JP5177906B2 - Heat sink mechanism for electrical equipment - Google Patents

Description

  The present invention relates to a heat sink mechanism of an electric device.

  The mounting of the board is currently high density, and the electrical equipment is downsized. And in a highly functional electric apparatus, the emitted-heat amount of an electrical component (electronic component) increases, and the thermal radiation by a heat sink is needed. For fixing the heat sink, a method of sticking the electrical component with an adhesive, a method of fixing the heat sink to the board on which the electrical component is mounted with a screw, a method of hooking the heat sink on the electric device body, or a method of electric A method has been proposed in which a heat sink is sandwiched between a board on which components are mounted and an electric device body. However, there is a concern about peeling with adhesive. Fixing with screws may reduce the mounting range of the board. Furthermore, the above method may cause a load on the board due to the influence of the dimensional tolerance of the component, warpage, and reaction force of the component.

  For this reason, it was considered that the heat sink was attached to the substrate side while being biased by a coil spring (see FIG. 4). In FIG. 4, reference numeral 21 denotes a case body of the electric device. Reference numeral 22 denotes a substrate that is internally (fixed) in the case main body 21. Reference numeral 23 denotes an electrical component (electronic component) mounted on the substrate 22. Reference numerals 24 a and 24 b denote cylinders provided in the case main body 21. Reference numeral 25 denotes a heat sink. Reference numeral 26 denotes a heat sink substrate. Reference numeral 27 denotes a heat radiating plate of the heat sink 25. Reference numerals 28a and 28b denote shafts provided on the substrate 26 of the heat sink. The shafts 28a and 28b are provided corresponding to the cylinders 24a and 24b, and the shafts 28a and 28b are inserted into the cylinders 24a and 24b. 29a and 29b are coil springs. The coil springs 29a and 29b are disposed around the cylinders 24a and 24b. One end sides of the coil springs 29 a and 29 b are hooked to the cylinders 24 a and 24 b, and the other end side is hooked to the heat sink substrate 26. The heat sink 25 is pressed and urged toward the electric component (electronic component) 23 side by the force of the coil springs 29a and 29b. Reference numeral 30 denotes a heat transfer plate provided between the heat sink 25 and the electrical component (electronic component) 23.

Utility model registration No. 3153773 JP 2004-103675 A JP 2004-193387 A JP 2007-188998 A Special Table 2002-200827

Now, the heat sink mounting mechanism of FIG. 4 has the following problems.
For mounting the heat sink, a plurality (at least two) of shafts 28a and 28b and cylinders 24a and 24b are required for one of the substrates 22 on which the electrical component (electronic component) 23 is mounted. Since at least two shafts 28a and 28b are required, the heat sink 25 becomes large. Further, since the two shafts 28a and 28b are required, two cylindrical bodies 24a and 24b are required, so that a large space is required and the size becomes large. In the case where there are no two shafts 28a, 28b and two cylinders 24a, 24b, that is, when the shaft and the cylinder are combined, the heat sink rotates around the shaft (cylinder). Get up. Therefore, a plurality of shafts and cylinders are necessary. Since the two shafts 28a and 28b are provided, the number of components mounted on the board 22 is reduced, and it is difficult to mount the components at high density. In addition, the number of parts increases and the cost increases accordingly. In addition, parts management becomes troublesome.

  Therefore, the problem to be solved by the present invention is to solve the above problems. In particular, it is to provide a heat sink mounting mechanism with a small number of parts. An object of the present invention is to provide a heat sink mounting mechanism capable of high-density mounting of electrical components (electronic components). It is to provide a heat sink mounting mechanism that can be easily managed at a low cost.

The above issues are
A heat sink mechanism of an electric device comprising an electric component and a heat sink device arranged corresponding to the electric component,
The main body of the electric device comprises a cylindrical body,
The cylindrical body has a concave portion or a convex portion,
The heat sink device includes a single insertion portion to be inserted into the cylindrical body, and a heat radiating plate,
The insertion portion includes a convex portion or a concave portion that fits into the concave portion or the convex portion,
The heat sink device is configured not to rotate by the fitting,
One end is hooked on the electric device main body side, and the other end is hooked on the heat sink device side, and an urging member for urging the heat sink device toward the electric component side is provided. Solved by the heat sink mechanism of the equipment.

Moreover, a heat sink mechanism of an electrical device comprising an electrical component and a heat sink device arranged corresponding to the electrical component,
The heat sink device includes one cylindrical body and a heat sink,
The cylindrical body has a concave portion or a convex portion,
The main body of the electric device includes an insertion portion into which the cylindrical body is inserted,
The insertion portion includes a convex portion or a concave portion into which the concave portion or the convex portion is fitted,
The heat sink device is configured not to rotate by the fitting,
One end is hooked on the electric device main body side, and the other end is hooked on the heat sink device side, and an urging member for urging the heat sink device toward the electric component side is provided. Solved by the heat sink mechanism of the equipment.

  A heat sink mounting mechanism is configured with a small number of parts. High-density mounting of electrical components (electronic components) becomes possible. Since the number of parts is small, parts management is easy. In addition, the cost is low.

Sectional drawing of the principal part of the heat sink mechanism of the electric equipment which becomes 1st Embodiment The exploded state figure of the heat sink mechanism of the electric equipment which becomes a 1st embodiment The principal part perspective view of the heat sink mechanism of the electric equipment which becomes other embodiment. Cross section of the main part of the heat sink mechanism of electrical equipment

  The present invention is a heat sink mechanism of an electric device. In particular, it is a heat sink mechanism of an electrical device including an electrical component (the electrical component includes an electronic component) and a heat sink device arranged corresponding to the electrical component. The main body of the electric device has a cylindrical body. For example, it comprises a cylinder attached to the case body of an electrical device. This cylindrical body has a concave portion (or convex portion). The heat sink device includes an insertion portion (for example, a shaft or a cylinder) inserted into the cylinder (for example, inserted inside and / or outside of the cylinder). For example, an insertion portion (for example, a shaft or a cylinder) attached to a heat sink is provided. This insertion part comprises a convex part (or concave part) fitted in the concave part (or convex part). Even if the heat sink device is attached by one cylindrical body (insertion portion) due to the fitting between the concave portion and the convex portion, the heat sink device does not rotate (is fixed). Furthermore, an urging member is provided that has one end hooked to the electric device main body side and the other end hooked to the heat sink device side to urge the heat sink device to the electric component side. Examples of the urging member include a coil spring and a leaf spring. Of course, it is not limited to this. In the above, the cylindrical body is attached to the main body side of the electric device and the insertion portion is attached to the heat sink device side, but the cylindrical body is on the heat sink device side and the insertion portion is the main body of the electric device. It may be attached to the side.

  This will be described in more detail below.

  FIGS. 1 and 2 show a first embodiment of a heat sink mechanism according to the present invention. FIG. 1 is a cross-sectional view of a main part of an electric device including the heat sink mechanism after assembly, and FIG. 2 is an exploded view.

  In each figure, 1 is the case main body of an electric equipment. Reference numeral 2 denotes a substrate that is internally (fixed) to the case body 1. Reference numeral 3 denotes an electrical component (electronic component) mounted on the substrate 2. Reference numeral 4 denotes a cylinder provided in the case main body 1. Reference numeral 5 denotes a ridge provided on the outer wall of the cylinder 4 in the vertical direction. 6 is a recessed part (groove part: slit: notch part) formed in the cylindrical body 4.

  Reference numeral 7 denotes a heat sink device. Reference numeral 8 denotes a substrate of the heat sink device 7. Reference numeral 9 denotes a heat radiating plate of the heat sink device 7. Reference numeral 10 denotes a cylinder provided on the substrate 8 of the heat sink device 7. The cylindrical body 10 is configured to be inserted into the cylindrical body 4. Reference numeral 11 denotes a ridge provided on the outer wall of the cylinder 10 in the vertical direction. And when the cylinder 10 is inserted in the inside of the cylinder 4, the protruding item | line 11 fits into the recessed part 6, and the idle rotation of the cylinder 10 is prevented.

  Reference numeral 12 denotes a heat transfer plate provided between the heat sink device 7 and the electrical component (electronic component) 3.

  13 is a coil spring. The coil spring 13 is fitted around the cylindrical body 4. The upper end of the inserted coil spring 13 is in contact with the side wall of the ridge 5, and the vicinity of the upper end of the coil spring 13 is in contact with the lower end surface of the ridge 5, and the upper end of the coil spring 13 is cylindrical. Regulated by body 4. The lower end of the coil spring 13 is in contact with the substrate 8 of the heat sink device 7, and the lower end portion of the coil spring 13 is regulated by the substrate 8. The heat sink device 7 is biased downward by the elastic force of the coil spring 13. That is, the heat sink device 7 is pressed and urged (crimped) to the electrical component (electronic component) 3 through the heat transfer plate 12 by the action of the coil spring 13.

  When the heat sink mounting mechanism is configured as described above, the heat generated by the current flowing through the electrical component (electronic component) 3 is efficiently radiated by the heat sink device 7. Moreover, even if an external force is applied to the case body 1, the heat sink device 7, or the substrate 2, the external force is absorbed and relaxed by the coil spring 13. Even if the part has a dimensional tolerance, the dimensional tolerance is absorbed by the coil spring 13 and allowed. As a result, the electrical component (electronic component) 3 and the substrate 2 are not easily damaged (stressed). That is, when the heat sink device is fixed to the electrical component (electronic component) 3 using screws or adhesive, the external force acting on the heat sink device is immediately transmitted to the electrical component (electronic component) 3 and is easily damaged. However, such a concern is small in the above embodiment. Further, since the heat sink device is attached by one cylindrical body 4, one cylindrical body 10, and one coil spring 13, two cylindrical bodies 24a and 24b, two shafts 28a and 28b, and two coil springs. The number of parts is smaller than when 29a and 29b are used. Accordingly, since the number of attachment parts is small, the installation space can be reduced, and space saving (or reduction in size and weight) can be realized. As a result, the number of electrical components (electronic components) 3 can be increased. That is, high-density mounting is possible. Moreover, weight reduction is also realized.

  FIG. 3 is a schematic view of a main part showing a second embodiment of the heat sink mechanism according to the present invention. The present embodiment is an example in which a leaf spring 15 is used instead of the coil spring 13 in the first embodiment.

1 Electrical equipment case body 2 Substrate 3 Electrical components (electronic components)
4 cylinder 5 ridge 6 recess 7 heat sink device 8 substrate 9 heat sink 10 cylinder 11 ridge 12 heat transfer plate 13 coil spring 15 leaf spring

Claims (3)

A heat sink mechanism of an electric device comprising an electric component and a heat sink device arranged corresponding to the electric component,
The main body of the electric device comprises a cylindrical body,
The cylindrical body has a concave portion or a convex portion,
The heat sink device includes a single insertion portion to be inserted into the cylindrical body, and a heat radiating plate,
The insertion portion includes a convex portion or a concave portion that fits into the concave portion or the convex portion,
The heat sink device is configured not to rotate by the fitting,
One end is hooked on the electric device main body side, and the other end is hooked on the heat sink device side, and an urging member for urging the heat sink device toward the electric component side is provided. Equipment heat sink mechanism. A heat sink mechanism of an electric device comprising an electric component and a heat sink device arranged corresponding to the electric component,
The heat sink device includes one cylindrical body and a heat sink,
The cylindrical body has a concave portion or a convex portion,
The main body of the electric device includes an insertion portion into which the cylindrical body is inserted,
The insertion portion includes a convex portion or a concave portion into which the concave portion or the convex portion is fitted,
The heat sink device is configured not to rotate by the fitting,
One end is hooked on the electric device main body side, and the other end is hooked on the heat sink device side, and an urging member for urging the heat sink device toward the electric component side is provided. Equipment heat sink mechanism. 3. The heat sink mechanism for an electric device according to claim 1, wherein the biasing member is a spring.

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