JP5225044B2 - Electronic component storage package, electronic device, and method of manufacturing electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package for storing electronic components such as a piezoelectric vibrator, a semiconductor element, and a crystal vibrator, an electronic device, and a method for manufacturing the electronic device.

  2. Description of the Related Art Conventionally, electronic component storage packages (hereinafter simply referred to as “packages”) for storing electronic components such as piezoelectric vibrators, semiconductor elements, and crystal vibrators are known (see, for example, Patent Document 1). . The package includes a base body provided with a mounting portion for mounting an electronic component, and a frame body provided so as to surround the mounting portion. After the electronic component is mounted on the mounting portion provided on the base of the package and the lid is disposed on the frame (positioning), the inside of the package is evacuated. Some packages do not have a vacuum. And an electronic component is airtightly sealed by joining a frame and a cover body with a joining material, and an electronic device is comprised. Such electronic devices are used as parts of various electronic devices such as mobile phones and personal computers.

  Here, at the time of manufacturing the electronic device as described above, after positioning the lid body on the frame body, it is necessary to exhaust (release) the air existing in the package to the outside in order to make the inside of the package into a vacuum state. There is (this process is referred to as “exhaust process”). In order to shorten the manufacturing time of the electronic device and efficiently manufacture the electronic device, it is preferable that the air present in the package can be exhausted to the outside in a short time. In order to exhaust the air present in the package to the outside in a short time, the exhaust resistance of the package needs to be low. The exhaust resistance is a failure when the air existing in the package is exhausted to the outside.

  That is, if the exhaust resistance is high, the air present in the package is difficult to exhaust to the outside, and the exhaust time becomes longer. On the other hand, when the exhaust resistance is low, the air present in the package is easily exhausted to the outside, and the exhaust time is shortened. In other words, at the contact portion between the frame body and the lid body, if the width of the contact portion in the thickness direction of the frame body, that is, if the width of the frame body is wide, the air present in the package is difficult to exhaust to the outside. The exhaust resistance becomes high. On the other hand, if the width of the frame is narrow, the air present in the package is easily exhausted to the outside, and the exhaust resistance is low.

In short, it is preferable that the air existing in the package can be exhausted to the outside in a short time in the exhaust process at the time of manufacturing the electronic device, but in order to exhaust the air present in the package to the outside in a short time, As described above, it is necessary to narrow the width of the frame. However, when the width of the frame is reduced, the exhaust resistance is reduced, but the bonding strength between the frame and the lid when the frame and the lid are bonded with a bonding material is reduced. When the bonding strength between the frame body and the lid body decreases, the lid body easily comes off from the frame body. Since the lid is easily detached from the frame, the quality of the package is lowered.
JP 2007-95956 A

  The present invention has been made in view of the above-described problems, and the object thereof is to reduce the quality of the air, and to remove the air present in the package to the outside in a short time in an exhaust process such as manufacturing. An object of the present invention is to provide an electronic component storage package that can be evacuated, an electronic device, and a method for manufacturing the electronic device.

  To achieve the above object, an electronic component storage package according to the present invention includes a base provided with a mounting portion for mounting an electronic component, a frame provided so as to surround the mounting portion, and the mounting portion. An electronic component storage package including a cover for covering, the support having a support for supporting the cover on the frame, and the width of the support in the thickness direction of the frame Is gradually narrower toward the lid body, and the side surface of the support portion and the lid body are joined via a joining material.

  According to the electronic component storage package of the present invention, the support portion for supporting the lid is provided on the frame. Here, the width of the support portion in the thickness direction of the frame is gradually narrowed toward the lid. For this reason, the electronic component storage package of the present invention has lower exhaust resistance than the conventional electronic component storage package. Therefore, air existing in the electronic component storage package can be exhausted to the outside in a short time in an exhaust process such as manufacturing.

  Further, according to the electronic component storage package of the present invention, since the side surface of the support portion and the lid are bonded via the bonding material, the support portion is compared with the conventional electronic component storage package. The bonding strength between the side surface and the lid does not decrease.

  To achieve the above object, an electronic component storage package according to the present invention includes an electronic component including a base body provided with a mounting portion for mounting the electronic component, and a frame body provided so as to surround the mounting portion. A storage package, comprising: a support part for supporting a lid for covering the mounting part on the frame body via a bonding material, and the support part in the thickness direction of the frame body. The width becomes narrower toward the part for supporting the lid.

  In order to achieve the above object, an electronic device according to the present invention includes the electronic component storage package of the present invention and an electronic component mounted on a mounting portion provided on a base of the electronic component storage package.

  In order to achieve the above object, an electronic device manufacturing method according to the present invention includes a base body provided with a mounting portion for mounting an electronic component, a frame body provided so as to surround the mounting portion, And a support portion for supporting the lid for covering the mounting portion, and the width of the support portion in the thickness direction of the frame is gradually narrowed toward the lid. In the component storage package, a step of mounting an electronic component on the mounting portion, a step of disposing the lid on the support portion, or a step of disposing the support portion on the lid, and the electronic component A step of exhausting the air inside the storage package to the outside, and a step of interposing a bonding material in a gap between the support portion and the lid.

  As described above, the electronic component storage package, the electronic device, and the manufacturing method of the electronic device according to the present invention reduce the air present in the package in the exhaust process such as manufacturing without reducing the quality. There is an effect that it can be exhausted outside in time.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  However, in the drawings referred to below, for the convenience of explanation, among the constituent members of one embodiment of the present invention, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the electronic component storage package and the electronic device according to the present invention can include arbitrary components not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  FIG. 1 is a plan view showing an example of an electronic apparatus 1 according to an embodiment of the present invention. 2 is a cross-sectional view taken along the cutting line AA ′ shown in FIG. As shown in FIGS. 1 and 2, the electronic device 1 includes an electronic component 2 and an electronic component storage package (package) 3 for storing the electronic component 2. In addition, the electronic component 2 is comprised from arbitrary components, such as a piezoelectric vibrator, a semiconductor element, a crystal oscillator, for example. Such an electronic device 1 is used as a part of various electronic devices such as a mobile phone and a personal computer.

  The package 3 includes a base body 32 provided with a mounting portion 31 for mounting the electronic component 2, and a frame 33 provided so as to surround the mounting portion 31.

The base 32 is made of, for example, a ceramic material, a metal material, a glass material, a resin material having a high gas barrier property, or the like. Here, the ceramic material, for example, aluminum oxide _(Al 2 _{O 3)} sintered material, mullite _{(3Al 2 O 3 · 2SiO 2} ) sintered material, silicon carbide (SiC) sintered material, aluminum nitride ( AlN) sintered body, silicon nitride (Si ₃ N ₄ ) sintered body, glass ceramics and the like. The metal material is, for example, an Fe-based alloy, oxygen-free copper, SUS, or the like. Examples of the glass material include borosilicate glass and quartz glass. Furthermore, the resin material having a high gas barrier property is, for example, a silicone resin. A resin having a low gas barrier property may be formed by forming a gas barrier film such as plating or a thin film to have a similar function.

  Here, for example, consider the case where the substrate 32 is made of glass ceramics. In this case, the glass ceramic contains a glass component and a filler component.

Examples of the glass component include SiO ₂ —B ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ system, SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —MO system (where M is Ca, Sr, Mg, Ba or Zn), SiO ₂ —Al ₂ O ₃ —M ¹ O—M ² O system (M ¹ and M ² are the same or different Ca, Sr, Mg, Ba or Zn), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ¹ O—M ² O system (M ¹ and M ² are the same as above), SiO ₂ —B ₂ O ₃ — M ³ ₂ O system (M ³ represents Li, Na or K), SiO ₂ —B ₂ O ₃ —Al ₂ O ₃ —M ³ ₂ O system (M ³ is the same as above) , Pb glass, Bi glass and the like.

Examples of the filler component include Al ₂ O ₃ , SiO ₂ , a composite oxide of ZrO ₂ and an alkaline earth metal oxide, a composite oxide of TiO ₂ and an alkaline earth metal oxide, Al ₂ O ₃ and Examples thereof include composite oxides containing at least one selected from SiO ₂ (for example, spinel, mullite, cordierite) and the like.

  For example, consider the case where the base 32 is formed of a dense aluminum oxide sintered body having a relative density of 95% or more. In this case, the substrate 32 is formed as follows. That is, first, a sintering aid such as rare earth oxide powder or aluminum oxide powder is added to and mixed with the aluminum oxide powder to produce a raw material powder of the aluminum oxide sintered body. Then, an organic binder and a dispersion medium are added to and mixed with the produced raw material powder to form a paste. This paste is added by a doctor blade method, or an organic binder is added to the raw material powder, and a predetermined thickness is obtained by press molding, rolling molding, or the like. The green sheet which has is produced | generated. Then, after aligning and laminating and pressing a predetermined number of sheet-like molded bodies, the laminate is fired at a temperature of 1200 to 1500 ° C. in a non-oxidizing atmosphere, for example. A ceramic substrate 32 is obtained. The substrate 32 may be formed by a powder molding press method.

  For example, consider the case where the base 32 is made of a metal material. In this case, the base body 32 is formed into a predetermined shape by a cutting method, a pressing method, a MIM (Metal-Injection-Mold) method, or the like. In order to prevent corrosion, the surface of the base 32 is preferably subjected to a coating process such as a plating process such as Au or Ni or a resin coating such as polyimide.

  Further, for example, consider the case where the substrate 32 is made of a glass material. In this case, it is preferable that a film of Au, Ni, or the like is formed on the surface of the base 32 by using, for example, vapor deposition or sputtering.

  The frame 33 is formed of an insulator such as an aluminum oxide sintered body (aluminum oxide ceramics), an aluminum nitride sintered body, or a glass ceramic. The frame 33 is formed by laminating and firing ceramic green sheets. The frame 33 may be formed of a metal body (for example, iron-nickel-cobalt alloy, iron-nickel, etc.) or a glass body instead of the insulator. Here, when the frame 33 is formed of a metal body, the frame 33 is formed in a predetermined shape by applying a conventionally known metal processing method such as rolling or punching to the metal ingot.

  In order to prevent the frame 33 from being oxidatively corroded, the surface of the frame 33 has a nickel (Ni) layer having a thickness of 0.5 to 9 μm and a gold (Au) having a thickness of 0.5 to 5 μm. ) Layer is preferably deposited sequentially by plating.

  Further, the package 3 according to this embodiment includes a support portion 34 on the frame 33. The support part 34 is a member for supporting the lid 35. The lid 35 is a member for covering the mounting portion 31 (electronic component 2). Here, in the present embodiment, the support portion 34 is formed in a tapered shape as shown in FIG. In the present embodiment, the example in which the support portion 34 is formed in a tapered shape has been described. However, the present invention is not limited to this. That is, as long as the width of the support portion 34 in the thickness direction of the frame 33 (direction T shown in FIG. 2) gradually decreases toward the lid 35, the width is not limited to the tapered shape and is arbitrary. Note that “gradually narrowing” means gradually narrowing (continuously).

  As described above, since the width of the support portion 34 in the thickness direction of the frame 33 gradually decreases toward the lid 35, the package 3 according to the present embodiment has an exhaust resistance that is lower than that of the conventional package. Becomes lower. For this reason, air existing in the package 3 can be exhausted to the outside in a short time in an exhaust process at the time of manufacture or the like.

  Here, the support part 34 is formed from insulators, such as an aluminum oxide sintered body (aluminum oxide ceramics), an aluminum nitride sintered body, glass ceramics, for example. The support part 34 is formed by laminating and firing ceramic green sheets. The support portion 34 may be formed of a metal body (for example, iron-nickel-cobalt alloy, iron-nickel, etc.) or a glass body instead of the insulator. Here, when the support part 34 is formed from a metal body, the support part 34 is formed in a predetermined shape by applying a conventionally known metal processing method such as rolling or punching to the metal ingot.

  In addition, the frame 33 and the support part 34 may be integrally formed, and may be formed separately from each other.

  As illustrated in FIG. 2, the bonding material 36 is interposed in a gap portion between the support portion 34 and the lid body 35. That is, the side surface of the support portion 34 and the lid 35 are joined by the joining material 36. The bonding material 36 is, for example, a solder material, a glass material, a brazing material, or the like. For example, when the bonding material 36 is a solder material, a lead-free solder such as Sn-based, Bi-based, or Zn-based material, lead-containing solder such as SnPb, or an Au-based material such as AuSn, AuGe, or AuSi is preferably used. It is done. When the bonding material 36 is a glass material, borosilicate glass, alkali glass, lead oxide glass containing lead as a main component, or the like is preferably used. Furthermore, when the bonding material 36 is a brazing material, an Ag-based material such as AgCu, an Au-based material such as AuCu, AuNi, or the like is preferably used. When such a material is used, the side surface of the support portion 34 and the lid 35 can be favorably bonded.

  Thus, in the package 3 according to the present embodiment, since the bonding material 36 is interposed in the gap portion between the side surface of the support portion 34 and the lid body 35, the support portion 34 is compared with the conventional package. The bonding strength between the side surface and the lid 35 does not decrease. Moreover, since the support part 34 is formed in the taper shape in the package 3 according to the present embodiment, the bonding material 36 can be interposed in a well-balanced space between the support part 34 and the lid 35. . Moreover, since the support part 34 is formed in the taper shape, the package 3 which concerns on this embodiment can exhaust the air in the package 3 to the exterior efficiently.

  Next, a method for manufacturing the electronic device 1 according to this embodiment will be described.

  That is, first, the electronic component 2 is mounted on the mounting portion 31 provided on the base 32 of the package 3. Specifically, the electronic component 2 is mounted on the mounting portion 31 by inserting the electronic component 2 from an opening formed by the support portion 34 before joining the side surface of the support portion 34 and the lid 35. Here, the electronic component 2 and the mounting portion 31 are mounted by a bonding wire, a flip chip, or the like. After mounting the electronic component 2 on the mounting portion 31, the lid 35 is disposed on the support portion 34. Alternatively, the support portion 34 is disposed with respect to the lid body 35. That is, the support part 34 and the lid 35 are positioned.

  Then, the air in the package 3 is exhausted to the outside (exhaust process). Here, in the present embodiment, since the width of the support portion 34 in the thickness direction of the frame 33 is narrowed toward the lid 35, the package 3 according to the present embodiment has low exhaust resistance. For this reason, air existing in the package 3 can be exhausted to the outside in a short time in an exhaust process such as when the electronic device 1 is manufactured. Then, the bonding material 36 is interposed in the gap portion between the side surface of the support portion 34 and the lid body 35. In this case, the bonding material 36 is injected from the side surface of the support portion 34 facing the outside of the package 3. Here, since the width of the support portion 34 in the thickness direction of the frame 33 gradually decreases toward the lid body 35, the bonding material 36 can be easily applied to the support portion 34 facing the inside of the package 3. Can intervene. That is, in the package 3 according to the present embodiment, the bonding material 36 is interposed in the gap portion between the side surface of the support portion 34 and the lid body 35, so that the side surface and lid of the support portion 34 are compared with the conventional package. The bonding strength with the body 35 does not decrease.

  As described above, the electronic device 1 in which the electronic component 2 is hermetically sealed in the package 3 is manufactured.

  In addition, after positioning the support part 34 and the cover body 35, you may manufacture the electronic device 1 as follows. That is, the bonding material 36 is applied (formed) in advance to the portion of the lid 35 corresponding to the support portion 34. Instead of applying the bonding material 36 to the lid 35, it may be graded (rolled) or melted. In this state, the air in the package 3 is exhausted to the outside. In this case, the entire package 3 is preferably baked at a high temperature in order to promote the exhaust of the air in the package 3. When the entire package 3 is baked at a high temperature, it is more preferable that the bonding material 36 is melted and hinders exhaustion, and therefore baking is performed at a temperature that does not hinder the melting of the bonding material 36 and hinder exhaust. Then, after the inside of the package 3 is evacuated, the temperature is raised to a temperature at which the bonding material 36 melts. Thereby, the side surface of the support part 34 and the lid 35 are joined via the joining material 36. That is, also in such a method, the electronic device 1 in which the electronic component 2 is hermetically sealed in the package 3 can be manufactured.

  As described above, according to the package 3 according to the present embodiment, the air existing in the package 3 can be exhausted to the outside in a short time without deteriorating the quality and in the exhaust process such as manufacturing. it can.

  The above-described embodiment shows a specific example of the embodiment of the present invention, and various modifications can be made. The following are some major changes.

(Modification 1)
FIG. 3 is an enlarged cross-sectional view of a part of the electronic device 1a according to the first modification. As illustrated in FIG. 3, the package 3 a in the electronic device 1 a according to the first modification includes a support portion 34 a on the frame 33. The support portion 34 a has a first slope S ₁ that is inclined to the outside of the base body 32 and a second slope S ₂ that is inclined to the inside of the base body 32. Here, in the first modification, the angle of the second slope S ₂ with respect to the thickness direction of the frame 33 (direction T shown in FIG. 3) is larger than the angle of the first slope S ₁ with respect to the thickness direction of the frame 33. large. On the other hand, if this and conversely, the second inclined surfaces S ₂ of the angle with respect to the thickness direction of the frame 33, is smaller than the first inclined surface S ₁ of the angle with respect to the thickness direction of the frame 33, in the bonding material 36 Voids (bubbles) present in the are easily removed into the package 3a. That is, with this configuration, the purpose of the package 3a for hermetically sealing the electronic component 2 cannot be achieved. Therefore, in the first modification, as shown in FIG. 3, the angle of the second slope S ₂ with respect to the thickness direction of the frame 33 is set larger than the angle of the first slope S ₁ with respect to the thickness direction of the frame 33. Yes. This makes it easy for voids (bubbles) present in the bonding material 36 to escape to the outside of the package 3a. As a result, the quality of the package 3a can be improved.

(Modification 2)
FIG. 4 is a plan view illustrating an example of an electronic apparatus 1b according to the second modification. FIG. 5 is a cross-sectional view taken along the cutting line BB ′ shown in FIG. As shown in FIGS. 4 and 5, the electronic device 1 b according to the modification 2 includes a support portion 34 b for supporting the lid 35. Here, as in the support portion 34 shown in FIG. 1, the support portion 34 b shown in FIG. 4 and FIG. 5 becomes narrower as the width of the support portion 34 b in the thickness direction of the frame 33 goes toward the lid 35. . However, unlike the support part 34 shown in FIG. 1, the support part 34b protrudes from the frame 33 to the inside of the package 3b. In addition, the electronic device 1b according to the modification 2 includes a reinforcing portion F interposed between the support portion 34b and the base body 32. Here, in this embodiment, the reinforcement part F is provided over the full length of the support part 34b. Since the reinforcement part F interposed between the support part 34b and the base | substrate 32 is provided, the joining strength of the sealing part 34b and the cover body 35 improves. In addition, the reinforcement part F is formed from a ceramic material, a metal material, a glass material, a high heat-resistant resin material, etc., for example.

  4 and 5, the example in which the reinforcing portion F is provided over the entire length of the support portion 34b has been described. However, the present invention is not limited to this. That is, it may be provided in a part of the support portion 34b.

  That is, the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

FIG. 1 is a plan view showing an example of an electronic apparatus according to an embodiment of the present invention. 2 is a cross-sectional view taken along the cutting line AA ′ shown in FIG. FIG. 3 is an enlarged cross-sectional view of a part of the electronic device according to the first modification. FIG. 4 is a plan view illustrating an example of an electronic device according to the second modification. FIG. 5 is a cross-sectional view taken along the cutting line BB ′ shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1a, 1b Electronic device 2 Electronic component 3, 3a, 3b Electronic component storage package 31 Mounting part 32 Base body 33 Frame body 34, 34a, 34b Support part 35 Cover body 36 Bonding material

Claims (5)

An electronic component storage package comprising: a base provided with a mounting portion for mounting an electronic component; a frame provided so as to surround the mounting portion; and a lid for covering the mounting portion. ,
A support portion for supporting the lid body is provided on the frame body,
The width of the support portion in the thickness direction of the frame is gradually narrowed toward the lid,
The side surface of the support part and the lid are joined via a joining material ,
The support portion is formed in a taper shape, and has a first inclined surface inclined to the outside of the base and a second inclined surface inclined to the inside of the base,
The electronic component storage package , wherein an angle of the second inclined surface with respect to the thickness direction of the frame body is larger than an angle of the first inclined surface with respect to the thickness direction of the frame body . An electronic component storage package comprising a base provided with a mounting portion for mounting an electronic component, and a frame provided so as to surround the mounting portion,
On the frame body, provided with a support part for supporting a lid for covering the mounting part via a bonding material,
The width of the support portion in the thickness direction of the frame body is gradually narrowed toward the site for supporting the lid body ,
The support portion is formed in a taper shape, and has a first inclined surface inclined to the outside of the base and a second inclined surface inclined to the inside of the base,
The electronic component storage package , wherein an angle of the second inclined surface with respect to the thickness direction of the frame body is larger than an angle of the first inclined surface with respect to the thickness direction of the frame body . Further comprising an electronic component storing package according to claim 1 or 2, wherein the reinforcing portion interposed between the supporting portion and the base. The electronic component storage package according to any one of claims 1 to 3 ,
And an electronic component mounted on a mounting portion provided on a base of the electronic component storage package. A base provided with a mounting part for mounting an electronic component, a frame provided so as to surround the mounting part, and a lid for covering the mounting part on the frame A width of the support portion in the thickness direction of the frame body as it goes to the lid body.
In the electronic component storage package that is gradually narrowed, the step of mounting the electronic component on the mounting portion;
Arranging the lid with respect to the support, or arranging the support with respect to the lid;
Exhausting the air inside the electronic component storage package to the outside;
And a step of interposing a bonding material in a gap between the support and the lid .

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