JP5166167B2 - Electronic component mounting device - Google Patents

Description

  According to the present invention, a pair of beams movable in one opposite direction by a one-way driving source is provided with a mounting head that can be moved by another direction driving source in another direction orthogonal to the one direction, and the suction nozzle of the mounting head The present invention relates to an electronic component mounting apparatus that adsorbs electronic components from a component supply device and mounts them on a printed board.

This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. Each mounting head takes out an electronic component from the corresponding component supply device and mounts the electronic component sucked and held by the suction nozzle on the printed circuit board. In particular, each mounting head has a component supply device on one side. When the electronic components are taken out from the other side of the component supply device, or when the suction nozzles of both mounting heads simultaneously take out from one component supply device, the two mounting heads interfere with each other. There is a danger of collision. Further, when electronic components are mounted on a printed circuit board, there is a similar danger if the suction nozzles of both mounting heads perform mounting operations simultaneously.
JP 2005-159209 A

  However, if the collision occurs, the mounting head or the like is damaged, and it is necessary to prevent the collision as much as possible.

  Accordingly, an object of the present invention is to prevent the mounting heads from colliding as much as possible.

For this reason, the first aspect of the invention provides a pair of beams movable in one opposite direction by a one-way drive source, each having a mounting head movable in the other direction orthogonal to the one direction by the other-direction drive source. In an electronic component mounting apparatus that picks up an electronic component from a component supply device by a head suction nozzle and mounts the electronic component on a printed circuit board, it detects that the other mounting head has approached multiple locations outside at least one of the mounting heads. A plurality of detection sensors, and when at least one of the plurality of detection sensors detects that the other mounting head is approaching, control is performed to stop the driving of the one-way drive source and the other-direction drive source. It is characterized by providing a control means .

According to a second aspect of the present invention, a pair of beams movable in one opposite direction by a one-way driving source are provided with a mounting head movable by another direction driving source in each other direction orthogonal to the one direction. In the electronic component mounting apparatus that sucks an electronic component from a component supply device by a suction nozzle and mounts the electronic component on a printed circuit board, a plurality of detecting that the other mounting head is approaching a plurality of positions outside at least one of the mounting heads. When at least one of the plurality of detection sensors detects that the other mounting head is approaching, the safety circuit shuts off the power to the one-way drive source and the other-direction drive source. Control means for controlling is provided.
According to a third invention, in the first or second invention, the plurality of detection sensors are provided on a surface and a side surface of each of the mounting heads facing each other in the beam moving direction.

The fourth invention is, in the first to third invention, the respectively plurality of detection sensors on opposite surfaces of the mounting head provided, wherein the two mounting heads when both the mounting heads are opposed with a perfectly matched condition at least one of the plurality of detecting sensors provided in is characterized in that it is disposed to be shifted positions so as not to face.

  The present invention can prevent the mounting heads from colliding with each other as much as possible, and can prevent the mounting heads from being damaged.

  Hereinafter, an embodiment of an electronic component mounting apparatus 1 for mounting electronic components on a printed circuit board P will be described with reference to FIG. The electronic component mounting apparatus 1 includes a transport device 2 that transports the printed circuit board P, a component supply device 3 that supplies electronic components, and a pair of beams 4A and 4B that can be moved in one direction (Y direction) by a drive source. A mounting head unit that includes a plurality of suction nozzles 5 and that can be moved by each drive source in a direction along each of the beams 4A and 4B, that is, in a direction orthogonal to the one direction, is provided.

  The transport device 2 is disposed at an intermediate portion of the electronic component mounting device 1 and mounts a substrate supply unit that inherits the printed circuit board P from the upstream device and an electronic component that is sucked and held by the suction nozzle 5 of each mounting head 6. In order to do so, the printed circuit board P is supplied with a printed circuit board P. The printed circuit board P is positioned and fixed, and the printed circuit board P on which the electronic component is mounted is transferred to the downstream device. Is done.

  The component supply device 3 is disposed on both the front side and the rear side of the transport device 2, and is provided with a feeder base 3A that is attached to the device main body of the electronic component mounting device 1, and a plurality of components on the feeder base 3A. And a component supply unit 3B group (component supply device) that supplies various electronic components one by one to the component take-out position (component suction position). The component supply unit 3 intermittently sends the electronic components stored in the component storage portion formed on the carrier tape to the component extraction position while peeling the cover tape from the carrier tape of the storage tape. It is something to offer.

  The pair of front and rear beams 4A and 4B which are long in the X direction (printed circuit board transport direction) are fixed to the beams 4A and 4B along a pair of left and right front and rear guides driven by the Y direction linear motor 9. Slide and individually move in the Y direction. The Y-direction linear motor 9 is composed of a pair of stators fixed along a pair of left and right bases 1A and 1B, and a mover 9A fixed to mounting plates provided at both ends of the beams 4A and 4B. Is done.

  The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X direction linear motor 15, and the X direction linear motor 15 A pair of stators fixed to the beams 4A and 4B, and a mover 15A provided between the stators and provided in the mounting head unit.

  Therefore, each mounting head unit is provided inside each beam 4A, 4B so as to face each other, and moves above the component pick-up position of the printed circuit board P and the component supply unit 3B on the positioning unit of the transport device 2.

  Each mounting head 6 in each mounting head unit is provided with twelve suction nozzles 5 biased downward by respective springs at predetermined intervals along the circumference. It is also possible to simultaneously take out electronic components from a plurality of component supply units 3B arranged in parallel by the suction nozzle 5 located at the 3 o'clock and 9 o'clock positions of the head 6. The suction nozzle 5 can be moved up and down by a vertical axis motor 28, and the mounting head 6 is rotated around a vertical axis by a rotation mechanism 52 including a θ-axis motor 29, and as a result, each suction nozzle 5 of each mounting head 6. Can move in the X and Y directions, can rotate about a vertical line, and can move up and down.

  Further, two component recognition cameras 10 are arranged on the front and rear of the apparatus main body, and when the mounting head 6 moves and the position where the component should be recognized matches the position of the mounting head 6, the component recognition camera 10 is exposed. Then, while the suction nozzle 5 holding the electronic component moves, the component recognition camera 10 images the electronic component and performs fly recognition.

  Although the mover 9A of the Y-direction linear motor 9 is integrated, when divided into the inner mover 9B and the outer mover 9C, the inner mover 9B is shorter than the outer mover 9C. This is because when two mounting heads 6 take out an electronic component sent from the same component supply apparatus 3 to the take-out position TL, or when two mounting heads 6 overlap the printed circuit board P in the Y direction. This is to prevent the mover 9A from serving as a stopper when mounting components. Conversely, since the mover 9A does not act as a stopper, there is a risk that the two mounting heads 6 collide. When a collision occurs, the mounting head 6 and the nozzle drive mechanism in the mounting head 6 are prevented from being damaged.

  Then, a slider fixed to the head base 13 to which the mounting head 6 is attached slides along a guide rail (not shown) fixed to each of the beams 4A and 4B, and the longitudinal direction of the beams 4A and 4B. The mounting head 6 moves along (X direction). As shown in FIG. 2, the upper portion of the mounting head 6 and the rotation mechanism 52 are covered with a head cover 12, and a bumper 11 is provided outside the head cover 12. That is, the head cover 12 is merely a cover, and has no effect of protecting the mounting head 6 and the like against external impacts. The bumper 11 is attached to the outside of the head cover 12 to cover the two mounting heads 6. The mounting head 6 and the like are protected in the event of a collision.

  Therefore, the bumper 11 needs to have a certain degree of strength and needs to be lightweight so as not to hinder high-speed movement. For example, the bumper 11 is made of aluminum. Moreover, the bumpers 11 attached to both mounting heads 6 are of the same type, and the bumpers 11 are attached to the mounting heads 6 so that the vertical positions thereof are substantially the same.

  Further, a plurality of detection sensors 18 for detecting that the other bumper 11 has approached at least one of the two bumpers 11 are provided. In this embodiment, the two bumpers 11 are provided. The configuration of each mounting head unit is the same including the bumper 11 including the detection sensor 18. The detection sensor 18 is an optical sensor including a light emitting element and a light receiving element, but may be another sensor such as a capacitive proximity sensor, an ultrasonic sensor, a laser sensor, or the like.

  Then, as shown in FIG. 4, a total of four detection sensors 18, two each, are attached to both corners (far from the beams 4 </ b> A and 4 </ b> B) of the bumper 11 having a U-shape in plan view. As shown in FIG. 6, there is no problem when both bumpers 11 face each other in a state where they do not completely match, but as can be understood from FIG. 4, when they face each other so that the positions in the X direction completely match each other. In addition, since the detection sensor 18A attached to one bumper 11 and the detection sensor 18B attached to the other bumper 11 cannot be detected when they face each other, even if both bumpers 11 face each other in a completely matched state, When the detection sensor 18A attached to the bumper 11 is arranged so as to be slightly shifted so as not to face the detection sensor 18B attached to the other bumper 11, and both the bumpers 11 face each other in a completely matched state. Also be able to detect.

  More specifically, when the bumper 11 is completely matched, if the detection sensor 18A attached to one bumper 11 and the detection sensor 18B attached to the other bumper 11 are mounted so as not to face each other, The flat portion is mirror-finished as much as possible so that the light is not irregularly reflected, and the light from the detection sensor 18 is reflected by the surface of the bumper 11 and received by the light receiving element. That is, when the detection sensors face each other so as to completely match as described above, light from each detection sensor is diffusely reflected by the opposing detection sensors, and the bumpers 11 approach each other within a predetermined distance range. This is because it cannot be detected.

  The detection sensors 18C and 18D are respectively attached to both corners of the bumper 11 having a U-shape in plan view at the same distance from each corner, but in a state where the bumpers 11 overlap in the Y direction. This is to detect that both bumpers 11 are within a certain distance range.

  Next, a description will be given based on the control block diagram of FIG. First, 20 is a CPU as a control unit that performs overall control of operations related to electronic component mounting of the electronic component mounting apparatus, 21 is a RAM (Random Access Memory) as a storage device, and 22 is a ROM (Read Only).・ Memory).

  The RAM 21 has mounting data for each type of printed circuit board P such as X direction, Y direction and angle information in the printed circuit board P, and arrangement number information of each component supply unit 3B for each mounting order (for each step number). In addition, the type of each electronic component (component ID) and the type of each suction nozzle 5 (component arrangement data) corresponding to the arrangement number of each component supply unit 3B are stored. Furthermore, component library data composed of items representing the characteristics of the electronic component for each component ID is also stored.

  The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus according to the program stored in the ROM 22 based on the data stored in the RAM 21. That is, the CPU 20 receives the Y-direction linear motor 9, the X-direction linear motor 15, the vertical axis motor 28, and the θ-axis motor 29 via the motion controller 25 and the drive circuits 26A, 26B, 26C, and 26D connected via the interface 23. Control the drive.

  The monitor 24 as a display device is provided with various touch panel switches 27 as input means for data setting, and various settings can be performed by an operator operating the touch panel switch 27. The setting data is stored in the RAM 21. Stored in

  A recognition processing device 30 is connected to the CPU 200 via the interface 23. The recognition processing device 30 performs recognition processing of an image captured by the component recognition camera 10, and the processing result is sent to the CPU 20. Is sent out. That is, the CPU 20 outputs an instruction to the recognition processing device 30 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the component recognition camera 10 and receives a recognition processing result from the recognition processing device 30. It is.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 30, the result is sent to the CPU 20, and the CPU 20 corrects and moves the Y-direction linear motor 9, the X-direction linear motor 15, and the θ-axis motor 29. Thus, the electronic component is controlled to be mounted on the printed circuit board P.

  The plurality of detection sensors 18 are connected to the motion controller 25 and the safety circuit 33 via the OR circuit 32. A relay 34 is built in the safety circuit 33. When one of the detection sensors 18 outputs a detection signal, it is input to the safety circuit 33 via the OR circuit 32, and the safety circuit 33 immediately receives the relay 34. Is excited to open the switches 34A and 34B, and the power supply from the power supply circuit 36 to the drive circuits 26C and 26D is cut off.

  With the above configuration, the mounting operation will be described below. First, when the printed circuit board P is inherited from an upstream device (not shown) and exists on the substrate supply unit of the transport device 2, the printed circuit board P on the substrate supply unit is moved to the substrate positioning unit, and this print The substrate P is positioned and fixed.

  When the printed circuit board P is positioned, the slider 4 slides in the Y direction along the guide that the back beam 4A extends forward and backward by the drive of the Y direction linear motor 9, and moves in the Y direction. 15, the mounting head 6 moves in the X direction, moves to above the component extraction position of the corresponding component supply unit 3 </ b> B, lowers the suction nozzle 5 by driving the vertical axis motor 28, and takes out the electronic component from the component supply unit 3 </ b> B. .

  In this case, by lowering the other suction nozzles 5 of the mounting head 6 on the back side, the plurality of suction nozzles 5 can take out electronic components from the component supply unit 3B one after another. Further, as shown in FIG. 5, from the front-side component supply device 3, not only the front-side mounting head 6 but also the suction nozzle 5 of the rear-side mounting head 6 can simultaneously take out electronic components. In this way, not only when both the bumpers 11 are close to the predetermined distance range, but particularly when the suction nozzles 5 of the both mounting heads 6 simultaneously perform the take-out operation from the one component supply device 3, Although there is a risk of collision due to the mounting heads 6 interfering with each other, the bumpers 11 are attached to the head covers 12 covering the respective mounting heads 6, and each of the bumpers 11 is provided with a detection sensor 18. The collision of the head 6 is avoided as much as possible, and even if it collides, the impact can be greatly reduced.

  That is, at least one of the detection sensors 18 provided on both bumpers 11 detects that the other bumper 11 has come close to a predetermined distance next to one bumper 11 in the left-right direction, and a detection signal is detected. Is output to the safety circuit 33 via the OR circuit 32, and the relay 34 incorporated in the safety circuit 33 is immediately energized to open the switches 34A and 34B, and from the power supply circuit 36 to the drive circuits 26C and 26D. Is turned off. The detection signal is also input to the motion controller 25 via the OR circuit 32. The motion controller 25 outputs a stop signal to the drive circuits 26A, 26B, 26C, and 26D to output the Y-direction linear motor 9 and the X-direction linear. Since the drive of the motor 15, the vertical axis motor 28, and the θ axis motor 29 is stopped, and the motion controller 25 outputs an abnormal signal to the CPU 20, the CPU 20 controls to stop all the devices of the electronic component mounting device. At the same time, the monitor 24 displays a notice of the abnormality, or other visual or audible notification means notifies the abnormality.

  After the removal, the suction nozzles 5 of both mounting heads 6 are raised so that the mounting heads 6 of both beams 4A and 4B pass over the respective component recognition cameras 10, and the suction of both mounting heads 6 is performed during this movement. A plurality of electronic components sucked and held by the nozzle 5 can be picked up at once, and the picked-up image can be recognized by the recognition processing device, and the positional deviation with respect to the sucking nozzle 5 can be grasped (fly recognition).

  Thereafter, the mounting coordinates of the electronic component of the mounting data are corrected based on the position recognition result of each electronic component, and the electronic component is mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation. That is, based on the recognition processing result of the recognition processing device 30, the CPU 20 controls the Y-direction linear motor 9 corresponding to each beam 4A, 4B and the X-direction linear motor 15 related to the mounting head 6 in the X and Y directions. As a result, the θ-axis motor 29 is controlled for the mounting angle, and as a result, each suction nozzle 5 of each mounting head 6 is corrected in the X and Y directions and the mounting angle. An electronic component is mounted on the printed circuit board P. When all the electronic components are mounted on the printed board P in this way, the printed board P is transferred from the board positioning unit to the downstream device via the board discharging unit.

  As shown in FIG. 7, when the suction nozzles 5 of the both mounting heads 6 simultaneously perform the electronic component mounting operation on the printed circuit board P, the both mounting heads 6 particularly overlap the printed circuit board P in the Y direction. Even when an electronic component is mounted, the mounting heads 6 can be prevented from colliding as described above. That is, it is possible to reliably detect that the other bumper 11 is close to a predetermined distance next to the one bumper 11 in the left-right direction.

  Next, a large number of detection sensors 18 may be provided in each bumper 11, and various arrangements may be considered. That is, as shown in FIG. 8 showing another embodiment, for example, three are provided for each surface. Specifically, in addition to the detection sensors 18A and 18B provided on the facing surface 11A of the bumper 11 of the first embodiment, a detection sensor 18E is provided at a position that is not the center in the left-right direction, and the left side surface 11B of the bumper 11 is provided. 18F and 18G are provided in addition to the provided detection sensor 18C, and 18H and 18I are provided in addition to the detection sensor 18D provided on the right side surface 11C of the bumper 11. In this case, the distance between the detection sensors 18C and 18F is not the same as the distance between 18F and 18G, and similarly, the distance between the detection sensors 18D and 18H is the same as the distance between 18H and 18I. is not.

  Therefore, not only when both the bumpers 11 are close to each other within a predetermined distance range, but also when the two bumpers 11 face each other so as to completely coincide with each other, the detection sensor 18 securely attached to one bumper 11 is the other. It can be detected that the bumper 11 is approaching (see FIG. 8). Even when both mounting heads 6 overlap in the Y direction, for example, when both mounting heads 6 simultaneously take out electronic components from the same component supply device 3, both mounting heads 6 simultaneously mount electronic components on the printed circuit board P. In some cases (see FIG. 9), it is possible to reliably detect that the other bumper 11 is close to a predetermined distance next to the one bumper 11 in the left-right direction.

  In this case, even when the detection sensors 18A and 18B of one mounting head unit and the detection sensors 18B and 18A of the other mounting head unit face each other, at least the detection sensors 18E and 18E of both mounting head units are completely displaced. Even if the detection sensors 18C and 18G of one mounting head unit and the detection sensors 18G and 18C of the other mounting head unit face each other, at least the detection sensors 18F and 18F of both mounting head units Is completely displaced (see FIG. 9). Therefore, it is possible to reliably detect that one bumper 11 approaches the other bumper 11 within a predetermined distance.

  The detection sensor 18 is an optical sensor including a light emitting element and a light receiving element, but may be another sensor such as a capacitive proximity sensor, an ultrasonic sensor, a laser sensor, or the like.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic plan view of an electronic component mounting apparatus. It is an external view of a mounting head. It is a control block diagram. It is a schematic plan view when both bumpers face each other in a completely matched state. It is a schematic plan view which shows the state from which both mounting heads are taking out the electronic component simultaneously from the same component supply apparatus. It is a schematic plan view when both bumpers face each other in a state where they do not completely match. It is a schematic plan view showing a state where both mounting heads are simultaneously mounting electronic components on a printed circuit board. It is a schematic plan view when both bumpers in other embodiments face each other in a completely matched state. It is a schematic plan view which shows the state in which both the mounting heads in other embodiment have mounted | worn the electronic component on the printed circuit board simultaneously.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 3B Component supply unit 4A, 4B Beam 5 Adsorption nozzle 6 Mounting head 12 Head cover 11 Bumper 18 Detection sensor 32 OR circuit 33 Safety circuit 34 Relay 34A Switch 36 Power supply circuit

Claims (4)

A pair of beams movable in one opposite direction by a one-way driving source are provided with mounting heads movable in other directions orthogonal to the one direction by other-direction driving sources, respectively, and a component supply device is provided by a suction nozzle of the mounting head In the electronic component mounting apparatus for attracting electronic components and mounting them on a printed circuit board, a plurality of detection sensors for detecting that the other mounting head has approached a plurality of positions outside at least one of the mounting heads are provided. When at least one of the plurality of detection sensors detects that the other mounting head is approaching, control means is provided for controlling to stop driving the one-way drive source and the other-direction drive source. An electronic component mounting device. A pair of beams movable in one opposite direction by a one-way driving source are provided with mounting heads movable in other directions orthogonal to the one direction by other-direction driving sources, respectively, and a component supply device is provided by a suction nozzle of the mounting head In the electronic component mounting apparatus for attracting electronic components and mounting them on a printed circuit board, a plurality of detection sensors for detecting that the other mounting head has approached a plurality of positions outside at least one of the mounting heads are provided. When at least one of the plurality of detection sensors detects that the other mounting head is approaching, a safety circuit is provided for controlling the safety circuit to cut off the power to the one-way drive source and the other-direction drive source. An electronic component mounting apparatus characterized by that. 3. The electronic component mounting apparatus according to claim 1, wherein the plurality of detection sensors are provided on a surface and a side surface of each mounting head that face each other in a moving direction of the beam. Wherein the respectively provided a plurality of detection sensors on opposite surfaces of the mounting head, at least one face of the plurality of detecting sensors provided the both mounting head when both the mounting heads are opposed with a perfectly matched condition The electronic component mounting apparatus according to any one of claims 1 to 3, wherein the electronic component mounting apparatus is disposed so that the position is shifted so as not to occur.

Images