JP5228931B2 - Glow plug energization control device - Google Patents

Description

  The present invention relates to a glow plug energization control device that controls energization of a glow plug.

  In general, in a diesel vehicle or the like, when the engine is started in a state where the temperature of the outside air is low and the temperature in the combustion chamber is low, the fuel ignition temperature is not reached even if the air in the combustion chamber is compressed. A glow plug containing a ceramic heater or the like is provided so as to protrude into the combustion chamber. The glow plug is energized only when the engine is started, and the energization of the glow plug is terminated after the engine is started.

  Here, a glow plug energization control device is provided to energize a desired voltage from an in-vehicle power source based on a control signal transmitted from the electronic control device to the glow plug. The glow plug energization control device is provided in the engine room and is electrically connected to the glow plug, the electronic control device, and the power source (for example, see Patent Document 1).

  In addition, the electrical circuit in the glow plug energization control device has a bus bar or a printed circuit board with a plurality of power transistors for switching energization and deenergization to the glow plug, and energization signals based on control signals transmitted from the electronic control device. A large number of electronic elements such as a control IC that transmits to a transistor at an appropriate timing are mounted.

  In recent years, in order to reduce the amount of nitrogen oxides or hydrocarbons discharged from a diesel engine or the like, it is required to lower the compression ratio of the engine. However, since the fuel ignition temperature also decreases as the compression ratio of the engine decreases, there is a concern that the combustion stability of the engine will decrease. Therefore, in order to improve the combustion stability of the engine when the compression ratio of the engine is lowered, it is required to keep the temperature in the combustion chamber at a high temperature by continuously energizing the glow plug even after the engine is started. A control method for energizing the glow plug even after the engine is started is called afterglow, and there is a need for a glow plug energization control device that can further enhance combustion stability by performing afterglow for a long time. It has been.

  Due to such a demand for afterglow, a power transistor with a large amount of heat generation continues to exhibit a predetermined performance, so that it is very important to improve the heat dissipation of the power transistor. Therefore, in order to improve the heat dissipation of the power transistor, it has been proposed to fix the circuit portion including the power transistor to a metal heat dissipation member with an adhesive.

  Thus, when attaching a circuit part to a heat sink, in order to improve productivity, it is calculated | required that a circuit part is fixed to a heat radiating member with other structural members, for example, a resin case.

JP 2007-255275 A

  However, when the circuit portion including the power transistor is bonded and fixed to the heat radiating member together with the structural member such as the resin case, it is necessary to bond and fix the circuit portion and the heat radiating member and the resin case and the heat radiating member. Therefore, in order to improve heat dissipation, the thickness of the adhesive that adheres and fixes the circuit part including the power transistor and the heat dissipation member that need to be managed with high precision is not required. And the thickness of the adhesive that adheres and fixes the heat dissipating member. Specifically, for example, the maximum tolerance of the thickness of the adhesive that bonds and fixes the resin case and the heat dissipation member may be added to the maximum tolerance of the thickness of the adhesive that bonds and fixes the circuit portion and the heat dissipation member. In such a case, the adhesive hinders the heat dissipation of the power transistor, and the heat dissipation that the heat generated in the circuit portion dissipates to the outside through the adhesive and the heat dissipation member is impaired. There is a possibility that the power transistor in the circuit unit cannot exhibit desired performance.

  Therefore, in view of the above problems, the present invention accurately manages the thickness of the adhesive that bonds the circuit portion including the power transistor and the heat radiating member, and allows the power transistor to continue to exhibit the desired performance. An object is to provide a control device.

In order to solve the above-described problems, a glow plug energization control device according to the present invention is configured to energize a glow plug based on a control signal generated by a power unit that switches energization to the glow plug and an electronic control device by supplying power from a power source. A circuit unit having a control unit that transmits a signal to the power unit at a predetermined timing; and a heat dissipation member that is bonded and fixed to the circuit unit with an adhesive and dissipates heat transmitted from the circuit unit via the adhesive to the outside. A resin member that supports the circuit portion and is bonded and fixed to the heat radiating member; a distance adjustment member that is provided between the resin member and the heat radiating member, and that adjusts a facing distance between the circuit portion and the heat radiating member ; It is joined to the lead provided in the circuit part, and the other end is held by the resin member and becomes a terminal connected to the power source, the electronic control device, and the glow plug, And a bus bar portion for electrically connecting the glow plug and the circuit portion, wherein the first main surface of the circuit portion is in contact with the second main surface of the opposing resin member, and the lead The bus bar portion is characterized in that the first main surface is in close contact with the second main surface by being welded in a direction perpendicular to the contact surface between the first main surface and the second main surface. . Thereby, the circuit part is held by the resin member via the bus bar part, and the circuit part is bonded and fixed to the heat dissipation member together with the resin member. Compared with the case where the resin member is bonded to the heat radiating member, the number of manufacturing steps can be reduced. Furthermore, since the stress is applied so that the first main surface and the second main surface are in close contact with each other by welding the lead and the bus bar portion, the reliability of the contact between the first main surface and the second main surface is improved. To do. Thereby, the manufacturing variation of a 1st main surface and a 2nd main surface does not affect the thickness of the adhesive agent between a circuit part and a heat radiating member, and the heat dissipation of a power part is ensured. Therefore, the power unit can exhibit desired performance.

  That is, the distance adjustment member provided between the circuit portion and the heat dissipation member adjusts and manages the facing distance between the circuit portion and the heat dissipation member. Thereby, since the thickness of the adhesive for bonding and fixing the circuit portion and the heat radiating portion can be determined by the facing distance, the tolerance at the time of bonding and fixing between the resin member supporting the circuit portion and the heat radiating member, and others Unaffected by design variations. Therefore, by accurately controlling the thickness of the adhesive, heat dissipation from the circuit portion to the heat dissipation member via the adhesive is ensured, and the power portion can exhibit desired performance.

  In the present invention, the distance adjusting member is preferably in contact with the heat radiating member. Thereby, it becomes possible to adjust and manage the facing distance between the resin member and the heat radiating member only by the distance adjusting member.

  In the present invention, it is preferable that the distance adjusting member and the resin member or the circuit portion are integrally formed. Thereby, the number of parts of the glow plug energization control device can be reduced.

  In the present invention, the distance adjusting member abuts on the resin member. Thereby, it becomes possible to adjust and manage the facing distance between the resin member and the heat radiating member only by the distance adjusting member.

  In the present invention, it is preferable that the distance adjusting member and the heat radiating member are integrally formed. Thereby, the number of parts of the glow plug energization control device can be reduced.

  In the present invention, it is preferable that the distance adjusting member positions the circuit portion. Thereby, a circuit part is reliably attached to the predetermined position of a resin member.

The present invention is a method for producing a grayed Ropuragu electrification control apparatus, after an adhesive is applied to the heat radiating member, a contact step of abutting the length adjusting member to the circuit unit or the heat radiating member, in parallel with the abutting step A glow plug energization control device manufacturing method comprising at least a bonding step in which a predetermined pressure is applied to bond and fix the resin member and the heat dissipation member, and the circuit portion and the heat dissipation member, respectively.

  That is, in the abutting step, the facing distance between the circuit portion and the heat radiating member is determined by bringing the distance adjusting member into contact with the circuit portion or the heat radiating member. By setting in view of the facing distance, since the thickness of the adhesive is determined by the facing distance, the accuracy of the thickness of the adhesive is improved. As a result, the heat generated in the circuit part is efficiently dissipated to the outside through the adhesive and the heat radiating member whose thickness is accurately controlled, so that the power part can continue to exhibit the desired performance. A glow plug energization control device can be manufactured.

It is a block diagram which shows typically the structure of the glow plug electricity supply control apparatus of embodiment in this invention. It is an external view of the upper surface of the glow plug energization control device of the embodiment in the present invention. It is an external view of the lower surface of the glow plug energization control device according to the embodiment of the present invention. It is an external view of the heat sink upper surface of embodiment in this invention. It is an external view of the upper surface of the glow plug energization control device according to the embodiment of the present invention. (Excluding lid) It is an external view of the bus-bar part upper surface of embodiment in this invention. It is a schematic diagram inside the multichip module of embodiment in this invention. It is an external view of the housing lower surface of the embodiment in the present invention. It is a schematic diagram which shows the power part of embodiment in this invention. It is AA sectional drawing in FIG. It is a flowchart which shows the manufacturing process of the glow plug electricity supply control apparatus in this invention. It is a schematic diagram which shows the change of the thickness of adhesives A and B in the manufacturing process of FIG. It is drawing which shows the modification of FIG. It is drawing which shows the modification of FIG. It is drawing which shows the modification of FIG. It is drawing which shows the modification of FIG.

  The configuration of the embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic diagram illustrating a configuration of a glow plug energization control system including a glow plug energization control device 6 and an electrical component in the vicinity thereof according to an embodiment of the present invention. As shown in FIG. 1, the glow plug energization control system mainly includes an engine 1, a key switch 2, a power source 3 such as a battery, glow plugs 4a, 4b, 4c and 4d, an electronic control device 5, and a glow plug energization control device. 6 is composed.

  The engine 1 of the present embodiment includes four cylinders (not shown), and when the key switch 2 is turned on, the glow plug energization control device 6 is controlled based on a control signal generated by the electronic control device 5. The energization / non-energization to 4d is controlled.

  The glow plugs 4a to 4d are provided so as to protrude into the combustion chambers of four cylinders (not shown). The glow plugs 4a to 4d incorporate a ceramic heater or the like, and the ceramic heater or the like is heated by energization to raise the temperature in the combustion chamber. In the present embodiment, the compression ratio of the engine 1 is designed to be 15-17.

  Vehicle information such as the voltage of the power source 3, the temperature of the combustion chamber, and the on / off signal of the key switch 2 is transmitted to the electronic control unit 5. Then, based on the vehicle information collected in the electronic control unit 5, the energization / non-energization of the glow plugs 4a to 4d is determined. When energization is performed, the PWM control is performed at a predetermined timing, for example, a frequency of several tens Hz. The control signal is intermittently output to the glow plug energization control device 6.

  The glow plug energization control device 6 energizes the glow plugs 4a to 4d based on the control signal of the electronic control device 5 when the key switch 2 is turned on. Specifically, before the engine 1 is started, when the temperature in the combustion chamber is low and the temperature in the combustion chamber needs to be raised, the power supply 3 sends the glow plugs 4a to 4d to the glow plugs 4a to 4d based on the control signal of the electronic control device 5, for example An effective voltage of 11V is applied. After the engine 1 is started, it is preferable to improve the combustion stability of the engine 1 by keeping the combustion chamber at a high temperature of, for example, 900 ° C. by performing afterglow for 10 minutes or more. Specifically, when energizing the glow plugs 4a to 4d by the afterglow control, for example, an effective voltage of 14V is applied to keep the combustion chamber at 900 ° C. for about 20 to 30 minutes. When the key switch 2 is turned off, the glow plug energization control device 6 ends energization to the glow plugs 4a to 4d.

  Hereinafter, the structure of the glow plug energization control device 6 will be described with reference to the drawings.

  2 is an external view of the upper surface of the glow plug energization control device 6, and FIG. 3 is an external view of the lower surface thereof.

  The glow plug energization control device 6 supplies a predetermined energization signal to the glow plugs 4a to 4d based on a control signal generated by a power unit that switches energization to the glow plugs 4a to 4d and an electronic control device by supplying power from the power source 3. A multi-chip module (corresponding to the circuit unit according to the present invention) having a control unit that transmits to the power unit at the timing of, and bonded and fixed to the multi-chip module with an adhesive, via the adhesive A heat sink 11 that dissipates heat transmitted from the multichip module to the outside (corresponding to a heat dissipation member according to the present invention), and a housing 10 that supports the multichip module and is bonded and fixed to the heat sink 11 ( Corresponding to the resin member according to the present invention), the housing 10 and the heat sink 1. Provided between, comprising a, a distance adjusting member for adjusting the opposing distance between the heat sink 11 and the multi-chip module.

  As shown in FIGS. 2 and 3, the resin housing 10 is accommodated in a case-shaped metal heat sink 11. The housing 10 has an outer shape constituted by four side portions 10a, 10b, 10c, and 10d that are made of a hard resin such as PPS and PBT and have a frame shape as a whole, and a lid portion 10e that closes an upper opening. From the outer surface of the side portion 10a, in order from the right toward the outer surface of the side portion 10a, a first connector portion 101 for connecting the power source 3 and the glow plug energization control device 6, glow plugs 4a and 4b, and a first described later. A second connector part 102 for connecting the two bus bar parts 22, a third connector part 103 for connecting the glow plugs 4 c, 4 d and the second bus bar part 22, and a third bus bar described later with the electronic control unit 5. A fourth connector portion 104 for connecting the portion 23 is provided so as to protrude. The connector portions 101 to 104 and the housing 10 are integrally formed and accommodate the terminals of the bus bar portion 20.

As shown in FIGS. 3 and 4, the heat sink 11 includes a box-shaped box portion 11a having two open surfaces, and a plurality of rectangular fins 11b that protrude from the outside of the bottom surface of the box portion 11a and are coupled to each other. Become.
The heat sink 11 is made of a metal having a thermal conductivity of 200 W / (m · K) or more, such as aluminum, or an alloy thereof, and accommodates the housing 10 by bonding and fixing.

  The heat sink 11 may be made of, for example, copper, iron, or an alloy thereof other than aluminum as long as it has a high thermal conductivity. Inside the bottom surface of the heat sink 11, a plane X on which a part of an adhesive A for bonding and fixing the multichip module and the heat sink 11 described later is applied, and an adhesive for bonding and fixing the housing 10 and the heat sink 11. There is a groove-like plane Y on which B is applied.

  FIG. 5 is a view showing a state in which the lid portion 10e of the housing 10 of FIG. 2 is partially cut away. Hereinafter, for the sake of simplicity, in the present embodiment, in FIG. 5, the thickness direction of the glow plug energization control device 6 and the direction from the paper surface toward the front is the upper side, and the opposite direction is the lower side.

  In a space surrounded on all sides by the side portions 10a to 10d of the housing 10, a bridging portion 10f is formed in parallel with the side portions 10a and 10c. A bus bar portion 20 constituting an electric circuit of the glow plug energization control device 6 is formed by insert molding, and the bus bar portion 20 is held by the side portions 10a to 10d and the bridging portion 10f.

  FIG. 6 shows the external appearance of the upper surface of the bus bar portion 20 before insert molding. The bus bar portion 20 is connected to the first bus bar portion 21 connected to the power source 3 and to the second glow plugs 4a to 4d. The bus bar portion 22 and the third bus bar portion 23 connected to the electronic control unit 5 are included. The third bus bar portion 23 includes a line for transmitting a control signal from the electronic control unit 5, a line for detecting a failure, a power source 3, and a line connected to the ground. The bus bar portion 20 is electrically connected to the multichip module 30 shown in FIG.

  FIG. 7 is a schematic view of the inside of the multichip module 30, and FIG. 8 is a back view of the housing 10 shown in FIG.

  As shown in FIGS. 7 and 8, the multichip module 30 has a rectangular box shape, in which one lead frame 31, four power units 32, and one control unit 33 are provided, and an epoxy resin is provided. And so on.

  In FIG. 7, the lead frame 31 is made of a metal such as copper, and includes two power supply leads 31a and one plate 31b. The plate 31b has a rectangular plate shape, and the power lead 31a is bent and joined to one end side of the bus bar portion 20, respectively. The four power units 32 and the control unit 33 are joined to the plate 31b by soldering.

  The power unit 32 is made of a MOSFET and is electrically connected to the glow plugs 4 a to 4 d via the power lead 32 a and the second bus bar unit 22. Specifically, as shown in FIG. 9, each power unit 32 is formed of a three-terminal planar type MOSFET that is a switching element. In the power unit 32, terminals are arranged in the order of the drain 321, the gate 322, and the source 323 from the surface fixed to the plate 31b upward. The drain 321 is joined and fixed to the lead frame 31 by soldering or the like, and both are electrically connected. The gate 322 is electrically connected to the control unit 33 by wire bonding, and a gate voltage is applied from the control unit 33 to the gate 322 based on a control signal. The source 323 is electrically connected to one end side of the four power leads 32a by wire bonding. The other end side of the power lead 32a is joined to one end side of the second bus bar portion 22, and the power portion 32 and the second bus bar portion 22 are electrically connected. With such a configuration, the current supplied from the power source 3 to the lead frame 31 is supplied to the glow plugs 4 a to 4 d at a predetermined timing by switching of the power unit 32.

  The control unit 33 is electrically connected to the power unit 32 by wire bonding, and transmits a signal to each of the four power units 32 with a phase shift based on a control signal sent from the electronic control unit 5. Thus, switching of the four power units 32 is controlled at a predetermined timing.

  The multichip module 30 also includes a power supply lead 31 a that electrically connects the internal lead frame 31 and the external first bus bar portion 21, and an internal power portion 32 and the second bus bar portion 22. Four power leads 32a to be connected and eight control leads 33a to electrically connect the internal control unit 33 and the external third bus bar portion 23 are provided so as to protrude outward from the mold resin 35. ing. Here, the power lead 31a, the power lead 32a, and the control lead 33a correspond to the leads described in the claims of the present invention.

  The power supply lead 31 a protrudes from the side of the rectangular box-shaped mold resin 35 toward the side portion 10 a of the housing 10 and is resistance-welded to one end side of the first bus bar portion 21 connected to the power supply 3. Similarly to the power supply lead 31a, the power lead 32a protrudes toward the side portion 10a and is resistance-welded to one end side of the second bus bar portion 22 connected to the glow plugs 4a to 4d. The control lead 33a protrudes from the side of the mold resin 35 toward the side portion 10c, and the control lead 33a is resistance-welded to one end side of the third bus bar portion 23 connected to the electronic control unit 5. Yes. The multichip module 30 is supported by the housing 10 by joining the leads 31 a, 32 a, 33 a and the bus bar portion 20.

  FIG. 10 is a cross-sectional view taken along the line AA in FIG. 5 and shows the respective structural parts accommodated in the housing 10. As shown in FIG. 10, the bridge portion 10f of the housing 10 has two substantially cylindrical projections 40 (corresponding to the distance adjusting member according to the present invention) projecting downward. The end surface of the protrusion 40 is in direct contact with the flat surface X of the heat sink. The multichip module 30 supported by the housing 10 is positioned at the bridging portion 10 f by the protrusion 40. The upper surface 30a of the multichip module 30 shown in FIG. 10 (corresponding to the first main surface described in the claims of the present invention) is the lower surface 100f of the opposing bridging portion 10f (described in the claims of the present invention). Corresponding to the second main surface), and the leads 31a, 32a, 33a and the bus bar portion 20 are welded in a direction perpendicular to the contact surface where the upper surface 30a and the lower surface 100f of the bridging portion 10f abut. By doing so, it is preferable that the upper surface 30a and the lower surface 100f are brought into close contact with each other. Thereby, the manufacturing variation in the contact state between the upper surface 30a and the lower surface 100f is reduced, and the variation in the contact state between the end surface of the protrusion 40 and the plane X is also reduced.

  The protrusion 40 is formed longer than the thickness of the mold resin 35 of the multichip module 30.

  Hereinafter, a method for manufacturing the glow plug energization control device 6 will be described before describing the effect produced by the protrusion 40.

  As shown in FIG. 11, first, the multichip module 30 is attached to the housing 10. The mold resin 35 of the multichip module 30 has an engaging portion 35a formed along the thickness direction at the central portion of the side surface in the longitudinal direction, and the engaging portion 35a and the protruding portion 40 engage with each other. Thus, the multichip module 30 is positioned at the bridging portion 10f. Then, each lead 31a, 32a, 33a and the bus-bar part 20 are each resistance-welded by energizing a big current, making each lead 31a, 32a, 33a and the bus-bar part 20 contact.

  Subsequently, two types of adhesives are applied to the inner surface of the heat sink 11 in an adhesion process. Of the inner surface of the heat sink 11, an adhesive A such as CY-52-333 (manufactured by Toray Industries, Inc.) or the like is applied to the plane X for bonding and fixing the multi chip module 30 and the heat sink 11 to the bottom surface 30 b of the multi chip module 30. Apply evenly over an equal area. On the other hand, an adhesive B with high heat dissipation, such as SE1714 (manufactured by Toray Industries, Inc.), is applied to the plane Y that bonds and fixes the side portions 10a to 10d of the housing 10 and the heat sink 11. Both the plane X and the plane Y are smooth surfaces without irregularities. At this time, as shown in FIG. 12A, the thicknesses of the adhesives A and B actually applied onto the heat sink 11 are t1 and t2, respectively. Here, t1 and t2 are average values of the thicknesses of the adhesives A and B applied to each product.

  The housing 10 is housed in the heat sink 11 to which the adhesive A and the adhesive B are applied, and the bottom surface 30b of the multichip module 30 and the side on which the multichip module 30 is indirectly supported on the plane X and the plane Y, respectively. The end faces of the portions 10a to 10d are bonded and fixed, respectively. In the contact step performed in parallel with the bonding step, a predetermined pressure, for example, 10 to 50 N is applied, and the end surface of the protrusion 40 is brought into contact with the plane X of the heat sink 11 without the adhesives A and B. When the predetermined pressure is applied, the average values of the thicknesses of the adhesives A and B in FIG. 12B are t1 ′ and t2 ′ after the contact step.

  Thereafter, in order to waterproof and moisture-proof the electric circuit in the space surrounded by the side portions 10a to 10d of the housing 10, a gel-like silicon resin or a filler-containing silicon resin having good thermal conductivity, or an epoxy resin or a gel (Not shown) is filled, and finally the housing 10 is watertightly sealed by the lid 10e. Through the manufacturing process described above, the glow plug energization control device 6 in which the housing 10 and the heat sink 11 are bonded and fixed is completed.

  In the above-described abutting step, the end surface of the protruding portion 40 that protrudes downward from the bridge portion 10f longer than the thickness of the multichip module 30 directly abuts on the plane X of the heat sink 11. Thereby, in order to ensure the heat dissipation of the power part 32 in the multichip module 30, the thickness of the adhesive A that requires high-precision management can be managed with high accuracy.

  Specifically, when the multichip module 30 supported by the housing 10 is bonded and fixed to the heat sink 11 in the bonding step and the abutting step, the protrusion 40 abuts on the plane X of the heat sink 11. That is, when the average value of the facing distance between the plane X of the heat sink 11 and the bottom surface 30b of the multichip module 30 is D, the facing distance D is a value obtained by subtracting the thickness of the multichip module 30 from the length of the protrusion 40. As such, it is uniquely determined from the structure. Thus, by determining the facing distance D by providing the protrusion 40, the thickness t1 of the adhesive A applied at least between the plane X and the bottom surface 30b of the multichip module 30 is larger than the facing distance D. If it is larger, the thickness t1 ′ of the adhesive A after the contact step becomes equal to the facing distance D. Therefore, the thickness t1 ′ of the adhesive A is accurately controlled because it is not affected by variations in pressure applied during the bonding process, temperature, or the like.

  More specifically, with respect to the thickness t1 of the adhesive A applied during the bonding process and the thickness t2 of the adhesive B, the tolerance values ± d1 and ± d2 of about 50 μm are taken into consideration, and the target value T1 of the thickness of the adhesive A is determined. Set T1> D + d1. Thus, when the target value T1 of the thickness of the adhesive A satisfies the relationship of T1> D + d1, the bottom surface 30b of the multichip module 30 and the flat surface X of the heat sink 11 are securely bonded, and bonding after bonding is performed. The thickness t1 ′ of the agent A conforms to the facing distance D. Note that the length of the protrusion 40 also has a dimensional tolerance ± d3 during molding, but the dimensional tolerance d3 of the protrusion 40, which is a structure, is entangled with various factors such as pressure, temperature, and application amount during assembly. Management is easier than the generated tolerances d1 and d2, and the facing distance D can be managed with higher accuracy than the thicknesses of the adhesives A and B. Therefore, since the multichip module 30 and the heat sink 11 are securely bonded and fixed by the adhesive A having the thickness t1 ′ according to the facing distance D, the variation in the thickness t1 ′ can be suppressed. From the above, the heat generated in the power unit 32 is transmitted through the adhesive A even when the glow plugs 4a to 4d are energized for a long time, for example, for 20 to 30 minutes, in the multichip module 30 for afterglow. And efficiently transmitted to the heat sink 11. Therefore, the power unit 32 can continue to exhibit desired performance.

Note that the thickness t2 of the adhesive B applied in the bonding process and the thickness t2 ′ of the adhesive B after the contacting process are the same as the side part at the same time that the protrusion 40 contacts the plane X of the heat sink 11 in the manufacturing process. The thickness of the end faces 10a to 10d and the flat surface Y of the heat sink 11 can be bonded and fixed, and the thickness is set to a value that does not interfere with the contact between the protrusion 40 and the flat surface X of the heat sink 11 in the contact process. Need.
(Other embodiments)
Although one embodiment of the present invention has been described above, the present invention is not construed as being limited to such an embodiment, and can be applied to various embodiments without departing from the spirit of the present invention. .

  For example, in the above embodiment, the protrusion 40 is formed integrally with the bridging portion 10f of the housing 10, but as shown in FIG. 13, the protrusion 40 is formed integrally with the heat sink 11, and the end surface of the protrusion 40 is formed. May be brought into contact with the lower surface 100 f of the bridging portion 10 f of the housing 10. Similarly, as shown in FIG. 14, an L-shaped protrusion 40 is formed integrally with the mold resin 35 of the multichip module 30, and the end surface of the protrusion 40 is brought into contact with the plane X of the heat sink 11. Also good. As described above, the shape of the protrusion 40 is not particularly limited as long as the facing distance between the bottom surface 30b of the multichip module 30 and the plane X is determined. Moreover, if the thickness t1 ′ of the adhesive A after bonding is within a range determined by the facing distance D, the number of the protrusions 40 and the protruding position are not particularly limited.

  Further, if the thickness t1 ′ of the adhesive A after bonding is determined by the facing distance D, a plane where the end face of the protrusion 40 and the inner surface of the heat sink 11 abut and a plane X where the adhesive A is applied are obtained. It does not have to be on the same plane. For example, as shown in FIG. 15, the plane where the end face of the protrusion 40 and the inner surface of the heat sink 11 abut is in the recess 11c recessed from the plane X to which the adhesive A is applied, and the protrusion 40 is the recess 11c. And the mounting position of the protrusion 40 with respect to the heat sink 11 is positioned. Since the protrusion 40 contacts the bottom surface of the recess 11c, the thickness t1 ′ of the adhesive A interposed between the bottom surface 30b of the multichip module 30 and the plane X of the heat sink 11 is naturally determined. The variation in the manufacturing process of the thickness t1 ′ is reduced. Therefore, the power unit 32 can continue to exhibit the desired performance.

  Furthermore, in the above embodiment, the electric circuit of the glow plug energization control device 6 is mainly composed of the bus bar portion 20 and the multichip module 30, but instead of the bus bar portion 20, a multi-chip is formed on the lower surface of a ceramic substrate (not shown). Even in the glow plug energization control device 6 in which the chip module 30 is mounted and the ceramic substrate is supported by the housing 10, the same effect as in the above embodiment can be obtained.

  In the above embodiment, as shown in FIG. 8, the engaging portion 35 a is formed along the thickness direction at the center portion of the side surface in the longitudinal direction of the mold resin 35, and the engaging portion 35 a and the protruding portion 40 are formed. The multi-chip module 30 is positioned by engaging, but as shown in FIG. 16, an engaging portion 35a is formed in the central portion of the side surface perpendicular to the longitudinal direction of the mold resin 35, and the engaging portion 35a The multi-chip module 30 may be positioned by engaging the protrusion 40.

  In addition to the above, the structure of the glow plug energization control device 6 can be appropriately changed as long as it is within the range specified in the claims.

DESCRIPTION OF SYMBOLS 1 ... Engine 2 ... Key switch 3 ... Power supply 4a, 4b, 4c, 4d ... Glow plug 5 ... Electronic control device 6 ... Glow plug electricity supply control device 10 ... Housing (resin member)
10a, 10b, 10c, 10d ... side portion 10e ... lid portion 10f ... bridging portion 100f ... bottom surface (second main surface)
DESCRIPTION OF SYMBOLS 101 ... 1st connector part 102 ... 2nd connector part 103 ... 3rd connector part 104 ... 4th connector part 11 ... Heat sink (heat dissipation member)
DESCRIPTION OF SYMBOLS 11a ... Plate part 11b ... Fin 11c ... Recess 20 ... Bus bar part 21 ... First bus bar part 312 ... Projection part 22 ... Second bus bar part 23 ... Third bus bar part 30 ... Multichip module 30a ... Upper surface (first main surface)
30b ... Bottom 31 ... Lead frame 31a ... Power supply lead 31b ... Plate 32 ... Power section 32a ... Power lead 321 ... Drain 322 ... Gate 323 ... Source 33 ... Control part 33a ... Control lead 35 ... Mold resin 35a ... Engagement Part 40 ... Projection part 40

Claims (8)

A circuit unit having a power unit that switches energization to the glow plug by power supply from a power source and a control unit that transmits an energization signal to the glow plug based on a control signal generated by the electronic control unit to the power unit at a predetermined timing When,
A heat dissipation member that is bonded and fixed to the circuit portion with an adhesive, and dissipates heat transmitted from the circuit portion via the adhesive to the outside.
A resin member that supports the circuit portion and is bonded and fixed to the heat dissipation member;
A distance adjusting member provided between the resin member and the heat radiating member, and adjusting a facing distance between the circuit portion and the heat radiating member ;
One end side is joined to a lead provided in the circuit unit, and the other end side is a terminal connected to the power source, the electronic control unit, and the glow plug, and the power source, the electronic control unit, and the glow plug A bus bar portion that electrically connects the circuit portion,
The first main surface of the circuit portion is in contact with the second main surface of the resin member that is opposed, and the lead and the bus bar portion are contact surfaces of the first main surface and the second main surface. A glow plug energization control device , wherein the first main surface is in close contact with the second main surface by welding in a direction perpendicular to the first main surface .   The glow plug energization control device according to claim 1, wherein the distance adjustment member is in contact with the heat dissipation member.   The glow plug energization control device according to claim 1 or 2, wherein the distance adjusting member and the resin member are integrally formed.   The glow plug energization control device according to claim 1, wherein the distance adjusting member and the circuit unit are integrally formed.   The glow plug energization control device according to claim 1, wherein the distance adjusting member is in contact with the resin member.   The glow plug energization control device according to claim 5, wherein the distance adjusting member and the heat radiating member are integrally formed. The glow plug energization control device according to claim 1 , wherein the distance adjusting member positions the circuit unit . It is a manufacturing method of the glow plug electricity supply control device as described in any one of Claims 1 thru | or 7, Comprising: After apply | coating the said adhesive agent to the said heat radiating member, the said distance adjustment member is attached to the said resin member or the said heat radiating member. An abutting step for abutting;
In parallel with the abutting step, a bonding step of applying a predetermined pressure to bond and fix the resin member and the heat radiating member, and the circuit portion and the heat radiating member, respectively.
Method of manufacturing features and to Heidelberg Ropuragu electrification control apparatus to have at least a.

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