JP5224665B2 - Lead frame, package component, semiconductor device, and method of manufacturing package component - Google Patents

Description

  The present invention relates to a lead frame having an electrical connection region, a package component manufactured by integrally molding a lead frame by resin molding, a semiconductor device including the package component, and a method for manufacturing the package component. In particular, the present invention relates to prevention of resin burrs from entering an electrical connection region when a lead frame is molded with resin.

  As a conventional semiconductor device, an electrical connection region to which an electrical connection member is connected is formed in a lead frame, a groove is formed around the electrical connection region, and resin burrs generated during resin sealing are formed in the groove. The burrs are prevented from entering the electrical connection region by, for example, the following Patent Document 1.

FIG. 9 shows a conventional semiconductor device 50 described in Patent Document 1, wherein (a) is a plan view, (b) is an XX cross-sectional view in (a), and (c) is a groove. It is an expanded sectional view.
The semiconductor device 50 electrically connects the semiconductor element 51, the lead frames 52 and 53, the electrical connection region 54 formed in the lead frames 52 and 53, and the semiconductor element 51 and the electrical connection region 54. It has an electrical connection member 55 (wire) and a housing 56 formed of resin.

  The housing 56 includes a pair of opposing lead frames 52 and 53 and has an open hollow portion 57. The lead frames 52 and 53 are disposed on the bottom surface of the hollow portion 57, and the semiconductor element 51 and the electrical connection region 54 are exposed in the hollow portion 57. An annular groove 58 is formed on one main surface of each of the lead frames 52 and 53, and the inner area of the groove 58 serves as the electrical connection area 54. The semiconductor element 51 is placed on the electrical connection region 54 of one lead frame 52, and an electrical connection member 55 (wire) is wire-bonded from the semiconductor element 51 to the electrical connection region 54 of the other lead frame 53. . The cross section of the groove 58 is formed in a square shape.

According to this, when manufacturing the semiconductor device 50, in the molding process, the lead frames 52 and 53 are sandwiched between mold dies (not shown), and the resin in a fluid state is injected into the cavity where the housing 56 is molded. To do. At this time, since the resin leaking from the cavity flows into the groove 58, it is possible to prevent the resin from entering the electrical connection region 54 and becoming a resin burr. As a result, good bondability (good or bad bonding) between the electrical connection region 54 and the electrical connection member 55 (wire) can be obtained in a later step.
Japanese Patent No. 3695434

  However, in the conventional configuration, when the resin leaking from the cavity of the mold (not shown) in the direction of the electrical connection region 54 is concentrated in a local portion (a part) of the groove 58 during the molding process, It is difficult for the resin to spread smoothly from the local area of the groove 58 in the circumferential direction of the groove 58. For this reason, the resin easily enters the electrical connection region 54 locally beyond the groove 58. Therefore, the problem of remaining as a resin burr in the electrical connection region 54 still remains.

  The present invention provides a lead frame, package component, semiconductor device, and package component in which the resin does not easily cross the groove even when the resin leaking from the mold cavity is concentrated at a part (part) of the groove during the molding process. An object is to provide a manufacturing method.

In order to solve the above-described conventional problems, a lead frame according to the present invention is a lead frame having an electrical connection region to which a connection member is connected or a semiconductor element is mounted. A resin guide groove surrounding the electrical connection region is formed, and the resin guide groove is composed of a groove body portion having a square cross section and a resin guide portion having a V shape in cross section. It has an opening that opens on the surface, the width of the resin guiding part decreases from the opening side toward the back end, the back end of the resin guiding groove is sharp, and the groove body part is the opening of the resin guiding groove The resin guide part is formed on the back end side of the resin guide groove and communicates with the groove body part over the entire circumference, and the width of the groove body part is larger than the width of the resin guide part. Is.

  According to this, in the molding process, the resin leaking from the mold cavity toward the electrical connection region flows into the resin guide groove from the opening. At this time, the capillary phenomenon occurs more significantly (strongly) at the back end portion where the width of the resin guide groove is reduced, and by this capillary phenomenon, the resin is smoothly guided and spreads in the circumferential direction of the resin guide groove, It collects in a wide range in the circumferential direction in the resin guide groove. Accordingly, even when the resin is concentrated locally (partly) in the resin guide groove, the resin spreads smoothly in the circumferential direction of the resin guide groove due to the capillary phenomenon as described above, so that the resin is difficult to cross the resin guide groove. Can be prevented from entering the electrical connection region.

Furthermore , since the capillary phenomenon occurs more significantly (strongly) in the resin guiding portion than in the groove main body portion, the resin flowing into the resin guiding groove from the opening portion is caused by the capillary phenomenon in the resin guiding portion in the circumferential direction of the resin guiding groove. The resin is smoothly guided and spreads, and accumulates in a wide range in the circumferential direction in the resin guide groove. At this time, since the cross-sectional shape of the groove main body is square, it becomes possible to store a larger amount of resin in the resin guide groove, thereby more reliably preventing the resin from entering the electrical connection region. can do.

In the lead frame of the present invention, the angle of the back end portion of the resin guide groove is 90 ° or less.
According to this, a certain and sufficient capillary action occurs at the back end of the resin guide groove.

In the lead frame of the present invention , a resin reservoir is formed inside or outside the resin guide groove, and the resin reservoir communicates with the resin guide groove.

  According to this, the resin that has flowed into the resin guide groove from the opening is smoothly guided and expanded in the circumferential direction of the resin guide groove by a capillary phenomenon, and accumulated in a wide range in the circumferential direction in the resin guide groove. Furthermore, the resin in the resin guide groove flows into the resin reservoir, so that the resin can be prevented from overflowing from the resin guide groove, thereby more reliably intruding the resin into the electrical connection region. Can be prevented.

The lead frame of the present invention has a plurality of resin guide grooves arranged concentrically.
According to this, the resin first flows into the outermost resin guide groove, but even if it overflows from the outermost resin guide groove, the resin guide formed inside the outermost resin guide groove is next. It flows into the groove. For this reason, the penetration | invasion to the electrical connection area | region of resin can be prevented more reliably.

The package component of the present invention is a package component including any one of the lead frames described above , wherein a resin casing is mounted on the lead frame, the casing has an open hollow housing portion, and the lead The frame is disposed on the bottom surface of the housing portion, and the electrical connection region and the resin guide groove are exposed in the housing portion.

A semiconductor device of the present invention is a semiconductor device including the above-described package component, in which a casing is mounted on a plurality of lead frames, and a semiconductor element is mounted on an electrical connection region of any one of the lead frames. And an electrical connection region of another lead frame are electrically connected via a connection member.

The package component manufacturing method of the present invention is the above-described package component manufacturing method, wherein a lead frame is set between a fixed mold and a movable mold having a punch for forming a resin guide groove, and the movable mold is formed. The lead frame is sandwiched between a punching process in which a resin guide groove is formed by pressing one main surface of the lead frame with a punch, and a mold having a cavity that matches the shape of the housing. And a mold step of filling the molten resin from the resin inlet into the cavity.

  According to this, even when the resin leaking from the mold cavity during the molding process is concentrated on a part (part) of the resin guide groove, it becomes difficult for the resin to cross the resin guide groove, leading to the resin electrical connection region. Can be prevented from entering.

The method for manufacturing a package component of the present invention includes a plating process for plating a lead frame before the punching process.
According to this, corrosion of the lead frame can be prevented by plating. In addition, since the punching process is performed after the plating process, the plating on the surface of the resin guiding groove is peeled off in the punching process to expose the material, and a metal oxide film is formed on the surface of the resin guiding groove. Since the wettability between the metal oxide film and the resin is good, the capillary phenomenon between the resin guide groove and the resin is kept good in the molding process, and the resin spreads smoothly in the circumferential direction of the resin guide groove by the capillary phenomenon. .

  As described above, the present invention can prevent the resin from entering the electrical connection region beyond the resin guide groove, thereby preventing the occurrence of resin burrs in the electrical connection region and improving the production yield. It is possible to obtain a semiconductor device that does not deteriorate or impair the reliability of electrical connection.

Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
First, the first embodiment will be described with reference to FIGS.

As shown in FIG. 1, reference numeral 1 denotes an optical semiconductor device which is an example of a semiconductor device, and includes a package component 2 and an optical semiconductor element 3 (an example of a semiconductor element).
As shown in FIG. 2, the package component 2 includes a pair of lead frames 6, 7 facing each other with a predetermined gap, and a resin casing 8 mounted on both the lead frames 6, 7. Yes. The housing 8 is a square box-shaped member having a hollow housing portion 9 whose upper surface is open. Both lead frames 6, 7 are disposed on the bottom surface of the housing portion 9, and the opposite ends of the lead frames 6, 7 protrude outward of the housing 8.

  In addition, as resin which is the material of the housing | casing 8, thermosetting resins, such as an epoxy, a phenol, a melamine, an acryl, a urea resin, unsaturated polyester, an alkyd, a polyimide, a polyamide, a polyether, are used, for example.

  As shown in FIG. 3, each of the lead frames 6 and 7 is made of copper or an alloy containing copper. An electrical connection region 12 and annular resin guide grooves 14 and 15 surrounding the electrical connection region 12 are formed on one main surface of each lead frame 6 and 7, respectively. As shown in FIG. 2, the electrical connection region 12 and the resin guide grooves 14 and 15 are exposed in the housing portion 9.

  As shown in FIG. 3, both resin guide grooves 14 and 15 are formed concentrically and double inside and outside. Each resin guide groove 14, 15 has an opening 17 that opens on one main surface of the lead frames 6, 7, and each resin guide groove 14, 15 has a V-shaped cross section. , 15 gradually decreases from the opening 17 toward the inner ends 14a, 15a of the resin guide grooves 14, 15, and the inner ends 14a, 15a of the resin guide grooves 14, 15 are pointed. The angle α of the back end portions 14a, 15a of the resin guide grooves 14, 15 is 90 ° or less.

  As shown in FIG. 1, the optical semiconductor element 3 is mounted on an electrical connection region 12 of one lead frame 6 (an example of one of the lead frames). One end of a connection member 19 is connected to the optical semiconductor element 3, and the other end of the connection member 19 is connected to the electrical connection region 12 of the other lead frame 7 (an example of another lead frame). As a result, the optical semiconductor element 3 and the electrical connection region 12 of the other lead frame 7 are electrically connected via the connection member 19. As the connecting member 19, a wire made of, for example, gold or copper is used. Moreover, stable reliability can be ensured by filling the accommodating portion 9 with a light transmissive resin (not shown).

Next, a method for manufacturing the package component 2 shown in FIG. 2 will be described with reference to FIGS.
As shown in FIG. 4, first, in the punching process, the resin guide grooves 14 and 15 are formed in the lead frames 6 and 7 by using a press working apparatus. That is, the press working apparatus has a fixed mold 25 and a movable mold 26, and the movable mold 26 is provided with a protruding punch 27 for forming a resin guide groove.

  As shown in FIG. 4 (a), a pair of lead frames 6 and 7 are set between the fixed mold 25 and the movable mold 26, and the movable mold 26 is moved downward so that both lead frames 6 and 7 are moved. Then, the resin guide grooves 14 and 15 are formed by pressing one main surface with the punch 27. As a result, as shown in FIG. 4B, lead frames 6 and 7 having resin guiding grooves 14 and 15 are completed.

  Thereafter, as shown in FIG. 5, the housing 8 is resin-molded using a mold 30 in the molding step. That is, as shown in FIG. 5A, in the mold 30, a cavity 31 (gap) that matches the shape of the housing 8 and a resin injection port 32 that injects the resin R into the cavity 31 from the outside. And are provided.

  A pair of lead frames 6 and 7 are held between mold molds 30 and a resin supply mechanism (not shown) is used to remove the heat-melted resin R from the resin inlet 32 as shown in FIG. It is injected into the cavity 31 and filled.

  Thereafter, when the resin R is solidified, the mold 30 is opened, the processing is finished, and the integrated lead frames 6 and 7 and the housing 8 are taken out. Thereby, the package component 2 shown in FIG. 2 is completed.

Hereinafter, the operation of the above configuration will be described.
In the molding process shown in FIG. 5, when the resin R is injected into the cavity 31 from the resin injection port 32, at least the electrical connection region 12 and the resin guide grooves 14, 15 are closed while being in contact with the mold 30. However, as shown in FIG. 6, the resin R leaked from the cavity 31 due to the pressure at the time of resin injection may intensively reach the local part (part) of the resin guide grooves 14 and 15.

  In such a case, the resin R first flows into the outer resin guide groove 14 as shown in FIG. At this time, the capillary phenomenon occurs more remarkably (strongly) at the back end portion 14a where the width of the resin guide groove 14 is reduced, and the resin R smoothly flows in the circumferential direction A of the resin guide groove 14 by this capillary phenomenon. The resin guide groove 14 accumulates in a wide range in the circumferential direction A. Therefore, even when the resin R is concentrated locally (partially) in the resin guide groove 14, the resin R smoothly spreads in the circumferential direction A of the resin guide groove 14 due to the capillary phenomenon as described above. It becomes difficult to cross the groove 14, and the resin R can be prevented from entering the electrical connection region 12.

  In the unlikely event that the resin R overflows from the outer resin guide groove 14, the resin R then flows into the inner resin guide groove 15 as shown in FIG. Further, the resin guide groove 15 is also smoothly guided and expanded in the circumferential direction A of the resin guide groove 15 by the capillary phenomenon, and accumulates in a wide range in the circumferential direction A in the resin guide groove 15. Thereby, it becomes difficult for the resin R to cross the resin guide groove 15 and the penetration of the resin R into the electrical connection region 12 can be more reliably prevented.

  As shown in FIG. 3 (c), the angle α of the back end portions 14a, 15a of the resin guide grooves 14, 15 is 90 ° or less, so the back end portions 14a, A reliable and sufficient capillary action occurs at 15a.

In the above embodiment, the resin guide grooves 14 and 15 are formed in the inner and outer doubles in the lead frames 6 and 7, respectively, but a plurality of triple or more may be formed, or a single (ie, single) is formed. May be.
(Embodiment 2)
Next, a second embodiment will be described.

  In the manufacturing method of the package component 2, a plating process for plating the lead frames 6 and 7 is performed before the punching process. Examples of the plating include Cu or Cu alloy, Fe / Ni alloy, Ni—Au, Ni—Pd, Ni—Pd—Au, Ag, Ni—Ag, Cu—Ag, and the like. Excellent in ability.

According to this, corrosion of the lead frames 6 and 7 can be prevented by plating. Further, since the punching process is performed after the plating process, the plating on the surface of each resin guiding groove 14 and 15 is peeled off in the punching process to expose the metal material, and a metal oxide film is formed on the surface of each resin guiding groove 14 and 15. Is done. Since the wettability between the metal oxide film and the resin R is good, the capillary phenomenon between the resin guiding grooves 14 and 15 and the resin R is kept good in the molding process, and the resin R is caused by the capillary phenomenon. , 15 are smoothly guided in the circumferential direction A and spread.
(Embodiment 3)
Next, Embodiment 3 will be described.

  As shown in FIG. 7, the resin guide groove 35 has an opening 36 opened on one main surface of the lead frames 6, 7, a groove main body portion 35 a having a square cross section, and a cross section having a V shape. It is comprised with the resin guide part 35b which is a shape. The groove main body 35 a is formed facing the opening 36 side of the resin guide groove 35. Moreover, the resin guide part 35b is formed in the back end part 35c side of the resin guide groove 35, and is connected to the bottom part of the groove main-body part 35a over the perimeter. The angle α of the resin guiding portion 35b (the back end portion 35c of the resin guiding groove 35) is 90 ° or less. Further, the width Wa of the groove main body portion 35a is larger than the width Wb of the resin guiding portion 35b.

Hereinafter, the operation of the above configuration will be described.
In the molding step, when the resin R leaked from the cavity 31 intensively reaches a part (part) of the resin guide groove 35 and flows into the resin guide groove 35, the resin R is more in the resin guide part 35b than the groove main body part 35a. Since the capillary phenomenon occurs more remarkably (strongly), the resin R is smoothly guided and spreads in the circumferential direction A of the resin guide groove 35 by the capillary phenomenon in the resin guide portion 35b, and the circumference in the resin guide groove 35 is increased. Accumulate in a wide range in direction A. At this time, since the cross-sectional shape of the groove main body portion 35a is a square shape, a larger amount of the resin R than the resin guide groove 14 or the resin guide groove 15 of the first embodiment (see FIG. 3) is put in the resin guide groove 35. It becomes possible to accumulate. This can more reliably prevent the resin R from entering the electrical connection region 12.

In the third embodiment, each of the lead frames 6 and 7 has a single resin guide groove 35 (ie, a single), but the resin guide groove 35 is formed in the same manner as in the first embodiment (see FIG. 3). A plurality of inner and outer doubles or more may be formed.
(Embodiment 4)
Next, a fourth embodiment will be described.

  As shown in FIG. 8, resin guide grooves 14 are formed in the lead frames 6 and 7, respectively. As shown in FIG. 8D, the resin guide groove 14 has a V-shaped cross section and has an opening 17 that opens on one main surface of the lead frames 6, 7. As shown in FIG. 8A, resin reservoirs 39 are formed at a plurality of locations in the circumferential direction A of the resin guide groove 14. As shown in FIGS. 8B and 8C, these resin reservoirs 39 have a concave cross-sectional shape, are located on the outer side of the resin guide groove 14, and communicate with the resin guide groove 14. .

Hereinafter, the operation of the above configuration will be described.
In the molding process, when the resin R leaked from the cavity 31 intensively reaches a part (part) of the resin guide groove 14 and flows into the resin guide groove 14, the resin R becomes a resin guide groove by capillary action. 14 is smoothly guided in the circumferential direction A and spreads, and accumulates in a wide range in the circumferential direction A in the resin guiding groove 14. Further, the resin R in the resin guide groove 14 flows into the resin reservoir 39, so that the resin R can be prevented from overflowing from the resin guide groove 14, and thereby the electrical connection region 12 of the resin R can be prevented. It is possible to prevent the intrusion into the device more reliably.

In the fourth embodiment, the resin reservoir 39 is formed on the outer side of the resin guide groove 14, but may be formed on the inner side of the opposite side.
In the fourth embodiment, a single resin guide groove 14 is formed in each lead frame 6 and 7 (that is, a single layer). However, as in the first embodiment (see FIG. 3), the resin is doubled inside and outside. The guide grooves 14 and 15 may be formed, or the inner and outer triple layers may be formed. In this case, the resin reservoir 39 may be formed on the outer side of the outermost resin guide groove 14 and on the inner side of the innermost resin guide groove 15.

  When the lead frame is molded with resin and is integrally formed, it is useful for preventing the entry of resin burrs into the electrical connection region, and is particularly suitable for an optical semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure of the optical semiconductor device in Embodiment 1 of this invention, (a) is a top view, (b) shows the XX arrow view in (a). It is a figure of the package components of an optical semiconductor device, (a) is a top view, (b) shows the XX arrow view in (a). FIG. 6 is a view of a lead frame of a package component of an optical semiconductor device, where (a) is a plan view, (b) is a view taken along line XX in (a), and (c) is an enlarged cross-sectional view of a resin guide groove. Show. It is a figure which shows the punch process of the manufacturing method of the package components of an optical semiconductor device equally. It is a figure which shows the molding process of the manufacturing method of the package components of an optical semiconductor device equally. FIG. 4 is a plan view of a part of the resin guide groove of the lead frame of the optical semiconductor device, where (a) shows a state in which the resin flows into the outer resin guide groove, and (b) shows a resin in the resin guide groove on both the inner and outer sides. Indicates a state where the It is a figure of the lead frame of the optical semiconductor device in Embodiment 3 of this invention, (a) is a top view, (b) is a XX arrow line view in (a), (c) is an expansion of the resin guide groove | channel. A cross-sectional view is shown. It is a figure of the lead frame of the optical semiconductor device in Embodiment 4 of this invention, (a) is a top view, (b) is a XX arrow view in (a), (c) is a resin reservoir part formed. The expanded sectional view of the resin guide groove in the part currently done, (d) shows the expanded sectional view of the resin guide groove in the part where the resin reservoir part is not formed. It is a figure of the conventional semiconductor device, (a) is a top view, (b) is a XX arrow line view in (a), (c) shows the expanded sectional view of a groove | channel.

Explanation of symbols

1 Optical semiconductor device (semiconductor device)
2 Package parts 3 Optical semiconductor element (semiconductor element)
6, 7 Lead frame 8 Housing 9 Housing portion 12 Electrical connection region 14, 15 Resin guiding groove 14a, 15a Back end portion 17 Opening portion 19 Connection member 25 Fixed die 26 Movable die 27 Punch 30 Mold die 31 Cavity 32 Resin injection port 35 Resin guide groove 35a Groove main body part 35b Resin guide part 35c Deep end part 36 Opening part 39 Resin reservoir part α Angle of deep end part of resin guide groove R Resin Wa Width of groove main part Wb Resin guide part width

Claims (8)

A lead frame having an electrical connection region to which a connection member is connected or a semiconductor element is mounted,
A resin guide groove surrounding the electrical connection region is formed on one main surface of the lead frame,
The resin guide groove is composed of a groove main body portion having a quadrangular cross-sectional shape and a resin guide portion having a V-shaped cross section, and has an opening opening on one main surface of the lead frame,
The width of the resin guide portion decreases as it goes from the opening side to the back end, and the back end of the resin guide groove is sharp,
The groove body is formed on the opening side of the resin guide groove,
The resin guide part is formed on the back end side of the resin guide groove and communicates with the groove body part over the entire circumference.
A lead frame characterized in that the width of the groove body is larger than the width of the resin guiding portion.   The lead frame according to claim 1, wherein an angle of a back end portion of the resin guide groove is 90 ° or less. A resin reservoir is formed inside or outside the resin guide groove,
The lead frame according to claim 1, wherein the resin reservoir portion communicates with a resin guide groove.   The lead frame according to any one of claims 1 to 3, wherein the plurality of resin guide grooves are disposed concentrically. A package component comprising the lead frame according to any one of claims 1 to 4,
A resin casing is attached to the lead frame,
The housing has an open hollow housing portion,
The lead frame is arranged on the bottom surface of the housing part,
A package component, wherein the electrical connection region and the resin guide groove are exposed in the housing portion. A semiconductor device comprising the package component according to claim 5,
A housing is attached to multiple lead frames,
A semiconductor element is mounted on the electrical connection region of any lead frame,
A semiconductor device, wherein a semiconductor element and an electrical connection region of another lead frame are electrically connected through a connection member. A method of manufacturing a package component according to claim 5,
A lead frame is set between the fixed mold and a movable mold having a punch for forming a resin guide groove, and the movable mold is moved to press one main surface of the lead frame with a punch to form a resin guide groove. Punching process,
And a mold process in which a lead frame is sandwiched between mold molds provided with cavities that match the shape of the casing, and a resin in a heated and melted state is injected into the cavity from the resin injection port and filled. A method for manufacturing a package component.   8. The method of manufacturing a package component according to claim 7, further comprising a plating step of plating the lead frame before the punching step.

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