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JP5160966B2 - Light-emitting element feeding structure - Google Patents
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JP5160966B2 - Light-emitting element feeding structure - Google Patents

Light-emitting element feeding structure Download PDF

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JP5160966B2
JP5160966B2 JP2008146516A JP2008146516A JP5160966B2 JP 5160966 B2 JP5160966 B2 JP 5160966B2 JP 2008146516 A JP2008146516 A JP 2008146516A JP 2008146516 A JP2008146516 A JP 2008146516A JP 5160966 B2 JP5160966 B2 JP 5160966B2
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led element
contact
base member
case
light emitting
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JP2009295369A (en
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広徳 塚本
和典 夏目
弘美 中村
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Koito Manufacturing Co Ltd
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Description

本発明はLED(発光ダイオード)等の発光素子を光源とする車両の照明灯や標識灯に関し、特に発光素子に電力を供給するための給電構造に関するものである。   The present invention relates to a vehicle illuminating lamp or a marker lamp using a light emitting element such as an LED (light emitting diode) as a light source, and more particularly to a power feeding structure for supplying power to the light emitting element.

近年の自動車では、ヘッドランプやテールランプ等の灯具の省エネルギ化を図るために、光源体にLED素子等の発光素子を用いたランプが提案されている。この種のランプではランプハウジング内に配設した配線部材にLED素子を実装し、当該配線部材を通して車載バッテリ電力をLED素子に給電しているが、この給電構造としてはLED素子の電極を配線部材に対して半田付け等により機械的、電気的に接続する構成がとられている。しかし、光源体として多数個のLED素子を搭載するランプではそれぞれのLED素子に対して半田付けを行う必要があるため、半田付けの作業工数が無視できず、コスト高の要因になる。また、LED素子を発光したときの熱で半田が溶融して半田付けの信頼性が低下するおそれがあるため、LED素子に給電する電力を制限してLED素子の発光を抑制せざるを得ず、ランプの照射光度を高める上での障害になっている。   In recent automobiles, in order to save energy of lamps such as a head lamp and a tail lamp, a lamp using a light emitting element such as an LED element as a light source is proposed. In this type of lamp, an LED element is mounted on a wiring member disposed in the lamp housing, and vehicle-mounted battery power is supplied to the LED element through the wiring member. As this power supply structure, the electrode of the LED element is connected to the wiring member. The structure is mechanically and electrically connected by soldering or the like. However, in a lamp mounted with a large number of LED elements as a light source body, it is necessary to perform soldering on each LED element. Therefore, the number of man-hours for soldering cannot be ignored, resulting in high costs. In addition, since the solder melts due to the heat generated when the LED element emits light and the reliability of soldering may be reduced, the power supplied to the LED element must be limited to suppress the light emission of the LED element. This is an obstacle to increasing the luminous intensity of the lamp.

このような半田付け構造に起因する問題を解消するために、特許文献1ではLED素子に設けた被係合部に電極を露呈させた構造とし、一方ベース部材には導電部を一体に有する係合部を設けておき、LED素子をベース部材の係合部に係合させることにより、LED素子の係合保持と電極に対する給電を同時に行うようにした技術が提案されている。また、特許文献2ではLED素子の電極を給電用の導電フィルムの金属層に対して超音波接合した技術が提案されている。このように半田付けに代えて係合構造や超音波接合構造を採用することで、少なくともLED素子の発熱が要因となる半田付けの信頼性の低下が解消できる。
特開2001−80412号公報 特開2005−322450号公報
In order to solve such a problem caused by the soldering structure, Patent Document 1 discloses a structure in which an electrode is exposed to an engaged portion provided in an LED element, while the base member has a conductive portion integrally. There has been proposed a technique in which a joint portion is provided and the LED element is engaged with the engaging portion of the base member to simultaneously hold the LED element and supply power to the electrode. Patent Document 2 proposes a technique in which an electrode of an LED element is ultrasonically bonded to a metal layer of a conductive film for power supply. Thus, by adopting an engagement structure or an ultrasonic bonding structure instead of soldering, it is possible to eliminate a decrease in reliability of soldering caused by at least heat generation of the LED element.
JP 2001-80412 A JP 2005-322450 A

特許文献1の技術はLED素子の電極とベース部材の導電部とを直接接触させて給電を行っているが、電極と導電部はそれぞれ平坦面であるので両者の接触不良が生じ易い。特に、LED素子やベース部材の製造上の寸法誤差による接触不良や、自動車の走行に伴う振動による接触不良が生じ易く、LED素子の発光不良や発光の瞬断等が生じるおそれがある。また、特許文献1のLED素子は被係合部に電極を露呈させるための構造が必要であり、標準化されている市販のLED素子をそのまま利用することが難しく、LED素子を特注したときにはコスト高を招くことになる。特許文献2の技術はLED素子と金属層との電気的な接続の信頼性に高いものが得られるが、個々のLED素子に対して超音波接合を行う必要があるため、組付け作業が煩雑になり、コストを削減することが難しい。また、超音波溶着構造であるために、メンテナンス等においてLED素子を交換することが難しい。   In the technique of Patent Document 1, power is supplied by directly contacting the electrode of the LED element and the conductive portion of the base member. However, since the electrode and the conductive portion are flat surfaces, contact failure between them tends to occur. In particular, contact failures due to dimensional errors in manufacturing LED elements and base members, and contact failures due to vibrations associated with driving of automobiles are likely to occur, and there is a risk of LED element light emission failure or instantaneous light emission interruption. Further, the LED element of Patent Document 1 requires a structure for exposing the electrode to the engaged portion, and it is difficult to use a commercially available LED element that is standardized as it is. Will be invited. Although the technology of Patent Document 2 provides a highly reliable electrical connection between the LED element and the metal layer, since it is necessary to perform ultrasonic bonding on each LED element, the assembly work is complicated. It is difficult to reduce costs. In addition, because of the ultrasonic welding structure, it is difficult to replace the LED element in maintenance or the like.

本発明の目的は、半田を用いることなく発光素子への給電を実現する一方で、電極での電気接続の信頼性を高め、かつ低コストに構成することを可能にした発光素子給電構造を提供するものである。   An object of the present invention is to provide a light-emitting element power supply structure that realizes power supply to a light-emitting element without using solder, while increasing the reliability of electrical connection at an electrode and can be configured at low cost. To do.

本発明は、ベース部材の表面に密接して配設され、少なくとも一部に給電用の導電層が露呈されている面状配線部材と、面状配線部材に対面する電極を備えて面状配線部材に対向配置される発光素子と、発光素子を面状配線部材の露呈された導電層に対して位置決めし、かつ面状配線部材に対して押圧状態に固定する固定手段と、発光素子の電極と導電層との間に介在され、これら電極と導電層に弾接する導電性の接点部材とを備え、かつ接点部材は前記固定手段と一体に形成されていることを特徴とする。 The present invention includes a planar wiring member that is disposed in close contact with the surface of the base member and has a conductive layer for power supply exposed at least partially, and an electrode facing the planar wiring member. A light emitting element disposed opposite to the member, a fixing means for positioning the light emitting element with respect to the exposed conductive layer of the planar wiring member and fixing the light emitting element in a pressed state with respect to the planar wiring member, and an electrode of the light emitting element and is interposed between the conductive layers, Bei example a contact member of conductive resilient contact with the electrodes and the conductive layer, and the contact member is characterized by being formed integrally with the fixing means.

本発明によれば、発光素子の電極と、面状配線部材の導電層とを弾性を有する接点部材を介して電気接続するので半田を用いなくても接触抵抗の小さい電気接続が実現できる。また、発光素子で発生した熱を接点部材を介して面状配線部材に効率良く伝熱し、さらにベース部材にまで伝熱させることで放熱性を高めることができる。そのため、発光素子の発熱による半田の溶融及び接続不良の問題が解消でき、信頼性の高い電気接続が得られる。組立に際しては発光素子、固定手段、接点部材を係合させ、あるいは一部においてネジ止めするだけでよく、組立作業を簡略化し、低コスト化が可能になる。   According to the present invention, since the electrode of the light emitting element and the conductive layer of the planar wiring member are electrically connected via the elastic contact member, electrical connection with low contact resistance can be realized without using solder. In addition, heat generated in the light emitting element can be efficiently transferred to the planar wiring member via the contact member, and further transferred to the base member, thereby improving heat dissipation. Therefore, the problem of melting of solder and poor connection due to heat generation of the light emitting element can be solved, and highly reliable electrical connection can be obtained. At the time of assembly, it is only necessary to engage the light emitting element, the fixing means, and the contact member, or to screw in part, so that the assembly operation can be simplified and the cost can be reduced.

本発明において、接点部材を固定手段と一体に形成することにより、構成部品点数を削減し、組立作業のさらなる簡略化、低コスト化を図ることができる。 In the present invention , by forming the contact member integrally with the fixing means, the number of components can be reduced, and the assembly work can be further simplified and the cost can be reduced.

本発明における好ましい形態の一つとして、固定手段を、発光素子の位置決めを行うためのケースと、発光素子を面状配線部材に向けて押圧するためのカバーとで構成する。ケースとカバー、ないし接点部材をサブアッシーして発光素子をユニット化することが可能であり、組立の作業性を改善する上で有利になる。   As one of the preferred embodiments in the present invention, the fixing means is composed of a case for positioning the light emitting element and a cover for pressing the light emitting element toward the planar wiring member. The case and cover or contact member can be sub-assembled to unitize the light emitting elements, which is advantageous in improving the workability of assembly.

さらに、本発明において、カバーを発光素子から出射した光を反射、又は屈折する光学部材の一部で構成した形態とすれば、独立したカバーが不要になり、部品点数を削減し、かつ組立作業の簡略化が可能になる。   Furthermore, in the present invention, if the cover is configured by a part of the optical member that reflects or refracts the light emitted from the light emitting element, an independent cover becomes unnecessary, the number of parts is reduced, and assembly work is performed. Can be simplified.

本発明において、ベース部材を放熱体とした形態とすれば、発光素子で発生した熱を面状配線部材からベース部材に伝熱し、さらにベース部材から放熱させることができ、発光素子の放熱効果を高めることができる。   In the present invention, if the base member is configured as a radiator, the heat generated in the light emitting element can be transferred from the planar wiring member to the base member, and further radiated from the base member. Can be increased.

次に、本発明の実施例1を説明する。図1は本発明を自動車のヘッドランプに適用した断面図である。容器状をしたランプボディ2と、ランプボディ2の前面開口に取着される光透過カバー3とでランプハウジング1が構成されており、このランプハウジング1内にリフレクタ4が配設され、このリフレクタ4の裏面側に光源体としての複数個のLED素子ユニット5が配設されている。各LED素子ユニット5はヒートシンクを兼ねるベース部材6に支持された面状配線部材7に対して実装されており、この面状配線部材7に接続したコネクタ8を通して図には表れない車載バッテリに接続され、車載バッテリの電力が給電されて発光するようになっている。前記リフレクタ4は前記各LED素子ユニット5に対応した開口窓41が開けられており、各LED素子ユニット5で発光した光は開口窓41を通してリフレクタ4の表面側の反射面に投射され、ここで反射されて前記光透過カバー3を透過し、自動車の前方に向けて所要の配光特性で照射されるようになっている。   Next, Example 1 of the present invention will be described. FIG. 1 is a sectional view in which the present invention is applied to a headlamp of an automobile. A lamp housing 2 is composed of a container-shaped lamp body 2 and a light-transmitting cover 3 attached to the front opening of the lamp body 2, and a reflector 4 is disposed in the lamp housing 1, and the reflector A plurality of LED element units 5 as light source bodies are disposed on the back surface side of 4. Each LED element unit 5 is mounted on a planar wiring member 7 supported by a base member 6 also serving as a heat sink, and is connected to an in-vehicle battery not shown in the figure through a connector 8 connected to the planar wiring member 7. In addition, the power of the in-vehicle battery is supplied with power to emit light. The reflector 4 has an opening window 41 corresponding to each LED element unit 5, and the light emitted from each LED element unit 5 is projected through the opening window 41 onto the reflecting surface on the surface side of the reflector 4. The light is reflected and transmitted through the light transmission cover 3, and is irradiated toward the front of the automobile with a required light distribution characteristic.

前記LED素子ユニット5、ベース部材6、面状配線部材7の詳細を図2に示す。ここでは説明を簡略化するために、多数のLED素子ユニット5のうち、3つのLED素子ユニット5についてのみ図示している。ベース部材6はアルミニウムや鉄等の剛性が高く、熱伝導性の良い金属でヒートシンクとして形成されており、各LED素子ユニット5を実装するための実装領域61は前記リフレクタ4の背面形状に沿って横方向に段差を有する階段状に形成されている。また、ベース部材6の後面側には各実装領域における放熱効果を高めるために後方に突出した複数の放熱フィン62を有している。一方、ベース部材6の前面側には面状配線部材7として、ここでは横方向に延長されたFPC(フレキシブルプリント回路)が配設されており、ベース部材6の階段形状に沿って階段状に折り曲げられている。このFPC7は表裏の絶縁層74間に並列平面配置された一対の導電層71が所要パターンに形成されたものであり、ここでは導電層71は図2の上下方向に隣接配置されて左右方向に延びる一対の導電層として形成されている。この一対の導電層71は一端部にコネクタ8が接続され、図には示されない車載バッテリにコネクタ接続される。また、前記FPC7は、前記ベース部材6の各実装領域61に対応する箇所において前面側の絶縁層が部分的に除去された窓部72が形成されており、この窓部72において各導電層71が露呈されている。   Details of the LED element unit 5, the base member 6, and the planar wiring member 7 are shown in FIG. Here, in order to simplify the description, only three LED element units 5 among the many LED element units 5 are illustrated. The base member 6 is formed of a metal having high rigidity such as aluminum or iron and having good thermal conductivity as a heat sink, and a mounting region 61 for mounting each LED element unit 5 follows the shape of the back surface of the reflector 4. It is formed in a step shape having a step in the lateral direction. In addition, the rear surface side of the base member 6 has a plurality of heat dissipating fins 62 protruding rearward in order to enhance the heat dissipating effect in each mounting region. On the other hand, an FPC (flexible printed circuit) extending in the lateral direction is provided as a planar wiring member 7 on the front side of the base member 6, and is stepped along the step shape of the base member 6. It is bent. In this FPC 7, a pair of conductive layers 71 arranged in parallel plane between front and back insulating layers 74 are formed in a required pattern. Here, the conductive layers 71 are arranged adjacent to each other in the vertical direction in FIG. It is formed as a pair of extending conductive layers. The pair of conductive layers 71 is connected to a connector 8 at one end, and is connected to an in-vehicle battery not shown in the drawing. Further, the FPC 7 is formed with a window portion 72 from which the insulating layer on the front side is partially removed at locations corresponding to the mounting regions 61 of the base member 6, and the conductive layers 71 are formed in the window portion 72. Is exposed.

図3は前記LED素子ユニット5、ベース部材6、面状配線部材7の部分分解斜視図である。前記ベース部材6の各実装領域61にはそれぞれLED素子ユニット5を固定するための一対のネジ穴63が開口され、これに対応するFPC7にはそれぞれ一対の挿通穴72が開口されている。LED素子ユニット5は、概念構成としては、LED素子51と、このLED素子51をベース部材6及び面状配線部材7に対して固定するための固定手段と、LED素子51を面状配線部材7に対して電気接続するための接点部材とで構成されている。ここで、固定手段はケース52とカバー5とで構成されている。LED素子51は偏平な四角柱に近い外形をしたパッケージ511の頂面にレンズ512を一体化したディスクリート型LED素子として構成されており、パッケージ511の底面には破線で示すように一対の電極513が上下に並んで配設されている。このLED素子51は、前記一対の電極513に対して給電することによりパッケージ511内に内装した図には表れないLEDチップが発光し、発光した光が前記レンズ512を透過して集光されながら出射されるものであり、このようなLED素子は広く知られているのでここでは詳細な説明は省略する。   FIG. 3 is a partially exploded perspective view of the LED element unit 5, the base member 6, and the planar wiring member 7. A pair of screw holes 63 for fixing the LED element unit 5 is opened in each mounting region 61 of the base member 6, and a pair of insertion holes 72 are opened in the corresponding FPC 7. The LED element unit 5 has, as a conceptual configuration, an LED element 51, fixing means for fixing the LED element 51 to the base member 6 and the planar wiring member 7, and the LED element 51 to the planar wiring member 7. And a contact member for electrical connection. Here, the fixing means includes a case 52 and a cover 5. The LED element 51 is configured as a discrete LED element in which a lens 512 is integrated with the top surface of a package 511 having an outer shape close to a flat quadrangular prism, and a pair of electrodes 513 is formed on the bottom surface of the package 511 as indicated by a broken line. Are arranged side by side. In the LED element 51, power is supplied to the pair of electrodes 513 so that an LED chip that is not shown in the figure inside the package 511 emits light, and the emitted light passes through the lens 512 and is condensed. Since such an LED element is widely known, detailed description thereof is omitted here.

前記ケース52は前記LED素子51を収納できるように板厚方向に貫通した矩形(正方形)の収納口521を有する直方体をした絶縁樹脂で形成されており、この収納口521を上下に挟む位置には前記ベース部材6のネジ穴63に対応する一対の挿通穴522が開口されており、この挿通穴522を挿通する一対のネジ50を前記FPC7の挿通穴73を通した上でベース部材6のネジ穴63に螺合させることによりケース52及びFPC7をベース部材6の実装領域61に固定するようになっている。また、前記ケース52の前記収納口521内には一対の接点部材54をそれぞれ一端支持している。これら接点部材54は、実施例1では銅等の弾性力のある導電材料をストリップ状に形成した上で、一端をケース52に一体成形して支持させるとともに、他端部は板厚方向に湾曲加工して円形ないし楕円形に近い形状の接点片として構成している。これらの接点片54は収納口521にLED素子51が収納されたときに、一方の面において当該LED素子51の一対の電極513に接触すると同時に、他方の面においてFPC7の窓部72内に露呈された一対の導電層71に接触するように、両面がケース52の前面側の後面側にそれぞれ突出するように形成されている。また、ケース52の左右の側面にはテーパ状をした係合爪523が一体に突出形成されている。   The case 52 is formed of a rectangular parallelepiped insulating resin having a rectangular (square) storage port 521 penetrating in the plate thickness direction so that the LED element 51 can be stored. A pair of insertion holes 522 corresponding to the screw holes 63 of the base member 6 are opened, and the pair of screws 50 inserted through the insertion holes 522 are passed through the insertion holes 73 of the FPC 7 and then the base member 6 The case 52 and the FPC 7 are fixed to the mounting region 61 of the base member 6 by being screwed into the screw holes 63. In addition, a pair of contact members 54 are respectively supported at one end in the storage port 521 of the case 52. In the first embodiment, these contact members 54 are formed by forming a conductive material having elasticity, such as copper, in a strip shape and supporting one end integrally formed with the case 52, and the other end is curved in the thickness direction. It is processed and configured as a contact piece having a circular or elliptical shape. When the LED element 51 is stored in the storage port 521, these contact pieces 54 come into contact with the pair of electrodes 513 of the LED element 51 on one side, and at the same time, are exposed in the window 72 of the FPC 7 on the other side. Both surfaces of the case 52 are formed so as to protrude toward the rear surface side of the front surface side of the case 52 so as to contact the pair of conductive layers 71 formed. Further, tapered engagement claws 523 are integrally formed on the left and right side surfaces of the case 52.

前記カバー53は、弾力性のある金属板で概ねコ字状に形成されており、中央片53cには前記LED素子51のレンズ512を挿通させるための円形窓531が開口され、左側片53lと右両側片53rには前記ケース52の係合爪523に係合可能な係合穴532が開口されている。このカバー53は前記ケース52の正面側から被せたときに、両側片53l,53rの係合穴532が係合爪523に係合し、ケース52に対してカバー53が取着されることになる。   The cover 53 is made of an elastic metal plate and is generally U-shaped, and a circular window 531 through which the lens 512 of the LED element 51 is inserted is opened in the center piece 53c. Engagement holes 532 that can be engaged with the engaging claws 523 of the case 52 are opened in the right side pieces 53r. When the cover 53 is covered from the front side of the case 52, the engagement holes 532 of the side pieces 53 l and 53 r are engaged with the engagement claws 523, and the cover 53 is attached to the case 52. Become.

この構成によれば、ランプの組立に際しては、図4(a),(b)の垂直断面図と水平断面図を参照すると、最初にケース52の収納口521内にLED素子51を収納し、カバー53をLED素子51を前方から覆うようにケース52の前面側から被せて左右の各側片の係合穴532を係合爪523に係合させる。これによりカバー53はケース52に一体化され、同時にケース52内にLED素子51を内挿支持し、これらでサブアッシーしたLED素子ユニット5が構成される。このLED素子ユニット5では、LED素子51はカバー53によって収納口521の前方に脱落することが防止され、後面側においては一対の電極513が一対の接点片54にそれぞれ当接されることにより収納口521の後方に脱落することも防止される。しかる上で、LED素子ユニット5をベース部材6に固定する。ここでは、一対のネジ50をケース52の挿通穴522に挿通させ、次いでFPC7の挿通穴73を挿通させた上でベース部材6のネジ穴63に螺合させる。これによりLED素子ユニット5はベース部材6に固定されるが、このときFPC7をベース部材6との間に挟持した状態で固定支持させる。そして、この固定した状態では、一対の接点片54はFPC7の露呈されている一対の導電層71に接触し、電気的な導通が行われる。これらの接点片54はLED素子51の裏面の一対の電極513にそれぞれ接しているので、これらの接点片54を介してLED素子51の各電極513がFPC7の一対の導電層71に電気接続されることになる。   According to this configuration, when assembling the lamp, referring to the vertical sectional view and the horizontal sectional view of FIGS. 4A and 4B, the LED element 51 is first housed in the housing port 521 of the case 52, The cover 53 is covered from the front side of the case 52 so as to cover the LED element 51 from the front, and the engagement holes 532 of the left and right side pieces are engaged with the engagement claws 523. As a result, the cover 53 is integrated with the case 52, and at the same time, the LED element 51 is inserted and supported in the case 52, and the LED element unit 5 sub-assembled with these is constituted. In this LED element unit 5, the LED element 51 is prevented from falling off in front of the storage port 521 by the cover 53, and the pair of electrodes 513 are respectively brought into contact with the pair of contact pieces 54 on the rear surface side. It is also possible to prevent the outlet 521 from dropping out. Then, the LED element unit 5 is fixed to the base member 6. Here, the pair of screws 50 are inserted into the insertion holes 522 of the case 52, and then inserted into the screw holes 63 of the base member 6 after the insertion holes 73 of the FPC 7 are inserted. As a result, the LED element unit 5 is fixed to the base member 6. At this time, the FPC 7 is fixedly supported while being sandwiched between the LED element unit 5 and the base member 6. In this fixed state, the pair of contact pieces 54 come into contact with the pair of conductive layers 71 exposed from the FPC 7 so that electrical conduction is performed. Since these contact pieces 54 are in contact with the pair of electrodes 513 on the back surface of the LED element 51, each electrode 513 of the LED element 51 is electrically connected to the pair of conductive layers 71 of the FPC 7 via these contact pieces 54. Will be.

図1に示したコネクタ8を介して車載バッテリの電力がFPC7の導電層71に供給されると、導電層71から接点片54を介してLED素子51に給電されLED素子51が発光される。発光した光はLED素子51のレンズ512から前方に出射され、リフレクタ4の開口窓41を通してリフレクタ4の反射面に投射され、ここで自動車の前方に向けて照射される。一方、LED素子51の発光に伴って発生した熱はパッケージ511の4側面からケース52に伝熱され、さらにベース部材6に伝熱される。同時にパッケージ511の裏面の電極513から接点片54を介してFPC7の導電層71に伝導され、さらにこれに接しているベース部材6に伝熱される。これらのベース部材6に伝熱された熱は放熱フィン62を通して放熱される。これにより、LED素子51の過熱が防止され、LED素子51の安定した発光が保持される。   When the electric power of the vehicle-mounted battery is supplied to the conductive layer 71 of the FPC 7 via the connector 8 shown in FIG. 1, the LED element 51 is supplied with power from the conductive layer 71 via the contact piece 54 to emit light. The emitted light is emitted forward from the lens 512 of the LED element 51, is projected onto the reflecting surface of the reflector 4 through the opening window 41 of the reflector 4, and is irradiated toward the front of the automobile here. On the other hand, the heat generated with the light emission of the LED element 51 is transferred from the four side surfaces of the package 511 to the case 52 and further transferred to the base member 6. At the same time, the heat is transferred from the electrode 513 on the back surface of the package 511 to the conductive layer 71 of the FPC 7 through the contact piece 54 and further transferred to the base member 6 in contact therewith. The heat transferred to these base members 6 is radiated through the radiation fins 62. Thereby, overheating of the LED element 51 is prevented, and stable light emission of the LED element 51 is maintained.

このように、実施例1では、手作業によってLED素子51をケース52に収納し、さらにカバー53をケース52に係合することによってLED素子ユニット5が構成でき、その上でLED素子ユニット5をFPC7と共にベース部材6にネジ止めする作業を行うことによってLED素子のランプハウジング1内への実装が完了できるので、ランプの組立に際しては半田付けやその他の特許文献2のような超音波溶着作業は不要であり、作業工数の増大を抑制してランプの低コスト化に有利となる。一方、LED素子51とFPC7の電気接続においては、電極513と導電層71との間に介在される接点片54の弾性力によって接触が保持されるので、これらにおける寸法誤差や自動車の走行に伴う振動等によっても接触不良が生じることは少なく、LED素子51における発光不良や発光の瞬断等が防止できる。また、接点片54の幅寸法を可及的に大きくすることでLED素子51からFPC7への伝熱効果を高め、LED素子51の放熱効果を高める上でも有利になる。   As described above, in Example 1, the LED element 51 can be configured by manually storing the LED element 51 in the case 52 and further engaging the cover 53 with the case 52. Since the LED element can be mounted in the lamp housing 1 by screwing the base member 6 together with the FPC 7, soldering and other ultrasonic welding operations such as Patent Document 2 are not necessary when assembling the lamp. This is unnecessary and is advantageous in reducing the cost of the lamp by suppressing an increase in work man-hours. On the other hand, in the electrical connection between the LED element 51 and the FPC 7, the contact is maintained by the elastic force of the contact piece 54 interposed between the electrode 513 and the conductive layer 71. Contact failure is rarely caused by vibration or the like, and light emission failure or instantaneous light emission interruption in the LED element 51 can be prevented. Further, by increasing the width dimension of the contact piece 54 as much as possible, the heat transfer effect from the LED element 51 to the FPC 7 is enhanced, and this is advantageous in enhancing the heat dissipation effect of the LED element 51.

図5は本発明の固定手段の変形例である実施例2の要部の部分斜視図である。実施例1と等価な部分には同一符号を付して詳細な説明は省略する。実施例2はLED素子ユニット5の一部を構成する接点部材をケース52とは別部品として構成したものである。ケース52には実施例1と同様にLED素子51を収納する収納口521を有しているが、この収納口内521には実施例1のような接点片54は設けられていない。その代わりに、LED素子51のパッケージ511の外形にほぼ等しく収納口521内に収納可能な寸法の矩形枠状をした絶縁樹脂からなる枠体551を備え、この枠体551の内部に一対の接点片552を一体に支持した接点部材55が設けられている。これら接点片552の構成は実施例1の接点片54とほぼ同じであるが、板厚方向に湾曲加工して円形ないし楕円形に近い形状に加工された部分は枠体551の前面側と後面側にそれぞれ突出した構成としていることが肝要である。   FIG. 5 is a partial perspective view of a main part of the second embodiment which is a modification of the fixing means of the present invention. Parts equivalent to those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the second embodiment, a contact member constituting a part of the LED element unit 5 is configured as a separate part from the case 52. The case 52 has a storage port 521 for storing the LED element 51 as in the first embodiment, but the contact piece 54 as in the first embodiment is not provided in the storage port 521. Instead, a frame body 551 made of an insulating resin having a rectangular frame shape having a size approximately equal to the outer shape of the package 511 of the LED element 51 and capable of being housed in the housing port 521 is provided, and a pair of contact points is provided inside the frame body 551. A contact member 55 that integrally supports the piece 552 is provided. The configuration of these contact pieces 552 is almost the same as that of the contact piece 54 of the first embodiment, but the parts processed into a circular or elliptical shape by bending in the thickness direction are the front side and the rear side of the frame 551. It is important to have a configuration that protrudes to the side.

実施例2においては、ランプの組立に際しては、図6(a),(b)の垂直断面図と水平断面図を参照すると、ここでは先にケース52をFPC7を挟んでベース部材6にネジ50でネジ止めする。しかる上で、ケース52の収納口521内に接点部材55を内装し、次いでLED素子51を内装し、最後にカバー53をケース52の前面側から被せ、係合穴532を係合爪523に係合させる。このようにすることでベース部材6及びFPC7に対して固定された状態のLED素子ユニット5を組み立てることができる。組み立てられたLED素子ユニット5では、LED素子51の裏面の電極513とFPC7の露呈された導電層71との間に接点部材55が介在され、接点部材55の枠体551がLED素子51とFPC7との間のスペーサとして機能する一方で、接点部材55の接点片552によって実施例1と同様にLED素子51の電極513とFPC7の導電層71との間の電気接続が行われ、LED素子51の発光が可能になる。LDE素子51の発光により発生した熱はケース52及びFPC7を介してベース部材6に伝熱され、ここから放熱されることは言うまでもない。   In the second embodiment, when assembling the lamp, referring to the vertical sectional view and the horizontal sectional view of FIGS. 6A and 6B, the case 52 is first screwed to the base member 6 with the FPC 7 interposed therebetween. Secure with screws. Then, the contact member 55 is installed in the storage port 521 of the case 52, then the LED element 51 is installed, and finally the cover 53 is covered from the front side of the case 52, and the engagement hole 532 is attached to the engagement claw 523. Engage. By doing in this way, the LED element unit 5 of the state fixed with respect to the base member 6 and FPC7 can be assembled. In the assembled LED element unit 5, the contact member 55 is interposed between the electrode 513 on the back surface of the LED element 51 and the exposed conductive layer 71 of the FPC 7, and the frame 551 of the contact member 55 is connected to the LED element 51 and the FPC 7. The contact piece 552 of the contact member 55 makes electrical connection between the electrode 513 of the LED element 51 and the conductive layer 71 of the FPC 7 in the same manner as in the first embodiment. Can be emitted. It goes without saying that the heat generated by the light emission of the LDE element 51 is transferred to the base member 6 through the case 52 and the FPC 7 and is radiated from here.

実施例2は、規格の異なるLED素子を使用する場合でも同じケースやカバーを利用することが可能になる。例えば、パッケージの厚み寸法が異なるLED素子や、パッケージ裏面の電極の位置や寸法が異なるLED素子においても、接点片が当該LED素子の電極の位置や寸法に対応した規格の接点部材に変更すればLED素子に対する給電が可能になる。例えば、図7(a)に示すように、パッケージ511の裏面からL字状に電極514が突出されているLED素子51Aの場合でも、枠551の厚み寸法を小さくした接点部材55Aを用意しておくことにより、同じケース52とカバー53を利用しても当該LED素子51Aの電極514とFPC7の導電層71との間の電気接続が確保でき、LED素子51Aに対する給電が可能になる。あるいは、図7(b)に示すように、パッケージ511の外形寸法がケース52の収納口521の寸法よりも小さいLED素子51Bの場合でも、枠体551の周縁部をパッケージ511の側面と収納口521の内面との間に介在するように突出形成した突出縁551aを有する接点部材55Bを用いることで、この突出縁551aがLED素子51Bのパッケージ511と収納口521との間のガタを吸収するスペーサとして機能し、当該LED素子51Bを収納口521内において安定な位置に収納することが可能になる。   The second embodiment can use the same case or cover even when LED elements having different standards are used. For example, even in the case of LED elements having different package thickness dimensions and LED elements having different positions and dimensions of electrodes on the back side of the package, the contact piece is changed to a standard contact member corresponding to the position and dimensions of the electrodes of the LED elements. Power can be supplied to the LED element. For example, as shown in FIG. 7A, even in the case of the LED element 51A in which the electrode 514 protrudes in an L shape from the back surface of the package 511, a contact member 55A having a reduced thickness dimension of the frame 551 is prepared. Thus, even when the same case 52 and cover 53 are used, electrical connection between the electrode 514 of the LED element 51A and the conductive layer 71 of the FPC 7 can be secured, and power supply to the LED element 51A can be achieved. Alternatively, as shown in FIG. 7B, even in the case of the LED element 51 </ b> B whose outer dimension of the package 511 is smaller than the dimension of the storage port 521 of the case 52, the peripheral part of the frame 551 is connected to the side surface of the package 511 By using the contact member 55B having the protruding edge 551a formed so as to protrude between the inner surface of the 521, the protruding edge 551a absorbs backlash between the package 511 of the LED element 51B and the storage port 521. It functions as a spacer, and the LED element 51B can be stored in a stable position in the storage port 521.

なお、実施例1,2において、ケース52をベース部材6にネジ止めする構成として、ベース部材6のネジ穴63を挿通穴に変更し、またケース52の挿通穴522をネジ穴に変更した上で、ベース部材6の裏面側から挿通穴に挿入したネジをケース52のネジ穴に螺合してケース52をベース部材6に固定するようにしてもよい。   In the first and second embodiments, the case 52 is screwed to the base member 6, and the screw hole 63 of the base member 6 is changed to an insertion hole, and the insertion hole 522 of the case 52 is changed to a screw hole. Thus, the case 52 may be fixed to the base member 6 by screwing the screw inserted into the insertion hole from the back side of the base member 6 into the screw hole of the case 52.

図8は本発明の固定手段の他の変形例である実施例3の要部の部分斜視図である。実施例1,2ではケースをベース部材にネジ止めしていたが、実施例3ではこのネジ止めを不要にしたものである。実施例3は実施例1の変形例を示しており、実施例1と等価な部分には同一符号を付して説明は省略する。ここでは、ベース部材6の実装領域61の前面にはケース52の挿通穴522に対応する位置に一対のボス64が前方に向けて突出形成され、このボス64がFPC7の挿通穴73とケース52の挿通穴522に挿入され、これらによってケース52とFPC7のベース部材6に対する位置決めを行っている。ケースは実施例1と同じであり、収納口521内に本発明の接点部材を構成する一対の接点片54が一端支持状態で配設されている。一方、カバー53Aは中央片53c及び左右側片53l,53rは実施例1,2と同じであるが、これに加えて中央片53cの上縁部と下縁部からそれぞれ上下方及び後方に延びる上側片53uと下側片53dを有しており、これら上側片53uと下側片53dの先端はベース部材6の上面部と下面部にまで達し、かつ先端部が内側に折り曲げられたフック部533として形成されている。このフック部533に対応してベース部材6の上面部と下面部にはそれぞれフック部533が嵌入可能なスリット65が形成されている。   FIG. 8 is a partial perspective view of an essential part of Embodiment 3 which is another modification of the fixing means of the present invention. In the first and second embodiments, the case is screwed to the base member, but in the third embodiment, this screwing is unnecessary. The third embodiment shows a modification of the first embodiment, and the same parts as those in the first embodiment are denoted by the same reference numerals and the description thereof is omitted. Here, a pair of bosses 64 project from the front surface of the mounting region 61 of the base member 6 at positions corresponding to the insertion holes 522 of the case 52, and the bosses 64 are formed in the insertion holes 73 of the FPC 7 and the case 52. These are inserted into the insertion holes 522, and the positioning of the case 52 and the FPC 7 with respect to the base member 6 is performed by these. The case is the same as that of the first embodiment, and a pair of contact pieces 54 constituting the contact member of the present invention are disposed in the storage port 521 in a supported state. On the other hand, the cover 53A is the same as the first and second embodiments in the center piece 53c and the left and right side pieces 53l and 53r. The upper piece 53u and the lower piece 53d are provided, the tips of the upper piece 53u and the lower piece 53d reach the upper surface portion and the lower surface portion of the base member 6, and the hook portion is bent inward. 533 is formed. Corresponding to the hook portion 533, slits 65 into which the hook portion 533 can be fitted are formed on the upper surface portion and the lower surface portion of the base member 6, respectively.

実施例3では、図9(a),(b)の垂直断面図と水平断面図を参照すると、先にベース部材6のボス64にFPC7の挿通穴73とケース52の挿通穴522を挿通させてケース52を仮固定する。その上でケース52の収納口521内にLED素子51を内装する。最後にカバー53Aをケース52に係合させる。カバー53AはLED素子51の前面側、すなわちケース52の前面側から被せて係合穴532を係合爪523に係合させることによりケース52に一体化され、カバー53AによってLED素子51が収納口521の前方から脱落することが防止される。また、これと同時にカバー53Aの上側片53uと下側片53dの各フック部533をベース部材6の上面と下面の各スリット65にそれぞれ係合させ、カバー53Aをベース部材6に固定する。これにより、カバー53Aを介してケース52及びFPC7がベース部材6に挟持された状態で固定される。このとき、実施例1と同様にLED素子51は裏面において一対の電極513が接点部材の一対の接点片54にそれぞれ接触され、収納口521の後方に脱落することが防止されることは言うまでもなく、さらに、一対の接点片54はFPC7の露呈されている一対の導電層71に接触し、電気的な導通が行われるので、これら接点片54を介してLED素子51の一対の電極513はFPC7の一対の導電層71に電気接続されることになる。   In the third embodiment, referring to the vertical sectional view and the horizontal sectional view of FIGS. 9A and 9B, first, the insertion hole 73 of the FPC 7 and the insertion hole 522 of the case 52 are inserted into the boss 64 of the base member 6. The case 52 is temporarily fixed. On top of that, the LED element 51 is housed in the storage port 521 of the case 52. Finally, the cover 53A is engaged with the case 52. The cover 53A is integrated with the case 52 by covering the front surface side of the LED element 51, that is, the front surface side of the case 52, and engaging the engagement holes 532 with the engagement claws 523, and the LED element 51 is received by the cover 53A. It is prevented from dropping from the front of 521. At the same time, the hooks 533 of the upper piece 53u and the lower piece 53d of the cover 53A are engaged with the slits 65 on the upper surface and the lower surface of the base member 6 to fix the cover 53A to the base member 6. As a result, the case 52 and the FPC 7 are fixed while being sandwiched by the base member 6 via the cover 53A. At this time, it is needless to say that the LED element 51 is prevented from coming off behind the storage port 521 as the pair of electrodes 513 are in contact with the pair of contact pieces 54 of the contact member on the back surface as in the first embodiment. Further, since the pair of contact pieces 54 come into contact with the pair of conductive layers 71 exposed from the FPC 7 and electrical conduction is performed, the pair of electrodes 513 of the LED element 51 is connected to the FPC 7 via the contact pieces 54. The pair of conductive layers 71 are electrically connected.

実施例3では、ケース52をベース部材6に固定するためのネジの締結作業が不要になるため、組立の作業を極めて簡略化することができる。ケース52はカバー53Aによってベース部材6に押圧された状態で支持されているので、実施例1,2のようなネジによる固定よりも支持の安定性は若干低下するが、LED素子51とFPC7との間には弾性を有する接点片54が介在されているので、LED素子51の電極513とFPC7の導電層71との電気接続の信頼性が低下されることはない。   In the third embodiment, a screw fastening operation for fixing the case 52 to the base member 6 is not necessary, so that the assembly operation can be greatly simplified. Since the case 52 is supported while being pressed against the base member 6 by the cover 53A, the stability of the support is slightly lower than that of fixing with screws as in the first and second embodiments, but the LED element 51 and the FPC 7 Since the elastic contact piece 54 is interposed between the electrodes, the reliability of the electrical connection between the electrode 513 of the LED element 51 and the conductive layer 71 of the FPC 7 is not lowered.

この実施例3において、ベース部材6の実装領域の前面の上下方向の寸法に余裕があるときには、当該実装領域の前面のFPC7を挟む上下の位置に横方向に延びる一対のスリットを形成しておき、このスリットにカバー53Aの上側片53uと下側片53dの各フック部533を挿入してスリットに対する係合を行い、カバー52をベース部材6に固定させるようにしてもよい。この場合には、フック部533の形状を実施例3とは変形させてスリットに対する係合を行うようにすることが必要となる場合がある。   In the third embodiment, when there is a margin in the vertical dimension of the front surface of the mounting area of the base member 6, a pair of slits extending in the horizontal direction are formed at vertical positions sandwiching the FPC 7 on the front surface of the mounting area. Alternatively, the hooks 533 of the upper piece 53u and the lower piece 53d of the cover 53A may be inserted into the slit to engage with the slit, and the cover 52 may be fixed to the base member 6. In this case, it may be necessary to change the shape of the hook portion 533 from that of the third embodiment to engage the slit.

図10は本発明の固定手段のさらに他の変形例である実施例4の部分斜視図である。ここではケースをカバーで兼用し、ケースを省略している。実施例2におけるケース52はLED素子51や接点部材55の位置決め機能を行うためのものであるので、これをカバーでも行うようにし、そのため実施例4のカバー53Bは左右の各側片53l,53rと上下の各側片53u,53dとでLED素子51と接点部材55の周囲を囲むような矩形容器状部分を形成し、この矩形容器状部分においてLED素子51と接点部材55の支持と位置決めを行うようにしている。また、カバー53Bの上下の側片53u,53dは実施例3と同様にベース部材6の上下寸法に対応するように矩形容器部分よりも上下方向の間隔を拡大させ、変復調器部材6の上下面に設けたスリット65に係合するフック部533を設けている。この実施例4では、カバー53Bには左右側片53l,53rに係合穴は不要である。なお、FPC7をベース部材6に対して位置決めが必要であるので、実施例3よりもボス64の長さを短くして位置決めを行うようにする。   FIG. 10 is a partial perspective view of Embodiment 4 which is still another modification of the fixing means of the present invention. Here, the case is also used as a cover, and the case is omitted. Since the case 52 in the second embodiment is for performing the positioning function of the LED element 51 and the contact member 55, this is also performed by the cover. Therefore, the cover 53B of the fourth embodiment has the left and right side pieces 53l and 53r. And the upper and lower side pieces 53u, 53d form a rectangular container-like portion that surrounds the periphery of the LED element 51 and the contact member 55, and supports and positions the LED element 51 and the contact member 55 in this rectangular container-like part. Like to do. Further, the upper and lower side pieces 53u and 53d of the cover 53B are made larger in the vertical direction than the rectangular container portion so as to correspond to the vertical dimension of the base member 6 in the same manner as in the third embodiment, so A hook portion 533 is provided that engages with the slit 65 provided at the top. In the fourth embodiment, the cover 53B does not require an engagement hole in the left and right side pieces 53l and 53r. Since the FPC 7 needs to be positioned with respect to the base member 6, the length of the boss 64 is made shorter than that in the third embodiment.

実施例4においては、図11(a),(b)の垂直断面図と水平断面図を参照すると、先にカバー53Bの上下、左右の各側片53l,53r,53u,53dで囲まれる矩形容器状部分の内部に後面側からLED素子51と接点部材55を順次内挿し、しかる上でFPC7を介在させながらカバー53Bの上下側片のフック部533をベース部材6の上下面のスリット65に係合させる。LED素子51と接点部材55、さらにFPC7はカバー53Bによってベース部材6との間に挟持された状態でベース部材6に固定される。LED素子51の電極513は接点部材55の接点片552を介してFPC7の導電層71に電気接続され、LED素子51への給電が可能になる。なお、実施例4においても、ベース部材6の実装領域の前面にFPC7を上下に挟む領域に余裕があるときには、スリットを当該前面に設けてフック部533を係合させるようにしてもよい。   In the fourth embodiment, referring to the vertical sectional view and the horizontal sectional view of FIGS. 11A and 11B, a rectangle enclosed by the upper, lower, left and right side pieces 53l, 53r, 53u, 53d of the cover 53B. The LED element 51 and the contact member 55 are sequentially inserted into the container-like portion from the rear surface side, and the hook portions 533 of the upper and lower pieces of the cover 53B are inserted into the slits 65 on the upper and lower surfaces of the base member 6 while the FPC 7 is interposed therebetween. Engage. The LED element 51, the contact member 55, and the FPC 7 are fixed to the base member 6 while being sandwiched between the base member 6 and the cover 53B. The electrode 513 of the LED element 51 is electrically connected to the conductive layer 71 of the FPC 7 via the contact piece 552 of the contact member 55, so that power can be supplied to the LED element 51. Also in the fourth embodiment, when there is a margin in the area where the FPC 7 is vertically sandwiched on the front surface of the mounting area of the base member 6, a slit may be provided on the front surface to engage the hook portion 533.

図12は本発明の固定手段のさらに異なる他の変形例である実施例5の部分斜視図であり、カバーとケースを省略し、代わりにサブプレートを用いた構成である。サブプレート56は伝熱性のある樹脂等でベース部材6の実装領域の前面に対応する寸法をした板状に形成しており、例えば接着によりベース部材6の前面に固定している。あるいは、ネジによりベース部材6に固定してもよい。サブベース56の前面には前方に向けて一対の係合片561が突出されている。これら係合片561はFPC7の窓72を上下に挟む位置にそれぞれ設けたスリット75を挿通することが可能であり、これら係合片561の各先端には内側に向けて突出するフック部562が設けられている。これら一対の係合片561の突出寸法はLED素子51のパッケージの高さ寸法と接点部材55の高さ寸法を合わせた寸法にほぼ等しく、両係合片561の対向間隔はLED素子51のパッケージ511及び接点部材55の枠体551の辺寸法にほぼ等しくされている。   FIG. 12 is a partial perspective view of a fifth embodiment, which is still another modified example of the fixing means of the present invention, in which the cover and the case are omitted and a sub-plate is used instead. The sub-plate 56 is formed in a plate shape having a size corresponding to the front surface of the mounting region of the base member 6 with heat-conductive resin or the like, and is fixed to the front surface of the base member 6 by adhesion, for example. Or you may fix to the base member 6 with a screw | thread. A pair of engaging pieces 561 protrudes forward from the front surface of the sub-base 56. These engagement pieces 561 can be inserted through slits 75 provided at positions where the window 72 of the FPC 7 is sandwiched vertically, and hook portions 562 projecting inward are provided at the respective ends of the engagement pieces 561. Is provided. The projecting dimensions of the pair of engaging pieces 561 are substantially equal to the combined height of the LED element 51 package and the height of the contact member 55, and the opposing distance between the engaging pieces 561 is the package of the LED element 51. 511 and the side dimension of the frame body 551 of the contact member 55 are substantially equal.

実施例5では、図13(a),(b)の垂直断面図と水平断面図を参照すると、ベース部材6に固定されているサブベース56に対し、係合片561をFPC7のスリット75に挿通させることでFPC7をベース部材6に仮固定する。このとき、FPC7の露呈された導電層71は係合片561の上下の間に位置される。次いで、上下の係合片561の間に前面側から接点部材55を内挿し、次いでLED素子51を内挿する。LED素子51を内挿したときに各係合片561のフック部563がLED素子51のパッケージ511の両肩に係合し、この係合力によってLED素子51は接点部材55をFPC7の表面に押圧した状態でサブベース56に固定され、結局ベース部材6に固定支持される。この固定支持により、LED素子51の電極513は接点部材55の接点片552を介してFPC7の導電層71に接触して電気接続が行われる。   In the fifth embodiment, referring to the vertical sectional view and the horizontal sectional view of FIGS. 13A and 13B, the engagement piece 561 is formed in the slit 75 of the FPC 7 with respect to the sub-base 56 fixed to the base member 6. The FPC 7 is temporarily fixed to the base member 6 by being inserted. At this time, the exposed conductive layer 71 of the FPC 7 is positioned between the upper and lower sides of the engagement piece 561. Next, the contact member 55 is inserted between the upper and lower engaging pieces 561 from the front side, and then the LED element 51 is inserted. When the LED element 51 is inserted, the hook portions 563 of the engagement pieces 561 engage with both shoulders of the package 511 of the LED element 51, and the LED element 51 presses the contact member 55 against the surface of the FPC 7 by this engagement force. In this state, it is fixed to the sub-base 56 and finally fixed to the base member 6. By this fixed support, the electrode 513 of the LED element 51 is brought into contact with the conductive layer 71 of the FPC 7 via the contact piece 552 of the contact member 55 to be electrically connected.

この実施例5では、図示は省略するが、係合片561のフック部562は必ずしもLED素子51のパッケージ511の肩部に係合するものではなく、例えば、パッケージ511の両側面に電極513の一部が延在しているような場合には、この電極513の一部にフック部562を係合させて固定を行うようにしてもよい。また、図示は省略するが、ベース部材6の前面に一対の係合片を一体に、形成することが可能であれば、サブベースは不要であり、部品点数をさらに低減でき、組立工数のさらなる削減も可能である。   In the fifth embodiment, although not shown, the hook portion 562 of the engagement piece 561 does not necessarily engage with the shoulder portion of the package 511 of the LED element 51. For example, the electrode 513 is formed on both sides of the package 511. When a part of the electrode 513 is extended, the hook part 562 may be engaged with a part of the electrode 513 to be fixed. Although not shown, if a pair of engaging pieces can be integrally formed on the front surface of the base member 6, the sub-base is unnecessary, the number of parts can be further reduced, and the number of assembly steps can be further increased. Reduction is also possible.

図14は前記実施例2の変形例の実施例6の部分断面図であり、カバー53をリフレクタ4で兼用した構成である。図1に示したリフレクタ4の開口窓41を挟む位置に一対の係合片42を後方に向けて突出形成し、これらの係合片42にはケース52の係合爪523に係合する係合穴43を形成している。実施例6では、ランプハウジング1内に配設されているベース部材6に対し、FPC7を挟むようにしてケース52をベース部材6にネジ止めし、その上でケース52の収納口521にLED素子51を内挿する。ケース52の収納口521内には実施例1と同様に接点片54が設けられている。しかる上で、リフレクタ4をベース部材6の前面側から装着すると、リフレクタ4の一対の係合片42はケース52の前面側に被せられる状態となり、係合片42の係合穴43がケース52の係合爪523に係合され、リフレクタ4とケース52は一体化される。これにより、LED素子51はリフレクタ4によって前方への脱落が防止された状態でケース52の収納口521内に保持される。このとき接点片54はLED素子51の電極513とFPC7の導電層71それぞれ接触して両者の電気接続が行われ、LED素子51への給電が可能とされることは実施例1と同じである。実施例6ではリフレクタ4がカバーを兼用することになり、カバーが不要となるので部品点数を削減でき、またカバーの取付工数を削減することができる。   FIG. 14 is a partial cross-sectional view of the sixth embodiment which is a modification of the second embodiment, in which the cover 53 is also used as the reflector 4. A pair of engaging pieces 42 are formed to project rearward at positions sandwiching the opening window 41 of the reflector 4 shown in FIG. 1, and these engaging pieces 42 engage with the engaging claws 523 of the case 52. A joint hole 43 is formed. In Example 6, the case 52 is screwed to the base member 6 so as to sandwich the FPC 7 with respect to the base member 6 disposed in the lamp housing 1, and then the LED element 51 is attached to the storage port 521 of the case 52. Interpolate. A contact piece 54 is provided in the storage port 521 of the case 52 as in the first embodiment. Accordingly, when the reflector 4 is mounted from the front side of the base member 6, the pair of engaging pieces 42 of the reflector 4 are put on the front side of the case 52, and the engaging holes 43 of the engaging piece 42 are formed in the case 52. The reflector 4 and the case 52 are integrated with each other. Thereby, the LED element 51 is held in the storage port 521 of the case 52 in a state in which the LED element 51 is prevented from falling forward by the reflector 4. At this time, the contact piece 54 is in contact with the electrode 513 of the LED element 51 and the conductive layer 71 of the FPC 7 so as to be electrically connected to each other, and power supply to the LED element 51 is enabled as in the first embodiment. . In the sixth embodiment, the reflector 4 also serves as a cover, and the cover is unnecessary, so that the number of parts can be reduced and the number of steps for attaching the cover can be reduced.

実施例6のようにカバーとリフレクタを一体化する構成は、実施例3,4,5についても同様に適用することは可能である。また、これとは反対に、図15に示すように、レンズを備えていないLED素子51Cを光源として用い、LED素子51Cから出射した光を独立した集光レンズによって集光してランプハウジング1の前方に照射させるランプに適用する場合には、LED素子51Cから出射した光を集光するための集光レンズ534を一体に形成した透明樹脂でカバー53Cを構成するようにしてもよい。この場合ではカバー53Cは集光レンズ534のブラケットを兼用することになり、ランプの部品点数を削減し、取付工数を削減する。   The configuration in which the cover and the reflector are integrated as in the sixth embodiment can be similarly applied to the third, fourth, and fifth embodiments. On the contrary, as shown in FIG. 15, the LED element 51 </ b> C that does not include a lens is used as a light source, and the light emitted from the LED element 51 </ b> C is condensed by an independent condenser lens. When applied to a lamp that irradiates forward, the cover 53C may be made of a transparent resin integrally formed with a condensing lens 534 for condensing light emitted from the LED element 51C. In this case, the cover 53C also serves as a bracket for the condenser lens 534, reducing the number of lamp parts and reducing the number of mounting steps.

図16(a)は前記実施例1等で用いた接点片54の変形例を示す実施例7の斜視図である。実施例1等では接点片54として金属板を曲げ加工し、当該金属板の弾性力を利用してLED素子の電極とFPCの導電層との電気接続を行っているが、図16(a)の接点片54Aでは形状復元力のある材料を用いて接点片を構成している。ここでは、同図(b)のように、矩形をした柔軟な絶縁膜541の表面に可撓性のある柔軟な導電膜542を貼り合わせ、かつ両端及び両側部を表面絶縁膜543で覆ったシート材を形成する。ここでは一対の導電膜542をほぼ平行に平面配置する。このシート材を同図(c)のようにほぼ中央で折り返すように曲げ加工し、かつ折り返した両端部を接着して導電膜542が外面に露呈された無端状の湾曲部544を形成する。しかる上で、同図(d)のように、この湾曲部内に形状復元力のある材料としてシリコンゲル545を内装している。このシート材は片面の絶縁膜を部分的に除去したFPCで構成してもよい。この接点片54Aはケース52の収納口521内に内装した上で基端部をケース52に一体化することで実施例1と同様なケースが構成できる。   FIG. 16A is a perspective view of Example 7 showing a modification of the contact piece 54 used in Example 1 or the like. In Example 1 or the like, a metal plate is bent as the contact piece 54, and the electrical connection between the electrode of the LED element and the conductive layer of the FPC is performed using the elastic force of the metal plate. In the contact piece 54A, the contact piece is made of a material having a shape restoring force. Here, as shown in FIG. 6B, a flexible flexible conductive film 542 is bonded to the surface of a rectangular flexible insulating film 541 and both ends and both sides are covered with a surface insulating film 543. A sheet material is formed. Here, the pair of conductive films 542 are arranged in a plane substantially in parallel. The sheet material is bent so as to be folded substantially at the center as shown in FIG. 3C, and both the folded ends are bonded to form an endless curved portion 544 in which the conductive film 542 is exposed on the outer surface. Accordingly, as shown in FIG. 4D, silicon gel 545 is housed as a material having a shape restoring force in the curved portion. This sheet material may be composed of FPC from which the insulating film on one side is partially removed. The contact piece 54 </ b> A is built in the storage port 521 of the case 52, and the base end portion is integrated with the case 52, whereby a case similar to that of the first embodiment can be configured.

また、実施例2等の接点部材55に代えた接点部材55Aとして、図17(a)のように、形状復元力のある材料を用いて接点部材を構成している。ここでは、同図(b)のように、矩形をした柔軟な絶縁膜555の表面に可撓性のある柔軟な導電膜556を貼り合わせ、かつ両端及び両側部を表面絶縁膜557で覆ったシート材を形成する。ここでは一対の幅広い導電膜556を長さ方向に並ぶように平面配置する。このシート材を同図(c)のように、両端部をそれぞれ折り返すように曲げ加工し、かつ折り返した各両端部を絶縁膜555に対して接着して導電膜556が外面に露呈された無端状の湾曲部558を両端部に形成する。しかる上で、同図(d)のように、これらの湾曲部内に形状復元力のある材料としてシリコンゲル559を内装している。このシート材は片面の絶縁膜を部分的に除去したFPCで構成してもよい。この接点部材55Aは実施例2の接点部材55と同様に用いることができる。   Further, as the contact member 55A in place of the contact member 55 in the second embodiment, a contact member is formed using a material having a shape restoring force as shown in FIG. Here, as shown in FIG. 5B, a flexible flexible conductive film 556 is bonded to the surface of a rectangular flexible insulating film 555, and both ends and both sides are covered with a surface insulating film 557. A sheet material is formed. Here, a pair of wide conductive films 556 are arranged in a plane so as to be aligned in the length direction. As shown in FIG. 3C, the sheet material is bent so that both ends are folded, and the folded ends are bonded to the insulating film 555, and the conductive film 556 is exposed on the outer surface. A curved portion 558 is formed at both ends. Accordingly, as shown in FIG. 4D, silicon gel 559 is housed as a material having a shape restoring force in these curved portions. This sheet material may be composed of FPC from which the insulating film on one side is partially removed. The contact member 55A can be used similarly to the contact member 55 of the second embodiment.

実施例7の接点片54Aや接点部材55Aでは、LED素子51とFPC7との間に挟持されたときにシリコンゲル545,559が圧縮状態に変形され、かつその際の変形復元力によって導電膜542,556がLED素子51の電極513とFPC7の導電層71にそれぞれ密接し、両者間を電気接続する。基材となるシート材が柔軟であることとシリコンゲル545,559の復元力とによって導電膜542,556は電極513と導電層71のそれぞれに対して広い面積で密接することになるため、前記実施例1〜6の金属板からなる接点片54や接点部材55に比較して両者間の接触面積が大きくなり、電気抵抗を低減するとともにLED素子51からベース部材6への伝熱性を高め、放熱効果を高めることが可能になる。   In the contact piece 54A and the contact member 55A of the seventh embodiment, the silicon gels 545 and 559 are deformed into a compressed state when sandwiched between the LED element 51 and the FPC 7, and the conductive film 542 is deformed by the deformation restoring force at that time. , 556 are in close contact with the electrode 513 of the LED element 51 and the conductive layer 71 of the FPC 7, respectively, and electrically connect them. Since the conductive material 542 and 556 are in close contact with each of the electrode 513 and the conductive layer 71 due to the flexibility of the sheet material as the base material and the restoring force of the silicon gels 545 and 559, the above-mentioned Compared with the contact piece 54 and the contact member 55 made of the metal plate of Examples 1 to 6, the contact area between the two is increased, the electrical resistance is reduced and the heat transfer from the LED element 51 to the base member 6 is increased. It becomes possible to enhance the heat dissipation effect.

前記実施例1〜7では本発明にかかる面状配線部材としてFPCを用いた例を示したが、PCB(プリント配線基板)あるいはFFC(フレキシブルフラットケーブル)を利用することもできる。PCBの場合には、図18のように、矩形平板状をしたPCB57をベース部材6の複数の実装領域の前面にそれぞれネジ、あるいは接着等により配設した上で、各PCB57の基板の表面に形成された導電層571に対してコネクタ572及びケーブル573により図には表れない車載電源に接続する。しかる上で、実施例1と同様にPCB57に対してLED素子ユニット5をネジ50で固定する。これにより、LED素子ユニット5のLED素子51の電極513はケース52に支持させている接点片54を介してPCB57の導電層571に電気接続されることになる。図示は省略するが、FFCについてもFPCとほぼ同様に適用できる。   In the first to seventh embodiments, the FPC is used as the planar wiring member according to the present invention. However, a PCB (printed wiring board) or FFC (flexible flat cable) can also be used. In the case of a PCB, as shown in FIG. 18, a rectangular plate-like PCB 57 is disposed on the front surface of a plurality of mounting regions of the base member 6 by screws or adhesives, and then placed on the surface of the substrate of each PCB 57. The formed conductive layer 571 is connected to an in-vehicle power source not shown in the figure by a connector 572 and a cable 573. Then, the LED element unit 5 is fixed to the PCB 57 with the screws 50 as in the first embodiment. As a result, the electrode 513 of the LED element 51 of the LED element unit 5 is electrically connected to the conductive layer 571 of the PCB 57 via the contact piece 54 supported by the case 52. Although illustration is omitted, FFC can be applied in substantially the same manner as FPC.

以上の各実施例において、ケースをベース部材に固定する手法として、ケースに係合片を設けておき、この係合片をベース部材に対して係合して固定を行うようにしてもよい。また、本発明において、実施例1〜7では本発明にかかる発光素子としてLED素子を用いた例を示したが、EL素子(エレクトロルミネッセンス素子)やLD素子(レーザダイオード)を使用することも可能である。さらに、本発明は実施例1の自動車用ヘッドランプに限られるものではなく、各種車両のヘッドランプやその他の照明用ランプ、あるいは標識用ランプの発光素子の給電構造として適用が可能である。   In each of the above embodiments, as a method for fixing the case to the base member, an engagement piece may be provided on the case, and the engagement piece may be engaged with the base member for fixation. Moreover, in this invention, although the example which used the LED element as a light emitting element concerning this invention was shown in Examples 1-7, it is also possible to use an EL element (electroluminescence element) and LD element (laser diode). It is. Furthermore, the present invention is not limited to the automotive headlamp of the first embodiment, and can be applied as a power feeding structure for light emitting elements of various vehicle headlamps, other illumination lamps, or marker lamps.

本発明を適用したランプの全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the lamp | ramp to which this invention is applied. 実施例1のランプの一部の分解斜視図である。FIG. 3 is an exploded perspective view of a part of the lamp according to the first embodiment. 実施例1の要部の部分分解斜視図である。2 is a partial exploded perspective view of a main part of Example 1. FIG. 実施例1の要部の垂直断面図と水平断面図である。2 is a vertical sectional view and a horizontal sectional view of a main part of Example 1. FIG. 実施例2の要部の部分分解斜視図である。FIG. 6 is a partial exploded perspective view of a main part of Example 2. 実施例2の要部の垂直断面図と水平断面図である。It is the vertical sectional view and horizontal sectional view of the principal part of Example 2. 実施例2の変形例の垂直断面図と水平断面図である。It is the vertical sectional view and horizontal sectional view of the modification of Example 2. 実施例3の要部の部分分解斜視図である。FIG. 10 is a partial exploded perspective view of a main part of Example 3. 実施例3の要部の垂直断面図と水平断面図である。It is the vertical sectional view and horizontal sectional view of the principal part of Example 3. 実施例4の要部の部分分解斜視図である。FIG. 10 is a partial exploded perspective view of a main part of Example 4. 実施例4の要部の垂直断面図と水平断面図である。It is the vertical sectional view and horizontal sectional view of the principal part of Example 4. 実施例5の要部の部分分解斜視図である。FIG. 10 is a partial exploded perspective view of a main part of Example 5. 実施例5の要部の垂直断面図と水平断面図である。FIG. 10 is a vertical sectional view and a horizontal sectional view of a main part of Example 5. 実施例6の水平断面図である。7 is a horizontal sectional view of Example 6. FIG. 実施例6の変形例の水平断面図である。FIG. 10 is a horizontal cross-sectional view of a modification of Example 6. 実施例7の外観図と断面図である。FIG. 10 is an external view and a cross-sectional view of Example 7. 実施例7の変形例の外観図と断面図である。FIG. 16 is an external view and a cross-sectional view of a modified example of Example 7. 実施例8の部分斜視図である。FIG. 10 is a partial perspective view of an eighth embodiment.

符号の説明Explanation of symbols

1 ランプハウジング
4 リフレクタ
5 LED素子ユニット
6 ベース部材
7 FPC(面状配線部材)
51 LED素子
52 ケース
53 カバー
54 接点片(接点部材)
55 接点部材
71 導電層
511 パッケージ
512 レンズ
513 電極

DESCRIPTION OF SYMBOLS 1 Lamp housing 4 Reflector 5 LED element unit 6 Base member 7 FPC (planar wiring member)
51 LED element 52 Case 53 Cover 54 Contact piece (contact member)
55 Contact member 71 Conductive layer 511 Package 512 Lens 513 Electrode

Claims (4)

ベース部材の表面に密接して配設され、少なくとも一部に給電用の導電層が露呈されている面状配線部材と、前記面状配線部材に対面する電極を備えて前記面状配線部材に対向配置される発光素子と、前記発光素子を前記面状配線部材の前記露呈された導電層に対して位置決めし、かつ前記面状配線部材に対して押圧状態に固定する固定手段と、前記発光素子の電極と前記導電層との間に介在され、これら電極と導電層に弾接する導電性の接点部材とを備え、前記接点部材は前記固定手段と一体に形成されていることを特徴とする発光素子給電構造。 A planar wiring member that is disposed in close contact with the surface of the base member and at least partially exposes a conductive layer for power supply, and an electrode facing the planar wiring member. Light emitting elements arranged opposite to each other, fixing means for positioning the light emitting elements with respect to the exposed conductive layer of the planar wiring member and fixing the light emitting element in a pressed state with respect to the planar wiring member, and the light emission A conductive contact member interposed between the electrode of the element and the conductive layer and elastically contacting the electrode and the conductive layer is provided , and the contact member is formed integrally with the fixing means. Light-emitting element feeding structure. 前記固定手段は、前記発光素子の位置決めを行うためのケースと、前記発光素子を前記面状配線部材に向けて押圧するためのカバーとを備えることを特徴とする請求項1に記載の発光素子の給電構造。 The light emitting element according to claim 1, wherein the fixing means includes a case for positioning the light emitting element and a cover for pressing the light emitting element toward the planar wiring member. Feeding structure. 前記カバーは前記発光素子から出射した光を反射、又は屈折する光学部材の一部で構成されていることを特徴とする請求項に記載の発光素子給電構造。 The light emitting element feeding structure according to claim 2 , wherein the cover is constituted by a part of an optical member that reflects or refracts light emitted from the light emitting element. 前記ベース部材は放熱体として構成されていることを特徴とする請求項1ないしのいずれかに記載の発光素子給電構造。 The base member has the light emitting element feeding structure according to any one of claims 1 to 3, characterized in that it is constructed as a heat radiator.
JP2008146516A 2008-06-04 2008-06-04 Light-emitting element feeding structure Expired - Fee Related JP5160966B2 (en)

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JP5914839B2 (en) * 2010-10-25 2016-05-11 パナソニックIpマネジメント株式会社 LIGHT EMITTING DEVICE AND LIGHTING APPARATUS HAVING THE SAME
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