JP5140495B2 - Etching device - Google Patents

Description

  The present invention relates to an etching apparatus.

  A number of complicated processes are performed on a printed circuit board that drives an electronic product. Among them, a circuit forming process, that is, an etching process plays a central role in transmitting an electrical signal.

  According to the conventional wet etching process, the substrate is transferred by a horizontal rotating roll (roll), and the substrate is etched by spraying an etching solution onto the substrate. In particular, in order to reduce damage to the substrate by the roll, The substrate was transferred by a three-point roll method in which only both sides and the middle part were supported by a roll.

  FIG. 2 is a schematic view showing an etching apparatus according to the prior art. As shown in FIG. 2, the etching apparatus 100 according to the related art supports the substrate 120 by a three-point roll 110, and jets an etching solution 130 onto the substrate 120 from the nozzle 140. Due to the etching solution 130 sprayed from 140, the substrate 120 is bent in the direction of gravity (downward in the figure) and the etching solution 130 accumulates.

  In this way, when the etching solution does not circulate and accumulates in a certain area, problems such as local over-etching and accumulation of foreign substances occur, resulting in low product yield and high density circuit formation. Therefore, there is a demand for an etching apparatus that can accelerate the flow of the etching solution.

  In view of the problems of the prior art, an object of the present invention is to provide an etching apparatus that can promote the flow of an etching solution on a substrate.

  According to one aspect of the present invention, a substrate support table for supporting a substrate, an injection nozzle for spraying an etchant onto the substrate, an outer peripheral edge of the substrate support table to facilitate the flow of the etchant, and etching An inhaler for collecting the liquid is provided.

  In order to facilitate the flow of the etchant, the substrate support may further include a discharger disposed on the outer peripheral edge of the substrate support so as to face the inhaler and ejecting auxiliary fluid onto the substrate. The substrate support can be tilted toward the inhaler so that the etchant flows into the inhaler. The spray nozzle can be tilted corresponding to the substrate support.

  In order to prevent the etchant from accumulating, an auxiliary nozzle disposed adjacent to the spray nozzle and spraying the auxiliary fluid onto the substrate may be further included. There may be a plurality of injection nozzles and auxiliary nozzles, and the auxiliary nozzles may be arranged between the injection nozzles. The spray nozzle may be a two-fluid nozzle.

  According to the embodiment of the present invention, it is possible to manufacture a substrate on which a high-density circuit is formed with a high yield by promoting the flow of the etching solution on the substrate.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an etching apparatus according to the present invention will be described in detail with reference to the accompanying drawings, and the same and corresponding components will be assigned the same drawing numbers and will be duplicated. Description is omitted.

  Further, the term “coupled” does not mean that the components are physically directly in contact with each other, but other configurations are interposed between the components, and the components are included in the other configurations. It is used as a concept that includes cases where they are in contact with each other.

  FIG. 1 is a schematic view showing an etching apparatus according to an embodiment of the present invention. Referring to FIG. 1, an etching apparatus 200, a substrate support 210, a substrate 220, an injection nozzle 230, an etching solution 240, an inhaler 250, a fluid suction unit 260, a discharger 270, a fluid supply unit 280, an auxiliary fluid 285, and an auxiliary nozzle 290 is shown.

  According to the present embodiment, the flow of the etching solution 240 sprayed onto the substrate 220 can be promoted by disposing the inhaler 250 on the outer peripheral edge of the substrate support 210 and collecting the etching solution 240. An etching apparatus 200 that can make the flow of the etching solution 240 flowing into the inhaler 250 smoother by disposing the discharge device 270 so as to face the container 250 and injecting the auxiliary fluid 285 is presented.

  Further, by tilting the substrate support 210 and the injection nozzle 230 in the direction of the inhaler 250, the etching solution 240 injected onto the substrate 220 can be more easily collected by the inhaler 250 and is adjacent to the injection nozzle 230. The etching apparatus 200 that can prevent the etching liquid 240 from locally collecting on the substrate 220 by ejecting the auxiliary fluid 285 from the auxiliary nozzle 290 is provided.

  In addition, by using a two-fluid nozzle as the injection nozzle 230, the etching apparatus 200 that can further accelerate the flow rate of the etching solution 240 is presented.

  The substrate support 210 can support the substrate 220, and the substrate 220 can be transferred by driving the substrate support 210 with a driving device (not shown). The drive device is normally used in the industry. For example, the drive device of the substrate support is rotationally controlled by microcomputer control to drive the substrate support. At this time, the substrate support 210 can be tilted toward the inhaler 250 so that the etching solution 240 sprayed from the spray nozzle 230 onto the substrate 220 can easily flow into the inhaler 250. The angle formed with the ground can be tilted so as to be 0 to 90 degrees.

  The substrate support 210 is tilted in the direction in which the inhaler 250 is arranged, and the substrate 220 supported thereby is tilted toward the inhaler 250, so that the etching solution 240 sprayed onto the substrate 220 is gravity. As a result, it flows into the inhaler 250 side, and the inhaler 250 can collect the etching solution 240 more easily. The inhaler 250 will be described in more detail later.

  The spray nozzle 230 can spray the etching solution 240 onto the substrate 220. That is, the spray nozzle 230 can be disposed on the substrate support base 210 corresponding to the position of the substrate support base 210, and the etching liquid 240 can be sprayed onto the substrate 220 to form, for example, a circuit pattern. it can.

  At this time, since the spray nozzle 230 can be tilted corresponding to the substrate support 210, and the etchant 240 can be sprayed substantially vertically onto the substrate 220 supported to be tilted by the substrate support 210, The surface of the substrate 220 can be etched more uniformly.

Further, the injection nozzle 230 may be a two-fluid nozzle capable of injecting air, argon (Ar), nitrogen (N ₂ ), or the like together with the etching solution 240, thereby increasing the injection pressure of the injection nozzle 230 to 10. Since it can be increased by a factor of two or more, the flow of the etching solution 240 can be increased to further accelerate the flow of the etching solution.

  In this case, since the etching solution 240 that has been reduced by reacting with the substrate 220 can be oxidized and regenerated with air or the like sprayed together with the etching solution 240, a necessary amount of additional additives for oxidizing and regenerating the etching solution 240 is required. The manufacturing cost of the substrate 220 can be reduced.

  The inhaler 250 is disposed on the outer peripheral edge of the substrate support 210 so that the flow of the etching solution 240 is promoted, and the etching solution 240 can be collected. That is, the inhaler 250 is disposed on one side of the substrate support 210 and can suck the etchant 240 sprayed onto the substrate 220 and collect it in the fluid suction part 260, thereby promoting the flow of the etchant 240. A high-density fine circuit pattern can be formed.

  The discharger 270 may be disposed on the outer peripheral edge of the substrate support 210 so as to face the inhaler 250 so that the flow of the etching solution 240 is promoted, and jet the auxiliary fluid 285 to the substrate 220. That is, the discharger 270 is disposed on the other side of the substrate support 210 corresponding to the inhaler 250, and for example, the auxiliary fluid 285 composed of the etching solution 240 and air can be ejected from the fluid supply unit 280, For this reason, the inhaler 250 can collect the etching solution 240 more easily.

  The auxiliary nozzle 290 is disposed adjacent to the spray nozzle 230 to prevent the etchant 240 from accumulating, and can spray the auxiliary fluid 285 onto the substrate 220. In addition, there may be a plurality of injection nozzles 230 and auxiliary nozzles 290, and the auxiliary nozzles 290 may be disposed between the injection nozzles 230, respectively.

  The auxiliary nozzle 290 is disposed adjacent to the injection nozzle 230, and the etching liquid 240 is accumulated by, for example, injecting the auxiliary fluid 285 composed of the etching liquid 240 and air into a region where the etching liquid 240 is locally accumulated. This can be prevented, and as a result, the flow of the etching solution 240 can be promoted.

  Further, by arranging the auxiliary nozzle 290 between the spray nozzles 230, the etchant 240 that is likely to stagnate in the space between the spray nozzles 230 is guided to flow smoothly to prevent the etchant 240 from accumulating. As a result, the flow of the etching solution 240 can be promoted. Note that the overall control of the etching apparatus may be, for example, a microcomputer control or any apparatus having performance equivalent to that of the microcomputer control. Liquid injection is performed. Various embodiments other than those described above are within the scope of the claims of the present invention.

It is the schematic which shows the etching apparatus by one Embodiment of this invention. It is the schematic which shows the etching apparatus by a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 200 Etching apparatus 210 Substrate support stand 230 Injection nozzle 250 Inhaler 260 Fluid suction part 270 Discharger 280 Fluid supply part 290 Auxiliary nozzle

Claims (4)

A substrate support for supporting the substrate;
An injection nozzle for injecting an etchant onto the substrate;
An inhaler that is disposed on an outer peripheral edge of the substrate support so as to facilitate the flow of the etchant and collects the etchant;
A discharger that is disposed on the outer periphery of the substrate support so as to face the inhaler so as to promote the flow of the etching solution, and jets an auxiliary fluid to the substrate;
In order to prevent the etching liquid from accumulating, an auxiliary nozzle that is disposed adjacent to the injection nozzle and injects an auxiliary fluid composed of an etching liquid and air on the substrate,
The injection nozzle and the auxiliary nozzle, Ri plurality der respectively,
Before SL auxiliary nozzle is provided between the injection nozzle, the etching liquid is arranged in the region accumulated locally,
Before SL substrate support is etched and wherein the the sides and the middle portion of the substrate is a three roll for supporting a roll. The etching apparatus according to claim 1, wherein the substrate support is inclined toward the inhaler so that the etching liquid flows to the inhaler. The etching apparatus according to claim 2, wherein the spray nozzle is inclined so as to correspond to the substrate support. The etching apparatus according to any one of claims 1 to 3, wherein the spray nozzle is a two-stream nozzle.

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