JP5147337B2 - fuse - Google Patents

Description

  The present invention relates to a fuse used in a circuit that controls power supply to a load via a relay circuit.

  For example, an electric junction box and an in-vehicle electronic control unit mounted on an automobile have a function of distributing battery power to a predetermined load. As shown in FIG. 10, such a conventional electrical junction box 100 is supplied with a fuse 102 that receives a current from the battery 101 and prevents an excessive current from being supplied from the battery 101, and the fuse 102. A semiconductor relay 103 for energizing or de-energizing the load 110 and a relay control circuit (not shown) for controlling the semiconductor relay 103 are provided. The semiconductor relay 103 is mounted on a substrate 104 accommodated in the housing 100a. The relay control circuit is formed by electronic components (not shown) mounted on the board 104 and a circuit pattern (not shown) formed on the board 104. A conventional example in which the semiconductor relay 103 is mounted on the substrate 104 in the housing 100a is disclosed in Patent Document 1.

  As another conventional example, as shown in FIG. 11, a mechanical relay 105 may be used instead of the semiconductor relay 103, and the mechanical relay 105 is mounted on the substrate 104 like the semiconductor relay 103. In FIG. 11, the same components as those in the conventional example are denoted by the same reference numerals, and redundant description is omitted.

As shown in FIG. 12, the fuse 102 is a plug-in type that is attached to a tuning fork terminal (not shown) provided in the housing 100a of the electrical connection box 100, and is parallel to the first connection terminal portion 102a. A second connection terminal portion 102b disposed and a fuse element portion 102c interposed between the terminals 102a and 102b, and the locations of the first and second connection terminal portions 102a and 102b excluding the mating terminal connection location; The fuse element portion 102c is integrated by being sealed with a mold resin sealing portion 102d. The tuning fork terminal to which the fuse 102 is attached is provided outside the housing for the convenience of maintenance and inspection.
JP 2002-359349 A

  However, in the conventional example, since the semiconductor relay 103 and the mechanical relay 105, which are heat sources, are mounted on the substrate 104 in the housing 100a, it is necessary to secure an installation space for the semiconductor relay 103 and the mechanical relay 105 on the substrate 104 or the like. . Therefore, the substrate 104, and thus the casing 100a in which the substrate 104 is built, becomes a factor of increasing the size. Further, since the relay circuit is a heat source, it is necessary to use a high heat dissipation material or a high heat resistant material for the substrate 104 or the like, which increases the cost. Furthermore, when the semiconductor relay 103 or the mechanical relay 105 fails, it is necessary to replace the entire substrate 104, and maintenance is poor.

  Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a fuse that can solve various problems caused by housing a relay circuit in a housing.

The invention according to claim 1 is a first connection terminal portion connected to the power supply side, a second connection terminal portion connected to the load side, a third connection terminal portion connected to the relay control circuit side, and the first 1 comprises a fuse element portion connected at one end to a connection terminal portion, and a relay circuit in which conduction and non-conduction between the drain electrode and the source electrode are made based on a control signal inputted to the gate electrode, A semiconductor relay in which the source electrode is electrically connected to the second connection terminal portion and the gate electrode is electrically connected to the third connection terminal portion, respectively, on the other end side of the fuse element portion, the third and the semiconductor relay connection terminal portion and the fuse element portion is integrated by sealing, the fuse element portion and the first connection terminal portion is integrally formed from the base material of the bus bar A fuse which is characterized the door.

The invention of claim 2 includes a first connection terminal connected to the power supply side, a second connection terminal connected to the load, a third connection terminal connected to the relay control circuit, and the first 1 comprises a fuse element portion connected at one end to a connection terminal portion, and a relay circuit in which conduction and non-conduction between the drain electrode and the source electrode are made based on a control signal inputted to the gate electrode, A semiconductor relay in which the source electrode is electrically connected to the second connection terminal portion and the gate electrode is electrically connected to the third connection terminal portion, respectively, on the other end side of the fuse element portion, The third connection terminal portion, the fuse element portion, and the semiconductor relay are integrated by sealing, and the semiconductor relay has one surface of the drain electrode, the source electrode, and the gate electrode. The semiconductor relay electrode portion is connected to the other end of the fuse element portion, and the semiconductor relay is directly mounted on the semiconductor placement electrode portion. The first connection terminal portion, the fuse element portion, and the semiconductor placement electrode portion are integrally formed from a base material of a bus bar .

According to a third aspect of the present invention, in the fuse according to the first or second aspect, the fuse element portion includes the first connection terminal portion between the first connection terminal portion and the second connection terminal portion. The fuse is extended from the second connection terminal portion toward the second connection terminal portion .

According to the first aspect of the present invention, since the semiconductor relay is built in the fuse, it is not necessary to mount the semiconductor relay on a substrate or to secure the installation space. Therefore, when a relay function is given to an electrical junction box or the like, it is only necessary to externally attach a fuse to the electrical junction box or the like. It becomes. The reduction in the size of the substrate and the housing reduces the weight and the cost. In addition, since it is not necessary to mount a relay circuit as a heat source on a substrate or the like in the electrical junction box, it is not necessary to use a high heat dissipation material or a high heat resistant material for the substrate or the like, which also reduces the cost. Furthermore, when the semiconductor relay fails, only the fuse needs to be replaced, so that maintainability is improved. Further, since the fuse element portion can be manufactured at the same time when the first connection terminal portion is manufactured, the manufacturing process of the fuse can be simplified.

According to the invention of claim 2, since the semiconductor relay is built in the fuse, it is not necessary to mount the semiconductor relay on a substrate or to secure the installation space. Therefore, when a relay function is given to an electrical junction box or the like, it is only necessary to externally attach a fuse to the electrical junction box or the like. It becomes. The reduction in the size of the substrate and the housing reduces the weight and the cost. In addition, since it is not necessary to mount a relay circuit as a heat source on a substrate or the like in the electrical junction box, it is not necessary to use a high heat dissipation material or a high heat resistant material for the substrate or the like, which also reduces the cost. Furthermore, when the semiconductor relay fails, only the fuse needs to be replaced, so that maintainability is improved. In addition, if the semiconductor relay is mounted on the electrode for semiconductor placement, the connection work of one electrode is completed, so that the manufacturing process of the fuse can be simplified. In addition, since the fuse element portion and the semiconductor placement electrode portion can be manufactured at the same time when the first connection terminal portion is manufactured, the manufacturing process of the fuse can be simplified.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2 show a first embodiment of the present invention, FIG. 1 is a conceptual diagram of a circuit and the like of an electrical junction box, and FIG. 2 is a front view of a fuse.

  As shown in FIG. 1, the electrical junction box 1 is supplied with a current from a battery 2 as a power source, a fuse 10 </ b> A that prevents an excessive current from being supplied from the battery 2, and a fuse 10 </ b> A. A semiconductor relay 11A for energizing or de-energizing the load 3 and a relay control circuit (not shown) for controlling the semiconductor relay 11A are provided.

  The fuse 10A is of a plug-in type and is attached to a tuning fork terminal (not shown) arranged outside the housing 1a. The fuse 10A incorporates a semiconductor relay 11A, and its detailed configuration will be described in detail below. The relay control circuit (not shown) is formed by an electronic component (not shown) mounted on the board 20 in the housing 1a and a circuit pattern (not shown) formed on the board 20.

  Next, a detailed configuration of the fuse 10A will be described. As shown in FIG. 2, the fuse 10A includes a first connection terminal portion 12 connected to the battery 2 side, a second connection terminal portion 13 connected to the load 3 side, and a second connection terminal connected to the relay control circuit side. 3 connection terminal part 14, fuse element part 15, and semiconductor relay 11 </ b> A mounted on second connection terminal part 13. The fuse 10 </ b> A is integrated by sealing the locations of the first to third connection terminal portions 12, 13, 14, the fuse element portion 15, and the semiconductor relay 11 </ b> A excluding each counterpart terminal connection location with a mold resin sealing portion 16. It has become.

  The first connection terminal portion 12 and the fuse element portion 15 are integrally formed, and the first connection terminal portion 12 and one end side of the fuse element portion 15 are connected. The integral structure of the first connection terminal portion 12 and the fuse element portion 15 is manufactured, for example, by subjecting the base material of the bus bar to press working and cutting.

  The semiconductor relay 11A is a bare chip such as an FET, and has a source electrode (not shown) arranged on the lower surface thereof, a drain electrode (not shown) and a gate electrode (not shown) respectively arranged on a part of the upper surface. ). A relay circuit is formed in which the drain electrode and the source electrode are made conductive / non-conductive based on a control signal input to the gate electrode. The drain electrode is electrically connected to the other end side of the fuse element portion 15 via a bonding wire 17a. The source electrode is electrically connected by soldering the semiconductor relay 11 </ b> A to the second connection terminal portion 13. The gate electrode is electrically connected to the third connection terminal portion 14 via a bonding wire 17b.

  In the above configuration, since the semiconductor relay 11A is built in the fuse 10A, it is not necessary to mount the semiconductor relay 11A on the substrate 20 or the like as in the conventional example or to secure the installation space. Accordingly, since the fuse 10A is simply attached to the electrical junction box 1 or the like, the substrate 20 incorporated in the electrical junction box 1 and, consequently, the housing 1a such as the electrical junction box 1 is reduced. By reducing the size of the substrate 20 and the housing 1a, the electrical junction box 1 can be reduced in weight and cost. Further, since it is not necessary to mount a relay circuit as a heat source on the substrate 20 or the like in the electrical junction box 1, it is not necessary to use a high heat dissipation material or a high heat-resistant material for the substrate 20 or the like, thereby reducing the cost. Become. Further, when the semiconductor relay 11A fails, only the fuse 10A needs to be replaced, so that maintainability is improved.

  In the first embodiment, the semiconductor relay 11A has a lower surface formed as a source electrode, and the semiconductor relay 11A is directly mounted on the second connection terminal portion 13, so that the semiconductor placement electrode portion is manufactured separately. Therefore, the fuse configuration can be simplified. Moreover, since the operation | work which electrically connects between 11 A of semiconductor relays and the 2nd connection terminal part 13 is unnecessary, the manufacturing process of fuse 10A can be simplified.

  In the first embodiment, since the first connection terminal portion 12 and the fuse element portion 15 are integrally formed, the manufacturing process of the fuse 10A can be simplified.

  FIG. 3 is a front view of the fuse according to the second embodiment of the present invention.

  As shown in FIG. 3, the fuse 10B includes a first connection terminal portion 12 connected to the battery side, a second connection terminal portion 13 connected to the load side, and a third connection connected to the relay control circuit side. A terminal portion 14, a fuse element portion 15, a semiconductor placement electrode portion 18, and a semiconductor relay 11 </ b> B mounted on the semiconductor placement electrode portion 18 are provided. In the fuse 10B, the first to third connection terminal portions 12, 13, and 14 except for each counterpart terminal connection portion, the fuse element portion 15, the semiconductor placement electrode portion 18 and the semiconductor relay 11B are molded resin sealing portions 16. It is integrated by being sealed.

  The first connection terminal portion 12, the fuse element portion 15, and the semiconductor placement electrode portion 18 are integrally formed, the first connection terminal portion 12 and one end side of the fuse element portion 15 are connected, and the other end side of the fuse element portion 15 is connected. The semiconductor placement electrode unit 18 is connected. The integral structure of the first connection terminal portion 12, the fuse element portion 15, and the semiconductor arrangement electrode portion 18 is manufactured, for example, by subjecting the base material of the bus bar to pressing and cutting.

  The semiconductor relay 11B is a bare chip such as an FET, and has a drain electrode (not shown) arranged on the lower surface thereof, a source electrode (not shown) and a gate electrode (not shown) arranged on a part of the upper surface. ). A relay circuit is formed in which the drain electrode and the source electrode are made conductive / non-conductive based on a control signal input to the gate electrode. The drain electrode is electrically connected to the other end side of the fuse element portion 15 by being soldered to the semiconductor arrangement electrode portion 18. The source electrode is electrically connected to the second connection terminal portion 13 via a bonding wire 17c. The gate electrode is electrically connected to the third connection terminal portion 14 via a bonding wire 17d.

  Also in the fuse 10B of the second embodiment, various effects resulting from the fact that it is not necessary to mount the relay circuit on the substrate can be obtained as in the case of the first embodiment.

  Further, in the second embodiment, the semiconductor relay 11B has a semiconductor placement electrode portion 18 connected to the other end side of the fuse element portion 15 while having a lower surface formed as a drain electrode. Since the semiconductor relay 11B is directly mounted on the electrode section 18, the mounting process of one electrode is completed if the semiconductor relay 11B is mounted on the semiconductor placement electrode section 18, so that the manufacturing process of the fuse 10B can be simplified. .

  In the second embodiment, since the first connection terminal portion 12, the fuse element portion 15, and the semiconductor placement electrode portion 18 are integrally formed, the manufacturing process of the fuse 10B can be simplified.

  FIG. 4 is a front view of a fuse according to a third embodiment of the present invention.

  As shown in FIG. 4, the fuse 10C includes a first connection terminal portion 12 connected to the battery side, a second connection terminal portion 13 connected to the load side, and a third connection connected to the relay control circuit side. A terminal portion 14, a fuse element portion 15, and a semiconductor relay 11 </ b> A mounted on the second connection terminal portion 13 are provided. In the fuse 10C, the locations of the first to third connection terminal portions 12, 13, 14 excluding each counterpart terminal connection location, the fuse element portion 15A, and the semiconductor relay 11A are sealed with the mold resin sealing portion 16. It is integrated by.

  The fuse element portion 15A is made of a low melting point metal (for example, a Zn alloy) and is formed in a wire shape. The wire-shaped fuse element portion 15A is interposed between the first connection terminal portion 12 and the drain electrode (not shown) of the semiconductor relay 11A by wire bonding.

  The semiconductor relay 11A is similar to the first embodiment, and is a bare chip such as an FET. A source electrode (not shown) disposed on the lower surface of the semiconductor relay 11A and a drain electrode (not illustrated) respectively disposed on a part of the upper surface. And a gate electrode (not shown). A relay circuit is formed in which the drain electrode and the source electrode are made conductive / non-conductive based on a control signal input to the gate electrode. As described above, the drain electrode is electrically connected to the other end of the wire-shaped fuse element portion 15A. The source electrode is electrically connected by soldering the semiconductor relay 11 </ b> A to the second connection terminal portion 13. The gate electrode is electrically connected to the third connection terminal portion 14 via a bonding wire 17e.

  Also in the fuse 10C of the third embodiment, various effects resulting from the fact that the relay circuit does not need to be mounted on the substrate 20 can be obtained as in the case of the first embodiment.

  In the third embodiment, the lower surface of the semiconductor relay 11A is formed as a source electrode, and the semiconductor relay 11A is directly mounted on the second connection terminal portion 13, so that the same as in the first embodiment. In addition, it is not necessary to separately manufacture the electrode portion for semiconductor arrangement, and the fuse configuration can be simplified. Moreover, since the operation | work which electrically connects between 11 A of semiconductor relays and the 2nd connection terminal part 13 is unnecessary, the manufacturing process of fuse 10C can be simplified.

  In the third embodiment, the fuse element portion 15A is made of a low-melting-point metal and is formed in a wire shape, and the wire-like fuse element portion 15A is bonded to the first connection terminal portion 12 and the semiconductor. It is interposed between the drain electrodes of the relay 11A. Therefore, since the fuse element portion 15A can be easily manufactured, the fuse configuration can be simplified. Further, since the melting point of the fuse element portion 15A can be easily adjusted, the fuse 10C having desired fuse characteristics can be easily manufactured.

  5 to 7 show a fourth embodiment of the present invention, FIG. 5 is a conceptual diagram of a circuit and the like of an electrical junction box, FIG. 6 is a front view of the fuse, and FIG. 7 is a perspective view of the fuse.

  As shown in FIG. 5, the electrical junction box 1 is supplied with a current from a battery 2 as a power source and a fuse 10 </ b> D that prevents an excessive current from being supplied from the battery 2 and the fuse 10 </ b> D. The semiconductor relay 11A for energizing or de-energizing the load 3, the semiconductor relay driving element 30A for driving the semiconductor relay 11A, and the semiconductor relay 11A are controlled via the semiconductor relay driving element 30A. And a relay control circuit 31.

  The fuse 10D is of a plug-in type and is attached to a tuning fork terminal (not shown) arranged outside the housing 1a. The fuse 10D incorporates a semiconductor relay 11A and a semiconductor relay driving element 30A, and the detailed configuration thereof will be described in detail below. The relay control circuit 31 includes a charge pump circuit 31a and a control switch SW1. In this embodiment, since the semiconductor relay 11A is an N-channel MOS type and is high-side driven, the charge pump circuit 31a is necessary.

  Next, a detailed configuration of the fuse 10D will be described. As shown in FIG. 6, the fuse 10D is connected to the first connection terminal portion 12 connected to the battery 2 side, the second connection terminal portion 13 connected to the load 3 side, and the relay control circuit 31 side. The third connection terminal portion 14, the fuse element portion 15B, the semiconductor relay 11A mounted on the second connection terminal portion 13, the semiconductor relay driving element 30A also mounted on the second connection terminal portion 13, and the relay terminal Part 32.

  Each of the connection terminal portions 12, 13, 14, the fuse element portion 15 and the relay terminal portion 32 is formed of a separate bus bar material.

  The semiconductor relay 11A is a bare chip such as an N-channel MOS FET. 11 A of semiconductor relays have the source electrode (not shown) arrange | positioned at the lower surface, and the drain electrode (not shown) and gate electrode (not shown) which were each arrange | positioned at a part of upper surface. A relay circuit is formed in which the drain electrode and the source electrode are made conductive / non-conductive based on a control signal input to the gate electrode. The drain electrode is electrically connected to the relay terminal portion 32 via a bonding wire 17f. The source electrode is electrically connected by soldering the semiconductor relay 11 </ b> A to the second connection terminal portion 13. The gate electrode is electrically connected to an output electrode (not shown) of the semiconductor relay driving element 30A via a bonding wire 17g.

  The semiconductor relay driving element 30A is a bare chip, and includes a source side electrode (not shown) arranged on the lower surface thereof, an input electrode (not shown) arranged on a part of the upper surface, and an output electrode (not shown). (Not shown). The source side electrode is electrically connected by soldering the semiconductor relay driving element 30 </ b> A to the second connection terminal portion 13. The input electrode is connected to the third connection terminal portion 14 via a bonding wire 17h.

  The locations of the first to third connection terminal portions 12, 13, 14 excluding each counterpart terminal connection location, the relay terminal portion 32, the semiconductor relay 11 </ b> A, and the semiconductor relay driving element 30 </ b> A are sealed with a mold resin sealing portion 40. It is integrated by doing. Further, the fuse connection portions 12 a and 32 a of the first connection terminal portion 12 and the relay terminal portion 32 are exposed to the outside without being sealed by the mold resin sealing portion 40.

  Both ends of the fuse element portion 15B are connected to both the fuse connection portions 12a and 32a exposed from the mold resin sealing portion 40 by soldering or the like. The mold resin sealing portion 40 and the fuse element portion 15B are accommodated in the case 41, whereby the fuse 10E is integrated as a whole (see FIG. 7).

  In the above configuration, since the semiconductor relay 11A and the semiconductor relay driving element 30A are built in the fuse 10D, the housing 1a such as the electrical junction box 1 is further reduced as compared with the first embodiment. By reducing the size of the substrate and the housing 1a, the electric junction box 1 is further reduced in weight and cost. In addition, since it is not necessary to mount a relay circuit as a heat source on a substrate or the like in the electrical junction box 1, it is not necessary to use a high heat dissipation material or a high heat-resistant material for the substrate or the like, which also reduces the cost. Furthermore, when the semiconductor relay 11A fails, only the fuse 10D needs to be replaced, so that maintainability is improved.

  In the fourth embodiment, the first to third connection terminal portions 12, 13, and 14, the semiconductor relay 11A, and the semiconductor relay driving element 30A are integrated by being sealed with the mold resin sealing portion 40, In addition, the fuse element portion 15B is connected to the fuse connection portions 12a and 32a exposed from the mold resin sealing portion 40, and the mold resin sealing portion 40 and the fuse element portion 15B are accommodated in the case 41 so that the whole is integrated. It has become. Therefore, since the semiconductor relay 11A and the semiconductor relay driving element 30A are completely separated from the outside by the mold resin sealing portion 40, adverse effects due to water, dust, and the like can be reliably avoided. Further, since the fuse element portion 15B itself is not sealed by the mold resin sealing portion 40, the fuse element portion 15B is surely blown by energization of an overcurrent.

  8 and 9 show a fifth embodiment of the present invention, FIG. 8 is a conceptual diagram of a circuit and the like of an electric junction box, and FIG. 9 is a front view of a fuse.

  As shown in FIG. 8, the electrical junction box 1 is loaded with a fuse 10E for preventing an excessive current from being supplied from the battery 2 and a current supplied via the fuse 10E, as in the fourth embodiment. 3 for energizing or de-energizing 3, semiconductor relay driving element 30B for driving semiconductor relay 11C, and relay control circuit for controlling semiconductor relay 11C via semiconductor relay driving element 30B And a control switch SW2.

  The fuse 10E is of a plug-in type, and is attached to a tuning fork terminal (not shown) arranged outside the housing 1a. The fuse 10E incorporates a semiconductor relay 11C and a semiconductor relay driving element 30B, and the detailed configuration thereof will be described in detail below. In this embodiment, since the semiconductor relay 11C is a P-channel MOS type, it can be controlled only by the control switch SW2.

  Next, a detailed configuration of the fuse 10E will be described. As shown in FIG. 9, the fuse 10E includes a first connection terminal portion 12 connected to the battery 2 side, a second connection terminal portion 13 connected to the load 3 side, as in the fourth embodiment, The third connection terminal portion 14 connected to the control switch SW2 side, the fuse element portion 15B, the semiconductor relay 11C mounted on the second connection terminal portion 13, and the semiconductor relay similarly mounted on the second connection terminal portion 13 A driving element 30B and a relay terminal portion 32 are provided.

  Each of the connection terminal portions 12, 13, 14, the fuse element portion 15 and the relay terminal portion 32 is formed of a separate bus bar material.

  The semiconductor relay 11C is a bare chip such as a P-channel MOS FET. The semiconductor relay 11C has a drain electrode (not shown) arranged on the lower surface thereof, and a source electrode (not shown) and a gate electrode (not shown) respectively arranged on a part of the upper surface. A relay circuit is formed in which the drain electrode and the source electrode are made conductive / non-conductive based on a control signal input to the gate electrode. The drain electrode is electrically connected by soldering the semiconductor relay 11 </ b> C to the second connection terminal portion 13. The source electrode is electrically connected to the relay terminal portion 32 via a bonding wire 17i. The gate electrode is electrically connected to an output electrode (not shown) of the semiconductor relay driving element 30B via a bonding wire 17j.

  The semiconductor relay driving element 30B is a bare chip, and includes a source side electrode (not shown), an output electrode (not shown), and an input electrode (not shown) arranged on a part of the upper surface thereof. Have. The source electrode is connected to the relay terminal portion 32 via a bonding wire 17k. The input electrode is connected to the third connection terminal portion 14 via a bonding wire 17l.

  The locations of the first to third connection terminal portions 12, 13, 14 excluding each counterpart terminal connection location, the relay terminal portion 32, the semiconductor relay 11C, and the semiconductor relay driving element 30B are molded as in the fourth embodiment. It is integrated by sealing with the resin sealing part 40. Further, the fuse connection portions 12 a and 32 a of the first connection terminal portion 12 and the relay terminal portion 32 are exposed to the outside without being sealed by the mold resin sealing portion 40.

  Both ends of the fuse element portion 15B are connected to both the fuse connection portions 12a and 32a exposed from the mold resin sealing portion 40 by soldering or the like. The mold resin sealing portion 40 and the fuse element portion 15B are accommodated in the case 41, whereby the fuse 10E is integrated as a whole.

  In the fifth embodiment, as in the fourth embodiment, the electrical connection box 1 is reduced in weight, cost, and the like. In addition, since it is not necessary to mount a relay circuit as a heat source on a substrate or the like in the electrical junction box 1, it is not necessary to use a high heat dissipation material or a high heat-resistant material for the substrate or the like, which also reduces the cost. Furthermore, when the semiconductor relay 11C fails, only the fuse 10E needs to be replaced, so that the maintainability is improved.

  In the fifth embodiment, as in the fourth embodiment, the first to third connection terminal portions 12, 13, and 14, the semiconductor relay 11C, and the semiconductor relay driving element 30B are sealed with the mold resin sealing portion 40. The mold resin sealing part 40 and the fuse element part 15B are accommodated in the case 41 and integrated as a whole. Therefore, since the semiconductor relay 11C and the semiconductor relay driving element 30B are completely isolated from the outside by the mold resin sealing portion 40, adverse effects due to water, dust, and the like can be reliably avoided. Further, since the fuse element portion 15B itself is not sealed by the mold resin sealing portion 40, the fuse element portion 15B is surely blown by energization of an overcurrent.

  The fifth embodiment has the following advantages. That is, when the semiconductor relay 11C is a MOS FET, the breakdown voltage between the gate electrode and the source electrode is lower than the breakdown voltage between the drain electrode and the source electrode. Therefore, when a surge current such as static electricity is applied to the gate electrode of the semiconductor relay 11C, the possibility that the semiconductor relay 11C is broken is very high. However, in the configuration of the fifth embodiment, even if a human or the like touches the third connection terminal portion 14 and a surge current such as static electricity is generated, the Zener diode of the semiconductor drive element 30B is connected between the gate electrode and the source electrode. Therefore, the surge current is not directly applied to the gate electrode of the semiconductor relay 11C by the semiconductor relay driving element 30B, so that the semiconductor relay 11C is not broken by static electricity or the like. Therefore, the fuse 10E of the fifth embodiment has an advantage that it is not necessary to protect the circuit of the semiconductor relay 11C.

  In the fourth and fifth embodiments, the semiconductor relays 11A and 11C are directly mounted on the second connection terminal portion 13, but the semiconductor placement electrode portion as in the second embodiment is provided and mounted. Alternatively, the relay terminal unit 32 may be mounted.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual diagram illustrating a circuit etc. of an electrical junction box according to a first embodiment of the present invention. 1 is a front view of a fuse according to a first embodiment of the present invention. It is a front view of a fuse, showing a second embodiment of the present invention. It is a front view of a fuse, showing a 3rd embodiment of the present invention. FIG. 4 is a conceptual diagram illustrating a circuit of an electrical junction box according to a fourth embodiment of the present invention. It is a front view of a fuse, showing a 4th embodiment of the present invention. FIG. 9 is a perspective view of a fuse, showing a fourth embodiment of the present invention. FIG. 10 is a conceptual diagram showing a fifth embodiment of the present invention, such as a circuit of an electrical junction box. It is a front view of a fuse, showing a 5th embodiment of the present invention. It is a conceptual diagram which shows a prior art example and is a circuit etc. of an electric junction box. It is a conceptual diagram which shows another conventional example and is a circuit etc. of an electric junction box. It is a front view of the conventional fuse.

Explanation of symbols

1 Electrical Junction Box 1a Case 2 Battery (Power)
3 Load 10A, 10B, 10C, 10D, 10E Fuse 11A, 11B, 11C Semiconductor Relay 12 First Connection Terminal Part 13 Second Connection Terminal Part 14 Third Connection Terminal Part 15, 15A, 15B Fuse Element Part 16 Mold Resin Sealing Part 18 Semiconductor placement electrode part 30A, 30B Semiconductor relay driving element 31 Relay control circuit 40 Mold resin sealing part 41 Case SW2 control switch (relay control circuit)

Claims (3)

A first connection terminal connected to the power supply side, a second connection terminal connected to the load, and a third connection terminal connected to the relay control circuit;
A fuse element portion having one end connected to the first connection terminal portion;
Based on a control signal input to the gate electrode, a relay circuit is formed in which the drain electrode and the source electrode are made conductive / non-conductive, the drain electrode is on the other end side of the fuse element portion, and the source electrode is A semiconductor relay in which the gate electrode is electrically connected to the third connection terminal portion, respectively, in the second connection terminal portion,
The first to third connection terminal portions, the fuse element portion, and the semiconductor relay are integrated by sealing ,
The fuse, wherein the first connection terminal portion and the fuse element portion are integrally formed from a bus bar base material . A first connection terminal connected to the power supply side, a second connection terminal connected to the load, and a third connection terminal connected to the relay control circuit;
A fuse element portion having one end connected to the first connection terminal portion;
Based on a control signal input to the gate electrode, a relay circuit is formed in which the drain electrode and the source electrode are made conductive / non-conductive, the drain electrode is on the other end side of the fuse element portion, and the source electrode is A semiconductor relay in which the gate electrode is electrically connected to the third connection terminal portion, respectively, in the second connection terminal portion,
The first to third connection terminal portions, the fuse element portion, and the semiconductor relay are integrated by sealing,
One surface of the semiconductor relay is formed as any one of the drain electrode, the source electrode, and the gate electrode, and is connected to the other end side of the fuse element portion. The semiconductor relay is directly mounted on the electrode portion for semiconductor placement,
The fuse, wherein the first connection terminal portion, the fuse element portion, and the semiconductor placement electrode portion are integrally formed from a base material of a bus bar . The fuse according to claim 1 or claim 2,
  The fuse, wherein the fuse element portion extends from the first connection terminal portion toward the second connection terminal portion between the first connection terminal portion and the second connection terminal portion.

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