JP5218684B2 - Sensor chip mounting structure - Google Patents

Description

  The present invention relates to a sensor chip mounting structure.

  Conventionally, as a technique related to the sensor chip mounting structure, for example, there is a pressure sensor disclosed in Patent Document 1 below. The pressure sensor includes a sensor chip that outputs an electrical signal corresponding to the pressure received at the pressure receiving surface, and the sensor chip is interposed via a bump with the pressure receiving surface facing one surface of the wiring board. It is flip-chip bonded to the wiring board. Then, in order to seal the bump joint including the bump, the electrode of the sensor chip connected to the bump, and the electrode of the wiring board, a resin material serving as an insulating member is applied to the joint of the bump. An insulating member is formed by curing.

JP 2006-177925 A

  By the way, the wiring board to which the sensor chip is fixed employs a board having a high elastic modulus and little deformation, for example, a ceramic board, in order to reduce stress transmission to the sensor chip. However, as the accuracy of the sensor increases, even a slight stress transmitted from the wiring board to the sensor chip, such as a thermal stress caused by a difference in thermal expansion between the sensor chip and the wiring board, has become a problem.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a sensor chip mounting structure that can prevent transmission of stress to the sensor chip.

In order to achieve the above object, in the sensor chip mounting structure according to claim 1, the sensor chip (20, 20a, 20b, 20c) is attached to the mounted member (30, 30a, 30b, 30c, 30d). , 30e, 30f), a magnetic fluid (40, 40a, 40b, 40c) interposed between the sensor chip and the mounted member, and the sensor chip by its surface tension. and magnetic fluid capable of holding, the said ferrofluid and the magnetic force generating means for generating a magnetic force to magnetically adsorbed to the mounting member (33,34,37,38a~38f), comprises a front Symbol sensor chip, magnetic A technical feature is that the entire surface of the fluid side is held by the surface tension of the magnetic fluid without contacting the attached member.

According to the first aspect of the present invention, the sensor chip is held by the surface tension of the magnetic fluid without contacting the attached member over the entire surface on the magnetic fluid side, and this magnetic fluid is generated from the magnetic force generating means on the attached member. It is magnetically attracted by the applied magnetic force . As this, the sensor chip is for mounted without contacting the mounting member via the magnetic fluid, even the mounting member is deformed by thermal stress or the like, the stress corresponding to the deformation is transmitted to the sensor chip It never happens.
Therefore, transmission of stress to the sensor chip can be prevented.

In the invention of claim 2, the magnetic force generating means is a magnetic powder contained in the attached member. This eliminates the need to insert-mold the permanent magnet and the magnetic force generating coil on the attached member, thereby reducing the manufacturing cost.

According to a third aspect of the present invention, the magnetic force generating means is a magnetic force adjusting means provided on the attached member and capable of adjusting the generated magnetic force . Thus, by adopting a magnetic force adjusting means capable of adjusting the magnetic force generated as the magnetic force generating means, for example, a magnetic force generating coil, a magnetic force for magnetically attracting the magnetic fluid can be generated as needed. . In addition, when a permanent magnet is insert-molded on a member to be attached, such as a wiring board, the permanent magnet is exposed to a high temperature at the time of insert molding, so the magnetism of the permanent magnet may be lost, making molding difficult. It is. On the other hand, if it is a coil for magnetic force generation, since magnetism will not be lost even if it is exposed to high temperature at the time of insert molding, insert molding can be performed easily.

In the invention of claim 4 , the sensor chip and the connection terminal provided on the attached member are electrically connected by flexible wiring. Thereby, even if the sensor chip does not deform following the deformation of the attached member due to thermal stress or the like, the electrical connection between the sensor chip and the connection terminal provided on the attached member can be reliably maintained.

In the invention of claim 5 , the plurality of connection terminals of the sensor chip face the connection terminals scheduled to be connected among the plurality of connection terminals of the attached member. Then, a plurality of magnetic fluids are interposed between each connection terminal so as to electrically connect the connection terminal of the sensor chip and the connection terminal of the attached member to be connected to the connection terminal. A plurality of magnetic force generating means are provided on the attached member so that the separated magnetic fluid is interposed between the connection terminals.

  In this way, each connection terminal of the sensor chip and each connection terminal of the mounted member to be connected are electrically connected to each other by the magnetic fluid, so that no connection work is required, and therefore stress on the sensor chip Can be prevented, and the manufacturing cost can be reduced.

In the sixth aspect of the present invention, a plurality of concave grooves are formed so as to be separated from each other at each portion of the surface of the attached member from which each connection terminal protrudes. Thus, as in the invention described in claim 5, the magnetic fluid is connected between each connection terminal so as to electrically connect the connection terminal of the sensor chip and the connection terminal of the mounted member corresponding to this connection terminal. When a plurality of magnetic fluids are interposed each time, each magnetic fluid is magnetically attracted while being positioned so as to flow into a plurality of concave grooves formed so as to be separated from each other. Thereby, the short circuit between each magnetic fluid can be prevented reliably.

In the invention of claim 7, the plurality of connection terminals of the sensor chip respectively oppose the connection terminal scheduled to be connected among the plurality of connection terminals of the attached member. A plurality of magnetic force adjusting means are provided on the attached member for each connection terminal of the attached member. Then, the magnetic fluid electrically connects the connection terminal of the mounted member corresponding to the magnetic force adjusting means that generates the magnetic force among the magnetic force adjusting means and the connection terminal of the sensor chip to be connected to the connection terminal. Between the two connection terminals.

  For this reason, only the magnetic force adjusting means corresponding to the connection terminal that performs electrical connection generates magnetic force, so that the magnetic fluid moves and intervenes between the connection terminals to be connected. Connection can be switched. The magnetic fluid interposed between the connection terminals that are electrically connected can hold the sensor chip and prevent stress from being transmitted to the sensor chip. In particular, for example, when a sensor chip having two or more functions such as a pressure sensor function and a temperature sensor function is used, only a predetermined detection signal among a plurality of detection signals is output from the sensor chip. This is effective because the electrical connection can be selectively switched.

According to an eighth aspect of the present invention, the magnetic force generating means is a magnetic substrate provided on a contact surface of the attached member that contacts the magnetic fluid . When a permanent magnet or magnetic powder is used as the magnetic force generating means, the permanent magnet or magnetic powder is exposed to a high temperature during insert molding, so that magnetism may be lost, and molding is difficult. On the other hand, by adopting a magnetic substrate, the magnetism is not lost because it is not exposed to a high temperature during insert molding.

According to the ninth aspect of the present invention, at least one of the contact surface of the sensor chip that contacts the magnetic fluid and the contact surface of the mounted member that contacts the magnetic fluid is formed so as to have a large contact area. As a result, when the contact surface of the sensor chip that contacts the magnetic fluid is increased, the holding force of the sensor chip due to the surface tension of the magnetic fluid increases, so that the sensor chip can be reliably held by the magnetic fluid. In addition, when the contact surface of the mounted member that contacts the magnetic fluid is increased, the attracting force to the mounted member due to the surface tension of the magnetic fluid is increased, so that the magnetic fluid is reliably attracted to the mounted member. I'm going.

According to a tenth aspect of the present invention, there is provided a magnetic force generating means for adsorbing dust that generates a magnetic force capable of adsorbing dust around the sensor chip in a portion of the attached member that is separated from the magnetic force generating means. Thereby, the dust around the sensor chip is magnetically adsorbed by the magnetic force of the magnetic force generating means for adsorbing dust, so that it is possible to prevent the dust from adhering to the sensor chip due to the magnetic force of the magnetic force generating means. Further, since the magnetic force generating means for dust adsorption is arranged away from the magnetic force generating means, the magnetic fluid that holds the sensor chip is not affected by the magnetic force generated by the magnetic force generating means for dust adsorption.

In the invention of claim 11, the magnetic force generating means for adsorbing dust is a permanent magnet. As described above, a magnetic force for magnetically adsorbing dust by a permanent magnet may be generated as the magnetic force generating means for adsorbing dust.

In a twelfth aspect of the present invention, the dust adsorption magnetic force generating means is a dust adsorption magnetic force adjusting means. Thus, by adopting a dust adsorption magnetic force adjusting means, for example, an electromagnet or a magnetic force generation coil, as the dust adsorption magnetic force generating means, it is possible to generate a magnetic force for magnetically adsorbing dust as required. .

In a thirteenth aspect of the present invention, a magnetic film is provided on the contact surface of the sensor chip that contacts the magnetic fluid. Thus, by providing the magnetic film on the contact surface of the sensor chip that contacts the magnetic fluid, the magnetic film is magnetically adsorbed by the magnetic force generated by the magnetic force generating means, so that the sensor chip is held via the magnetic fluid. The power can be increased.

  Further, when electrically connecting the connection terminal of the sensor chip and the connection terminal of the attached member, the magnetic film of the sensor chip is directly magnetically attracted to the attached member by using the magnetic force generated by the magnetic force generating means. This eliminates the need for a mounting jig for fixing the sensor chip to the mounted member when the connection terminal is connected, thereby improving workability.

In the invention of claim 14, said force adjusting means, Ru provided more to the attached member such that the sensor chip holding through a magnetic attraction by the magnetic fluid by the magnetic force respectively positioned in the desired measurement position.

  In this way, by generating a magnetic force only in the magnetic force adjusting means corresponding to the desired measurement position, the magnetic fluid holding the sensor chip is magnetically attracted by the magnetic force of the magnetic force adjusting means so as to move to the desired measurement position. The Accordingly, transmission of stress to the sensor chip can be prevented, and the measurement position by the sensor chip can be arbitrarily moved by selectively changing the position of the sensor chip with respect to the attached member.

It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 1st Embodiment. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 2nd Embodiment. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 3rd Embodiment. FIG. 4A is a schematic cross-sectional view showing a sensor chip mounting structure according to a fourth embodiment, and FIG. 4A is a cross-sectional view showing a state in which a magnetic force is generated from the magnetic force generating coils 38a and 38b. B) is a cross-sectional view showing a state in which a magnetic force is generated from the magnetic force generating coils 38a and 38c. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 5th Embodiment. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 6th Embodiment. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 7th Embodiment. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 8th Embodiment. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 9th Embodiment. It is a schematic sectional drawing which shows the attachment structure of the sensor chip which concerns on 10th Embodiment.

Hereinafter, embodiments of a sensor chip mounting structure of the present invention will be described with reference to the drawings.
[First Embodiment]
A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a schematic cross-sectional view showing a sensor chip mounting structure according to the first embodiment.
The sensor 10 is, for example, a pressure sensor, and is mounted on an automobile to detect air pressure in a predetermined space. The sensor 10 mainly includes a sensor chip 20 and a sensor chip 20 for mounting the sensor chip 20. It is comprised from the to-be-attached member 30 which is a member, the magnetic fluid 40 etc. which intervene between the sensor chip 20 and the to-be-attached member 30.

  The sensor chip 20 receives an electrical signal corresponding to the pressure received by the pressure receiving surface 21 formed on one side surface (the lower surface in FIG. 1) via a plurality of connection terminals 22 provided on the periphery on the pressure receiving surface 21 side. Output.

  The attached member 30 is a case for attaching the sensor chip 20 to a position corresponding to a predetermined measurement position, but may be a wiring board, for example.

  Each connection terminal 22 of the sensor chip 20 is electrically connected to a connection portion 32 a of a plurality of pins 32 protruding as a connection terminal from the chip side surface 31 on the sensor chip side of the attached member 30 by a flexible wiring 50. In FIG. 1, for convenience, a set of connection terminals 22 and pins 32 are shown connected by a flexible wiring 50.

  As shown in FIG. 1, the attached member 30 is provided with a permanent magnet 33 embedded in the vicinity of the chip side surface 31, and the permanent magnet 33 magnetically attracts the magnetic fluid 40. Generating power. In addition, when the detection signal output via each pin 32 is affected by noise or the like due to the magnetic force generated by the magnetic force generating means such as the permanent magnet 33, for example, each pin 32 has a process for preventing noise. May be performed.

  The magnetic fluid 40 is configured, for example, by dispersing magnetic particles such as iron oxide in a liquid such as water. In the first embodiment, the magnetic fluid 40 is fixed to the chip side surface 31 of the mounted member 30 by magnetic adsorption by the permanent magnet 33 of the mounted member 30. The sensor chip 20 has a surface on the side opposite to the surface on which the pressure-receiving surface 21 is formed (the upper surface in FIG. 1, hereinafter also referred to as a magnetic fluid side surface 23) and the magnetic fluid 40 due to the surface tension of the magnetic fluid 40. 40 is held and fixed. Thereby, even if the attached member 30 which is the attached member to which the sensor chip 20 is attached is deformed by thermal stress or the like, the stress corresponding to this deformation is not transmitted to the sensor chip 20.

Hereinafter, the attachment procedure of the sensor chip 20 in the sensor 10 configured as described above will be described.
First, after manufacturing the to-be-attached member 30 provided with the permanent magnet 33 and each pin 32 by insert molding, the flexible wiring 50 corresponding to the connection part 32a of each pin 32, for example, ultrasonic bonding, thermocompression bonding, etc. The connection is reinforced with an appropriate reinforcing agent. Next, the sensor chip 20 is fixed by a mounting jig (not shown) so as to form a predetermined gap between the magnetic fluid side surface 23 and the chip side surface 31 of the mounted member 30. Then, each connection terminal 22 of the sensor chip 20 is electrically connected to the flexible wiring 50 connected to the pin 32 to be connected.

  Then, the magnetic fluid 40 is injected into a gap formed between the magnetic fluid side surface 23 of the sensor chip 20 and the chip side surface 31 of the attached member 30. At this time, the magnetic fluid 40 is injected along both surfaces between the magnetic fluid side surface 23 and the chip side surface 31 by capillary action. As a result, the magnetic fluid 40 is interposed between the sensor chip 20 and the attached member 30. And the sensor 10 comprised in this way is fixed to a predetermined position by caulking to a housing not shown via an O-ring or the like. In addition, as shown in FIG. 1, the test | inspection space in which the sensor chip 20 exists, and other space are covered by covering the site | part which protrudes from the chip | tip side surface 31 of each pin 32 with the magnetic fluid 41 which is a part of magnetic fluid 40. It may be sealed so as to eliminate the communication.

  In addition, while the sensor chip 20 is disposed on the upper side with respect to the mounted member 30 and the magnetic fluid side surface 23 of the sensor chip 20 and the chip side surface 31 of the mounted member 30 are in contact with each other, Forty injection operations may be performed. In the case of this injection work, even if the magnetic fluid side surface 23 and the chip side surface 31 are in contact with each other, the magnetic fluid 40 is injected so as to enter between both surfaces by capillary action. Thereby, the magnetic fluid 40 can be interposed between the sensor chip 20 and the mounted member 30 without using the mounting jig described above.

As described above, in the mounting structure of the sensor chip 20 according to the first embodiment, the sensor chip 20 is held by the surface tension of the magnetic fluid 40, and the magnetic fluid 40 is a mounted member that is a mounted member. The member 30 is magnetically attracted by the magnetic force generated from the permanent magnet 33. Thus, since the sensor chip 20 is attached to the attached member 30 via the magnetic fluid 40, even if the attached member 30 is deformed by thermal stress or the like, the stress corresponding to the deformation is transmitted to the sensor chip 20. It never happens.
Therefore, transmission of stress to the sensor chip 20 can be prevented.

  In the mounting structure of the sensor chip 20 according to the first embodiment, each connection terminal 22 of the sensor chip 20 and each pin 32 of the mounted member 30 are electrically connected by the flexible wiring 50. Thereby, even when the sensor chip 20 does not deform following the deformation of the mounted member 30 due to thermal stress or the like, the electrical connection between the sensor chip 20 and the mounted member 30 can be reliably maintained.

[Second Embodiment]
Next, a sensor chip mounting structure according to a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20 according to the second embodiment.
In the sensor 10 employing the mounting structure of the sensor chip 20 according to the second embodiment, FIG. 2 shows a magnetic force adjusting means capable of adjusting the generated magnetic force instead of the permanent magnet 33 described in the first embodiment. The point which employ | adopts the coil 34 for magnetic force generation shown differs from the attachment structure of the sensor chip 20 which concerns on the said 1st Embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 2, the magnetic force generating coil 34 is insert-molded in the attached member 30, for example, and is configured to be able to generate a magnetic force according to an electric current supplied from the outside.

  In the mounting structure of the sensor chip 20 according to the second embodiment configured as described above, a magnetic fluid generating coil 34 is employed as a magnetic force adjusting means capable of adjusting the generated magnetic force, so that a magnetic fluid can be used as necessary. A magnetic force for magnetically adsorbing 40 can be generated. Further, when the permanent magnet 33 of the first embodiment is insert-molded on the attached member 30, the permanent magnet 33 is exposed to a high temperature at the time of insert molding, so the magnetism of the permanent magnet 33 may be lost. It is difficult to mold. On the other hand, if the magnetic force generating coil 34 is exposed to a high temperature during the insert molding, the magnetism is not lost, and therefore the insert molding can be easily performed.

[Third Embodiment]
Next, a sensor chip mounting structure according to a third embodiment of the present invention will be described with reference to FIG. FIG. 3 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20a according to the third embodiment. In FIG. 3, for convenience, two sets of connection terminals 22 and pins 35 are shown connected by magnetic fluids 40.

  In the sensor 10 that employs the mounting structure of the sensor chip 20a according to the third embodiment, the sensor chip 20a and the mounted member 30a are employed instead of the sensor chip 20 and the mounted member 30 described in the first embodiment. In addition, the point that the flexible wiring 50 is abolished is different from the mounting structure of the sensor chip 20 according to the first embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 3, the sensor chip 20 a differs from the sensor chip 20 in the first embodiment in that each connection terminal 22 is provided on the magnetic fluid side surface 23.

  When the sensor chip 20a is attached to the attached member 30a via the magnetic fluid 40, the plurality of pins 35 that are connection terminals of the attached member 30a are opposed to the connection terminals 22 of the sensor chip 20a to be connected. They are arranged (see FIG. 3). On the chip side surface 31 of the mounted member 30a, a concave groove 36 is formed for each pin 35 so as to be separated from each other, and each pin 35 is formed so as to protrude to the center in the corresponding groove 36. Yes. In the vicinity of each groove 36, permanent magnets 37 are respectively provided so as to penetrate the corresponding pins 35.

  The magnetic fluid 40 is separated and magnetically attracted to the vicinity of each groove 36 by the magnetic force generated by each permanent magnet 37. The magnetic fluid 40 separated as described above holds the sensor chip 20a in the vicinity of each connection terminal 22 by the respective surface tension. Thereby, each connection terminal 22 and the corresponding pin 35 are electrically connected by the separated magnetic fluid 40, respectively.

  In the mounting structure of the sensor chip 20a according to the third embodiment configured as described above, each connection terminal 22 of the sensor chip 20a faces the pin 35 of the mounted member 30a to be connected. The magnetic fluid 40 is separated for each connection terminal so as to electrically connect the connection terminals 22 of the sensor chip 20a and the pins 35 of the attached member 30a to be connected to the connection terminals 22. There are several. A plurality of permanent magnets 37 as magnetic force generating means are provided in the vicinity of each groove 36 of the attached member 30a according to the pin 35 so that a plurality of separated magnetic fluids 40 are interposed between the connection terminals, respectively. ing.

  As described above, each connection terminal 22 of the sensor chip 20a and each pin 35 of the attached member 30a to be connected are electrically connected by the separated magnetic fluids 40, so that connection work is not required. As a result, the transmission of stress to the sensor chip 20a can be prevented and the manufacturing cost can be reduced.

  Further, in the mounting structure of the sensor chip 20a according to the third embodiment, a plurality of concave grooves 36 are formed so as to be separated from each other in each portion of the chip side surface 31 of the mounted member 30a where each pin 35 protrudes. Yes. As a result, a plurality of magnetic fluids 40 are separately provided between the connection terminals so as to electrically connect the connection terminals 22 of the sensor chip 20a and the pins 35 of the attached member 30a to be connected. In this case, the separated magnetic fluids 40 are magnetically attracted while being positioned so as to flow into a plurality of concave grooves 36 formed so as to be separated from each other. Thereby, the short circuit between each magnetic fluid 40 can be prevented reliably.

[Fourth Embodiment]
Next, a sensor chip mounting structure according to a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20a according to the fourth embodiment, and FIG. 4A is a cross-sectional view showing a state in which a magnetic force is generated from the magnetic force generating coils 38a and 38b. FIG. 4B is a cross-sectional view showing a state in which a magnetic force is generated from the magnetic force generating coils 38a and 38c. 4 shows a state in which any two of the three sets of connection terminals (22a to 22c) and pins (35a to 35c) are connected by magnetic fluid (40a to 40c) for convenience.

  In the sensor 10 adopting the attachment structure of the sensor chip 20a according to the fourth embodiment, the attachment member 30b is used instead of the attachment member 30a described in the third embodiment. Different from the mounting structure of the sensor chip 20 according to the third embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20a of the third embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  As shown in FIGS. 4A and 4B, when the sensor chip 20a is attached to the attached member 30b via the magnetic fluid 40, the plurality of pins 35a to 35c, which are connection terminals of the attached member 30b, are attached. These are arranged so as to face the connection terminals 22a to 22c of the sensor chip 20a to be connected. The chip side surface 31 of the attached member 30b is provided with a concave groove 36a formed so as to be wider than the magnetic fluid side surface 23 of the sensor chip 20, and all the pins 35a to 35c are in the groove 36a. It is arranged to protrude. In the vicinity of the groove 36a, magnetic force generating coils 38a to 38c are respectively provided so as to penetrate the corresponding pins 35a to 35c, and each of the magnetic force generating coils 38a to 38c is supplied with an electric current supplied from the outside. Each is configured so as to enable generation of a magnetic force according to the above.

  The magnetic fluid 40 is separated from the magnetic force generating coils 38a to 38c by a magnetic force generated by a coil to which a current is supplied so that the magnetic fluid 40 is separated and magnetically separated in the groove 36a so as to cover the pins penetrating the coils. To be adsorbed. Specifically, as shown in FIG. 4A, when the magnetic fluid 40 generates a magnetic force by supplying a current to the magnetic force generating coils 38a and 38b, a groove 36a covers the pins 35a and 35b. The magnetic fluids 40a and 40b are separated and magnetically adsorbed. The magnetic fluids 40a and 40b separated as described above hold the sensor chip 20a in the vicinity of the connection terminals 22a and 22b by the respective surface tensions. Thereby, the connection terminals 22a and 22b and the corresponding pins 35a and 35b are electrically connected by the separated magnetic fluids 40a and 40b, respectively.

  As shown in FIG. 4B, when the magnetic fluid 40 generates a magnetic force by supplying current to the magnetic force generating coils 38a and 38c, the magnetic fluid 40 covers the pins 35a and 35c in the groove 36a. The magnetic fluids 40a and 40c are separated and magnetically attracted. The magnetic fluids 40a and 40c separated as described above hold the sensor chip 20a in the vicinity of the connection terminals 22a and 22c by their surface tension. Thereby, the connecting terminals 22a and 22c and the corresponding pins 35a and 35c are electrically connected by the separated magnetic fluids 40a and 40c, respectively.

  In the mounting structure of the sensor chip 20a according to the fourth embodiment configured as described above, the connection terminals 22a to 22c of the sensor chip 20a face the pins 35a to 35c of the mounted member 30b to be connected. ing. A plurality of magnetic force generating coils 38a to 38c as magnetic force adjusting means are provided on the attached member 30b so as to be separated from each other for each of the pins 35a to 35c of the attached member 30b. The magnetic fluid 40 has both connection terminals so as to electrically connect a pin corresponding to a coil that has generated a magnetic force among the magnetic force generating coils 38a to 38c and a connection terminal of the sensor chip 20a facing the pin. They are intervened separately.

  For this reason, by generating a magnetic force only for the magnetic force generating coils (38a to 38c) corresponding to the pins (35a to 35c) to be electrically connected, the connection terminals to be connected (the pins 35a to 35c and the connection terminals) The magnetic fluid (40a-40c) is separated and moved between 22a-22c), so that the electrical connection can be selectively switched. And the magnetic fluid (40a-40c) interposed between the connection terminals connected electrically can hold | maintain the sensor chip 20a, and can prevent transmission of the stress to the sensor chip 20a. In particular, for example, when a sensor chip having two or more functions such as a pressure sensor function and a temperature sensor function is used, only a predetermined detection signal among a plurality of detection signals is output from the sensor chip. This is effective because the electrical connection can be selectively switched. In addition, by generating magnetic force from all the magnetic force generating coils 38a to 38c, the magnetic fluids 40a to 40c are connected between the connection terminals 22a to 22c of the sensor chip 20a and the pins 35a to 35c of the attached member 30b to be connected. All the connection terminals may be electrically connected through 40c.

[Fifth Embodiment]
Next, a sensor chip mounting structure according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 5 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20 according to the fifth embodiment.
In the sensor 10 that employs the mounting structure of the sensor chip 20 according to the fifth embodiment, the mounted member 30c is employed instead of the mounted member 30 described in the first embodiment. It differs from the mounting structure of the sensor chip 20 according to the first embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  Unlike the above-described attached member 30, the attached member 30c has the permanent magnet 33 omitted. The attached member 30c is formed of a magnetic powder composite resin in which a magnetic powder is contained in, for example, a resin material. The chip side surface 31 of the attached member 30c is provided with a concave groove 36b formed so as to be wider than the magnetic fluid side surface 23 of the sensor chip 20.

  The magnetic fluid 40 is magnetically attracted while being positioned so as to flow into the groove 36b of the chip side surface 31 of the attached member 30c by the magnetic force of the magnetic powder contained in the attached member 30c. The sensor chip 20 is held and fixed to the magnetic fluid 40 by the surface tension of the magnetic fluid 40 at the magnetic fluid side surface 23.

  In the mounting structure of the sensor chip 20 according to the fifth embodiment configured as described above, the magnetic powder contained in the mounted member 30c is used as a magnetic force generating means. This eliminates the need to insert-mold the permanent magnet 33 and the magnetic force generating coil 34 on the attached member 30c, thereby reducing the manufacturing cost.

[Sixth Embodiment]
Next, a sensor chip mounting structure according to a sixth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20 according to the sixth embodiment.
In the sensor 10 adopting the attachment structure of the sensor chip 20 according to the sixth embodiment, the attachment member 30d is adopted instead of the attachment member 30 described in the first embodiment. It differs from the mounting structure of the sensor chip 20 according to the first embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The attached member 30d after the plurality of pins 35 and the like are insert-molded is provided with a magnetic substrate 39 so as to cover the chip side surface 31 thereof. Only one concave groove 39a is formed on the surface (the lower surface in FIG. 6) opposite to the surface that contacts the chip side surface 31 of the substrate 39. In addition, the substrate 39 is provided with a plurality of connection terminals 39 b for being electrically connected to the connection terminals 22 of the sensor chip 20 by the flexible wiring 50. The substrate 39 processes the detection signal of the sensor chip 20 input from each connection terminal 39b, and then outputs it from each pin 35. In FIG. 6, for convenience, a set of connection terminals 22 and connection terminals 39 b are shown connected by a flexible wiring 50.

  The magnetic fluid 40 is magnetically attracted while being positioned so as to flow into the groove 39a of the substrate 39 by the magnetic force of the substrate 39 provided on the chip side surface 31 of the attached member 30d. The sensor chip 20 is held and fixed to the magnetic fluid 40 by the surface tension of the magnetic fluid 40 at the magnetic fluid side surface 23.

  In the mounting structure of the sensor chip 20 according to the first embodiment described above, when the permanent magnet 33 or the magnetic powder is employed as the magnetic force generating means, the permanent magnet 33 or the magnetic powder is exposed to a high temperature during the insert molding, so that the magnetism is not increased. May be lost and difficult to mold. On the other hand, in the mounting structure of the sensor chip 20 according to the sixth embodiment, by providing the magnetic substrate 39 on the chip side surface 31 of the mounted member 30 after the insert molding, the sensor chip 20 is exposed to a high temperature during the insert molding. Therefore, magnetism does not disappear. The substrate 39 may be provided so as to cover a part of the chip side surface 31, or may be provided so as to cover the entire surface of the chip side surface 31.

[Seventh Embodiment]
Next, a sensor chip mounting structure according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 7 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20b according to the seventh embodiment.
In the sensor 10 that employs the mounting structure of the sensor chip 20b according to the seventh embodiment, the sensor chip 20b and the mounted member 30e are replaced with the sensor chip 20 and the mounted member 30 described in the first embodiment. The adopted point differs from the mounting structure of the sensor chip 20 according to the first embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  Unlike the sensor chip 20, the sensor chip 20 b has a plurality of concave and convex grooves 23 a on the magnetic fluid side surface 23 such that the surface area of the magnetic fluid side surface 23, which is a surface held by the surface tension of the magnetic fluid 40, increases. Is formed.

  Unlike the mounted member 30, the mounted member 30 e has a plurality of concave and convex grooves 36 c on the chip side surface 31 so that the surface area of the surface of the chip side surface 31 on which the magnetic fluid 40 is magnetically attracted is increased. Has been.

  In the mounting structure of the sensor chip 20b according to the seventh embodiment configured as described above, the surface on which the magnetic fluid 40 is magnetically adsorbed among the magnetic fluid side surface 23 and the chip side surface 31 of the sensor chip 20b is the respective contact area. The concave and convex grooves 23a and 36c are formed so as to be large. As a result, the holding force of the sensor chip 20b due to the surface tension of the magnetic fluid 40 increases, so that the sensor chip 20b can be reliably held by the magnetic fluid 40. Further, since the attracting force to the attached member 30e due to the surface tension of the magnetic fluid 40 is increased, the magnetic fluid 40 can be reliably adsorbed to the attached member 30e.

  The uneven groove 23a formed on the magnetic fluid side surface 23 is not limited to an uneven shape, and may have any shape as long as the surface area of the magnetic fluid side surface 23 increases. Similarly, the uneven groove 36c formed in the chip side surface 31 is not limited to being formed in an uneven shape, and may have any shape as long as the surface area of the chip side surface 31 is increased. Moreover, you may abolish either the uneven groove 23a of the magnetic fluid side surface 23, or the uneven groove 36c of the chip | tip side surface 31. FIG.

[Eighth Embodiment]
Next, a sensor chip mounting structure according to an eighth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20 according to the eighth embodiment.
In the sensor 10 that employs the mounting structure of the sensor chip 20 according to the eighth embodiment, the dust adsorption device 60 having the permanent magnet 61 that is a magnetic force generating means for dust adsorption is newly adopted. It differs from the mounting structure of the sensor chip 20 according to one embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  As shown in FIG. 8, a plurality of dust adsorption devices 60 are attached to the chip side surface 31 of the attached member 30 so that the permanent magnet 61 is separated from the permanent magnet 33 and the dust around the sensor chip 20 is magnetically adsorbed. It has been.

  In the sensor chip 20 mounting structure according to the eighth embodiment configured as described above, the dust around the sensor chip 20 is magnetically attracted to the dust adsorbing device 60 by the magnetic force generated from the permanent magnet 61. It is possible to prevent the dust from adhering to the sensor chip 20 or the like due to the magnetic force 33. Further, since the dust adsorption device 60 is attached to the chip side surface 31 of the attached member 30 so that the permanent magnet 61 is separated from the permanent magnet 33, the magnetic fluid in which the magnetic force by the permanent magnet 61 holds the sensor chip 20. It does not affect the magnetic fluid 40, such as magnetically adsorbing 40.

  Further, as a modification of the eighth embodiment, a magnetic force generating coil that functions as a magnetic force adjusting means for adsorbing dust may be employed in place of the permanent magnet 61 in the dust adsorbing device 60. Thereby, magnetic force for magnetically adsorbing dust can be generated as necessary.

[Ninth Embodiment]
Next, a sensor chip mounting structure according to a ninth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20c according to the ninth embodiment.
In the sensor 10 employing the sensor chip 20c mounting structure according to the ninth embodiment, the sensor chip 20c is employed instead of the sensor chip 20 described in the first embodiment. It differs from the mounting structure of the sensor chip 20 according to the embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  A magnetic film 24 is provided on the magnetic fluid side surface 23 of the sensor chip 20c to generate a magnetic attractive force to the permanent magnet 33 in accordance with the magnetic force generated by the permanent magnet 33. The sensor chip 20c is held and fixed by the magnetic fluid 40 by the surface tension of the magnetic fluid 40 by the magnetic film 24.

  In the mounting structure of the sensor chip 20c according to the ninth embodiment configured as described above, the magnetic film 24 is formed on the magnetic fluid side surface 23 of the sensor chip 20c by the magnetic force generated by the permanent magnet 33. Since it is magnetically attracted, the holding force for holding the sensor chip 20c via the magnetic fluid 40 can be increased.

  Further, when the connection terminal 22 of the sensor chip 20 and the pin 32 of the attached member 30 are electrically connected, the magnetic film 24 of the sensor chip 20 is attached to the attached member 30 by using the magnetic force generated by the permanent magnet 33. By directly adsorbing to the mounting member, a mounting jig for fixing the sensor chip 20 to the mounted member 30 when the connection terminal is connected becomes unnecessary, and workability can be improved.

[Tenth embodiment]
Next, a sensor chip mounting structure according to a tenth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a schematic cross-sectional view showing the mounting structure of the sensor chip 20 according to the tenth embodiment.
In the sensor 10 that employs the mounting structure of the sensor chip 20 according to the tenth embodiment, the mounted member 30f is employed instead of the mounted member 30 described in the first embodiment. It differs from the mounting structure of the sensor chip 20 according to one embodiment. Therefore, substantially the same components as the mounting structure of the sensor chip 20 of the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  The attached member 30f includes a plurality of magnetic force generating coils 38d to 38f as magnetic force adjusting means for magnetically attracting the magnetic fluid 40. Each of the magnetic force generating coils 38d to 38f is provided on the attached member 30f so that the sensor chip 20 held via the magnetic fluid 40 magnetically attracted by the magnetic force is located at a desired measurement position. In FIG. 10, only three magnetic force generating coils 38d to 38f are shown for convenience.

  In the mounting structure of the sensor chip 20 according to the tenth embodiment configured as described above, only the magnetic force generating coil corresponding to a desired measurement position generates a magnetic force, so that the magnetic force of the magnetic force generating coil is used to generate a sensor. The magnetic fluid 40 holding the chip 20 is magnetically attracted so as to move to a desired measurement position. Specifically, when the sensor chip 20 is moved to the measurement position shown in FIG. 10A, only the magnetic force generating coil 38d is caused to generate a magnetic force. Further, when the sensor chip 20 is moved to the measurement position shown in FIG. 10 (B), only the magnetic force generating coil 38e generates a magnetic force, and when the sensor chip 20 is moved to the measurement position shown in FIG. 10 (C). Causes only the magnetic force generating coil 38f to generate a magnetic force. This prevents stress from being transmitted to the sensor chip 20 and selectively moves the measurement position of the sensor chip 20 by selectively changing the position of the sensor chip 20 with respect to the attached member 30f. it can.

The present invention is not limited to the above embodiments, and may be embodied as follows. Even in this case, the same operations and effects as those of the above embodiments can be obtained.
(1) The permanent magnet as the magnetic force generation means and the magnetic force generation coil as the magnetic force adjustment means described in each of the above embodiments may be eliminated if an existing magnetic field can be used.

(2) The concave / convex groove 23a of the magnetic fluid side surface 23 or the concave / convex groove 36c of the chip side surface 31 in the seventh embodiment may be adopted in the first to sixth embodiments.

(3) You may employ | adopt the dust adsorption apparatus 60 in the said 8th Embodiment in each said 1st-7th, 9th embodiment.

(4) The magnetic film 24 in the ninth embodiment may be employed in the sensor chip in the first, second, fifth, sixth, eighth, and tenth embodiments.

DESCRIPTION OF SYMBOLS 10 ... Sensor 20, 20a, 20b, 20c ... Sensor chip 21 ... Pressure receiving surface 22, 22a, 22b, 22c ... Connection terminal 23 ... Magnetic fluid side surface 23a ... Concave and convex groove 24 ... Magnetic film 30, 30a, 30b, 30c, 30d, 30e, 30f: Mounted member 31: Chip side surface 32: Pin (connection terminal)
33, 37 ... Permanent magnet (magnetic force generating means)
34, 38a to 38f ... Coil for generating magnetic force (magnetic force generating means, magnetic force adjusting means)
35, 35a, 35b, 35c ... pin (connection terminal)
36, 36a, 36b ... groove 36c ... uneven groove 40, 40a, 40b, 40c ... magnetic fluid 50 ... flexible wiring 60 ... dust adsorption device (magnetic force generating means for dust adsorption)
61. Permanent magnet (magnetic force generating means for dust adsorption)

Claims (14)

In the sensor chip mounting structure for mounting the sensor chip to the mounted member,
A magnetic fluid interposed between the sensor chip and the mounted member, the magnetic fluid capable of holding the sensor chip by its surface tension;
Magnetic force generating means for generating a magnetic force for magnetically attracting the magnetic fluid to the attached member;
Equipped with a,
Before Symbol sensor chip, the mounting structure of the sensor chip, characterized in that it is held by the surface tension of the magnetic fluid without contacting the to the mounting member on the entire surface of the surface of the magnetic fluid side. It said magnetic force generating means, the mounting structure of the sensor chip of claim 1, wherein the magnetic powder der Rukoto said contained in the attached member. It said magnetic force generating means, said mounting structure of the sensor chip of claim 1, wherein the adjustable force adjusting means der Rukoto the magnetic force generated is provided to the attached member. The sensor chip mounting structure according to claim 1 or 3 , wherein the sensor chip and a connection terminal provided on the mounted member are electrically connected by a flexible wiring. The plurality of connection terminals of the sensor chip are respectively opposed to connection terminals scheduled to be connected among the plurality of connection terminals of the attached member,
The magnetic fluid is interposed between the connection terminals of the sensor chip and the connection terminals of the attached member scheduled to be connected to the connection terminals, and is separately provided for each connection terminal.
The sensor chip mounting structure according to claim 1 or 3 , wherein a plurality of the magnetic force generating means are provided on the mounted member so that the separated magnetic fluid is interposed between the connection terminals.

The mounting structure of the sensor chip of claim 5, wherein Rukoto formed a plurality of such recessed grooves in each region of the connection terminals protrude out of the surface of the mounting member are separated from each other. The plurality of connection terminals of the sensor chip are respectively opposed to connection terminals scheduled to be connected among the plurality of connection terminals of the attached member,
A plurality of the magnetic force adjusting means are provided on the attached member for each connection terminal of the attached member,
The magnetic fluid electrically connects the connection terminal of the attached member corresponding to the magnetic force adjusting means that generates magnetic force among the magnetic force adjusting means and the connection terminal of the sensor chip to be connected to the connection terminal. mounting structure of the sensor chip according to claim 3, characterized that you interposed between the connecting terminals to. 2. The sensor chip mounting structure according to claim 1 , wherein the magnetic force generating means is a magnetic substrate provided on a contact surface of the mounted member that contacts the magnetic fluid . Claim 1, the contact surface and the feature that you formed so that a contact area of at least one of the contact surfaces in contact with the magnetic fluid of the attachment member is increased in contact with the magnetic fluid in the sensor chip The mounting structure of the sensor chip according to any one of?   The dust-attached magnetic force generating means for generating a magnetic force capable of attracting dust around the sensor chip is provided in a part of the attached member that is separated from the magnetic force generating means. The sensor chip mounting structure according to one item.   The sensor chip mounting structure according to claim 10, wherein the dust adsorption magnetic force generating means is a permanent magnet.   The sensor chip mounting structure according to claim 10, wherein the dust adsorption magnetic force generation means is a dust adsorption magnetic force adjustment means capable of adjusting a generated magnetic force.   The sensor chip mounting structure according to claim 1, wherein a magnetic film is provided on a contact surface of the sensor chip that contacts the magnetic fluid.   4. A plurality of the magnetic force adjusting means are provided on the mounted member so that the sensor chips held via the magnetic fluid magnetically attracted by the magnetic force are respectively located at desired measurement positions. The sensor chip mounting structure described in 1.

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