JP5120551B2 - Substrate device and lighting device - Google Patents

Description

  The present invention relates to a substrate device having a substrate formed in multiple layers and an illumination device including the substrate device.

Conventionally, as an illumination device, an LED illumination device having an LED substrate including a plurality of LEDs connected in series to each other and a control substrate including a lighting circuit for lighting the LEDs is known. In such an LED lighting device, for example, when the LED is abnormally operated due to malfunction or failure of a lighting circuit or the like, the circuit is cut off by cutting off the power supply to the LED when a predetermined temperature is reached. A thermal fuse for protection is provided (see, for example, Patent Document 1).
JP 2007-305512 A (page 5-8, FIG. 2)

  Incidentally, in recent years, in order to cope with the thinness of the entire lighting device, an LED substrate in which an LED is mounted and an electronic component constituting a lighting circuit is embedded has been used.

  However, since such an LED substrate is formed by laminating a plurality of layers and appropriately performing temperature treatment or the like, heating is required during the manufacturing process. For this reason, the above-described conventional thermal fuse may be blown by heating during manufacture, and has a problem that it cannot be used for an embedded substrate.

  In addition, although it is possible to use a thermal fuse that sets the rated temperature of the fusible body so that it does not melt at the temperature at the time of manufacture, in this case, even if a circuit abnormality etc. occurs, the thermal fuse becomes difficult to blow, It is not easy to ensure reliability.

The present invention has been made in view of these points, and provides a substrate device capable of reliably blocking a predetermined circuit in the event of an abnormality while corresponding to a configuration in which electronic components are embedded in a multilayer substrate, and an illumination device including the substrate device. For the purpose.

The substrate device according to claim 1 is a multilayer substrate in which a plurality of substrates mainly composed of an insulator are formed in multiple layers ; embedded in an interlayer between the multilayer substrates and disposed on any substrate, and generates heat due to abnormal operation An electronic component; disposed on any substrate of the multilayer substrate and different from the substrate on which the electronic component is disposed, and at least a part of the electronic component is formed facing the electronic component; And a wiring section that is formed and cut off by heat generated during abnormal operation of the electronic component.

The multilayer substrate is, for example, a multilayer substrate mainly composed of an insulating material such as resin or ceramic.

  As the electronic component, for example, a resistor, a capacitor, or a semiconductor component such as a predetermined power element can be used.

  The predetermined circuit is, for example, a lighting circuit for lighting a light source such as an LED, but is not limited thereto.

  The wiring part is formed on the layer by a conductive metal member such as copper foil.

Then, the substrate different from the one of the layers a and a substrate on which electronic components are disposed in the multilayer substrate wiring portion is blocked by the heat generation of the abnormal operation of the electronic component, so that at least a part is opposed to the electronic component By forming, the predetermined circuit formed by the electronic component and the wiring portion is surely cut off while corresponding to the configuration in which the electronic component is embedded in the multilayer substrate.

The claim 2 substrate apparatus, wherein in the substrate according to claim 1, wherein a large coefficient of thermal expansion than the multilayer substrate is disposed embedded in the multilayer substrate, the thermal expansion member wiring portion formed therein It is equipped with.

  Then, by forming the wiring portion inside the thermal expansion member that thermally expands due to heat generated during abnormal operation of the electronic component, the predetermined circuit formed by the electronic component and the wiring portion is more reliably blocked.

The substrate device according to claim 3 is a multilayer substrate in which a plurality of substrates mainly composed of an insulator are formed in multiple layers ; embedded in an interlayer in the multilayer substrate and disposed on any substrate, and generates heat due to abnormal operation electronic components and; high thermal expansion coefficient than the multilayer substrate, and the thermal expansion member disposed embedded in the multilayer substrate; electrically one of the layers of the multilayer board inside of the thermal expansion member through And a wiring part that forms a predetermined circuit together with the electronic component and is blocked by thermal expansion of the thermal expansion member due to heat generation during abnormal operation of the electronic component.

  The wiring portion is, for example, a via hole that electrically connects arbitrary layers, or a through hole that electrically connects all layers.

Then, a wiring portion that electrically connects any one of the layers different from the substrate on which the electronic component of the multilayer board is arranged is disposed inside the thermal expansion member that thermally expands due to heat generated during abnormal operation of the electronic component. By configuring the wiring portion to be blocked by this thermal expansion, a predetermined circuit formed by the electronic component and the wiring portion can be reliably blocked while corresponding to a configuration in which the electronic component is embedded in the multilayer substrate.

According to a fourth aspect of the present invention, there is provided a lighting device comprising: the substrate device according to any one of the first to third aspects; and an LED mounted on a multilayer substrate of the substrate device and controlled to be lit by a predetermined circuit. It is.

Then, by mounting an LED on the multilayer substrate of the substrate device according to any one of claims 1 to 3 and controlling the lighting of the LED by a predetermined circuit, high reliability can be obtained while reducing the overall size.

  The illuminating device according to claim 5 is the illuminating device according to claim 4, wherein the LED is disposed at a position excluding a position facing the wiring portion.

  And by arrange | positioning LED in the position except the position which opposes a wiring part, it is prevented that a wiring part is interrupted | blocked at the wrong timing by the heat_generation | fever from LED.

According to the substrate device of the first aspect , at least one wiring portion that is blocked by heat generated during abnormal operation of the electronic component is provided on any substrate of the multilayer substrate and different from the substrate on which the electronic component is disposed. By forming the portion so as to face the electronic component, it is possible to reliably block a predetermined circuit formed by the electronic component and the wiring portion while corresponding to a configuration in which the electronic component is embedded in the multilayer substrate.

According to the substrate device according to claim 2, in addition to the effect of the substrate device according to claim 1, by forming the wiring portion inside the thermal expansion member that thermally expands due to heat generated during abnormal operation of the electronic component, The predetermined circuit formed by the electronic component and the wiring part can be blocked more reliably.

According to the substrate device of claim 3, the wiring part that electrically connects any one of the layers of the multilayer substrate is disposed inside the thermal expansion member that thermally expands due to heat generated during abnormal operation of the electronic component, By configuring the wiring portion to be blocked by this thermal expansion, it is possible to reliably block a predetermined circuit formed by the electronic component and the wiring portion, while corresponding to a configuration in which the electronic component is embedded in the multilayer substrate.

According to the lighting device of the fourth aspect, the LED is mounted on the multilayer substrate of the board device according to any one of the first to third aspects, and the lighting of the LED is controlled by a predetermined circuit, whereby the whole is downsized. High reliability can be obtained.

  According to the illuminating device of claim 5, in addition to the effect of the illuminating device according to claim 4, by arranging the LED at a position other than the position facing the wiring portion, the wiring portion is caused by heat generated from the LED. It is possible to prevent being blocked at an incorrect timing.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  1 to 5 show a first embodiment, FIG. 1 is an explanatory cross-sectional view of the main part of the substrate device, FIG. 2 is a perspective view of the main part of the substrate device, and FIG. 3 is an illumination device provided with the substrate device. FIG. 4 is a plan view of the substrate device, and FIG. 5 is a side view of the lighting device.

  In FIG. 5, reference numeral 11 denotes a light bulb-shaped LED lamp that is an LED lighting device as a lighting device. The LED lamp 11 includes a light emitting device 12 as a substrate device, a support portion 13 that supports the light emitting device 12, A cover 14 that is a glove that covers the light emitting device 12 and is attached to the support portion 13 is provided.

  As shown in FIGS. 1 to 4, the light emitting device 12 includes a substrate 21 and a plurality of LEDs 22 mounted on the substrate 21.

  The substrate 21 is a multilayer substrate manufactured by the build-up method, and a plurality of, for example, four cores 25, 26, 27, 28, between the cores 25, 26, between the cores 26, 27, and between the cores 27, 28 And epoxy layers 32, 33, and 34, which are insulating layers, respectively. Although not shown, the cores 25 to 28 are formed with a large number of via holes that electrically connect any one of the cores 25 to 28.

  Each of the cores 25 to 28 is a multilayer resin substrate made of an insulating material, and is formed in a circular shape in a plan view, for example. The cores 25, 26, and 28 are formed to have substantially the same thickness, and the core 27 is formed to be thicker than the cores 25, 26, and 28.

  The first core 25 can also be referred to as an LED mounting layer, forms the front surface of the substrate 21, and is a wiring pattern as a wiring section body provided in a predetermined pattern on the surface that is the main surface on the front side. 37. The first core 25 is preferably formed of a white resin in order to obtain the light reflection performance of the LED 22 on the surface.

  The wiring pattern 37 is formed on the surface side of the first core 25 by, for example, copper foil. Further, the wiring pattern 37 is formed in a pattern corresponding to each of the LEDs 22, and these LEDs 22 are mounted on the surface side and are electrically connected to these LEDs 22.

  The second core 26 can also be called a wiring layer, and is insulated from the first core 25 via the first epoxy layer 32. On the main surface on the front side of the second core 26, a wiring pattern 39 as a wiring section body is formed of, for example, copper foil.

  The third core 27 can also be called a circuit mounting layer, and is insulated from the second core 26 through the second epoxy layer 33. Wiring patterns 41 provided in a predetermined pattern are provided on the surface side, and electronic components 42 are mounted on these wiring patterns 41, respectively. Further, a wiring pattern 43 provided in a predetermined pattern is formed on the back side of the third core 27, and the LED 22 is formed by the wiring patterns 41 and 43, the electronic component 42, the wiring patterns 37 and 39, and the like. A lighting circuit 44, which is a predetermined circuit for controlling the lighting, is formed.

  The wiring pattern 41 is formed on the surface side of the third core 27 by using, for example, copper foil.

  The electronic component 42 is, for example, a resistor, a capacitor, or a semiconductor element, and is embedded in the second epoxy layer 33.

  Here, as shown in FIG. 3, the lighting circuit 44 is a bridge diode as a full-wave rectifying element that is the electronic component 42 via the capacitor C that is the electronic component 42 for noise reduction with respect to the commercial AC power source e. As a switching element that is an electronic component 42 in which a collector is connected to the cathode of the LED 22 connected in series and the LED 22 on the low-voltage side, between the output terminals of the rectifying element REC. The NPN transistor Q and a resistor R which is an electronic component 42 which is connected to the emitter of the transistor Q and forms current limiting means together with the transistor Q are sequentially connected. A predetermined bias circuit (not shown) is connected to the base of the transistor Q, and a part of the wiring pattern 39 between the commercial AC power source e and the capacitor C is in the vicinity of the transistor Q. Then, it is formed at a position immediately above.

  That is, in the wiring pattern 39, as shown in FIG. 1 and FIG. 2, a wiring formed in a thin film shape and narrower than other portions at a position immediately above (directly below) the transistor Q that generates heat during abnormal operation. A blocking portion 45, which is a wiring pattern as a portion, is formed. In other words, at least a part of the blocking portion 45 is formed to face the transistor Q in the present embodiment. In other words, the entire blocking portion 45 has a length equal to or smaller than the width dimension of the transistor Q, and is formed at a position closer to the center than the outline of the transistor Q in plan view. And this interruption | blocking part 45 is a safety device for terminating operation | movement of the lighting circuit 44 by cut | disconnecting conduction | electrical_connection by the heat_generation | fever of the transistor Q at the time of abnormal operation. Further, the blocking portion 45 is disposed at a position not facing the LED 22, that is, a position avoiding the LED 22, preferably a position where there is no influence due to heat generated from the LED 22.

  In addition, if the interruption | blocking part 45 is a part which terminates the lighting circuit 44 by interrupting | blocking, not only the wiring pattern 39 but the position of the vicinity of the electronic components 42 which generate | occur | produce heat | fever at the time of abnormal operation, such as the wiring patterns 37 and 41 It may be provided in a plurality of places. Further, the position where the blocking portion 45 is formed is defined by at least a portion facing the transistor Q, that is, a position intersecting with a surface extending the outer shape of the transistor Q in the vertical direction or the horizontal direction, or these surfaces. It only needs to be within the area.

  The fourth core 28 forms the back surface of the substrate 21, is insulated from the third core 27 through the third epoxy layer 34, and is covered with a heat conductive layer 47 formed of copper foil or the like. ing. The heat conducting layer 47 guides heat generated from various electronic components 42 to a heat radiating unit (not shown).

  The LED 22 includes a blue LED chip that emits blue light, for example, and a resin portion that covers the blue LED chip. And in this resin part, the fluorescent substance which mainly radiates | emits the yellow light which is a blue complementary color excited by a part of blue light which a blue LED chip | tip emits is mixed, and each LED22 is white-type illumination light. It is configured to obtain.

  Further, as shown in FIG. 4, the support portion 13 is configured by connecting a base 53 via an insulating member 52 to a heat radiating member 51 that radiates heat generated from the LED 22 or the like.

  The heat dissipating member 51 is formed of a member having excellent thermal conductivity such as aluminum. Further, an insertion hole for inserting a wiring (not shown) for electrically connecting the lighting circuit 44 side and the base 53 side is provided inside the heat radiating member 51.

  The base 53 is electrically connected to a commercial AC power source e (FIG. 3) by being screwed into a socket (not shown).

  The cover 14 has translucency and is fixed by being screwed to the heat radiating member 51.

  Next, the operation of the first embodiment will be described.

  The LED lamp 11 is supplied with power from a commercial AC power source e with the base 53 screwed into a socket or the like, rectified by the rectifier element REC, applied with a voltage to the LED 22, the transistor Q is turned on, and the voltage is in the order of the LED 22. A predetermined current flows through the LED 22 in a state where the directional voltage is exceeded, and the LED 22 lights up.

  Here, when the lighting circuit 44 operates abnormally, for example, when the LED 22 is short-circuited, an excessive current exceeding the rating flows in the transistor Q, and the transistor Q abnormally generates heat.

  Then, due to the abnormal heat generation of the transistor Q, the cores 25 to 28 and the epoxy layers 32 to 34 of the substrate 21 are thermally expanded so as to be peeled off in the thickness direction of the substrate 21, etc., thereby blocking the blocking portion 45 of the wiring pattern 39. Then, the lighting circuit 44 is stopped.

  As described above, in the present embodiment, the blocking part 45 that is blocked by heat generated during the abnormal operation of the transistor Q of the electronic component 42 is formed at least partially facing the transistor Q in the core 26 in the substrate 21. The configuration.

  Therefore, the lighting circuit 44 formed by the electronic component 42 (transistor Q) and the blocking portion 45 can be surely cut off while corresponding to the embedded configuration in which the electronic component 42 is buried in the substrate 21. However, it is possible to prevent the abnormal heat generation from continuing to have an undesirable effect on each part of the LED lamp 11.

  In addition, the shut-off unit 45 is an element constituting the lighting circuit 44, and can be easily configured to shut off the circuit by temperature only by being arranged in the vicinity of the transistor Q, and it is necessary to separately provide a shut-off means such as a thermal fuse. Therefore, it is possible to reduce the size and cost.

  Furthermore, by disposing the LED 22 at a position other than the position facing the blocking unit 45, the influence of heat generated from the LED 22 on the blocking unit 45 is suppressed. For example, the blocking unit 45 is generated by heat generated from the LED 22 during normal operation. Can be prevented from being cut off at the wrong timing.

  Then, the LED 22 is mounted on the substrate 21 of the light emitting device 12, and the lighting of the LED 22 is controlled by the lighting circuit 44 including the electronic component 42 and the blocking unit 45. High reliability can be obtained.

  Next, FIG. 6 and FIG. 7 show a second embodiment, FIG. 6 is an explanatory cross-sectional view of the main part of the substrate device, and FIG. 7 is a perspective view of the main part of the substrate device. In addition, about the structure and effect | action similar to the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the second embodiment, in the first embodiment, the blocking portion 45 of the wiring pattern 39 has a larger thermal expansion coefficient than the cores 25 to 28 and the epoxy layers 32 to 34 of the substrate 21. It is formed in the thermal expansion member 55 embedded in.

  That is, the thermal expansion member 55 is formed in a substantially rectangular parallelepiped shape, and is formed, for example, directly above (directly below) the transistor Q, that is, at a position facing the transistor Q. In addition, the thermal expansion member 55 is formed to have a width dimension substantially equal to that of the transistor Q, for example, and at least a part of the blocking part 45 is located at a position facing the transistor Q.

  When the lighting circuit 44 operates abnormally, for example, when the LED 22 is short-circuited or the resistor R is broken, an excessive current exceeding the rating flows to the transistor Q, the transistor Q abnormally generates heat, and the thermal expansion member 55 is relatively larger than the cores 25 to 28 and epoxy layers 32 to 34 of the substrate 21 in the thickness direction of the substrate 21 and the like, so that the blocking portion of the wiring pattern 39 located inside the thermal expansion member 55 45 is shut off and the lighting circuit 44 is stopped.

  In this way, the blocking portion 45 of the wiring pattern 39 formed on the core 26 of the substrate 21 is disposed inside the thermal expansion member 55 that thermally expands due to heat generated during the abnormal operation of the transistor Q, and is blocked by this thermal expansion. By configuring so that the part 45 is blocked, the lighting circuit 44 formed by the electronic component 42 and the wiring pattern 39 can be reliably blocked while corresponding to the embedded configuration in which the electronic component 42 is embedded in the substrate 21. In addition, it is possible to prevent the electronic component 42 and the like from continuing to generate abnormal heat and to have an unfavorable influence on each part of the LED lamp 11, and to achieve the same operational effects as the first embodiment.

  In addition, by disposing the blocking portion 45 in the thermal expansion member 55 having a larger thermal expansion coefficient than that of the substrate 21, it is possible to more reliably block the blocking portion 45 due to abnormal heat generation of the transistor Q.

  Next, FIG. 8 and FIG. 9 show a third embodiment, FIG. 8 is an explanatory cross-sectional view of the main part of the substrate device, and FIG. 9 is a perspective view of the main part of the substrate device. In addition, about the structure and effect | action similar to said each embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the third embodiment, in the first embodiment, a via hole 58 as a wiring portion that connects the wiring pattern 39 and the wiring pattern 41 is in the vicinity of the transistor Q in which the electronic component 42 is located, for example, on the side, That is, it is formed in a substantially cylindrical shape at a position facing the transistor Q.

  The via hole 58 is formed of a conductive member such as a copper foil so as to penetrate the core 26 and the core 27 in the thickness direction, and has a larger thermal expansion coefficient than the cores 25 to 28 and the epoxy layers 32 to 34 of the substrate 21. It is formed in a thermal expansion member 59 embedded in the substrate 21. Accordingly, at least a part of the via hole 58 faces the side of the transistor Q.

  When the lighting circuit 44 operates abnormally, for example, when the LED 22 is short-circuited, an excessive current exceeding the rated value flows in the transistor Q, the transistor Q abnormally generates heat, and the thermal expansion member 59 becomes the core 25 to 25 of the substrate 21. The thermal expansion is relatively larger in the thickness direction of the substrate 21 than 28 and the epoxy layers 32 to 34, etc., whereby the via hole 58 located inside the thermal expansion member 55 is blocked and the lighting circuit 44 is stopped.

  In this manner, the via hole 58 that electrically connects the cores 26 and 27 of the substrate 21 is disposed inside the thermal expansion member 59 that thermally expands due to heat generated during the abnormal operation of the transistor Q, and the via hole is formed by this thermal expansion. By configuring so that 58 cuts off, it is possible to reliably cut off the lighting circuit 44 formed by the electronic component 42, the via hole 58, and the like while corresponding to the embedded configuration in which the electronic component 42 is buried in the substrate 21.

  In addition, by disposing the via hole 58 in the thermal expansion member 59 having a larger thermal expansion coefficient than that of the substrate 21, it becomes possible to more reliably block the via hole 58 due to abnormal heat generation of the transistor Q.

  In each of the above embodiments, each wiring portion is provided at an arbitrary facing position as well as immediately above and immediately below the electronic component as long as it is a position that is blocked by the heat of the electronic component that generates heat during abnormal operation of the circuit. It is possible.

  Further, the blocking portion 45, the via hole 58, and the like may be arranged at a position facing the LED 22 when the influence of heat from the LED 22 is small.

  Furthermore, the electronic component that generates heat during an abnormal operation may be other than the transistor Q.

  The substrate device is the light emitting device 12 including the lighting circuit 44 that controls the lighting of the LEDs 22. However, any substrate device can be used as long as it is an embedded substrate device that forms a predetermined circuit. .

It is explanatory sectional drawing of the principal part of the board | substrate apparatus which shows the 1st Embodiment of this invention. It is a perspective view of the principal part of a substrate apparatus same as the above. It is a circuit diagram of the illuminating device provided with the board | substrate apparatus same as the above. It is a top view of a substrate apparatus same as the above. It is a side view of an illuminating device same as the above. It is explanatory drawing sectional drawing of the principal part of the board | substrate apparatus which shows the 2nd Embodiment of this invention. It is a perspective view of the principal part of a substrate apparatus same as the above. It is explanatory sectional drawing of the principal part of the board | substrate apparatus which shows the 3rd Embodiment of this invention. It is a perspective view of the principal part of a substrate apparatus same as the above.

Explanation of symbols

11 LED lamps as lighting devices
12 Light-emitting device as a substrate device
Substrate that is 21 multilayer substrate
22 LED
Core that is 25-28 substrates
44 Lighting circuit as a predetermined circuit
45 Blocking section as wiring section
55, 59 Thermal expansion member
58 Via hole as wiring part Q Transistor as electronic component

Claims (5)

A multilayer substrate having a plurality of substrates mainly composed of insulating material in a multilayer;
An electronic component that is embedded between layers in the multilayer substrate and disposed on any substrate and generates heat due to abnormal operation;
Arranged on any layer of the multilayer substrate and different from the substrate on which the electronic component is disposed, at least part of the electronic component is formed facing the electronic component, and a predetermined circuit is formed with the electronic component. Wiring parts that are blocked by heat generated during abnormal operation of the parts;
A substrate apparatus comprising: High thermal expansion coefficient than the multilayer substrate, this is arranged embedded in a multilayer substrate, a substrate device according to claim 1, wherein the wiring portion is characterized in that it comprises a thermal expansion member formed therein. A multilayer substrate having a plurality of substrates mainly composed of insulating material in a multilayer;
An electronic component that is embedded between layers in the multilayer substrate and disposed on any substrate and generates heat due to abnormal operation;
High thermal expansion coefficient than the multilayer substrate, and the thermal expansion member disposed embedded in the multilayer substrate;
Through the inside of the thermal expansion member, one of the layers of the multilayer board is electrically connected to form a predetermined circuit together with the electronic component, and the heat of the thermal expansion member due to heat generation during abnormal operation of the electronic component A wiring section that is blocked by expansion;
A substrate apparatus comprising: A substrate apparatus according to any one of claims 1 to 3;
An LED mounted on a multilayer substrate of the substrate device and controlled to be lit by a predetermined circuit;
An illumination device comprising: LED is arrange | positioned in the position except the position which opposes a wiring part. The illuminating device of Claim 4 characterized by the above-mentioned.

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