JP5100686B2 - Manufacturing method of semiconductor device - Google Patents

Description

  The present invention relates to a method for manufacturing a semiconductor device, and more particularly to a method for manufacturing a semiconductor device on which a semiconductor element such as a light emitting element is mounted.

  In recent years, reproducing apparatuses for reproducing information recorded on a recording medium such as a CD and a DVD have been widely used. The reproducing apparatus is provided with a semiconductor device (laser diode package) including semiconductor elements (light emitting element (laser diode) and light receiving element) for optically reading recorded information.

  FIG. 5 shows an example of a conventional semiconductor device (laser diode package) 100 (see Patent Document 1). More specifically, the semiconductor device 100 includes a stem 103 made of a metal disk having a thickness of several millimeters as a main part of the assembly, and a cap 104 hermetically fixed to the main surface side of the stem 103. In the stem 103, a heat sink 105 having a thickness of several millimeters made of a metal having good thermal conductivity is fixed by brazing at a position slightly off the center of the main surface (upper surface). A submount 108 is fixed to the upper portion of the side surface of the heat sink 105 near the center of the stem 103, that is, the upper portion of the main side surface 106 by a solder 107. A semiconductor element (laser diode) 109 is also fixed on the submount 108 by solder. In the heat sink 5, the position of the main side surface 106 for fixing the submount 108 is fixed. The light receiving element 120 is fixed to the stem 103 by a solder 118. Reference numeral 123 denotes a lead.

  Further, in the method of manufacturing the semiconductor device 100, as shown in FIG. 6, after fixing the heat sink 105 to the main surface of the stem 103, pressing is performed facing the portion of the main side surface 106 that fixes the submount 108 of the heat sink 105. The die 113 is set to the reference position, and the back side 116 of the main side 106 of the heat sink 105 is pressed and punched out to the die 113 side by the punch 115, and the heat sink 105 is deformed to set the position above the main side 106. A fixed surface (reference surface) is formed, and then a submount 108 having a semiconductor element (laser diode) 109 fixed to the upper surface is fixed to the fixed surface by a solder 107 (see FIG. 5).

JP-A-2-174179

  In order to reliably reproduce information recorded on a high-density recording medium having a fine track width such as CD, DVD, etc., a semiconductor device (laser diode package) provided in the reproducing apparatus for reproducing information will be described. It is necessary to provide a semiconductor element, that is, a light emitting element and a light receiving element at a set position with high accuracy.

  In particular, when the light emitting element and the light receiving element are mounted on a common member, the formation accuracy (position accuracy) of the set position of each element mounting surface becomes a problem, so how to form them with high accuracy Is an issue.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device manufacturing method capable of forming an element mounting surface on which a semiconductor element is mounted at a set position with high accuracy.

  The present invention solves the above-described problems by the solving means described below.

In this method of manufacturing a semiconductor device, a block is fixed to the surface of the eyelet, and a first punch having a first flat pushing surface and a second flat pushing surface orthogonal to each other is pushed in a direction toward the surface of the eyelet. The first flat pushing surface is brought into contact with the upper surface of the block and flatly pushed, and at the same time, the second flat pushing surface is arranged at a setting position where one side surface of the block is formed, and in this state The second punch having a flat pushing surface formed up to a position higher than the upper surface of the block is pushed in a direction toward the second flat pushing surface of the first punch, and the second punch of the first punch is pushed. Sandwiching the block between the two flat pressing surfaces and the flat pressing surface of the second punch, flat pressing one side surface of the block and the other side surface facing the one side surface; The one side is connected to the eyelet Comprising the steps of forming a element mounting surface to the setting position relative the upper surface of said block, when the press plane at the same time by the one and other aspects first punch and the second punch, It is a requirement that a region not flat-pressed is provided at an end portion of the upper surface near the other side surface.

  ADVANTAGE OF THE INVENTION According to this invention, in a semiconductor device provided with semiconductor elements, such as a light emitting element and a light receiving element, it becomes possible to form in high precision the element mounting surface in which the said semiconductor element is mounted in a setting position.

It is the schematic which shows the example of the semiconductor device which concerns on embodiment of this invention. It is the schematic which shows the example of the mounting structure which mounts a semiconductor element in the semiconductor device which concerns on embodiment of this invention. It is the schematic which shows the example of the manufacturing method of the semiconductor device which concerns on embodiment of this invention. It is explanatory drawing for demonstrating the effect of the manufacturing method of the semiconductor device which concerns on embodiment of this invention. It is the schematic which shows the example of the semiconductor device which concerns on the conventional embodiment. It is the schematic which shows the example of the manufacturing method of the semiconductor device which concerns on the conventional embodiment.

  A semiconductor device 1 according to the present embodiment is applied to an optical pickup device used in an optical disk device such as a reproducing device for a recording medium such as a CD and a DVD, and has a light emitting element (laser diode) 11 as its basic configuration. And semiconductor elements such as the light receiving element 12 are mounted in close proximity.

  As shown in FIG. 1, the semiconductor device 1 includes an eyelet 2 processed and molded into a predetermined shape (circular shape in the present embodiment) such as a circle and a rectangle, a block 3 standing on the eyelet 2, and an eyelet 2. And a plurality of leads 4 fixed to each other. As an example, the eyelet 2 is formed using a Fe (iron) -based metal material.

  The eyelet 2 is provided with a plurality of through holes 2a penetrating in the thickness direction thereof, and the plurality of leads 4 are inserted into the respective through holes 2a, and the distal end portion 4a is formed on the surface 2b of the eyelet 2. In a protruding manner, each through hole 2a is sealed and fixed by an insulating material such as a glass material. Note that some of the leads 4 are electrically connected to the eyelet 2 and function as ground terminals. The other lead 4 is provided in a state of being electrically insulated from the eyelet 2.

  The block 3 includes element mounting surfaces (upper surface 3 a and side surface 3 b) on which the semiconductor elements 11 and 12 are mounted, and also functions as a heat sink that dissipates heat generated by the semiconductor elements 11 and 12. The block 3 processed and molded into a predetermined shape (in the present embodiment, a rectangular parallelepiped shape) is fixed on the eyelet 2 by, for example, “brazing”. At that time, it is important to mount the block 3 at a set position on the eyelet 2 with high accuracy. However, the “deviation amount” between the allowable set position and the actual fixed position is on the order of 100 μm or less. (In the in-plane direction of the eyelet 2 surface). The block 3 is formed using a material having higher thermal conductivity than the Fe (iron) -based material that forms the eyelet, such as Cu (copper) or a Cu alloy. Thereby, heat dissipation can be improved.

In the present embodiment, the upper surface 3a and the side surface 3b of the block 3 are formed as element mounting surfaces. More specifically, the light receiving element 12 is mounted at the set position on the upper surface 3a, and the light emitting element 11 such as a laser diode is mounted at the set position on the side surface 3b. Here, FIG. 2 is a top view of the semiconductor device 1 as viewed from above. The light emitting element 11 (the reference point) and the light receiving element 12 (the reference point) are arranged at a predetermined distance from each other and on a straight line (shown here as the reference line A) with high accuracy and without “shift”. This is important for reliably reproducing the information recorded on the recording medium. At this time, the allowable amount of the “deviation amount” between the light emitting element 11 and the light receiving element 12 and the “deviation amount” of the distance from the reference line are both on the order of 30 μm or less (both are eyelets). In the in-plane direction of the two surfaces). The flatness of the upper surface 3a and the side surface 3b serving as the element mounting surfaces is also on the order of 30 [μm] or less.
Here, the “displacement amount of the distance from the reference line” is the reference when the light emitting element 11 and the light receiving element 12 are displaced in the same direction with respect to the reference line A in FIG. This is the larger value of the distance from the line A to the light emitting element 11 (the reference point) and the distance from the reference line A to the light receiving element 12 (the reference point). On the contrary, when the light emitting element 11 and the light receiving element 12 are shifted in the opposite directions with respect to the reference line A, the distance from the reference line A to the light emitting element 11 (the reference point) and the reference line A to the light receiving element. This is the total distance to 12 (reference point).

Next, a method for manufacturing the semiconductor device according to this embodiment will be described.
As described above, the semiconductor device 1 is required to have very high formation accuracy of the element mounting surfaces 3a and 3b on which the semiconductor elements (the light emitting element 11 and the light receiving element 12) are mounted. Conventionally, it has been carried out by either pressing the upper surface 3a and then pressing the side surface 3b, or pressing the side surface 3b and then pressing the upper surface 3a. As a result, after processing the first surface, when processing the second surface, the force to process (deform) the second surface slightly deforms the first surface, making it difficult to perform the required high-precision processing. There has been a problem of being.
On the other hand, the manufacturing method of the semiconductor device according to the present embodiment makes it possible to solve the problem, and the procedure is shown below.

First, an eyelet 2 is prepared in a state in which the lead 4 is inserted through the through hole 2a and fixed. Next, a step of fixing the block 3 to the surface 2b of the eyelet 2 is performed. In this case, the block 3 is fixed at a set position on the eyelet 2 with reference to the reference lines A and B (see FIG. 2) provided on the eyelet 2. As a fixing method, a method such as “brazing” is conceivable. As an example, the reference line A is set parallel to the line connecting the planned mounting positions of the light emitting element 11 (the reference point) and the light receiving element 12 (the reference point), and here the reference line B is the light emitting element 11 ( The reference point) and the light receiving element 12 (the reference point) are set orthogonal to a line connecting the planned mounting positions.
Instead of using the reference lines A and B as a reference, a method using a reference point (not shown) such as a three-point alignment mark as a reference may be employed.

  Next, as shown in FIG. 3A, a step of setting the eyelet 2 to which the block 3 is fixed at a predetermined position of the base 25 of the manufacturing apparatus 20 used in this embodiment is performed.

  Next, as shown in FIG. 3B, the first punch 21 having the first flat pushing surface 21a and the second flat pushing surface 21b orthogonal to each other is pushed in the direction toward the surface 2b of the eyelet 2. The first flat pushing surface 21a is brought into contact with the upper surface 3a of the block 3 and flat pushed, and at the same time, the second flat pushing surface 21b is arranged at a set position where the side surface 3b is formed. In this state, as shown in FIG. 3C, the second punch 22 having the flat pushing surface 22a is pushed in the direction toward the second flat pushing surface 21b of the first punch 21, and the second punch 22 The step of sandwiching the block 3 between the flat pushing surface 22a of the punch 22 and the second flat pushing surface 21b of the first punch 21 to flat-press the side surface 3b and the side surface 3c is performed. The “set position where the side surface 3 b is formed” is set with reference to the reference line A or B provided on the eyelet 2.

  The flat pushing force acting on each surface of the block 3 in the above process will be described. When the second punch 22 is pushed, the first punch 21 is not pushed, but the flat push surface 22 a of the second punch 22 and the second flat push surface of the first punch 21. When the side surface 3c and the side surface 3b are pressed flat with 21b, the sandwiched block 3 is deformed so as to extend upward. As a reaction of the deformation, the first flat pressing surface 21a of the first punch 21 A flat pushing force is also applied to the upper surface 3a. That is, when the second punch 22 is pushed by the flat pushing surface 22a, the upper surface 3a, the side surface 3b and the side surface 3c of the block 3 are simultaneously pushed flat.

  In this way, the upper surface 3a, the side surface 3b, and the side surface 3c of the block 3 can be flattened at the same time, so that the element mounting surface previously formed as in the conventional method in which each is formed in order. However, it is possible to solve the problem of deformation when the next element mounting surface is formed. As a result, it is possible to simultaneously form the upper surface 3a and the side surface 3b serving as the element mounting surfaces with high accuracy. More specifically, the upper surface 3a is formed with high accuracy simultaneously at a predetermined set position with respect to the surface 2b of the eyelet 2 and the side surface 3b with reference to a reference line (here, reference line B) provided on the eyelet 2. It becomes possible. In particular, as compared with the conventional method, both the “deviation amount” of the distance between the light emitting element 11 and the light receiving element 12 and the “deviation amount” of the distance from the reference line have a high accuracy of 30 [μm] or less. It can be formed (both in the in-plane direction of the eyelet 2 surface). Further, the flatness of the upper surface 3a and the side surface 3b serving as the element mounting surfaces can be formed with high accuracy of 30 [μm] or less.

  Here, when the first punch 21 is pushed in the direction toward the surface 2b of the eyelet 2 (see FIG. 3B), the block 3 is fixed so that the first punch 21 does not collide with the block 3. The position of the first punch 21, that is, the position where the eyelet 2 is fixed to the manufacturing apparatus 20 is set in consideration of the variation in the amount of positional deviation.

  Further, when the second punch 22 is pushed in the direction toward the second flat pushing surface 21b of the first punch 21 (see FIG. 3C), the second flat pushing surface 21b of the first punch 21 is obtained. It is preferable to provide a clearance groove 21c that allows the tip of the lead 4 to escape in the lower portion of the first punch 21 so that the surface can contact the entire surface of the side surface 3b of the block 3 and receive a load evenly. .

  Next, as shown in FIG. 3D, a process of mounting the light receiving element 12 and the light emitting element 11 on the element mounting surface formed on the block 3, that is, the upper surface 3a and the side surface 3b, respectively, is performed.

However, in the above method, a case where a new problem occurs is assumed.
Specifically, in the step of connecting each of the semiconductor elements 11 and 12 and the tip portion 4a of the lead 4 disposed on the surface 2b of the eyelet 2 by wire bonding, which is performed as a post-process, the upper surface of the block 3 It is possible that the deformation 3f (hereinafter referred to as “nigue”) 3f of the block 3 that occurs in a state where the flat surface 3a, the side surface 3b, and the side surface 3c are simultaneously pressed may cause a problem. The protrusion amount of the relief 3f is about 0.2 [mm] as an example. More specifically, there is a great demand for miniaturization of the semiconductor device 1, and the eyelet 2 is formed with a necessary minimum area (for example, the diameter of the surface 2 b is 5 [mm] or less). Since the tip portion 4a is arranged close to the minimum necessary distance to the block 3, when the relief 3f is generated in the side surface 3c direction (or the side surface 3d direction or the side surface 3e direction) (FIG. 4 (a)), when wire bonding the semiconductor elements 11 and 12 and the tip portion 4a of the lead 4, the capillary 23 or the wire 24 of the wire bonding apparatus comes into contact with the relief 3f, and the wire bonding failure It can happen.

On the other hand, in this embodiment, when the first flat pushing surface 21a of the first punch 21 is brought into contact with the upper surface 3a of the block 3, the first flat pushing surface is formed at the end of the upper surface 3a near the side surface 3c. An area where 21a is not brought into contact is provided, and the area is not flat pressed (see FIG. 3C). Furthermore, as shown in the figure, the side surface 3c of the block 3 is flat pressed by the flat pressing surface 22a of the second punch 22 formed to a position higher than the upper surface 3a of the block 3.
As a result, as shown in FIG. 4B, the deformation of the block 3 that occurs when the upper surface 3a, the side surface 3b, and the side surface 3c of the block 3 are simultaneously flat pressed, that is, the negative 3f is not flat pressed by the upper surface 3a. It can be generated upward in the region (in the direction away from the upper surface 3a in FIG. 4B). As a result, when the semiconductor elements 11 and 12 and the tip 4a of the lead 4 are wire-bonded, the capillary 23 or the wire 24 described above can be obtained simply by setting the rising amount of the capillary 23 large by the height of the relief 3f. It is possible to avoid an obstacle that comes into contact with the nigue 3f. Thus, it can be said that the problem can be solved without increasing the size of the eyelet 2 in the semiconductor device 1 in which the demand for downsizing is particularly great.

  As described above, according to the method for manufacturing a semiconductor device according to the present invention, in a semiconductor device including semiconductor elements such as a light emitting element and a light receiving element, the element mounting surface on which the semiconductor element is mounted is set with high accuracy. Can be formed. In addition, the problem of capillary or wire collision during wire bonding that can occur at that time can be solved.

  Needless to say, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the present invention. In particular, the light-emitting element (laser diode) and the light-receiving element have been described as examples of the semiconductor element. However, the present invention is not limited to this, and the present invention can be similarly applied even when other semiconductor elements are mounted. Is possible.

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Eyelet 3 Block 3a, 3b Element mounting surface 4 Lead 11 Light emitting element 12 Light receiving element 21 1st punch 22 2nd punch

Claims (3)

Fixing the block on the surface of the eyelet;
A first punch having a first flat pushing surface and a second flat pushing surface orthogonal to each other is pushed in a direction toward the surface of the eyelet so that the first flat pushing surface is brought into contact with the upper surface of the block. The second flat pressing surface is disposed at a set position where one side surface of the block is formed at the same time as the flat pressing, and in this state, the second flat pressing surface has a flat pressing surface formed to a position higher than the upper surface of the block. The second punch is pushed in the direction toward the second flat pushing surface of the first punch, and the block is moved by the second flat pushing surface of the first punch and the flat pushing surface of the second punch. By sandwiching, one side surface of the block and the other side surface facing in the opposite direction to the one side surface are pressed flat, and the upper surface and the one side surface are set as element mounting surfaces at a set position with respect to the eyelet. Forming, and
When the upper surface , one side surface , and the other side surface of the block are simultaneously flat-pressed by the first punch and the second punch, a region not flat-pressed is provided at an end portion of the upper surface near the other side surface. A method for manufacturing a semiconductor device. Fixing a semiconductor element on each of the upper surface and one side surface of the block formed as an element mounting surface;
Manufacturing method of the each semiconductor device, the semiconductor device according to claim 1, characterized in that it comprises the steps of the lead tip portions are connected by wire bonding is disposed on the surface of the eyelet. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the block is formed using copper or a copper alloy.

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