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JP5202188B2 - Resin casting with ground layer - Google Patents
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JP5202188B2 - Resin casting with ground layer - Google Patents

Resin casting with ground layer Download PDF

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JP5202188B2
JP5202188B2 JP2008218351A JP2008218351A JP5202188B2 JP 5202188 B2 JP5202188 B2 JP 5202188B2 JP 2008218351 A JP2008218351 A JP 2008218351A JP 2008218351 A JP2008218351 A JP 2008218351A JP 5202188 B2 JP5202188 B2 JP 5202188B2
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ground layer
layer
resin
insulating layer
grounding
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JP2010057246A (en
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美佳 松岡
千代美 川口
文雄 降矢
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Toshiba Corp
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Description

本発明は、中心導体を埋め込んだ絶縁層の外周表面に導電性塗料を塗布して形成した接地層を設けた樹脂注型品に係り、特にガスシール特性を向上し得る接地層付き樹脂注型品に関する。   The present invention relates to a resin casting product provided with a grounding layer formed by applying a conductive paint on the outer peripheral surface of an insulating layer embedded with a central conductor, and in particular, a resin casting with a grounding layer capable of improving gas sealing characteristics Related to goods.

従来、この種の接地層付き樹脂注型品は、中心導体の周りにエポキシ樹脂を注型して絶縁層を形成し、絶縁層の外周表面に導電性塗料を塗布して接地層を設けたものが知られている。このような接地層付き樹脂注型品は、ガス絶縁スイッチギヤに用いられるT形ブッシングが挙げられ、主回路導体の絶縁支持とともに、箱体の天井板などに取り付けられ、気中−ガスのガス区分が行われる(例えば、特許文献1参照。)。
特開2007−174817号公報 (第4ページ、図1)
Conventionally, this type of resin casting product with a grounding layer has an insulating layer formed by casting an epoxy resin around the central conductor, and a grounding layer is provided by applying a conductive paint on the outer peripheral surface of the insulating layer. Things are known. Such a resin casting product with a grounding layer includes a T-type bushing used for a gas-insulated switchgear, and is attached to a ceiling board of a box body together with an insulating support of a main circuit conductor, and is an air-gas gas Classification is performed (for example, refer to Patent Document 1).
JP 2007-174817 (4th page, FIG. 1)

上記の従来の接地層付き樹脂注型品においては、次のような問題がある。接地層は、絶縁層外周の接地電位を保つための導電性とともに、箱体内の気密を保持するためのガスシール特性を要求される。しかしながら、形成状態によっては、両特性を両立させることが困難であった。   The above-mentioned conventional resin cast product with a ground layer has the following problems. The ground layer is required to have a gas seal characteristic for maintaining airtightness in the box as well as conductivity for maintaining the ground potential of the outer periphery of the insulating layer. However, depending on the formation state, it has been difficult to achieve both characteristics.

即ち、導電性塗料は銀やカーボンなどの導電性粉末にバインダーとしてエポキシ樹脂やアクリル樹脂を用いているので、導電性粉末がバインダーよりも多いと、充分なる導電性を得られるものの、導電性粉末の相互が強固に接着されず、ガスシール特性が得られ難くなる。逆に、導電性粉末がバインダーよりも少ないと、導電性粉末の相互が強固に接着して充分なるガスシール特性を得られるものの、導電性が得られ難くなる。導電性が得られないと、絶縁層内の電界分布が乱れ、絶縁層が絶縁劣化を起こすことになる。   That is, since the conductive paint uses epoxy resin or acrylic resin as a binder for conductive powder such as silver or carbon, if the conductive powder is more than the binder, sufficient conductivity can be obtained, but the conductive powder Are not firmly bonded to each other, making it difficult to obtain gas seal characteristics. On the contrary, when there are few electroconductive powders than a binder, although electroconductive powder mutually adhere | attaches firmly and sufficient gas-seal characteristics are acquired, electroconductivity becomes difficult to be obtained. If the conductivity is not obtained, the electric field distribution in the insulating layer is disturbed, and the insulating layer is deteriorated in insulation.

本発明は上記問題を解決するためになされたもので、導電性とガスシール特性とを両立し得る導電性塗料を塗布して接地層を設けた接地層付き樹脂注型品を提供することを目的とする。   The present invention has been made to solve the above problems, and provides a resin casting product with a ground layer provided with a ground layer by applying a conductive paint capable of achieving both conductivity and gas seal characteristics. Objective.

上記目的を達成するために、本発明の接地層付き樹脂注型品は、中心導体と、前記中心導体の周りに注型により形成された絶縁層と、前記絶縁層の外周表面に銀粉末エポキシ樹脂とで構成される導電性塗料を塗布して設けられとともに、盤壁にOリングを介して当接する接地層とを備え、前記接地層は、前記絶縁層に近いほど前記エポキシ樹脂よりも前記銀粉末が多くなるように形成されていることを特徴とする。 In order to achieve the above object, a resin cast product with a ground layer of the present invention comprises a center conductor, an insulating layer formed by casting around the center conductor, and silver powder on the outer peripheral surface of the insulating layer. together provided by coating the configured conductive coating with an epoxy resin, and a ground layer abutting via an O-ring plate wall, the ground layer, rather than the more the epoxy resin is close to the insulating layer The silver powder is formed so as to increase.

本発明によれば、絶縁層に近くなるほど導電性粉末が多く、逆に外表面になるほど接着樹脂が多くなるような接地層を設けているので、接地層の導電性とガスシール特性とを両立させることができる。   According to the present invention, since the ground layer is provided such that the closer to the insulating layer, the more conductive powder, and the more the adhesive resin the more the outer surface is, the ground layer is provided with both the conductivity and gas seal characteristics of the ground layer. Can be made.

以下、図面を参照して本発明の実施例を説明する。   Embodiments of the present invention will be described below with reference to the drawings.

先ず、本発明の実施例1に係る接地層付き樹脂注型品を図1、図2を参照して説明する。図1は、本発明の実施例1に係る接地層付き樹脂注型品の構成を示す断面図、図2は、本発明の実施例1に係る接地層付き樹脂注型品の接地層を示す拡大断面図である。なお、接地層付き樹脂注型品をT形ブッシングを用いて説明する。   First, a resin cast product with a grounding layer according to Example 1 of the present invention will be described with reference to FIGS. 1 is a cross-sectional view showing the configuration of a resin cast product with a ground layer according to Example 1 of the present invention, and FIG. 2 shows the ground layer of the resin cast product with a ground layer according to Example 1 of the present invention. It is an expanded sectional view. A resin cast with a ground layer will be described using a T-shaped bushing.

図1に示すように、T形ブッシングは、筒状の第1の中心導体1aとこの第1の中心導体1aの略中央部から垂直に伸びた棒状の第2の中心導体1bとからなる中心導体1と、中心導体1の周りにエポキシ樹脂のような絶縁材料を注型して形成した略T字状の絶縁層2とから構成されている。   As shown in FIG. 1, the T-shaped bushing has a center composed of a cylindrical first central conductor 1a and a rod-shaped second central conductor 1b extending vertically from a substantially central portion of the first central conductor 1a. It comprises a conductor 1 and a substantially T-shaped insulating layer 2 formed by casting an insulating material such as an epoxy resin around the central conductor 1.

T字状の頭部の絶縁層2の中央両端には、凹状で円錐状の界面接続部3が設けられ、外周表面に導電性塗料を塗布して形成した接地層4が設けられている。界面接続部3には、図示しない凸状で円錐状の盤間を接続する絶縁母線が接続され、埋め金5に固定される。また、T字状の柄部の絶縁層2は沿面絶縁部となっており、露出した第2の中心導体1b端に箱体内に設けられた遮断器のような電気機器が接続される。   At both ends of the center of the insulating layer 2 of the T-shaped head, a concave and conical interface connecting portion 3 is provided, and a grounding layer 4 formed by applying a conductive paint on the outer peripheral surface is provided. The interface connecting portion 3 is connected to an insulating bus that connects between convex and conical discs (not shown), and is fixed to the buried metal 5. Further, the insulating layer 2 of the T-shaped handle portion is a creeping insulating portion, and an electrical device such as a circuit breaker provided in the box is connected to the exposed end of the second central conductor 1b.

T字状の頭部と柄部との中間部には、箱体の盤壁6が設けられ、Oリング7を介して気密が保たれるようになっている。頭部側が気中となり、柄部側が箱体内でガス中となる。なお、Oリング7が当接する絶縁層2表面には、接地層4が設けられており、ガスシールが行われる。   A box-like wall 6 is provided at an intermediate portion between the T-shaped head and the handle, and airtightness is maintained via an O-ring 7. The head side is in the air, and the handle side is in the gas inside the box. A grounding layer 4 is provided on the surface of the insulating layer 2 with which the O-ring 7 abuts, and gas sealing is performed.

ここで、図2に示すように、接地層4は、銀、銅などの導電性粉末4aにバインダーとしてエポキシ樹脂やアクリル樹脂などの接着樹脂4bを用いた導電性塗料を例えばスプレー塗装し、硬化させて形成したものである。そして、絶縁層2に近いほど接着樹脂4bよりも導電性粉末4aが多く、逆に盤壁6に当接する外表面になるほど接着樹脂4bが多くなるようにしている。   Here, as shown in FIG. 2, the ground layer 4 is formed by spraying a conductive paint using an adhesive resin 4b such as an epoxy resin or an acrylic resin as a binder on a conductive powder 4a such as silver or copper, and curing. And formed. Then, the closer to the insulating layer 2, the more conductive powder 4 a is present than the adhesive resin 4 b, and conversely, the adhesive resin 4 b increases as the outer surface comes into contact with the panel wall 6.

これは、導電性粉末4aよりも接着樹脂4bの比重が小さいことを利用し、例えば塗布した導電性塗料の硬化速度を緩やかにし、比重の大きい導電性粉末4aを絶縁層2側に沈殿させた後、硬化させている。このような硬化状態は、少なくとも盤壁6に当接する部分において形成する。   This utilizes the fact that the specific gravity of the adhesive resin 4b is smaller than that of the conductive powder 4a. For example, the curing rate of the applied conductive paint is reduced, and the conductive powder 4a having a large specific gravity is precipitated on the insulating layer 2 side. After that, it is cured. Such a hardened state is formed at least in a portion in contact with the panel wall 6.

形成方法としては、図1に記載のT形ブッシングの上下を反転して盤壁6が当接する平面部を上方向にし、導電性塗料をスプレー塗装する。この状態を保って、数10℃に設定した恒温槽に入炉し、数時間かけて緩やかに硬化させることで導電性粉末4aを沈殿させることができる。また、導電性塗料を塗布した後、常温で数時間放置し、その後加熱硬化させてもよい。   As a forming method, the T-shaped bushing shown in FIG. 1 is turned upside down so that the flat portion where the panel wall 6 abuts is directed upward, and the conductive paint is spray-coated. The conductive powder 4a can be precipitated by keeping this state and entering a thermostatic bath set to several tens of degrees Celsius and gradually curing over several hours. Further, after applying the conductive paint, it may be allowed to stand at room temperature for several hours and then cured by heating.

導電性塗料は、導電性粉末4aが60wt%、接着樹脂4bが40wt%のものを用いる。接地層4の厚さは、数100μmとする。なお、導電性粉末4aに銀を用いると粉末の大きさが数10〜数100μmで比重が約10、接着樹脂4bにエポキシ樹脂を用いると比重が約2であり、緩やかに硬化させることで、導電性粉末4aを沈殿させることができる。   As the conductive paint, the conductive powder 4a is 60 wt% and the adhesive resin 4b is 40 wt%. The thickness of the ground layer 4 is set to several 100 μm. In addition, when silver is used for the conductive powder 4a, the specific gravity is about 10 when the size of the powder is several tens to several hundreds μm, and when the epoxy resin is used for the adhesive resin 4b, the specific gravity is about 2, and by slowly curing, The conductive powder 4a can be precipitated.

これにより、接地層4aの絶縁層2側では、導電性粉末4aが多く優れた導電性を得ることができる。接地層4の電位は、埋め金5で固定される。また、接地層4の外表面では、接着樹脂4bが多く強固に接着したものとなり、特に盤壁6に当接する面ではOリング7との密着性が向上し、気密性を向上させることができる。なお、接地層4には、厚さ方向に対し、導電性の傾斜機能が付加される。   Thereby, on the insulating layer 2 side of the ground layer 4a, the conductive powder 4a is large and excellent conductivity can be obtained. The potential of the ground layer 4 is fixed by the filling 5. Further, the outer surface of the ground layer 4 has a large amount of the adhesive resin 4b firmly bonded, and particularly the surface in contact with the panel wall 6 improves the adhesion with the O-ring 7 and can improve the airtightness. . The ground layer 4 is provided with a conductive gradient function in the thickness direction.

上記実施例1の接地層付き樹脂注型品によれば、絶縁層2に近いほど導電性粉末4aが多く、逆に外表面になるほど接着樹脂4bが多くなるような接地層4を設けているので、絶縁層2側では良好な導電性が得られ絶縁層2内の電界分布を乱すことがなく、また盤壁6に当接する外表面側では強固な接着力が得られガスシール特性を向上させることができる。   According to the resin cast product with the ground layer of Example 1 described above, the ground layer 4 is provided such that the closer to the insulating layer 2, the more conductive powder 4a, and the more the adhesive resin 4b the more the outer surface. Therefore, good conductivity is obtained on the insulating layer 2 side, the electric field distribution in the insulating layer 2 is not disturbed, and a strong adhesive force is obtained on the outer surface side in contact with the panel wall 6 to improve gas sealing characteristics. Can be made.

上記実施例1では、接地層付き樹脂注型品をT形ブッシングを用いて説明したが、一方のガス室と他方のガス室とを区分する絶縁スペーサのようなガス−ガス区分するものについても用いることができる。   In the first embodiment, the resin casting with the ground layer has been described using the T-shaped bushing. However, it is also possible to classify gas-gas such as an insulating spacer that separates one gas chamber from the other gas chamber. Can be used.

次に、本発明の実施例2に係る接地層付き樹脂注型品を図3を参照して説明する。図3は、本発明の実施例2に係る接地層付き樹脂注型品の接地層を示す拡大断面図である。なお、この実施例2が実施例1と異なる点は、接地層の構成である。図3において、実施例1と同様の構成部分においては、同一符号を付し、その詳細な説明を省略する。   Next, a resin cast product with a grounding layer according to Example 2 of the present invention will be described with reference to FIG. FIG. 3 is an enlarged cross-sectional view showing a ground layer of a resin cast product with a ground layer according to Example 2 of the present invention. The second embodiment is different from the first embodiment in the configuration of the ground layer. In FIG. 3, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

図3に示すように、絶縁層2側に第1の接地層8を設け、その外周に第2の接地層9を設け、多層の接地層8、9としている。第2の接地層9には、Oリング7を介して盤壁6が当接する。   As shown in FIG. 3, a first ground layer 8 is provided on the insulating layer 2 side, and a second ground layer 9 is provided on the outer periphery of the first ground layer 8. The panel wall 6 is in contact with the second ground layer 9 through the O-ring 7.

第1の接地層8では、導電性粉末4aが多く、接着樹脂4bの少ない導電性塗料を用いている。第2の接地層9では、導電性粉末4aが第1の接地層8よりも少なく、接着樹脂4bが第1の接地層8よりも多い導電性塗料を用いている。即ち、第1の接地層8では導電性が優れ、第2の接地層9では接着力の強固なものとしている。   The first ground layer 8 uses a conductive paint with a large amount of conductive powder 4a and a small amount of adhesive resin 4b. In the second ground layer 9, a conductive paint is used in which the conductive powder 4 a is less than the first ground layer 8 and the adhesive resin 4 b is more than the first ground layer 8. That is, the first ground layer 8 has excellent conductivity, and the second ground layer 9 has a strong adhesive force.

上記実施例2の接地層付き樹脂注型品によれば、実施例1と同様の効果を得ることができる。   According to the resin cast product with the grounding layer of the second embodiment, the same effect as the first embodiment can be obtained.

本発明の実施例1に係る接地層付き樹脂注型品の構成を示す断面図。Sectional drawing which shows the structure of the resin casting product with a grounding layer which concerns on Example 1 of this invention. 本発明の実施例1に係る接地層付き樹脂注型品の接地層を示す拡大断面図。The expanded sectional view which shows the grounding layer of the resin casting product with a grounding layer which concerns on Example 1 of this invention. 本発明の実施例2に係る接地層付き樹脂注型品の接地層を示す拡大断面図。The expanded sectional view which shows the grounding layer of the resin casting product with a grounding layer which concerns on Example 2 of this invention.

符号の説明Explanation of symbols

1 中心導体
1a 第1の中心導体
1b 第2の中心導体
2 絶縁層
3 界面接続部
4 接地層
4a 導電性粉末
4b 接着樹脂
5 埋め金
6 盤壁
7 Oリング
8 第1の接地層
9 第2の接地層
DESCRIPTION OF SYMBOLS 1 Center conductor 1a 1st center conductor 1b 2nd center conductor 2 Insulating layer 3 Interface connection part 4 Ground layer 4a Conductive powder 4b Adhesive resin 5 Filling 6 Panel wall 7 O-ring 8 1st ground layer 9 2nd The ground layer

Claims (1)

中心導体と、
前記中心導体の周りに注型により形成された絶縁層と、
前記絶縁層の外周表面に銀粉末エポキシ樹脂とで構成される導電性塗料を塗布して設けられとともに、盤壁にOリングを介して当接する接地層とを備え、
前記接地層は、前記絶縁層に近いほど前記エポキシ樹脂よりも前記銀粉末が多くなるように形成されていることを特徴とする接地層付き樹脂注型品。
A central conductor;
An insulating layer formed by casting around the central conductor;
The outer peripheral surface of the insulating layer is provided by applying a conductive paint composed of silver powder and epoxy resin, and includes a grounding layer that comes into contact with the panel wall via an O-ring,
The grounding layer is formed such that the closer to the insulating layer, the larger the amount of the silver powder than the epoxy resin is.
JP2008218351A 2008-08-27 2008-08-27 Resin casting with ground layer Expired - Fee Related JP5202188B2 (en)

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JP2008218351A JP5202188B2 (en) 2008-08-27 2008-08-27 Resin casting with ground layer

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JP5202188B2 true JP5202188B2 (en) 2013-06-05

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CN119234364A (en) * 2022-05-10 2024-12-31 三菱电机株式会社 Solid insulated bus

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JPS513919B1 (en) * 1969-04-21 1976-02-06
JPS58178557U (en) * 1982-05-26 1983-11-29 株式会社明電舎 Sealing device
JPH0393417A (en) * 1989-09-04 1991-04-18 Toshiba Corp Insulation structure of gas insulated electric machine
JP2004214070A (en) * 2003-01-07 2004-07-29 Toshiba Corp SUPPORTING INSULATOR, METHOD FOR FORMING GROUND LAYER THEREOF, AND ELECTRICAL EQUIPMENT
JP2007174817A (en) * 2005-12-22 2007-07-05 Toshiba Corp Insulated busbar device and bushing
JP4886531B2 (en) * 2007-01-25 2012-02-29 株式会社東芝 Cast insulator and method of manufacturing the same

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