JP5209403B2 - Processing equipment equipped with a bite tool - Google Patents

Description

  The present invention relates to a processing apparatus including a bite tool for turning a workpiece held on a chuck table having a holding surface for holding the workpiece.

A semiconductor wafer in which a plurality of semiconductor devices are formed in a lattice shape is divided into individual semiconductor devices by a dicing apparatus or the like, and the divided semiconductor devices are widely used in electric devices such as mobile phones and personal computers.
2. Description of the Related Art In recent years, in order to reduce the weight and size of electrical equipment, a stacked device configured so that semiconductor devices can be stacked has been developed. In this laminated device, bumps (electrodes) of 50 to 100 μm are formed on the surface of a semiconductor device, and the bumps are embedded with an underfill material made of a synthetic resin such as epoxy resin or benzocyclobutene (BCB). Thereafter, the bumps of the stacked devices are configured to be connectable by exposing the bumps to the surface of the underfill material.

Thus, a processing apparatus that exposes bumps on the surface of the underfill material in which bumps (electrodes) formed on the surface of the semiconductor device are embedded is disclosed in Patent Document 1 below. The processing apparatus disclosed in Patent Document 1 includes a chuck table having a holding surface for holding a workpiece, and a turning means having a bite tool for turning the workpiece held on the chuck table. A machining feed mechanism for moving the chuck table and the turning means relative to each other in a machining feed direction in a horizontal plane parallel to the holding surface; and a notch feeding mechanism for moving the turning means in a direction perpendicular to the holding surface. And holding the semiconductor wafer on the chuck table and turning the underfill material in which the bumps formed on the surface of the semiconductor device are embedded with a bite tool, the bump (electrode) is removed from the surface of the underfill material. To expose.
Japanese Patent Application Laid-Open No. 2000-173954

  In the processing apparatus described above, if grinding scraps adhere to the holding surface of the chuck table, the semiconductor wafer held on the holding surface of the chuck table rises locally, so the height of the turned bump (electrode) There is a problem that is not complete.

In order to solve such a problem, a holding portion for holding the semiconductor wafer is formed by an outer peripheral annular holding portion formed on the outer peripheral portion, a suction recess formed on the inner side of the outer peripheral annular holding portion and communicating with the suction means, A chuck table formed by a plurality of support pins formed inside the outer peripheral annular holding portion is disclosed in Patent Document 2 below.
JP 2005-333067 A

  When the semiconductor wafer is supported by a plurality of support pins as in the chuck table disclosed in Patent Document 2, since the support area by the support pins is small, foreign matters such as dust are not sandwiched between the wafer and the wafer. Can be kept flat. On the other hand, the chuck table is mechanically strained due to aging and the upper surface of the support pin is slightly displaced. For this reason, the surface of the chuck table is turned with the above bite tool, and the heights of the support pins are made uniform. However, when the surface of the chuck table is turned to the limit of use, the chuck table must be discarded. Therefore, a nickel plating layer having a thickness of about 200 μm is formed on the surface of the chuck table including the support pins, and this plating layer is periodically formed. In particular, it is turned by several μm by a turning means equipped with the above-mentioned bite tool.

  Therefore, since the support pin has a diameter of about 1 mm and the support area on the upper surface is very small, it is difficult to directly confirm whether or not a plurality of support pins have been turned and how many μm have been turned. There is a problem that there is.

  The present invention has been made in view of the above-mentioned facts, and its main technical problem is that it has a function capable of indirectly measuring the amount of turning when turning a plurality of support pins constituting the chuck table. An object of the present invention is to provide a machining apparatus equipped with a cutting tool.

In order to solve the above main technical problem, according to the present invention, a chuck table having a holding surface for holding a workpiece and a bite tool for turning the workpiece held on the chuck table are provided. A turning means, a machining feed mechanism for moving the chuck table and the turning means in a machining feed direction in a horizontal plane parallel to the holding surface; and a turning means in a cutting feed direction perpendicular to the holding surface. A notch feed mechanism for moving,
The chuck table includes an outer peripheral annular holding portion formed on the outer peripheral portion, a suction recess formed on the inner side of the outer peripheral annular holding portion and communicating with the suction means, and a plurality of support pins formed on the inner side of the outer peripheral annular holding portion. And a plating layer serving as the holding surface is formed on the upper surfaces of the outer peripheral annular holding portion and the plurality of support pins,
The turning means includes a rotating tool, a tool tool mounting member mounted on the lower end of the rotating spindle, and a tool tool mounted on the tool tool mounting member at a position eccentric from the rotational axis. In the processing equipment
A reference member disposed adjacent to the chuck table and having the same height position as the upper surface of the outer peripheral annular holding portion and the plurality of support pins;
A turning confirmation member having a plating layer formed at the same height as the holding surface on an upper surface disposed adjacent to the chuck table and having the same height as the reference member;
A height position detecting means for detecting a height position of the upper surface of the plating layer of the turning confirmation member and the upper surface of the reference member;
There is provided a machining apparatus provided with a cutting tool characterized by the above.

The reference member and the turning confirmation member are arranged so as to be movable in the machining feed direction together with the chuck table, and are arranged on a straight line in the machining feed direction, and the height position detecting means is on the movement path of the reference member and the turning confirmation member. It is arranged.
It is desirable that four turning confirmation members are arranged at equal intervals along the outer periphery of the chuck table.
The reference member and the four turning confirmation members are arranged to be movable in the machining feed direction together with the chuck table, and two turning confirmation members and four turning confirmation members among the reference member and the four turning confirmation members. The other two turning confirmation members among the members are respectively arranged on a straight line in the machining feed direction, and the height position detecting means is the turning confirmation of two of the reference member and the four turning confirmation members. It is desirable that they are respectively disposed on the movement path of the member and on the movement paths of the other two turning confirmation members among the four turning confirmation members.

  The processing apparatus according to the present invention is provided adjacent to the chuck table, has a reference member having the same height position as the outer peripheral annular holding portion of the chuck table and the upper surfaces of the plurality of support pins, and has the same height position as the reference member. A turning confirmation member having a plating layer formed at the same height as the holding surface of the chuck table on the upper surface, and a height position detecting means for detecting the height positions of the upper surface of the plating layer of the turning confirmation member and the upper surface of the reference member; After turning the holding surface of the chuck table and the plating layer of the turning confirmation member, the height position detecting means detects the height position of the plating layer of the turning confirmation member and the upper surface of the reference member, and turning. By determining the difference between the plating layer of the check member and the height position of the upper surface of the reference member, the turning amount of the chuck table can be checked and the chuck table can be held. It is possible to make sure that is certainly turning.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a processing apparatus having a cutting tool constructed according to the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a machining apparatus having a bite tool constructed according to the present invention.
The processing apparatus in the illustrated embodiment includes an apparatus housing denoted as a whole by the number 2. The apparatus housing 2 includes a rectangular parallelepiped main portion 21 that extends elongated and an upright wall 22 that is provided at a rear end portion (upper right end in FIG. 1) of the main portion 21 and extends substantially vertically upward. Yes. A pair of guide rails 221 and 221 extending in the vertical direction are provided on the front surface of the upright wall 22. A turning unit 3 as a turning means is mounted on the pair of guide rails 221 and 221 so as to be movable in the vertical direction.

  The turning unit 3 includes a moving base 31 and a spindle unit 32 attached to the moving base 31. The movable base 31 is provided with a pair of legs 311 and 311 extending in the vertical direction on both sides of the rear surface. The pair of legs 311 and 311 is slidably engaged with the pair of guide rails 221 and 221. Guided grooves 312 and 312 are formed. A support member 313 is mounted on the front surface of the movable base 31 slidably mounted on the pair of guide rails 221 and 221 provided on the upright wall 22, and the spindle unit 32 is attached to the support member 313. It is done.

  The spindle unit 32 includes a spindle housing 321 mounted on a support member 313, a rotating spindle 322 rotatably disposed on the spindle housing 321, and a servo motor as a drive source for rotationally driving the rotating spindle 322. 323. The lower end of the rotary spindle 322 protrudes downward beyond the lower end of the spindle housing 321, and a disk-shaped tool tool mounting member 324 is provided at the lower end. The tool tool 33 is detachably mounted on the tool tool mounting member 324.

Here, the attachment / detachment structure of the cutting tool 33 to the cutting tool mounting member 324 will be described with reference to FIG.
The tool tool mounting member 324 is provided with a tool mounting hole 324a penetrating in a vertical direction in a part of the outer peripheral portion eccentric from the rotation axis, and the tool mounting is performed from the outer peripheral surface corresponding to the tool mounting hole 324a. A female screw hole 324b reaching the hole 324a is provided. The bite tool 33 is inserted into the bite mounting hole 324a of the bite tool mounting member 324 having the above-described configuration, and the tightening bolt 330 is screwed into the female screw hole 324b to be tightened. Removably attached to the. In the illustrated embodiment, the cutting tool 33 is composed of a cutting tool body 331 formed in a rod shape with tool steel such as super steel alloy, and a cutting blade formed of diamond or the like provided at the tip of the cutting tool body 331. 332 is used. The tool tool 33 configured as described above and mounted on the tool tool mounting member 324 is rotated in a horizontal plane parallel to a holding surface for holding a workpiece of a chuck table, which will be described later, by rotating the rotary spindle 322. I'm damned.

  Referring back to FIG. 1, the machining apparatus in the illustrated embodiment moves the turning unit 3 up and down along the pair of guide rails 221 and 221 (in a direction perpendicular to a holding surface of a chuck table described later). A cutting feed mechanism 4 is provided. The cutting feed mechanism 4 includes a male screw rod 41 disposed on the front side of the upright wall 22 and extending substantially vertically. The male screw rod 41 is rotatably supported by bearing members 42 and 43 whose upper end and lower end are attached to the upright wall 22. The upper bearing member 42 is provided with a pulse motor 44 as a drive source for rotationally driving the male screw rod 41, and the output shaft of the pulse motor 44 is connected to the male screw rod 41 by transmission. A connecting portion (not shown) that protrudes rearward from the center portion in the width direction is also formed on the rear surface of the movable base 31, and a through female screw hole that extends in the vertical direction is formed in the connecting portion, The male screw rod 41 is screwed into the female screw hole. Therefore, when the pulse motor 44 rotates forward, the moving base 31, that is, the turning unit 3 is lowered or advanced, and when the pulse motor 44 reversely moves, the moving base 31, that is, the turning unit 3 is raised or retracted.

  1 and FIG. 3, a substantially rectangular machining work portion 211 is formed on the rear half of the main portion 21 of the housing 2, and the machining work portion 211 includes a chuck table mechanism. 5 is disposed. The chuck table mechanism 5 includes a support base 51 and a disk-shaped chuck table 52 disposed on the support base 51 so as to be rotatable about a rotation center axis extending substantially vertically. The support base 51 slides on a pair of guide rails 23 and 23 extending in the direction indicated by the arrows 23a and 23b in the front-rear direction (the direction perpendicular to the front surface of the upright wall 22) on the processing work unit 211. The workpiece loading / unloading area 24 shown in FIG. 1 (position indicated by a solid line in FIG. 3) and the bite tool 33 constituting the spindle unit 32 are opposed to each other by a machining feed mechanism 56 described later. It is moved between the machining area 25 (position indicated by a two-dot chain line in FIG. 3).

Next, the chuck table 52 will be described with reference to FIGS.
The chuck table 52 shown in FIGS. 4 and 5 is formed in a disc shape from a metal material such as stainless steel, and an outer peripheral annular holding portion 521 is formed on the outer peripheral portion of the holding surface which is the upper surface thereof. A suction recess 522 is formed inside the outer circumferential holding portion 521, and a plurality of support pins 523 serving as internal holding portions are provided in the suction recess 522. In the illustrated embodiment, the outer peripheral annular holding portion 521 has a width of about 1 mm, and the support pin 523 has a cylindrical shape with a diameter of about 1 mm. On the upper surface of the outer peripheral annular holding portion 521 and the plurality of support pins 523 in the chuck table 52 thus configured, nickel or the like having a thickness of about 200 μm constituting a holding surface for holding the workpiece as shown in FIG. The plating layer 524 is formed.

  The suction recess 522 formed in the chuck table 52 is communicated with a suction means (not shown) via a suction passage 525. Accordingly, by operating a suction means (not shown), a negative pressure is applied to the suction recess 522 via the suction passage 525, and the workpiece placed on the holding surface is sucked and held. At this time, the workpiece is supported by the outer peripheral annular holding portion 521 and the plurality of support pins 523.

  3, the illustrated chuck table mechanism 5 includes a cover member 54 that has a hole through which the chuck table 52 is inserted and is movably disposed together with the support base 51 and the chuck table 52. I have.

  In the cover member 54, a reference member 6 having the same height as the outer peripheral annular holding portion 521 of the chuck table 52 and the upper surfaces of the plurality of support pins 523 is disposed adjacent to the chuck table 52. The reference member 6 is formed in a cylindrical shape from a metal material such as stainless steel, which is the same material as the chuck table 52.

  Further, the turning confirmation member 7 is disposed on the cover member 54 adjacent to the chuck table 52. The turning confirmation member 7 is arranged at a position where the cover member 54 can be moved to a turning range of the turning unit 3 by the cutting tool 33 of the turning unit 3. The turning confirmation member 7 is formed in a cylindrical shape by a metal material such as stainless steel which is the same material as the chuck table 52 and the reference member 6. The upper surface of the turning confirmation member 7 is formed at the same height as the upper surface of the reference member 6, and the upper surface of the turning confirmation member 7 is made of nickel or the like having a thickness of about 200 μm, like the outer peripheral annular holding portion 521 and the plurality of support pins 523. A plating layer 71 is formed. The upper surface of the plating layer 71 is set at the same height as the upper surface of the holding surface of the chuck table 52, that is, the outer peripheral annular holding portion 521 and the upper surfaces of the plurality of support pins 523. The turning confirmation member 7 and the reference member 6 are arranged on a straight line in the machining feed direction of the chuck table 52 indicated by arrows 23a and 23b.

Here, another embodiment relating to the arrangement of the turning confirmation member 7 and the reference member 6 will be described with reference to FIG.
In the embodiment shown in FIG. 6, four turning confirmation members 7 a, 7 b, 7 c, 7 d and one reference member 6 are disposed on the cover member 54. The four turning confirmation members 7 a, 7 b, 7 c, 7 d are desirably arranged at equal intervals along the outer periphery of the chuck table 52. In this case, the two turning confirmation members 7a and 7b and the reference member 6 arranged in this way are arranged on a straight line in the machining feed direction of the chuck table 52 indicated by arrows 23a and 23b, and the other two turnings. The confirmation members 7c and 7d are arranged on a straight line in the machining feed direction of the chuck table 52 indicated by arrows 23a and 23b.

  Returning to FIG. 3, the description of the processing apparatus according to the illustrated embodiment is such that the chuck table mechanism 5 moves the arrow 23 a along a pair of guide rails 23, 23 in a horizontal plane parallel to the holding surface of the chuck table 52. And a machining feed mechanism 56 that moves in the machining feed direction indicated by 23b. The processing feed mechanism 56 includes a male screw rod 561 that is disposed between the pair of guide rails 23, 23 and extends in parallel with the pair of guide rails 23, 23, and a servo motor 562 that rotationally drives the male screw rod 561. . The male screw rod 561 is screwed into a screw hole 511 provided in the support base 51, and the tip end portion thereof is rotatably supported by a bearing member 563 attached by connecting a pair of guide rails 23 and 23. ing. The servo motor 562 has a drive shaft connected to the base end of the male screw rod 561 by transmission. Accordingly, when the servo motor 562 rotates in the forward direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23a. When the servo motor 562 rotates in the reverse direction, the support base 51, that is, the chuck table mechanism 5, moves in the direction indicated by the arrow 23b. It can be moved. The chuck table mechanism 5 that is moved in the direction indicated by the arrows 23a and 23b in this manner is selectively positioned in the workpiece loading / unloading area indicated by the solid line and the machining area indicated by the two-dot chain line in FIG. Further, the chuck table mechanism 5 is reciprocated in a machining feed direction indicated by arrows 23a and 23b over a predetermined range in the machining area.

  The description will be continued with reference to FIG. 1. On both sides in the moving direction of the support base 51 constituting the chuck table mechanism 5, the cross-sectional shape is a reverse channel shape, and the pair of guide rails 23, 23 and Bellows means 71 and 72 covering the male screw rod 561 and the servomotor 562 are attached. The bellows means 71 and 72 can be formed from any suitable material such as campus cloth. The front end of the bellows means 71 is fixed to the front wall of the processing unit 211, and the rear end is fixed to the front end surface of the cover member 54 of the chuck table mechanism 5. The front end of the bellows means 72 is fixed to the rear end surface of the cover member 54 of the chuck table mechanism 5, and the rear end is fixed to the front surface of the upright wall 22 of the apparatus housing 2. When the chuck table mechanism 5 is moved in the direction indicated by the arrow 23a, the bellows means 71 is expanded and the bellows means 72 is contracted, and when the chuck table mechanism 5 is moved in the direction indicated by the arrow 23b, the bellows means. 71 is contracted and the bellows means 72 is extended.

  Continuing the description with reference to FIG. 1, the machining apparatus in the illustrated embodiment includes a height position detecting means 8 for detecting the height position of the upper surface of the reference member 6 and the upper surface of the plating layer 71 of the turning confirmation member 7. doing. The height position detector 8 includes a detector support member 81 and a height position detector 82 attached to the detector support member 81. The detector support member 81 is formed by a gate-shaped frame disposed across the movement path of the chuck table 52. The height position detector 82 is made of a micro gauge in the illustrated embodiment, and is a support portion of a detector support member 81 formed of a portal frame above the movement path of the turning confirmation member 7 and the reference member 6. 811 is disposed. As shown in FIG. 6, when four turning confirmation members 7a, 7b, 7c, 7d and one reference member 6 are arranged on the cover member 54, one height indicated by a solid line is provided. A position detector 82 is disposed above the movement paths of the two turning confirmation members 7a and 7b and the reference member 6, and two points in FIG. 1 above the movement paths of the other two turning confirmation members 7c and 7d. Another one of the height position detectors 82 is disposed as indicated by a chain line.

  The description will be continued based on FIG. 1. On the front half of the main portion 21 of the apparatus housing 2, a first cassette mounting portion 11 a, a second cassette mounting portion 12 a, and a workpiece temporary storage portion are provided. 13a and a cleaning unit 14a are provided. A first cassette 11 that accommodates a workpiece before processing is placed on the first cassette mounting portion 11a, and a workpiece after processing is accommodated on the second cassette mounting portion 12a. The second cassette 12 is placed. The workpiece temporary placement section 13a temporarily places a workpiece temporary placement means for temporarily placing the workpiece before being carried out from the first cassette 11 placed on the first cassette placement portion 11a. 13 is disposed. The cleaning unit 14a is provided with cleaning means 14 for cleaning the processed workpiece.

  A workpiece transfer means 15 is disposed between the first cassette mounting portion 11a and the second cassette mounting portion 12a. The workpiece conveying means 15 carries the workpiece before processing stored in the first cassette 11 placed on the first cassette placing portion 11 a to the workpiece temporary placing means 13. At the same time, the processed workpiece cleaned by the cleaning means 14 is transported to the second cassette 12 mounted on the second cassette mounting portion 12a. A workpiece carrying means 16 is disposed between the workpiece temporary placing portion 13a and the workpiece loading / unloading area 24. The workpiece carrying-in means 16 places the workpiece before processing placed on the workpiece temporary placing means 13 on the chuck table 52 of the chuck table mechanism 5 positioned in the workpiece carrying-in / out area 24. Transport. A workpiece unloading means 17 is disposed between the workpiece loading / unloading area 24 and the cleaning unit 14a. The workpiece unloading means 17 conveys the processed workpiece placed on the chuck table 52 positioned in the workpiece loading / unloading area 24 to the cleaning means 14.

  The workpiece before processing accommodated in the first cassette 11 includes a semiconductor wafer 10 having a plurality of devices 110 formed in a lattice shape on the surface as shown in FIG. A plurality of stud bumps (electrodes) 120 are formed on the surfaces of the plurality of devices 110 formed on the semiconductor wafer 10. The stud bumps (electrodes) 120 on the surface of each device 110 are thus formed, and the surface of the semiconductor wafer 10 is covered with an underfill material 130 made of a synthetic resin as shown in FIG. Is buried.

  The first cassette 11 containing the semiconductor wafer 10 as the workpiece is mounted on the first cassette mounting portion 11 a of the apparatus housing 2. When all the unprocessed semiconductor wafers 10 accommodated in the first cassette 11 placed on the first cassette placement portion 11a are carried out, a plurality of empty wafers 11 are replaced. A new cassette 11 containing the unprocessed semiconductor wafer 10 is manually mounted on the first cassette mounting portion 11a. On the other hand, when a predetermined number of processed semiconductor wafers 10 are loaded into the second cassette 12 mounted on the second cassette mounting portion 12a of the apparatus housing 2, the second cassette 12 is manually unloaded. Then, a new empty second cassette 12 is placed.

The processing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.
The unprocessed semiconductor wafer 10 as a workpiece accommodated in the first cassette 11 is conveyed by the vertical movement and advancing / retreating operation of the workpiece conveyance means 15 and placed on the workpiece temporary placement means 13. The semiconductor wafer 10 placed on the workpiece temporary placement means 13 is positioned in the workpiece loading / unloading area 24 by the turning operation of the workpiece loading means 16 after being centered here. It is placed on the chuck table 52 of the table mechanism 5. When the semiconductor wafer 10 is placed on the chuck table 52, the semiconductor wafer 10 placed on the holding surface which is the upper surface of the chuck table 52 is sucked and held by operating a suction means (not shown).

  When the semiconductor wafer 10 is sucked and held on the chuck table 52, the machining feed mechanism 56 (see FIG. 3) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck table holding the semiconductor wafer 10 is held. 52 is positioned in the machining area 25. When the chuck table 72 holding the semiconductor wafer 10 is positioned in the processing region 25 in this way, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned and formed on the surface of the semiconductor chip 110. A turning process of exposing a plurality of stud bumps (electrodes) 120 to the surface of the underfill material 130 is performed.

The turning process will be described with reference to FIG.
In the turning process, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached is rotated at a rotational speed of, for example, 6000 rpm in the direction indicated by the arrow in FIG. Then, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Next, for example, when the turning width of the cutting edge 332 of the cutting tool 33 is 20 or more μm, the chuck table mechanism 5 holding the semiconductor wafer 10 is moved to the right from the position indicated by the solid line in FIG. It moves to the position shown in FIG. 9B at a feed rate of 2 mm / sec. As a result, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned by the cutting edge 332 of the cutting tool 33 rotating with the rotation of the cutting tool mounting member 324, and formed on the surface of the semiconductor device 110. A plurality of stud bumps (electrodes) 120 are turned, and the stud bumps (electrodes) 120 are exposed on the surface of the underfill material 130 coated on the surface of the semiconductor wafer 10 as shown in FIG.

  As described above, the underfill material 130 coated on the surface of the semiconductor wafer 10 is turned, and a plurality of stud bumps (electrodes) 120 formed on the surface of the semiconductor chip 110 are exposed to the surface of the underfill material 130. When the process is finished, the turning unit 3 is raised. Next, the chuck table 52 is moved in the direction indicated by the arrow 23b in FIG. 1 to be positioned in the workpiece loading / unloading area 24, and the suction holding of the turned semiconductor wafer 10 on the chuck table 52 is released. Then, the semiconductor wafer 10 whose suction and holding by the chuck table 52 is released is carried out by the workpiece carrying-out means 17 and conveyed to the cleaning means 14. The semiconductor wafer 10 conveyed to the cleaning means 14 is cleaned here. The semiconductor wafer 10 cleaned by the cleaning unit 14 is stored in a predetermined position of the second cassette 12 by the workpiece transfer unit 15.

  As described above, when the semiconductor wafer 10 is sucked and held on the holding surface which is the upper surface of the chuck table 52 and the turning process is repeatedly performed, mechanical strain is generated in the plurality of support pins 523 constituting the holding surface of the chuck table 52. As a result, the top surface is uneven. Therefore, a chuck table turning process is performed in which the outer peripheral annular holding portion 521 constituting the holding surface of the chuck table 52 and the plating layer 524 of the plurality of support pins 523 are periodically turned by the turning unit 3 as the turning means. The chuck table turning process will be described with reference to FIG.

  In the chuck table turning process, first, the machining feed mechanism 56 (see FIG. 3) is operated to move the chuck table mechanism 5 in the direction indicated by the arrow 23a, and the chuck table mechanism 5 is indicated by a solid line in FIG. Position it in the machining area. Then, the rotary spindle 322 is driven to rotate, and the tool tool mounting member 324 to which the tool tool 33 is attached is rotated in the direction indicated by the arrow in FIG. Next, the turning unit 3 is lowered to position the cutting tool 33 at a predetermined cutting position. Then, the chuck table mechanism 5 is moved rightward from the state shown in FIG. 11A to a position shown in FIG. 11B at a feed rate of 2 mm / second, for example. As a result, the outer peripheral annular holding portion 521 constituting the chuck table 52 and the plating layer 524 formed on the upper surfaces of the plurality of support pins 523 are formed by the cutting edge 332 of the cutting tool 33 rotating as the cutting tool mounting member 324 rotates. It is turned and the height of the holding surface which is the upper surface is made uniform. It should be noted that the depth for turning the plating layer 525 may be about 5 μm. At this time, the plating layer 71 formed on the upper surface of the turning confirmation member 7 is also turned. Accordingly, the upper surface height position of the plating layer 71 formed on the upper surface of the turning confirmation member 7 and the upper surface height of the plating layer 525 formed on the upper surfaces of the outer peripheral annular holding portion 521 and the plurality of support pins 523 constituting the chuck table 52. The height position is the same height position. The reference member 6 includes a plating layer 524 having an upper surface formed on the upper surface of the support pin 523, an outer peripheral annular holding portion 521 constituting the chuck table 52, and a plating layer 525 formed on the upper surfaces of the plurality of support pins 523. Since it is low, it is not turned in the chuck table turning process.

  If the chuck table turning process is performed as described above, the outer peripheral annular holding portion 521 constituting the chuck table 52 and the plating layer 524 formed on the upper surfaces of the plurality of support pins 523 have been reliably turned, and what A turning confirmation process is performed to confirm whether or not μm has been turned. This turning confirmation process will be described with reference to FIG.

  The chuck table mechanism 5 is moved to the left from the state where the chuck table turning process shown in FIG. 11B is completed, and the reference member 6 is moved to the height position detecting means 8 as shown in FIG. It is positioned directly below the height position detector 82. Then, the height position detector 82 made of a micro gauge is operated to bring the detector 821 into contact with the upper surface of the reference member 6, whereby the upper surface height position of the reference member 6 can be detected.

  Next, the chuck table mechanism 5 is moved to the left from the state of FIG. 12 (a), and the turning confirmation member 7 is moved to a height position detector 8 as shown in FIG. 12 (b). Position directly below 82. Then, the height position detector 82 made of a micro gauge is operated to bring the detector 821 into contact with the upper surface of the plating layer 71 formed on the upper surface of the turning confirmation member 7, thereby forming the upper surface of the turning confirmation member 6. Further, the height position of the upper surface of the plated layer 71 can be detected. When four turning confirmation members 7a, 7b, 7c, and 7d are provided as shown in FIG. 6, the upper surface height position is detected for each of the four turning confirmation members 7a, 7b, 7c, and 7d. To do. That is, the height position detector 82 shown by the solid line in FIG. 1 detects the upper surface height position of the plating layer formed on the upper surfaces of the turning confirmation members 7a and 7b, and the height position detection shown by the two-dot chain line in FIG. The upper surface of the plating layer formed on the upper surfaces of the turning confirmation members 7c and 7d is detected by the device 82. In the above-described embodiment, the chuck table, the reference member 6, and the turning confirmation member 7 are formed of the same member, and are formed on the upper surfaces of the outer peripheral annular holding portion 521 and the plurality of support pins 523 constituting the chuck table 52. Since the plating layer 524 and the plating layer 71 formed on the upper surface of the turning confirmation member 7 are formed of the same member, the relative relationship is maintained even if they are expanded, so that the amount of turning can be detected reliably. can do.

  As described above, the upper surface of the turning confirmation member 7 which is turned together with the height position of the upper surface of the reference member 6 and the outer peripheral annular holding portion 521 constituting the chuck table 52 and the plating layer 524 formed on the upper surfaces of the plurality of support pins 523. When the upper surface height position of the plating layer 71 formed on the upper surface is detected, the difference between the upper surface height position of the turning confirmation member 7 and the upper surface height position of the reference member 6 is obtained, thereby the chuck table turning step. The amount of turning of the outer peripheral annular holding portion 521 constituting the holding surface of the chuck table 52 that has been turned and the plating layer 525 formed on the upper surfaces of the plurality of support pins 523 can be indirectly checked. It can be confirmed that the holding surface is reliably turned. As shown in FIG. 6, four turning confirmation members 7a, 7b, 7c, 7d are arranged at equal intervals along the outer periphery of the chuck table 52, and the four turning confirmation members 7a, 7b, 7c, By detecting the upper surface height position of 7d, the turning state of the entire region of the chuck table 52 can be indirectly confirmed.

  When performing the turning confirmation process, before the chuck table turning process, the height position of the upper position of the turning confirmation member 7 and the upper surface height position of the reference member 6 are set to the height of the height position detecting means 8. After detecting the position by the position detector 82 and performing the chuck table turning process, the turning confirmation member 7 is detected by detecting the upper surface height position of the turning confirmation member 7 and the upper surface height position of the reference member 6 as described above. The amount of turning of the plating layer 71 formed on the upper surface of the plate can be accurately confirmed.

  If the turning confirmation process described above is performed periodically and the difference between the upper surface height position of the plating layer 71 formed on the upper surface of the turning confirmation member 7 and the upper surface height position of the reference member 6 reaches, for example, 20 μm. Then, a metal such as nickel is plated on the upper surfaces of the outer peripheral annular holding portion 521 and the plurality of support pins 523 constituting the holding surface of the chuck table 52, and the plating layer is made 200 μm again. Similarly, a metal such as nickel is plated on the upper surface of the turning confirmation member 7 so that the plating layer is 200 μm again.

The perspective view of the processing apparatus provided with the bite tool comprised according to this invention. The perspective view of the turning unit with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. The perspective view which shows the chuck | zipper table mechanism with which the processing apparatus provided with the cutting tool shown in FIG. The perspective view of the chuck table with which the processing apparatus provided with the cutting tool shown in FIG. 1 is equipped. The expanded sectional view of the chuck table shown in FIG. Explanatory drawing regarding arrangement | positioning of the turning confirmation member and reference | standard member with which the processing apparatus provided with the bite tool shown in FIG. 1 is equipped. The top view of the semiconductor wafer as a to-be-processed object. Sectional drawing which expands and shows the principal part of the semiconductor wafer shown in FIG. Explanatory drawing of the turning process by the processing apparatus provided with the cutting tool shown in FIG. Sectional drawing which expands and shows the principal part of the semiconductor wafer turned by the processing apparatus provided with the cutting tool shown in FIG. Explanatory drawing of the chuck table turning process implemented by the processing apparatus provided with the cutting tool shown in FIG. Explanatory drawing of the turning confirmation process implemented by the processing apparatus provided with the cutting tool shown in FIG.

Explanation of symbols

2: Device housing 3: Grinding unit 31: Moving base 32: Spindle unit 321: Spindle housing 322: Rotary spindle 323: Servo motor 324, 325: Tool mounting member 33: Tool tool 331: Tool body 332: Cutting blade 4: Turning unit feed mechanism 5: Chuck table mechanism 51: Support base 52: Chuck table 521: Peripheral annular holding portion 523: Plural support pins 54: Cover member 56: Work feed mechanism 6: Reference member 7: Turning confirmation member 8: Height position detecting means 81: Detector support member 82: Height position detector 11: First cassette 12: Second cassette 13: Temporary workpiece placing means 14: Cleaning means 15: Workpiece conveying means 16 : Workpiece carry-in means 17: Workpiece carry-out means 10: Semiconductor wafer 111: Electrode 120: bump (electrode)
130: Underfill material

Claims (4)

A chuck table having a holding surface for holding a workpiece, a turning means having a bite tool for turning the workpiece held on the chuck table, and holding the chuck table and the turning means A machining feed mechanism that relatively moves in a machining feed direction in a horizontal plane parallel to the surface, and a cutting feed mechanism that moves the turning means in a cutting feed direction perpendicular to the holding surface,
The chuck table includes an outer peripheral annular holding portion formed on the outer peripheral portion, a suction recess formed on the inner side of the outer peripheral annular holding portion and communicating with the suction means, and a plurality of support pins formed on the inner side of the outer peripheral annular holding portion. And a plating layer serving as the holding surface is formed on the upper surfaces of the outer peripheral annular holding portion and the plurality of support pins,
The turning means includes a rotating tool, a tool tool mounting member mounted on the lower end of the rotating spindle, and a tool tool mounted on the tool tool mounting member at a position eccentric from the rotational axis. In the processing equipment
A reference member disposed adjacent to the chuck table and having the same height position as the upper surface of the outer peripheral annular holding portion and the plurality of support pins;
A turning confirmation member having a plating layer formed at the same height as the holding surface on an upper surface disposed adjacent to the chuck table and having the same height as the reference member;
A height position detecting means for detecting a height position of the upper surface of the plating layer of the turning confirmation member and the upper surface of the reference member;
A processing apparatus having a bite tool characterized by the above.   The reference member and the turning confirmation member are disposed so as to be movable in the machining feed direction together with the chuck table, and are arranged on a straight line in the machining feed direction. The height position detecting means is configured to detect the reference member and the turning. The processing apparatus provided with the cutting tool according to claim 1, which is disposed on a moving path of the confirmation member.   The machining device with a bite tool according to claim 1, wherein four turning confirmation members are arranged at equal intervals along the outer periphery of the chuck table.   The reference member and the four turning confirmation members are disposed together with the chuck table so as to be movable in the machining feed direction, the reference member and two turning confirmation members of the four turning confirmation members, and the 4 The other two turning confirmation members among the turning confirmation members are respectively arranged on a straight line in the machining feed direction, and the height position detection means includes the reference member and the four turning confirmation members. The bite tool according to claim 3, wherein the tool is disposed on a movement path of two of the turning confirmation members, and on a movement path of the other two turning confirmation members of the four turning confirmation members. A processing device with

Images