JP5145209B2 - Vacuum processing equipment - Google Patents

Description

  The present invention relates to the technical field of vacuum processing, and in particular, to a technology for carrying a plurality of substrates from the atmosphere into a vacuum atmosphere.

  Conventionally, a single-wafer type vacuum processing apparatus that processes substrates one by one in a vacuum atmosphere has been widely used. However, in a technical field such as a solar cell, a film forming process is performed on a small substrate. There is a demand to improve the processing speed by processing a plurality of substrates together.

  In this case, when processing each substrate, when the substrate is transferred between the hand and the pin and the substrate is transferred from the hand onto the mounting table in the vacuum processing chamber, the number of pins increases according to the number of the substrates. The number of holes through which the pins formed on the mounting table go in and out increases, making it difficult to provide a heater in the mounting table, and the contact area between the substrate and the mounting table decreases. In addition, there is a possibility that the small-diameter substrate falls off from the pins.

When multiple substrates are placed on a tray and transported with the tray viewed as a single substrate, a device with the same structure as before can be used and the problem of dropping off can be solved, but the tray is taken out together with the substrate to the atmosphere. When the substrate is carried into the vacuum atmosphere together with the tray, the adsorbed gas is released from the tray.
In addition, since the film is formed together with the tray, a thin film adheres to the tray and it is necessary to clean the tray in order to prevent generation of particles.

An apparatus for transporting a substrate in a vacuum atmosphere is described in, for example, the following document.
JP 2006-19544 A

  The present invention was created in order to solve the above-described problems of the prior art, and an object thereof is a technique for moving a plurality of substrates together from an atmospheric atmosphere into a vacuum chamber.

In order to solve the above-described problems, the present invention includes a processing vacuum chamber, a loading vacuum chamber and an unloading vacuum chamber respectively connected to the processing vacuum chamber, and the loading vacuum chamber and the processing vacuum chamber. The vacuum chamber and the unloading vacuum chamber are evacuated, a plurality of substrates arranged in the loading vacuum chamber are moved to the processing vacuum chamber, and vacuum processing is performed in the processing vacuum chamber, and then the unloading is performed. A vacuum processing apparatus for moving to a vacuum chamber for suction, wherein the suction vacuum chamber for transporting and the vacuum chamber for unloading are each provided with a suction portion for sucking a plurality of substrates arranged in a matrix in a non-contact state; A suction part moving device for moving the part up and down, and the same number of elongated fingers as the number of rows of the substrate to be sucked by the suction part in a horizontal plane in the same direction at the same interval as the row interval of the substrate. intake and placed hand portion, the front Symbol hand portion, the finger portion is the suction portion A first transfer position that is stationary immediately below each row of the substrate and a hand moving device that reciprocates between a predetermined second transfer position in the processing vacuum chamber, The processing vacuum chamber is disposed at a position lower than the hand unit, and can be mounted on a mounting table on which a plurality of substrates can be mounted, and is formed on the surface of the mounting table, and extends in the same direction as the finger unit extends. One or more grooves than the provided fingers, a plurality of horizontal bars extending in the same direction as the direction in which each of the grooves extends, and each of the horizontal bars being stationary in each of the grooves; And a vertical movement device that moves up and down between a position inside and a position higher than the height of the finger surface, and the width of the finger is a gap between the horizontal bars arranged in adjacent grooves And when the finger is stationary at the second transfer position, the finger A vacuum processing apparatus which is formed so as to be positioned directly above the gap between the bars.
Further, according to the present invention, the suction portion includes a suction surface directed vertically downward, a plurality of recesses formed in the suction surface and arranged in a matrix with the same interval as the substrate to be suctioned, and the inside of each recess A vacuum processing apparatus having a plurality of nozzles arranged on each of the nozzles and capable of jetting gas and a protrusion disposed outside the recess.
Further, the present invention is the vacuum processing apparatus according to the present invention, wherein the vertical movement device is located outside the mounting table and is vertically attached to an end portion of the horizontal bar, and has a support portion that moves the horizontal bar up and down.

The present invention has a processing vacuum tank and a loading vacuum tank connected to the processing vacuum tank, and the loading vacuum tank and the processing vacuum tank are evacuated to the loading vacuum tank. A vacuum processing apparatus for moving a plurality of arranged substrates to the processing vacuum chamber and performing vacuum processing in the processing vacuum chamber, wherein the plurality of substrates arranged in a matrix in the loading vacuum chamber An adsorbing part that adsorbs the adsorbing part in a non-contact state, and an adsorbing part moving device that moves the adsorbing part up and down, and the same number of elongated fingers as the number of rows of the substrate adsorbed to the adsorbing part, a hand portion with a line the same interval as the substrate arranged in the same direction in a horizontal plane, the front Symbol hand portion, first to the finger rests beneath the row of the substrate to be attracted to the suction unit Between the transfer position and a predetermined second transfer position in the processing vacuum chamber. Each of which is provided at a position lower than the hand unit, and is formed on the surface of the mounting table. One or more grooves that extend in the same direction as the direction in which the fingers extend, and a plurality of grooves that extend in the same direction as the direction in which each of the grooves extends and can rest in each of the grooves A horizontal bar, and a vertical movement device for moving the horizontal bar up and down between a position in the groove and a position higher than the height of the finger surface, and the width of the finger is defined by an adjacent groove. So that when the finger portion is stationary at the second transfer position, the finger portion is positioned directly above the gap between the horizontal bars. It may be a formed vacuum processing apparatus.
Further, the present invention may have more finger parts than the number of rows on the substrate, or may have one finger part.

The surface of the substrate is consistently directed upward, and the surface that is the film formation surface does not contact the suction device or the transport device.
Since a plurality of substrates are transported together without using a tray, the efficiency of vacuum processing is high, and cleaning of the tray is unnecessary.

Reference numeral 10 in FIG. 1 is a vacuum processing apparatus of the present invention.
The vacuum processing apparatus 10 includes a carry-in / delivery chamber 102a, a processing chamber 103, and a carry-out / delivery chamber 102b. The carry-in / delivery chamber 102a, the processing chamber 103, and the carry-out / delivery chamber 102b each have a carry-in vacuum chamber 112a, a process vacuum chamber 113, and a carry-out vacuum chamber 112b.

The carry-in vacuum tank 112a and the processing vacuum tank 113 are connected by a carry-in gate valve 123, and the process vacuum tank 113 and the carry-out vacuum tank 112b are connected by a carry-out gate valve 124.
A carry-in door 122 is provided between the carry-in vacuum tank 112a and the atmospheric atmosphere, and a carry-out door 125 is provided between the carry-out vacuum tank 112b and the atmospheric atmosphere.

  Vacuum exhaust devices 181a, 181b, and 182 are connected to the vacuum chambers 112a, 112b, and 113, respectively, the loading door 122 and the unloading door 125 are closed, and the vacuum chambers 181a, 181b, and 182 are used to close the vacuum chambers. When the insides of 112a, 112b, and 113 are evacuated to a vacuum atmosphere, the loading and unloading partition valves 123 and 124 are opened and closed to maintain the vacuum atmosphere of the processing vacuum tank 113 and carry in the loading vacuum tank. 112a and the unloading vacuum chamber 112b can be connected to the processing vacuum chamber 113.

On the other hand, when the carry-in gate valve 123 and the carry-out door 125 are opened while the carry-in gate valve 123 and the carry-out gate valve 124 are closed and dry air or N ₂ gas is introduced, a vacuum atmosphere inside the processing vacuum chamber 113 is obtained. In this state, the inside of the carrying-in vacuum chamber 112a and the inside of the carrying-out vacuum chamber 112b can be made into a dry air atmosphere (or N ₂ atmosphere).

  Here, outside the carry-in door 122 and the carry-out door 125, the carry-in chamber 101a and the carry-out chamber 101b, which are placed in an air atmosphere, are arranged, respectively, and the carry-in door 122 and the carry-out door 125 are opened. The inside of the carry-in vacuum chamber 112a and the inside of the carry-out vacuum chamber 112b are connected to the inside of the carry-in chamber 101a and the inside of the carry-out chamber 101b, respectively.

  In the carry-in chamber 101a and the carry-out chamber 101b, first and second atmosphere side carry-in devices 141 are respectively arranged. The first and second atmosphere side carry-in devices 141 have a moving plate 145 on which a substrate can be placed and a moving device 143 that moves the moving plate 145 in the horizontal direction. As shown in FIG. The substrates 31 are arranged in a matrix on the moving plate 145 of the first atmosphere side loading device 141 in the chamber 101a, the loading door 122 is opened, and the moving plate 145 is placed inside the loading vacuum chamber 112a of the loading / unloading chamber 102a. Carry in.

A first suction device 131a and a first transfer device 151a are provided inside the carry-in / delivery chamber 102a.
A second suction device 131b and a second transport device 151b are also provided inside the carry-out delivery chamber 102b, and the first suction device 131a and the second suction device 131b have the same configuration, and the same member Are described together with the same reference numerals.
The first and second suction devices 131a and 131b include a suction portion 135 and a suction portion moving device 133 that moves the suction portion 135 up and down.

As shown in FIG. 3, when the matrix-like substrate 31 is arranged on the moving plate 145 and loaded into the loading vacuum chamber 112 a, the moving plate 145 is stopped at a position below the main body of the suction unit 135.
A plurality of recesses 136 having a diameter smaller than that of the substrate 31 are formed on the suction surface 137 facing vertically below the suction part 135, and one recess 136 is provided on the inner peripheral surface of each recess 136 as shown in FIG. 15. A plurality of gas ejection holes 138 are arranged for each, and a plurality of protrusions 170 are arranged for each recess 136 on the outside of each recess 136.

The concave portions 136 are arranged in a matrix, and the substrates 31 on the moving plate 145 are arranged in the same matrix as the matrix of the concave portions 136. The matrix of the recesses 136 and the matrix of the substrates are directed in the same direction in the horizontal plane, and the moving plate 145 is stopped at a position where the substrates 31 are arranged one by one immediately below each recess 136.
In this state, when the suction portion 135 is lowered by the suction portion moving device 133, the concave portion 136 approaches the substrate 31.

FIG. 13 is an enlarged view of one substrate. This substrate 31 is a substrate for a solar cell, and is rounded so that four corners of a square form a part of a circle.
Here, four protrusions 170 are provided for each recess 136, and the protrusions 170 around each recess 136 are located outside the four sides adjacent to the four sides of the substrate 31 when the substrate 31 approaches the recess 136. It is formed to be arranged.

Accordingly, when the recess 136 approaches the substrate 31, the substrate 31 enters between the protrusions 170 as shown in FIG.
The lowering of the suction unit 135 is stopped after the substrate 31 enters between the protrusions 170 and before the suction surface contacts the surface of the substrate 31.

  A gas supply system 172 is provided outside the carry-in vacuum chamber 112a. When gas is supplied from the gas supply system 172 to each gas ejection hole 138, the substrate 31 and the suction unit 135 are in a non-contact state. A gas is jetted between the substrate 31 and the recess 136. The gas ejection direction from the gas ejection hole 138 is perpendicular to the radial direction, and the gas is ejected in the same circumferential direction on the circumference of the edge of one recess 136.

  Although a rotational force is applied to the substrate 31 by this gas, a part of the substrate 31 comes into contact with the protrusion 170 and the rotation is stopped. In a state in which the substrate 31 is stopped, a gas vortex 139 is formed between the surface of the substrate 31 and the surface of the recess 136, the inside of the recess 136 becomes negative pressure, and the substrate 31 is adsorbed by the recess 136 due to the differential pressure from the atmospheric pressure. The

  At this time, a flux of ejected gas is formed between the substrate 31 and the adsorption surface 137, and when the substrate 31 tries to contact the adsorption surface, it is pushed back by the repulsive force of the compressed flux. Is maintained in the state of being attracted to the recess 136 without contacting the suction surface.

  Therefore, as shown in FIG. 4, when the suction part 135 is moved upward by the suction part moving device 133, each substrate 31 is attracted to the suction part 135 in a non-contact state with the recess 136 and together with the suction part 135. Accordingly, the substrate 31 is removed from the moving plate 145.

  The first and second transport devices 151a and 151b include a hand unit 155 and a hand moving device 153 that moves the hand unit 155 in the horizontal direction. The hand unit 155 is positioned below the moving plate 145 that is carried into the carry-in vacuum chamber 112a or the carry-out vacuum vessel 112b, and the movable plate 145 is moved from the carry-in vacuum vessel 112a or the carry-out vacuum vessel 112b. When removed, it is located directly below the suction part 135.

  The hand portion 155 is provided with the same number of finger portions 156 as the number of rows or columns of the concave portions 136 arranged in a matrix as shown in FIG. Each finger part 156 is formed in an elongated shape and extends in the same direction as the direction in which the rows or columns of the recesses 136 extend.

  Here, the substrate 31 is moved from the loading vacuum chamber 112 a to the unloading vacuum chamber 112 b through the processing vacuum chamber 113 without changing the direction, and one of the rows or columns of the recesses 136 is moved by the substrate 31. Are arranged along the direction, and the other is arranged along a direction perpendicular to the other. When the moving direction of the substrate 31 is a row in the matrix of the recesses 136 and the substrate 31, each finger portion 156 follows the row. It extends in the direction.

When the first transfer position is directly below each row of the substrate 31, the hand unit 155 is stationary so that the finger unit 156 is positioned at the first transfer position.
When the suction unit 135 is lowered in this state, the substrate 31 in one row approaches one finger unit 156. The suction part moving device 133 is controlled so that the substrate 31 comes into contact with the finger part 156 or stops immediately before coming into contact therewith, and in this state, when the ejection of gas is stopped and the suction is released, FIG. As shown in FIG. 5B, the substrate 31 in one row rides on one finger portion 156, and the substrate 31 is placed on the hand portion 155 as shown in FIG.

  The adsorption of the substrate 31 to the adsorption device 135 is performed in a state where the inside of the carry-in vacuum chamber 112a or the carry-out vacuum vessel 112b is at or near the atmospheric pressure, and the first adsorption in the carry-in vacuum vessel 112a. After the adsorption of the device 131a is released, the loading door 122 between the loading vacuum chamber 112a and the loading chamber 101a is closed, and the inside of the loading vacuum chamber 112a is evacuated.

  The processing vacuum chamber 113 is placed in a vacuum atmosphere, and after the inside of the carrying-in vacuum chamber 112a is evacuated to a predetermined pressure and becomes the same pressure as the vacuum chamber for the processing chamber 103, the carrying-in partition valve 123 is The hand unit 155 is moved by the hand moving device 153 and is carried into the processing vacuum chamber 113 through the carry-in gate valve 123. The hand unit 155 is connected to the hand moving device 153 via the arm unit 154. The arm unit 154 slides in the vacuum chamber, and the hand unit 155 moves on the arm unit 154 with respect to the arm unit 154. Thus, the hand portion 155 can enter and leave the processing vacuum chamber 113 from the inside of the loading vacuum chamber 112a and the unloading vacuum chamber 112b.

A mounting table 165 and a transfer mechanism 161 are provided in the processing vacuum chamber 113.
As shown in FIG. 17, the transfer mechanism 161 includes one or more horizontal bars 162 more than the finger parts 156, a support part 163 connected to each end of each horizontal bar 162, and the support And a vertical movement device 164 for moving the portion 163 up and down.

Each support portion 163 is arranged vertically, each horizontal bar 162 is supported by the support portion 163, and when the vertical movement device 164 moves the support portion 163 up and down, each horizontal bar 162 moves up and down together with the support portion 163. .
Each horizontal bar 162 extends in the same direction as the direction in which the finger portion 156 extends, and is arranged in parallel with each other in the horizontal plane.

  Before the hand unit 155 enters the processing vacuum chamber 113, the horizontal bar 162 is positioned at a lower position than the hand unit 155. As shown in FIG. 6, the hand unit 155 is moved by the hand moving device 153. The finger portion 156 is stopped so as to be positioned immediately above the gap between the horizontal bar 162 and the horizontal bar 162.

  Assuming that the position of the hand unit 155 through which the horizontal bar 162 passes between the fingers 156 of the hand unit 155 and moves upward from below the hand unit 155 is the second transfer position, the second transfer position is As shown in FIG. 18A of the plan view and FIG. 18B of the side view thereof, the finger portion 156 is located at a position directly above the gap between the horizontal bar 162 and the horizontal bar 162.

Further, the second transfer position is such that the palm portion 157, which is the root of the finger portion 156 connected to the hand portion 155 main body, is arranged with the hand moving device 153 of each hand portion 155 rather than the horizontal bar 162 portion. Close to the vacuum chamber.
The width of the horizontal bar 162 is smaller than the width of the gap between the finger part 156 and the finger part 156, and the horizontal bar 162 does not collide with the palm part 157 when the horizontal bar 162 is raised. It can move above the finger 156 through the gap.

  As shown in FIG. 14B, each substrate 31 is larger than the width of the finger portion 156, a part of each side of each substrate 31 protrudes from the finger portion 156, and the horizontal bar 162 rises from below. Then, as for the back surface of each board | substrate 31 on one finger part 156, the part exposed to the one side of the finger part 156 contacts the same horizontal bar 162, and the part exposed to the other one side contacts the other same horizontal bar 162. Contact.

As shown in FIG. 7, when the horizontal bar 162 moves above the surface of the finger part 156, the substrate 31 in one row placed on the one finger part 156 is placed on the two horizontal bars 162. get on.
When each substrate 31 is transferred to the horizontal bar 162 in this way, each substrate 31 is separated from the finger portion 156, and the finger portion 156 is located between the support portions 163 of the horizontal bar 162. While returning the part 155 in the vacuum chamber 112a for carrying in, the horizontal bar 162 can be moved below rather than the position where the hand part 155 was stationary.

A mounting table 165 is disposed at a position where the horizontal bar 162 moves downward.
The mounting table 165 is formed so that the length in the same direction as the extending direction of the horizontal bar 162 is shorter than that of the horizontal bar 162, and the support portion 163 attached to the end of each horizontal bar 162 is connected to the mounting table 165. A through hole that is located outside and through which the support portion 163 is inserted is not formed in the mounting table 165.

  As shown in FIG. 19A of the plan view and FIG. 19B of the side view thereof, a groove 168 is formed at a position directly below each horizontal bar 162. Each groove 168 is shorter than the horizontal bar 162, and both ends are open to the outer periphery of the mounting table 165. When the horizontal bar 162 descends, each horizontal bar 162 enters the inside of the groove 168.

  The groove 168 is formed to a depth equal to or greater than the thickness of the entering horizontal bar 162. As shown in FIG. 8A and FIG. 20A of the plan view and FIG. 20B of the side view, the horizontal bar 162 is formed. When the surface of the substrate 31 is lowered to a height below the surface of the mounting table 165, the back surface of each substrate 31 on the horizontal bar 162 comes into contact with the surface of the mounting table 165.

  A heater 166 is disposed inside the mounting table 165. When the heater 166 is energized in advance to generate heat and the mounting table 165 is heated, the substrate 31 in contact with the mounting table 165 is removed from the mounting table 165. It is heated by heat conduction. When the horizontal bar 162 is positioned below the hand portion 155, the horizontal bar 162 is accommodated in the groove 168, the temperature is raised, and the back surface of the substrate 31 is brought into contact with the horizontal bar 162 in the groove 168. Is also heated by heat conduction from the horizontal bar 162.

  A shower plate 171 is disposed above the mounting table 165. A gas introduction system is arranged outside the processing vacuum chamber 113, the hand portion 155 of the first transfer device 151a is returned into the loading vacuum chamber 112a, the loading partition valve 123 is closed, and the loading vacuum chamber is closed. 112a and the processing vacuum chamber 113 are separated, a thin film source gas is supplied to the shower plate 171 from the gas introduction system, and a voltage is applied to the shower plate 171 while the source gas is dispersed into the processing vacuum chamber 113 from the shower plate 171. Is applied, plasma of the source gas is formed above the surface of the substrate 31 on the mounting table 165, and a thin film is formed on the surface of the substrate 31 by a chemical reaction.

Here, as a source gas, a compound gas containing Si and a compound gas reacting therewith are supplied, and a Si thin film is formed on the surface of the substrate 31 in the processing vacuum chamber 113.
On the other hand, on the side of the loading vacuum chamber 112a, after the hand portion 155 returns to the loading vacuum chamber 112a and the loading gate valve 123 is closed, the atmosphere is introduced into the loading vacuum chamber 112a and the loading door 122 is reached. Can be opened.

  New substrates 32 are arranged in a matrix and are placed on a moving plate 145 in the atmosphere-side transfer robot in the loading chamber 101a, and the moving plate 145 is loaded into the loading vacuum chamber 112a to be processed. While the thin film is growing on the surface of the substrate 31 in 113, as described above, the substrate 32 is transferred from the moving plate 145 to the finger portion 156 of the hand portion 155, and the moving plate 145 enters the carry-in chamber 101a. After returning, the loading door 122 is closed, and the inside of the loading vacuum chamber 112a is evacuated while the unprocessed substrate 32 is placed on the hand.

In the processing vacuum chamber 113, when a thin film having a predetermined thickness is formed on the surface of the substrate 31, the voltage is stopped and the plasma is extinguished.
Next, the horizontal bar 162 is raised, the substrate 31 is transferred from the surface of the mounting table 165 onto the horizontal bar 162, and is stopped at a position higher than the moving height of the hand portion 155 in the unloading vacuum chamber 112b.

Next, as shown in FIG. 9, the carry-out gate valve 124 is opened, and the hand portion 155 in the carry-out vacuum tank 112 b is moved into the processing vacuum tank 113.
Since the support part 163 which supports the horizontal bar 162 is attached to the horizontal bar 162 at both end positions of the horizontal bar 162, the hand part 155 of the second transport device 151b in the unloading vacuum chamber 112b has the finger part 156. The direction extending from the root position to the tip is opposite to the finger portion 156 of the hand portion 155 of the first transfer device 151a in the loading vacuum chamber 112a, that is, the hand portion 155 of the second transfer device 151b is for processing. When moved into the vacuum chamber 113, the side closer to the unloading vacuum chamber 112 b is the base palm portion 157, and when entering the processing vacuum chamber 113, the finger portion 156 passes between the support portions 163. It moves to below the gap between the horizontal bars 162 and stops before the base portion of the finger portion 156 comes into contact with the support portion 163.

Both ends of the substrate 31 are placed on the horizontal bar 162 on the horizontal bar 162. When the horizontal bar 162 is lowered in this state, the central part of each substrate 31 is on the finger portion 156 as shown in FIG. get on.
As described above, after the substrate 31 is transferred from the horizontal bar 162 onto the hand unit 155 of the second transport device 151b, the hand unit 155 moves from the horizontal bar 162 with the substrate 31 placed thereon. Returning into the unloading vacuum chamber 112b, the unloading gate valve 124 is closed.

  At this time, the unprocessed substrate 32 is placed on the hand of the first transfer device 151a and is waiting, and after the inside of the loading vacuum chamber 112a is evacuated to a predetermined pressure, the loading gate valve 123 is opened. The substrate 32 is opened and the non-film-formed substrates 32 arranged in a matrix are arranged on the mounting table 165, and the formation of the thin film is started.

  The hand unit 155 of the second transfer device 151b is located immediately below the second suction device 131b with the substrate 31 on which a thin film is formed, and after the discharge gate valve 124 is closed, After the atmosphere is introduced into the vacuum chamber 112b and the atmospheric pressure is reached, the unloading door 125 is opened, the second suction device 131b is lowered, and the substrate 31 on the finger portion 156 is brought into contact with the suction portion 135 without contact. Adsorb.

  As shown in FIG. 11, after moving the suction part 135 of the second suction device 131b upward, the unloading door 125 is opened, and the second atmosphere side loading device is opened from the unloading chamber 101b into the unloading vacuum chamber 112b. 141 moving plate 145 is inserted and positioned just below the suction device.

  When the suction device is lowered and the lowering is stopped when the back surface of the substrate 31 comes into contact with or just before the moving plate 145 and the suction is released, the substrate 31 is placed on the moving plate 145 as shown in FIG. When the movable plate 145 is returned to the carry-out chamber 101b, the substrate 31 that has been subjected to vacuum processing can be taken out of the vacuum processing apparatus 10.

  At this time, in the processing vacuum chamber 113, a thin film is grown on the surface of the loaded substrate 32, and after this thin film is formed to a predetermined thickness, it is transferred to the unloading chamber 101b by the same procedure as described above. The substrate 33 taken out from the vacuum processing apparatus 10 and carried into the processing vacuum chamber 113 from the carry-in chamber 101a is vacuum-processed.

As described above, the present invention can vacuum-process a plurality of substrates together without using a tray, does not require tray cleaning, and does not place a substrate on the tip of a pin. There is little risk of dropping off.
In the above embodiment, the vacuum process is a film forming process for forming a thin film on the substrate. However, the present invention is not limited to this, and widely includes a vacuum process performed in a vacuum atmosphere.

Sectional drawing explaining an example of the vacuum processing apparatus of this invention Sectional drawing explaining the state before carrying in the vacuum chamber of a board | substrate about an example of the vacuum processing apparatus of this invention Sectional drawing explaining the state at the time of carrying in the vacuum tank for carrying in a board | substrate about an example of the vacuum processing apparatus of this invention Sectional drawing explaining the state in the time before a board | substrate is mounted in a 1st conveying apparatus about an example of the vacuum processing apparatus of this invention. Sectional drawing explaining the state in the time of the board | substrate being mounted in the 1st conveying apparatus about an example of the vacuum processing apparatus of this invention Sectional drawing explaining the state at the time of moving a board | substrate on the 1st conveyance apparatus about the example of the vacuum processing apparatus of this invention, and moving right above the transfer mechanism which has arrange | positioned the horizontal bar | burr. Sectional drawing explaining the state in the time of the board | substrate being transferred to the transfer mechanism which has arrange | positioned the horizontal bar from the 1st conveying apparatus about an example of the vacuum processing apparatus of this invention. Sectional drawing explaining the state in the time when the board | substrate transferred to the transfer mechanism which has arrange | positioned the horizontal bar about the example of the vacuum processing apparatus of this invention is formed into a film Sectional drawing explaining the state before the board | substrate by which the film-forming process was carried out about an example of the vacuum processing apparatus of this invention was transferred to the 2nd conveying apparatus from the transfer mechanism which has arrange | positioned the horizontal bar | burr Sectional drawing explaining the state in the time of the board | substrate by which film-forming processing was carried out about an example of the vacuum processing apparatus of this invention being transferred to the 2nd conveyance apparatus from the transfer mechanism which has arrange | positioned the horizontal bar | burr Sectional drawing explaining the state in the time before the board | substrate by which film-forming processing was carried out about an example of the vacuum processing apparatus of this invention leaves | separates from a 2nd conveying apparatus, and is carried out. Sectional drawing explaining the state in the time of the board | substrate by which the film-forming process was carried out about an example of the vacuum processing apparatus of this invention being transferred to the atmosphere side carrying-in apparatus and carrying out The top view explaining an example of the board | substrate which is a process target of this invention (A), (b) The top view explaining one state of an example of the member provided in the conveying apparatus member of this invention The top view explaining one state of an example of the member provided in the adsorption | suction apparatus member of this invention The top view explaining another state of an example of the member provided in the adsorption | suction apparatus member of this invention The top view explaining one state of an example of the member provided in the transfer mechanism member of this invention (A), (b) The top view explaining one state at the time of transferring the process target board | substrate in this invention. (A), (b) The top view explaining another state at the time of transferring the process target board | substrate in this invention. (A), (b) The top view explaining the state before and behind the film-forming of the process target board | substrate in this invention

Explanation of symbols

112a …… Vacuum chamber for loading 113 …… Vacuum chamber for processing 112b …… Vacuum chamber for unloading 133 …… Suction portion moving device 135 …… Suction portion 136 …… Recess portion 170 …… Protrusion 138 …… Blowout hole 153 …… Hand Moving device 155 …… Hand portion 162 …… Horizontal bar 163 …… Supporting portion 164 …… Vertical moving device 165 …… Place 168 …… Groove 31 …… Substrate

Claims (3)

A vacuum chamber for processing, a vacuum chamber for loading and a vacuum chamber for unloading respectively connected to the vacuum chamber for processing, and vacuuming the vacuum chamber for loading, the vacuum chamber for processing, and the vacuum chamber for unloading A vacuum processing apparatus that evacuates and moves a plurality of substrates disposed in the loading vacuum chamber to the processing vacuum chamber, vacuums the substrate in the processing vacuum chamber, and then moves the substrate to the unloading vacuum chamber. And
In the carrying-in vacuum tank and the carrying-out vacuum tank,
An adsorbing portion that adsorbs a plurality of substrates arranged in a matrix in a non-contact state;
A suction part moving device for moving the suction part up and down;
Is provided,
Fingers of the same number of elongated rows of the substrate to be attracted to the suction unit, and a hand portion disposed in a horizontal plane in the same direction in a row the same interval as the substrate,
The front Symbol hand portion, a first transfer position where the finger is still beneath the row of the substrate to be attracted to the suction portion, of the predetermined second transfer position of the processing vacuum tank And a hand moving device that reciprocates between them,
In the processing vacuum chamber,
Placed at a position lower than the hand unit, a mounting table capable of mounting a plurality of substrates,
One or more grooves formed on the surface of the mounting table and extending in the same direction as the direction in which the finger portion extends, and more than one groove,
A plurality of horizontal bars extending in the same direction as the direction in which each of the grooves extends, and capable of resting in each of the grooves,
A vertical movement device for moving the horizontal bar up and down between a position in the groove and a position higher than the height of the finger surface;
Is provided,
The width of the finger is formed smaller than the gap between the horizontal bars arranged in adjacent grooves,
A vacuum processing apparatus formed such that when the finger portion is stationary at the second transfer position, the finger portion is positioned directly above a gap between horizontal bars.   The suction part includes a suction surface that is directed vertically downward, a plurality of recesses that are formed on the suction surface and are arranged in a matrix at the same interval as the substrate to be suctioned, and a plurality of the suction parts are disposed in each recess. The vacuum processing apparatus according to claim 1, further comprising an ejection hole through which gas can be ejected and a protrusion disposed outside the recess.   3. The vertical movement device according to claim 1, further comprising a support portion that is positioned outside the mounting table and is vertically attached to an end portion of the horizontal bar, and moves the horizontal bar up and down. The vacuum processing apparatus as described.

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