JP5196334B2 - Probe card fixing unit - Google Patents

Description

  The present invention relates to a probe card fixing unit that suppresses deformation of a probe card in a semiconductor test apparatus.

  In the manufacturing process of a semiconductor device, a semiconductor test apparatus is used to test the performance and function of the semiconductor device. In a semiconductor test apparatus, a probe card is fixed to a semiconductor test apparatus, and a test is performed by electrically connecting a wafer on which an integrated circuit, which is a device under test, is formed and probe pins provided in the probe card. Since the probe card is compatible with the type of device under test, it must be replaced whenever the type of device under test changes.

  FIG. 7A is a diagram schematically showing a configuration in the vicinity of a probe card fixing portion in a conventional semiconductor test apparatus. In this figure, a ring 320 is a unit for fixing an outer peripheral portion of a removable circular probe card 200 and is fixed to a top plate 310. Although not shown, a base unit main body held by the test head is disposed on the top plate 310.

  Then, the prober chuck 220 on which the wafer 230 is mounted presses the wafer 230 against the probe pins of the probe card 200, whereby the probe pins and the wafer 230 are electrically connected.

  The conventional semiconductor test apparatus is provided with a mechanism for preventing the probe card 200 from being deformed downward as shown in FIG. 7B due to the influence of heat when performing high temperature measurement. .

  This mechanism will be described with reference to FIG. As shown in FIG. 8A, the circular top plate 310 is provided with a cylinder 311 that is driven by air. The cylinder 311 moves the L-shaped arm 312 having a wedge-shaped tip to two positions: a position where it abuts against the clamp head 210 provided in the probe card 200 and a position where it separates. In the figure, only one set of the cylinder 311 and the L-shaped arm 312 is shown, but actually, a plurality of sets including at least one set provided at the opposed positions are provided.

  As described above, the probe card 200 is provided with the flange-shaped clamp head 210 having a tapered surface, and when the probe card 200 is fixed, the wedge surface of the L-shaped arm 312 as shown in FIG. However, the cylinder 311 is driven so that it engages with the tapered surface of the clamp head 210 of the probe card 200 and is locked. Thereby, the probe card 200 is prevented from being deformed downward.

  On the other hand, when the probe card 200 is replaced, the cylinder 311 is driven so that the engagement between the wedge surface of the L-shaped arm 312 and the clamp head 210 is released and the unlocked state is established. FIG. 8A shows the state at this time.

JP 2010-50437 A

  However, when there is a problem in component accuracy between the taper surface of the clamp head 210 of the probe card 200 and the wedge surface of the L-shaped arm 312 or when deformation occurs during transportation of the probe card 200, etc. As shown in FIG. 8C, there may be a problem in the engagement between the tapered surface of the clamp head 210 and the wedge surface of the L-shaped arm 312.

  If the contact resistance between the taper surface of the clamp head 210 and the wedge surface of the L-shaped arm 312 increases due to this defect, there is a possibility that the locking operation and the unlocking operation may be hindered by the frictional force.

  If the locking operation is not sufficient, it becomes impossible to suppress the deformation of the probe card 200 due to the influence of heat, and if the unlocking operation fails, it takes time to remove the probe card 200 and deteriorates the throughput of the semiconductor test. Become.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a probe card fixing unit that can reliably perform a lock / unlock operation of a probe card.

  In order to solve the above problems, a probe card fixing unit according to the present invention is a probe card fixing unit for fixing a probe card having a clamp head having a tapered surface to a reference member, and an arm portion having a rotation mechanism at the tip. And the arm portion is moved with respect to the reference member so that the rotation mechanism of the arm portion comes into contact with the taper surface of the clamp head and moves away from the taper surface of the clamp head. And a drive unit.

  Here, the position away from the taper surface of the clamp head may be a position outside the outer periphery of the clamp head. In addition, it is desirable that a plurality of sets of the arm part and the driving part are provided so as to be in a position to sandwich the clamp head. The rotation mechanism may be a spherical outer ring-shaped roller.

  ADVANTAGE OF THE INVENTION According to this invention, the probe card adhering unit which can perform locking / unlocking operation | movement of a probe card reliably is provided.

It is a schematic diagram for demonstrating the probe card adhering mechanism of the semiconductor test apparatus which concerns on this embodiment. It is a schematic diagram which shows the locked state of a probe card adhering mechanism. It is a schematic diagram which shows two sets of probe card adhering mechanisms. It is a schematic diagram explaining a mode that the inclination of a probe card is absorbed. It is a figure which shows the example of a shape of a roller. It is a figure which shows the example of a shape of a clamp head. It is a figure which shows typically the structure of the probe card adhering part vicinity in the conventional semiconductor test apparatus. It is a figure explaining the conventional mechanism for preventing a deformation | transformation of a probe card.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram for explaining a probe card fixing mechanism of the semiconductor test apparatus according to the present embodiment. As shown in the figure, the top plate 110 is provided with a cylinder 111 that is driven by air. Note that the top plate 110 is a circular member disposed in the lower portion of the base unit main body held by the test head in the semiconductor test apparatus.

  The cylinder 111 functions as a drive unit, and moves the L-shaped arm 112 to two positions: a position where it abuts against the clamp head 210 and a position where it separates based on a control signal from a sequencer device provided outside.

  A roller 113 that freely rotates in the diameter direction of the top plate 110 is provided at the tip of the L-shaped arm 112. The roller 113 functions as a rotation mechanism, and at least the upper side is exposed so that it can come into contact with the tapered surface of the clamp head 210 of the probe card 200. As long as this structure is satisfied, the roller 113 is not limited to a wheel shape, and may adopt a cylindrical shape, a spherical shape, or any other shape, and any material may be used. Moreover, the arm which is the support member of the roller 113 that is moved by the cylinder 111 is not limited to the L shape.

  When the probe card 200 is locked, as shown in FIG. 2, the roller 113 provided on the L-shaped arm 112 hits the tapered surface of the clamp head 210 of the probe card 200 and drives the cylinder 111 so as to always press. At this time, since the roller 113 rotates, the cylinder 111 can be driven with a small force. In addition, since a large frictional force is not generated between the roller 113 and the taper surface of the clamp head 210, it is possible to prevent malfunction during the locking operation.

  Thus, in the present embodiment, a sufficient upward force is generated by pressing the roller 113 against the tapered surface of the clamp head 210 with the pressure of the cylinder 111 driven by air, and the probe card 200 is lowered by heat during high temperature measurement. Prevents deformation in the direction.

  The outer peripheral portion of the probe card 200 is fixed by a ring 120 fixed to the top plate 110 as in the prior art. Here, the top plate 110 and the ring 120 function as a reference member for fixing the probe card 200.

  1 and 2, only one set of the cylinder 111 and the L-shaped arm 112 with a roller is shown. However, as shown in FIG. It is desirable to provide a plurality of sets including at least one set of opposing positions of the top plate 110 and simultaneously drive the cylinders 111 when locked and unlocked.

  When exchanging the probe card 200, the L-arm 112 with a roller is moved to a position away from the clamp head 210 by the cylinder 111, so that the pressing by the roller 113 is released and the unlocked state is set. At this time, by moving the roller 113 to a position outside the outer periphery of the clamp head 210, the probe card 200 can be easily removed. FIG. 1 shows the state at this time.

  Also during the unlocking operation, since the roller 113 rotates, the cylinder 111 can be driven with a small force. In addition, since a large frictional force is not generated between the roller 113 and the tapered surface of the clamp head 210, it is possible to prevent malfunction during the unlocking operation.

  In the present embodiment, the roller 113 and the taper surface of the clamp head 210 are in contact with a line instead of a surface. For this reason, even if the shape of the probe card 200 is distorted, as shown in FIGS. 4A and 4B, it can be tilted in either the clockwise direction or the counterclockwise direction. However, since the roller 113 absorbs the inclination of the probe card 200, it is possible to suppress the malfunction of the lock operation and the unlock operation due to the increase of the frictional force.

  Furthermore, as shown in FIG. 5A, the roller 113 has a spherical outer ring shape, so that the roller 113 and the taper surface of the clamp head 210 come into contact with each other at a point. In this case, as shown in FIG. 5B, the roller 113 can absorb the inclination of the probe card 200 in all directions.

  When a stronger holding force is required for fixing the probe card 200, as shown in FIG. 6 (a), the probe card 200 is used when the roller card 113 is applied. A larger upward holding force can be generated with respect to the downward deformation load of 200.

  On the other hand, as shown in FIG. 6B, by using the clamp head 210b having a tapered surface, the holding force in the upward direction is reduced, but the lateral space occupied by the clamp head 210b can be reduced. , Space can be saved.

  As described above, according to the present embodiment, a probe card adhering unit capable of reliably performing a lock / unlock operation of a lobe card is provided.

110 ... Top plate 111 ... Cylinder 112 ... L-shaped arm 113 ... Roller 120 ... Ring 200 ... Probe card 210 ... Clamp head 220 ... Prober chuck 230 ... Wafer 310 ... Top plate 311 ... Cylinder 312 ... L-shaped arm 320 ... Ring

Claims (4)

A probe card fixing unit for fixing a probe card having a clamp head having a tapered surface to a reference member,
An arm portion having a rotation mechanism at the tip;
A drive unit that moves the arm unit relative to the reference member so that the rotation mechanism of the arm unit is in a position in contact with the taper surface of the clamp head and in a position in which the arm unit is separated from the taper surface of the clamp head. And a probe card adhering unit.   The probe card fixing unit according to claim 1, wherein the position away from the taper surface of the clamp head is a position outside the outer periphery of the clamp head.   3. The probe card fixing unit according to claim 1, wherein a plurality of sets of the arm part and the driving part are provided so as to sandwich the clamp head. 4.   The probe card fixing unit according to claim 1, wherein the rotation mechanism is a roller having a spherical outer ring shape.