upper surface of the screen mask 201 by the air cylinder 211. Then, the squeegee 210 is moved in the Y direction, and the cream solder mounted on the upper surface of the screen mask 201 is printed at a predetermined position on the upper surface of the circuit board 100 through the holes of the screen mask 201. In addition, as highlighted with hatching in FIG. 16, the downward suction force from the friction adjustment gas passage 92 (see FIG. 10) is continuously applied to the movable portion 37 during this process.

(Peeling process)
In FIG. 17, the schematic diagram which looked at the peeling process of the printing method of the screen printer of this embodiment from the right side is shown. In this step, first, the direction of the air flowing through the friction adjustment gas passage 92 (see FIG. 10) is reversed from the downward direction to the upward direction, as shown by hatching in FIG. And the frictional force between the base 35 and the movable part 37 is reduced. The supplied air is leaked to the outside through a gap between the base portion 35 and the movable portion 37.

  Subsequently, as shown by hatching in FIG. 17, air is supplied to the rear gap between the base portion 35 and the movable portion 37 via the first moving gas passage 90 (see FIG. 8). . Then, the circuit board 100 is pressed forward by the movable portion 37. That is, a clamping force in the Y direction is applied to the circuit board 100 by the pair of clamp members 33 and 34. The supplied air is leaked to the outside through a gap between the base portion 35 and the movable portion 37.

  Then, with the positional relationship between the circuit board 100, the pair of clamp members 33 and 34, and the backup pin 320 being fixed, these members are lowered together with the intermediate table 31 shown in FIG. That is, the circuit board 100 is lowered with respect to the stationary screen mask 201. By the descending, the screen mask 201 is relatively peeled from the circuit board 100.

(Board positioning release process)
FIG. 18 is a schematic view of the substrate positioning release process of the printing method of the screen printing machine according to the present embodiment as viewed from the right side. In this step, first, the supply of air from the moving first gas passage 90 (see FIG. 8) is stopped. Next, as shown by hatching in FIG. 18, air is supplied between the base portion 35 and the movable portion 37 via the moving second gas passage 91 (see FIG. 9). Then, the movable portion 37 is moved backward with respect to the rear edge of the circuit board 100. Thereafter, the upper table 32 is lowered, and the circuit board 100 is placed on the pair of belt conveyor units 331 and 36. As highlighted by hatching in FIG. 18, buoyancy from the friction adjustment gas passage 92 (see FIG. 10) is continuously applied to the movable portion 37 during this process. Further, the supplied air is leaked to the outside through a gap between the base portion 35 and the movable portion 37.

[Poor circuit board positioning method]
Next, the case where the defective circuit board is positioned in the board positioning step of the printing method of the screen printer 1 of the present embodiment will be described. FIG. 19 shows a schematic view of the front stage of the substrate positioning process when the defective circuit board is positioned as viewed from above. FIG. 20 shows a schematic view of the latter stage of the process as viewed from above.

  In this step, as shown in FIGS. 12 to 14, buoyancy is first given to the movable portion 37 by the air from the friction adjustment gas passage 92, and then the movable portion 37 is made by the air from the moving first gas passage 90. Is moved forward, and finally the movable portion 37 is sucked downward by the friction adjusting gas passage 92, whereby the defective circuit board 101 is positioned in the X and Y directions.

  As emphasized in FIG. 19, the leading edge and the trailing edge of the defective circuit board 101 are not parallel to each other. For this reason, it is difficult to firmly position the defective circuit board 101 even if the movable part is moved forward while maintaining the parallel state of the movable part 37 and the base part 330.

  Here, gaps C3 and C4 are secured at both ends in the left-right direction of the movable portion 37, as shown in FIG. For this reason, the movable part 37 can tilt in the XY plane while consuming the gaps C3 and C4. Therefore, as shown in FIG. 20, the movable portion 37 tilts along the rear edge of the defective circuit board 101 when moving forward by the air from the first moving gas passage 90. By the tilting, the defective circuit board 101 can be firmly positioned between the movable portion 37 and the base portion 330.

<Effect>
Next, functions and effects of the substrate positioning device 3, the screen printing machine 1, the substrate positioning method, and the printing method (hereinafter simply referred to as “substrate positioning device etc.”) will be described.

  According to the substrate positioning apparatus and the like of this embodiment, the movable portion 37 is moved by the gas discharge force (included in the non-contact force of the present invention) acting between the width direction facing surfaces 352b and 372b. For this reason, compared with the case where the clamp member 34 itself is moved with an air cylinder, the movement amount of the movable part 37 can be controlled precisely. Therefore, the clamping force between the pair of clamp members 33 and 34 can be precisely controlled.

  Further, according to the substrate positioning device of this embodiment, the movable portion 37 is moved by the gas discharge force. For this reason, a guide member is unnecessary compared with the case where the clamp member 34 itself is moved with an air cylinder. Therefore, the moving direction of the movable part 37 is not restricted only in the Y direction. Therefore, the movable part 37 can be tilted in the XY plane without providing a specific swing axis. That is, as shown in FIGS. 19 and 20, even when the defective circuit board 101 is sandwiched, the pair of clamp members 33 and 34 are arranged along both edges in the width direction (Y direction) of the defective circuit board 101. Can be arranged. In addition, since the force in the rotational direction hardly acts on the defective circuit board 101, both edges in the width direction can be firmly held.

  Further, according to the substrate positioning device and the like of the present embodiment, the movable portion 37 is moved in the narrow direction and the wide direction only by the non-contact drive mechanism 6 (the first moving gas passage 90 and the second moving gas passage 91). Can move. For this reason, the structure of the board | substrate positioning apparatus 3 becomes simple compared with the case where the non-contact drive mechanism 6 and an air cylinder are used together, for example.

  Further, according to the substrate positioning device and the like of the present embodiment, the air supplied by the non-contact drive mechanism 6 can be leaked to the outside through the gap between the base portion 35 and the movable portion 37. For this reason, it is not necessary to provide a separate exhaust passage in the substrate positioning device 3. Therefore, the structure of the substrate positioning device 3 is simplified.

  Further, according to the substrate positioning device and the like of this embodiment, in addition to the non-contact drive mechanism 6, the friction adjustment mechanism 7 (friction adjustment gas passage 92) is arranged. The friction adjustment mechanism 7 can apply upward and downward forces to the movable portion 37. For this reason, when the movable part 37 is moved by applying an upward force to the movable part 37, the frictional force between the base 35 and the movable part 37 can be reduced. On the other hand, by applying a downward force to the movable part 37, the frictional force between the base part 35 and the movable part 37 can be increased when the movable part 37 is positioned.

  Further, according to the substrate positioning device of this embodiment, as shown in FIG. 15, only a downward suction force can be applied to the movable portion 37 in the substrate position fixing step. For this reason, after the circuit board 100 is positioned, the clamping force applied to the circuit board 100 from the pair of clamp members 33 and 34 is released. Therefore, it is possible to suppress the circuit board 100 from being deformed by the clamping force. The substrate positioning device and the like of the present embodiment are particularly suitable for the circuit board 100 having a thin plate thickness (full length in the Z direction).

  Further, according to the substrate positioning device and the like of the present embodiment, the air supplied by the friction adjustment mechanism 7 can be leaked to the outside through the gap between the base portion 35 and the movable portion 37. For this reason, it is not necessary to provide a separate exhaust passage in the substrate positioning device 3. Therefore, the structure of the substrate positioning device 3 is simplified.

  Further, according to the screen printer 1 and the printing method of the present embodiment, since the substrate positioning device 3 of the present embodiment is used, the positioning accuracy of the circuit board 100 is high. Therefore, the printing accuracy when the cream solder is printed on the circuit board 100 is increased.

  Further, according to the screen printing machine 1 and the printing method of the present embodiment, the clamping force is applied to the circuit board 100 by the pair of clamp members 33 and 34 in a state where buoyancy is applied to the movable portion 37 in the peeling step shown in FIG. Added. For this reason, the screen mask 201 can be relatively peeled from the circuit board 100 while precisely controlling the clamping force.

<Second embodiment>
The difference between the screen printing machine and the printing method of the present embodiment and the screen printing machine and the printing method of the first embodiment is that the non-contact drive mechanism and the friction adjustment mechanism have a magnetic repulsive force, a magnetic force as a non-contact force. This is the point where tensile force is used. Therefore, only the differences will be described here.

  FIG. 21 is a horizontal sectional view of the clamp member of the substrate positioning device of the screen printing machine according to the present embodiment. In addition, about the site | part corresponding to FIG. 5, it shows with the same code | symbol. FIG. 22 is a sectional view taken along the line XXII-XXII in FIG. In addition, about the site | part corresponding to FIG. 6, it shows with the same code | symbol.

  As shown in FIGS. 21 and 22, the clamp member 34 includes a base portion 35, a belt conveyor portion 36, a movable portion 37, a non-contact drive mechanism 6, and a friction adjustment mechanism 7. The base portion 35 includes a main body 350, a front end plate 351, a rear end plate 357, a left end plate 354, and a right end plate 355. The members constituting the base portion 35 and the movable portion 37 are made of a nonmagnetic material such as stainless steel.

  The rear end plate 357 has the same shape as the front end plate 351. The rear end plate 357 is opposed to the front end plate 351 in the Y direction across the main body 350 and the connecting portion 372 of the movable portion 37. A total of seven moving magnets 357c to 357i are embedded in the width direction facing surface 357b of the front protrusion 357a of the rear end plate 357 at a predetermined interval in the X direction. The moving magnets 357c to 357i are electromagnets.

  A total of seven moving magnets 372c to 372i are embedded in the connecting portion 372 of the movable portion 37 so as to pass through the width direction facing surfaces 372a and 372b with a predetermined interval in the X direction. The moving magnets 372c to 372i are electromagnets. The moving magnets 372c to 372i of the movable portion 37 face the moving magnets 357c to 357i of the rear end plate 357 on a one-to-one basis in the Y direction.

  A total of four moving magnets 351g to 351j are embedded in the width direction facing surface 351b of the rear projecting portion 351a of the front end plate 351 at a predetermined interval in the X direction. The moving magnets 351g to 351j are electromagnets. The moving magnets 351g to 351j on the front end plate are opposed to the moving magnets 372c to 372i of the movable portion 37 every other direction.

  The non-contact drive mechanism 6 is configured by the moving magnets 357c to 357i of the rear end plate 357, the moving magnets 372c to 372i of the movable portion 37, and the moving magnets 351g to 351j of the front end plate 351.

  A friction adjusting magnet 371 b is embedded in the vertically facing surface 371 a of the anchor portion 371 of the movable portion 37. The friction adjusting magnet 371b is an electromagnet. A friction adjusting magnet 350 h is embedded in the vertically facing surface 350 a of the main body 350. The friction adjusting magnet 350h is an electromagnet. The friction adjustment magnet 350h of the main body 350 is opposed to the friction adjustment magnet 371b of the anchor portion 371 in the vertical direction over the entire length of the anchor portion 371 in the X direction.

  The friction adjustment mechanism 7 is configured by the friction adjustment magnet 371 b of the anchor portion 371 and the friction adjustment magnet 350 h of the main body 350.

  When moving the movable part 37 forward, first, the energization to the moving magnets 351g to 351j of the front end plate 351 is cut off. Next, the polarities of the rear surfaces of the moving magnets 372c to 372i of the movable portion 37 and the front surfaces of the moving magnets 357c to 357i of the rear end plate 357 are matched. That is, the movable part 37 is moved forward by the magnetic repulsive force.

  When moving the movable portion 37 backward, first, the energization to the moving magnets 357c to 357i of the rear end plate 357 is cut off. Next, the polarities of the front surfaces of the moving magnets 372c to 372i of the movable portion 37 and the rear surfaces of the moving magnets 351g to 351j of the front end plate 351 are matched. That is, the movable part 37 is moved backward by the magnetic repulsive force.

  When the frictional force between the base portion 35 and the movable portion 37 is reduced, the polarities of the lower surface of the friction adjustment magnet 371b of the anchor portion 371 and the upper surface of the friction adjustment magnet 350h of the main body 350 are matched. That is, buoyancy is applied to the movable portion 37 by the magnetic repulsive force.

  When the frictional force between the base portion 35 and the movable portion 37 is increased, the polarities of the lower surface of the friction adjustment magnet 371b of the anchor portion 371 and the upper surface of the friction adjustment magnet 350h of the main body 350 are made different. Specifically, the direction of the current applied to the friction adjustment magnet 371b or the friction adjustment magnet 350h is reversed. And the movable part 37 is attracted | sucked to the base 35 with a magnetic tensile force.

  The pressing force applied by the movable portion 37 to the circuit board, the moving amount of the movable portion 37, the moving speed, and the like are as follows: moving magnets 351g to 351j, moving magnets 372c to 372i, moving magnets 357c to 357i, friction adjusting magnets It can be controlled by adjusting the energization state (voltage, current, etc.) to 371b and the friction adjusting magnet 350h. By appropriately combining the operations of the movable portion 37, the printing method of the screen printing machine according to the first embodiment can be executed.

  The substrate positioning device and the like of the present embodiment have the same operational effects with respect to the parts having the same configuration as the substrate positioning device and the like of the first embodiment. Further, according to the substrate positioning device and the like of the present embodiment, a gas passage for moving the movable portion 37 is unnecessary. This simplifies the structure of the substrate positioning device by extending the base 35.

  In addition, the substrate positioning apparatus of this embodiment uses electromagnets as the moving magnets 351g to 351j, the moving magnets 372c to 372i, the moving magnets 357c to 357i, the friction adjusting magnet 371b, and the friction adjusting magnet 350h. Yes. For this reason, the magnitude of the magnetic tensile force and the magnetic repulsive force can be precisely controlled. Therefore, the movement of the movable part 37 can be controlled more precisely than in the case of using a permanent magnet.

  Moreover, the polarity of the electromagnet can be reversed. For this reason, an arbitrary magnet can be used for both the front drive and the rear drive of the movable portion 37. In addition, any magnet can be used for both upward biasing and downward biasing of the movable portion 37. Therefore, compared with the case where a permanent magnet is used, the number of magnets can be reduced.

<Others>
The embodiments of the substrate positioning apparatus, the substrate processing apparatus, the substrate positioning method, and the substrate processing method of the present invention have been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  For example, in the first embodiment, the gas discharge force and the gas suction force are used for the non-contact drive mechanism 6 and the friction adjustment mechanism 7. On the other hand, in the second embodiment, a magnetic repulsive force and a magnetic tensile force are used for the non-contact driving mechanism 6 and the friction adjusting mechanism 7.

  However, you may use combining these non-contact forces suitably. FIG. 23 is a vertical sectional view of a clamp member of a substrate positioning device of a screen printing machine according to another embodiment (part 1). Parts corresponding to those in FIGS. 7 and 22 are denoted by the same reference numerals. As shown in FIG. 23, as the non-contact drive mechanism 6, a moving first gas passage 90 and a moving second gas passage 91 may be arranged as in the first embodiment. In addition, as the friction adjustment mechanism 7, the friction adjustment magnets 371b and 350h may be arranged as in the second embodiment.

  FIG. 24 is a vertical sectional view of a clamp member of a substrate positioning device for a screen printing machine according to another embodiment (part 2). Parts corresponding to those in FIGS. 7 and 22 are denoted by the same reference numerals. As shown in FIG. 24, as the non-contact drive mechanism 6, moving magnets 351h, 372e, and 357e may be arranged as in the second embodiment. In addition, as the friction adjusting mechanism 7, a friction adjusting gas passage 92 may be disposed as in the first embodiment.

  Further, the friction adjustment mechanism 7 may not be arranged. For example, a ball bearing or the like may be interposed between the base portion 35 and the movable portion 37. Then, the movable portion 37 may be moved by the non-contact drive mechanism 6. This simplifies the structure of the substrate positioning device 3 by the amount that the friction adjustment mechanism 7 is not disposed.

  In the substrate positioning apparatus or the like according to the second embodiment, all of the moving magnets 351g to 351j, the moving magnets 372c to 372i, the moving magnets 357c to 357i, the friction adjusting magnet 371b, and the friction adjusting magnet 350h are electromagnets. Was used. However, a permanent magnet may be used. In this case, since it is not necessary to configure an electric circuit, the structure of the substrate positioning device 3 is simplified.

  In the substrate positioning apparatus and the like of the above embodiment, as shown in FIG. 18, the movable portion 37 is moved backward by the air discharge force and the magnetic repulsion force in the substrate positioning release process. However, the clamp member 34 itself may be moved rearward with respect to the rear edge of the middle table 31 by a feed screw mechanism (not shown). This simplifies the structure of the non-contact drive mechanism 6.

  In the substrate positioning device and the like of the above embodiment, as shown in FIG. 16, no clamping force (forward pressing force) is applied from the movable portion 37 to the circuit board 100 in the printing process. However, in the case of the thick circuit board 100, the printing process may be performed in a state where a clamping force is applied to the circuit board 100 from the movable portion 37.

  In the substrate positioning apparatus and the like of the above embodiment, the non-contact drive mechanism 6 and the friction adjustment mechanism 7 are disposed only on the clamp member 34. However, the non-contact drive mechanism 6 and the friction adjustment mechanism are provided on both the clamp members 33 and 34. 7 may be arranged.

  In the substrate positioning device of the first embodiment, the main body 350, the front end plate 351, the rear first end plate 352, the rear second end plate 353, the left end plate 354, and the right end plate 355 are made of aluminum. Although made of an alloy, these members may be made of steel.

  Moreover, in the board | substrate positioning apparatus etc. of 1st embodiment, although air was used as gas, the kind of gas is not specifically limited. An inert gas such as nitrogen or carbon dioxide may be used. If it carries out like this, the oxidation of a solder can be suppressed.

  Moreover, in the said embodiment, although the substrate processing apparatus of this invention was embodied as the screen printing machine 1, you may implement | achieve the substrate processing apparatus of this invention as an electronic component mounting machine, for example. That is, the substrate processing apparatus of the present invention may be embodied as any type of substrate processing apparatus that requires positioning of the circuit board 100.

It is a side view of the screen printer of a first embodiment. It is a perspective view of the clamp member of the substrate positioning device of the screen printing machine. It is the perspective view seen from the back lower direction of the clamp member. It is a disassembled perspective view of the clamp member. FIG. 5 is a cross-sectional view in the VV direction of FIG. 2. FIG. 6 is a cross-sectional view in the VI-VI direction of FIG. 3. It is a VII-VII direction sectional view of Drawing 3. It is the partial exploded perspective view of the clamp member which emphasized the 1st gas passage for movement. It is the partial exploded perspective view of the clamp member which emphasized the 2nd gas passage for movement. It is the partial exploded perspective view of the clamp member which emphasized the gas passage for friction adjustment. It is the schematic diagram which looked at the board | substrate carrying-in process of the printing method of the screen printer from the right side. It is the schematic diagram which looked at the board | substrate positioning process previous stage of the printing method from the right side. It is the schematic diagram which looked at the middle stage of the process from the right side. It is the schematic diagram which looked at the latter stage of the process from the right side. It is the schematic diagram which looked at the board | substrate position fixing process of the printing method from the right side. It is the schematic diagram which looked at the printing process of the printing method from the right side. It is the schematic diagram which looked at the peeling process of the printing method from the right side. It is the schematic diagram which looked at the board | substrate positioning cancellation | release process of the printing method from the right side. It is the schematic diagram which looked at the board | substrate positioning process front in the case of positioning a defective circuit board from the upper side. It is the schematic diagram which looked at the latter stage of the process from the upper side. It is a horizontal direction sectional view of a clamp member of a substrate positioning device of a screen printer of a second embodiment. It is XXII-XXII direction sectional drawing of FIG. It is a vertical direction sectional view of a clamp member of a substrate positioning device of a screen printer of other embodiments (the 1). It is a vertical direction sectional view of a clamp member of a substrate positioning device of a screen printer of other embodiments (the 2).

Explanation of symbols

1: screen printer (substrate processing apparatus), 2: printing apparatus, 3: substrate positioning apparatus, 4: substrate pressing apparatus, 5: frame, 6: non-contact driving mechanism, 7: friction adjusting mechanism.
20: Screen device, 21: Squeegee device, 30: Lower table, 31: Middle table, 32: Upper table, 33: Clamp member, 34: Clamp member, 35: Base part, 36: Belt conveyor part, 37: Movable part, 40: device main body, 41: X direction moving member, 42: X direction guide rail, 90: first gas passage for movement, 91: second gas passage for movement, 92: gas passage for friction adjustment.
100: circuit board, 101: defective circuit board, 200: frame, 201: screen mask, 210: squeegee, 211: air cylinder, 212: guide member, 310: guide rod, 320: backup pin, 330: base, 331: Belt conveyor section, 350: main body, 350a: vertical facing surface, 350b to 350d: vertical hole, 350e: recess, 350f: horizontal hole, 350g: horizontal hole, 350h: friction adjusting magnet, 351: front end plate, 351a : Rear projecting portion, 351b: width direction facing surface, 351c to 351e: bent hole, 351f: recessed portion, 351g to 351j: moving magnet, 352: rear first end plate, 352a: front projecting portion, 352b: width direction facing Surface, 352c to 352i: horizontal hole, 352k: recess, 353: rear second end plate, 353a to 353c: horizontal 354: Left end plate, 355: Right end plate, 356: Porous member, 357: Rear end plate, 357a: Front protrusion, 357b: Width facing surface, 357c to 357i: Moving magnet, 370: Substrate Press part, 371: anchor part, 371a: vertical facing surface, 371b: friction adjusting magnet, 372: connecting part, 372a: width facing surface, 372b: width facing surface, 372c to 372i: moving magnet.
C1 to C7: gaps.

Claims (13)

A board positioning device comprising a pair of clamp members disposed on both sides in the width direction of a circuit board, and positioning the circuit board by narrowing a width between the pair of clamp members,
At least one clamp member of the pair of clamp members is
The base,
A movable part that is supported by the base from below and is movable in a narrow direction adjacent to the other clamp member with respect to the base, and capable of pressing the circuit board;
By applying a non-contact force, which is one or more forces selected from gas discharge force, gas suction force, magnetic repulsive force, and magnetic tensile force, between the base and the movable part, A non-contact drive mechanism for moving the movable part in the narrow direction and positioning the circuit board;
Equipped with a,
Further, when the non-contact drive mechanism moves the movable part in the narrow direction with respect to the base, the non-contact force is applied to the base in a direction to float the movable part, substrate positioning apparatus according to claim Rukoto which have a friction adjusting mechanism to reduce the frictional force between the base and the movable portion.   The non-contact drive mechanism further causes the non-contact force to act between the base and the movable part, thereby widening the movable part away from the other clamp member. The substrate positioning device according to claim 1, wherein the substrate positioning device is moved in a direction. The base portion and the movable portion each have a width direction facing surface facing each other in the width direction,
3. The substrate positioning apparatus according to claim 1, wherein the non-contact driving mechanism has a moving gas passage that opens in the width direction facing surface of the base portion. 4.   The said non-contact drive mechanism is a board | substrate positioning apparatus in any one of Claim 1 thru | or 3 which has the several magnet for a movement arrange | positioned by shifting in the width direction at the said base and the said movable part.   The friction adjustment mechanism may further include the non-contact in a direction in which the non-contact driving mechanism moves the movable part in the narrow direction with respect to the base, and then lowers the movable part with respect to the base. The substrate positioning apparatus according to claim 1, wherein a force is applied to increase a frictional force between the base portion and the movable portion.   The friction adjustment mechanism is configured to apply the non-contact force only in a direction in which the movable part is lowered with respect to the base after the non-contact drive mechanism moves the movable part in the narrow direction with respect to the base. 6. The substrate positioning device according to claim 5, wherein the substrate positioning device is operated.   The base portion and the movable portion each have a vertically facing surface that faces each other in the vertically direction,
  The substrate positioning apparatus according to claim 1, wherein the friction adjustment mechanism includes a friction adjustment gas passage that opens in the vertically opposed surface of the base.   8. The substrate positioning apparatus according to claim 1, wherein the friction adjustment mechanism includes a plurality of friction adjustment magnets that are arranged in the base portion and the movable portion so as to be shifted in the vertical direction.   A substrate processing apparatus comprising the substrate positioning apparatus according to claim 1.   A board positioning method for positioning the circuit board by narrowing a width between a pair of clamp members disposed on both sides in the width direction of the circuit board,
  The clamp member of at least one of the pair of clamp members is movable from the base portion and the base portion from below to the base portion, and is movable in a narrow direction adjacent to the other clamp member. A movable part that can be pressed,
  By applying a non-contact force, which is one or more forces selected from gas discharge force, gas suction force, magnetic repulsive force, and magnetic tensile force, between the base and the movable part, A substrate positioning step for positioning the circuit board by moving the movable part in the narrow direction;
  In the substrate positioning step, the non-contact force is applied in a direction in which the movable portion is levitated with respect to the base portion, and the friction force between the base portion and the movable portion is reduced. Method.   After the substrate positioning step, there is a substrate position fixing step in which the non-contact force is applied in the direction in which the movable portion is lowered with respect to the base portion, and the frictional force between the base portion and the movable portion is increased. The substrate positioning method according to claim 10.   The substrate positioning method according to claim 11, wherein in the substrate position fixing step, the non-contact force is applied only in a direction in which the movable portion is lowered with respect to the base portion.   A substrate positioning method according to any one of claims 10 to 12,
  A processing step of raising the circuit board between the pair of clamp members and performing a predetermined process on the circuit board;
A substrate processing method.

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