JP5130082B2 - Composition for imprint molding and molded product using the same - Google Patents
Composition for imprint molding and molded product using the same Download PDFInfo
- Publication number
- JP5130082B2 JP5130082B2 JP2008052561A JP2008052561A JP5130082B2 JP 5130082 B2 JP5130082 B2 JP 5130082B2 JP 2008052561 A JP2008052561 A JP 2008052561A JP 2008052561 A JP2008052561 A JP 2008052561A JP 5130082 B2 JP5130082 B2 JP 5130082B2
- Authority
- JP
- Japan
- Prior art keywords
- meth
- acrylate
- group
- imprint molding
- acrylate monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 45
- 238000000465 moulding Methods 0.000 title claims description 45
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 99
- 239000000178 monomer Substances 0.000 claims description 50
- 125000000217 alkyl group Chemical group 0.000 claims description 33
- 229920001296 polysiloxane Polymers 0.000 claims description 25
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 24
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 19
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 13
- 125000004432 carbon atom Chemical group C* 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- 230000009257 reactivity Effects 0.000 claims 1
- -1 acryloyloxy group Chemical group 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 229920005862 polyol Polymers 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 239000006082 mold release agent Substances 0.000 description 5
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
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- 239000010959 steel Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
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- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- OZDCBKYPNBVRSA-UHFFFAOYSA-N (4,4-dimethoxycyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical compound C1=CC(OC)(OC)CC=C1C(=O)C1=CC=CC=C1 OZDCBKYPNBVRSA-UHFFFAOYSA-N 0.000 description 1
- KFJJYOKMAAQFHC-UHFFFAOYSA-N (4-methoxy-5,5-dimethylcyclohexa-1,3-dien-1-yl)-phenylmethanone Chemical compound C1C(C)(C)C(OC)=CC=C1C(=O)C1=CC=CC=C1 KFJJYOKMAAQFHC-UHFFFAOYSA-N 0.000 description 1
- QERNPKXJOBLNFM-UHFFFAOYSA-N 1,1,2,2,3,3,4,4-octafluoropentane Chemical compound CC(F)(F)C(F)(F)C(F)(F)C(F)F QERNPKXJOBLNFM-UHFFFAOYSA-N 0.000 description 1
- BWZAUXRKSMJLMH-UHFFFAOYSA-N 1,1-diethoxyethylbenzene Chemical compound CCOC(C)(OCC)C1=CC=CC=C1 BWZAUXRKSMJLMH-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- VHJHZYSXJKREEE-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropyl prop-2-enoate Chemical compound FC(F)C(F)(F)COC(=O)C=C VHJHZYSXJKREEE-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- YDIYEOMDOWUDTJ-UHFFFAOYSA-N 4-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=C(C(O)=O)C=C1 YDIYEOMDOWUDTJ-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
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- 125000004122 cyclic group Chemical group 0.000 description 1
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- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 229910052719 titanium Inorganic materials 0.000 description 1
- JUYONNFUNDDKBE-UHFFFAOYSA-J tri(oct-2-enoyloxy)stannyl oct-2-enoate Chemical compound [Sn+4].CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O.CCCCCC=CC([O-])=O JUYONNFUNDDKBE-UHFFFAOYSA-J 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- Macromonomer-Based Addition Polymer (AREA)
Description
本発明は、インプリント成形用組成物及びそれを用いた成形物に関し、特には、硬化後にモールドから脱型し易く、モールドへの離型剤の塗布回数を低減することが可能なインプリント成形用組成物及びそれを用いた成形物に関するものである。 The present invention relates to a composition for imprint molding and a molded article using the same, and in particular, imprint molding that can be easily removed from a mold after curing and can reduce the number of times a release agent is applied to the mold. The present invention relates to a composition for use and a molded product using the same.
昨今、微細なパターンを低コストで形成する技術としてインプリント成形技術が精力的に研究されている。該インプリント成形技術は、基材上に配置した樹脂材料層に所望の凹凸を有するモールドを押し当てることで所望のパターンを基材上に形成する技術である。そして、該インプリント成形技術においては、熱可塑性樹脂や熱硬化性樹脂を用い、熱でパターンを形成する方法と、紫外線硬化型の樹脂を用い、紫外線照射でパターンを形成する方法が知られている。 Recently, an imprint molding technique has been vigorously studied as a technique for forming a fine pattern at a low cost. The imprint molding technique is a technique for forming a desired pattern on a substrate by pressing a mold having desired irregularities on a resin material layer disposed on the substrate. In the imprint molding technique, a method of forming a pattern by heat using a thermoplastic resin or a thermosetting resin and a method of forming a pattern by ultraviolet irradiation using an ultraviolet curable resin are known. Yes.
熱可塑性樹脂や熱硬化性樹脂を用いた場合は、加熱及び加圧に大量のエネルギーを消費せざるを得ず、また、成形時間が長くなって、生産性が低下する問題がある。一方、紫外線硬化型樹脂を用いたインプリント成形においては、成形物のモールドからの脱型を容易にするために、フッ素系の離型剤をモールドに塗布するが、通常の紫外線硬化型樹脂は、モールドに離型剤を塗布してインプリント成形を行っても、数回脱型を行うと離型剤がモールドから取り除かれ、離型剤の効果が失われ、成形物と基材との界面で剥離が生じる問題がある。 When a thermoplastic resin or a thermosetting resin is used, a large amount of energy must be consumed for heating and pressing, and there is a problem that the molding time becomes long and the productivity is lowered. On the other hand, in imprint molding using an ultraviolet curable resin, a fluorine-based mold release agent is applied to the mold in order to facilitate removal of the molded product from the mold. Even if the mold release agent is applied to the mold and imprint molding is performed, if the mold release is performed several times, the mold release agent is removed from the mold, and the effect of the mold release agent is lost. There is a problem that peeling occurs at the interface.
そこで、本発明の目的は、硬化後にモールドから脱型し易く、モールドへの離型剤の塗布回数を低減することが可能なインプリント成形用組成物を提供することにある。 Accordingly, an object of the present invention is to provide an imprint molding composition that can be easily removed from a mold after curing and can reduce the number of times a release agent is applied to the mold.
本発明者は、上記目的を達成するために鋭意検討した結果、特定の(メタ)アクリレートオリゴマーと、疎水性の長鎖アルキル基を有する特定の(メタ)アクリレートモノマー又は(メタ)アクリロイル基を有する反応性シリコーンとを含む組成物が、硬化後にモールドから脱型し易く、モールドへの離型剤の塗布回数を低減できることを見出し、本発明を完成させるに至った。 As a result of intensive studies to achieve the above object, the present inventor has a specific (meth) acrylate oligomer and a specific (meth) acrylate monomer or a (meth) acryloyl group having a hydrophobic long-chain alkyl group. It has been found that a composition containing a reactive silicone can be easily removed from a mold after curing, and the number of times of application of a release agent to the mold can be reduced, and the present invention has been completed.
即ち、本発明のインプリント成形用組成物は、
・ウレタン(メタ)アクリレートオリゴマー及びエポキシ(メタ)アクリレートオリゴマーからなる群から選択される少なくとも一種の(メタ)アクリレートオリゴマー(A)と、
・ヒドロキシル基含有(メタ)アクリレートモノマーと、
・下記一般式(I):
・光重合開始剤(C)と
を含むことを特徴とする。
That is, the imprint molding composition of the present invention is
-At least one (meth) acrylate oligomer (A) selected from the group consisting of urethane (meth) acrylate oligomers and epoxy (meth) acrylate oligomers;
A hydroxyl group-containing (meth) acrylate monomer,
-The following general formula (I):
-A photoinitiator (C) is included, It is characterized by the above-mentioned.
本発明のインプリント成形用組成物の好適例においては、前記アルキル基含有(メタ)アクリレートモノマー(B1)の含有量が組成物全体の5〜20質量%である。 In the suitable example of the imprint molding composition of this invention, content of the said alkyl group containing (meth) acrylate monomer (B1) is 5-20 mass% of the whole composition.
本発明のインプリント成形用組成物の他の好適例においては、前記(メタ)アクリロイル基含有反応性シリコーン(B2)の添加量が、前記(メタ)アクリレートオリゴマー(A)と前記アルキル基含有(メタ)アクリレートモノマー(B1)及び前記(メタ)アクリロイル基含有反応性シリコーン(B2)以外の(メタ)アクリレートモノマーとの合計100質量部に対して4〜20質量部である。 In another preferred embodiment of the imprint molding composition of the present invention, the amount of the (meth) acryloyl group-containing reactive silicone (B2) is such that the (meth) acrylate oligomer (A) and the alkyl group-containing ( It is 4-20 mass parts with respect to 100 mass parts in total with (meth) acrylate monomers other than (meth) acrylate monomer (B1) and the said (meth) acryloyl group containing reactive silicone (B2).
また、本発明の成形物は、上記のインプリント成形用組成物を紫外線照射により硬化させてなる。 The molded product of the present invention is obtained by curing the above-mentioned imprint molding composition by ultraviolet irradiation.
本発明によれば、特定の(メタ)アクリレートオリゴマーと、ヒドロキシル基含有(メタ)アクリレートモノマーと、疎水性の長鎖アルキル基を有する特定の(メタ)アクリレートモノマー又は(メタ)アクリロイル基を有する反応性シリコーンとを含み、エネルギー消費量が小さく、成形時間が短く、硬化後にモールドから脱型し易く、モールドへの離型剤の塗布回数を低減することが可能なインプリント成形用組成物を提供することができる。 According to the present invention, a specific (meth) acrylate oligomer, a hydroxyl group-containing (meth) acrylate monomer, a specific (meth) acrylate monomer having a hydrophobic long-chain alkyl group or a reaction having a (meth) acryloyl group Provides a composition for imprint molding, which contains low-consumption silicone, has low energy consumption, has a short molding time, can be easily removed from the mold after curing, and can reduce the number of times the release agent is applied to the mold can do.
以下に、本発明を詳細に説明する。本発明のインプリント成形用組成物は、ウレタン(メタ)アクリレートオリゴマー及びエポキシ(メタ)アクリレートオリゴマーからなる群から選択される少なくとも一種の(メタ)アクリレートオリゴマー(A)と、ヒドロキシル基含有(メタ)アクリレートモノマーと、上記一般式(I)で表わされるアルキル基含有(メタ)アクリレートモノマー(B1)又は(メタ)アクリロイル基含有反応性シリコーン(B2)と、光重合開始剤(C)とを含むことを特徴とする。なお、本発明のインプリント成形用組成物は、上記アルキル基含有(メタ)アクリレートモノマー(B1)及びヒドロキシル基含有(メタ)アクリレートモノマー以外の(メタ)アクリレートモノマーを更に含んでもよい。 The present invention is described in detail below. The imprint molding composition of the present invention comprises at least one (meth) acrylate oligomer (A) selected from the group consisting of urethane (meth) acrylate oligomers and epoxy (meth) acrylate oligomers, and hydroxyl group-containing (meth). An acrylate monomer, an alkyl group-containing (meth) acrylate monomer (B1) or (meth) acryloyl group-containing reactive silicone (B2) represented by the above general formula (I), and a photopolymerization initiator (C) It is characterized by. The imprint molding composition of the present invention may further contain a (meth) acrylate monomer other than the alkyl group-containing (meth) acrylate monomer (B1) and the hydroxyl group-containing (meth) acrylate monomer .
本発明のインプリント成形用組成物は、モノマーに比べて分子量が大きいウレタン(メタ)アクリレートオリゴマー及び/又はエポキシ(メタ)アクリレートオリゴマーを含むため、紫外線照射で形成される成形物が高い強度を有する。また、本発明のインプリント成形用組成物においては、アルキル基含有(メタ)アクリレートモノマー(B1)又は(メタ)アクリロイル基含有反応性シリコーン(B2)が紫外線硬化樹脂表面の表面張力(表面自由エネルギー)を低下させる事が出来るため、硬化後にモールドから脱型し易く、モールドへの離型剤の塗布回数を低減することが可能となる。 Since the imprint molding composition of the present invention includes a urethane (meth) acrylate oligomer and / or an epoxy (meth) acrylate oligomer having a molecular weight larger than that of the monomer, a molded product formed by ultraviolet irradiation has high strength. . Further, in the imprint molding composition of the present invention, the alkyl group-containing (meth) acrylate monomer (B1) or (meth) acryloyl group-containing reactive silicone (B2) is subjected to surface tension (surface free energy) on the surface of the ultraviolet curable resin. ) Can be reduced, it is easy to remove from the mold after curing, and the number of times of application of the release agent to the mold can be reduced.
本発明のインプリント成形用組成物に用いる(メタ)アクリレートオリゴマー(A)は、ウレタン(メタ)アクリレートオリゴマー及び/又はエポキシ(メタ)アクリレートオリゴマーであり、ウレタンアクリレートオリゴマー及び/又はエポキシアクリレートオリゴマーであることが好ましい。なお、これら(メタ)アクリレートオリゴマー(A)は、一種単独で用いてもよいし、二種以上を組み合わせて用いてもよい。インプリント成形用組成物がこれら(メタ)アクリレートオリゴマー(A)を含まない場合、紫外線照射で形成される成形物の強度が低下してしまう。 The (meth) acrylate oligomer (A) used in the imprint molding composition of the present invention is a urethane (meth) acrylate oligomer and / or an epoxy (meth) acrylate oligomer, and is a urethane acrylate oligomer and / or an epoxy acrylate oligomer. It is preferable. These (meth) acrylate oligomers (A) may be used alone or in combination of two or more. When the composition for imprint molding does not contain these (meth) acrylate oligomers (A), the strength of the molded product formed by ultraviolet irradiation is lowered.
上記ウレタン(メタ)アクリレートオリゴマーは、(メタ)アクリロイルオキシ基(CH2=CHCOO−又はCH2=C(CH3)COO−)を1つ以上有し、ウレタン結合(−NHCOO−)を複数有する化合物である。該ウレタン(メタ)アクリレートオリゴマーは、例えば、ポリオールとポリイソシアネートとからウレタンプレポリマーを合成し、該ウレタンプレポリマーに水酸基を有する(メタ)アクリレートを付加させることによって製造することができる。 The urethane (meth) acrylate oligomer has at least one (meth) acryloyloxy group (CH 2 ═CHCOO— or CH 2 ═C (CH 3 ) COO—) and a plurality of urethane bonds (—NHCOO—). A compound. The urethane (meth) acrylate oligomer can be produced, for example, by synthesizing a urethane prepolymer from a polyol and polyisocyanate, and adding a (meth) acrylate having a hydroxyl group to the urethane prepolymer.
上記ウレタンプレポリマーの合成に用いるポリオールは、水酸基(OH基)を複数有する化合物であり、該ポリオールとして、具体的には、ポリエーテルポリオール、ポリエステルポリオール、ポリテトラメチレングリコール、ポリブタジエンポリオール、アルキレンオキサイド変性ポリブタジエンポリオール及びポリイソプレンポリオール等が挙げられる。なお、上記ポリエーテルポリオールは、例えば、エチレングリコール、プロピレングリコール、グリセリン等の多価アルコールに、エチレンオキシドやプロピレンオキシド等のアルキレンオキサイドを付加させて得られ、また、上記ポリエステルポリオールは、例えば、エチレングリコール、ジエチレングリコール、1,4-ブタンジオール、1,6-ヘキサンジオール、プロピレングリコール、トリメチロールエタン、トリメチロールプロパン等の多価アルコールと、アジピン酸、グルタル酸、コハク酸、セバシン酸、ピメリン酸、スベリン酸等の多価カルボン酸とから得られる。 The polyol used for the synthesis of the urethane prepolymer is a compound having a plurality of hydroxyl groups (OH groups). Specific examples of the polyol include polyether polyol, polyester polyol, polytetramethylene glycol, polybutadiene polyol, and alkylene oxide modification. Examples include polybutadiene polyol and polyisoprene polyol. The polyether polyol is obtained, for example, by adding an alkylene oxide such as ethylene oxide or propylene oxide to a polyhydric alcohol such as ethylene glycol, propylene glycol, or glycerin. The polyester polyol is, for example, ethylene glycol. , Diethylene glycol, 1,4-butanediol, 1,6-hexanediol, propylene glycol, trimethylolethane, trimethylolpropane and other polyhydric alcohols and adipic acid, glutaric acid, succinic acid, sebacic acid, pimelic acid, suberin It is obtained from a polyvalent carboxylic acid such as an acid.
上記ポリイソシアネートは、イソシアネート基(NCO基)を複数有する化合物であって、該ポリイソシアネートとして、具体的には、トリレンジイソシアネート(TDI)、ジフェニルメタンジイソシアネート(MDI)、粗製ジフェニルメタンジイソシアネート(クルードMDI)、イソホロンジイソシアネート(IPDI)、水素添加ジフェニルメタンジイソシアネート、水素添加トリレンジイソシアネート、ヘキサメチレンジイソシアネート(HDI)や、これらのイソシアヌレート変性物、カルボジイミド変性物、グリコール変性物等が挙げられる。 The polyisocyanate is a compound having a plurality of isocyanate groups (NCO groups). Specifically, as the polyisocyanate, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), crude diphenylmethane diisocyanate (crude MDI), Examples include isophorone diisocyanate (IPDI), hydrogenated diphenylmethane diisocyanate, hydrogenated tolylene diisocyanate, hexamethylene diisocyanate (HDI), these isocyanurate-modified products, carbodiimide-modified products, and glycol-modified products.
上記ウレタンプレポリマーの合成においては、ウレタン化反応用の触媒を用いることが好ましい。該ウレタン化反応用触媒としては、有機スズ化合物、無機スズ化合物、有機鉛化合物、モノアミン類、ジアミン類、トリアミン類、環状アミン類、アルコールアミン類、エーテルアミン類、有機スルホン酸、無機酸、チタン化合物、ビスマス化合物、四級アンモニウム塩等が挙げられ、これらの中でも、有機スズ化合物が好ましい。また、好適な有機スズ化合物としては、ジブチルスズジラウレート、ジブチルスズジアセテート、ジブチルスズチオカルボキシレート、ジブチルスズジマレエート、ジオクチルスズチオカルボキシレート、オクテン酸スズ、モノブチルスズオキシド等が挙げられる。 In the synthesis of the urethane prepolymer, it is preferable to use a catalyst for urethanization reaction. Examples of the catalyst for urethanization reaction include organic tin compounds, inorganic tin compounds, organic lead compounds, monoamines, diamines, triamines, cyclic amines, alcohol amines, ether amines, organic sulfonic acids, inorganic acids, titanium A compound, a bismuth compound, a quaternary ammonium salt, etc. are mentioned, Among these, an organotin compound is preferable. Suitable organic tin compounds include dibutyltin dilaurate, dibutyltin diacetate, dibutyltin thiocarboxylate, dibutyltin dimaleate, dioctyltin thiocarboxylate, tin octenoate, monobutyltin oxide, and the like.
また、上記ウレタンプレポリマーに付加させる水酸基を有する(メタ)アクリレートは、水酸基を1つ以上有し、(メタ)アクリロイルオキシ基を1つ以上有する化合物である。該水酸基を有する(メタ)アクリレートは、上記ウレタンプレポリマーのイソシアネート基に付加することができる。該水酸基を有する(メタ)アクリレートとしては、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート等が挙げられる。 The (meth) acrylate having a hydroxyl group to be added to the urethane prepolymer is a compound having one or more hydroxyl groups and one or more (meth) acryloyloxy groups. The (meth) acrylate having a hydroxyl group can be added to the isocyanate group of the urethane prepolymer. Examples of the (meth) acrylate having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and pentaerythritol tri (meth) acrylate.
また、上記エポキシ(メタ)アクリレートオリゴマーは、グリシジル基を有する化合物、好ましくは、グリシジル基を有し且つベンゼン環、ナフタレン環、スピロ環、ジシクロペンタジエン、トリシクロデカン等の環状構造を有する化合物と(メタ)アクリル酸とを反応させることによって製造することができる。 The epoxy (meth) acrylate oligomer is a compound having a glycidyl group, preferably a compound having a glycidyl group and a cyclic structure such as a benzene ring, a naphthalene ring, a spiro ring, dicyclopentadiene, or tricyclodecane. It can be produced by reacting with (meth) acrylic acid.
上記グリシジル基を有する化合物としては、ビスフェノールA又はビスフェノールFとエピクロロヒドリンとの反応によって得られるビスフェノール型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、脂環式エポキシ樹脂等が挙げられる。 Examples of the compound having a glycidyl group include a bisphenol type epoxy resin, a phenol novolak type epoxy resin, a cresol novolak type epoxy resin, an alicyclic epoxy resin, and the like obtained by a reaction between bisphenol A or bisphenol F and epichlorohydrin. It is done.
本発明のインプリント成形用組成物において、上記(メタ)アクリレートオリゴマー(A)の含有量は、組成物全体の20〜60質量%の範囲が好ましい。(メタ)アクリレートオリゴマー(A)の含有量が20質量%以上であれば、十分な強度を有する成形物を得ることができ、また、(メタ)アクリレートオリゴマー(A)の含有量が60質量%以下であれば、組成物の粘度が十分に低く、モールドへ流れ込み易くなる。 In the imprint molding composition of the present invention, the content of the (meth) acrylate oligomer (A) is preferably in the range of 20 to 60% by mass of the entire composition. If the content of the (meth) acrylate oligomer (A) is 20% by mass or more, a molded product having sufficient strength can be obtained, and the content of the (meth) acrylate oligomer (A) is 60% by mass. If it is below, the viscosity of the composition is sufficiently low, and it is easy to flow into the mold.
本発明のインプリント成形用組成物に用いられるアルキル基含有(メタ)アクリレートモノマー(B1)は、上記一般式(I)で表わされる。式(I)のアルキル基含有(メタ)アクリレートモノマー(B1)は、R1として炭素数4〜14の疎水性の長鎖アルキル基を有するため、成形物のモールドからの脱型を容易にする作用を有する。なお、R1が炭素数3以下の低級アルキル基である場合、(メタ)アクリレートモノマーの疎水性が不十分で、成形物のモールドからの脱型性が悪い。また、モールドからの脱型性の観点から、R1は炭素数12以上のアルキル基であることが好ましい。一方、R1が炭素数15以上の長鎖アルキル基である場合、(メタ)アクリレートモノマー(B1)の取り扱い性が悪い上、(メタ)アクリレートオリゴマー(A)との相溶性も悪い。 The alkyl group-containing (meth) acrylate monomer (B1) used in the imprint molding composition of the present invention is represented by the above general formula (I). Since the alkyl group-containing (meth) acrylate monomer (B1) of the formula (I) has a hydrophobic long-chain alkyl group having 4 to 14 carbon atoms as R 1 , the mold can be easily removed from the mold. Has an effect. When R 1 is a lower alkyl group having 3 or less carbon atoms, the hydrophobicity of the (meth) acrylate monomer is insufficient and the mold release from the mold is poor. From the viewpoint of mold release from the mold, R 1 is preferably an alkyl group having 12 or more carbon atoms. On the other hand, when R 1 is a long-chain alkyl group having 15 or more carbon atoms, the handleability of the (meth) acrylate monomer (B1) is poor and the compatibility with the (meth) acrylate oligomer (A) is also poor.
上記一般式(I)において、R1は炭素数4〜14のアルキル基であって、直鎖状でも分岐鎖状であってもよく、R2は水素又はメチル基である。R1において、炭素数4〜14のアルキル基として、具体的には、各種ブチル基、各種ペンチル基、各種ヘキシル基、各種ヘプチル基、各種オクチル基、各種ノニル基、各種デシル基、各種ウンデシル基、各種ドデシル基(例えば、ラウリル基等)、各種トリデシル基、各種テトラデシル基(例えば、ミリスチル基、イソミリスチル基等)が挙げられ、これらの中でも、ラウリル基及びイソミリスチル基が好ましい。 In the general formula (I), R 1 is an alkyl group having 4 to 14 carbon atoms, which may be linear or branched, and R 2 is hydrogen or a methyl group. In R 1 , as the alkyl group having 4 to 14 carbon atoms, specifically, various butyl groups, various pentyl groups, various hexyl groups, various heptyl groups, various octyl groups, various nonyl groups, various decyl groups, various undecyl groups , Various dodecyl groups (for example, lauryl group), various tridecyl groups, various tetradecyl groups (for example, myristyl group, isomyristyl group, etc.). Among these, lauryl group and isomyristyl group are preferable.
上記式(I)の(メタ)アクリレートモノマー(B1)として、具体的には、ラウリル(メタ)アクリレート、イソミリスチル(メタ)アクリレート、ミリスチル(メタ)アクリレート、イソブチル(メタ)アクリレート、n-ブチル(メタ)アクリレート、イソアミル(メタ)アクリレート、イソオクチル(メタ)アクリレート等が挙げられ、これらの中でも、イソミリスチル(メタ)アクリレート及びラウリル(メタ)アクリレートが好ましい。なお、これら式(I)の(メタ)アクリレートモノマー(B1)は、一種単独で用いてもよいし、二種以上を組み合わせて用いてもよい。 Specific examples of the (meth) acrylate monomer (B1) of the above formula (I) include lauryl (meth) acrylate, isomyristyl (meth) acrylate, myristyl (meth) acrylate, isobutyl (meth) acrylate, n-butyl ( Examples thereof include meth) acrylate, isoamyl (meth) acrylate, isooctyl (meth) acrylate and the like. Among these, isomyristyl (meth) acrylate and lauryl (meth) acrylate are preferable. These (meth) acrylate monomers (B1) of the formula (I) may be used alone or in combination of two or more.
本発明のインプリント成形用組成物がアルキル基含有(メタ)アクリレートモノマー(B1)を含む場合、該アルキル基含有(メタ)アクリレートモノマー(B1)の含有量は、組成物全体の5〜20質量%の範囲が好ましい。式(I)のアルキル基含有(メタ)アクリレートモノマー(B1)の割合が5質量%以上であれば、成形物のモールドからの脱型性を十分に向上させることができ、一方、式(I)のアルキル基含有(メタ)アクリレートモノマー(B1)の割合が20質量%以下であれば、硬化速度を維持出来、硬化物がべたつく事はない。 When the composition for imprint molding of the present invention contains an alkyl group-containing (meth) acrylate monomer (B1), the content of the alkyl group-containing (meth) acrylate monomer (B1) is 5 to 20 mass of the entire composition. % Range is preferred. If the proportion of the alkyl group-containing (meth) acrylate monomer (B1) of the formula (I) is 5% by mass or more, the mold release from the mold can be sufficiently improved, while the formula (I If the ratio of the alkyl group-containing (meth) acrylate monomer (B1) is 20% by mass or less, the curing rate can be maintained and the cured product will not be sticky.
本発明のインプリント成形用組成物に用いられる反応性シリコーン(B2)は、(メタ)アクリロイル基[CH2=CHCO−又はCH2=C(CH3)CO−]を一つ以上有し、シロキサン単位[−SiR3 2−O−、式中、R3はそれぞれ独立して水素、メチル基等のアルキル基、フェニル基等のアリール基である]を複数有する。該反応性シリコーン(B2)としては、特に限定されず、公知の反応性シリコーン(B2)を使用することができる。 The reactive silicone (B2) used in the imprint molding composition of the present invention has one or more (meth) acryloyl groups [CH 2 ═CHCO— or CH 2 ═C (CH 3 ) CO—], It has a plurality of siloxane units [—SiR 3 2 —O—, wherein each R 3 is independently an alkyl group such as hydrogen or a methyl group or an aryl group such as a phenyl group]. The reactive silicone (B2) is not particularly limited, and a known reactive silicone (B2) can be used.
本発明のインプリント成形用組成物が(メタ)アクリロイル基含有反応性シリコーン(B2)を含む場合、該(メタ)アクリロイル基含有反応性シリコーン(B2)の添加量は、前記(メタ)アクリレートオリゴマー(A)と前記アルキル基含有(メタ)アクリレートモノマー(B1)及び前記(メタ)アクリロイル基含有反応性シリコーン(B2)以外の(メタ)アクリレートモノマーとの合計100質量部に対して4〜20質量部の範囲が好ましい。(メタ)アクリロイル基含有反応性シリコーン(B2)の添加量が4質量部以上であれば、成形物のモールドからの脱型性を十分に向上させることができ、一方、(メタ)アクリロイル基含有反応性シリコーン(B2)の添加量が20質量部以下であれば、硬化速度を維持出来、硬化物がべたつかない。 When the imprint molding composition of the present invention contains the (meth) acryloyl group-containing reactive silicone (B2), the amount of the (meth) acryloyl group-containing reactive silicone (B2) is the above-mentioned (meth) acrylate oligomer. 4 to 20 mass with respect to 100 mass parts in total of (A) and the (meth) acrylate monomer other than the alkyl group-containing (meth) acrylate monomer (B1) and the (meth) acryloyl group-containing reactive silicone (B2) A range of parts is preferred. If the amount of the (meth) acryloyl group-containing reactive silicone (B2) added is 4 parts by mass or more, the mold release from the mold can be sufficiently improved, while the (meth) acryloyl group-containing If the addition amount of the reactive silicone (B2) is 20 parts by mass or less, the curing rate can be maintained and the cured product is not sticky.
本発明のインプリント成形用組成物は、ヒドロキシル基含有(メタ)アクリレートモノマーを含み、ヒドロキシル基含有アクリレートモノマーを含むことが好ましい。インプリント成形用組成物がヒドロキシル基含有(メタ)アクリレートモノマーを含むことで、IZOやITO等の金属酸化物に対する接着性が向上し、脱型時に基材から成形物が剥離するのを抑制できる。 Imprint molding composition of the invention comprises a hydroxyl group-containing (meth) acrylate monomer preferably contains a hydroxyl group-containing acrylate monomer. By imprinting molding composition comprising a hydroxyl group-containing (meth) acrylate monomer, improved adhesion to metal oxides such as IZO or ITO, it can be suppressed molded product to peel from the substrate during demolding .
上記ヒドロキシル基含有(メタ)アクリレートモノマーは、水酸基を1つ以上有し、(メタ)アクリロイルオキシ基を1つ以上有する化合物である。かかるヒドロキシル基含有(メタ)アクリレートモノマーとして、具体的には、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート及び2-ヒドロキシブチル(メタ)アクリレートが挙げられ、これらの中でも、2-ヒドロキシエチルアクリレートが好ましい。なお、これらヒドロキシル基含有(メタ)アクリレートモノマーは、一種単独で用いてもよいし、二種以上を組み合わせて用いてもよい。 The hydroxyl group-containing (meth) acrylate monomer is a compound having one or more hydroxyl groups and one or more (meth) acryloyloxy groups. Specific examples of the hydroxyl group-containing (meth) acrylate monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate. Among these, 2-hydroxyethyl acrylate is preferred. These hydroxyl group-containing (meth) acrylate monomers may be used alone or in combination of two or more.
上記ヒドロキシル基含有(メタ)アクリレートモノマーの割合は、特に限定されるものではないが、上記(メタ)アクリレートオリゴマー(A)と(メタ)アクリレートモノマーとの総配合量中40〜60質量%の範囲が好ましい。ヒドロキシル基含有(メタ)アクリレートモノマーの割合が40質量%以上であれば、インプリント成形用組成物の金属酸化物に対する接着性を十分に向上させることができ、一方、ヒドロキシル基含有(メタ)アクリレートモノマーの割合が60質量%以下であれば、紫外線照射で形成される成形物の強度が十分に高い。 The proportion of the hydroxyl group-containing (meth) acrylate monomer is not particularly limited, but it is in the range of 40 to 60% by mass in the total amount of the (meth) acrylate oligomer (A) and the (meth) acrylate monomer. Is preferred. If the proportion of the hydroxyl group-containing (meth) acrylate monomer is 40% by mass or more, the adhesion of the imprint molding composition to the metal oxide can be sufficiently improved, whereas the hydroxyl group-containing (meth) acrylate When the proportion of the monomer is 60% by mass or less, the strength of the molded product formed by ultraviolet irradiation is sufficiently high.
本発明のインプリント成形用組成物に用いる光重合開始剤(C)は、紫外線を照射されることによって、上述した(メタ)アクリレートオリゴマー(A)、アルキル基含有(メタ)アクリレートモノマー(B1)、(メタ)アクリロイル基含有反応性シリコーン(B2)及びヒドロキシル基含有(メタ)アクリレートモノマーの重合を開始させる作用を有する。該光重合開始剤(C)としては、4-ジメチルアミノ安息香酸、4-ジメチルアミノ安息香酸エステル、2,2-ジメトキシ-2-フェニルアセトフェノン、アセトフェノンジエチルケタール、アルコキシアセトフェノン、ベンジルジメチルケタール、ベンゾフェノン及び3,3-ジメチル-4-メトキシベンゾフェノン、4,4-ジメトキシベンゾフェノン、4,4-ジアミノベンゾフェノン等のベンゾフェノン誘導体、ベンゾイル安息香酸アルキル、ビス(4-ジアルキルアミノフェニル)ケトン、ベンジル及びベンジルメチルケタール等のベンジル誘導体、ベンゾイン及びベンゾインイソブチルエーテル等のベンゾイン誘導体、ベンゾインイソプロピルエーテル、2-ヒドロキシ-2-メチルプロピオフェノン、1-ヒドロキシ-シクロヘキシル-フェニル-ケトン、キサントン、チオキサントン及びチオキサントン誘導体、フルオレン、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキシド、ビス(2,6-ジメトキシベンゾイル)-2,4,4-トリメチルペンチルホスフィンオキシド、ビス(2,4,6-トリメチルベンゾイル)-フェニルホスフィンオキシド、2-メチル-1-(4-メチルチオフェニル)-2-モルホリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(モルホリノフェニル)-ブタノン-1等が挙げられる。これら光重合開始剤(C)は、1種単独で用いてもよいし、2種以上を組み合わせて使用してもよい。 The photopolymerization initiator (C) used in the imprint molding composition of the present invention is the above-described (meth) acrylate oligomer (A) and alkyl group-containing (meth) acrylate monomer (B1) when irradiated with ultraviolet rays. , (Meth) acryloyl group-containing reactive silicone (B2) and a hydroxyl group-containing (meth) acrylate monomer. Examples of the photopolymerization initiator (C) include 4-dimethylaminobenzoic acid, 4-dimethylaminobenzoic acid ester, 2,2-dimethoxy-2-phenylacetophenone, acetophenone diethyl ketal, alkoxyacetophenone, benzyldimethyl ketal, benzophenone and 3,3-dimethyl-4-methoxybenzophenone, benzophenone derivatives such as 4,4-dimethoxybenzophenone, 4,4-diaminobenzophenone, alkyl benzoylbenzoate, bis (4-dialkylaminophenyl) ketone, benzyl, benzylmethyl ketal, etc. Benzyl derivatives, benzoin derivatives such as benzoin and benzoin isobutyl ether, benzoin isopropyl ether, 2-hydroxy-2-methylpropiophenone, 1-hydroxy-cyclohexyl-phenyl-ketone, Thiolene, thioxanthone and thioxanthone derivatives, fluorene, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,4,6- Trimethylbenzoyl) -phenylphosphine oxide, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (morpholinophenyl) -butanone-1, etc. Is mentioned. These photoinitiators (C) may be used individually by 1 type, and may be used in combination of 2 or more type.
本発明のインプリント成形用組成物における上記光重合開始剤(C)の含有量は、組成物全体の0.5〜10質量%の範囲が好ましい。光重合開始剤(C)の含有量が0.5質量%以上であれば、インプリント成形用組成物の紫外線硬化を十分に開始させることができ、一方、10質量%を超えると、紫外線硬化を開始させる効果が飽和する一方、インプリント成形用組成物の原料コストが高くなる。 The content of the photopolymerization initiator (C) in the imprint molding composition of the present invention is preferably in the range of 0.5 to 10% by mass of the entire composition. If the content of the photopolymerization initiator (C) is 0.5% by mass or more, the ultraviolet curing of the imprint molding composition can be sufficiently started. On the other hand, if the content exceeds 10% by mass, the ultraviolet curing starts. On the other hand, the raw material cost of the imprint molding composition increases.
上述のように、本発明のインプリント成形用組成物は、紫外線照射により硬化後、モールドから脱型し易く、モールドへの離型剤の塗布回数を低減することができる。なお、本発明のインプリント成形用組成物を硬化させる際の紫外線の照射条件は特に限定されず、適宜設定することができる。また、インプリント成形においては、モールドにフッ素系離型剤等を塗布しておくことが好ましい。 As described above, the imprint molding composition of the present invention can be easily removed from the mold after being cured by ultraviolet irradiation, and the number of times of application of the release agent to the mold can be reduced. In addition, the irradiation condition of the ultraviolet-ray at the time of hardening the imprint molding composition of this invention is not specifically limited, It can set suitably. In imprint molding, it is preferable to apply a fluorine-based mold release agent or the like to the mold.
以下に、実施例を挙げて本発明を更に詳しく説明するが、本発明は下記の実施例に何ら限定されるものではない。 Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples.
表1及び2に示す配合のインプリント成形用組成物を調製して、下記の方法で、Ni電鋳製の板に対する繰り返し剥離回数、及びNi電鋳製のモールドに対する繰り返し脱型回数を測定した。結果を表1及び2に示す。 A composition for imprint molding having the composition shown in Tables 1 and 2 was prepared, and the number of repeated peeling with respect to a Ni electroformed plate and the number of repeated demolding with respect to a Ni electroformed mold were measured by the following methods. . The results are shown in Tables 1 and 2.
(1)Ni電鋳製の板に対する繰り返し剥離回数
Ni電鋳製の板に対してフッ素系離型剤を塗布しておき、基材フィルムに対し紫外線硬化配合液をバーコーターで塗布し、離型処理済のNi電鋳製の板を貼り、基材フィルムに向け紫外線照射を行い、硬化させ、所定の大きさにカットした後、Ni電鋳製の板から硬化後の成形物の剥離を試み、100 N/m以下の剥離力で剥離できた場合を剥離回数としてカウントし、剥離力が100 N/mを超えるまで、試験を繰り返した。
(1) in advance by coating a fluorine-based releasing agent to repeat peeling count Ni electroformed steel plate to Ni electroformed plate made of an ultraviolet curable liquid combination to the substrate film was coated with a bar coater, away A die-treated Ni electroformed plate is attached, irradiated with ultraviolet rays toward the base film, cured, cut to a predetermined size, and then the cured molded product is peeled from the Ni electroformed plate. Attempts were made to count the number of peels when the peel force was 100 N / m or less, and the test was repeated until the peel force exceeded 100 N / m.
(2)Ni電鋳製のモールドに対する繰り返し脱型回数
Ni電鋳製のモールドに対してフッ素系離型剤を塗布しておき、対象となる紫外線硬化樹脂とインプリント成形機を用い、一定の加圧力で押し当て、紫外線照射した後、Ni電鋳製のモールドから硬化後の成形物の脱型を試み、成形物が破壊されず、且つ成形物が基材から剥離せずに脱型できた場合を脱型回数としてカウントし、成形物が破壊されるか、成形物が基材から剥離するまで、試験を繰り返した。
(2) advance by coating a fluorine-based releasing agent to repeated demolding times Ni electroformed steel mold for Ni electroformed steel mold using a UV curable resin and the imprint molding machine of interest, a certain After pressing with pressure and irradiating with ultraviolet light, it is possible to demold the molded product after curing from the Ni electroformed mold, without destroying the molded product and without removing the molded product from the substrate. The case was counted as the number of times of demolding, and the test was repeated until the molded product was destroyed or the molded product peeled from the substrate.
*1 共栄社化学製, 商品名「3002A」, エポキシアクリレートオリゴマー, 重量平均分子量(Mw)=600, ビスフェノールA骨格
*2 共栄社化学製, 商品名「HO−A」, 2-ヒドロキシエチルアクリレート
*3 共栄社化学製, 商品名「LA」, ラウリルアクリレート, 式(I)で表わされR1が炭素数12のアルキル基でR2が水素であるモノマー
*4 共栄社化学製, 商品名「IM−A」, イソミリスチルアクリレート, 式(I)で表わされR1が炭素数14のアルキル基でR2が水素であるモノマー
*5 信越シリコーン製, 商品名「X−22−1602」, シリコーンアクリレート, 官能基当量=1600
*6 信越シリコーン製, 商品名「X−22−1603」, シリコーンアクリレート, 官能基当量=930
*7 チバ・スペシャルティ・ケミカルズ製, 商品名「IRGACURE 184」, 1-ヒドロキシ-シクロヘキシル-フェニル-ケトン
*8 新中村化学製, 商品名「A−MO」, アクリロイルモルホリン
*9 共栄社化学製, 商品名「SA」, ステアリルアクリレート, 式(I)で表わされR1が炭素数18のアルキル基でR2が水素であるモノマー
*10 大阪有機化学工業製, 商品名「ビスコート4F」, 2,2,3,3-テトラフルオロプロピルアクリレート
*11 大阪有機化学工業製, 商品名「ビスコート8F」, 1H,1H,5H-オクタフルオロペンチルアクリレート
* 1 Kyoeisha Chemical Co., Ltd., trade name “3002A”, epoxy acrylate oligomer, weight average molecular weight (Mw) = 600, bisphenol A skeleton
* 2 Kyoeisha Chemical Co., Ltd., trade name “HO-A”, 2-hydroxyethyl acrylate
* 3 Kyoeisha Chemical Co., Ltd., trade name “LA”, lauryl acrylate, a monomer represented by the formula (I) wherein R 1 is an alkyl group having 12 carbon atoms and R 2 is hydrogen
* 4 Kyoeisha Chemical Co., Ltd., trade name “IM-A”, isomyristyl acrylate, a monomer represented by the formula (I) wherein R 1 is an alkyl group having 14 carbon atoms and R 2 is hydrogen
* 5 Shin-Etsu Silicone, trade name “X-22-1602”, silicone acrylate, functional group equivalent = 1600
* 6 Shin-Etsu Silicone, trade name “X-22-1603”, silicone acrylate, functional group equivalent = 930
* 7 Product name “IRGACURE 184”, 1-hydroxy-cyclohexyl-phenyl-ketone, manufactured by Ciba Specialty Chemicals
* 8 Shin-Nakamura Chemical Co., Ltd., trade name “A-MO”, acryloylmorpholine
* 9 Kyoeisha Chemical Co., Ltd., trade name “SA”, stearyl acrylate, a monomer represented by the formula (I) wherein R 1 is an alkyl group having 18 carbon atoms and R 2 is hydrogen
* 10 Made by Osaka Organic Chemical Industry, trade name “Biscoat 4F”, 2,2,3,3-tetrafluoropropyl acrylate
* 11 Made by Osaka Organic Chemical Industry, trade name “Biscoat 8F”, 1H, 1H, 5H-octafluoropentyl acrylate
表1から、(メタ)アクリレートオリゴマー(A)と、ヒドロキシル基含有(メタ)アクリレートモノマーと、式(I)のアルキル基含有(メタ)アクリレートモノマー(B1)又は(メタ)アクリロイル基含有反応性シリコーン(B2)を含む実施例のインプリント成形用組成物は、モールドに対する脱型性に優れることが分かる。 From Table 1, (meth) acrylate oligomer (A), hydroxyl group-containing (meth) acrylate monomer, alkyl group-containing (meth) acrylate monomer (B1) of formula (I) or (meth) acryloyl group-containing reactive silicone It turns out that the composition for imprint molding of the Example containing (B2) is excellent in the mold release property with respect to a mold.
一方、表2から、式(I)のアルキル基含有(メタ)アクリレートモノマー(B1)及び(メタ)アクリロイル基含有反応性シリコーン(B2)のいずれも含まない比較例1〜5のインプリント成形用組成物は、モールドに対する脱型性が悪いため、実施例に比べて早期に、脱型不能となり、離型剤の塗布頻度の増加を引き起こすことが示唆された。 On the other hand, from Table 2, for imprint molding of Comparative Examples 1 to 5, which does not contain any of the alkyl group-containing (meth) acrylate monomer (B1) and (meth) acryloyl group-containing reactive silicone (B2) of formula (I) Since the composition has poor mold release properties, it was suggested that the composition could not be demolded earlier than in the examples, and increased the frequency of application of the release agent.
Claims (4)
ヒドロキシル基含有(メタ)アクリレートモノマーと、
下記一般式(I):
光重合開始剤(C)と
を含むインプリント成形用組成物。 At least one (meth) acrylate oligomer (A) selected from the group consisting of urethane (meth) acrylate oligomers and epoxy (meth) acrylate oligomers;
A hydroxyl group-containing (meth) acrylate monomer;
The following general formula (I):
An imprint molding composition comprising: a photopolymerization initiator (C).
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| JP2008052561A JP5130082B2 (en) | 2008-03-03 | 2008-03-03 | Composition for imprint molding and molded product using the same |
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| JP2008052561A JP5130082B2 (en) | 2008-03-03 | 2008-03-03 | Composition for imprint molding and molded product using the same |
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| JP2009209244A JP2009209244A (en) | 2009-09-17 |
| JP5130082B2 true JP5130082B2 (en) | 2013-01-30 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US8711762B2 (en) | 2001-08-27 | 2014-04-29 | Panasonic Corporation | Wireless communications apparatus and wireless communications method |
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| KR100568581B1 (en) * | 2003-04-14 | 2006-04-07 | 주식회사 미뉴타텍 | Composition for micropattern forming mold and mold made therefrom |
| JP4479907B2 (en) * | 2005-05-13 | 2010-06-09 | 株式会社ブリヂストン | Photocurable transfer sheet, method for producing optical information recording medium using the same, and optical information recording medium |
| JP5117002B2 (en) * | 2006-07-10 | 2013-01-09 | 富士フイルム株式会社 | Photocurable composition and pattern forming method using the same |
| JP5032249B2 (en) * | 2007-09-05 | 2012-09-26 | 株式会社ブリヂストン | Composition for imprint molding and molded product using the same |
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| US8711762B2 (en) | 2001-08-27 | 2014-04-29 | Panasonic Corporation | Wireless communications apparatus and wireless communications method |
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