JP5163656B2 - Manufacturing method of component mounting substrate and component mounting substrate - Google Patents

Description

The present invention relates to a method for manufacturing a component mounting board in which a wiring board is connected to a frame body via a connecting portion, and a component mounting board. This application is related to the following Japanese application and claims priority from the following Japanese application. For designated countries where incorporation by reference of documents is permitted, the contents described in the following application are incorporated into this application by reference and made a part of this application.
Japanese Patent Application No. 2008-011162 Application date January 22, 2008

  Electronic devices such as portable information terminals and digital cameras are required to be smaller, higher performance, and thinner. In order to meet the demands of these electronic devices, various printed wiring boards (hereinafter referred to as wiring boards) for mounting components at high density have been commercialized. As the wiring board, for example, a rigid wiring board in which a wiring pattern is formed by a conductive foil on a glass epoxy resin base material (FR4) made of a composite material of glass fiber and epoxy resin, or a resin film such as a polyimide film or a liquid crystal polymer There is a flexible wiring board in which a wiring pattern is formed by a conductive foil. Further, for example, there is a flex-rigid wiring board in which a rigid connection portion on which various modules, ICs and other components are mounted is flexibly connected via a flexible portion without a signal connection connector inside an electronic device. A flex-rigid wiring board is a multilayer printed wiring board having a flexible part and a rigid part, and its structure is diverse. For example, a glass epoxy resin base material (FR4) made of a composite material of glass fiber and epoxy resin in which a wiring pattern is formed by a conductor foil is used as a rigid portion, and a resin such as a polyimide film or a liquid crystal polymer in which the wiring pattern is formed by a conductor foil A three-dimensional wiring structure is formed by using the film as a flexible portion and overlapping the resin base material and the resin film so as to be partially exposed.

FIG. 3 is a schematic view showing a work (multilayer wiring board) in a conventional manufacturing process. The piece substrate 53 is connected to the first frame body 5 via the first connecting portion 4 and becomes a child substrate 52. The sub board 52 is connected to the second frame 15 via the second connecting portion 14 and constitutes the main board 51 as a whole.
In the manufacturing process, the parent substrate 51 including the piece substrate 53 and the child substrate 52 is manufactured collectively, or the child substrate 52 is separated from the parent substrate 51 during the manufacturing process. In general, for the purpose of ensuring the positioning accuracy for mounting components at high density, the component is mounted on the component mounting surface of the piece substrate 53 in the state of the child substrate 52 in which the piece substrate 53 is connected to the frame body 5 via the connecting portion 4. Implemented. The above-described piece substrate 53, child substrate 52, and parent substrate 51 are all forms of a wiring board. In this specification, in order to clearly distinguish the component mounting board (child board) from these wiring boards (parent board and piece board), the piece board on which the component is directly mounted is connected to the connecting part (first connecting part). The state of being connected to each other is expressed as a component mounting board.

  Along with miniaturization and high performance of mounted components, when mounting components on a board, mounting in a clean environment is required. In particular, when mounting precision optical components such as digital camera lenses and CCDs on a substrate, great care must be taken to maintain a clean environment. In the manufacturing process, it is known that dust is generated from the side surface of the component mounting board when the component is mounted. The dust generation material from the side surface of the component mounting board is mainly made of resin powder containing fibers such as glass. If dust generation material from the side surface of the component mounting board adheres to, for example, the surface of these precision optical components or the wiring board on which these precision optical components are mounted, defective dot missing in the image, foreign matter on the lens Defects such as adhesion failure and reference angle shift failure occur, which is a major problem in manufacturing quality.

  In the manufacturing process of the component mounting board, a tool (processing equipment) such as a die or a router is used to leave the connecting portion (first connecting portion, second connecting portion) along the outer shape of the wiring board. An outer shape process (cutting process) for forming a through groove is performed. By this outer shape processing, the cut side surfaces (cut surfaces) of the wiring board, the connecting portion, and the frame are exposed. For example, the side surface (cut surface) of the rigid wiring board (rigid portion) is in a state in which fibers such as glass constituting the base material are exposed, so that resin powder containing fibers such as glass is easily scattered. The dust generation material is scattered from the side surface of the rigid wiring board (rigid portion) due to vibration in the manufacturing process, and the surface of the mounting component or the mounting surface of the mounting component and the mounting component are caused by the action of static electricity or the like. Adheres to the mounted wiring board. On the other hand, for example, the side surface (cut surface) of the flexible wiring board (flexible part) is thinner than the rigid wiring board (rigid part), so the amount of dust generated by the external processing of the flexible part is rigid. The amount of dust generated due to the external processing of the part is small.

Conventionally, with respect to the component mounting board in which the rigid wiring board is connected to the frame body via the connecting portion, after applying the outer shape processing to form a through groove along the outer shape of the rigid wiring board, leaving the connecting portion, Applying a photosensitive resin such as resist ink for insulation protection of wiring patterns to the side surface formed by external processing, exposing and developing, and covering the side surface of the component mounting board with the photosensitive resin for component mounting A manufacturing method for preventing dust generation from a cut side surface of a substrate is disclosed (Patent Documents 1 and 2).
Japanese Patent Laid-Open No. 11-145580 JP-A-9-148719

  However, the present inventors have disclosed a side surface (cutting) of a component mounting board using a manufacturing method similar to that of Patent Documents 1 and 2 for a component mounting board in which a flex-rigid wiring board is connected to a frame body via a connecting portion. The surface is coated with a resist ink (photosensitive resin) for insulation protection of a wiring pattern, and then exposed and developed to cover the cut side surface with the photosensitive resin. The photosensitive resin is applied not only to the side surface (cut surface) of the connecting portion and the frame but also to the side surface (cut surface) of the flexible portion, and exposure / development processing is performed on the side surface (cut surface) of the flexible portion. When applied, the above-mentioned flexible part becomes hard, and the problem that flexibility required as a flexible part is impaired was newly found.

  Therefore, an object of the present invention is a component mounting substrate manufacturing method and a component mounting substrate in which flex-rigid wiring boards are connected via a connecting portion, while maintaining the necessary flexibility as a flexible portion, An object of the present invention is to provide a component mounting board manufacturing method and a component mounting board that prevent dust generation from the side surface of the rigid portion.

  Therefore, an object of one aspect of the present invention is to provide a method for manufacturing a component mounting board and a component mounting board that can solve the above-described problems. This object is achieved by a combination of features described in the independent claims. The dependent claims define further advantageous specific examples of the present invention.

  The component mounting substrate manufacturing method according to the first aspect of the present invention is a component mounting substrate manufacturing method in which a flex-rigid wiring board including a rigid portion and a flexible portion is connected to a frame body via a connecting portion. And forming a through groove along the outer shape of the flex-rigid wiring board, leaving the connecting portion, and then covering the side surface of the rigid portion and the side surface of the frame with a photosensitive resin, exposing and developing The photosensitive resin is removed from the side surface of the flexible part.

  According to one aspect of the present invention, when the side surface of the rigid portion and the side surface of the frame body are covered with a photosensitive resin, even if the photosensitive resin adheres to the side surface of the flexible portion, it is removed by development processing without being exposed. Therefore, the flexibility required for the flexible part is maintained. On the other hand, the side surface of the rigid part where the fiber such as glass constituting the base material is exposed is covered with the photosensitive resin by forming the through-groove by the outer shape processing.

  As one aspect of the present invention, a photosensitive resin coating operation in which the side surface of the rigid portion is covered with a photosensitive resin is also used as a resist resin coating operation for the wiring pattern of the wiring board, or the photosensitive resin and the wiring pattern By using the resist resin also, an existing manufacturing process (existing manufacturing equipment) or manufacturing material can be applied.

  As one aspect of the present invention, there is provided a method for manufacturing a component mounting board in which a flex-rigid wiring board including a rigid portion and a flexible portion is connected to a first frame body via a first connecting portion. The mounting boards are connected to the second frame body via the second connecting portion, and pass along the outer shape of the flex-rigid wiring board, leaving the first connecting portion and the second connecting portion. After forming the groove, the side surface of the rigid portion and the side surfaces of the first frame body and the second frame body are covered with a photosensitive resin, exposed and developed, whereby the photosensitive resin is exposed from the side surface of the flexible portion. It can apply to the manufacturing method which cut | disconnects the said 2nd connection part after removing. According to this manufacturing method, since the component mounting boards can be operated in a state of being connected to each other via the second connecting portion, the steps such as the above-described photosensitive resin coating, exposure, and development are performed. A large number can be processed at once without reducing the size.

  The first frame may be an example of a first holding unit. The second frame may be an example of a second holding unit. The 2nd connection part does not need to contain the fiber. The second connecting portion may be an organic material that does not contain fibers. The said fiber may be a glass fiber contained in a glass epoxy resin base material (FR4). The fiber may be an example of a dust generating material.

  A component mounting board according to a second aspect of the present invention is a component mounting board in which a flex rigid wiring board including a rigid portion and a flexible portion is connected to a frame body via a connecting portion, The side surface and the side surface of the frame body are covered with resin, but at least the side surface of the flexible portion is not coated with resin. According to one aspect of the present invention, the purpose is to suppress dust generation while maintaining the flexibility required as the flexible part of the flex-rigid wiring board. For that purpose, some resin is in the flexible part. It is not preferable. Moreover, it is preferable that there is no resin in which the flexibility required for the flexible portion is impaired even on the upper surface or the lower surface of the flexible portion. However, since the resin is not applied to at least the side surface of the flexible portion, the flexibility necessary for the flexible portion is maintained. Examples of the resin include a photosensitive resin and a thermosetting resin.

  As one aspect of the present invention, in the component mounting board, the resin is preferably a photosensitive resin used for insulating a wiring pattern of the wiring board.

  According to one aspect of the present invention, the resin is a photosensitive resin used for insulating the wiring pattern of the wiring board, so that the insulating resin of the wiring pattern on the upper surface of the wiring board and the side surface of the wiring board are Since the resin to be covered is the same resin, batch processing is possible, and a new manufacturing process does not have to be provided.

  As one aspect of the present invention, in the component mounting board, it is preferable that the connecting portion and the flexible portion are made of an organic material that does not contain fibers such as glass. The amount of dust generated from the cut side surfaces of the connecting portion and the flexible portion can be reduced as much as possible.

  In the third aspect of the present invention, a rigid part in which a wiring pattern is formed, a flexible part connected to the rigid part and having flexibility, and a first holding part for holding at least the rigid part, Preparing a substrate comprising a first connecting part for connecting the rigid part and the first holding part, and at least on a side surface of the rigid part and at least an inner side surface of the first holding part, A step of applying a photosensitive resin; and the photosensitive resin remains on at least an inner surface of the rigid portion and at least an inner surface of the first holding portion, and the photosensitive resin is substantially formed on at least the side surface of the flexible portion. There is provided a method for manufacturing a component mounting board comprising: exposing and developing the photosensitive resin so as not to remain.

  In the manufacturing method of the component mounting board, the step of preparing the board includes forming a through groove in a multilayer wiring board in which a rigid base material containing fibers and a flexible base material having flexibility are superimposed, The method may include forming the substrate. In the method for manufacturing a component mounting board, the board includes a plurality of the rigid portion, the flexible portion, and the first connecting portion, and each of the plurality of rigid portions includes the plurality of rigid portions. The first holding part may be connected to the first holding part via the first connecting part.

  In the method for manufacturing a component mounting board, the flexible part may not contain a dusting substance. In the method for manufacturing a component mounting board, the first connecting portion may not contain a dusting substance. In the method for manufacturing a component mounting board, the board includes a plurality of first holding parts to which at least the rigid parts are connected, and a second holding that holds the plurality of first holding parts. And a plurality of second connecting parts that connect each of the plurality of first holding parts and the second holding part.

  In the fourth aspect of the present invention, the first rigid portion, the second rigid portion, and the flexible portion are electrically coupled to each other. A flexible part, a first holding part for holding the first rigid part and the second rigid part, the first holding part and the first rigid part or the second rigid part. A step of preparing a substrate including a first connecting portion to be connected, and at least on a side surface of the first rigid portion, a side surface of the second rigid portion, and at least an inner surface of the first holding portion, A step of applying a photosensitive resin, and the photosensitive resin remains on at least an inner side surface of the first rigid portion, a side surface of the second rigid portion, and a side surface of the first holding portion; The photosensitive tree on at least the side of So it does not substantially remain, method for producing a component mounting substrate comprising the steps of exposing and developing the photosensitive resin is provided.

  In the fifth aspect of the present invention, a rigid part having a wiring pattern formed thereon, a flexible part connected to the rigid part and having flexibility, and a first holding part for holding at least the rigid part, A first connecting portion that connects the rigid portion and the first holding portion, and a resin that suppresses dust generation from the side surface is disposed on a side surface of the rigid portion. At least the side surface is provided with a component mounting board in which the same kind of resin as the above resin is not substantially disposed. In the component mounting board, the resin may include the same material as the insulating resin used for insulating the wiring pattern of the rigid portion.

  In the sixth aspect of the present invention, a rigid part in which a wiring pattern is formed, a flexible part connected to the rigid part and having flexibility, and a first holding part for holding at least the rigid part, A substrate including a first connecting portion that connects the rigid portion and the first holding portion is prepared, and at least a side surface of the rigid portion and at least an inner side surface of the first holding portion are photosensitive. Resin is applied so that the photosensitive resin remains on at least the inner surface of the rigid portion and the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. A component mounting board obtained by exposing and developing the photosensitive resin is provided.

  In the seventh aspect of the present invention, the first rigid part, the second rigid part, and the flexible part are electrically coupled to each other. A flexible part, a first holding part for holding the first rigid part and the second rigid part, the first holding part and the first rigid part or the second rigid part. A first connecting portion to be connected, and a resin for suppressing dust generation from the side surface is disposed on a side surface of the first rigid portion and a side surface of the second rigid portion. At least the side surface is provided with a component mounting board in which the same kind of resin as the above resin is not substantially disposed.

  In an eighth aspect of the present invention, a rigid part in which a wiring pattern is formed, a flexible part connected to the rigid part and having flexibility, and a first holding part for holding at least the rigid part, Preparing a substrate comprising a first connecting part for connecting the rigid part and the first holding part, and at least on a side surface of the rigid part and at least an inner side surface of the first holding part, A step of applying a photosensitive resin; and the photosensitive resin remains on at least an inner surface of the rigid portion and at least an inner surface of the first holding portion, and the photosensitive resin is substantially formed on at least the side surface of the flexible portion. A flexible rigid wiring board comprising: exposing and developing the photosensitive resin so as not to remain; and separating the first holding portion and the rigid portion. A method is provided. The method for manufacturing a flex-rigid wiring board may further include a step of mounting a mounting component on the rigid portion before the step of separating the first holding portion and the rigid portion.

  In the ninth aspect of the present invention, the first rigid portion, the second rigid portion, and the flexible portion are electrically coupled to each other. The first rigid portion and the second rigid portion are electrically coupled. A flexible part, a first holding part for holding the first rigid part and the second rigid part, the first holding part and the first rigid part or the second rigid part. A step of preparing a substrate including a first connecting portion to be connected, and at least on a side surface of the first rigid portion, a side surface of the second rigid portion, and at least an inner surface of the first holding portion, A step of applying a photosensitive resin, and the photosensitive resin remains on at least an inner side surface of the first rigid portion, a side surface of the second rigid portion, and a side surface of the first holding portion; The photosensitive tree on at least the side of Exposing and developing the photosensitive resin so that substantially does not remain, and separating the first holding portion, the first rigid portion and the second rigid portion. A method for manufacturing a flex-rigid wiring board is provided.

  In a tenth aspect of the present invention, a rigid portion having a wiring pattern formed thereon and a flexible portion connected to the rigid portion and having flexibility are provided on the side surface of the rigid portion. There is provided a flex-rigid wiring board in which a resin for suppressing dust generation is disposed, and at least a side surface of the flexible portion is substantially not disposed with a resin of the same type as the resin. In the flex-rigid wiring board, the resin may include the same material as the insulating resin used for insulating the wiring pattern of the rigid portion.

  In an eleventh aspect of the present invention, a rigid part in which a wiring pattern is formed, a flexible part connected to the rigid part and having flexibility, and a first holding part for holding at least the rigid part, A substrate including a first connecting portion that connects the rigid portion and the first holding portion is prepared, and at least a side surface of the rigid portion and at least an inner side surface of the first holding portion are photosensitive. Resin is applied so that the photosensitive resin remains on at least the inner surface of the rigid portion and the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. There is provided a flex-rigid wiring board obtained by exposing and developing the photosensitive resin and separating the first holding portion and the rigid portion.

  In the twelfth aspect of the present invention, the first rigid portion, the second rigid portion, and the flexible portion are electrically connected to each other. The first rigid portion and the second rigid portion are electrically coupled. A flexible portion, and on the side surface of the first rigid portion and the side surface of the second rigid portion, a resin for suppressing dust generation from the side surface is disposed, and at least the side surface of the flexible portion, There is provided a flex-rigid wiring board in which the same kind of resin as the resin is substantially not disposed.

  The above summary of the invention does not enumerate all the necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.

  According to one aspect of the present invention, even if the photosensitive resin adheres to the flexible portion when the side surface of the rigid portion is covered with the photosensitive resin, it is not exposed but is removed by development processing. Therefore, the flexibility necessary for the flexible part is maintained. Meanwhile, the side surface of the rigid portion is covered with a photosensitive resin. In addition, since the connecting portion and the flexible portion are made of a resin material that does not contain fibers such as glass, the amount of dust generated from the cut side surfaces of the connecting portion and the flexible portion can be reduced as much as possible. Therefore, according to the present invention, it is possible to realize a component mounting substrate that prevents dust generation by selectively covering the side surface of the rigid portion with the photosensitive resin while maintaining the flexibility necessary for the flexible portion.

It is a schematic diagram which shows the component mounting board | substrate of embodiment to which this invention is applied. It is a schematic diagram which shows the component mounting board | substrate of embodiment to which this invention is applied. It is a schematic diagram which shows the component mounting board | substrate of embodiment to which this invention is applied. It is a schematic diagram which shows the component mounting board | substrate of embodiment to which this invention is applied. It is a process flowchart which shows the manufacture procedure of the said embodiment. It is a schematic diagram which shows the workpiece | work (multilayer wiring board) in the conventional manufacturing process.

Explanation of symbols

1 Component mounting board (child board),
2 Flex rigid wiring boards (piece boards, wiring boards),
4 connecting portion (first connecting portion), 4a side surface of connecting portion,
5 Frame (first frame), 5a, 5b Side surfaces of the frame,
6 through groove (first through groove),
7 Rigid part, 7a, 7b Rigid side,
8 Flexible part, 8a Side of flexible part,
9 Resin (photosensitive resin, solder resist)

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  Hereinafter, one aspect of the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the invention according to the scope of claims, and are combinations of features described in the embodiments. Not all are essential to the solution of the invention.

(Component mounting board according to an embodiment of the present invention)
Fig.1 (a) is the schematic diagram which looked at an example of the board | substrate 1 for component mounting to which this invention was applied from the front. 1B is a cross-sectional view taken along line AA of the component mounting board 1, FIG. 1C is a cross-sectional view taken along line BB of the component mounted board 1, and FIG. 1 is a side view of a mounting substrate 1. The present embodiment is a component mounting substrate 1 in which a flex-rigid wiring board 2 as a plurality (four in FIG. 1 exemplarily) piece substrates is connected to a frame 5 via a connecting portion 4. The side surfaces 7a and 7b (outer side surface 7a and inner side surface 7b) of the rigid portion 7 of the flex rigid wiring board 2 and the side surfaces 5a and 5b (outer side surface 5a and inner side surface 5b) of the frame 5 are photosensitive. Covered with resin 9. However, the photosensitive resin 9 is not applied to the side surface 8a (outer side surface 8a) of the flexible portion 8, and the upper surface 8c and the lower surface 8d of the flexible portion 8. Therefore, the component mounting substrate 1 of the present embodiment is such that the photosensitive resin 9 is not applied to the side surface 8 a of the flexible portion 8, so that the flexibility required for the flexible portion 8 is maintained, while the rigid portion 7 has Dust generation is prevented by selectively covering the side surfaces 7 a and 7 b and the side surfaces 5 a and 5 b of the frame 5 with the photosensitive resin 9.

  The photosensitive resin 9 also serves as a resin used to insulate the wiring pattern on the upper surface 7 c of the rigid portion 7 (wiring pattern connected to the upper surface wiring electrode 54). This is because the manufacturing method described later can be simplified. The main component of the resin material of the rigid portion 7 is epoxy, and the main component of the photosensitive resin 9 is also epoxy. This is to improve the adhesion between the photosensitive resin 9 and the rigid portion 7. The resin material of the flexible portion 8 is polyimide that does not contain fibers such as glass. The resin material of the connecting part 4 is also made of polyimide that does not contain fibers such as glass. This is to minimize the amount of dust generated from the side surface 8a of the flexible portion 8 or the side surface 4a of the connecting portion 4 that is not covered with the photosensitive resin 9. Moreover, although the connection part 4 is cut | disconnected after component mounting, since the connection part 4 consists of polyimides which do not contain fibers, such as glass, the amount of dust generation from the cut | disconnected side surface of the connection part 4 is small.

  By separating the frame 5 and the rigid portion 7, the component mounting board 1 and the flex rigid wiring board 2 can be separated. The frame 5 may be an example of a first holding unit. The side surface 5b of the frame 5 may be an example of an inner surface. The rigid portion 7 may be an example of a first rigid portion or a second rigid portion.

  In addition, in this embodiment, although the case where the side surface 5a and the side surface 5b of the frame 5 were covered with the photosensitive resin 9 was demonstrated, it is not limited to this. For example, at least the side surface 5b of the frame 5 may be covered with a photosensitive resin. For example, the side surface 5b of the frame 5 is covered with resin, but the side surface 5a may not be covered with resin. Since the outer side surface 5a is relatively distant from the mounting area of the mounting component such as the image sensor, the influence of the dust generating material scattered from the outer side surface 5a is the influence of the dust generating material scattered from the inner side surface 5b. It is because it is small compared.

  In the present embodiment, the component mounting board 1 has a plurality of flex-rigid wiring boards 2 and a plurality of connecting portions 4, and the plurality of flex-rigid wiring boards 2 are connected to the inside of the frame body 5. The case where it connects via is demonstrated. However, the component mounting board is not limited to this. For example, the shape of the first holding portion may be a plate shape, a rod shape, or an H shape.

  In this embodiment, the case where the flex-rigid wiring board 2 has two rigid portions 7 and the flexible portion 8 electrically couples the two rigid portions 7 has been described. However, the present invention is not limited to this. For example, the flex-rigid wiring board may include at least one rigid portion and a flexible portion connected to the rigid portion. The flex-rigid wiring board may include, for example, one rigid portion, one end of the flexible portion is connected to the rigid portion, and a connector is disposed at the other end of the flexible portion. In the present specification, not only the state before the component is mounted on the rigid portion but also the state after the component is mounted on the rigid portion is referred to as a flex-rigid wiring board.

(Manufacturing method of component mounting board according to an embodiment of the present invention)
FIG. 2 is a process flowchart showing an example of the manufacturing procedure of the component mounting board 1 of the present invention. An example of a method for manufacturing the component mounting board 1 to which the present invention is applied will be described below in accordance with the process flowchart of FIG.

  First, an outer shape process is performed on a work (multilayer wiring board) in which a flexible base material (a base material to be the flexible portion 8) and a rigid base material (a base material to be the rigid portion 7) are superimposed and integrally formed (S1). Here, the outer shape processing is to form the through-groove 6 along the outer shape of the portion to be the flex-rigid wiring board 2 leaving the connecting portion 4 with a tool (processing equipment) such as a mold or a router. The positioning hole 57 and the component mounting hole 56 of the rigid portion 7 are also processed in the step S1.

  Then, if necessary, the surface of the electrode (such as copper) that forms the wiring pattern on the upper surface of the workpiece (multilayer wiring board) is removed, and appropriate irregularities are provided to improve the adhesion with the photosensitive resin 9. Pre-processing is performed (not shown). Examples of the pretreatment include pickling and alkali washing.

  After the outer shape processing (S1), the photosensitive resin 9 is applied to the upper surface 7c of the rigid portion 7 of the workpiece (multilayer wiring board), the side surfaces 7a and 7b of the rigid portion 7, and the side surfaces 5a and 5b of the frame body 5 (S2). ). As a coating method of the photosensitive resin 9, a spray coating method, a curtain coating method, a roller coating method, a screen printing method, or the like can be applied. Preferably, a coating by a spray coating method is performed. The photosensitive resin 9 can be applied in accordance with the shape of the workpiece (multilayer wiring board) over a wide range by spray coating. That is, even if the side surfaces 7a and 7b of the rigid portion 7 or the side surfaces 5a and 5b of the frame 5 are uneven, the photosensitive resin 9 can be reliably applied.

  After the photosensitive resin application (S2), the work (multilayer wiring board) is dried to evaporate the organic solvent of the applied photosensitive resin 9 (S3). Here, the photosensitive resin application (S2) and the drying process (S3) are continuously performed by a spray coater (spray coater line).

  After the drying process (S3), a mask film made of artwork is brought into close contact with the work (multilayer wiring board), exposed to ultraviolet rays, and the photosensitive groups of the photosensitive resin 9 at the exposed locations are reacted (light (S4).

  As the photosensitive resin 9, there are a positive resist in which the exposed area is melted by the developing process and a negative resist in which the exposed area is insoluble by the developing process. By using a positive resist, it is possible to selectively leave the photosensitive resin 9 in a portion where light does not reach such as a through hole (through hole). The negative resist is a general-purpose photosensitive resin, and an existing solder resist apparatus (solder resist line) can be used as it is.

  First, the case where the photosensitive resin 9 is a negative resist will be described. The upper surface wiring electrode 54, the component adhesion portion 55, the side surface 8a of the flexible portion 8, the upper surface 8c and the lower surface 8d of the flexible portion 8, which are regions where the photosensitive resin 9 is removed in a later process, are shielded from light by the mask film. . Then, the wiring pattern on the upper surface 7c of the rigid portion 7 (wiring pattern connected to the upper surface wiring electrode 54), the side surfaces 7a and 7b of the rigid portion 7, and the frame 5 are the regions where the photosensitive resin 9 is not removed in the subsequent process. The side surfaces 5a and 5b are exposed (S4).

  After the exposure process (S4), the work (multilayer wiring board) is developed (S5). Development methods include an immersion method, a spray method, and a paddle method. By performing the development process, the photosensitive resin 9 adhered to the upper surface wiring electrode 54, the component adhesion portion 55, the side surface 8a of the flexible portion 8, the upper surface 8c and the lower surface 8d of the flexible portion 8 that is shielded by the mask film is developed. Melt in. An alkaline aqueous solution is used as the developer.

  After the development process (S5), washing and draining are performed (not shown), and the work (multilayer wiring board) is heated by a heating means (S6). By heating, the photosensitive resin 9 covering the wiring pattern on the upper surface 7c of the rigid portion 7 (wiring pattern connected to the upper surface wiring electrode 54), the side surfaces 7a and 7b of the rigid portion 7 and the side surfaces 5a and 5b of the frame 5 is formed. Fully cured. As the heating means, for example, a hot plate is used. If necessary, after the development processing (S5), the work is re-irradiated with ultraviolet rays to completely react the photosensitive groups of the photosensitive resin 9 at the exposed portions, and then the work (multilayer wiring board) is heated. To cure by heating (S6).

  The component mounting board 1 of the present embodiment is manufactured by the above manufacturing method. In the component mounting substrate 1 of the present embodiment by the above-described manufacturing method, the side surfaces 7a and 7b of the rigid portion 7 and the side surfaces 5a and 5b of the frame 5 are covered with the photosensitive resin 9, but the side surface 8a of the flexible portion 8 The photosensitive resin 9 is not applied to the upper surface 8c and the lower surface 8d of the flexible portion 8. Therefore, the side surfaces 7 a and 7 b of the rigid portion 7 are selectively covered with the photosensitive resin 9.

  In the manufacturing method described above, for the purpose of rationalizing the manufacturing process, the wiring pattern on the upper surface 7c of the rigid portion 7 (wiring pattern connected to the upper surface wiring electrode 54), the side surfaces 7a and 7b of the rigid portion 7, and the frame 5 Although the side surfaces 5a and 5b are simultaneously covered with the photosensitive resin 9, the respective steps can be performed separately.

  In the above manufacturing method, the case where the photosensitive resin 9 is a negative resist has been described. However, there is no problem even when the photosensitive resin 9 is a positive resist. That is, when the photosensitive resin 9 is a positive resist, in the exposure (S4) step, a wiring pattern (on the upper surface wiring electrode 54 and the upper surface electrode 7c) is a region where the photosensitive resin 9 is not removed in a later step. The connected wiring pattern), the side surfaces 7a and 7b of the rigid portion 7, and the side surfaces 5a and 5b of the frame 5 are shielded from light by the mask film. Then, the upper surface wiring electrode 54, the component adhesion portion 55, the side surface 8a of the flexible portion 8, the upper surface 8c and the lower surface 8d of the flexible portion 8 which are regions from which the photosensitive resin 9 is removed in a subsequent process are exposed (S4). After the exposure (S4), the work (multilayer wiring board) is developed (S5). By development, the photosensitive resin 9 attached to the upper surface wiring electrode 54, the component bonding portion 55, the side surface 8a of the flexible portion 8, the upper surface 8c and the lower surface 8d of the flexible portion 8 exposed by the mask film is dissolved in the developer. It becomes. The development process (S5) is followed by the heating process (S6) described above.

  In the manufacturing method described above, the manufacturing method in the state of the sub board (corresponding to the sub board 52 in FIG. 3) has been described. However, in the state of the parent board (corresponding to the main board 51 in FIG. 3), the same as the above manufacturing method. After manufacturing, the sub board may be separated from the second connecting part (corresponding to the second connecting part 14 in FIG. 3) to form the component mounting board 1 (for example, the state in FIG. 1). In this case, in a state where the component mounting boards 1 are connected to each other via the second connecting portion 14, a large number of processes such as the outer shape processing and the photosensitive resin application described above are collectively processed.

  The component mounting board 1 manufactured in this manner is mounted with precision optical components and the like in the component mounting process.

  Thus, for example, according to the following procedure, a rigid part in which a wiring pattern is formed, a flexible part connected to the rigid part and having flexibility, and a first holding part that holds at least the rigid part, A first connecting portion that connects the rigid portion and the first holding portion, and a resin that suppresses dust generation from the side surface is disposed on a side surface of the rigid portion, and at least the flexible portion A component mounting board on which the same kind of resin as the above resin is not substantially disposed on the side surface can be manufactured. The resin may include the same material as the insulating resin used for insulating the wiring pattern of the rigid portion. In this specification, “the resin is not substantially arranged” means not only the case where the resin is not arranged, but also the case where the resin remains to the extent that the flexibility necessary for the flexible part is not impaired. Is also included.

  First, a rigid part in which a wiring pattern is formed, a flexible part connected to the rigid part and having flexibility, a first holding part that holds at least the rigid part, the rigid part, and the first A substrate including a first connecting portion that connects the holding portions is prepared. Next, a photosensitive resin is applied to at least the side surface of the rigid portion and at least the inner surface of the first holding portion. Thereafter, the photosensitive resin is left so that the photosensitive resin remains on at least the side surface of the rigid portion and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. The photosensitive resin is exposed and developed.

  In addition, for example, according to the following procedure, a rigid portion having a wiring pattern formed thereon and a flexible portion connected to the rigid portion and having flexibility are provided. It is possible to manufacture a flex-rigid wiring board in which a resin that suppresses dust is disposed, and at least a side surface of the flexible portion is substantially not disposed with the same type of resin as the resin. The resin may include the same material as the insulating resin used for insulating the wiring pattern of the rigid portion.

  First, a rigid part in which a wiring pattern is formed, a flexible part connected to the rigid part and having flexibility, a first holding part that holds at least the rigid part, the rigid part, and the first A substrate including a first connecting portion that connects the holding portions is prepared. Next, a photosensitive resin is applied to at least the side surface of the rigid portion and at least the inner surface of the first holding portion. Next, the photosensitive resin remains on at least the inner surface of the rigid portion and the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. The photosensitive resin is exposed and developed. Thereafter, the first holding part and the rigid part are separated.

  In the present embodiment, a substrate including a rigid portion 7, a flexible portion 8, a frame 5 that is an example of a first holding portion, and a connecting portion 4 that is an example of a first connecting portion is prepared. Although the case where the component mounting substrate 1 is manufactured has been described, the method for manufacturing the component mounting substrate is not limited thereto. For example, the substrate includes a plurality of first holding portions to which flex-rigid wiring boards are connected, a second holding portion that holds the plurality of first holding portions, and the plurality of first holding portions. A plurality of second connecting portions that connect each of the first holding portion and the second holding portion may be prepared.

(Example)
The component mounting board 1 was manufactured by the manufacturing method of the present embodiment. The size of the component mounting board 1 is 110 mm long and 60 mm wide. The existing photosensitive resin 9 was applied with an existing solder resist processing apparatus, and drying, exposure, development, and heat curing were performed. When component mounting was performed on the completed component mounting board 1, the amount of dust generation was less than that of the conventional product. This is presumably because the side surfaces 7 a and 7 b of the rigid portion 7 of the component mounting substrate 1 and the side surfaces 5 a and 5 b of the frame 5 are both covered with the photosensitive resin 9. Further, the flexible portion 8 of the component mounting board 1 was able to maintain the flexibility necessary for the flexible portion 8. This is presumably because the photosensitive resin 9 is not applied to the side surface 8a of the flexible portion 8 of the component mounting substrate 1, and the upper surface 8c and the lower surface 8d of the flexible portion 8.

  As described above, the present invention is not limited to the embodiment described above. For example, even if the base material of the connection part 4 is glass epoxy (FR4), dusting can be prevented by applying the photosensitive resin 9 to the upper surface of the connection part 4 or the side surface 4a of the connection part. Thus, it cannot be overemphasized that this invention can be suitably changed in the range which does not deviate from the meaning.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior”. It should be noted that they can be implemented in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for the sake of convenience, it means that it is essential to carry out in this order. is not.

Flexibility required as a flexible part of a flex-rigid wiring board having a rigid part and a flexible part can be maintained, and the invention can be applied to uses such as manufacture of a component mounting board.
(Item 1)
A method of manufacturing a component mounting board in which a flex-rigid wiring board composed of a rigid part and a flexible part is connected to a frame body via a connecting part, along the outer shape of the flex-rigid wiring board, leaving the connecting part After forming the through groove, the photosensitive resin is removed from the side surface of the flexible portion by covering the side surface of the rigid portion and at least the inner side surface of the frame with a photosensitive resin, exposing and developing. A method for manufacturing a component mounting board.
(Item 2)
2. The method for manufacturing a component mounting board according to item 1, wherein the connecting portion and the flexible portion are made of an organic material not containing fibers such as glass.
(Item 3)
A component mounting board in which a flex-rigid wiring board composed of a rigid part and a flexible part is connected to a frame body via a connecting part, and the side surface of the rigid part and at least the inner side surface of the frame body are covered with resin. A component mounting board, wherein a resin is not applied to at least a side surface of the flexible part.
(Item 4)
Item 4. The component mounting board according to Item 3, wherein the resin is a photosensitive resin used for insulating a wiring pattern of the wiring board.
(Item 5)
Item 3. The component mounting board according to Item 3, wherein the connecting portion and the flexible portion are made of an organic material that does not contain fibers such as glass.
(Item 6)
A rigid portion on which a wiring pattern is formed;
A flexible part connected to the rigid part and having flexibility;
A first holding part for holding at least the rigid part;
A first connecting part for connecting the rigid part and the first holding part;
Preparing a substrate comprising:
Applying a photosensitive resin to at least a side surface of the rigid portion and at least an inner surface of the first holding portion;
The photosensitive resin so that the photosensitive resin remains on at least the inner surface of the rigid portion and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. Exposing and developing
Comprising
A method of manufacturing a component mounting board.
(Item 7)
The step of preparing the substrate includes
Forming a through groove in a multilayer wiring board formed by superimposing a rigid base material containing fibers and a flexible base material having flexibility, and forming the substrate;
Item 7. A method for manufacturing a component mounting board according to Item 6.
(Item 8)
The substrate has a plurality of the rigid portion, the flexible portion, and the first connecting portion,
Each of the plurality of rigid portions is coupled to the first holding portion via the plurality of first coupling portions.
8. A method for manufacturing a component mounting board according to item 6 or item 7.
(Item 9)
The flexible part does not contain dusting substances,
Item 9. The method for manufacturing a component mounting board according to any one of Items 6 to 8.
(Item 10)
The first connecting part does not contain a dusting substance,
10. The method for manufacturing a component mounting board according to any one of items 6 to 9.
(Item 11)
The substrate is
A plurality of the first holding parts connected to at least the rigid part;
A second holding unit for holding the plurality of first holding units;
A plurality of second connecting parts that connect each of the plurality of first holding parts and the second holding part;
Further comprising
The method for manufacturing a component mounting board according to any one of items 6 to 10.
(Item 12)
A first rigid part;
A second rigid part;
A flexible portion having flexibility and electrically coupling the first rigid portion and the second rigid portion;
A first holding part for holding the first rigid part and the second rigid part;
A first connecting part that connects the first holding part and the first rigid part or the second rigid part;
Preparing a substrate comprising:
Applying a photosensitive resin to at least a side surface of the first rigid portion, a side surface of the second rigid portion, and at least an inner surface of the first holding portion;
The photosensitive resin remains on at least the inner surface of the first rigid portion, the second rigid portion, and the first holding portion, and the photosensitive resin is present on at least the side surface of the flexible portion. Exposing and developing the photosensitive resin so that it does not substantially remain;
Comprising
A method of manufacturing a component mounting board.
(Item 13)
A rigid portion on which a wiring pattern is formed;
A flexible part connected to the rigid part and having flexibility;
A first holding part for holding at least the rigid part;
A first connecting part for connecting the rigid part and the first holding part;
With
Resin that suppresses dust generation from the side surface is disposed on the side surface of the rigid part,
The resin of the same type as the resin is not substantially disposed on at least the side surface of the flexible part.
PCB for component mounting.
(Item 14)
The resin includes the same material as the insulating resin used for insulating the wiring pattern of the rigid portion.
Item 13. The component mounting board according to Item 13.
(Item 15)
A rigid portion on which a wiring pattern is formed;
A flexible part connected to the rigid part and having flexibility;
A first holding part for holding at least the rigid part;
A first connecting part for connecting the rigid part and the first holding part;
Prepare a substrate with
Apply a photosensitive resin to at least the side surface of the rigid portion and at least the inner surface of the first holding portion,
The photosensitive resin so that the photosensitive resin remains on at least the inner surface of the rigid portion and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. Obtained by exposure and development,
PCB for component mounting.
(Item 16)
A first rigid part;
A second rigid part;
A flexible portion having flexibility and electrically coupling the first rigid portion and the second rigid portion;
A first holding part for holding the first rigid part and the second rigid part;
A first connecting part that connects the first holding part and the first rigid part or the second rigid part;
With
On the side surface of the first rigid portion and the side surface of the second rigid portion, a resin for suppressing dust generation from the side surface is disposed,
The resin of the same type as the resin is not substantially disposed on at least the side surface of the flexible part.
PCB for component mounting.
(Item 17)
A rigid portion on which a wiring pattern is formed;
A flexible part connected to the rigid part and having flexibility;
A first holding part for holding at least the rigid part;
A first connecting part for connecting the rigid part and the first holding part;
Preparing a substrate comprising:
Applying a photosensitive resin to at least a side surface of the rigid portion and at least an inner surface of the first holding portion;
The photosensitive resin so that the photosensitive resin remains on at least the inner surface of the rigid portion and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. Exposing and developing
Separating the first holding part and the rigid part;
Comprising
A manufacturing method for flex-rigid wiring boards.
(Item 18)
Before separating the first holding part and the rigid part,
The step of mounting a mounting component on the rigid part further comprises:
Item 18. A method for manufacturing a flex-rigid wiring board according to Item 17.
(Item 19)
A first rigid part;
A second rigid part;
A flexible portion having flexibility and electrically coupling the first rigid portion and the second rigid portion;
A first holding part for holding the first rigid part and the second rigid part;
A first connecting part that connects the first holding part and the first rigid part or the second rigid part;
Preparing a substrate comprising:
Applying a photosensitive resin to at least a side surface of the first rigid portion, a side surface of the second rigid portion, and at least an inner surface of the first holding portion;
The photosensitive resin remains on at least the inner surface of the first rigid portion, the second rigid portion, and the first holding portion, and the photosensitive resin is present on at least the side surface of the flexible portion. Exposing and developing the photosensitive resin so that it does not substantially remain;
Separating the first holding portion from the first rigid portion and the second rigid portion;
Comprising
A manufacturing method for flex-rigid wiring boards.
(Item 20)
A rigid portion on which a wiring pattern is formed;
A flexible part connected to the rigid part and having flexibility;
With
Resin that suppresses dust generation from the side surface is disposed on the side surface of the rigid part,
The resin of the same type as the resin is not substantially disposed on at least the side surface of the flexible part.
Flex rigid wiring board.
(Item 21)
The resin includes the same material as the insulating resin used for insulating the wiring pattern of the rigid portion.
Item 21. A flex-rigid wiring board according to item 20.
(Item 22)
A rigid portion on which a wiring pattern is formed;
A flexible part connected to the rigid part and having flexibility;
A first holding part for holding at least the rigid part;
A first connecting part for connecting the rigid part and the first holding part;
Prepare a substrate with
Apply a photosensitive resin to at least the side surface of the rigid portion and at least the inner surface of the first holding portion,
The photosensitive resin so that the photosensitive resin remains on at least the inner surface of the rigid portion and at least the inner surface of the first holding portion, and the photosensitive resin does not substantially remain on at least the side surface of the flexible portion. Exposure and development,
Obtained by separating the first holding part and the rigid part,
Flex rigid wiring board.
(Item 23)
A first rigid part;
A second rigid part;
A flexible portion having flexibility and electrically coupling the first rigid portion and the second rigid portion;
With
On the side surface of the first rigid portion and the side surface of the second rigid portion, a resin for suppressing dust generation from the side surface is disposed,
The resin of the same type as the resin is not substantially disposed on at least the side surface of the flexible part.
Flex rigid wiring board.

Claims (20)

A rigid portion on which a wiring pattern is formed;
Connected to said rigid portion, a flexible portion having flexibility,
A first holding portion for holding at least the rigid part,
A first connecting portion for connecting the said rigid portion said first holding portion,
Preparing a substrate comprising:
At a minimum, at least the inner surface of the side and the first holding portion of the rigid portion, and the step of applying a photosensitive resin,
Wherein said photosensitive resin remaining on at least the inner surface of the side and the first holding portion of the rigid portion, so that the photosensitive resin to at least a side of the flexible portion does not substantially remain, the photosensitive resin by exposing and developing, and removing the photosensitive resin adhering to the side surface of the flexible portion in the step of coating the photosensitive resin,
Comprising
A method of manufacturing a component mounting board. Preparing the substrate comprises:
Forming a through-groove in a multilayer wiring board formed by superimposing a rigid base material containing fibers and a flexible base material having flexibility, and forming the substrate;
The manufacturing method of the component mounting board | substrate of Claim 1 . The substrate has a plurality of the rigid portion, the flexible portion, and the first connecting portion,
Each of said rigid portions, via said first connecting portion is connected to said first holding portion,
The manufacturing method of the component mounting board | substrate of Claim 1 or Claim 2 . The flexible part does not contain fibers ,
The manufacturing method of the component mounting board | substrate as described in any one of Claim 1- Claim 3 . The first connecting portion does not contain fibers ;
The manufacturing method of the component mounting board | substrate as described in any one of Claim 1- Claim 4 . The substrate is
A plurality of the first holding parts connected to at least the rigid part;
A second holding portion for holding a plurality of said first holding portion,
Connecting with each of the plurality of the first holding portion and the second holding portion, and a plurality of second connecting portions,
Further comprising
The manufacturing method of the component mounting board | substrate as described in any one of Claim 1- Claim 5 . The second holding part is arranged in a frame shape.
The manufacturing method of the component mounting board | substrate of Claim 6. A first rigid part;
A second rigid part;
Flexible and a flexible portion for electrically coupling the said first rigid portion and the second rigid part,
A first holding portion for holding the first rigid portion and the second rigid part,
A first connecting portion connecting the first holding portion and the first rigid portion and the second rigid part,
Preparing a substrate comprising:
At least, the first rigid portion of the side surface, at least on the inner surface of the side and the first holding portion of the second rigid portion, the step of applying a photosensitive resin,
Said first rigid portion of the side surface, the side surface of the second rigid portion and said photosensitive resin remaining on at least the inner surface of the first holding portion, the photosensitive resin to at least a side of the flexible portion so as not to substantially remain, the photosensitive resin by exposure and development, and removing the photosensitive resin adhering the step of applying the photosensitive resin on a side surface of the flexible portion,
Comprising
A method of manufacturing a component mounting board. The first holding part is arranged in a frame shape.
The manufacturing method of the component mounting board | substrate as described in any one of Claim 1- Claim 8. A rigid portion on which a wiring pattern is formed;
Connected to said rigid portion, a flexible portion having flexibility,
A first holding portion for holding at least the rigid part,
A first connecting portion for connecting the said rigid portion said first holding portion,
With
A side surface of the rigid portion suppresses generation of dust from the side surface resin is disposed,
At least a side of the flexible portion, the resin of the same kind as the resin has not been substantially disposed,
The rigid part contains fibers ,
It said first coupling portion does not contain the fiber,
PCB for component mounting. The resin includes the same material as the insulating resin used for insulating the wiring pattern of the rigid portion.
The component mounting board according to claim 10 . A first rigid part;
A second rigid part;
Flexible and a flexible portion for electrically coupling the said first rigid portion and the second rigid part,
A first holding portion for holding the first rigid portion and the second rigid part,
A first connecting portion connecting the first holding portion and the first rigid portion and the second rigid part,
With
Wherein the first side surface and the side surface of the second rigid part of the rigid portion, to suppress the generation of dust from the side surface resin is disposed,
At least a side of the flexible portion, the resin of the same kind as the resin has not been substantially disposed,
Said first rigid portion and the second rigid portion containing fibers,
It said first coupling portion does not contain the fiber,
PCB for component mounting. The first holding part is arranged in a frame shape.
The component mounting board according to any one of claims 10 to 12. A rigid portion on which a wiring pattern is formed;
Connected to said rigid portion, a flexible portion having flexibility,
A first holding portion for holding at least the rigid part,
A first connecting portion for connecting the said rigid portion said first holding portion,
Preparing a substrate comprising:
At a minimum, at least the inner surface of the side and the first holding portion of the rigid portion, and the step of applying a photosensitive resin,
Wherein said photosensitive resin remaining on at least the inner surface of the side and the first holding portion of the rigid portion, so that the photosensitive resin to at least a side of the flexible portion does not substantially remain, the photosensitive resin by exposing and developing, and removing the photosensitive resin adhering to the side surface of the flexible portion in the step of coating the photosensitive resin,
A step of separating the said first holding portion rigid portion,
Comprising
A manufacturing method for flex-rigid wiring boards. Before separating the first holding part and the rigid part,
Mounting a mounting component on the rigid part, further comprising:
The manufacturing method of the flex-rigid wiring board of Claim 14 . A first rigid part;
A second rigid part;
Flexible and a flexible portion for electrically coupling the said first rigid portion and the second rigid part,
A first holding portion for holding the first rigid portion and the second rigid part,
A first connecting portion connecting the first holding portion and the first rigid portion and the second rigid part,
Preparing a substrate comprising:
At least, the first rigid portion of the side surface, at least on the inner surface of the side and the first holding portion of the second rigid portion, the step of applying a photosensitive resin,
Said first rigid portion of the side surface, the side surface of the second rigid portion and said photosensitive resin remaining on at least the inner surface of the first holding portion, the photosensitive resin to at least a side of the flexible portion so as not to substantially remain, the photosensitive resin by exposure and development, and removing the photosensitive resin adhering the step of applying the photosensitive resin on a side surface of the flexible portion,
A step of separating said first holding portion, and said first rigid portion and the second rigid part,
Comprising
A manufacturing method for flex-rigid wiring boards. The first holding part is arranged in a frame shape.
The manufacturing method of the flex-rigid wiring board as described in any one of Claim 14 to 16. A rigid portion on which a wiring pattern is formed;
Connected to said rigid portion, a flexible portion having flexibility,
With
A side surface of the rigid portion suppresses generation of dust from the side surface resin is disposed,
The resin that suppresses dust generation from the side surface includes a first resin made of an organic material not containing fibers , and a second resin obtained by exposing and developing a photosensitive resin,
At least a side of the flexible portion, the second resin of the same kind as the resin is not substantially disposed,
Flex rigid wiring board. The resin includes the same material as the insulating resin used for insulating the wiring pattern of the rigid portion.
The flex-rigid wiring board according to claim 18 . A first rigid part;
A second rigid part;
Flexible and a flexible portion for electrically coupling the first rigid portion and the second rigid part,
With
Wherein the first side surface and the side surface of the second rigid part of the rigid portion, to suppress the generation of dust from the side surface resin is disposed,
Dust suppressing resin from the side, it viewed contains a first resin made of an organic material not containing fibers and a second resin obtained a photosensitive resin is exposed and developed,
At least a side of the flexible portion, the second resin of the same kind as the resin is not substantially disposed,
Flex rigid wiring board.

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