JP5194849B2 - Component supply device and vibration separating device using the component supply device - Google Patents

Description

  The present invention relates to a component supply device that supplies a component to be separated filled in a component supply unit from a supply port provided in the component supply unit, and a vibration separation device that uses the component supply device.

  For example, when an electrode is formed on a rectangular parallelepiped chip component by barrel plating, it is common to immerse the chip component and a steel ball medium as a current-carrying medium in a plating solution. Then, after the barrel plating process, the chip component and the medium are supplied from the component supply device to the vibration separating device and separated by the vibration separating device.

Conventionally, as such a vibration separating device, a plurality of diaphragms are arranged in a stepped manner below a hopper (part supply unit) filled with chip parts and media, and are raised below the diaphragm. There is a type in which a vibration feeder that applies vibration in a direction is disposed so as to be separated into a chip component that goes up the slope of each diaphragm and a medium that rolls down the slope (see, for example, Patent Document 1).
Registered Utility Model No. 3030464

  By the way, in order to adjust the amount of parts supplied from the hopper, it is conceivable to change the opening area of the supply port. However, there is a problem that the parts to be separated are easily clogged simply by changing the opening area, and stable continuous supply cannot be performed. In particular, clogging is likely to occur when the opening area is reduced in order to reduce the supply amount of parts to be separated, and an improvement in this respect is demanded.

  The present invention has been made in view of the above-described conventional situation, and provides a component supply device capable of preventing clogging of components to be separated and performing stable continuous supply, and a vibration separation device using the supply device. It is an issue.

The invention of claim 1 is a component supply device for supplying a rectangular parallelepiped separated component and a spherical separated component filled in a component supply unit from a supply port provided in the component supply unit, wherein the supply the mouth opening width is increased as it goes upward, each disposed a dam portion having a plurality of openings which are separately formed so that the opening width as the lower side is smaller, the partition plate to the weir portion, which is the divided sliding contact with the edge of the opening, and is characterized in that a vertically movable disposed so as to vary the area of the respective opening.

  The invention of claim 2 is characterized in that, in claim 1, the opening of the weir portion is formed continuously over substantially the entire width of the supply port.

  According to a third aspect of the present invention, in the first or second aspect, the component supply unit is provided with a vibration mechanism that feeds the component to be separated from the opening of the weir unit by applying vibration to the component to be separated. It is characterized by having.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the component supply unit includes a vibration supply unit including a vibration drive unit and a pool unit mounted on the vibration drive unit. On the other hand, a plurality of vibration drive units are provided.

A fifth aspect of the present invention, there is provided a vibration isolation apparatus using the component supply device according to any one of claims 1 to 4, in the component feed unit, so as to form a predetermined angle below the component supply section And a vibration separating body for separating and discharging the part to be separated supplied from the supply port of the part supply unit into a part to be separated that goes up the slope and a part to be separated that goes down the slope. It is characterized by being.

  Here, the part to be separated that goes up the slope and the part to be separated that come down means that they are separated by different sizes, shapes, weights, and the like.

  According to the first aspect of the present invention, the supply port of the component supply unit is provided with the dam part having an opening whose opening width decreases from the upper side to the lower side, and the partition plate for changing the opening area of the dam part. Therefore, clogging when adjusting the supply amount of the parts to be separated can be prevented, and stable continuous supply becomes possible. That is, when the supply amount is reduced, the height can be secured with respect to the opening area, so that the part can be easily discharged, and the part can be prevented from clogging at the opening.

  In the invention of claim 2, since the opening of the weir portion is continuously formed over substantially the entire width of the supply port, the increase and decrease of the supply amount can be adjusted with high accuracy.

  According to the third aspect of the present invention, since the parts to be separated are sent out from the supply port while applying vibration, clogging of the parts can be prevented more reliably and stable continuous supply can be achieved.

  In the invention of claim 4, since the plurality of vibration driving portions are arranged for one pool portion, the parts to be separated can be supplied stably and uniformly.

  According to the vibration separating device of the fifth aspect of the invention, since the vibration separating body is disposed below the component supply portion so as to be inclined at a predetermined angle, the vibration separation body is supplied from the component supply portion. The separation part can be reliably separated into the part to be separated that goes up the slope and the part that goes down the slope and discharged.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  1 to 4 are diagrams for explaining a component supply device according to an embodiment (first embodiment) of the present invention and a vibration separation device including the component supply device, and FIG. 2, 3 and 4 are a cross-sectional view, a front view and a plan view of a component supply unit of the vibration separating device.

  In the drawing, reference numeral 1 denotes a vibration separating device for separating a rectangular parallelepiped chip part C and a steel ball medium M, which is equipped with a vibration generating source 3 on a gantry 2, and The vibration generating body 3 has a schematic structure in which the vibration separating body 4 is disposed so that the inclination angle is about 6.5 to 9 degrees, and the component supplying device 5 is disposed above the vibration separating body 4. .

  A balance adjusting weight 3a is connected to the vibration generating source 3, and is configured to apply an upward vibration to the vibration separating main body 4 by a leaf spring (not shown), a piezoelectric element, a cam type horizontal vibration or the like. ing.

  Component recovery portions 6 and 7 are disposed below the up-side end portion and the down-side end portion of the vibration isolation body 4, respectively. The ascending-side component collection unit 6 is provided with a chute 8 disposed below the upper end of the vibration separating body 4 and a mesh 9a disposed below the chute 8 and allowing only the chip component C to pass therethrough. And a work tray 10 disposed below the foreign matter separating part 9. The foreign matter separating portion 9 is provided with a vibrator (not shown) for removing the chip component C.

  The descending part collecting unit 7 is fixed so as to surround the lower end of the vibration separating body 4, and has a box-like foreign substance separating part 11 provided with a mesh 11 a that allows only the chip part C to pass therethrough, and the foreign substance separating part 11. A chip component collection tray 14 disposed below, a collection duct 12 for collecting the media M discharged from the foreign matter separation unit 11, and a media collection tray 13. Vibration of the vibration separating body 4 is transmitted to the foreign matter separating portion 11, whereby the foreign matter separating portion 11 sends the medium M discharged onto the mesh 11 a to the collecting duct 12 and the chip component C into the collecting tray 14. Sift out.

  The component supply device 5 includes a hopper (component supply unit) 15 into which the chip component C and the medium M are loaded, and a vibration supply unit 16 disposed below the hopper 15. The vibration supply unit 16 has a structure in which a box-shaped pool part 16b filled with a large number of chip parts C and media M is mounted on the vibration drive part 16a, and a supply port 16c is formed on the downward side of the pool part 16b. Has been. The chip part C and the medium M are sent out from the supply port 16c by applying vibration to the pool part 16b through the vibration drive part 16a.

  The supply port 16c is formed with a weir portion 16e having an inverted triangular shape 16d having a larger opening width at the upper side and a smaller opening width at the lower side, and the opening 16d extends over the entire width of the supply port 16c. Are formed continuously. A partition plate 17 that changes the opening area of each opening 16d is disposed in the dam portion 16e so as to be movable up and down. The partition plate 17 is driven up and down to variably control the feed amount of the chip part C and the medium M.

  Here, as the shape of the dam portion 16e, as shown in FIGS. 5 and 6, for example, a sin curve shape (see FIG. 5A), a semicircular shape (see FIG. 5B), a triangular shape, and the like. May be a combination pattern (see FIG. 5 (c)) formed alternately with a sin curve shape, or a sawtooth shape (see FIG. 6 (a)) or a trapezoidal shape (see FIG. 6 (b)). But you can.

  The vibration isolation body 4 has a generally bowl-like shape in which left and right side wall portions 4b and 4b are formed on a rectangular plate-shaped vibration isolation body 4a. The vibration separating body 4 is provided with an uppermost vibration separating plate 20 extending substantially parallel to the vibration separating portion 4a. The uppermost vibration separating plate 20 is fixed between the left and right side wall portions 4b. Yes.

  The uppermost vibration separating plate 20 is disposed in the vicinity of the lower portion of the supply port 16c of the component supplying device 5. Above the vibration separating plate 20, the chip component C and the medium M supplied from the component supplying device 5 are provided. A reflective sensor 21 is provided for detecting the supply amount. The sensor 21 detects a component supply amount, and the partition plate 17 is driven up and down so that the supply amount becomes a set amount, thereby preventing an excessive supply or an excessive supply.

  In the supply port 16c of the component supply device 5, a sieving portion 25 that allows only the chip component C to pass is disposed so as to extend in the downward direction. The sieving portion 25 is constituted by a mesh formed by incorporating wire rods in a lattice shape. As a result, most of the chip parts C fall directly from the screening part 25, and the medium M having a size larger than the chip parts C rolls down the slope of the screening part 25. That is, the chip component C is first input to the uppermost vibration separating plate 20, and then the medium M is input downstream from the chip component C.

  Here, when the size of the chip component is larger than the medium, the screening unit 25 is arranged so as to extend in the upward direction from the component supply device 5 as shown in FIG. By arranging in this way, the medium M ′ is input first, and then the chip component C ′ is input upstream from the medium M ′.

  An upstream intermediate vibration separating plate 22 is disposed on the upstream side of the uppermost vibration separating plate 20 of the vibration separating main body 4, and downstream intermediate vibration separating plates 23 and 24 are disposed on the downstream side so as to be stepped. . Each of the intermediate vibration separating plates 22 to 24 is fixed between the left and right side wall portions 4b. The uppermost vibration separating plate 20 and each of the intermediate vibration separating plates 22 to 24 together with the vibration separating main body 4 are arranged in the upward direction. Vibration is applied.

  The inclination angle of the intermediate vibration separating plate 22 on the upstream side is set larger than the inclination angle of the intermediate vibration separating plates 23 and 24 on the downstream side. Further, the inclination angle of the upper intermediate vibration separating plate 23 on the lower side is larger than the inclination angle of the lower intermediate vibration separating plate 24. Specifically, the inclination angle of the uppermost vibration separating plate 20 is 2.5 to 3 degrees and the upstream intermediate vibration separating plate 22 is 4 to 6 degrees with respect to the vibration separating main body 4, and the upper intermediate vibration of the descending upper stage. The separating plate 23 is set to 1.5 to 2 degrees, and the lower intermediate vibration separating plate 24 is set to 1 to 1.5 degrees.

  The upstream end of the uppermost vibration separating plate 20 and the downstream end of the upstream intermediate vibration separating plate 22 overlap each other when viewed in plan. Further, the chip component C can be dropped between the uppermost vibration separating plate 20 and the upper intermediate vibration separating plate 23 on the descending side and between the upper intermediate vibration separating plate 23 and the lower intermediate vibration separating plate 24. Gaps a and b are provided.

  Next, the effect of this embodiment is demonstrated.

  Chip components C and media M sent from the hopper 15 of the component supply device 5 are screened by the screening unit 25 into most of the chip components C and the remaining media M, and are fed to the uppermost vibration separating plate 20. The uppermost vibration separating plate 20 further separates the chip component C that goes up the slope and the media M that goes down.

  The chip component C that has fallen from the uppermost vibration separation plate 20 to the upside intermediate vibration separation plate 22 rises along the slope, falls onto the vibration separation body 4, and is recovered as it is to the work tray 10. On the other hand, the medium M that has fallen on the upstream intermediate vibration separating plate 22 rolls on the slope and falls onto the vibration separating body 4 and is collected as it is in the medium collecting tray 13.

  A part of the chip parts C dropped together with the medium M from the uppermost vibration separating plate 20 onto the downstream intermediate vibration separating plates 23 and 24 falls onto the vibration separating body 4 from the gaps a and b, and the vibration separating body. 4 is collected in the work tray 10. On the other hand, most of the media M dropped on the intermediate vibration separating plates 23 and 24 rolls down to the vibration separating main body 4 and is collected in the media collecting tray 13.

  In this case, when the chip part C is mixed in the medium M, the chip part C is collected in the collection tray 14 via the foreign matter separating unit 11, and thus the chip part C is mixed in the medium collection tray 13. Never do. Further, when the medium M is mixed in the chip part C, the medium M is collected by the foreign matter separating unit 9, so that the medium M is not mixed in the work tray 10.

  As described above, according to the present embodiment, the uppermost vibration separation plate 20 is disposed in the vicinity of the supply port 16c of the component supply device 5, and the uppermost vibration separation plate 20 descends stepwise on the upside and the downside, respectively. Since the intermediate vibration separating plates 22, 23, and 24 are disposed, the chip component C and the medium M can be roughly separated by the uppermost vibration separating plate 20 as described above, and each of the upstream and downstream intermediate vibration separating plates is separated. Separation can be achieved by the plates 22 to 24, so that the separation accuracy can be improved, and the operation of taking out the mixed components manually can be eliminated.

  Further, the chip component C and the medium M supplied from the component supply device 5 are sent out from the uppermost vibration separating plate 20 to the upstream and downstream intermediate vibration separating plates 22 to 24, and further each intermediate vibration separating plate. Since the chip parts C and the media M are separated by 22 to 24, a large amount of parts to be separated can be separated continuously and in a short time, and the separation ability can be increased without causing an increase in the size of the apparatus. .

  In the present embodiment, since the inclination angle of the upstream intermediate vibration separating plate 22 is made larger than that of each of the downstream intermediate vibration separating plates 23, 24, the medium M supplied on the upstream intermediate vibration separating plate 22 slips. It becomes easy to fall, and the separation by the intermediate vibration separating plate 22 can be promoted. Further, since the inclination angles of the intermediate vibration separating plates 23 and 24 on the down side are smaller than the up side, the chip part C can easily rise up the slope, and the separation on the down side can be promoted.

  Since the inclination angle of each of the downward intermediate vibration separating plates 23 and 24 is made smaller on the lower side than on the upper side, the separation of the chip part C from the medium M can be promoted, and the separation accuracy can be further improved. it can.

  In the present embodiment, the gaps a and b are provided between the uppermost vibration separating plate 20 and the lower intermediate vibration separating plate 23 on the lower side and between the upper and lower intermediate vibration separating plates 23 and 24, respectively. The chip component C that has dropped to the side drops directly from the gaps a and b to the vibration isolation body 4 below without passing through the intermediate vibration separation plates 23 and 24, and the chip component C is easily and reliably removed from the medium M. Can be separated.

  In this embodiment, since the sieving unit 25 is provided in the component supply device 5, the chip component C and the medium M can be roughly divided in advance before being supplied to the uppermost vibration separating plate 20, and the separation accuracy and Separation ability can be further increased.

  According to the present embodiment, the weir portion 16e having the inverted triangular opening 16d is formed in the supply port 16c of the component supply device 5, and the opening area of the weir portion 16e is changed by the partition plate 17, Clogging when adjusting the supply amounts of the chip component C and the medium M can be prevented, and stable continuous supply is possible. That is, conventionally, one having one horizontally long rectangular opening is generally used, and the opening height of this opening is reduced to reduce the supply amount. The opening height needs to be at least three times the thickness of the chip component, and if it is less than this, clogging is likely to occur. On the other hand, in the present embodiment, since the inverted triangular opening 16d is used, the opening height h can be secured approximately twice even when the opening area is approximately the same as the conventional one, and clogging is less likely to occur. Further, since the bottom of the weir portion 16e is V-shaped, the medium M can be supported at two points, and vibration during conveyance can be transmitted more strongly.

  Since the opening 16d of the weir portion 16e is continuously formed so as to extend over substantially the entire width of the supply port 16c, the increase and decrease of the supply amount can be adjusted with high accuracy. Further, since the chip component C and the medium M are sent out from the supply port 16c while applying vibration, the clogging of components can be prevented more reliably and a stable component supply amount can be secured.

  FIG. 8 is a view for explaining a vibration separating apparatus according to a second embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 1 denote the same or corresponding parts.

  In the present embodiment, upper and lower intermediate vibration separation plates 22 ′ and 22 ″ are disposed on the upper side of the uppermost vibration separation plate 20 in a stepped manner, and the upper and lower intermediate portions are disposed on the lower side in the same manner as in the above embodiment. This is an example in which the vibration separating plates 23 and 24 are arranged.The intermediate vibration separating plates 22 ', 22 ", 23, and 24 on the upstream side and the downstream side overlap with each other in the vertical direction, and the inclination angle decreases toward the lower side. Is getting smaller.

  In the present embodiment, the upper and lower intermediate vibration separation plates 22 ', 22 "and 22, 24 are arranged on the upstream side and the downward side of the uppermost vibration separation plate 20, respectively, so that the separation accuracy and separation ability can be further improved. Can be improved.

  In the above embodiment, the case where the chip component C subjected to the barrel plating process and the medium M is separated has been described as an example. However, the vibration separating device of the present invention is not limited to this, for example, The present invention can also be applied to the case where the workpiece subjected to the barrel polishing process and the abrasive are separated. In this case, the same effect as that of the above embodiment can be obtained.

  Moreover, although the said embodiment demonstrated the case where the vibration isolation | separation main body was a bowl-shaped thing and gave the vibration to the up direction, in this invention, employ | adopts the conveyor belt rotationally driven by the direction which goes up to a vibration isolation | separation main body. Is also possible.

  In the above embodiment, the case where one vibration drive unit 16a corresponding to one pool unit 16b is provided has been described. However, in the present invention, the pool unit is formed wide to provide a plurality of vibration drive units. May be.

  Usually, the width of the pool portion 16b (a direction perpendicular to the weir portion 16e) that can supply the parts to be separated stably and uniformly is limited by the width of the vibration driving portion 16a. That is, if the width of the pool portion 16b is too large compared to the width of the vibration driving portion 16a, the vibration becomes non-uniform, and the supply of components in the width direction varies. Here, although it is possible to arrange | position the big vibration drive part 16a according to the width | variety of the pool part 16b, in this case, an installation will enlarge.

  Therefore, by arranging a plurality of vibration driving portions 16a in the wide pool portion 16b, for example, at both ends of the pool portion 16b, it becomes possible to supply parts stably and uniformly. However, in this case, there is a concern that it becomes difficult to control the vibration drive units.

  In this embodiment, since the weir part 16e and the partition plate 17 are provided, even if, for example, two vibration drive parts are provided for one pool part 16b, the partition plate 17 supplies the weir part 16e. Can be distributed stably and can be supplied stably. Therefore, it is not necessary to control a plurality of vibration driving units.

BRIEF DESCRIPTION OF THE DRAWINGS It is a whole block diagram for demonstrating the components supply apparatus by 1st Embodiment of this invention, and the vibration separation apparatus using this apparatus. It is sectional drawing of the components supply apparatus of the said vibration isolator. It is a front view of the said component supply apparatus. It is a top view of the said component supply apparatus. It is a figure which shows the modification of the dam part of the said part supply apparatus. It is a figure which shows the modification of the dam part of the said part supply apparatus. It is a figure which shows the modification of the screening part of the said vibration separation apparatus. It is a schematic diagram of the vibration isolator by 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vibration isolation device 4 Vibration isolation | separation main body 5 Component supply apparatus 15 Hopper (component supply part)
16c Supply port 16d Opening 16e Weir part 17 Partition plate C Chip component (part to be separated)
M media (parts to be separated)

Claims (5)

A component supply device that supplies a rectangular parallelepiped separated component and a spherical separated component filled in a component supply unit from a supply port provided in the component supply unit,
The supply port is provided with a weir portion having a plurality of openings divided and formed so that the opening width increases toward the upper side and decreases toward the lower side,
A partition plate weir portions, sliding contact with the edge of each opening is the split, and the component supplying device being characterized in that a vertically movable disposed so as to vary the area of the respective opening. 2. The component supply apparatus according to claim 1, wherein the opening of the dam portion is formed continuously over substantially the entire width of the supply port. 3. The vibration supply mechanism according to claim 1 or 2, wherein the component supply unit is provided with a vibration mechanism that feeds the component to be separated from the opening of the weir unit by applying vibration to the component to be separated. Parts supply device. 4. The component supply unit according to claim 1, further comprising a vibration supply unit including a vibration drive unit and a pool unit mounted on the vibration drive unit, and a plurality of vibration drives for one pool unit. The component supply apparatus, wherein the part is disposed. A vibration isolation device using the component supply device according to any one of claims 1 to 4, in the component supply section is arranged to be inclined so as to form a predetermined angle below the component supply section And a vibration separating body for separating and discharging the component to be separated supplied from the supply port of the component supply unit into a component to be separated that goes up the slope and a component to be separated that goes down the slope. Separation device.

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