JP5200306B2 - Conductive junction contactor - Google Patents

Description

  The present invention relates to a conductive joint contactor that forms an electrical connection state, and includes a metal joint on a contact surface that electrically joins a land-like connection terminal and a spring-like contactor or a pair of spring-like contactors. The present invention relates to a conductive junction contactor.

FIG. 4 is a cross-sectional view schematically showing a contact state between a conventional contact and a connection terminal. FIG. 4A shows a contact state between the spiral contact and the connection terminal using a spiral contactor. ) Shows a contact state between the triple wound spiral contactor and the triple wound spiral contactor using a spiral contactor.
As shown in FIG. 4 (a), the triple spiral contact 102 is positioned and fixed to a mounting board 108 having a conductive land 108a on the surface.
The spiral contactor 101 is formed in a spiral shape from the root toward the center of the tip, and in the convex spiral contact 102 having the tip at the center of the spiral, the roots of the spiral contact 102 are phase-shifted from each other by 120 °. Three spiral contacts 102 arranged in a spiral shape, arranged in a shifted position, rise from the root toward the center of the spiral, and are arranged in parallel with each other in parallel with each other at the tip. A mirror-like flat surface 102da obtained by mirror-treating the upper surface of the tip of the triple spiral spiral contactor 102 is provided.

  As a result, the spiral contact 102 having the mirror-like flat surface 102da on the upper surface of the tip portion and the connection terminal 111a having the mirror-like flat surface 111aa on the connection surface can be brought into close contact with each other and can be joined. The mirror-like flat surface 102da of the spiral contactor 102 and the mirror-like flat surface 111aa of the connection terminal 111a face each other and overlap each other, so that the mirror-like flat surfaces are in close contact with each other to generate a metal bond, thereby generating a metal joint 102e. In addition, it can be electrically and strongly joined.

Next, as shown in FIG. 4 (b), one triple wound spiral contact is positioned and fixed to a mounting substrate 108 having a conductive land 108a on the surface, and the other triple wound spiral contact. The child 102 is also positioned and fixed to a mounting board 108 having a conductive land 108a on the surface.
At least one pair of the triple spiral spiral contacts 102 is provided, and a metal joint portion 102e generated by overlapping the mirror planes 102da of the pair of triple spiral spiral contacts 102 facing each other is provided.

That is, when the mirror-like flat surface 102da of the triple spiral spiral contactor 102 and the mirror-like flat surface 102da of the triple spiral spiral contactor 102 face each other and overlap each other, the mirror-like flat surfaces are in close contact with each other and metal bonding is performed. It is possible to easily produce a triple spiral spiral contact that is generated and can be electrically and strongly bonded, has high accuracy, and has excellent spring followability (see Patent Document 1).
Japanese Patent Application No. 2008-222905

However, in the conventional example, a connection terminal having a mirror-like plane on the connection surface and a spiral contact having a mirror-like plane on the top surface of the tip are joined, and the mirror-like plane is on the top of the tip. The spiral contactors provided with are joined together.
The present invention comprises a metal joint on a contact surface obtained by electrically joining a land-like connection terminal and a spring-like contactor, or a pair of spring-like contactors, and stably using a spring-like contactor. It is an object of the present invention to provide a conductive junction contactor that forms a general connection state.

  According to a first aspect of the present invention, there is provided a conductive junction contactor including a land-like connection terminal and an electrical contact with the land-like connection terminal by applying a biasing force to the land-like connection terminal and electrically contacting the conductive part of the substrate. In the spring-like contactor joined so as to be conductive, the land-like connection terminal and the spring-like contactor include a mirror-like flat surface whose contact surface is mirror-finished, and the land-like connection terminal and the spring-like contactor At least one pair of spring-like contacts is provided, and a metal joint generated by overlapping the mirror-like planes of the land-like connection terminal and the spring-like contact with each other is provided. The conductive portion is a metal portion such as a via, a terminal, a wiring, or a connection terminal provided in the substrate.

  According to a second aspect of the present invention, there is provided a conductive joint contactor comprising at least a pair of spring-like contactors that are in electrical contact with each other, and having a mirror-like plane obtained by mirror-treating contact surfaces with which the pair of spring-like contactors contact each other The pair of spring-like contacts include metal joints generated by overlapping the mirror-like planes facing each other.

  The invention according to claim 3 is the conductive joint contactor according to claim 1 or 2, wherein the spring-like contactor has a leaf spring shape.

  The invention according to claim 4 is the conductive joint contactor according to claim 1 or 2, wherein the spring-like contactor has a coil spring shape.

  The invention according to claim 5 is the conductive junction contactor according to claim 1 or 2, wherein the mirror-like plane is mirror-finished to a surface roughness of 0.2 nm or less by a CMP method. Features.

  According to the first aspect of the present invention, at least a pair of land-like connection terminals and spring-like contactors each having a mirror-like flat surface whose contact surface is mirror-finished is provided, and the mirror surfaces of the land-like connection terminals and the spring-like contactors are provided. The metal planes can be generated by facing and overlapping the flat surfaces, and the mirror-like flat surfaces can be bonded in a stable manner.

  According to the second aspect of the present invention, a pair of spring-like contactors having mirror-like flat surfaces obtained by mirror-treating contact surfaces that come into contact with each other are provided, and the mirror-like flat surfaces of the pair of spring-like contactors face each other and overlap each other. By joining together, a metal joint portion can be generated, and the respective mirror-like planes can be stably adhered and joined together.

  According to the invention which concerns on Claim 3, the spring-like contactor is a leaf | plate spring shape, The leaf | plate spring and the land-shaped connection terminal or leaf | plate spring provided with the mirror-like plane which mirror-processed the contact surface which mutually contacts A metal joint part is produced | generated between each other, and it can join, mutually making a mirror plane flat contact | adhered stably.

  According to the invention which concerns on Claim 4, when a spring-like contactor is a coil spring shape, it provided between the coil spring and the land-shaped connection terminal, or coil springs provided with the mirror-like plane which mirror-processed the contact surface which mutually contacts. It is possible to form a metal joint portion and bond the mirror-like flat surfaces to each other stably. As a result, it is possible to easily form a conductive junction contactor including a spring-like contactor with high accuracy, excellent electrical characteristics, and excellent spring followability.

  According to the invention which concerns on Claim 5, the strongest metal junction part can be obtained by providing the mirror surface planar surface which carried out the mirror surface process to the surface roughness of 0.2 nm or less by CMP method.

<First Embodiment>
Hereinafter, a first embodiment of a conductive junction contactor according to the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a conductive joint contactor for explaining a first embodiment of the present invention, and FIG. 1A is a cross-sectional view showing a conductive joint contactor including a leaf spring-shaped spring-like contactor. b) is a cross-sectional view showing a conductive joint contactor provided with a coil spring-shaped spring-like contactor.

  As shown in FIG. 1A, the conductive junction contactor 11 is in contact with the land-like connection terminal 12a by applying a biasing force of the spring to the land-like connection terminal 12a and the land-like connection terminal 12a. In the leaf spring-shaped spring-like contactor 13 joined so as to be electrically connected to the via 12b of the substrate 12, the land-like connection terminal 12a and the leaf-spring shaped spring-like contactor 13 are A plate-spring shaped spring-like contactor 13 having mirror-like flat surfaces 12aa and 13a whose contact surfaces are mirror-finished and joined to the land-like connection terminals 12a and the land-like connection terminals 22a 'of the substrate 12' by solder 14 or the like. At least a pair, and the metal contact generated by overlapping the land-like connection terminals 12a and the mirror-like flat surfaces 12aa, 13a of the leaf spring-shaped spring-like contactors 13 facing each other. A joint portion 15 is provided.

Further, as shown in FIG. 1B, the conductive junction contactor 21 applies an urging force to the land-like connection terminal 22a and the land-like connection terminal 22a to make electrical contact with the land-like connection terminal 22a. In the coil spring-shaped spring contact 23 joined so as to be electrically connected to the via 22b of the substrate 22, the land-shaped connection terminal 22a and the coil spring-shaped spring contact 23 have contact surfaces thereof. At least a land-like connection terminal 22a and a coil-spring shaped spring-like contactor 23 joined to the land-like connection terminal 22a 'of the substrate 22' by solder 24 or the like. By providing a pair of mirror-like flat surfaces 22aa, 23a of the land-like connection terminals 22a and the coil-spring-like spring-like contactors 23, facing each other and overlapping each other A generated metal joint 25 is provided.
Note that the solder joints (soldering portions) 14 and 24 may be laser spot welding or the like, as long as electrical joining is possible, or any other joining method or metal joining used in the present invention.
The core material forming the spring-like contacts 13 and 23 is a nickel (Ni) base material, and the surface thereof is Au-plated, but is not limited thereto.
The connection surfaces of the land-like connection terminals 12a and 22a and the spring-like contacts 13 and 23 are mirror-finished with a surface roughness of about 0.2 nm by CMP, but may have a surface roughness of about 20 nm. Absent.

Next, the operation of the conductive junction contactor will be described.
FIG. 3 is an enlarged view for explaining metal bonding. 3A shows a case where the connection partner of the spring-like contact is a land-like connection terminal, and FIG. 3B shows a case where the connection counterpart of the spring-like contact is also a spring-like contact. ing.
As shown in FIGS. 1A and 3A, the substrate of the conductive junction contactor 11 is a mounting substrate provided with electrical wiring. This mounting board may be a board provided with a power supply terminal or the like.
A plate-like spring-like contact 13 is soldered to the land-like connection terminal 12a 'of the substrate 12'. A mirror-like flat surface 13 a is provided at a place extending from the soldering portion 14. In this embodiment, the mirror-like flat surface 13a is subjected to a CPM treatment with a surface roughness of about 0.2 nm and is subjected to a mirror treatment. Note that the CPM treatment may be performed with a surface roughness of 0.1 nm to 20 nm.
Further, the substrate 12 is provided with land-like connection terminals 12a, and this surface is also provided with a mirror-like flat surface 12aa that has been subjected to a CPM treatment with a surface roughness of about 0.2 nm and subjected to a mirror treatment.

In order to electrically connect and connect the land-like connection terminals 12a provided on the substrate 12 and the substrate 12 'and the leaf spring-shaped spring-like contactor 13, the substrate 12 and the substrate 12' are brought close to a desired distance. As a result, the land-like connecting terminals 12a and the respective mirror-like flat surfaces 12aa and 13a of the leaf-like spring-like contactor 13 come into contact with each other. At this time, the mirror-like flat surface 12aa and the mirror-like flat surface 13a are in contact with each other in a slightly pressurized state by the spring biasing force of the leaf-like spring-like contactor 13. At this time, the metal atoms of the specular plane 12aa and the specular plane 13a diffuse to each other, and diffusion bonding occurs to generate the metal junction 15. Diffusion bonding is defined by JIS as follows: “Diffusion of atoms generated between bonding surfaces is applied by pressing the base material in close contact and pressurizing the base material to the extent that plastic deformation does not occur as much as possible. To join ".
The feature of such diffusion bonding is that it is possible to bond metals and dissimilar metals that are extremely difficult to melt and weld to each other, and to perform surface bonding.

  That is, the bonding surfaces of the metals to be bonded are pressed and heated without significant deformation, and the atoms at the bonding interface are diffused across the bonding surface and bonded. At this time, since surface irregularities, oxide films, and contaminated layers are factors that hinder bonding, strict control of the amount of plastic deformation by pressurization, diffusion rate by heating, and surface treatment is required. Precise bonding is possible by suppressing interdiffusion between bonding materials by condition control.

The mirror-like flat surfaces 12aa and 13a are precisely mirror-polished by a CMP method to have a precise mirror finish. The surface roughness (surface roughness) is 0.2 nm. When the surface roughness is 0.2 nm, metal bonding is possible even without pressure, and the mirror-like flat surfaces are brought into close contact with each other at normal pressure and normal temperature to be superposed electrically.
Note that when the surface roughness is 0.2 to 10 nm, the pressure is increased to about several MPa to several tens of MPa so that electrical bonding is strong. Once bonded, the electrical connection is maintained semi-permanently regardless of environmental changes.
Further, metal bonding is more likely to occur at a low temperature of 100 ° C. or lower, in a vacuum, or in an inert gas.
The mirror-like plane is not characterized by polishing, and any mirror-like plane may be used as long as it can generate a mirror-like plane, such as sputtering, plating, etching, and electrical processing.

In this way, since the joining surfaces meet each other due to the spring property of the spring-like contactor 12 and can work to supplement the parallel accuracy of the joining surfaces, the mirror-like flat surfaces 12aa and 13a are brought into close contact with each other. Can be overlapped. As a result, an appropriate pressure is applied from the spring-like contactor 13 to the joint surface between the mirror-like flat surfaces 12aa and 13a to cause metal fusion.
Further, the pressure of the spring-like contact 13 becomes larger than that of the conventional probe by making the cross-section of the spring-like contact 13 thick and further reducing the number of turns, and the mirror-like flat surfaces 12aa and 13a are stronger. Pressurized and suitable for metal bonding production.

Next, the case where the spring-like contact is a coil-spring shaped spring-like contact will be described.
As shown in FIG. 1B, the substrate of the conductive junction contactor 21 is a mounting substrate provided with electrical wiring. This mounting board may be a board provided with a power supply terminal or the like.
A coil spring-shaped spring-like contactor 23 is soldered to the land-like connection terminal 22a 'of the substrate 22'. The end surface opposite to the soldering portion 24 has a shape obtained by cutting the end surface of the coil spring, and the end surface is a mirror-like flat surface 23a. In the embodiment, the mirror-like flat surface 23a is subjected to a CPM process with a surface roughness of about 0.2 nm and is subjected to a mirror process. Note that the CPM treatment may be performed with a surface roughness of 0.1 nm to 20 nm.
The substrate 22 is provided with land-like connection terminals 22a, and a mirror-like flat surface 22aa that has been subjected to CPM treatment with a surface roughness of about 0.2 nm and mirror-finished is also provided on this surface.

  In order to electrically connect and connect the land-like connection terminals 22a provided on the substrate 22 and the substrate 22 'and the spring-like contactor 23 having a coil spring shape, the substrate 22 and the substrate 22' are brought close to a desired distance. As a result, the mirror-like flat surfaces 22aa and 23a of the land-like connection terminal 22a and the coil-spring shaped spring-like contactor 23 come into contact with each other. At this time, the mirror-like flat surface 22aa and the mirror-like flat surface 23a come into contact with each other in a slightly pressurized state by the urging force of the spring of the spring-like contactor 23 having a coil spring shape. At this time, the metal atoms of the mirror-like flat surface 22aa and the mirror-like flat surface 23a diffuse to each other to cause diffusion bonding, and the metal bonding portion 25 is generated. The diffusion bonding is the same as that in the case where the leaf spring-shaped spring-like contactor is used, and the description thereof is omitted here.

<Second Embodiment>
Next, a second embodiment of the conductive junction contactor according to the present invention will be described in detail with reference to the drawings. The second embodiment is different from the first embodiment in that, in the first embodiment, the land-like connection terminal and the spring-like contactor are electrically connected to each other, but in the second embodiment, It is a point which electrically joins, when spring-like contacts contact.
FIG. 2 shows a conductive junction contactor for explaining a second embodiment of the present invention, and FIG. 2A is a cross-sectional view showing a conductive junction contactor provided with a leaf spring-shaped spring-like contactor. b) is a cross-sectional view showing a conductive joint contactor provided with a coil spring-shaped spring-like contactor.
As shown in FIGS. 2A and 3, the conductive junction contactor 31 is a leaf spring-shaped spring-like contactor 33 that is solder-joined so as to be electrically connected to the land-like connection terminal 32 a of the substrate 32. And a spring-like spring-like contactor 33 ′ soldered so as to be electrically connected to the land-like connection terminal 32 a ′ of the substrate 32 ′, the biasing force of the springs on the mirror planes 33 a and 33 a ′. The metal joint 35 is generated by pressure contact.

  Further, as shown in FIG. 2B, the conductive joint contactor 41 is provided with a pair of coil spring-shaped spring contacts 43 that are in electrical contact with each other, and the pair of coil spring-shaped spring contacts 43, 43 'is provided with mirror-like flat surfaces 43a, 43a' obtained by mirror-treating contact surfaces that contact each other, and the pair of coil spring-shaped spring-like contacts 43, 43 'are land-like connection terminals 42a of the substrates 42, 42', 42a ′ is provided with a metal joint 45 that is soldered so as to be electrically connected to each other and is generated by overlapping the mirror-like flat surfaces 43a and 43a facing each other. Hereinafter, the operation of the conductive junction contactor for diffusion bonding is the same as that of the first embodiment.

  The preferred embodiments have been described above. However, the present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist of the present invention. For example, the spring-like contactor has been described as a plate spring shape and a coil spring shape, but is not limited to this, and any other spring-like contactor may be used, and a contact provided with a metal joint on a thin metal plate. You may comprise.

The conductive joint contactor for demonstrating the 1st Embodiment of this invention is shown, (a) is sectional drawing which shows the conductive joint contactor provided with the leaf-shaped spring-like contactor, (b), It is sectional drawing which shows the electroconductive joining contactor provided with the coil-shaped spring-shaped contactor. The conductive junction contactor for demonstrating the 2nd Embodiment of this invention is shown, (a) is sectional drawing which shows the conductive junction contactor provided with the leaf-like spring-like contactor, (b), It is sectional drawing which shows the electroconductive joining contactor provided with the coil-shaped spring-shaped contactor. It is an enlarged view explaining metal joining. (A) shows a case where the connection partner of the spring-like contact is a land-like connection terminal, and (b) shows a case where the connection partner of the spring-like contact is also a spring-like contact. It is sectional drawing which shows the outline of the contact state of the conventional contactor and a connection terminal, (a) shows the contact state of a spiral contactor and a connection terminal using a spiral contactor, (b) is spiral. The contact state of a triple winding spiral contact and a triple winding spiral contact using a contactor is shown.

Explanation of symbols

11, 21, 31, 41 Electrical junction contactor 12, 22, 32, 42 Substrate 12a, 12a ', 22a, 22a', 32a, 32a ', 42a, 42a' Land-shaped connection terminals 12aa, 22aa, 13a, 23a, 33a, 33a ', 43a, 43a' Specular plane 12b, 12b ', 22b, 22b', 32b, 32b ', 42b, 42b' Via 13, 13, 33, 33 ', 43, 43' Spring contact 14 , 24, 34, 44 Solder joint, soldering part 15, 25, 35, 45 Metal joint part

Claims (5)

A land-like connection terminal, and a spring-like contactor joined so as to be electrically connected to the conductive portion of the substrate by applying a biasing force to the land-like connection terminal and electrically contacting the land-like connection terminal; In the land-like connection terminal and the spring-like contact, the contact surface is provided with a mirror-like flat surface having a mirror-finished contact surface,
A metal joint produced by providing at least a pair of the land-like connection terminal and the spring-like contact, and overlapping the mirror-like planes of the land-like connection terminal and the spring-like contact with each other. A conductive junction contactor comprising:   At least one pair of spring-like contacts that are in electrical contact with each other is provided, and the pair of spring-like contacts are provided with a mirror-like flat surface obtained by mirror-treating contact surfaces with which the pair of spring-like contacts come into contact with each other. A conductive junction contactor comprising a metal junction generated by overlapping planes facing each other.   The conductive joint contactor according to claim 1, wherein the spring-like contact has a leaf spring shape.   The conductive joint contactor according to claim 1, wherein the spring-like contact has a coil spring shape.   3. The conductive junction contactor according to claim 1, wherein the mirror-like plane is mirror-finished to a surface roughness of 0.2 nm or less by a CMP method.

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