JP5234866B2 - Light irradiation device - Google Patents

Description

  The present invention relates to a light irradiation apparatus. More specifically, the adhesive force of an adhesive sheet can be lost or reduced by irradiating light to a processing object such as a semiconductor wafer to which a photoreactive adhesive sheet is attached. It is related with the light irradiation apparatus which can be performed.

  In a processing apparatus for a semiconductor wafer (hereinafter simply referred to as “wafer”), a protective adhesive sheet is applied to the circuit surface of the wafer to perform back surface grinding, or a dicing tape is applied to a plurality of chips. A process of tidy up is performed. The adhesive sheet used for such treatment employs an ultraviolet curable (photoreactive) adhesive as the adhesive, and is bonded by an ultraviolet irradiation device (light irradiation device) after the above treatment. The adhesive is weakened by curing the agent, and the adhesive sheet can be easily peeled off so that the wafer is not damaged.

  For example, Patent Document 1 discloses the ultraviolet irradiation device. The ultraviolet irradiation apparatus in the same document includes a case that accommodates wafers affixed to an adhesive sheet in a multi-stage shape, an ultraviolet irradiation means that is located at the lower part of the case and has a plate glass disposed on the upper surface side, and a wafer carry-in / out means The unloading / unloading means takes out the wafers one by one from the case and positions the wafers on the plate glass so that ultraviolet irradiation can be performed.

JP 2007-329300 A

  However, since the ultraviolet irradiation apparatus disclosed in Patent Document 1 is configured to irradiate ultraviolet rays for each wafer, the processing efficiency when a large number of wafers are subjected to ultraviolet irradiation is very low. There is an inconvenience.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to provide a high-efficiency ultraviolet irradiation capable of simultaneously irradiating and reacting a plurality of processing objects. To provide an apparatus.
Another object of the present invention is to provide an ultraviolet irradiation device capable of controlling light irradiation in accordance with the shape and presence / absence of a processing object when a plurality of processing objects are targets of light irradiation. There is.

  In order to achieve the above-mentioned object, the present invention has a light-reactive adhesive sheet attached thereto and emits light with the sheet application surface side of a plurality of processing objects supported at a predetermined interval from each other as an irradiated surface. In the light irradiation apparatus for irradiation, the light irradiation means having a plurality of irradiation bodies for irradiating the irradiated surface with light, and the plurality of processing objects and the light irradiation means are provided so as to be relatively movable in the approaching and separating directions. The plurality of irradiation bodies are provided so as to be opposed to the irradiated surfaces of the plurality of processing objects via the moving means, and the plurality of irradiated surfaces can be irradiated with light simultaneously. It has a configuration that is provided.

  In this invention, the said light irradiation means has a light source, The said irradiation body contains the light guide member for irradiating the said light-emitted surface with the light emitted from the light source, and the said light guide member is the said process target object. It is possible to adopt a configuration in which it can be positioned between them.

  Moreover, the said irradiation body is comprised in the surface parallel to the said to-be-irradiated surface, and is comprised by the one or several light emitting diode arrange | positioned in the direction orthogonal to the said relative movement direction.

  Further, the light emitting diode can be configured to irradiate light only to a region corresponding to the shape of the processing object.

  In addition, it includes a detection unit that detects the presence or absence of the processing object, and the light irradiation unit includes a light emission control unit that controls light emission and non-light emission of the irradiation body based on a detection result of the detection unit. Yes.

  Furthermore, it is possible to adopt a configuration further including an aligning means for aligning the processing objects.

  Further, it is preferable that the plurality of processing objects and the light irradiation means are arranged in a case that can be sealed and provided with an inert gas in the case so that an inert gas can be supplied.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to light-irradiate with respect to a several process target object simultaneously, and the processing efficiency of light irradiation can be improved greatly.
Moreover, in the structure which employ | adopted the light guide member which irradiates light to a to-be-irradiated surface, it becomes possible to position a light guide member between several process target objects, and to perform light irradiation. Therefore, it is possible to irradiate a plurality of objects to be processed in a lump, and the efficiency of light irradiation can be improved also from this point.
Furthermore, when a light emitting diode is used, power saving can be achieved, and wasteful power consumption can be avoided by variably setting the irradiation area.
Further, in the configuration in which the light irradiation means controls the light emission and non-light emission of the irradiation body based on the detection result of the detection means, it is possible to prevent inconvenience that a part of the processing object is excessively irradiated with light. In addition, power consumption when a light emitting diode is employed can be suppressed.
Furthermore, if it is set as the structure containing an alignment means, a process target object can be kept in a suitable position, light irradiation can be performed, and partial irradiation omission can be avoided.
Further, if an inert gas can be supplied into the case, for example, when an ultraviolet curable adhesive sheet is employed, poor curing of the adhesive due to oxygen inhibition can be prevented.

The schematic perspective view of the ultraviolet irradiation device concerning this embodiment. The schematic perspective view of a process target object. The schematic front view which looked at a part of ultraviolet irradiation device in cross section. The schematic plan view of an ultraviolet irradiation device. Operation | movement explanatory drawing of an ultraviolet irradiation device. The schematic plan view which shows the modification of an ultraviolet irradiation device.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic perspective view according to an embodiment in which the present invention is applied to an ultraviolet irradiation device, and FIG. 2 shows a schematic perspective view of a processing object. In these drawings, the ultraviolet irradiation device 10 includes an accommodating means 11 that accommodates a wafer W having an ultraviolet curable (photoreactive) adhesive sheet S attached to a circuit surface as an object to be processed, and an adhesive sheet S for the wafer W. The ultraviolet irradiation unit 12 as light irradiation means for irradiating light with the application surface as the irradiated surface, the moving means 13 for moving the accommodation means 11 and the light irradiation means 12 in the direction of separation from each other, and the accommodation means 11 The supporting means 14 for supporting the movement of the wafer W, the detecting means 15 for detecting the presence or absence of the wafer W in the accommodating means 11, the aligning means 17 for aligning the position of the wafer W at a predetermined position, and these means are integrated. The housing 18 is configured to be accommodated. Here, the wafer W constituting the object to be processed in the present embodiment is mounted on the ring frame RF via the dicing tape T from the surface opposite to the surface to which the adhesive sheet S is attached, as shown in FIG. Has been.

  The accommodating means 11 includes a cassette case 21 that is mounted on the ring frame RF and has an opening 20 that can accommodate the wafer W. The cassette case 21 includes a plurality of rails 27 for supporting the ring frame RF at equal intervals at symmetrical positions on the inner surface side of the pair of side walls 25.

  As shown in FIG. 3, the ultraviolet irradiation unit 12 includes a lamp case 30 extending in the vertical direction, a light source 31 such as a high-pressure mercury lamp disposed in the lamp case 30, and light emitted from the light source 31. A light guide member 33 (surface light source) as an illuminator that emits light by introducing light, an arm 34 including a light guide plate that supports the light guide member 33 and guides light to the light guide member 33, and a light source 31 And a shutter 35 as a light emission control means disposed between the two. The light guide members 33 are provided at the same interval with respect to the interval between the processing objects in the cassette case 21, and the same number of the light guide members 33 is provided. Thereby, the light emitted by the light source 31 is emitted by the light guide member 33 through the shutter 35, and the light guide to the light guide member 33 is configured to have an ON-OFF control function by the shutter 35. The light guide member 33 is provided in a shape substantially coinciding with the planar shape of the wafer W, and is configured such that its upper surface side becomes a light emitting surface. Note that ultraviolet rays are not emitted from the surface of the arm 34.

  The moving means 13 is constituted by a single-axis robot 40 arranged along the X-axis direction, and is configured to support the lamp case 30 of the ultraviolet irradiation unit 12 on the upper surface of the slider 41 of the single-axis robot 40. . Accordingly, when the slider 41 moves in the X-axis direction, the ultraviolet irradiation unit 12 can be separated from and approached to the cassette case 21, whereby the light guide member 33 is brought into contact with the irradiated surface of the wafer W through the opening 20. It is arranged to face each other.

  The support means 14 includes a single-axis robot 45 disposed along the Z-axis direction, a receiving plate 48 fixed to the slider 46 of the single-axis robot 45 via a bracket 47 (see FIG. 3), a cassette case The cassette case 21 is placed at a predetermined position on the receiving plate 48 and is supported so as to be able to move up and down.

  The detection means 15 is constituted by a sensor such as a photoelectric tube, a limit switch, a CCD camera, etc. fixed to the case 18 via a bracket (not shown). The detection means 15 is configured to detect whether or not a processing target exists at the accommodation position in each stage in the cassette case 21 and includes a function of outputting the detection signal to a control device (not shown). .

  The alignment means 17 includes a pair of motors M arranged on the opening 20 side, and a positioning arm 52 fixed to the output shaft of each motor M. The positioning arm 52 is rotatable between a position indicated by a two-dot chain line in FIG. 4 and a position indicated by a solid line position. The positioning arm 52 abuts on the ring frame RF in the cassette case 21 through the opening 20 to perform processing. The object is positioned at a predetermined position.

  The case 18 is provided in a substantially rectangular parallelepiped outer shape, opens and closes the window hole 54 via a case main body 53 having a window hole 54 that can pass through the cassette case 21 and driving means (not shown), and seals the inside of the case 18. A slide top plate 55 that can be used is provided. Further, a pipe 56 is connected to the upper side wall portion of the case body 53, and the case 18 is filled with nitrogen gas as an inert gas through the pipe 56 so that ultraviolet irradiation can be performed in a nitrogen gas atmosphere. ing.

  Next, the ultraviolet irradiation method according to this embodiment will be described with reference to FIG.

  As shown in FIG. 5, in a state where the window hole 54 is opened by the slide top plate 55 and the receiving plate 48 is raised, the cassette case 21 in which the processing object is stored in each stage is received via a conveying means (not shown). Transferred to the plate 48. Next, after the single axis robot 45 is driven and the receiving plate 48 is lowered to position the cassette case 21 in the case 18, the slide top plate 55 closes the window hole 54 (see FIG. 3). When the cassette case 21 is lowered, the detection means 15 detects whether or not a processing object is present in each stage of the cassette case 21 and outputs a detection signal to a control device (not shown).

  When the cassette case 21 is disposed in the case 18 in a predetermined manner, the positioning arm 52 rotates from the position indicated by the two-dot chain line in FIG. 4 to the position indicated by the solid line, and comes into contact with the outer periphery of the ring frame RF. Positioning is performed. Before and after this, the case 18 is filled with nitrogen gas from the pipe 56.

  Next, when the ultraviolet irradiation unit 12 moves to the cassette case 21 side via the single-axis robot 40, the light guide member 33 is disposed so as to face the irradiated surface through the opening 20, and the shutter 35 opens to open the light guide member. 33 is caused to emit light and irradiated with ultraviolet rays for a predetermined time. When it is detected by the detection means 15 that there is no object to be processed at a specific position in the cassette case 21, the optical signal is blocked without opening the shutter 35 by an operation signal of a control device (not shown), Light irradiation from the corresponding light guide member 33 is not performed.

  When the ultraviolet irradiation is completed, the shutter 35 is closed and the ultraviolet irradiation unit 12 moves backward via the single-axis robot 40, while the slide top plate 55 moves to a position where the window hole 54 is opened. Then, after the single-axis robot 45 is driven to raise the cassette case 21 (see FIG. 5), the cassette case 21 is transported to the next process via transport means (not shown), and a new cassette case 21 is received. 48.

  Therefore, according to such an embodiment, it is possible to simultaneously irradiate a large number of processing objects with ultraviolet rays, and it is possible to obtain an effect that the processing efficiency per unit time can be dramatically improved.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above embodiment, the case where the ultraviolet irradiation unit 12 includes the light guide member 33 is illustrated and described, but the present invention is not limited to this, and the ultraviolet irradiation unit 60 shown in FIG. 6 is adopted. can do. The ultraviolet irradiation unit 60 includes a support 61 supported by the slider 41 of the single-axis robot 40, an arm 63 protruding from the side end surface of the support 61, and a direction orthogonal to the moving direction of the slider 41 on the arm 63. A plurality of light emitting diodes (illuminating bodies) 65 arranged are provided. Here, each light-emitting diode 65 is provided so that light irradiation can be controlled independently, so that light irradiation can be performed only on necessary portions according to the planar shape of the irradiated surface. .

  In the modification shown in FIG. 6, the light emitting diode 65 emits light just before entering the inside through the opening 30 of the cassette case 21, and light irradiation is performed by reciprocating along the irradiated surface. The light emission is controlled to stop when the light exits outside. At this time, since the wafer W is circular, the light emitting diode 65 located in the central portion initially emits light, and the light emitting region is enlarged as it approaches the central portion of the wafer W. Individual control is performed to reduce the size and finally return to light emission only in the central portion. When the light emitting diode 65 is employed in this way, a control means (not shown) that gives a light emission command to the light emitting diode 65 becomes the light emission control means.

  Therefore, in such a modification, the light emission control of the light emitting diode 65 can be performed even in accordance with the planar shape of the irradiated surface, so that the power consumption can be reduced in addition to the effects obtained in the embodiment. A separate effect can be obtained.

  Further, the relative positions of the respective parts constituting the ultraviolet irradiation apparatus 10, that is, the layout, are not limited to the illustrated configuration example. For example, in the above embodiment, the cassette case 21 can be inserted and removed from the upper side of the case 18. However, the cassette case 21 can be removed from the side wall portion of the case 18 by providing the support means 14 with a mechanism that can rotate in a plane. A configuration for taking in and out can be adopted.

  Furthermore, in the said embodiment, although the ultraviolet irradiation units 12 and 60 moved along the X-axis direction, the cassette case 21 could be separated and approached, but at least one of the ultraviolet irradiation units 12 and 60 and the cassette case 21 is It is sufficient to configure it to move.

  Moreover, in the said embodiment, although the adhesive agent of the adhesive sheet S was hardened by irradiating with an ultraviolet-ray, the said heat-sensitive adhesive sheet is temporarily attached to a to-be-adhered body, and the said adhesion | attachment is carried out by heating this. The present invention can also be applied to an apparatus for strongly attaching a sheet to an adherend. Examples of light in this case include infrared rays.

  Further, the irradiated object is not limited to the wafer W, and other objects such as a glass plate, a steel plate, or a resin plate can be targeted. The semiconductor wafer is a silicon wafer or a compound wafer. Also good.

  Further, as the light source of the ultraviolet irradiation unit 12, the use of a halogen lamp, a fluorescent lamp, a metal halide lamp, etc. in addition to a high-pressure mercury lamp is not hindered.

  Further, the support plate 48 of the support means 14 can be raised and lowered via the single-axis robot 45. However, if the means for transporting the cassette case 21 is accessible in the case 18, the support plate 48 is fixed. May be. In this case, the single axis robot 45 can be omitted.

10 Ultraviolet irradiation device (light irradiation device)
11 Storage means 12, 60 Ultraviolet irradiation unit (light irradiation means)
DESCRIPTION OF SYMBOLS 13 Movement means 15 Detection means 17 Alignment means 18 Case 20 Opening part 31 Light source 33 Light guide member (irradiation body)
35 Shutter (light emission control means)
65 Light-emitting diode (irradiator)
S Adhesive sheet (object to be processed)
W Semiconductor wafer (object to be processed)

Claims (7)

In the light irradiation device that irradiates light with the light application type adhesive sheet being attached and irradiating the irradiated surface with the sheet attaching surface side of a plurality of processing objects supported at a predetermined interval from each other,
A light irradiating means having a plurality of irradiating bodies for irradiating the irradiated surface with light, and a moving means provided so as to be relatively movable in the separation approaching direction with the plurality of processing objects and the light irradiating means,
The plurality of irradiated bodies are provided so as to be opposed to the irradiated surfaces of the plurality of processing objects via a moving unit, respectively, and are provided so as to be capable of irradiating light to the plurality of irradiated surfaces simultaneously. The light irradiation apparatus characterized by this.   The light irradiation means includes a light source, and the irradiation body includes a light guide member for irradiating the irradiated surface with light emitted from the light source, and the light guide member can be positioned between the processing objects. The light irradiation apparatus according to claim 1, wherein the light irradiation apparatus is provided.   The said irradiation body is comprised in the surface parallel to the said to-be-irradiated surface, and is comprised by the one or several light emitting diode arrange | positioned in the direction orthogonal to the said relative movement direction. Light irradiation device.   The said light emitting diode irradiates light only to the area | region corresponding to the shape of the said process target object, The light irradiation apparatus of Claim 3 characterized by the above-mentioned.   The light irradiation means includes a light emission control means for controlling light emission and non-light emission of the irradiation body based on a detection result of the detection means. Item 5. The light irradiation device according to items 1 to 4.   6. The light irradiation apparatus according to claim 1, further comprising alignment means for aligning the processing objects.   The plurality of processing objects and the light irradiation means are arranged in a case that can be sealed, and are provided so that an inert gas can be supplied to the case. Light irradiation device.

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