JP5140189B2 - フィルム型光分解性転写材料 - Google Patents
フィルム型光分解性転写材料 Download PDFInfo
- Publication number
- JP5140189B2 JP5140189B2 JP2011511501A JP2011511501A JP5140189B2 JP 5140189 B2 JP5140189 B2 JP 5140189B2 JP 2011511501 A JP2011511501 A JP 2011511501A JP 2011511501 A JP2011511501 A JP 2011511501A JP 5140189 B2 JP5140189 B2 JP 5140189B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- resin
- transfer material
- material according
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 55
- 238000012546 transfer Methods 0.000 title claims description 49
- 229920005989 resin Polymers 0.000 claims description 116
- 239000011347 resin Substances 0.000 claims description 116
- 229920002120 photoresistant polymer Polymers 0.000 claims description 77
- 239000011241 protective layer Substances 0.000 claims description 55
- 239000010410 layer Substances 0.000 claims description 52
- 229920003986 novolac Polymers 0.000 claims description 32
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 23
- 229930003836 cresol Natural products 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 20
- FHIVAFMUCKRCQO-UHFFFAOYSA-N diazinon Chemical compound CCOP(=S)(OCC)OC1=CC(C)=NC(C(C)C)=N1 FHIVAFMUCKRCQO-UHFFFAOYSA-N 0.000 claims description 13
- 230000035945 sensitivity Effects 0.000 claims description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 claims description 12
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 claims description 12
- 229920002799 BoPET Polymers 0.000 claims description 11
- 229920002125 Sokalan® Polymers 0.000 claims description 10
- 238000010030 laminating Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 claims description 8
- 229940100630 metacresol Drugs 0.000 claims description 8
- 239000003623 enhancer Substances 0.000 claims description 7
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 6
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 4
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 claims description 3
- WXYSZTISEJBRHW-UHFFFAOYSA-N 4-[2-[4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(C(C)(C=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 3
- 239000010408 film Substances 0.000 description 159
- 238000000034 method Methods 0.000 description 21
- -1 polyethylene terephthalate Polymers 0.000 description 21
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 description 11
- 239000005020 polyethylene terephthalate Substances 0.000 description 11
- 239000003513 alkali Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 239000004698 Polyethylene Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 3
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- IAVREABSGIHHMO-UHFFFAOYSA-N 3-hydroxybenzaldehyde Chemical compound OC1=CC=CC(C=O)=C1 IAVREABSGIHHMO-UHFFFAOYSA-N 0.000 description 2
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000004181 carboxyalkyl group Chemical group 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011254 layer-forming composition Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical class OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- UYBDKTYLTZZVEB-UHFFFAOYSA-N (2,3,4,5,6-pentahydroxyphenyl)-phenylmethanone Chemical compound OC1=C(O)C(O)=C(O)C(O)=C1C(=O)C1=CC=CC=C1 UYBDKTYLTZZVEB-UHFFFAOYSA-N 0.000 description 1
- XEDWWPGWIXPVRQ-UHFFFAOYSA-N (2,3,4-trihydroxyphenyl)-(3,4,5-trihydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC(O)=C(O)C(O)=C1 XEDWWPGWIXPVRQ-UHFFFAOYSA-N 0.000 description 1
- JIKXTXDEGMWPJZ-UHFFFAOYSA-N (2,3-dihydroxyphenyl)-(2-hydroxyphenyl)methanone Chemical compound OC1=CC=CC(C(=O)C=2C(=CC=CC=2)O)=C1O JIKXTXDEGMWPJZ-UHFFFAOYSA-N 0.000 description 1
- WQCSLQBRPJWOID-UHFFFAOYSA-N (2,3-dihydroxyphenyl)-(4-hydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=CC(O)=C1O WQCSLQBRPJWOID-UHFFFAOYSA-N 0.000 description 1
- GBQZZLQKUYLGFT-UHFFFAOYSA-N (2,4-dihydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical class OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O GBQZZLQKUYLGFT-UHFFFAOYSA-N 0.000 description 1
- GKQOIQKMFFMJLF-UHFFFAOYSA-N (2-hydroxyphenyl)-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C(=CC=CC=2)O)=C1O GKQOIQKMFFMJLF-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- QPVRKFOKCKORDP-UHFFFAOYSA-N 1,3-dimethylcyclohexa-2,4-dien-1-ol Chemical compound CC1=CC(C)(O)CC=C1 QPVRKFOKCKORDP-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- AXNBHXKTLILFKJ-UHFFFAOYSA-N 1,6-dimethylcyclohexa-2,4-dien-1-ol 2,3,5-trimethylphenol Chemical compound C1(C(C=CC=C1)C)(C)O.CC1=C(C=C(C=C1C)C)O AXNBHXKTLILFKJ-UHFFFAOYSA-N 0.000 description 1
- PVOAHINGSUIXLS-UHFFFAOYSA-N 1-Methylpiperazine Chemical compound CN1CCNCC1 PVOAHINGSUIXLS-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- CYEKUDPFXBLGHH-UHFFFAOYSA-N 3-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC(O)=C1 CYEKUDPFXBLGHH-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- SXRSQZLOMIGNAQ-UHFFFAOYSA-N Glutaraldehyde Chemical compound O=CCCCC=O SXRSQZLOMIGNAQ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002565 Polyethylene Glycol 400 Polymers 0.000 description 1
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- LNTHITQWFMADLM-UHFFFAOYSA-N anhydrous gallic acid Natural products OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WXNRYSGJLQFHBR-UHFFFAOYSA-N bis(2,4-dihydroxyphenyl)methanone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1O WXNRYSGJLQFHBR-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical class OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229930003944 flavone Natural products 0.000 description 1
- 235000011949 flavones Nutrition 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229940074391 gallic acid Drugs 0.000 description 1
- 235000004515 gallic acid Nutrition 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- XOOMNEFVDUTJPP-UHFFFAOYSA-N naphthalene-1,3-diol Chemical compound C1=CC=CC2=CC(O)=CC(O)=C21 XOOMNEFVDUTJPP-UHFFFAOYSA-N 0.000 description 1
- ZUVBIBLYOCVYJU-UHFFFAOYSA-N naphthalene-1,7-diol Chemical compound C1=CC=C(O)C2=CC(O)=CC=C21 ZUVBIBLYOCVYJU-UHFFFAOYSA-N 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005026 oriented polypropylene Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920001289 polyvinyl ether Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/008—Azides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
(a)メタクリル酸:メチルメタクリレート(MAA):スチレンを20:70:10の重量比率で使用し、溶媒MEK(methylethyl ketone)、重合開始剤AIBN(azobisisobutyronitrile)1%、反応温度80℃、反応時間4時間、後添開始剤AIBN3%の条件下に重合してアクリル酸高分子(重量平均分子量70,000、固形分40%)を製造した。
アルカリ可溶性樹脂としてクレゾールノボラック樹脂(メタクレゾール/パラクレゾールの含量が重量基準で4:6であり、重量平均分子量8,000のクレゾールノボラック樹脂と重量平均分子量2,000のノボラック樹脂とが7:3の比率で混合されたクレゾールノボラック樹脂)を含み;前記アルカリ可溶性樹脂100重量部に対して、感光性化合物として34重量部の2,3,4−トリヒドロキシベンゾフェノン−1,2−ナフトキノンジアジド−5−スルホネート;感度増進剤として3.6重量部の2,3,4−トリヒドロキシベンゾフェノン;低沸点溶媒として165重量部のメチルエチルケトン;および離型剤として0.5重量部のフッ素系シリコン樹脂を含んでなる溶液を製造した。こうして製造された溶液を0.2μmのミリポアテフロン(登録商標)フィルターを用いて濾過させて不溶物質を除去した。その結果として得た溶液をポリエチレンテレフタレート(PET)フィルム(厚さ19μm)上に5μmの厚さで塗布してフォトレジスト樹脂層を形成した。厚さ23μmのポリエチレンフィルム保護層を前記フォトレジスト樹脂層に塗布してポジティブ型フォトレジスト樹脂フィルムを製造した。
<保護フィルム>
幅3cm、長さ20cmのフィルム型感光性転写材料試片の保護フィルムを離型させながら、開始点よりの5cm地点から8cm地点まで離型させるのに必要な力を万能試験機(UTM、4303 series、Instron社)を用いて測定した。
幅3cm、長さ20cmのフィルム型感光性転写材料試片の保護フィルムを除去した後、110℃で速度2m/min、圧力4kgf/cm2で銅張積層板にラミネートした。その後、支持体フィルムを離型させながら、開始点よりの5cm地点から8cm地点まで離型させるのに必要な力をUTM(4303 series、Instron社)を用いて測定した。
幅3cm、長さ20cmのフィルム型感光性転写材料試片の保護フィルムを除去して銅張積層板に110℃、圧力4kgf/cm2の条件下に2m/minの速度でラミネートした後、支持体フィルムを除去した。ここに幅4cm、長さ25cm、厚さ19μmのPETフィルム(FDFR、Kolon社製)を110℃、圧力4kgf/cm2の条件下に2m/minの速度でラミネートした後、前記PETフィルムを離型させ始めて開始点よりの5cm地点から8cm地点まで離型させるのに必要な力をUTM(4303 series、Instron社)を用いて測定した。
前記製造されたポジティブ型フォトレジスト樹脂フィルムをコンタクト型露光器で露光量別に露光した後、常温で2.38重量%のTMAH水溶液に60秒間現像(但し、実施例1〜3の場合は64秒間現像)し、30秒間水洗して乾燥させた後、Line/Space1/1の微細パターンの形成に必要な露光量を測定した。この際、微細パターンの大きさは光学顕微鏡で観察した。
一方、現像後に残る未露光部分は回路を形成するが、この際、解像度を電子顕微鏡で観察した。
20:フォトレジスト層
30:樹脂保護層
40:支持体フィルム
50:銅張積層板
60:マスク
Claims (13)
- 支持体フィルム、樹脂保護層、光分解性フォトレジスト層、および保護フィルムを含み、樹脂保護層は、重量平均分子量5,000〜300,000のアクリル酸高分子およびポリアルキレングリコールを含み、支持体フィルムを剥がしてから、別途のPETフィルムを樹脂保護層上にラミネートした後、これを離型させ始めて開始点よりの5cm地点から8cm地点まで離型させることに必要な力で定義される粘着力が0.05kgf以下であることを特徴とする、フィルム型光分解性転写材料。
- 前記樹脂保護層は0.001〜10μmの厚さを有することを特徴とする、請求項1に記載のフィルム型光分解性転写材料。
- 前記樹脂保護層はアルカリ現像可能型であることを特徴とする、請求項1または2に記載のフィルム型光分解性転写材料。
- 前記光分解性フォトレジスト層はアルカリ可溶性樹脂およびジアジド系感光性化合物を含むことを特徴とする、請求項1または2に記載のフィルム型光分解性転写材料。
- 前記アルカリ可溶性樹脂はノボラック樹脂であることを特徴とする、請求項4に記載のフィルム型光分解性転写材料。
- 前記アルカリ可溶性樹脂はクレゾールノボラック樹脂であることを特徴とする、請求項4に記載のフィルム型光分解性転写材料。
- 前記クレゾールノボラック樹脂は、重量平均分子量(GPCによって測定するとき)が2,000〜30,000であることを特徴とする、請求項6に記載のフィルム型光分解性転写材料。
- 前記クレゾールノボラック樹脂は、メタクレゾール/パラクレゾールの含量が4:6〜6:4の重量比率で混合されたことを特徴とする、請求項7に記載のフィルム型光分解性転写材料。
- 前記クレゾールノボラック樹脂は、重量平均分子量(GPCによって測定するとき)8,000〜30,000のクレゾールノボラック樹脂と、重量平均分子量(GPCによって測定するとき)2,000〜8,000のノボラック樹脂とが7:3〜9:1の重量比率で混合された樹脂であることを特徴とする、請求項8に記載のフィルム型光分解性転写材料。
- 前記ジアジド系感光性化合物は、2,3,4,4’−テトラヒドロキシベンゾフェノン−1,2−ナフトキノンジアジド−5−スルホネート、2,3,4−トリヒドロキシベンゾフェノン−1,2−ナフトキノンジアジド−5−スルホネート、および(1−[1−(4−ヒドロキシフェニル)イソプロピル]−4−[1,1−ビス(4−ヒドロキシフェニル)エチル]ベンゼン)−1,2−ナフトキノンジアジド−5−スルホネートの中から選択された少なくとも1種であることを特徴とする、請求項4に記載のフィルム型光分解性転写材料。
- 前記光分解性フォトレジスト層は、2,3,4−トリヒドロキシベンゾフェノン、2,3,4,4’−テトラヒドロキシベンゾフェノン、および1−[1−(4−ヒドロキシフェニル)イソプロピル]−4−[1,1−ビス(4−ヒドロキシフェニル)エチル]ベンゼンの中から選択された少なくとも1種の感度増進剤を含むことを特徴とする、請求項1または4に記載のフィルム型光分解性転写材料。
- 前記保護フィルムは15〜30μmの厚さを有することを特徴とする、請求項1に記載のフィルム型光分解性転写材料。
- 請求項1または2に記載のフィルム型光分解性転写材料を用いてパターンを形成した表示素子用基板。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020080050596A KR101318517B1 (ko) | 2008-05-30 | 2008-05-30 | 필름형 광분해성 전사재료 |
| KR10-2008-0050596 | 2008-05-30 | ||
| PCT/KR2009/002653 WO2009145520A2 (en) | 2008-05-30 | 2009-05-20 | Film type photodegradable transfer material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011522284A JP2011522284A (ja) | 2011-07-28 |
| JP5140189B2 true JP5140189B2 (ja) | 2013-02-06 |
Family
ID=41377747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011511501A Expired - Fee Related JP5140189B2 (ja) | 2008-05-30 | 2009-05-20 | フィルム型光分解性転写材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8697328B2 (ja) |
| JP (1) | JP5140189B2 (ja) |
| KR (1) | KR101318517B1 (ja) |
| CN (1) | CN102047180B (ja) |
| TW (1) | TWI396945B (ja) |
| WO (1) | WO2009145520A2 (ja) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10260235B4 (de) * | 2002-12-20 | 2010-10-28 | Infineon Technologies Ag | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
| JP5672854B2 (ja) * | 2010-08-25 | 2015-02-18 | ソニー株式会社 | 構造体の製造方法 |
| KR20140081022A (ko) * | 2012-12-21 | 2014-07-01 | 삼성전기주식회사 | 산소 투과 방지막을 포함하는 드라이필름 포토레지스트 및 그 제조방법 |
| CN104407503B (zh) * | 2014-11-24 | 2016-07-06 | 上海新微技术研发中心有限公司 | 曝光方法和半导体器件的制造方法 |
| CN104965390A (zh) * | 2015-05-29 | 2015-10-07 | 王氏港建经销有限公司 | 一种运送多个基板依次通过曝光机的方法和系统 |
| WO2019088268A1 (ja) * | 2017-11-06 | 2019-05-09 | 旭化成株式会社 | 感光性樹脂積層体及びレジストパターンの製造方法 |
| CN111279804B (zh) * | 2017-12-20 | 2023-10-24 | 住友电气工业株式会社 | 制造印刷电路板和层压结构的方法 |
| WO2019146380A1 (ja) * | 2018-01-24 | 2019-08-01 | 富士フイルム株式会社 | 感光性転写材料及びその製造方法、樹脂パターンの製造方法、並びに、回路配線の製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2049972B (en) * | 1977-07-12 | 1982-06-23 | Asahi Chemical Ind | Photosensitive element for producing a printed circuit board |
| JP2992128B2 (ja) * | 1991-06-21 | 1999-12-20 | 日本合成化学工業株式会社 | フォトレジストフィルム |
| JPH0635200A (ja) * | 1992-07-17 | 1994-02-10 | Fuji Photo Film Co Ltd | 感光性転写シート及びレジストパターン形成方法 |
| JPH06118632A (ja) * | 1992-10-02 | 1994-04-28 | Kansai Paint Co Ltd | フイルム型紫外線感光性レジスト及びパターン形成方法 |
| JP3241144B2 (ja) * | 1993-02-19 | 2001-12-25 | 日立化成工業株式会社 | 感光性樹脂組成物積層体、レジストパターンの製造法、基板、プリント配線板の製造法、プリント配線板及び機器 |
| JPH1039513A (ja) * | 1996-07-19 | 1998-02-13 | Toyobo Co Ltd | 粘着防止層、それを用いた感光性樹脂積層体、その製造方法およびその包装体 |
| MY120763A (en) * | 1997-09-19 | 2005-11-30 | Hitachi Chemical Co Ltd | Photosensitive film, process for laminating photosensitive resin layer, photosensitive resin layer-laminated substrate and process for curing photosensitive resin layer |
| US6749909B2 (en) * | 2000-12-20 | 2004-06-15 | Ncr Corporation | Thermal transfer medium and method of making thereof |
| JP2002341525A (ja) * | 2001-05-14 | 2002-11-27 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト転写材料およびそれを用いた基板表面の加工方法 |
| JP3878451B2 (ja) * | 2001-10-22 | 2007-02-07 | 富士フイルムホールディングス株式会社 | 感光性樹脂転写材料、画像形成方法、カラーフィルターとその製造方法、フォトマスクとその製造方法 |
| DE10260235B4 (de) * | 2002-12-20 | 2010-10-28 | Infineon Technologies Ag | Verfahren zum Strukturieren einer Resistschicht und Negativ-Resistschicht |
| CN1882882A (zh) * | 2003-11-19 | 2006-12-20 | 大金工业株式会社 | 抗蚀剂层积体的形成方法 |
| JP2005215137A (ja) * | 2004-01-28 | 2005-08-11 | Fuji Photo Film Co Ltd | 感光性樹脂組成物、感光性転写材料、液晶配向制御用突起及びその製造方法、並びに液晶表示装置 |
| WO2006062348A1 (en) * | 2004-12-09 | 2006-06-15 | Kolon Industries, Inc | Positive type dry film photoresist and composition for preparing the same |
| KR101040994B1 (ko) * | 2006-04-13 | 2011-06-16 | 코오롱인더스트리 주식회사 | 포지티브형 포토레지스트 필름 |
| WO2007119949A1 (en) * | 2006-04-13 | 2007-10-25 | Kolon Industries, Inc | Composition for positive type photoresist and positive type photoresist film manufactured thereby |
| KR101017550B1 (ko) * | 2006-04-28 | 2011-02-28 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 감광성 수지 적층체 |
| US7670450B2 (en) * | 2006-07-31 | 2010-03-02 | 3M Innovative Properties Company | Patterning and treatment methods for organic light emitting diode devices |
-
2008
- 2008-05-30 KR KR1020080050596A patent/KR101318517B1/ko not_active Expired - Fee Related
-
2009
- 2009-05-20 CN CN200980119958XA patent/CN102047180B/zh not_active Expired - Fee Related
- 2009-05-20 JP JP2011511501A patent/JP5140189B2/ja not_active Expired - Fee Related
- 2009-05-20 US US12/995,137 patent/US8697328B2/en active Active
- 2009-05-20 WO PCT/KR2009/002653 patent/WO2009145520A2/en not_active Ceased
- 2009-05-27 TW TW098117739A patent/TWI396945B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW201001081A (en) | 2010-01-01 |
| CN102047180B (zh) | 2013-11-20 |
| WO2009145520A2 (en) | 2009-12-03 |
| WO2009145520A3 (en) | 2010-02-25 |
| TWI396945B (zh) | 2013-05-21 |
| JP2011522284A (ja) | 2011-07-28 |
| KR20090124394A (ko) | 2009-12-03 |
| US20110135891A1 (en) | 2011-06-09 |
| KR101318517B1 (ko) | 2013-10-16 |
| US8697328B2 (en) | 2014-04-15 |
| CN102047180A (zh) | 2011-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5140189B2 (ja) | フィルム型光分解性転写材料 | |
| JP4440975B2 (ja) | ポジティブ型ドライフィルムフォトレジスト | |
| JP4699482B2 (ja) | ポジティブ型ドライフィルムフォトレジストの製造方法 | |
| JP4800321B2 (ja) | ポジティブ型ドライフィルムフォトレジスト及びこれを製造するための組成物 | |
| JP5356603B2 (ja) | ドライフィルムフォトレジスト | |
| JP5048754B2 (ja) | ポジティブ型フォトレジスト用組成物およびこれから製造されたポジティブ型フォトレジストフィルム | |
| JP2008537597A (ja) | 表示装置用アレイ基板の製造方法 | |
| KR101335076B1 (ko) | 드라이 필름 포토레지스트 | |
| JP2010020321A (ja) | フィルム型光分解性転写材料 | |
| KR101324871B1 (ko) | 필름형 광분해성 전사재료 | |
| KR101291935B1 (ko) | 필름형 광분해성 전사재료 | |
| KR100793406B1 (ko) | 포지티브형 드라이 필름 포토레지스트 및 그 제조방법 | |
| KR101258733B1 (ko) | 드라이필름 포토레지스트 | |
| KR101325866B1 (ko) | 필름형 감광성 전사재료 | |
| JP2024085295A (ja) | 積層フィルム、積層フィルムの製造方法、及び、パターンレジスト膜付き基板の製造方法 | |
| KR20090127466A (ko) | 필름형 광분해성 전사재료 | |
| KR20100018340A (ko) | 필름형 전사재료 슬릿팅 롤 | |
| KR101374516B1 (ko) | 다층구조의 필름형 감광성 전사재료를 이용한 미세회로 패턴 형성방법 | |
| KR100987785B1 (ko) | 금속 전극의 제조방법 | |
| JP2025012688A (ja) | ドライフィルムレジスト | |
| KR101305803B1 (ko) | 다층구조의 필름형 감광성 전사재료 | |
| KR20070099072A (ko) | 금속 전극의 제조방법 | |
| KR20120044836A (ko) | 다층필름 | |
| KR20110056254A (ko) | 드라이필름 포토레지스트 | |
| KR20120044837A (ko) | 다층필름 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101130 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120524 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120529 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120724 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120731 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120925 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20121113 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20121116 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20151122 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |