JP5151346B2 - Surface acoustic wave device and spherical surface acoustic wave component - Google Patents

Description

  The present invention relates to a spherical surface acoustic wave component having a terminal connected to a spherical surface acoustic wave element, and a surface acoustic wave device mounted with the spherical surface acoustic wave component.

  As in Patent Document 1, the spherical surface acoustic wave element is formed in a spherical shape having a diameter of about 1 mm to 10 mm using a piezoelectric base material such as quartz or lithium niobate. A pair of comb electrodes is formed on the spherical surface, and a high frequency voltage is applied between the comb electrodes to generate a surface acoustic wave on the surface of the piezoelectric substrate. In the annular circumference area, the circumference area along the intersecting line of the spherical surface and the plane perpendicular to the Z-axis of the crystal of the piezoelectric substrate is circulated. If the surface acoustic wave frequency, the material constituting the surrounding region of the piezoelectric base material, the curvature of the surrounding region, etc. satisfy certain conditions, the surface acoustic wave diffuses outside the range of the surrounding region. Without repeating, it propagates around the range of the circulation area repeatedly. In this spherical surface acoustic wave element, as in Patent Document 2, when a sensitive film is formed to adhere a predetermined substance to the surrounding region, and when the predetermined substance adheres to the sensitive film, the spherical surface acoustic wave element depends on the amount of the substance. Thus, it is used as a sensor for a substance that senses the presence of a predetermined substance by utilizing the change in the circulation time (that is, the circulation speed) of the surface acoustic wave that circulates in the circulation region.

  The diameter of the spherical surface acoustic wave element gradually decreases with the progress of development, and is currently reduced to about 1 mm. Because of such a small diameter and a spherical shape, it is difficult to handle the spherical surface acoustic wave element. Furthermore, in many cases, the sensitive film for measuring the amount of a predetermined substance does not quickly separate the predetermined substance attached to the sensitive film from the sensitive film at the time of the first measurement. In this case, since the substance remaining on the sensitive film from the previous measurement affects, it is necessary to frequently replace the spherical surface acoustic wave element with an element having a fresh sensitive film at every measurement. Therefore, it is necessary to quickly attach and detach the spherical surface acoustic wave element to and from the holder.

  In Patent Document 2, there is no influence on the circulation time (that is, the circulation speed) of the surface acoustic wave that circulates in the circulation area even if something touches a portion other than the rotation area on the surface of the piezoelectric substrate. Taking advantage of the fact that the portion other than the circumferential region of the surface of the piezoelectric substrate does not necessarily have to be spherical, the portion other than the circumferential region of the spherical surface acoustic wave element is scraped to be deformed from a spherical shape to reduce rolling. ing. That is, the device electrode is disposed on the shaved portion of the spherical surface acoustic wave device, the shaved portion is supported by the sensor holder, and the device electrode is electrically connected to the conductor pattern of the sensor holder.

  Further, in Patent Document 3, the spherical north pole and south pole of a spherical surface acoustic wave element are cut into a flat surface, an element electrode is formed thereon, and an electrode probe is brought into contact with the element electrode.

The known literature is described below.
International Publication No. WO01 / 045255 JP 2003-294713 A JP 2005-147736 A

  However, in the technique of Patent Document 1, the electrode of the sensor holder is installed upright on the sensor holder, and the spherical surface acoustic wave element is pushed in between the electrodes of the sensor holder so as to be sandwiched between the electrodes of the sensor holder. It is necessary to install it in an appropriate position and to orient it in a predetermined direction. In order to push the spherical surface acoustic wave element in such a manner, it is necessary to grasp the part of the spherical surface acoustic wave element other than the element electrode in contact with the electrode of the sensor holder with a jig, and the jig hits the circumferential area and damages the circumferential area. There was a problem that could make it. Further, in the techniques of Patent Document 2 and Patent Document 3, there is a problem that the manufacturing cost by grinding of a portion other than the circumferential region of the spherical surface acoustic wave element becomes expensive.

  The present invention has been made in order to solve such problems in the prior art, and the object of the present invention is to use a surface acoustic wave element in a spherical shape, and to achieve a spherical elastic surface even if the spherical surface acoustic wave element has a small diameter. An object of the present invention is to provide a spherical surface acoustic wave component capable of quickly attaching and detaching a wave element to and from a surface acoustic wave device, and a surface acoustic wave device formed by mounting the spherical surface acoustic wave component.

  In order to solve this problem, the present invention has a spherical piezoelectric base material, a plane perpendicular to the Z axis passing through the center of the crystal of the piezoelectric base material and passing through the center of the piezoelectric base material, and A first element electrode and a second element electrode having a pair of comb-shaped electrodes in a portion of a circumferential region of the surface of the piezoelectric base material along a line of intersection with the surface of the piezoelectric base material and connected to the pair of comb-shaped electrodes A spherical surface acoustic wave element having an element electrode on the surface of the piezoelectric substrate; and an element holder for holding the spherical surface acoustic wave element, wherein the element holder has a terminal lead and the first element electrode and the first element electrode. A spherical surface acoustic wave component that is held in contact with a two-element electrode.

  In the present invention, the first element electrode and the second element electrode are brought close to each other and formed near the Z-axis on the surface of the piezoelectric substrate, and the terminal lead is arranged in one plane. The spherical surface acoustic wave component according to claim 1, wherein the spherical surface acoustic wave component is in contact with the first element electrode and the second element electrode.

  The present invention also provides the spherical surface acoustic wave component according to the present invention, wherein the terminal lead is disposed on both poles of the spherical surface acoustic wave element.

  The present invention also includes a spherical piezoelectric substrate, a plane perpendicular to the Z axis passing through the center of the piezoelectric substrate crystal and passing through the center of the piezoelectric substrate, and the surface of the piezoelectric substrate. A pair of comb-shaped electrodes in a portion of the circumferential region of the surface of the piezoelectric substrate along the line of intersection with the first element electrode and the second element electrode connected to the comb-shaped electrode pair A spherical surface acoustic wave element formed near the Z-axis on the surface of the piezoelectric substrate is provided, and terminal leads arranged in one plane are joined to the first element electrode and the second element electrode. The above-mentioned spherical surface acoustic wave component.

  The present invention also includes the spherical surface acoustic wave element in which a pattern of an alignment mark is formed simultaneously with the comb-shaped electrode, the first element electrode, and the second element electrode, and the position is determined by the alignment mark. The spherical surface acoustic wave component according to claim 1, further comprising the terminal lead electrically connected to the first element electrode and the second element electrode.

  According to another aspect of the present invention, there is provided a surface acoustic wave device comprising a terminal lead of the above-described spherical surface acoustic wave component soldered to a conductor pattern on a surface of a sensor holder.

  Further, the present invention is the above-described surface acoustic wave device, wherein the sensor holder has a through hole, and the spherical surface acoustic wave element portion of the spherical surface acoustic wave component is accommodated in the through hole. .

  The present invention manufactures a spherical surface acoustic wave component in which a terminal lead is installed on a spherical surface acoustic wave element, and solders the terminal lead to the component terminal of the conductor pattern on the surface of the sensor holder. Since the surface acoustic wave device can be manufactured, it is easy to align the spherical surface acoustic wave element with the sensor holder, and there is an effect that the spherical surface acoustic wave element can be quickly attached to and detached from the sensor holder.

<First Embodiment>
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a spherical surface acoustic wave element 10 having a first element electrode 13a and a second element electrode 13b. FIG. 1A is a perspective view of the spherical surface acoustic wave element 10 of the first embodiment, and FIG. 1B is a spherical surface acoustic wave in which the terminal 14 is joined to the element electrode 13 (13a, 13b). FIG. 1C is a side view of the component 10a, and FIG. 1C is a front view of the spherical surface acoustic wave component 10a viewed from the terminal 14 side. FIG. 2 is a diagram showing a surface acoustic wave device in which the spherical surface acoustic wave component 10 a is installed in the sensor holder 20.

  In the present embodiment, as shown in the side view of FIG. 1B, the first element electrode 13a and the second element electrode 13b of the spherical surface acoustic wave element 10 are electrically conductive such as silver paste or conductive adhesive. The spherical surface acoustic wave component 10a in which the terminal 14 is bonded with the bonding material is manufactured. As shown in the front view of FIG. 1C, the terminal 14 is, for example, an elongated plate-like terminal made of a metal material such as copper or aluminum having a rectangular cross section of 0.2 mm width, 0.05 mm thickness, and 10 mm length. It consists of a lead 14a and a metal plate terminal joint 14b. The terminal joint portion 14 b is joined to the element electrode of the spherical surface acoustic wave element 10. It is desirable to form a concave surface with a radius of curvature of the spherical surface of the surface acoustic wave element 10 in the terminal joint portion 14b.

  As shown in FIG. 2, the spherical surface acoustic wave component 10a is installed in a sensor holder 20 composed of a printed wiring board made of an insulating material such as a glass epoxy resin material, a polyimide resin material, or a ceramic material having a thickness of about 0.05 mm to 10 mm. Thus, a surface acoustic wave device is obtained. 2A shows a side view of the surface acoustic wave device, and FIG. 2B shows a plan view. As shown in FIG. 2, a through hole 21 larger than the spherical surface acoustic wave element 10 is formed in the sensor holder 20 by a drilling process or a punching process, and a spherical elastic surface is formed on the surface in the vicinity of the through hole 21. The conductor pattern 22 of the component terminal to which the terminal lead 14a of the wave component 10a is soldered is formed.

(Structure of spherical surface acoustic wave element)
As shown in FIG. 1A, the spherical surface acoustic wave element 10 includes a spherical piezoelectric substrate 11 having a diameter of about 1 mm as a main part. The piezoelectric substrate 11 is made of a piezoelectric material such as quartz, LiNbO ₃ (lithium niobate), LiTaO ₃ (lithium tantalate), BSO (bismuth silicon oxide), or langasite. This piezoelectric substrate 11 has a crystal Z-axis 11z shown in FIG. 4 and paragraphs 0053 to 0054 of JP-A-2003-115744. Two points where the Z-axis 11z of the crystal passing through the center of the piezoelectric substrate 11 intersects the surface of the piezoelectric substrate 11 are defined as a north pole 11N and a south pole 11S.

  On the spherical surface between the north pole 11N and the south pole 11S of the piezoelectric base material 11, an annular circular region 12 is provided along a plane that passes through the center of the piezoelectric base material 11 and is perpendicular to the crystal Z axis 11z. In the circulation region 12, a width necessary for the circulation of the surface acoustic wave is secured. The width of the circulation region 12 depends on the frequency of the surface acoustic wave. For example, when a 150 MHz surface acoustic wave is circulated in the piezoelectric substrate 11 having a diameter of 1 mm, the width of the piezoelectric substrate 11 is approximately 1 /. About 4 to 1/3 is required. A north comb-shaped electrode 15N on the north pole 11N side having the width of the surrounding region 12 is formed on the surrounding region 12 on the spherical surface of the piezoelectric substrate 11 with a conductor pattern integrated with the first element electrode 13a. Further, a south comb electrode 15S facing the north comb electrode 15N on the south pole 11S side is formed on the spherical surface of the piezoelectric substrate 11 with a conductor pattern integrated with the second element electrode 13b. Further, the alignment mark 16 is formed in a pattern in the first element electrode 13a and the second element electrode 13b. The pair of conductor patterns and the alignment mark 16 are simultaneously formed on the spherical surface of the piezoelectric substrate 11 with a metal plating pattern, so that the surface acoustic wave generator 15 is formed by a pair of the north comb electrode 15N and the south comb electrode 15S. Form.

  By applying a high frequency voltage between the north comb electrode 15N and the south comb electrode 15S of the surface acoustic wave generator 15, a surface acoustic wave that circulates along the circulation region 12 is generated. At this time, the vibration transmission path of the surface acoustic wave of the spherical surface acoustic wave element 10 is limited to the circumference region 12 having a width that is one-fourth to one-third of the diameter of the piezoelectric substrate 11, and the north pole 11N Surface acoustic waves are not transmitted to the South Pole 11S. Therefore, even if pressure is applied to the spherical surfaces of the north pole 11N and the south pole 11S, the surface acoustic wave can be transmitted without being affected.

  For example, a sensitive film made of an antibody that binds to a specific protein is formed in the circumferential region 12 of the spherical surface acoustic wave element 10. Also, for example, in a surface acoustic wave device that detects hydrogen molecules, a sensitive film is formed on the circular region 12 by depositing a thin film of palladium / nickel alloy to a thickness of about 30 nm in a vacuum environment. The spherical surface acoustic wave element 10 in which a thin film of palladium / nickel alloy is formed as a sensitive film in the circulation region 12 is used as a gas sensor for detecting a hydrogen concentration from 10 ppm to 100%. In addition, an odor sensor that detects a small amount of odor molecules in a gas can be configured by forming a sensitive film that binds to other specific molecules in the circulation region 12.

(Assembling spherical surface acoustic wave components)
First, the position (orientation) of the spherical surface acoustic wave element 10 is discriminated by the alignment mark 16, and the terminal joint portion 14 b of the terminal 14 is aligned with the spherical surface acoustic wave element 10 and joined to the element electrode. When the piezoelectric base material 11 of the spherical surface acoustic wave element 10 is quartz, the terminal bonding portion 14b is bonded to the element electrode at a temperature of 200 ° C. or lower. For example, it is bonded to the element electrode by ultrasonic bonding in a temperature range of 50 ° C. to 200 ° C. Further, the terminal bonding portion 14b is bonded to the element electrode with a conductive bonding material such as a silver paste or a conductive adhesive. Alternatively, the silver nanoparticles can be melted by applying silver nanoparticles to the device electrode and the terminal joint portion 14b and heating and pressurizing to 200 ° C. to join the device electrode and the terminal joint portion 14b. When the piezoelectric substrate 11 is langasite, the element electrode on the surface of the piezoelectric substrate 11 is soldered with phosphor copper solder having a solidus temperature of about 645 ° C., or copper powder and tin-based powder The spherical surface acoustic wave component 10a can be assembled by forming a high melting point joint by heating and pressing a high temperature lead-free solder paste mixed with 280 ° C. and soldering.

(Sensor holder)
The sensor holder 20 made of a printed wiring board in FIG. 2 can use a glass epoxy substrate, a flexible polyimide substrate, a thermoplastic resin substrate, or a ceramic substrate. The printed wiring board of the sensor holder 20 is formed with a through hole 21 for making a space for accommodating the spherical surface acoustic wave element 10. Conductor patterns 22 are formed on the upper and lower surfaces of the printed wiring board of the sensor holder 20, and component terminals for joining the terminal leads 14a of the spherical surface acoustic wave component 10a are provided on the upper surface of the sensor holder 20 in the vicinity of the through holes 21 as conductors. The pattern 22 is formed. The sensor holder 20 can be installed by soldering an electronic component on the upper surface or the lower surface thereof and soldering the conductor pattern 22 formed on the surface. Alternatively, an external connection electrode such as a solder ball or a component lead can be bonded to the conductor pattern 22 on the lower surface of the sensor holder 20. The sensor holder 20 having the external connection electrode can be used by installing a component socket on the motherboard and electrically connecting the external connection electrode of the sensor holder 20 to the electrode of the component socket. Alternatively, the external connection electrode of the sensor holder 20 can be directly soldered to the conductor pattern of the mother board without going through the component socket.

(Manufacturing procedure of surface acoustic wave device)
(Step 1)
First, the spherical surface acoustic wave component 10 a is grasped and lifted by the terminal lead 14 a, and the positions of both terminal leads 14 a of the spherical surface acoustic wave element 10 are aligned with the positions of the component terminals of the conductor pattern 22 of the sensor holder 20.
(Step 2)
Next, both terminal leads 14 a of the spherical surface acoustic wave component 10 a are lowered to the position of the component terminal of the conductor pattern 22, and the piezoelectric substrate 11 portion of the spherical surface acoustic wave element 10 is inserted into the through hole 21 of the sensor holder 20. Accommodate.
(Step 3)
Next, by soldering the terminal lead 14a of the spherical surface acoustic wave component 10a to the component terminal of the conductor pattern 22, the spherical surface acoustic wave component 10a is installed in the sensor holder 20 to obtain a surface acoustic wave device.

(Substance detection work)
Next, a liquid to be analyzed is applied to the sensitive film in the circumferential region 12 exposed on the spherical surface acoustic wave element 10. Here, the analyte solution is applied to a part of the sensitive film in the circulation region 12, that is, a part other than the surface acoustic wave generator 15 to detect the protein that binds to the sensitive film. In the present embodiment, since the orbiting region 12 is directly above the spherical surface acoustic wave element 10, there is an effect that the liquid to be analyzed can be easily applied to the sensitive film.

  In order to perform accurate measurement in the same environment, the surface acoustic wave device is configured as follows. That is, a first spherical surface acoustic wave element 10 is prepared, a solution to be analyzed is applied to the sensitive film in the surrounding region 12 to bind the protein, and further, the second spherical surface acoustic wave element 10 that does not bind the protein. Prepare. The surface acoustic wave device detects the protein by comparing the measurement result of the first spherical surface acoustic wave element 10 and the measurement result of the second spherical surface acoustic wave element 10 and detecting the difference between the two. Can be configured.

  An electric pulse of a rectangular wave of 40 MHz to 550 MHz is applied to the first element electrode 13a and the second element electrode 13b of the spherical surface acoustic wave element 10, and an RF burst signal in the vicinity of 45 MHz, for example, is applied. This RF burst signal is further applied to the surface acoustic wave generator 15 composed of the north comb electrode 15N and the south comb electrode 15S. As a result, a surface acoustic wave is generated in the circulation region 12 of the piezoelectric substrate 11. The surface acoustic wave circulates in the circulation region 12 about 1 to 500 times, and the surface acoustic wave that has returned after being circulated is detected by the surface acoustic wave generation unit 15 that also serves as the surface acoustic wave detection unit. The time required for the surface acoustic wave to return to the surface acoustic wave generating section 15 is a phenomenon in which the surface area of the spherical surface acoustic wave element 10 is changed by utilizing a phenomenon that changes when a substance is bonded to the sensitive film in the area 12 of the spherical surface acoustic wave element 10. The presence or absence of substance binding to the 12 sensitive membranes is detected.

  In this embodiment, the first electrode 13a and the second electrode 13b installed on the north pole 11N and the south pole 11S of the piezoelectric substrate 11 are joined to the poles of the spherical surface acoustic wave element 10 in which rod-like terminal leads 14a are joined. A spherical surface acoustic wave component 10a having the terminal lead 14a joined thereto was manufactured. The spherical surface acoustic wave component 10a can be easily handled by grasping the terminal lead 14a, and has an effect of being quickly mounted on the sensor holder 20.

(Modification 1)
A first modification of the present embodiment will be described with reference to FIG.
(Structure of spherical surface acoustic wave element)
FIG. 3 shows a spherical surface acoustic wave element 10 in which a through hole 10 b is formed in the piezoelectric substrate 11. FIG. 3A shows a perspective view of the spherical surface acoustic wave element 10 in which a through hole 10b is formed in parallel to the Z axis 11z of the crystal of the piezoelectric substrate 11. The through-hole 10b is formed by performing a processing operation such as laser drilling on the piezoelectric substrate 11. The position of the through hole 10b does not necessarily have to be formed in parallel with the Z axis 11z of the crystal as long as it does not overlap with the circulation region 12.
(Terminal structure)
The terminal 14 is composed mainly of a rod such as an epoxy resin, a polyimide resin, or ceramics. Further, it is sufficient that the rods are insulated at both ends. For example, a rod in which two metal rods are bonded with an insulating resin to form a single rod may be used.

(Assembly procedure of spherical surface acoustic wave components)
(Step 1)
As shown in the side view of FIG. 3 (b) and the front view of FIG. 3 (c), the terminal 14 rod is inserted into the through hole 10 b of the piezoelectric substrate 11.
(Step 2)
Next, a metal plating film such as copper or gold that connects the rod and the surface of the piezoelectric substrate 11 is formed, and the first element electrode 13a and the surface of the rod are formed by etching or additive plating of the metal plating film. A metal film pattern in which the metal plating film is integrated is formed. Thus, in the rod inserted into the through-hole 10b of the piezoelectric substrate 11, the conductive portion of the rod integrated with the first element electrode 13a by the metal film pattern is used as the terminal lead 14a on the north pole side. Similarly, a metal film pattern of a bar integrated with the second element electrode 13b is formed, and a conductive portion of the bar to which the metal film pattern is connected is a terminal lead 14a on the south pole side.

  Since the modification 1 does not perform the metal bonding operation for heating to form the terminal lead 14a, there is an effect that the piezoelectric base material 11 of the spherical surface acoustic wave element 10 is not damaged by the heat treatment. In particular, this effect is significant for the spherical surface acoustic wave element 10 formed of the quartz piezoelectric substrate 11 having a heat resistance of 200 ° C. or less.

(Modification 2)
A second modification of the present embodiment will be described with reference to FIG. FIG. 4 shows a cross section of the sensor holder 20 and a side surface of the spherical surface acoustic wave component 10a.
(Structure of spherical surface acoustic wave element)
The first element electrode 13a integrated with the north comb-shaped electrode 15N is formed on the north pole 11N by the metal plating pattern simultaneously formed on the spherical surface of the piezoelectric substrate 11, and the south comb-shaped electrode 15S is integrated with the south pole 11S. The spherical second surface acoustic wave element 10 is manufactured in which the second element electrode 13b is formed, and the alignment mark 16 is formed on each element electrode.
(Terminal lead)
As the terminal lead 14a, a rectangular strip-shaped terminal lead 14a made of a metal such as copper or aluminum and having a thickness of 0.1 mm and a width of about 0.3 mm is used.

(Assembly procedure of spherical surface acoustic wave components)
(Step 1)
First, the position of the element electrode 13 is confirmed by observing the alignment mark 16 of the spherical surface acoustic wave element 10, the position of the terminal lead 14a is aligned, and the terminal joint portion is connected to the first element electrode 13a and the second element electrode 13b. It joins by 14b. The terminal bonding portion 14b uses a conductive bonding material such as solder or a conductive adhesive.
(Step 3)
The terminal lead 14a of the first element electrode 13a and the terminal lead 14a of the second element electrode 13b extend in parallel to each other and in parallel to the surface of the spherical surface acoustic wave element 10 at the joining position. Bend at a right angle in a direction away from 10. In this way, the spherical surface acoustic wave component 10a in which the terminal lead 14a is joined to one of the spherical surface acoustic wave elements 10 is formed.

(Manufacturing procedure of surface acoustic wave device)
First, the spherical surface acoustic wave component 10 a is grasped and lifted by the terminal lead 14 a, and the positions of both terminal leads 14 a of the spherical surface acoustic wave element 10 are aligned with the positions of the component terminals of the conductor pattern 22 of the sensor holder 20. Next, both the terminal leads 14a of the spherical surface acoustic wave component 10a are lowered to the position of the component terminals of the conductor pattern 22 and soldered to the component terminals of the conductor pattern 22, so that the spherical surface acoustic wave component 10a is attached to the sensor holder 20. To obtain a surface acoustic wave device. The spherical surface acoustic wave component 10a of Modification 2 has an effect that it can be mounted without providing the through hole 21 in the sensor holder 20 on which the spherical surface acoustic wave component 10a is installed.

(Modification 3)
Modification 3 of the present embodiment will be described with reference to FIG. FIG. 5 is a perspective view of the spherical surface acoustic wave component 10a.
(Structure of spherical surface acoustic wave element)
As shown in FIG. 5, the spherical surface acoustic wave element 10 according to the third modification has a metal comb pattern formed on the spherical surface of the piezoelectric substrate 11 of the spherical surface acoustic wave element 10 at the same time as the north comb on the south pole 11S side. Two element electrodes, a first element electrode 13a integrated with the mold electrode 15N and a second element electrode 13b integrated with the comb electrode 15S on the south side, are formed, and an alignment mark 16 is provided on the north pole 11N side. Form. In this way, the spherical surface acoustic wave element 10 formed by bringing the first element electrode 13a and the second element electrode 13b connected to the comb electrode pair to the lower side (the south pole 11S side) of the surface of the piezoelectric substrate 11 is formed. .
(Terminal lead)
The terminal lead 14a is a terminal made of a conductive bonding material such as solder or conductive adhesive at the end of the terminal lead 14a at the center of the terminal lead pair by installing the strip-shaped terminal lead 14a on a straight line on a plane. The joining part 14b is installed.

(Assembly procedure of spherical surface acoustic wave components)
(Step 1)
First, the alignment is confirmed by observing the alignment mark 16 of the spherical surface acoustic wave element 10, and the spherical surface acoustic wave element 10 is lifted by grasping the position of the alignment mark 16 with vacuum tweezers according to the alignment.
(Step 2)
Next, the vacuum tweezers holding the spherical surface acoustic wave element 10 is moved to align the spherical surface acoustic wave element 10 with the position of the center portion of the terminal lead pair, and the second surface of the spherical surface acoustic wave element 10 is placed on the terminal joint 14b of the terminal lead 14a. The first element electrode 13a and the second element electrode 13b are lowered and joined to the terminal lead 14a by the terminal joining portion 14b. Thus, the spherical surface acoustic wave component 10a is formed in which the terminal lead 14a parallel to the plane contacting the lower surface (the south pole 11S side) of the spherical surface acoustic wave element 10 is joined to the first element electrode 13a and the second element electrode 13b. To do.

  The spherical surface acoustic wave component 10a of Modification 3 has the following effects in addition to the effects of Modification 2. That is, since the terminal lead 14a is parallel to a plane in contact with the lower surface (the south pole 11S side) of the spherical surface acoustic wave element 10, the spherical surface acoustic wave component 10a is connected to the upper surface of the planar temporary table. 14a can be extended and brought into contact with the upper surface of the temporary table, and the spherical surface acoustic wave component 10a can be supported and stored. And since the north pole 11N is located above the spherical surface acoustic wave element 10 installed on the terminal lead 14a and the surrounding region 12 is not exposed to the upper portion, the upper portion is grasped with vacuum tweezers without damaging the surrounding region 12. There is an effect that it can be quickly lifted and moved to the sensor holder 20 for mounting. In particular, since the position of the circulation region 12 is at a certain height from the surface of the sensor holder 20 to be installed and the space near the circulation region 12 is released, the fluid to be analyzed can freely circulate without any obstacles. The region 12 can be touched and the component analysis can be performed quickly.

<Second Embodiment>
A second embodiment will be described with reference to FIGS. FIG. 6B is a view of the front surface of the element holder 17 and the spherical surface acoustic wave element 10a of the spherical surface acoustic wave component 10a according to the second embodiment. As shown in FIG. 6B, the element holder 17 has four support arm portions 17a, and the spherical surface acoustic wave element 10 is sandwiched between the support arm portions 17a. Further, the terminal fixing portion 14c joined to the terminal lead 14a is pressed against the spherical surface acoustic wave element 10 by the support arm portion 17a. The terminal lead 14a extends parallel to the paper surface of FIG. FIG. 6A is a view of the side surface of the element holder 17 and the north pole 11N side of the spherical surface acoustic wave element 10a. The terminal lead 14a extends in a direction perpendicular to the paper surface of FIG. FIG. 6C is a diagram in which the side surface of the element holder 17 and the spherical surface acoustic wave element 10 are observed from a direction perpendicular to the direction in which the terminal lead 14a extends in a direction 90 degrees different from that in FIG. 6B. FIG. 7 is a view showing a cross section of the sensor holder 20 on which the spherical surface acoustic wave component 10a of the present embodiment is installed and a side surface of the spherical surface acoustic wave component 10a.

The present embodiment is different from the first embodiment in that the present embodiment includes a spherical surface acoustic wave element 10 and rod-like terminals 14 installed at portions of the north pole 11N and the south pole 11S as shown in FIG. The element holder 17 is used for holding.
(Element holder)
The element holder 17 has a structure in which four support arm portions 17a are projected as shown in the front view of FIG. The four support arm portions 17a sandwich and support the spherical surface acoustic wave element 10 and the terminal fixing portion 14c. A gap is provided between the support arm portions 17a in which a jig for holding the spherical surface acoustic wave element 10 can be put. The base portion of the element holder 17 that supports the four support arm portions 17a is made of a material having elasticity such as a hard rubber material, and gives elasticity to hold the spherical surface acoustic wave element 10 therebetween. Alternatively, the element holder 17 may be manufactured by forming the support arm portion 17a with a spring material such as phosphor bronze to provide elasticity and installing the support arm portion 17a on the insulating material of the element holder 17.

(Terminal structure)
The terminal 14 has a plate-like terminal fixing portion 14 c obtained by bending a metal plate such as a copper plate or a SUS plate into a cylindrical surface having the same curvature as the radius of curvature of the spherical surface acoustic wave element 10. And it is comprised in the structure which joined the rod-shaped terminal lead 14a of the circular cross section to the terminal fixing | fixed part 14c. The terminal lead 14a is not limited to a circular cross section, and a plate-shaped terminal lead having a rectangular cross section can also be used.

(Assembly procedure of spherical surface acoustic wave components)
(Step 1)
First, the orientation of the spherical surface acoustic wave element 10 is confirmed by observing the alignment mark 16 of the spherical surface acoustic wave element 10, and the portion of the north pole 11N is grasped with vacuum tweezers in accordance with the orientation to obtain the spherical surface acoustic wave. The element 10 is lifted. Next, by pressing a bar-shaped jig from below onto the south pole 11S, the north pole 11N and the south pole 11S are pressed and held from above and below.
(Step 2)
Next, as shown in FIGS. 6A and 6B, the spherical surface acoustic wave element 10 held by the jig from both sides of the north pole 11N and the south pole 11S is placed between the four support arm portions 17a of the element holder 17. To the element holder 17. A jig that holds the spherical surface acoustic wave element 10 from both sides of the north pole 11N and the south pole 11S supports the spherical surface acoustic wave element 10 until it abuts against the element holder 17 so as to be inserted into the gap between the support arm portions 17a. As shown in FIG. 6C, a groove 17b that avoids the circular region 12 of the spherical surface acoustic wave element 10 is formed in the element holder 17 that abuts the spherical surface acoustic wave element 10, and the circular region 12 is used as the element holder. Do not touch 17.
(Step 3)
Next, as shown in FIG. 6C, the terminal fixing portion 14 c of the terminal 14 is inserted into the gap between the support arm portion 17 a of the element holder 17 and the spherical surface acoustic wave element 10. The terminal fixing portion 14c is brought into close contact with and electrically connected to the element electrode 13 (that is, 13a and 13b) of the spherical surface acoustic wave element 10 by the elasticity of the support arm portion 17a. Thus, the spherical surface acoustic wave component 11 a is obtained by using the element holder 17.

(Installation of spherical surface acoustic wave components on the sensor holder)
Next, as shown in FIG. 7, the element holder 17 of the spherical surface acoustic wave component 10 a is accommodated in the through hole 21 of the sensor holder 20 provided with the through hole 21, and the terminal lead 14 a is connected to the conductor pattern 22 of the sensor holder 20. The surface acoustic wave device is obtained by soldering to the position of the component terminal.

  In the surface acoustic wave device of this embodiment, the terminal 14 is attached to the spherical surface acoustic wave element 10 by using the element holder 17, and thermal stress is not applied to the spherical surface acoustic wave element 10 in the operation of attaching the terminal 14. There is an effect that the piezoelectric substrate 11 of the spherical surface acoustic wave element 10 is not damaged by the heat treatment. In particular, this effect is significant for the spherical surface acoustic wave element 10 formed of the quartz piezoelectric substrate 11 having a heat resistance of 200 ° C. or less. Further, since the spherical surface acoustic wave component 10a having the terminal lead thus installed protects the spherical surface acoustic wave element 10 with the element holder 17, it is easy to handle and has an effect that it can be quickly mounted on the sensor holder 20. Further, as shown in FIG. 7, the surface acoustic wave device mounted with the spherical surface acoustic wave component 10a faces the surrounding region 12 having the sensitive film upward, so that the liquid to be analyzed can be easily applied to the sensitive film from above. There is an effect that can be done.

<Third Embodiment>
A third embodiment will be described with reference to FIG. FIG. 8A is a diagram in which the spherical surface acoustic wave component 10a of the third embodiment is observed from the AA ′ plane (FIG. 8C) on the north pole 11N side, and FIG. FIG. 5 is a view of the spherical surface acoustic wave element 10 and the element holder 17 observed from the direction in which the lower holder 17c and the upper holder 17d of the element holder 17 protrude in a direction perpendicular to the crystal Z axis 11z. FIG. 8C is a view showing a side surface of the spherical surface acoustic wave element 10 and a cross section of the element holder 17 observed from a direction perpendicular to the Z-axis 11z of the crystal by 90 degrees from FIG. 8B. is there.

The present embodiment uses the element holder 17 as in the second embodiment, but this embodiment is different from the second embodiment in that the element holder 17 is connected to the lower holder 17c and the upper holder as shown in FIG. The spherical surface acoustic wave element 10 is placed on the lower holder 17c, and then the upper holder 17d is covered on the spherical surface acoustic wave element 10.
(Element holder)
As shown in FIG. 8, the element holder 17 of the present embodiment includes a lower holder 17c and an upper holder 17d made of a resin such as epoxy resin or tetrafluoroethylene resin (PTFE). The lower holder 17c is formed with a bowl-shaped recess for holding the spherical surface acoustic wave element 10, and the bottom of the bowl-shaped recess is in contact with the second element electrode 13b of the spherical surface acoustic wave element 10. The terminal lead 14a to be electrically connected is exposed and installed. As shown in FIG. 8A, the upper holder 17d is rotated around a rotating shaft rod 17e installed perpendicularly to the lower holder 17c. A terminal lead 14a that is in contact with and electrically connected to the first element electrode 13a of the spherical surface acoustic wave element 10 is installed in the upper holder 17d.

(Assembly procedure of spherical surface acoustic wave components)
(Step 1)
As shown in FIG. 8A, the upper holder 17d of the element holder 17 is rotated about the rotary shaft 17e to a position where the upper part of the lower holder 17c is opened.
(Step 2)
Next, the orientation of the spherical surface acoustic wave element 10 is confirmed by observing the alignment mark 16 of the spherical surface acoustic wave element 10, and the portion of the north pole 11N is grasped with vacuum tweezers in accordance with the orientation, thereby causing the spherical elastic surface. The wave element 10 is lifted. Next, the spherical surface acoustic wave element 10 is placed in the bowl-shaped recess of the lower holder 17c of the element holder 17, and is brought into contact with the terminal lead 14a at the bottom thereof and is electrically connected to the second element electrode 13b.
(Step 3)
Next, the upper holder 17d of the element holder 17 is rotated around the rotary shaft 17e to a position covering the lower holder 17c. As a result, as shown in FIGS. 8B and 8C, the terminal lead 14a installed on the upper holder 17d is brought into contact with and electrically connected to the first element electrode 13a of the spherical surface acoustic wave element 10, thereby causing spherical elasticity. The surface wave component 11a is obtained.

  In the present embodiment, it is also possible to form screws that fit together in the terminal lead 14a of the upper holder 17d or the lower holder 17c and its attachment portion. By doing so, the spherical surface acoustic wave element 10 can be strongly pressed by rotating and tightening the terminal lead 14a on which the screw is formed.

(Installation of spherical surface acoustic wave components on the sensor holder)
Next, similarly to FIG. 7 of the second embodiment, the spherical surface acoustic wave component 11a is mounted on the sensor holder 20 having the through holes 21 to obtain a surface acoustic wave device. The surface acoustic wave device of this embodiment can quickly install the spherical surface acoustic wave element 10 in the lower holder 17c by simply picking the north pole 11N portion of the spherical surface acoustic wave element 10 with vacuum tweezers. Next, the terminal lead 14 a of the upper holder 17 d can be quickly brought into contact with and electrically connected to the first element electrode 13 a of the spherical surface acoustic wave element 10. Since the number of jigs for holding the spherical surface acoustic wave element 10 is smaller than that of the second embodiment, the present embodiment has an effect of facilitating the work. Further, there is an effect that the installation work to the element holder 17 can be performed more quickly.

(Modification 4)
Modification 4 of the present embodiment will be described with reference to FIG. FIG. 9A is a view of the spherical surface acoustic wave component 10a of Modification 4 observed from the AA ′ plane (FIG. 9C) on the north pole 11N side, and FIG. It is the figure which observed the spherical surface acoustic wave element 10 and the element holder 17 from the direction where the lower holder 17c and the upper holder 17d of the element holder 17 protrude in the direction perpendicular to the Z axis 11z. FIG. 9C shows a side surface of the spherical surface acoustic wave element 10 and a cross section of the element holder 17 observed from a direction perpendicular to the Z-axis 11z of the crystal and a direction different from FIG. 9B by 90 degrees. FIG.
(Element holder)
The element holder 17 of Modification 4 has a structure in which an upper holder 17d with a pin 17f is installed by moving the pin 17f into the lower holder 17c in a direction parallel to the upper surface of the spherical surface acoustic wave element 10 and inserting it. .

(Assembly procedure of spherical surface acoustic wave components)
In the modified example 4, as shown in FIG. 9, after the spherical surface acoustic wave element 10 is installed on the lower holder 17c, the upper holder 17d with the pin 17f is placed on the spherical surface acoustic wave element 10 and the pin 17f is placed. By inserting and installing in the lower holder 17c, the terminal lead 14a installed in the upper holder 17d is electrically connected to the first element electrode 13a of the spherical surface acoustic wave element 10 to obtain the spherical surface acoustic wave component 11a. The spherical surface acoustic wave component 11a is mounted on the sensor holder 20 in which the through holes 21 are formed as in FIG. 7 of the second embodiment to obtain a surface acoustic wave device.

(Modification 5)
Modification 5 of the present embodiment will be described with reference to FIG. FIG. 10 is a view showing a side surface of the spherical surface acoustic wave element 10 and a cross section of the element holder 17 observed from a direction perpendicular to the Z-axis 11z of the crystal.
(Element holder)
The element holder 17 of Modification 5 has a structure in which an upper holder 17d with a screw 17g is installed by tightening the lower holder 17c with the screw 17g.
(Assembly procedure of spherical surface acoustic wave components)
In the modified example 5, as shown in FIG. 10, the spherical surface acoustic wave element 10 is installed on the lower holder 17c, and then the upper holder 17d is installed on the spherical surface acoustic wave element 10, and the upper holder 17d The upper holder 17d is fixed to the lower holder 17c by tightening a screw 17g that passes through and fits into a screw hole of the lower holder 17c. At this time, by tightening the screw 17g, the upper holder 17d and the terminal lead 14a installed on the upper holder 17d are pressed strongly against the first element electrode 13a of the spherical surface acoustic wave element 10 to be electrically connected, and the spherical surface acoustic wave element 10 A spherical surface acoustic wave component 11a that strongly holds Here, by inserting a spring spring between the screw 17g and the upper holder 17d, or between the upper holder 17d and the lower holder 17c, the force that presses the terminal lead 14a against the spherical surface acoustic wave element 10 is given by the elasticity of the spring spring. It is desirable to adjust to a constant force by. Further, the upper holder 17d itself may be provided with elasticity by providing a leaf spring.

  In the fifth modification, the upper holder 17d and the terminal lead 14a installed on the upper holder 17d and the terminal lead 14a installed on the upper holder 17d are firmly pressed against the first element electrode 13a of the spherical surface acoustic wave element 10 by firmly tightening the screw 17g into the screw hole of the lower holder 17c. There is an effect that can be done.

(Modification 6)
A spherical surface acoustic wave component 11a according to Modification 6 of the present embodiment will be described with reference to FIG. FIG. 11A is a diagram showing a side surface of the spherical surface acoustic wave element 10 and a cross section of the element holder 17 observed from a direction perpendicular to the Z axis 11z of the crystal. FIG. 11B is a view showing a cross section of the sensor holder 20 on which the spherical surface acoustic wave component 11a is mounted and a side surface of the spherical surface acoustic wave component 11a.
(Structure of spherical surface acoustic wave element)
As shown in FIG. 11A, the spherical surface acoustic wave element 10 of Modification 6 has a metal plating pattern formed simultaneously on the spherical surface of the piezoelectric substrate 11 of the spherical surface acoustic wave element 10, on the south pole 11S side. Two element electrodes, a first element electrode 13a integrated with the north comb electrode 15N and a second element electrode 13b integrated with the south comb electrode 15S, are formed and aligned with the north pole 11N side. A mark 16 is formed.
(Element holder)
The element holder 17 has a bowl-shaped recess for holding the spherical surface acoustic wave element 10 in the lower holder 17c, and two terminal leads 14a are exposed at the bottom of the bowl-shaped recess. To install. The terminal lead 14a extends along a straight line in contact with the bottom surface of the bowl-shaped recess.

(Assembly procedure of spherical surface acoustic wave components)
(Step 1)
First, the alignment is confirmed by observing the alignment mark 16 of the spherical surface acoustic wave element 10, and the spherical surface acoustic wave element 10 is lifted by grasping the position of the alignment mark 16 with vacuum tweezers according to the alignment.
(Step 2)
Next, the vacuum tweezers holding the spherical surface acoustic wave element 10 is moved to align the spherical surface acoustic wave element 10 with the position of the concave portion of the lower holder 17c, and lowered onto the first element electrode 13a. The second element electrode 13b is brought into contact with and electrically connected to the terminal lead 14a exposed in the recess of the lower holder 17c.
(Step 3)
Similarly to the modified example 5, the upper holder 17d is fastened with screws 17g and fixed to the lower holder 17c.

  In the spherical surface acoustic wave component 10a of the modified example 6, the spherical surface acoustic wave element 10 is inserted into the terminal lead 14a installed on the lower holder 17c by sandwiching the spherical surface acoustic wave element 10 between the lower holder 17c and the upper holder 17d. To make electrical connection. The spherical surface acoustic wave component 10a according to the modified example 6 can be mounted on the sensor holder 20 without holding the through hole 21 by grasping and lifting the upper portion of the upper holder 17d with vacuum tweezers. There is.

(Manufacturing procedure of surface acoustic wave device)
In the modified example 6, in addition to the surface mounting of the spherical surface acoustic wave component 10a on the sensor holder 20 not provided with the through hole 21 as described above, the spherical elasticity is applied to the sensor holder 20 provided with the through hole 21 as follows. The surface wave component 10a can also be mounted.
(Step 1)
First, the spherical surface acoustic wave component 10a is turned upside down, and the terminal lead 14a side of the spherical surface acoustic wave component 10a is gripped and lifted with a jig such as vacuum tweezers, so that the positions of both terminal leads 14a of the spherical surface acoustic wave element 10 are increased. Is aligned with the position of the component terminal of the conductor pattern 22 of the sensor holder 20.
(Step 2)
Next, both terminal leads 14 a of the spherical surface acoustic wave component 10 a are lowered to the position of the component terminal of the conductor pattern 22, and the portion of the spherical surface acoustic wave element 10 of the element holder 17 is accommodated in the through hole 21 of the sensor holder 20. To do.
(Step 3)
Next, by soldering the terminal lead 14a of the spherical surface acoustic wave component 10a to the component terminal of the conductor pattern 22, the spherical surface acoustic wave component 10a is installed in the sensor holder 20 to obtain a surface acoustic wave device. Thereafter, the spherical surface acoustic wave element 10 can be removed and quickly replaced by loosening the screw 17g of the upper holder 17d and removing the upper holder 17d to release the spherical surface acoustic wave element 10.

  In the surface acoustic wave device according to the modified example 6, the spherical surface acoustic wave element 10 is accommodated in the sensor holder 20 because the spherical surface acoustic wave element 10 is accommodated in the through hole 21 of the sensor holder 20. Since it does not protrude, the overall height of the surface acoustic wave device including the sensor holder 20 can be reduced. Further, since the upper holder 17d can be removed after the spherical surface acoustic wave component 10a is mounted on the sensor holder 20, the spherical surface acoustic wave element 10 can be removed from the surface acoustic wave device and replaced quickly.

  The spherical surface acoustic wave components 11a are stacked in the vertical direction on the paper surface of FIG. 11 and connected to each other, the upper holders 17d are connected to each other, the lower holders 17c are connected to each other, and the sensor holder 20 By connecting the through holes 21, the space of the through holes 21 surrounded by them can be formed in a pipe shape having a rectangular cross section. And the fluid which analyzes a component can be poured into the pipe-shaped space, and it can be made to contact the some spherical surface acoustic wave element 10, and the component of the fluid can be analyzed.

(Modification 7)
A surface acoustic wave device and a spherical surface acoustic wave component 11a according to Modification 7 of the present embodiment will be described with reference to FIG. FIG. 12A is a diagram showing a cross section of the sensor holder 20 on which the spherical surface acoustic wave component 11a is mounted and a side surface of the spherical surface acoustic wave component 11a.
(Element holder)
As shown in FIG. 12A, the lower holder 17 c of the element holder 17 of the spherical surface acoustic wave component 11 a of Modification 7 has a flat plate shape, and has a bowl-shaped recess for holding the spherical surface acoustic wave element 10. Two terminal leads 14a are exposed and installed on the bottom. The upper holder 17d is formed in a U shape and is fastened and fixed to the lower holder 17c with a screw 17g.

  The spherical surface acoustic wave components 11a are stacked in a vertical direction on the paper surface of FIG. 12 and connected to each other, the upper holders 17d are connected to each other, the lower holders 17c are connected to each other, and the space surrounded by them is It can be formed in a pipe shape having a rectangular cross section. And the fluid which analyzes a component can be poured into the pipe-shaped space, and it can be made to contact the some spherical surface acoustic wave element 10, and the component of the fluid can be analyzed.

  Further, as shown in FIG. 12B, the spherical surface acoustic wave component 10a without the upper holder 17d can be manufactured by fixing the spherical surface acoustic wave element 10 to the lower holder 17c with an adhesive. As the adhesive, a conductive adhesive is used, whereby the element electrode 13 of the spherical surface acoustic wave element 10 can be bonded to the terminal lead 14a of the lower holder 17c. The spherical surface acoustic wave element 10 is bonded to the lower holder 17c with an adhesive of an insulating resin such as a thermoplastic resin or a thermosetting epoxy resin, and the element electrode of the surface acoustic wave element 10 is cured by shrinkage of the adhesive. A spherical surface acoustic wave component 10a in which 13 is pressed against the terminal lead 14a may be manufactured. The spherical surface acoustic wave component 10a eliminates the obstacle that hinders the flow of fluid from the left and right spaces of the spherical surface acoustic wave element 10, and the fluid to be analyzed freely touches the circumferential region 12 of the spherical surface acoustic wave element 10 without any obstacle. And the component analysis can be performed quickly.

(A) It is a perspective view of the spherical surface acoustic wave element of the 1st Embodiment of this invention. (B) It is a side view of the spherical surface acoustic wave component of the 1st Embodiment of this invention. (C) It is the front view which observed the spherical surface acoustic wave component of the 1st Embodiment of this invention from the terminal lead side. (A) It is a figure which shows the cross section of the sensor holder of the 1st Embodiment of this invention, and the side surface of a spherical surface acoustic wave component. (B) It is a top view of the sensor holder and spherical surface acoustic wave component of the 1st Embodiment of this invention. (A) It is a perspective view of the spherical surface acoustic wave element of the modification 1 of the 1st Embodiment of this invention. (B) It is a side view of the spherical surface acoustic wave component of the modification 1 of the 1st Embodiment of this invention. (C) It is the front view which observed the spherical surface acoustic wave components of the modification 1 of the 1st Embodiment of this invention from the terminal lead side. It is a figure which shows the cross section of the sensor holder of the modification 2 of the 1st Embodiment of this invention, and the side surface of a spherical surface acoustic wave component. It is a perspective view of the spherical surface acoustic wave component of the modification 3 of the 1st Embodiment of this invention. It is a figure which shows the spherical surface acoustic wave components of the 2nd Embodiment of this invention. It is a figure which shows the cross section of the sensor holder of the 2nd Embodiment of this invention, and the side surface of a spherical surface acoustic wave component. It is a figure which shows the spherical surface acoustic wave components of the 3rd Embodiment of this invention. It is a figure which shows the spherical surface acoustic wave components of the modification 4 of the 3rd Embodiment of this invention. It is a figure which shows the spherical surface acoustic wave components of the modification 5 of the 3rd Embodiment of this invention. (A) It is a figure which shows the spherical surface acoustic wave components of the modification 6 of the 3rd Embodiment of this invention. (B) It is a figure which shows the cross section of the sensor holder of the modification 6 of the 3rd Embodiment of this invention, and the side surface of a spherical surface acoustic wave component. It is a figure which shows the cross section of the sensor holder of the modification 7 of the 3rd Embodiment of this invention, and the side surface of a spherical surface acoustic wave component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Spherical surface acoustic wave element 10a ... Spherical surface acoustic wave component 10b ... Through-hole 11 ... Piezoelectric substrate 11N ... North pole 11S ... South pole 11z ... Z axis of crystal DESCRIPTION OF SYMBOLS 12 ... Circulation area | region 13 ... Element electrode 13a ... 1st element electrode 13b ... 2nd element electrode 14 ... Terminal 14a ... Terminal lead 14b ... Terminal junction 14c ... Terminal fixing portion 15 ... Surface acoustic wave generating portion 15N ... North comb electrode 15S ... South comb electrode 16 ... Alignment mark 17 ... Element holder 17a ... Support arm 17b ..Groove 17c ... Lower holder 17d ... Upper holder 17e ... Rotary shaft rod 17f ... Pin 17g ... Screw 20 ... Sensor holder 21 ... Through hole 22 ... Conductor pattern

Claims (6)

  A spherical piezoelectric base material, and along a line of intersection between a plane perpendicular to the Z-axis passing through the center of the crystal of the piezoelectric base material and passing through the center of the piezoelectric base material and the surface of the piezoelectric base material In addition, the piezoelectric substrate has a pair of comb-shaped electrodes in a portion of the circumferential region of the surface of the piezoelectric substrate, and has a first element electrode and a second element electrode connected to the comb-shaped electrode pair on the surface of the piezoelectric substrate. It has a spherical surface acoustic wave element and has an element holder for holding the spherical surface acoustic wave element, and the element holder holds a terminal lead in contact with the first element electrode and the second element electrode. A spherical surface acoustic wave component.   The first element electrode and the second element electrode are brought close to each other and formed near the Z-axis on the surface of the piezoelectric substrate, and the terminal lead is arranged in one plane so that the first element electrode and the second element electrode 2. The spherical surface acoustic wave component according to claim 1, wherein the spherical surface acoustic wave component is in contact with the second element electrode.   2. The spherical surface acoustic wave component according to claim 1, wherein the terminal leads are disposed at both poles of the spherical surface acoustic wave element. The spherical surface acoustic wave element is formed by simultaneously forming a pattern of an alignment mark together with the comb electrode, the first element electrode, and the second element electrode, and the first element is aligned by the alignment mark. spherical surface acoustic wave component according to any one of claims 1 to 3, characterized in that it has the terminal leads electrically connected to the the electrode second element electrode. A surface acoustic wave device, characterized in that the terminal lead of the spherical surface acoustic wave component formed by soldering to the conductor pattern of the surface of the sensor holder according to claim 1 to 3. 6. The surface acoustic wave device according to claim 5, wherein the sensor holder has a through hole, and a portion of the spherical surface acoustic wave element of the spherical surface acoustic wave component is accommodated in the through hole.

Images