JP5162272B2 - Multilayer capacitor - Google Patents

Description

  The present invention relates to a multilayer capacitor with improved withstand voltage.

  FIGS. 1A and 1B are a top view and a side view of a two-terminal type medium and high voltage multilayer capacitor. The multilayer capacitor 10 has a rectangular parallelepiped shape in which first and second inner conductor layers 14 and 15 having a rectangular shape in a plane perpendicular to the stacking direction are alternately stacked via dielectric layers (no reference numerals). Capacitor body 11, and first and second external electrodes 12, 13 provided at opposing ends of the capacitor body 11 and connected to lead portions of the first and second inner conductor layers 14, 15, respectively. I have.

  In this multilayer capacitor 10, a part of both sides of the first and second inner conductor layers 14, 15 (upper and lower sides in FIG. 1A, see symbols L 11, L 12) substantially coincides with each other in the laminating direction. The end side of the conductor layer 14 (see the right side in FIG. 1A, reference L13) substantially matches in the stacking direction, and the end side of the second internal conductor layer 15 (the left side in FIG. 1A, see reference L14). ) Has a structure that almost matches in the stacking direction.

  In short, this multilayer capacitor 10 has a structure in which stress due to electrostriction tends to concentrate on the side portions (see the thick line frame in FIG. 1C) that coincide in the lamination direction of the first and second inner conductor layers 14 and 15. If voltage application is repeated, cracks or the like may occur in the side portions that match in the stacking direction, resulting in dielectric breakdown, and it is difficult to improve the withstand voltage.

  In order to increase the withstand voltage of the multilayer capacitor, it is impossible to avoid the suppression of the dielectric breakdown, and as an improvement measure, a multilayer capacitor for medium and high voltage having a different shape and multilayer form of the internal conductor layer is proposed by Patent Document 1. Yes. In this multilayer capacitor, the first internal conductor layer connected to the first external electrode and the second internal conductor layer connected to the second external electrode are positioned on the same plane, and the first and second internal conductor layers are connected to the first and second internal conductor layers. The third internal conductor layers not connected to the second external electrodes are alternately stacked via dielectric layers.

  However, in this multilayer capacitor, both sides of the first inner conductor layer and a part of both sides of the third inner conductor layer substantially coincide with each other in the lamination direction, and both sides of the second inner conductor layer and both sides of the third inner conductor layer are substantially aligned. A part of the side substantially matches in the stacking direction, the end of the first inner conductor layer approximately matches in the stacking direction, and the end of the second inner conductor layer substantially matches in the stacking direction. The conductor layer has a structure in which both ends of the conductor layer are substantially matched in the stacking direction.

In short, this multilayer capacitor can improve the insulation resistance to some extent depending on the shapes and laminated forms of the first to third inner conductor layers, but is similar to the multilayer capacitor shown in FIGS. 1 (A) and 1 (B). It has a structure in which stress due to electrostriction tends to concentrate on the side portions that match in the stacking direction of the first to third internal conductor layers, and when voltage application is repeated, cracks and the like occur in the side portions that match in the stacking direction, resulting in dielectric breakdown Therefore, there is a structural limit in improving the withstand voltage.
JP-A-8-273971

  The present invention was created in view of the above circumstances, and an object of the present invention is to provide a multilayer capacitor capable of improving withstand voltage.

  In order to achieve the above object, the multilayer capacitor of the present invention comprises a dielectric layer comprising at least three types of internal conductor layers each having a polygonal shape in a plane perpendicular to the lamination direction and different positions of the lead portions. And a capacitor body having a rectangular parallelepiped shape laminated in order, and at least three external parts that are provided in contact with each other on the surface of the capacitor body and are connected to the lead portions of the at least three types of internal conductor layers, respectively. Each of the plurality of sides defining each of the at least three types of internal conductor layers has a positional relationship that does not match in the stacking direction.

According to this multilayer capacitor, for each of a plurality of sides defining each of at least three internal conductor layers provided within the body the capacitor has a positional relationship which does not coincide in the laminating direction, the stress caused by electrostriction It is possible to reliably disperse each of a plurality of sides defining each of at least three types of inner conductor layers. In other words, it is possible to avoid stress due to electrostriction from being concentrated on a specific side or a part of a plurality of sides defining each of at least three types of inner conductor layers. Can improve the withstand voltage.

  ADVANTAGE OF THE INVENTION According to this invention, the multilayer capacitor which can improve a withstand voltage can be provided.

  The above object and other objects, structural features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[First Embodiment]
2 to 4 show a first embodiment of the present invention (multilayer capacitor). 2A is a top view of the multilayer capacitor, FIG. 2B is a side view of the multilayer capacitor shown in FIG. 2A, and FIG. 3 shows a layer structure of the capacitor body shown in FIG. FIGS. 4A and 4B are views showing the positional relationship in the stacking direction of each of the four sides of the first to fourth inner conductor layers in the capacitor body shown in FIG.

  The multilayer capacitor 20 includes a rectangular parallelepiped capacitor main body 21 (see FIGS. 2A and 2B) and four external electrodes (non-contacting) provided at four corners of the capacitor main body 21. 1st-4th external electrodes 22-25, FIG. 2 (A) and FIG. 2 (B)) are provided.

  The capacitor main body 21 has a quadrangular shape in a plane orthogonal to the stacking direction, and four types of internal conductor layers (first to fourth) that have different positions of the lead portions (26e to 29e, see FIG. 3). The inner conductor layers 26 to 29, FIG. 2 (A), FIG. 2 (B) and FIG. 3) are sequentially stacked via the dielectric layer 21a (see FIG. 3). As will be described in detail later, each of the four sides defining each of the first to fourth inner conductor layers 26 to 29 has a positional relationship that does not match in the stacking direction.

  The first external electrode 22 is connected to the lead portion 26e of each first internal conductor layer 26, the second external electrode 23 is connected to the lead portion 27e of each second internal conductor layer 27, and the third external electrode 24 is The third outer conductor 25 is connected to the lead portion 28 e of the third inner conductor layer 28, and the fourth outer electrode 25 is connected to the lead portion 29 e of each fourth inner conductor layer 29.

  As shown in FIG. 3, the first to fourth inner conductor layers 26 to 29 are different angles in a plane perpendicular to the stacking direction of a single-shaped rectangular conductor layer (hereinafter referred to as a reference rectangular conductor layer). Specifically, it is obtained by rotating at angles of 0 degrees, 90 degrees, 180 degrees, and 270 degrees. Incidentally, the four sides of the reference quadrangular conductor layer are constituted by four oblique sides inclined at an acute angle with the side surface of the capacitor body 21 facing each side.

  The relationship between the inclination angles of the four hypotenuses defining each of the first to fourth inner conductor layers 26 to 29 is (S26a = S27a = S28a = S29a) = (S26b = S27b = S28b = S29b) = (S26c = S27c) = S28c = S29c) <(S26d = S27d = S28d = S29a), and the relationship between the line lengths of the four hypotenuses is (S26a = S27a = S28a = S29a)> (S26b = S27b = S28b = S29b) > (S26c = S27c = S28c = S29c) <(S26d = S27d = S28d = S29d).

  The first inner conductor layer 26 has a strip-like lead portion 26e that reaches one corner of the capacitor body 21 between the end of the oblique side S26a and the end of the oblique side S26d, and the second inner conductor layer 27 includes the capacitor body. 21 has a belt-like lead portion 27e extending to the other corner portion (a corner portion adjacent to the corner portion to which the lead portion 26e reaches in the counterclockwise direction) between the end of the hypotenuse S27a and the end of the hypotenuse S27d, 3 The inner conductor layer 28 has strip-shaped lead portions 28e extending to the other corners of the capacitor body 21 (corners adjacent to the corners to which the lead portions 27e reach in the counterclockwise direction) at the ends of the hypotenuse S28a and the hypotenuse S28d. The fourth inner conductor layer 29 has a strip-shaped lead portion 29e extending to the other corner of the capacitor body 21 (the corner adjacent to the lead portion 28e in the counterclockwise direction). Between the end of S29a and the end of the hypotenuse S29d .

  Here, the positional relationship in the stacking direction of each of the four sides defining each of the first to fourth inner conductor layers 26 to 29 will be described with reference to FIG.

  In the left part in FIG. 4, the oblique side S29b of the fourth inner conductor layer 29 is located inside the oblique side S26a of the first inner conductor layer 26, because of the relationship between the inclination angle and the line segment length described above. The hypotenuse S28c of the third inner conductor layer 28 is located in parallel with the hypotenuse S29b of the fourth inner conductor layer 29 so as to intersect the three hypotenuses S26a, S29b, and S28c at an acute angle. The hypotenuse S27d of the second inner conductor layer 27 is located.

  In the lower portion in FIG. 4, the oblique side S26b of the first internal conductor layer 26 is located inside the oblique side S27a of the second internal conductor layer 27 from the relationship between the inclination angle and the line segment length described above. Are located in parallel, and the oblique side S29c of the fourth inner conductor layer 29 is located in parallel to the inside of the oblique side S26b of the first inner conductor layer 26 so as to intersect these three oblique sides S27a, S26b, S29c at an acute angle. The hypotenuse S28d of the third inner conductor layer 28 is located at the end.

  In the right part in FIG. 4, the oblique side S27b of the second inner conductor layer 27 is located on the inner side of the oblique side S28a of the third inner conductor layer 28 from the relationship between the inclination angle and the line segment length described above. The hypotenuse S26c of the first inner conductor layer 26 is located in parallel with the hypotenuse S27b of the second inner conductor layer 27 so as to intersect the three hypotenuses S28a, S27b, S26c at an acute angle. The hypotenuse S29d of the fourth inner conductor layer 29 is located.

  In the upper portion in FIG. 4, the oblique side S28b of the third inner conductor layer 28 is located inside the oblique side S29a of the fourth inner conductor layer 29 from the relationship between the inclination angle and the line segment length described above. The hypotenuse S27c of the second inner conductor layer 27 is located in parallel with the hypotenuse S28b of the third inner conductor layer 28 so as to cross the three hypotenuses S29a, S28b, and S27c at an acute angle. The hypotenuse S26d of the first inner conductor layer 26 is located.

  As described above, according to the multilayer capacitor 20 described above, the positional relationship in which the four sides defining each of the first to fourth inner conductor layers 26 to 29 provided in the capacitor body 21 do not match in the stacking direction. Therefore, the stress due to electrostriction can be reliably distributed to each of the four sides that define the first to fourth inner conductor layers 26 to 29. That is, it is possible to avoid stress due to electrostriction from being concentrated on a specific side or a part of the four sides that define the first to fourth inner conductor layers 26 to 29, and thereby the multilayer capacitor. The withstand voltage of 20 can be improved and the withstand voltage can be improved.

  Further, according to the multilayer capacitor 20 described above, the first to fourth inner conductor layers 26 to 29 are arranged at different angles (0 degrees, 90 degrees, 180 degrees, 270 degrees), it is not necessary to separately prepare conductor layers having different shapes as the first to fourth inner conductor layers 26 to 29. In other words, the conductor layer creation process can be simplified by sharing the shape of the first to fourth inner conductor layers 26 to 29, thereby suppressing an increase in the manufacturing cost of the multilayer capacitor 20.

[Second Embodiment]
5 to 7 show a second embodiment of the present invention (multilayer capacitor). 5A is a top view of the multilayer capacitor, FIG. 5B is a side view of the multilayer capacitor shown in FIG. 5A, and FIG. 6 is a layer configuration of the capacitor body shown in FIG. FIGS. 7A and 7B are diagrams showing the positional relationship in the stacking direction of each of the four sides of the first to fourth inner conductor layers in the capacitor body shown in FIG.

  The multilayer capacitor 30 includes a rectangular parallelepiped capacitor body 31 (see FIGS. 5A and 5B) and four external electrodes (non-contacting) provided at four corners of the capacitor body 21. First to fourth external electrodes 32 to 35, and FIG. 5A and FIG. 5B).

  The capacitor main body 31 has a quadrangular shape in a plane orthogonal to the stacking direction, and four types of internal conductor layers (first to fourth) whose lead portions (36e to 39e, see FIG. 6) are different from each other. The inner conductor layers 36 to 39, FIGS. 5A, 5B, and 6) are sequentially stacked via the dielectric layer 31a (see FIG. 6). As will be described in detail later, each of the four sides defining each of the first to fourth inner conductor layers 36 to 39 has a positional relationship that does not match in the stacking direction.

  The first external electrode 32 is connected to the lead portion 36e of each first internal conductor layer 36, the second external electrode 33 is connected to the lead portion 37e of each second internal conductor layer 37, and the third external electrode 34 is The third external conductor 35 is connected to the lead portion 39 e of each fourth internal conductor layer 39.

  As shown in FIG. 6, the first to fourth inner conductor layers 36 to 39 have different angles in a plane perpendicular to the stacking direction of a single-shaped rectangular conductor layer (hereinafter referred to as a reference rectangular conductor layer). Specifically, it is obtained by rotating at angles of 0 degrees, 90 degrees, 180 degrees, and 270 degrees. Incidentally, the four sides of the reference quadrangular conductor layer are inclined at an acute angle with two sides substantially parallel to the side surface of the capacitor body 31 facing two of the four sides and the side surface of the capacitor body 31 facing the other two sides. It consists of two hypotenuses.

  The relationship between the inclination angles of two hypotenuses among the four sides constituting the first to fourth inner conductor layers 36 to 39 is (S36b = S37b = S38b = S39b) = (S36d = S37d = S38d = S39a). The relationship between the line lengths of two substantially parallel sides and two oblique sides is (S36a = S37a = S38a = S39a) = (S36b = S37b = S38b = S39b) = (S36d = S37d = S38d = S39d) )> (S36c = S37c = S38c = S39c).

  The first inner conductor layer 36 has a strip-shaped lead portion 36e that reaches one corner of the capacitor body 31 between the end of the side S36a and the end of the oblique side S36d, and the second inner conductor layer 37 includes the capacitor body. 31 has a strip-like lead portion 37e that reaches the other corner portion (the corner portion that is adjacent to the corner portion to which the lead portion 36e reaches in the counterclockwise direction) between the end of the side S37a and the end of the hypotenuse S37d. 3 The inner conductor layer 38 has strip-shaped lead portions 38e that reach the other corners of the capacitor body 31 (corners that are adjacent to the corners to which the lead portions 37e reach in the counterclockwise direction) at the ends of the sides S38a and S38d. The fourth inner conductor layer 39 has a strip-shaped lead portion 39e extending to the other corner of the capacitor body 31 (the corner adjacent to the lead portion 38e in the counterclockwise direction). Between the end of S39a and the end of the hypotenuse S39d.

  Here, the positional relationship in the stacking direction of each of the four sides defining each of the first to fourth inner conductor layers 36 to 39 will be described with reference to FIG.

  In the left part in FIG. 7, the side S38c of the third inner conductor layer 38 is located inside the side S36a of the first inner conductor layer 36 from the relationship between the inclination angle and the line segment length described above. The oblique side S39b of the fourth inner conductor layer 39 and the oblique side S37d of the second inner conductor layer 37 are located so as to be parallel to each other and intersect the side S38c at an acute angle.

  In the lower part of FIG. 7, the side S39c of the fourth inner conductor layer 39 is located inside the side S37a of the second inner conductor layer 37 from the relationship between the inclination angle and the line segment length described above. Are located in parallel, and the oblique side S36b of the first inner conductor layer 36 and the oblique side S38d of the third inner conductor layer 38 are located so as to intersect the side S39c at an acute angle.

  In the right portion in FIG. 7, the side S36c of the first inner conductor layer 36 is located inside the side S38a of the third inner conductor layer 38 from the relationship between the inclination angle and the line segment length described above. The hypotenuse S37b of the second inner conductor layer 37 and the hypotenuse S39d of the fourth inner conductor layer 39 are located so as to be parallel to each other and intersect the side S36c at an acute angle.

  In the upper portion in FIG. 7, the side S37c of the second inner conductor layer 37 is located inside the side S39a of the fourth inner conductor layer 39 from the relationship between the inclination angle and the line segment length described above. The oblique side S38b of the third inner conductor layer 33 and the oblique side S36d of the first inner conductor layer 36 are located so as to be parallel to each other and intersect the side S37c at an acute angle.

  As described above, according to the multilayer capacitor 30 described above, the positional relationship in which the four sides defining each of the first to fourth inner conductor layers 36 to 39 provided in the capacitor body 31 do not match in the stacking direction. Therefore, the stress due to electrostriction can be reliably distributed to each of the four sides that define the first to fourth inner conductor layers 36 to 39. That is, it is possible to avoid stress due to electrostriction from being concentrated on a specific side or a part of the four sides defining the first to fourth inner conductor layers 36 to 39, and thereby the multilayer capacitor. The withstand voltage of 30 can be improved and the withstand voltage can be improved.

  Further, according to the multilayer capacitor 20 described above, the first to fourth inner conductor layers 36 to 39 are arranged at different angles (0 degrees, 90 degrees, 180 degrees, in a plane orthogonal to the stacking direction of the reference rectangular conductor layer. 270 degrees), it is not necessary to separately prepare conductor layers having different shapes as the first to fourth inner conductor layers 36 to 39. In other words, the conductor layer creation process can be simplified by sharing the shapes of the first to fourth inner conductor layers 36 to 39, thereby suppressing an increase in the manufacturing cost of the multilayer capacitor 30.

[Third Embodiment]
8 to 10 show a third embodiment of the present invention (multilayer capacitor). 8A is a top view of the multilayer capacitor, FIG. 8B is a side view of the multilayer capacitor shown in FIG. 8A, and FIG. 9 is a diagram showing a layer structure of the capacitor body shown in FIG. FIG. 10 is a diagram showing the positional relationship in the stacking direction of each of the four sides of the first to third inner conductor layers in the capacitor body shown in FIG.

  The multilayer capacitor 40 includes a rectangular parallelepiped capacitor main body 41 (see FIGS. 8A and 8B) and three external electrodes (non-contacting) provided at three corners of the capacitor main body 41. First to third external electrodes 42 to 44, see FIG. 8A and FIG. 8B).

  The capacitor main body 41 has a quadrangular shape in a plane orthogonal to the stacking direction, and three types of internal conductor layers (first to third) having different lead portions (46e to 48e, see FIG. 9). The inner conductor layers 46 to 48, FIG. 8 (A), FIG. 8 (B) and FIG. 9) are sequentially stacked via the dielectric layer 41a (see FIG. 9). As will be described in detail later, each of the four sides defining each of the first to third inner conductor layers 46 to 48 has a positional relationship that does not match in the stacking direction.

  The first external electrode 42 is connected to the lead portion 46e of each first internal conductor layer 46, the second external electrode 43 is connected to the lead portion 47e of each second internal conductor layer 47, and the third external electrode 44 is each 3 is connected to the lead portion 48e of the inner conductor layer 48.

  As shown in FIG. 9, the first to third inner conductor layers 46 to 48 are different angles in a plane perpendicular to the stacking direction of a single-shaped square conductor layer (hereinafter referred to as a reference square conductor layer). Specifically, it is obtained by rotating at an angle of 0 degrees, 90 degrees, and 180 degrees. Incidentally, the four sides of the reference quadrangular conductor layer are constituted by four oblique sides inclined at an acute angle with the side surface of the capacitor body 41 facing each side.

  The relationship between the inclination angles of the four hypotenuses defining each of the first to third inner conductor layers 46 to 48 is (S46a = S47a = S48a) = (S46b = S47b = S48b) = (S46c = S47c = S48c) < (S46d = S47d = S48d), and the relationship between the line lengths of the four hypotenuses is (S46a = S47a = S48a)> (S46b = S47b = S48b)> (S46c = S47c = S48c) <(S46d = S47d = S48d).

  The first inner conductor layer 46 has a strip-like lead portion 46e extending to one corner of the capacitor body 41 between the end of the oblique side S46a and the end of the oblique side S46d, and the second inner conductor layer 47 is composed of the capacitor body. 41 has a belt-like lead portion 47e that reaches the other corner portion (a corner portion that is adjacent to the corner portion to which the lead portion 46e reaches in the counterclockwise direction) between the end of the hypotenuse S47a and the end of the hypotenuse S47d, 3 The inner conductor layer 48 includes strip-shaped lead portions 48e that reach the other corners of the capacitor body 41 (corners adjacent to the corners to which the lead portions 47e reach in the counterclockwise direction) at the ends of the oblique sides S48a and S48d. And have between.

  Here, the positional relationship in the stacking direction of each of the four sides defining each of the first to third inner conductor layers 46 to 48 will be described with reference to FIG.

  In the left part of FIG. 10, the oblique side S48c of the third internal conductor layer 48 is located inside the oblique side S46a of the first internal conductor layer 46 from the relationship between the inclination angle and the line segment length described above. The oblique side S47d of the second inner conductor layer 47 is located so as to be parallel to each other and intersect the two oblique sides S46a and S48c at an acute angle.

  In the lower portion in FIG. 4, the oblique side S46b of the first internal conductor layer 46 is located inside the oblique side S47a of the second internal conductor layer 47 from the relationship between the inclination angle and the line segment length described above. Are located in parallel, and the oblique side S48d of the third inner conductor layer 48 is located so as to intersect these two oblique sides S47a and S46b at an acute angle.

  In the right portion in FIG. 4, the oblique side S47b of the second inner conductor layer 47 is located inside the oblique side S48a of the third inner conductor layer 48, based on the relationship between the inclination angle and the line segment length described above. The hypotenuse S46c of the first inner conductor layer 46 is located in parallel with the hypotenuse S47b of the second inner conductor layer 47.

  In the upper portion in FIG. 4, the oblique side S47c of the second inner conductor layer 47 is located inside the oblique side S48b of the third inner conductor layer 48 from the relationship between the inclination angle and the line segment length described above. The oblique side S46d of the first inner conductor layer 46 is located so as to be parallel to each other and to intersect these two oblique sides S48b and S47c at an acute angle.

  Thus, according to the multilayer capacitor 40 described above, the positional relationship in which the four sides defining each of the first to third inner conductor layers 46 to 48 provided in the capacitor body 41 do not match in the stacking direction. Therefore, the stress due to electrostriction can be reliably distributed to each of the four sides defining the first to third inner conductor layers 46 to 48. That is, it is possible to avoid stress due to electrostriction from being concentrated on a specific side or a part of the four sides that define the first to third inner conductor layers 46 to 48, and thereby the multilayer capacitor. 204 Withstand voltage can be improved by improving insulation resistance.

  Further, according to the above-described multilayer capacitor 40, the first to third inner conductor layers 46 to 48 are at different angles (0 degrees, 90 degrees, 180 degrees) in a plane orthogonal to the lamination direction of the reference quadrangular conductor layer. Therefore, it is not necessary to separately prepare conductor layers having different shapes as the first to third inner conductor layers 46 to 48. That is, the conductor layer creation process can be simplified by sharing the shapes of the first to third inner conductor layers 46 to 48, thereby suppressing an increase in the manufacturing cost of the multilayer capacitor 40.

  In the above-described third embodiment, the first to third inner conductor layers 46 to 48 are formed at different angles (0 degrees, 90 degrees) in the same plane as the first embodiment in a plane perpendicular to the stacking direction. In the plane perpendicular to the stacking direction, the first to third inner conductor layers 46 to 48 are arranged in the same plane as the second embodiment. Even if it is obtained by rotating at different angles (0 degrees, 90 degrees, 180 degrees), the same effect as described above can be obtained. In any case, the rotation angle may be 0 degrees, 90 degrees, and 270 degrees, or may be 0 degrees, 180 degrees, and 270 degrees.

  In the third embodiment described above, the first to third external electrodes 42 to 44 are provided at the three corners of the capacitor body 41. However, one of the first and third external electrodes 42 and 44 is shown. 11, for example, as shown in FIG. 11, the third external electrode 44 ′ extends to the corner where the lead-out portion 48 e reaches and the corner adjacent to the corner in the counterclockwise direction. In other words, it may be formed so as to cover one end of the capacitor body 41.

[Other Embodiments]
As described above, in the first to third embodiments, the first to fourth external electrodes or the first to third external electrodes provided at the corners of the capacitor body (excluding the partial modification of FIG. 11) are shown. However, if the shape of the lead-out portion of the reference quadrangular conductor layer is such that it reaches the side surface of the capacitor body, the first to fourth external electrodes, or the first to third external electrodes are the four side surfaces of the capacitor body, or It can also be provided on the three side surfaces.

  In the first and second embodiments, two sets of the first to fourth inner conductor layers are used in a total of eight layers, and in the third embodiment, two sets of the first to third inner conductor layers are set to six. Although what used the layer was shown, it cannot be overemphasized that the number of sets and the number of layers can be suitably increased / decreased in practical use.

  Furthermore, in the first to third embodiments, the first to fourth inner conductor layers, or the first to third inner conductor layers, all have a quadrangular shape in a plane orthogonal to the stacking direction. Even when a polygon other than a quadrangle in the plane perpendicular to the stacking direction, for example, a triangle, a pentagon, a hexagon, or the like is used as the internal conductor layer, each of a plurality of sides defining each internal conductor layer If there is a positional relationship that does not match in the stacking direction, the same effect as described above can be obtained.

It is a figure which shows the upper part figure and side view of a multilayer capacitor which show a prior art example, and the side part where the stress by electrostriction tends to concentrate. It is the top view and side view of a multilayer capacitor which show 1st Embodiment of this invention. It is a figure which shows the layer structure of the capacitor | condenser main body shown to FIG. 2 (A). It is a figure which shows the positional relationship of the lamination direction of each 4 sides of the 1st-4th internal conductor layer in the capacitor | condenser main body shown to FIG. 2 (A). It is the top view and side view of a multilayer capacitor which show 2nd Embodiment of this invention. It is a figure which shows the layer structure of the capacitor | condenser main body shown to FIG. 5 (A). It is a figure which shows the positional relationship of the lamination direction of each 4 sides of the 1st-4th internal conductor layer in the capacitor | condenser main body shown to FIG. 5 (A). It is the upper side figure and side view of a multilayer capacitor which show 3rd Embodiment of this invention. It is a figure which shows the layer structure of the capacitor | condenser main body shown to FIG. 8 (A). It is a figure which shows the positional relationship of the lamination direction of each 4 sides of the 1st-3rd internal conductor layer in the capacitor | condenser main body shown to FIG. 8 (A). It is a top view of the multilayer capacitor showing a partial modification of the third embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 20 ... Multilayer capacitor, 21 ... Capacitor main body, 22 ... 1st external electrode, 23 ... 2nd external electrode, 24 ... 3rd external electrode, 25 ... 4th external electrode, 26 ... 1st internal conductor layer, S26a-S26d ... Four sides of the first inner conductor layer, 26e ... extracted portion of the first inner conductor layer, 27 ... second inner conductor layer, S27a to S27d ... four sides of the second inner conductor layer, 27e ... leader of the second inner conductor layer 28, third inner conductor layer, S28a to S28d, four sides of the third inner conductor layer, 28e, lead portion of the third inner conductor layer, 29, fourth inner conductor layer, S29a-S29d, fourth inner conductor. 4 sides of the layer, 29e ... leading portion of the fourth internal conductor layer, 30 ... multilayer capacitor, 31 ... capacitor body, 32 ... first external electrode, 33 ... second external electrode, 34 ... third external electrode, 35 ... first 4 external electrodes, 36... First internal conductor layer, S36a to S 6d: four sides of the first inner conductor layer, 36e: lead portion of the first inner conductor layer, 37: second inner conductor layer, S37a to S37d: four sides of the second inner conductor layer, 37e: second inner conductor layer 38 ... third inner conductor layer, S38a to S38d ... four sides of third inner conductor layer, 38e ... leader of third inner conductor layer, 39 ... fourth inner conductor layer, S39a-S39d ... fourth Four sides of the inner conductor layer, 39e ... extracted portion of the fourth inner conductor layer, 40 ... multilayer capacitor, 41 ... capacitor body, 42 ... first outer electrode, 43 ... second outer electrode, 44, 44 '... third outer Electrode, 46 ... first inner conductor layer, S46a to S46d ... four sides of first inner conductor layer, 46e ... leading portion of first inner conductor layer, 47 ... second inner conductor layer, S47a to S47d ... second inner conductor 4 sides of the layer, 37e ... leading portion of the second inner conductor layer, 48 ... inside the third Conductor layer, four sides of S48a～S48d ... third inner conductor layer, 48e ... lead portion of the third inner conductor layer.

Claims (7)

A rectangular parallelepiped capacitor main body formed by laminating at least three types of internal conductor layers in order through a dielectric layer, each having a polygonal shape in a plane perpendicular to the laminating direction and different positions of the lead portions. When,
At least three external electrodes provided on the surface of the capacitor body in a non-contact manner and connected to the lead portions of the at least three types of internal conductor layers,
Wherein the plurality of sides each defining a respective at least three internal conductor layer has a positional relationship which does not coincide with the stacking direction,
Each of the plurality of corners of each of the at least three types of inner conductor layers has a rounded shape and has a positional relationship that does not match in the stacking direction.
A multilayer capacitor characterized by that. The at least three types of inner conductor layers are formed of four types of inner conductor layers in which the shape in a plane orthogonal to the stacking direction is a quadrangle, and the positions of the lead portions are different from each other.
The multilayer capacitor according to claim 1. The four types of inner conductor layers are obtained by rotating a single-shaped quadrangular conductor layer at different angles in a plane perpendicular to the stacking direction.
The multilayer capacitor according to claim 2. The at least three types of inner conductor layers are formed of three types of inner conductor layers in which a shape in a plane orthogonal to the stacking direction forms a quadrangle, and the positions of the lead portions are different from each other.
The multilayer capacitor according to claim 1. The three types of inner conductor layers are obtained by rotating a single-shaped quadrangular conductor layer at different angles in a plane orthogonal to the stacking direction.
The multilayer capacitor according to claim 4. The four sides of the single-shaped quadrangular conductor layer are constituted by four oblique sides inclined at an acute angle with the side surface of the capacitor body facing each side,
The multilayer capacitor according to claim 3 or 5, wherein Four sides of the single-shaped quadrangular conductor layer are inclined at an acute angle with two sides substantially parallel to the side surface of the capacitor body facing two of the four sides and the side surface of the capacitor body facing the other two sides. Composed of two hypotenuses,
The multilayer capacitor according to claim 3 or 5, wherein

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