JP5222449B2 - Slit method for plated copper strip and slitting device for plated copper strip - Google Patents

Description

  The present invention relates to a slitting method and a slitting apparatus for a plated copper strip, in which a plated copper strip having a plating layer formed on at least one surface of copper or a copper alloy is cut into a predetermined width. It is about.

  2. Description of the Related Art Conventionally, lead frames used in semiconductor devices such as ICs and LSIs, terminals of various electronic components, and connectors are manufactured by subjecting the above-described plated copper strips to press working or the like. When performing such press work, first, a wide plated copper strip is cut into a predetermined width to form a plated copper strip. Then, the surface of the plated copper strip is wiped off and continuously supplied to the press machine to perform press work.

Here, as a slit method and a slit device for forming a plated copper strip by cutting a wide plated copper strip into a predetermined width, for example, as shown in Patent Document 1-3, A slit cutter is provided, and a slit cutter is passed between the slit cutters and cut by shearing is widely used.
Japanese Patent Laid-Open No. 1-115511 Japanese Unexamined Patent Publication No. 1-252312 JP-A-2-172617

  By the way, when performing the slit process of the copper strip with plating, since the copper strip and the plating layer are sheared, there is a possibility that metal powder may be generated from the cut surface. Moreover, there is a possibility that foreign matter may be mixed from the outside during the slit processing. When the wiping operation is performed in a state where these metal powder and foreign matter are accumulated on the surface of the plating layer, the surface of the plating layer is damaged by the metal powder and foreign matter. In particular, in the case of a Sn plating material, since the Sn metal powder is oxidized to a very hard Sn oxide, the surface of the plating layer tends to be easily damaged.

  Here, as a means for preventing metal powder and foreign matter from directly depositing on the surface of the plating layer, it is conceivable to apply oil to the surface of the plating layer to form an oil-based protective film. When an oil-based protective film is formed, metal powder generated during slit processing or foreign matter mixed from the outside will be deposited on the oil-based protective film, and the accumulation of metal powder or foreign material will be suppressed. . Therefore, in the wiping operation before press working, it is possible to suppress the generation of scratches on the plating layer surface.

  However, when oil is simply supplied to the surface of the copper strip with plating, the oil-based protective film is not uniformly formed on the surface of the plating layer, and the oil-based protective film may not be partially formed. In particular, if there is a portion where the oil-based protective film is not partially formed in the width direction, the frictional resistance at this portion increases, and the wiping operation cannot be performed stably. In addition, in the portion where the oil-based protective film is not formed, it becomes impossible to suppress the occurrence of scratches due to metal powder or foreign matter.

  The present invention has been made in view of the above circumstances, and when performing slit processing for cutting a plated copper strip into a predetermined width, a uniform oil-based protective film on the surface of the plated copper strip An object of the present invention is to provide a slitting method and a slitting device for a plated copper strip with a low risk of generating scratches on the surface of the plating layer in the wiping operation before press working.

In order to solve this problem, the method for slitting a plated copper strip according to the present invention includes a plated copper strip having a plated layer formed on at least one surface of a copper strip made of copper or a copper alloy. A slitting method for a plated copper strip that is cut into a predetermined width dimension, wherein an oily protective film forming step is provided for forming an oily protective film having a thickness of 10 mm to 30 mm on the surface of the plated copper strip. And a cutting step of cutting the plated copper strip with the oil-based protective film formed into a predetermined width dimension to form a plated copper strip, and in the oil-based protective film forming step, Non-volatile oil is supplied by spraying using a spray nozzle to an application roller having a cylindrical surface extending along the axis and having an axial length equal to or greater than the entire width of the plated copper strip. Roller is plated By sliding contact with the surface of the elongated member is characterized by forming the oily protective film.

According to the method for slitting a plated copper strip according to the present invention having the above-described configuration, in the oil-based protective film forming step, the plated copper strip having a cylindrical surface extending along the axis and having an axial length. Since the oil-based protective film is formed by supplying oil to a coating roller having a width equal to or greater than the entire width of the coating roller and sliding the coating roller on the surface of the plated copper strip, the oil is applied in the width direction of the coating roller. In this state, it is slidably contacted with the plated copper strip, and a uniform oil-based protective film over the entire width can be formed on the surface of the plated copper strip.
Therefore, the frictional resistance of the entire surface of the plated copper strip is reduced, and the wiping operation before press working can be performed satisfactorily. In addition, metal powder and foreign matters generated during the slit processing are deposited and removed on the oil-based protective film, and the generation of scratches on the plating layer surface can be suppressed.
In this case, when the thickness of the oil-based protective film is less than 10 mm, the effect of suppressing the generation of scratches on the surface of the plating layer may decrease when a large amount of metal powder or the like is generated. On the other hand, if the thickness of the oil-based protective film exceeds 30 mm, the amount of oil used increases, and wiping work before press working becomes difficult. Therefore, it is preferable to control the thickness of the oil-based protective film to 10 to 30 mm.
Further, since the oil injection amount is changed by adjusting the oil supply pressure to the spray nozzle, the thickness of the formed oil-based protective film can be controlled with high accuracy.
Moreover, since the oil-based protective film is composed of non-volatile oil, the oil-based protective film is retained for a long period even after slit processing. Therefore, even when foreign matter or the like is mixed when the plated copper strip is handled, accumulation of foreign matter can be suppressed.

Here, in the oil-based protective film forming step, the oil-based protective film may be formed on both surfaces of the plated copper strip.
In this case, it is possible to suppress the occurrence of scratches due to metal powder or foreign matter on the other surface of the copper strip. In particular, when the plating layer is formed also on the other surface of the copper strip, it is preferable to form the oil-based protective film on both surfaces of the plated copper strip.

The slitting device for a plated copper strip according to the present invention is a plating for cutting a plated copper strip having a plating layer formed on at least one surface of a copper strip made of copper or a copper alloy into a predetermined width dimension. A slitting device for a copper strip, which is a strip supply portion for supplying the copper strip with plating, and a copper strip with plating is formed by cutting the supplied copper strip with a predetermined width. An oil-based protective film formed on the surface of the plating layer in the vicinity of the inlet of the slit cutting portion. A protective film means is provided, the oil-based protective film means having a cylindrical surface extending along the axis and having an axial length equal to or greater than the full width of the plated copper strip, and a spray nozzle By injecting the oil by Serial and oil supply section for supplying oil to the coating roller, is characterized by comprising a control unit for controlling the supply amount of the oil from the oil supply unit.

  According to the slit device for a plated copper strip according to the present invention having the above-described configuration, an oil-based protective film means for forming an oil-based protective film on the surface of the plating layer is provided in the vicinity of the inlet of the slit cutting portion. The oil-based protective film means has a cylindrical surface extending along the axis, and the axial length is equal to or greater than the full width of the plated copper strip, and supplies oil to the coating roller. An oil supply unit, so that oil is supplied to the application roller, and this oil is applied to the plated copper strip in a state of being spread in the width direction by the application roller. A uniform oil-based protective film over the entire width is formed on the surface of the material. And in the state in which this oil-based protective film was formed, it will be cut | disconnected in a slit cutting part. Therefore, it can prevent that the metal powder and foreign material which generate | occur | produce at the time of slit processing accumulate on the plating layer surface directly, and can suppress generation | occurrence | production of the damage | wound in the plating layer surface.

In this case, by controlling the supply amount of the oil in the control unit, it is possible to control the thickness of the oil-based protective film formed on the surface of the plating with the copper strip material.
Moreover, the amount of oil injection changes by adjusting the supply pressure of the oil to the spray nozzle, and the thickness of the oil-based protective film to be formed can be accurately controlled.

The application roller is provided with a first application roller that is in sliding contact with one surface of the plated copper strip, and a second application roller that is in sliding contact with the other surface of the plated copper strip. It is preferable.
In this case, an oil-based protective film can be formed on one surface and the other surface of the plated copper strip, and one surface and the other surface of the plated copper strip can be protected.

  According to the present invention, when performing slit processing for cutting a plated copper strip into a predetermined width dimension, a uniform oil-based protective film is formed on the surface of the plated copper strip, and the wiping operation before pressing is performed. It is possible to provide a slitting method and a slitting apparatus for a plated copper strip with a low risk of causing scratches on the surface of the plating layer.

Hereinafter, a slitting method and a slitting device for a plated copper strip material according to an embodiment of the present invention will be described with reference to the accompanying drawings.
First, the plated copper strip cut in the present embodiment will be described. As shown in FIG. 1, the plated copper strip 1 includes a copper strip 2 made of copper or a copper alloy, and a plating layer 3 </ b> A formed on one surface and the other surface of the copper strip 2. , 3B.

In the present embodiment, the plating layers 3A and 3B include Ni layers 4A and 4B formed on the innermost side, Cu-Sn alloy layers 5A and 5B formed on the outer side of the Ni layers 4A and 4B, and Cu-Sn. It has a three-layer structure composed of Sn layers 6A and 6B formed outside the alloy layers 5A and 5B. Here, the thickness of the copper strip 2 is 0.1 to 2.0 mm, the thickness of the Ni layers 4A and 4B is 0.05 to 1.0 μm, and the thickness of the Cu—Sn alloy layers 5A and 5B is 0.00. The thickness of the Sn layers 6A and 6B is 0.1 to 3.0 μm.
Such plated copper strip 1 is stored and transported in a coiled state after the plating layers 3A and 3B are formed.

Next, the slit device 10 for cutting the above-mentioned plated copper strip 1 into a predetermined width will be described with reference to FIGS.
The slit device 10 includes an uncoiler 11, a pinch roller 12, a first tension roller portion 14, a side guide portion 15, an oil-based protective film forming means 20, a slit cutting portion 30, and a second tension roller portion 16. The recoiler 17 is provided.

The uncoiler 11 supports the plated copper strip 1 wound in a coil shape so as to be rotatable. By rotating the plated copper strip 1, the uncoiler 11 unwinds the plated copper strip 1. , Continuously supplied on the conveyance path.
The pinch roller 12 guides the vertical position of the plated copper strip 1 by sandwiching the plated copper strip 1 supplied from the uncoiler 11 onto the conveyance path from above and below.

As shown in FIG. 2, the first tension roller section 14 causes the plated copper strip 1 to meander in an S shape to apply tension to the plated copper strip 1 on the conveyance path. In the present embodiment, as shown in FIG. 2, an end of one plated copper strip 1 and another plated copper strip 1 are disposed between the pinch roller 12 and the first tension roller portion 14. A welding machine 13 is provided which is welded to the end of each to make a long material.
The side guide portion 15 guides the plated copper strip 1 on the conveyance path so as to be in a predetermined width direction position.

The oil-based protective film forming means 20 applies oil to the surface of the plated copper strip 1 to form an oil-based protective film on the surfaces of the plating layers 3A and 3B.
The slit cutting part 30 cuts the plated copper strip 1 on which the oil-based protective film is formed into a predetermined width dimension to form a plurality of plated copper strips 8.

As shown in FIG. 2, the second tension roller portion 16 causes each of the formed plurality of plated copper strips 8 to meander in an S shape, thereby applying a tension to each of the plurality of plated copper strips 8. .
The recoiler 17 includes a rotatable drum, and is configured to wind the plated copper strip 8 around the drum.

Here, the slit cutting part 30 and the oil-based protective film forming means 20 described above will be described in detail with reference to FIGS.
The slit cutting unit 30 includes a cutter unit 33 in which slit cutters 31 </ b> A and 31 </ b> B each having a disk shape are vertically arranged. As shown in FIG. 3, the slit cutters 31 </ b> A and 31 </ b> B are configured to be rotatable about the shaft portions 32 </ b> A and 32 </ b> B, respectively. Here, the slit cutters 31 </ b> A and 31 </ b> B arranged above and below are arranged so as to slightly overlap in the vertical direction and to form a slight gap in the width direction. In this embodiment, the overlap amount in the vertical direction is in the range of 0 to 0.3 mm, and the gap in the width direction is in the range of 0 to 0.2 mm.
In the slit cutting part 30, a plurality of the above-described cutter units 33 are arranged at predetermined intervals in the width direction of the plated copper strip 1 to be conveyed.

The oil-based protective film means 20 is provided in the vicinity of the inlet of the slit cutting part 30.
As shown in FIGS. 3 and 4, the oil-based protective film forming unit 20 includes an application roller 21 having a cylindrical surface extending along the axis L, and an oil supply unit 22 that supplies oil to the application roller 21. I have.
The coating roller 21 has a length in the direction of the axis L that is equal to or greater than the entire width of the plated copper strip 1 to be cut, and rotates around the axis L to slidably contact the surface of the plated copper strip 1. It is supposed to be configured. In the present embodiment, the first application roller 21A slidably in contact with one surface (the upper surface in FIGS. 3 and 4) of the plated copper strip 1 and the other surface of the plated copper strip 1 (FIGS. 3 and 4). And a second application roller 21B slidably in contact with the lower surface in FIG. In the present embodiment, the material of the application roller 21 is urethane rubber.

As shown in FIG. 4, the oil supply unit 22 includes a first spray unit 24A and a second spray unit 24B having a plurality of spray nozzles 23 directed to the outer peripheral surfaces of the first application roller 21A and the second application roller 21B. A tank unit 25 for storing oil, and a first pump unit 26A and a second pump unit 26B that transfer oil from the tank unit 25 toward the first spray unit 24A and the second spray unit 24B at a predetermined pressure, respectively. And a control unit 27 that controls the operations of the first pump unit 26A and the second pump unit 26B to adjust the amount of oil injected from the first spray unit 24A and the second spray unit 24B.
Here, the plurality of spray nozzles 23 are arranged at equal intervals in the extending direction (the direction of the axis L) of the application roller 21. In addition, the spray nozzle 23 used in the present embodiment has a spray pattern that is linear.

  Next, the slit method using the slit apparatus 10 of the copper strip with plating which is this embodiment comprised as mentioned above is demonstrated. FIG. 5 shows a flowchart.

First, by rotating the uncoiler 11 on which the plated copper strip 1 wound in a coil shape is mounted, the plated copper strip 1 is unwound and continuously supplied onto the conveyance path (plating). Copper strip supply step S1).
The supplied plated copper strip 1 is sandwiched from above and below by the pinch roller 12 and guided in the vertical direction, and is guided in the width direction by the side guide portion 15 (position guide step S2). At this time, a predetermined tension is applied to the plated copper strip 1 by the first tension roller 14.

Then, the oil-based protective film forming means 20 forms an oil-based protective film on one surface and the other surface of the plated copper strip 1 (oil-based protective film forming step S3).
In this oil-based protective film forming step S3, oil is supplied at a predetermined pressure from the tank unit 25 toward the first spray unit 24A and the second spray unit 24B by the first pump unit 26A and the second pump unit 26B. . Oil is sprayed from the spray nozzles 23 arranged in the first spray unit 24A and the second spray unit 24B toward the outer peripheral surfaces of the first application roller 21A and the second application roller 21B.

In the first application roller 21A and the second application roller 21B, the sprayed oil spreads in the direction of the axis L and is brought into sliding contact with one surface and the other surface of the plated copper strip. Thereby, an oil-based protective film is formed on one surface and the other surface of the plated copper strip.
Here, in this embodiment, the supply amount of oil is adjusted by the control unit 27 so that the film thickness of the formed oil-based protective film is 10 to 30 mm. The tank unit 25 stores non-volatile oil, and an oil-based protective film is formed by the non-volatile oil.

The plated copper strip 1 on which the oil-based protective film is formed on one surface and the other surface is conveyed to the slit cutting part 30 and cut into a predetermined width dimension by the slit cutters 31A and 31B. Copper strip 8 is formed (cutting step S4).
The plurality of plated copper strips 8 are each loaded with tension by the second tension roller portion 16 and wound on the plurality of drums of the recoiler 17 (plated copper strip winding step S5).
In this way, the plated copper strip 1 is cut into a predetermined width, and a plurality of plated copper strips 8 are produced.

  According to the slitting method and the slit device 10 of the plated copper strip 1 according to the present embodiment configured as described above, an oil-based protective film is provided in the vicinity of the inlet of the slit cutting portion 30 that cuts the plated copper strip 1. Since the forming means 20 is provided, an oil-based protective film is formed on one surface and the other surface of the plated copper strip 1 before cutting. Here, the first coating roller 21A and the second coating roller in which the oil-based protective film forming means 20 has a cylindrical surface extending along the axis L and the length in the axis L direction is equal to or greater than the entire width of the plated copper strip 1. 21B, and an oil supply unit 22 that supplies oil to the first application roller 21A and the second application roller 21B. Therefore, oil is supplied to the first application roller 21A and the second application roller 21B. With the oil spread in the width direction by the first application roller 21A and the second application roller 21B, the first application roller 21A and the second application roller 21B are slid onto one surface and the other surface of the plated copper strip 1. It is possible to form a uniform oil-based protective film. And in the state where such a uniform oil-based protective film is formed, it can be cut by the slit cutting part 30, and metal powder and foreign matter generated at the time of cutting are directly deposited on the surfaces of the plating layers 3A and 3B. Can be prevented. Furthermore, since the oil-based protective film is also formed on the surface of the formed plated copper strip 8, it is possible to suppress the generation of scratches when winding with the recoiler 17, and the friction of the entire surface of the plated copper strip 8. Resistance becomes low and the wiping work before press work can be performed satisfactorily.

  Further, the oil-based protective film means 20 is provided with a control unit 27 for controlling the operation of the first pump unit 26A and the second pump unit 26B that transfer oil from the tank unit 25 to the first spray unit 24A and the second spray unit 24B. Since the control part 27 is controlled so that the film thickness of the oil-based protective film is not less than 10 mm and not more than 30 mm, the effect of suppressing the generation of scratches on the surfaces of the plating layers 3A and 3B can be reliably achieved. And the amount of oil used can be reduced. Further, by controlling the oil supply pressure to the spray nozzle 23 by the control unit 27, the amount of oil injected from the spray nozzle 23 can be accurately controlled.

  Moreover, since the oil-based protective film is formed of the non-volatile oil, the oil-based protective film is also retained for a long time in the plated copper strip 8 formed by cutting. Therefore, even when a foreign matter or the like is mixed during transport of the plated copper strip 8 or during preparation for pressing, the oil-based protective film can suppress the occurrence of scratches on the surfaces of the plating layers 3A and 3B.

  Furthermore, in this embodiment, since the material of the first application roller 21A and the second application roller 21B is urethane rubber, the plating layers 3A and 3B are damaged even if they are in sliding contact with the surface of the plated copper strip 1. And a uniform oil-based protective film can be formed.

As mentioned above, although the slit method of the plated copper strip material and the slit device of the plated copper strip material according to this embodiment which is an embodiment of the present invention have been described, the present invention is not limited to this description, Modifications can be made as appropriate without departing from the technical idea of the invention.
The configurations of the uncoiler, the pinch roller, the first tension roller, the side guide portion, the second tension roller, and the recoiler of the slit device are not limited to the embodiment, and may be other configurations.

Moreover, although demonstrated as what forms an oil-based protective film in one surface and the other surface of a plated copper strip, the oil-based protective film should just be formed in at least one surface.
Furthermore, although it demonstrated as what adjusts the film thickness of an oil-based protective film to 10 to 30 mm, the film thickness of an oil-based protective film is not limited to this.
Moreover, although it demonstrated as apply | coating non-volatile oil and forming an oil-based protective film, it is preferable to select the oil to apply | coat suitably considering the property of a plating layer.

Furthermore, although this embodiment demonstrated as what slits the copper strip with plating which has a plating layer of a three-layer structure, there is no limitation in the structure of a plating layer. However, since the plated copper strip described in the present embodiment has a Ni layer, Ni powder is generated at the time of slitting, and the Ni powder may damage the plating layer. Therefore, the effect of the present invention becomes remarkable.
Moreover, although the material of the application roller has been described as urethane rubber, the present invention is not limited to this, and an application roller made of another material may be used.

  Below, the result of the confirmation experiment performed in order to confirm the effect of this invention is demonstrated.

  Reflow Sn plating with a film thickness of 1.0 μm was applied to the surface of the copper strip made of MSP1 manufactured by Mitsubishi Shindoh Co., Ltd. to prepare a copper strip with plating having a thickness of 0.25 mm, a width of 320 mm, and a length of 3000 m. . A slit cutter was disposed so that seven plated copper strips having a width of 45 mm were produced from the plated copper strip with a conveyance speed of 150 m / min.

  As an example of the present invention, an oily protective film was formed as follows. A urethane roller having a diameter of 50 mm and an axial length of 400 mm was used as the coating roller in the oil-based protective film forming means. Three spray nozzles were arranged at intervals of 120 mm. The air pressure of the spray nozzle was 0.02 MPa, and the film thickness of the oil protective film was adjusted to 30 mm.

  As a comparative example, the application roller is arranged as it is, and oil is supplied in the preceding stage of the application roller. Oil was directly supplied to the upper surface of the plated copper strip by three dropping devices arranged at equal intervals in the width direction of the plated copper strip, and spread by a coating roller to form an oily protective film.

  As evaluation, it was confirmed visually whether the oil-based protective film was formed in the whole surface of the plated copper strip. Furthermore, the surface of the plated copper strip after cutting was wiped off with a pad, and the contamination state of the plating layer surface was evaluated. The evaluation results are shown in Table 1.

In the comparative example, the oil-based protective film was not formed in a part of the width direction and the longitudinal direction. Moreover, in the oil-based protective film partially formed in the width direction, the film thickness tends to be thick. Moreover, metal powder, a foreign material, etc. had adhered to the pad after wiping off, and stain | pollution | contamination had generate | occur | produced.
On the other hand, in the present invention example, the oil-based protective film was formed on the entire surface of the plated copper strip, and the film thickness was relatively thin. Further, the pat after wiping had less adhesion of metal powder or foreign matter, and the contamination was suppressed.

  From the results of the above confirmation experiment, according to the present invention, a uniform oil-based protective film can be formed on the surface of the plated copper strip, and the surface of the plated copper strip after cutting can be formed by this oil-based protective film. It was confirmed that contamination was suppressed.

It is a section explanatory view of a copper strip with plating which is slit in a slitting method and a slitting device of a copper strip with plating which is an embodiment of the present invention. It is the schematic of the slit apparatus of the copper strip with plating which is embodiment of this invention. It is a side view of the slit cutting part in FIG. FIG. 4 is a view in the direction of the arrow X in FIG. 3. It is a flowchart of the slit method of the copper strip with plating which is embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plated copper strip 3A, 3B Plating layer 8 Plating copper strip 10 Slit device (Slit device for plated copper strip)
11 Uncoiler (strip supply section)
17 Recoiler (winding part)
20 Oil-based protective film forming means 21A First application roller (application roller)
21B Second application roller (application roller)
22 Oil supply part 23 Spray nozzle 27 Control part 30 Slit cutting part

Claims (4)

A method of slitting a copper strip with plating, in which a plated copper strip with a plating layer formed on at least one surface of a copper strip made of copper or a copper alloy is cut into a predetermined width dimension,
An oil-based protective film forming step for forming an oil-based protective film having a thickness of 10 to 30 mm on the surface of the plated copper-line material, and the plated copper-lined material on which the oil-based protective film is formed are predetermined. A cutting step of forming a copper strip with plating by cutting into a width dimension,
In the oil-based protective film forming step, by spraying onto a coating roller having a cylindrical surface extending along the axis and having an axial length equal to or greater than the full width of the plated copper strip using a spray nozzle. A method for slitting a copper strip with plating, characterized in that the oil-based protective film is formed by supplying non-volatile oil and sliding the coating roller on the surface of the copper strip with plating.   2. The method for slitting a plated copper strip according to claim 1, wherein, in the oil protective coating forming step, the oil protective coating is formed on both surfaces of the plated copper strip. A plated copper strip material for cutting a plated copper strip having a plating layer formed on at least one surface of a copper strip made of copper or a copper alloy into a predetermined width dimension,
A strip supply section for supplying the plated copper strip, a slit cutting section for cutting the supplied plated copper strip into a predetermined width to form a plated copper strip, and the plated copper strip. A winding unit for winding and collecting, and
An oily protective film means for forming an oily protective film on the surface of the plating layer is provided in the vicinity of the inlet of the slit cutting part,
The oil-based protective film means has a cylindrical surface extending along the axis and the length in the axial direction is equal to or larger than the entire width of the plated copper strip, and the oil is sprayed by spraying the oil. An apparatus for slitting a copper strip with plating, comprising: an oil supply unit that supplies oil to the coating roller; and a control unit that controls a supply amount of oil from the oil supply unit. The application roller is provided with a first application roller that is in sliding contact with one surface of the plated copper strip, and a second application roller that is in sliding contact with the other surface of the plated copper strip. The slitting device for a plated copper strip according to claim 3 , wherein:

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