JP5123672B2 - Power supply panel and joining method thereof - Google Patents

Description

  The present invention relates to a joining method for joining a plurality of power supply panels for supplying power to each other, and a power supply panel joined by this method.

  Conventionally, various supply structures for supplying electric power and communication signals to various spaces such as ordinary houses and offices have been proposed. In general, a cable is laid from the switchboard under the floor or inside the wall, and the end of the cable is drawn out in the vicinity of the room. Then, power and communication signals are supplied by connecting a power connector and a signal terminal to the end, and connecting an electric device to the power connector and the signal terminal. However, with the recent diversification of electrical equipment centering on OA equipment, there is an increasing need to use power and communication signals at various positions in the space. A supply structure is desired.

  As one form of such a supply structure with a high degree of freedom, a structure using a so-called flat cable has been proposed. This flat cable is constituted by covering a plurality of a pair of flat wire conductors in a line. This flat cable is thinner than a general cable, and its presence can be almost eliminated by laying this flat cable on the floor and covering it with carpet etc. The degree of freedom can be increased.

  Patent Document 1 discloses a power wiring structure using a plate-like conductor. This structure is configured in layers by sandwiching a third conductor with an insulating film interposed between a first conductor and a second conductor. The first to third conductors are each formed in a narrow plate shape, and by using such a structure, a flat power supply structure can be constructed.

  However, such a conventional power and communication signal supply structure can increase the degree of freedom of the laying path by flattening, but still uses one of the narrow conductors. Power and communication signals could only be supplied to the area of the part. For example, when there is a possibility of using power and communication signals in a large number of positions in a wide room, when using a flat cable or the power wiring structure of Patent Document 1, a large number of these must be laid. It was lacking in practicality, such as requiring a lot of labor for laying and connecting. Further, in the power supply structure as in Patent Document 1, since the conductor is exposed on the surface side and may touch the user, ensuring the safety of the user, which is the most basic goal in the power supply structure, There was a risk of obstruction.

  In view of such a point, the inventors of the present application have proposed a novel power supply panel (for example, Patent Document 2, although not disclosed at the time of filing this application). The power supply panel is configured by arranging a plurality of conductive plates and insulating layers provided between the plurality of conductive plates so as to overlap each other. By arranging a plurality of such power supply panels in parallel, it is possible to construct a power supply environment and a communication environment in a wide range, and to ensure safety by making the conductive plate exposed to the user side a GND pole. Can do.

JP 2003-151367 A Japanese Patent Application No. 2007-126982

  When the power supply panel proposed in Patent Document 2 is laid on the installation surface, a single power supply panel is formed with a standard size like a fold, and the number of power supply panels according to the area of the installation surface It is reasonable to install the two in parallel. Thus, when arranging a plurality of power supply panels in parallel, it is necessary to secure a power transmission path and a communication path by joining the plurality of power supply panels to each other. No effective method has been proposed for this joining method.

  In particular, from the viewpoint of installation workability, it is preferable to connect a plurality of power supply panels to each other after a plurality of power supply panels are arranged side by side, but each power supply panel has a plurality of power supply panels. Conductive plates are provided, and it is difficult to join these conductive plates after arranging them side by side.

  The present invention has been made in order to solve the above-described problems of the prior art, and a method for joining a power supply panel, which can easily and quickly join a plurality of power supply panels after arranging them side by side, and this method An object of the present invention is to provide a power supply panel that is joined at the same time.

  In order to solve the above-described problems and achieve the object, the present invention according to claim 1 is a power supply comprising a plurality of conductive plates and an insulating layer provided between the plurality of conductive plates. A plurality of panels arranged side by side on the same installation surface, and a bonding method for joining the plurality of power supply panels to each other at adjacent panel ends, wherein the plurality of power supply panels are installed A side-by-side step of juxtaposing on the surface, and before or after the side-by-side step, the installation surface of the first conductive plate facing the installation surface is connected to the power supply panel with respect to the power supply panel. The conductive plate other than the first conductive plate and the end of the insulating layer on the bonding side with respect to the bonding side end of the first conductive plate so as to be exposed to the working space portion located on the opposite side of the first conductive plate The panels adjacent to each other by retreating the part After the forming step of forming a joining space between the parts, the parallel arrangement step, and the forming step, the first conductive plates at the panel end portions adjacent to each other are connected to the working space side. After the first joining step, and after the first joining step, the conductive plates other than the first conductive plate, the panel ends of the plurality of power supply panels A second joining step in which the conductive plates adjacent to each other in the part are joined to each other from the working space part side through a conductive connecting means.

  According to a second aspect of the present invention, in the first aspect of the present invention according to the first aspect, in the second bonding step, the surface of the first conductive plate bonded in the first bonding step on the working space side. After the insulating connecting means interposed between the insulating layers adjacent to each other at the panel end is arranged from the working space side, the conductive connecting means is provided on the surface of the insulating connecting means on the working space side. The connecting means is arranged.

  According to a third aspect of the present invention, in the present invention according to the second aspect of the present invention, in the forming step, the joining space is widened from the first conductive plate to the working space. In the second bonding step, the insulative connecting means having a width corresponding to the bonding space is inserted between the insulating layers with the narrower width at the top.

  According to a fourth aspect of the present invention, in the present invention according to the second or third aspect, in the second joining step, the insulating connecting means and the insulating connecting means formed integrally with each other are replaced with the insulating property. It is characterized by being inserted between the insulating layers or the conductive plates with the connecting means as the head.

  According to a fifth aspect of the present invention, in the present invention according to any one of the first to fourth aspects, in the first joining step or the second joining step, a conductive plate for joining as the conductive connecting means is provided. In addition, between the conductive plates to be joined, they are arranged in abutment with these conductive plates, and a rotating body is connected to the joint between the conductive plates and the conductive plate for joining from the working space side. These conductive plates and the bonding conductive plate are friction stir welded to each other by pressing them together.

  According to a sixth aspect of the present invention, in the present invention according to any one of the first to fourth aspects, in the first joining step or the second joining step, a conductive plate for joining as the conductive connecting means. The conductive plate for joining with an insert material attached to one surface thereof is so as to straddle the conductive plate to be joined from the working space side, and the surface on the side with the insert material is concerned By disposing the rotating body in contact with the conductive plate and pressing the rotating body against the insert material from the working space side, the insert material is diffused to the conductive plate by frictional heat between the rotating body and the bonding conductive plate. The conductive plates are joined together.

  The present invention according to claim 7 is the metal plate as the conductive connection means in the first bonding step or the second bonding step according to any one of the first to fourth aspects of the present invention. The protrusion is provided so that a metal plate having a plurality of hollow protrusions having openings on the surface on the working space side is straddled from the working space side between the conductive plates to be joined. Are arranged so that the projections are inserted into the through holes formed in the conductive plate, and a rotating body is pressed against the inner surface of the side of the projection from the working space side. Then, by expanding the side of the projection, the planar shape of the projection is expanded more than the planar shape of the through hole, and the conductive plates are joined to each other.

  The present invention according to claim 8 is characterized by being joined by the joining method of the power supply panel according to any one of claims 1 to 7.

  According to the first aspect of the present invention, since the joining work can be performed from the work space side, it is not necessary to perform the work on the power supply panel from the installation surface side, and the joining is performed after the power supply panels are arranged in parallel. Work can be done. Therefore, even when power supply panels are laid in a wide area, only a large number of power supply panels are laid out continuously first, and then joining is performed from above the power supply panels. Work can be performed easily and quickly.

  According to the second aspect of the present invention, by disposing the insulating connecting means interposed between the insulating layers, and disposing the conductive connecting means on the surface of the insulating connecting means on the working space side, Insulating connecting means and conductive connecting means can be stacked and stacked one after another, and the same structure as the power supply panel other than the joint can be constructed at the joint, and the continuity and insulation of the joint can be secured. The junction can be used as a part of the power supply path or the communication path.

  According to the third aspect of the present invention, the insulating connecting means formed with a width corresponding to the joining space is inserted between the insulating layers with the narrower width at the top, so that the insulating connecting means is The work of inserting into the joining space becomes extremely easy, and the workability of joining can be improved.

  According to the fourth aspect of the present invention, the insulative connecting means and the insulative connecting means formed integrally with each other are inserted between the insulating layers or the conductive plates, so that the insulative connecting means and the insulative properties are inserted. Compared with the case where the connecting means are individually arranged, the insertion work becomes easier and the workability of joining can be improved.

  According to the fifth aspect of the present invention, since the joint portion is joined by friction stir welding, the metal structure of the joint portion can be strongly processed, and excellent mechanical properties can be obtained. In addition, since a smooth joint surface without unevenness can be obtained, impedance mismatch caused by the joint portion can be reduced even when the conductive plate is used as a communication path.

  According to the sixth aspect of the present invention, since the joining portion is joined by thermally diffusing the insert material, it is possible to perform the joining while blocking oxygen, so that the oxide film becomes an obstacle like aluminum. Even when the conductive plate is formed of a material that is difficult to weld, it can be easily joined.

  According to the seventh aspect of the present invention, since the joint portion is joined by expanding the protrusion of the metal plate, the conductive plate can be reliably secured even when the conductive plate is not suitable for joining by plastic flow or thermal diffusion. Can be joined.

  According to the eighth aspect of the present invention, it is possible to obtain a power supply panel joined by various methods as described above. In particular, the power supply panel joined in the present invention according to claim 5 has excellent mechanical characteristics and a smooth joined surface free from irregularities.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, [I] the basic concept common to each embodiment was explained, then [II] the specific contents of each embodiment were explained, and [III] finally, a modification to each embodiment was explained. To do. However, the present invention is not limited by these embodiments.

[I] Basic concept common to the embodiments First, the basic concept common to the embodiments will be described. The power supply panel joining method according to each embodiment joins a plurality of power supply panels installed to provide power and a communication environment in an arbitrary space such as a general house or office. This space is not limited to being indoors but may be outdoor, and is not limited to buildings, but includes internal spaces of vehicles such as trains and airplanes. Hereinafter, a three-dimensional space that is a supply target of power or a communication signal is referred to as a “power supply target space portion”, and a plane for supplying power or a communication signal among each plane that partitions this power supply target space portion. The “power supply target plane” is referred to as a “power supply communication non-target plane”. The power supply target plane is, for example, the entire area of the floor that divides the power supply target space, or a part of these areas (for example, the central area excluding only the four peripheral edges of the floor).

  In general, the power supply panel is integrally configured by arranging a plurality of conductive plates and insulating layers provided between the plurality of conductive plates so as to overlap each other. Here, the conductive plate may be formed as a wide panel body in addition to the conventional narrow conductor, and covers a wide area. Thus, power supply and communication can be easily performed on a wide range of power supply target planes. In particular, the power supply target plane is covered by arranging a plurality of power supply panels in parallel, instead of covering all of the power supply target planes with a single power supply panel. Although this power supply panel can be formed in an arbitrary planar shape, an example of a rectangular shape will be described below. In addition, it is also possible to exclude the communication function from the power supply panel and perform only power supply.

  In such a configuration, one of the basic features of each embodiment is that after the power supply panel is arranged side by side on the installation surface, the joining work can be performed from the work space side. The installation surface is an arbitrary support structure that supports the power supply panel, for example, a floor surface. The work space is a space located on the opposite side of the installation surface with the power supply panel interposed therebetween, and overlaps with the power supply target space described above. Thus, in order to enable joining work from the work space side, conceptually, the conductive plates facing the installation surface are first bonded together, and the other conductive plates or insulating layers are close to the installation surface. Join sequentially from one side. Accordingly, it is not necessary to perform a joining operation from the installation surface. Therefore, the joining operation can be performed after arranging the power supply panel on the installation surface, and the joining operation can be performed easily and quickly. In addition, as a specific method for joining the conductive plates, any method other than the method shown in the following embodiments can be adopted, and any known method can be used as long as the conductive plates can be connected to each other in a conductive manner. Can be adopted. Here, “conductable” means that the conductive plates joined to each other can be energized. The conductive plate has the same conductivity as the single conductive plate. Even if the conductivity is inferior to the conductivity, the conductivity in the range that does not hinder the power supply and communication is included.

[II] Specific Contents of Each Embodiment Next, specific contents of the power supply panel joining method according to each embodiment will be described.

[Embodiment 1]
First, the first embodiment will be described. This form is a form in which the conductive plates are joined by friction stir welding.

(Configuration of power supply panel)
FIG. 1 is a perspective view of a living room to which a power supply communication system is applied, FIG. 2 is a plan view of the main part of FIG. 1, and FIG. 3 is a vertical sectional view of the main part of FIG. As shown in each of these drawings, the power supply communication system is configured by arranging a plurality of power supply panels 10 whose longitudinal sections are the same as each other on the upper surface of the floor portion 2 in the living room 1 that is a power supply target space portion. ing.

  The floor portion 2 is a support body that supports the power supply panel 10 and is configured as, for example, a reinforced concrete floor slab, and is a planar structure having an upper surface that is a smooth horizontal surface. An insulating sheet 3 is laid on substantially the entire upper surface of the floor 2, and the insulating sheet 3 insulates the floor 2 and the power supply panel 10 from each other. The upper surface of the insulating sheet 3 corresponds to the installation surface in the claims. Further, a finishing material 4 such as a floor tile or a tile carpet is laid on the upper surface of the power supply panel 10 to cover the power supply panel 10 so as not to be exposed directly to the living room 1. Of the planar rectangular floor portion 2 configured in this way, in the first embodiment, as shown in FIG. 2, only a part of the area where a floor configuration panel 7 to be described later is arranged is not fed and communicated. The plane is the target plane, and the other portions are planes to be fed.

  In the power supply target plane, a plurality of power supply panels 10 are arranged side by side to form a flat floor surface continuous with the upper surface, and an arbitrary communication device (for example, a computer or a robot) is arranged on the floor surface. be able to. Each power supply panel 10 is laid on the upper surface of the insulating sheet 3, and is joined to another adjacent power supply panel 10 by a joining method described later. On the other hand, the floor 2 may be simply exposed in the non-target plane for power supply communication, but here, as shown in FIGS. 1 and 2, a floor configuration panel 7 having substantially the same thickness as the power supply panel 10 is arranged. By doing so, the upper surfaces of the power supply panel 10 and the floor constituting panel 7 are made substantially flush with each other to constitute a flat floor surface. The floor constituting panel 7 is a plate-like body formed of, for example, resin or wood.

  Next, the configuration of each power supply panel 10 will be described. As shown in FIG. 2 (showing a state where the upper surface of the power supply panel 10 is exposed), the power supply panel 10 is formed in a planar rectangular shape. As shown in FIG. 3, the power supply panel 10 includes a plurality (here, two) of conductive plates 11 and 12 and an insulating layer 13 provided between the plurality of conductive plates 11 and 12. Are arranged so as to overlap each other. The conductive plate 11 and the conductive plate 12 are fixed to each other by an arbitrary fixing method such as adhesion, and a single power supply panel 10 is configured as a whole.

  Each of the conductive plates 11 and 12 is a plate-like body formed from a conductor such as metal. Specific materials and thicknesses of the conductive plates 11 and 12 can be determined in consideration of desired strength, supplied power, and the like.

  The insulating layer 13 functions as a waveguide for propagating communication signals while preventing the short-circuit between the conductive plates 11 and 12 by insulating each other. The insulating layer 13 is formed in substantially the same planar shape as the conductive plates 11 and 12, and is provided in almost the entire area between the conductive plates 11 and 12. The specific material and thickness of the insulating layer 13 can be determined in consideration of desired insulating properties and waveguide properties. For example, a resin such as polyethylene or vinyl chloride, an inorganic material such as mica or glass fiber, Alternatively, porcelain can be used. However, in the first embodiment, it is necessary that the insulating layer is not damaged by the heat of friction stir welding described later, and that a reaction force that can resist pressure contact of the rotating body 20 described later is required. Therefore, it is made of a material that satisfies such conditions.

  In the power supply panel 10 thus configured, as shown in FIG. 3, the conductive plates 11 and 12 are connected to the DC power supply 8 so that at least one of the conductive plates 11 and 12 is a ground electrode. Connected. For example, in the case of a structure in which the power supply panel 10 is supported by the floor 2, the conductive plate 12 on the side close to the floor 2 is the anode, and the conductive plate 11 on the side facing the anode is the ground electrode. Specifically, a DC power supply 8 is provided at an arbitrary position, the anode of the DC power supply 8 is connected to the conductive plate 12 of any one power supply panel 10, and the ground electrode of the DC power supply 8 is connected to the power supply panel. The electric power is supplied to the other electric power supply panels 10 through the connection structure of the electric power supply panels 10. Further, in order to form a closed circuit, the conductive plate 11 and the conductive plate 12 of any one of the power supply panels 10 are connected to each other by an arbitrary method (not shown). By constructing a power supply path using the conductive plates 11 and 12 as ground electrodes in this way, even when a person contacts the conductive plate 11 directly or indirectly through another conductor, Since energization can be prevented, human safety can be ensured.

  Next, a configuration common to the communication function and the power supply function will be described. As shown in FIG. 3, connection terminals 9 are arranged on the power supply panel 10. The connection terminal 9 is formed by concentrically combining a cylindrical external electrode 9a and a rod-shaped internal electrode 9b. The internal electrode 9b is an electrode on the anode side, and is formed to have a length that penetrates the conductive plate 11 and the insulating layer 13 on the ground electrode side and reaches the conductive plate 12 on the anode side. The external electrode 9a is an electrode on the ground electrode side, is formed shorter than the internal electrode 9b, and penetrates the conductive plate 11 together with the internal electrode 9b. In such a configuration, the external electrode 9a is brought into contact with the conductive plate 11 of the ground electrode by inserting the connection terminal 9 from above at an arbitrary position (in the vicinity of the communication device or the like) where communication is desired in the power supply panel 10. The internal electrode 9 b can be brought into contact with the anode conductive plate 12. The power acquisition connection line and the communication connection line are connected to the external electrode 9a and the internal electrode 9b, and the power acquisition connection line and the communication connection line are connected to a power load and a communication device. Power can be supplied to the load, and communication signals can be input to and output from the communication device.

(Method of joining power supply panels)
Next, a method for joining the power supply panel 10 configured as described above will be described. FIG. 4 is a longitudinal sectional view for sequentially explaining the joining method in time series. First, as shown to Fig.4 (a), the several power supply panel 10 is arranged in parallel on an installation surface (corresponding to the parallel arrangement process in a claim). This juxtaposition is performed such that the panel ends of the adjacent power supply panels 10 are abutted. Here, the space portion located on the opposite side of the installation surface with the power supply panel 10 interposed therebetween is the work space portion 5.

  Next, only the conductive plate 12 (corresponding to the first conductive plate in the claims) facing the installation surface is left with respect to the panel end of the power supply panel 10, and the insulating layer 13 and the conductive plate 11 are cut. Then, the joining space 6 is formed by removing them. This cutting is performed over the entire length of the panel end of the power supply panel 10. Here, the conductive plate 11 and the insulating layer 13 are connected to the end of the conductive plate 12 by retreating the end of the conductive plate 12 and the insulating layer 13 so that the conductive plate 12 is exposed to the work space 5. The joint space 6 is formed (in this embodiment, “retreat” means that each power supply panel 10 reaches a direction away from the other power supply panel 10 adjacent to the power supply panel 10. To do). In this state, only the conductive plates 12 of the power supply panel 10 are arranged so as to be in contact with each other (hereinafter, the boundary portion of the conductive plates 12 thus contacted is referred to as “joining portion 14”). In particular, by forming the joining space 6 so as to become wider from the conductive plate 12 to the work space 5, that is, by setting the width W 1> the width W 2, insertion of a connecting member 15 described later is inserted. Can be performed more easily. In addition, you may perform formation of the joining space 6 before a parallel installation process. For example, when the power supply panel 10 is manufactured in a factory, the bonding space 6 is formed by manufacturing the power supply panel 10 using the insulating layer 13 or the conductive plate 11 narrower than the conductive plate 12. Also good.

  Thereafter, the conductive plates 12 adjacent to each other are joined to each other from the work space portion 5 side (corresponding to the first joining step in the claims). As a method for joining the conductive plate 12 from the working space 5 side in this way, for example, Friction Stir Welding (FSW) can be used. FIG. 5 is a longitudinal sectional view showing the friction stir welding, and FIG. 6 is a perspective view showing the friction stir welding. In the friction stir welding, the rotating body 20 is pressed into contact with the joint portion 14, and the material (here, the conductive plate 12) constituting the joint portion 14 is stirred by the frictional heat between the rotating body 20 and the joint portion 14 ( This is a method of joining by plastic fluidization. Specifically, the rotating body 20 is pressed against the upper surface of the joint portion 14 from the work space portion 5 side, and pressure is applied to the joint portion 14 while rotating the rotor 20 at a predetermined speed. A protrusion 21 is provided at the tip of the rotating body 20, and only the protrusion 21 is press-fitted into the joint 14. The protrusion 21 thus press-fitted causes the joint 14 to be plastically fluidized with frictional heat and stirred, and the joint 14 is joined. While performing this joining, the joining part 14 can be joined over the entire length by horizontally moving the rotating body 20 along the joining part 14 at a constant speed.

  Next, the insulating layer 13 and the conductive plate 11 are joined from the working space 5 side (corresponding to the second joining step in the claims). For this reason, as shown in FIG.4 (c), the member 15 for a connection is inserted in the joining space 6 from the working space part 5 side. The connecting member 15 is formed by integrating the connecting insulating layer 15 a and the connecting conductive plate 15 b with each other, and has a length and a width corresponding to the joining space 6. The connecting insulating layer 15a is for connecting the insulating layers 13 adjacent to each other at the panel end of the power supply panel 10, and corresponds to the insulating connecting means in the claims. The connecting conductive plate 15b is for connecting the conductive plates 11 adjacent to each other at the panel end of the power supply panel 10, and corresponds to the conductive connecting means in the claims. In particular, as described above, the joining space 6 is formed so as to increase in width from the conductive plate 12 to the work space portion 5, and is connected to the connecting insulating layer 15 a in a shape corresponding to the joining space 6. When the connecting member 15 is inserted into the joining space 6 with the connecting insulating layer 15a at the top, the narrow portion of the connecting insulating layer 15a is changed to the wide portion of the joining space 6. Insertion is extremely easy.

  After inserting the connecting member 15, as shown in FIG. 4 (d), two joint portions 16 of the conductive plate 11 and the connecting conductive plate 15 b are friction stir welded over the entire length, Adjacent conductive plates 11 can be connected to each other via a connecting conductive plate 15b. This completes all the joining operations, and the joining of the power supply panel 10 is completed as shown in FIG.

(Effect of Embodiment 1)
As described above, according to the first embodiment, since all the joining operations can be performed from the work space portion 5 side, it is not necessary to perform work on the power supply panel 10 via the installation surface side, and the power supply panel 10 The joining work can be performed after the parallel arrangement. Therefore, even when the power supply panel 10 is laid in a wide area, only a large number of power supply panels 10 are laid continuously first, and then a joining operation is performed from above the power supply panel 10. Thus, the joining operation can be performed easily and quickly.

  In addition, since the joining space 6 is formed so as to be widened from the conductive plate 12 to the working space portion 5, the work of inserting the connecting member 15 into the joining space 6 is extremely easy.

  Further, since the connecting member 15 is configured by integrating the connecting insulating layer 15a and the connecting conductive plate 15b with each other, compared to the case where the connecting insulating layer 15a and the connecting conductive plate 15b are individually arranged. Thus, the work becomes easier.

  Furthermore, various advantages can be obtained by employing friction stir welding. That is, since this friction stir welding is a solid phase bonding method in which the bonded portions 14 and 16 are bonded to each other while not being dissolved, the metal structure of the bonded portions 14 and 16 can be strongly processed and is excellent. Mechanical properties can be obtained. In addition, since a smooth joint surface without unevenness can be obtained, impedance mismatch caused by the joint portions 14 and 16 can be reduced even when the conductive plates 11 and 12 are used as communication paths. it can.

[Embodiment 2]
Next, a second embodiment will be described. This form is a form relating to a joining method in the case where the insulating layer is made of a material having no heat resistance or a required reaction force. The configuration of the second embodiment is substantially the same as the configuration of the first embodiment except where otherwise specified, and the same configuration as that of the first embodiment is used in the first embodiment. The same reference numerals and / or names are attached as necessary, and the description thereof is omitted.

(Method of joining power supply panels)
In the second embodiment, the insulating layer 13 is made of a material that does not have heat resistance or a required reaction force (for example, a foamable resin). In this case, as shown in FIG. 4D of the first embodiment, when the conductive plate 11 is friction stir welded above the insulating layer 13, the frictional heat generated by the friction stir welding is transmitted through the conductive plate 11 to the insulating layer. 13 and the pressure of the rotator 20 is transmitted to the insulating layer 13 via the conductive plate 11, which may cause an undesirable state such as damage to the insulating layer 13. In order to avoid this, in the second embodiment, bonding is performed by the method shown in FIG.

  First, as shown to Fig.7 (a), the several power supply panel 10 is arranged in parallel on an installation surface (corresponding to the parallel arrangement process in a claim). Next, the conductive plate 12 facing the installation surface is left with respect to the panel end portion of the power supply panel 10, and the insulating layer 13 and the conductive plate 11 are cut and removed to form the joining space 6 </ b> A. Here, by cutting the insulating layer 13 so as to recede from the panel end of the conductive plate 11, a bonding space 6 </ b> B is also formed between the conductive plates 11 and 12. Thereafter, as shown in FIG. 7B, the joint portion 14 of the conductive plate 12 is joined by friction stir welding.

  Next, as shown in FIG. 7C, the connecting member 17 is inserted into the joining spaces 6A and 6B from the working space 5 side. The connecting member 17 includes connecting insulating layers 17a and 17b and a connecting conductive plate 17c, and has a length and a width corresponding to the joining spaces 6A and 6B. In particular, the connecting insulating layers 17 a and 17 b are formed of a material that can have an insulating property, heat resistance, and a reaction force that can resist the pressure contact of the rotating body 20. The connecting insulating layers 17a and 17b are divided into a connecting insulating layer 17a inserted into the joining space 6A and a connecting insulating layer 17b inserted into the joining space 6B between the conductive plates 11 and 12. First, the connecting insulating layer 17b can be arranged, and then the connecting insulating layer 17a can be arranged together with the connecting conductive plate 17c. The connecting insulating layer 17b is formed to be slightly wider than the portion of the conductive plate 11 protruding from the end of the insulating layer 13, and when inserted into the joining space 6B, the connecting insulating layer 17b is formed on the upper surface of the connecting insulating layer 17b. The end of the conductive plate 11 is placed, and a reaction force against the pressure contact of the rotating body 20 can be exhibited.

  After the insertion of the connecting member 17, as shown in FIG. 7D, the adjacent conductive plates 11 are joined by friction stir welding of the two joint portions 16 of the conductive plate 11 and the connecting conductive plate 17c. They can be connected to each other via the connecting conductive plate 17c. Under the present circumstances, since the connection insulating layer 17b which has heat resistance and reaction force is arrange | positioned under the junction part 16, friction stir welding can be performed, without producing problems, such as damage by friction heat. . This completes all joining operations, and the joining of the power supply panel 10 is completed as shown in FIG.

(Effect of Embodiment 2)
As described above, according to the second embodiment, even when the insulating layer 13 is made of a material that does not have heat resistance or a required reaction force, it is possible to perform the joining using the friction stir welding. become.

[Embodiment 3]
Next, Embodiment 3 will be described. This form is a form relating to a joining method of a power supply panel configured by arranging another conductive plate between a pair of upper and lower conductive plates. The configuration of the third embodiment is substantially the same as the configuration of the second embodiment unless otherwise specified, and the configuration that is substantially the same as the configuration of the second embodiment is as necessary. The same reference numerals and / or names as those used in Embodiment 2 are attached, and the description thereof is omitted.

(Configuration of power supply panel)
FIG. 8 is a longitudinal sectional view of a main part of the power supply structure according to the third embodiment. As shown in FIG. 8, the power supply structure is configured by arranging a plurality of power supply panels 30 in parallel on the upper surface of the floor 2 and the insulating sheet 3 configured in the same manner as in the first embodiment.

  Each power supply panel 30 includes a plurality (three in this case) of conductive plates 31, 32, 33 arranged in parallel with an interval between them, and insulation disposed between the conductive plates 31, 32, 33. The layers 34 and 35 are provided. In this configuration, by connecting the DC power supply 8 and the load 100 as shown, the upper and lower conductive plates 31 and 32 can be used as a ground electrode, and the central conductive plate 33 can be used as an anode, and the anode is exposed to the outside. It is possible to construct a safer power supply structure. In the third embodiment, as in the second embodiment, the insulating layers 34 and 35 are made of a material that does not have heat resistance or required reaction force.

(Method of joining power supply panels)
9 and 10 are longitudinal sectional views for sequentially explaining the joining method in time series. First, as shown to Fig.9 (a), the several power supply panel 30 is arranged in parallel on an installation surface (corresponding to the parallel arrangement process in a claim). Next, the conductive plate 32 facing the installation surface is left with respect to the panel end of the power supply panel 30, and the other insulating layers 34 and 35 and the conductive plates 31 and 33 are removed by cutting, thereby joining space 6A. , 6B. Here, the insulating layer 35 is cut so as to recede from the end of the conductive plate 33, and the insulating layer 34 is cut so as to recede from the end of the conductive plate 31. The joint spaces 6A and 6B are also formed between the conductive plates 31 and 33. Thereafter, as shown in FIG. 9B, the joint portion 14 of the conductive plate 32 is joined by friction stir welding.

  Next, as shown in FIG. 9 (c), the connecting member 17 is inserted into the joining spaces 6A and 6B from the working space 5 side, and as shown in FIG. 9 (d), the conductive plate 33 and the connecting conductive plate. The adjacent conductive plates 33 are connected to each other via the connecting conductive plate 17c by friction stir welding the two joint portions 16 with the 17c. Under the present circumstances, since the connection insulating layer 17b which has heat resistance and reaction force is arrange | positioned under the junction part 16, friction stir welding can be performed, without producing problems, such as damage by friction heat. .

  Thereafter, as shown in FIG. 10A, the connecting member 18 is inserted into the joining spaces 6A and 6B from the working space 5 side. The connecting member 18 is configured by integrally connecting the connecting insulating layers 18a and 18b and the connecting conductive plate 18c to each other. The connecting member 6A is formed by cutting the conductive plate 31 and the insulating layer 34. It has a length and width corresponding to 6B. Other points regarding the connecting member 18 are the same as those of the connecting member 17. Then, as shown in FIG. 10B, the adjacent conductive plates 31 are connected via the connecting conductive plates 18c by friction stir welding of the two joint portions 16 of the conductive plates 31 and the connecting conductive plates 18c. Connected to each other. Also at this time, since the connecting insulating layer 18b having heat resistance and reaction force is disposed below the joint portion 16, friction stir welding is performed without causing problems such as damage due to frictional heat. Can do. This completes all the joining operations, and the joining of the power supply panel 30 is completed as shown in FIG.

(Effect of Embodiment 3)
As described above, according to the third embodiment, when the multi-layered power supply panel 30 using the three conductive plates 31, 32, and 33 is joined, the insulating layers 34 and 35 have heat resistance and required resistance. Even when it is made of a material having no force, it is possible to perform the joining using the friction stir welding.

[Embodiment 4]
Next, a fourth embodiment will be described. This form is a form which performs joining using the conductive plate for joining and an insert material. The configuration of the fourth embodiment is substantially the same as the configuration of the third embodiment unless otherwise specified, and the configuration substantially the same as the configuration of the third embodiment is the same as that of the third embodiment. The same reference numerals and / or names as those used in Embodiment 3 are attached, and the description thereof is omitted.

(Method of joining power supply panels)
11 and 12 are longitudinal sectional views showing a joining method according to the fourth embodiment. In the fourth embodiment, as shown in FIG. 11A, the power supply panel 30 is juxtaposed and the joining spaces 6A and 6B are formed in the same manner as in the third embodiment. As shown in FIG. 6, the conductive plate 32 is joined to the rotating body 20 using the joining conductive plate 22 and the insert material 23. The bonding conductive plate 22 and the insert material 23 have shapes corresponding to the length and width of the bonding portion 14, and the bonding conductive plate 22 is oriented so that the insert material 23 contacts the bonding portion 14. And after arrange | positioning the insert material 23, this joining part 14 can be joined by horizontally moving along the joining part 14, rotating the rotary body 20. FIG.

  FIG. 13 is an enlarged view of the periphery of the joint in FIG. As shown in FIG. 13A, an insert material 23 is attached in advance to one surface (here, the bottom surface) of the bonding conductive plate 22. The bonding conductive plate 22 is a relay member for connecting the conductive plates 32 so as to be conductive with each other, and is formed of the same material as the conductive plate 32, for example. The insert material 23 is bonded to the conductive plate 32 and the bonding conductive plate 22 by thermal diffusion, and is formed of a low melting point metal (for example, an aluminum alloy). The rotating body 20 generates frictional heat on the bonding conductive plate 22 and is different from the first embodiment in that the protrusions are omitted. By rotating the rotating body 20 while being pressed against the bonding conductive plate 22, frictional heat between the rotating body 20 and the bonding conductive plate 22 is transmitted to the insert material 23 through the bonding conductive plate 22. As shown in FIG. 13B, the insert material 23 is thermally diffused to the conductive plate 32 and the bonding conductive plate 22. Since this joining method can perform joining while blocking oxygen, it is suitable when the conductive plate 32 is formed of a material that is difficult to weld due to an oxide film that becomes an obstacle, such as aluminum. Thereafter, as shown in FIG. 11C to FIG. 12B sequentially, the insertion of the connecting member 18 and the joining using the joining conductive plate 22 and the insert material 23 are repeated, so that FIG. As shown, the joining of the power supply panel 30 is completed.

(Effect of Embodiment 4)
As described above, according to the fourth embodiment, in addition to the effects of the third embodiment, since oxygen can be cut off and bonding can be performed, a material that is difficult to weld due to an oxide film being an obstacle, such as aluminum. Even when a conductive plate is formed by the above method, bonding can be easily performed.

[Embodiment 5]
Next, a fifth embodiment will be described. This form is a form which performs joining using a conductive tape. The configuration of the fifth embodiment is substantially the same as the configuration of the third embodiment unless otherwise specified. About the same configuration as the configuration of the third embodiment, the configuration of this embodiment is as necessary. The same reference numerals and / or names as those used in Embodiment 3 are attached, and the description thereof is omitted.

(Method of joining power supply panels)
14 and 15 are longitudinal sectional views showing a bonding method according to the fifth embodiment. In the fifth embodiment, as shown in FIG. 14A, the power supply panel 30 is juxtaposed and the joining spaces 6A and 6B are formed. In this embodiment, since frictional heat does not occur at the time of joining, there is no need to retract the insulating layer 35 from the end of the conductive plate 33 or the insulating layer 34 from the end of the conductive plate 31. Joint spaces 6A and 6B similar to those in the first embodiment are formed.

  Next, as shown in FIG. 14B, the joining portion 14 is joined by attaching the conductive tape 24 to the joining portion 14 of the conductive plate 32 from the working space portion 5 side. The conductive tape 24 has a width that extends over both of the adjacent conductive plates 32 and has a length corresponding to the entire length of the joint portion 14, and corresponds to the connecting member in the claims. The conductive tape 24 is formed, for example, by applying a conductive pressure-sensitive adhesive on both surfaces of a conductive fiber. Thereafter, as shown in FIG. 14C to FIG. 15B, the insertion of the connecting member 15 and the joining using the conductive tape 24 are repeated, as shown in FIG. The joining of the power supply panel 30 is completed.

(Effect of Embodiment 5)
As described above, according to the fifth embodiment, since frictional heat is not generated at the time of joining, there is no need to take a heat-resistant measure for the insulating layers 34 and 35 as in the third embodiment. Since it is not necessary to use a simple mechanical device, the joining work can be performed more easily.

[Embodiment 6]
Next, a sixth embodiment will be described. This form is a form which concerns on the modification of the joining method of conductive plates, and the joining method of a conductive plate and a conductive plate for connection. The configuration of the sixth embodiment is substantially the same as the configuration of the fifth embodiment unless otherwise specified, and the configuration that is substantially the same as the configuration of the fifth embodiment is as necessary. The same reference numerals and / or names as those used in Embodiment 5 are assigned, and description thereof is omitted.

  As a method of joining the conductive plates arranged so as to face the installation surface and a method of joining the conductive plate and the connecting conductive plate, in addition to the methods shown in the first to fifth embodiments, the following It is possible to use the joining method which concerns on each modification like. In addition, although demonstrated below as a method of joining electrically conductive plates, it is applicable similarly also to joining of a conductive plate and a conductive plate for connection.

(First modification)
First, a first modification will be described. 16 and 17 are diagrams showing a joining method according to a first modification, FIG. 16 is a plan view of the conductive plate, and FIG. 17 is a perspective view of the conductive plate sequentially showing the joining method. As shown in FIG. 16, the conductive plate 12 has a plurality of through holes 12 a arranged along the joint. These through holes 12a may be formed before or after the power supply panels are arranged side by side. Next, as shown in FIG. 17A, the fixing pin 25 is inserted into the pair of through-holes 12a facing each other across the joint portion 14 from the working space portion 5 side. The fixing pin 25 is formed of a conductive metal and is formed in a substantially U shape on the side surface.

  And as shown in FIG.17 (b), by attaching the electroconductive tape 24 so that the fixing pin 25 and the junction part 14 may be covered, the fall of the fixing pin 25 is prevented and the electroconductivity of the junction part 14 is improved. . This completes the joining operation. In addition, when the conduction between the conductive plates 12 can be ensured through either one of the fixing pin 25 and the conductive tape 24, either one may be non-conductive. Note that after the fixing pin 25 is inserted, the joint portion 14 may be friction stir welded. In this case, the fixing pin 25 is made to function as a temporary fixing member of the conductive plate 12 and then the required frictional stir welding is performed. Bonding strength can be obtained. In addition, when the fixing pin 25 is formed of a shape memory alloy and heated, the fixing pin 25 is deformed in the same manner as in FIG. Can also be secured. In the first modification, the conductive tape 24 and the fixing pin 25 correspond to the connecting member in the claims.

(Second modification)
Next, a second modification will be described. FIG. 18 is a longitudinal sectional view showing a joining method according to a second modification. After the formation of the through hole 12a and the insertion of the fixing pin 25 in the same manner as the first modification described above, the fixing pin 25 is heated from the working space 5 side. The fixing pin 25 is formed of a shape memory alloy and, when heated, is deformed as shown in FIG. 20 to hold the conductive plate 12 from the back side. The heating means is arbitrary, but for example, heating by burner heating, energization heating, electromagnetic heating, or friction stir welding can be employed. In the second modification, the fixing pin 25 corresponds to the connecting member in the claims.

(Third Modification)
Finally, a third modification will be described. FIGS. 19 to 21 are views showing a joining method according to a third modification, FIG. 19 is a plan view of a conductive plate, FIG. 20 is a perspective view of a superplastic alloy sheet, and FIG. 21 is an enlarged view of a joining portion. (A) is a main part longitudinal cross-sectional view before bonding, (b) is a main part plan view before bonding, (c) is a main part vertical cross-sectional view after bonding, and (d) is a main part after bonding. It is a top view. As shown in FIG. 19, the conductive plate 12 has a plurality of through holes 12 b arranged along the joint 14. These through holes 12b may be formed either before or after the power supply panel 30 is arranged. The through hole 12b is formed in a substantially rectangular shape corresponding to the protrusion 42 of the superplastic alloy sheet 40 shown in FIG. The superplastic alloy sheet 40 is formed by forming a plurality of protrusions 42 that protrude in one direction (downward here) with respect to a flat plate-like main body 41. Each of the plurality of protrusions 42 is formed in a substantially rectangular shape in a plane, and is arranged in parallel in two rows at substantially equal intervals. The superplastic alloy sheet 40 is a superplastic material (a material that can be deformed to a large strain region without causing plastic instability), and is formed of a conductive material.

  The superplastic alloy sheet 40 configured in this way is arranged at the joint 14 from the working space 5 side, the protrusion 42 is inserted into the through hole 12b, and the protrusion 42 is on the installation surface side of the conductive plate 12. To place. Then, as shown in FIG. 21A, a rotating body 43 is arranged from the working space 5 side with respect to each protrusion 42, and the rotating body 43 is rotated. The tip 43a of the rotating body 43 is formed in a square shape corresponding to the inner shape of the protrusion 42 as shown in FIG. Therefore, by rotating the rotating body 43, as shown in FIGS. 21 (c) and 21 (d), the four corners of the tip portion 43a are pressed against the side of the projection to be plastically deformed at a constant strain rate, This side can be expanded outward in the horizontal direction. In the expanded state, the planar shape of the projection 42 is larger than the planar shape of the through hole 12b, and the projection 42 cannot be removed from the through hole 12b, so that the superplastic alloy sheet 40 is in close contact with the joint portion 14. The conductive plates 12 can be joined together. In the third modification, the superplastic alloy sheet 40 corresponds to the connecting member and the metal plate in the claims.

  In the joining method using the superplastic alloy sheet 40, the conductive plates 12 can be temporarily fixed to each other via the superplastic alloy sheet 40 at the time when the superplastic alloy sheet 40 is disposed, and the superplastic alloy sheet 40 itself. In addition, since the conductive plate 12 can be temporarily fixed, even when the force of the rotating body 43 is applied, the bonding state of the conductive plates 12 can be maintained, and stable and reliable bonding can be performed. The metal plate used for this joining is not limited to the superplastic alloy sheet 40, and any metallic plate state that has both malleability and rigidity and can be diffusion joined can be used. For example, an aluminum plate or a copper plate May be used. In particular, the metal plate itself is preferably thermally diffused with respect to the conductive plate 12 by the rotating body 43. For this purpose, it is preferable to form the metal plate with the same material as the conductive plate 12. Actually, it may be difficult to align the through hole 12b and the protrusion 42 with each other. For this reason, for example, only the formation of the through hole 12b for the conductive plate 12 is performed at the factory, and the position and shape of the through hole 12b of the conductive plate 12 before and after the conductive plate 12 is laid on the construction site are subjected to image processing or the like. The protrusion 42 that recognizes and matches this position and shape may be molded at the construction site.

(Effect of Embodiment 6)
As described above, according to the sixth embodiment, it is possible to perform bonding by various methods, and it is possible to perform various bonding according to the implementation environment.

[III] Modifications to Each Embodiment While the embodiments of the present invention have been described above, the specific configuration and means of the present invention are within the scope of the technical idea of each invention described in the claims. It can be arbitrarily modified and improved within. Hereinafter, such a modification will be described.

(About problems to be solved and effects of the invention)
The problems to be solved by the invention and the effects of the invention are not limited to the above-described contents, and the present invention solves the problems not described above or produces the effects not described above. In addition, only a part of the described problems may be solved or only a part of the described effects may be achieved.

(Combination of each embodiment)
The configurations shown in the embodiments can be combined with each other. For example, among the plurality of conductive plates 31, 32, and 33 of the power supply panel 30, the connection between the conductive plates 31 is the same as that in the first embodiment. The conductive stir welding is performed, and the conductive plates 32 and the conductive plates 33 can be bonded to each other with the conductive tape 24 according to the fifth embodiment.

  The present invention is useful for a power supply structure that supplies power to a wide range of power supply targets, and is useful for simply and quickly joining a plurality of power supply panels arranged side by side.

It is a perspective view of the living room to which the electric power feeding communication system which concerns on Embodiment 1 of this invention is applied. It is a principal part top view of FIG. It is a principal part longitudinal cross-sectional view of FIG. It is a longitudinal cross-sectional view for demonstrating sequentially the joining method which concerns on Embodiment 1 along a time series. It is a longitudinal cross-sectional view which shows friction stir welding. It is a perspective view which shows friction stir welding. It is a longitudinal cross-sectional view for demonstrating sequentially the joining method which concerns on Embodiment 2 along a time series. FIG. 6 is a longitudinal sectional view of main parts of a power supply structure according to a third embodiment. It is a longitudinal cross-sectional view for demonstrating sequentially the joining method which concerns on Embodiment 3 along a time series. FIG. 10 is a view subsequent to FIG. 9 and is a longitudinal sectional view for sequentially explaining the joining method according to the third embodiment in time series. FIG. 10 is a longitudinal sectional view showing a joining method according to a fourth embodiment. FIG. 12 is a longitudinal sectional view illustrating the joining method according to the fourth embodiment, following FIG. 11. FIG. 12 is an enlarged view of the vicinity of the joint in FIG. FIG. 10 is a longitudinal sectional view showing a joining method according to a fifth embodiment. FIG. 15 is a view subsequent to FIG. 14 and a longitudinal sectional view showing a bonding method according to the fifth embodiment. It is a top view of a conductive plate. It is a perspective view of the electroconductive board which shows a joining method sequentially. It is a longitudinal cross-sectional view which shows the joining method which concerns on a 2nd modification. It is a top view of a conductive plate. It is a perspective view of a superplastic alloy sheet. It is an enlarged view of a junction part, (a) is a principal part longitudinal cross-sectional view before joining, (b) is a principal part top view before joining, (c) is a principal part longitudinal cross-sectional view after joining, (d) is It is a principal part top view after joining.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Living room 2 Floor part 3 Insulation sheet 4 Finishing material 5 Work space part 6, 6A, 6B Joining space 7 Floor structure panel 8 DC power supply 9 Connection terminal 9a External electrode 9b Internal electrode 10, 30 Power supply panel 11, 12, 31, 32, 33 Conductive plate 12a, 12b Through-hole 13, 34, 35 Insulating layer 14, 16 Joining portion 15, 17, 18 Connecting member 15a, 17a, 17b, 18a, 18b Connecting insulating layer 15b, 17c, 18c For connecting Conductive plate 20, 43 Rotating body 21, 42 Protruding portion 22 Joining conductive plate 23 Insert material 24 Conductive tape 25 Fixing pin 40 Superplastic alloy sheet 41 Main body 43a Tip portion

Claims (8)

A plurality of power supply panels configured to include a plurality of conductive plates and an insulating layer provided between the plurality of conductive plates are arranged side by side on the same installation surface, and the plurality of power supply panels are mutually connected. A joining method for joining together at adjacent panel ends,
A parallel arrangement step of arranging the plurality of power supply panels side by side on the installation surface;
Before or after the side-by-side arrangement step, the end of the first conductive plate facing the installation surface is exposed to a working space located on the opposite side of the installation surface with respect to the power supply panel. So that the conductive plate other than the first conductive plate and the end portion on the bonding side of the insulating layer are retreated with respect to the end portion on the bonding side of the first conductive plate. Forming a bonding space between the panel end portions;
A first joining step of joining the first conductive plates of the panel end portions adjacent to each other in the joining space from the working space side after the parallel placement step and the forming step. When,
After the first joining step, the conductive plates other than the first conductive plate, wherein the conductive plates adjacent to each other at the panel end portions of the plurality of power supply panels are connected to each other by a conductive connecting means. A second joining step for joining together from the work space side through
A method for joining power supply panels, comprising: In the second joining step,
Insulating connection means interposed between the insulating layers adjacent to each other at the panel end portion on the surface of the first conductive plate joined in the first joining step on the work space portion side surface. After placing from the department side,
Arranging the conductive connection means on the surface of the insulating connection means on the side of the working space,
The method for joining power supply panels according to claim 1. In the forming step, the joining space is formed so as to be widened from the first conductive plate to the working space portion,
In the second bonding step, the insulating connecting means formed with a width corresponding to the bonding space is inserted between the insulating layers with a narrower width as a head,
The method for joining power supply panels according to claim 2. In the second joining step, the insulating connecting means and the insulating connecting means formed integrally with each other are inserted between the insulating layers or the conductive plates with the insulating connecting means as a head,
The method for joining power supply panels according to claim 2, wherein: In the first joining step or the second joining step,
The conductive plates for bonding as the conductive connection means are arranged in abutment with the conductive plates between the conductive plates to be bonded,
By friction-welding the conductive plates and the conductive plates for bonding to each other by pressing the rotating body from the working space side to the joints between the conductive plates and the conductive plates for bonding,
The method for joining power supply panels according to any one of claims 1 to 4, wherein: In the first joining step or the second joining step,
A conductive plate for bonding as the conductive connecting means, wherein a conductive plate for bonding having an insert material attached to one surface thereof is straddled between the conductive plates to be bonded from the working space side. And the surface on which the insert material is attached is arranged so as to be in contact with the conductive plate,
By pressing the rotating body against the insert material from the working space side, the insert material is diffused into the conductive plates by frictional heat between the rotating body and the conductive plate for bonding, and the conductive plates are bonded to each other. To do,
The method for joining power supply panels according to any one of claims 1 to 4, wherein: In the first joining step or the second joining step,
A metal plate as the conductive connecting means, the metal plate having a plurality of hollow projections having openings on the surface on the working space side, the work between the conductive plates to be joined It is arranged so that the protrusion is inserted into the through hole formed in the conductive plate so as to straddle from the space portion side, and is a through hole having substantially the same planar shape as the protrusion,
By expanding the side of the projection by pressing the rotating body from the working space side to the inner surface of the side of the projection, the planar shape of the projection is larger than the planar shape of the through hole. Joining conductive plates together,
The method for joining power supply panels according to any one of claims 1 to 4, wherein: It was joined by the joining method of the power supply panel according to any one of claims 1 to 7,
Power supply panel characterized by

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