JP5254875B2 - Mounting machine - Google Patents

Description

  The present invention relates to a mounting machine, and in particular, a mounting including a first head unit movable above a base and a second head unit movable above the base independently of the first head unit. Related to the machine.

  2. Description of the Related Art Conventionally, a mounting machine including a first head unit that can move above a base and a second head unit that can move above the base independently of the first head unit is known.

  In such a mounting machine, when mounting a component on a single printed circuit board using the first head unit and the second head unit, the first head unit is used for mounting the component by the first head unit. The position of the printed circuit board is recognized by imaging the fiducial mark of the printed circuit board by the imaging device provided in the unit, and the first head unit is driven based on the recognition result (the position of the printed circuit board) to Wearing. In addition, when the component is mounted by the second head unit, the position of the printed circuit board is recognized by re-imaging the fiducial mark of the printed circuit board by the imaging device provided in the second head unit, and the recognition result Based on the above, the second head unit was driven to mount the parts.

  However, since it is necessary for both the first head unit and the second head unit to separately capture the fiducial mark on the printed circuit board, the time for moving the head unit to recognize the fiducial mark (second head) The recognition time of the fiducial mark is increased by the time required to move the unit), and as a result, the productivity is lowered.

  Therefore, conventionally, in order to eliminate the above inconvenience, the fiducial mark on the printed circuit board is imaged only by the imaging device of the first head unit, and the fiducial mark on the printed circuit board is imaged by the second head unit. 2. Description of the Related Art A mounting machine that mounts components without performing the process is known (for example, see Patent Document 1).

  In Patent Document 1, the position calibration data of the first head unit and the position calibration data of the second head unit are obtained using a calibration board provided with a plurality of reference marks before the component is mounted on the printed board. doing. When mounting the component on the printed circuit board, when the first head unit is mounted, the fiducial mark of the printed circuit board is imaged by the imaging device of the first head unit to recognize the position data of the printed circuit board. At the same time, based on the position data of the printed circuit board and the position calibration data (position correction data) of the first head unit, the first head unit is driven to mount the component on the printed circuit board. During the mounting operation by the second head unit, the fiducial mark of the printed circuit board is not imaged by the imaging device of the second head unit, and the position of the printed circuit board obtained by imaging the printed circuit board by the imaging device of the first head unit Based on the data and the position calibration data (position correction data) of the second head unit, the second head unit is driven to mount the component on the printed circuit board. Although not specified in Patent Document 1, the same mark (reference mark provided on the calibration board) is imaged by each of the imaging device of the first head unit and the imaging device of the second head unit. Based on the imaging result, the position of the first head unit and the position of the second head unit can be associated with each other, and as a result, only the fiducial mark on the printed circuit board is imaged by the imaging device of the first head unit. Thus, it is considered that the component mounting operation by the second head unit can be performed without imaging the fiducial mark on the printed circuit board by the imaging device of the second head unit.

Japanese Patent No. 3744251

  However, in Patent Document 1, it is necessary to perform a process of imaging the calibration board after placing the calibration board at a predetermined position and then removing the calibration board before the component mounting operation. As a result, the number of mounting processes is increased by the placement and removal of the calibration board, and as a result, there is a problem in that productivity is reduced due to the acquisition of position calibration data (position correction data). In addition, when a disturbance such as shaking of the transport conveyor occurs when the calibration board is imaged, there may be a case where accurate position calibration data cannot be acquired. In this case, when the component is mounted on the printed circuit board by driving the second head unit based on the position data of the printed circuit board acquired by the imaging device of the first head unit and the position calibration data of the second head unit. There is a problem that it is difficult to mount the component at an accurate position on the printed circuit board.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to obtain position correction data in a mounting machine having a first head unit and a second head unit. It is an object of the present invention to provide a mounting machine capable of suppressing a decrease in productivity due to the above and capable of mounting a component at an accurate position.

Means for Solving the Problems and Effects of the Invention

A mounting machine according to one aspect of the present invention is provided for mounting a component on a base and a substrate that is disposed on the base and has a fiducial mark, and includes a first imaging device and a base. A first head unit that is movable above the base, and a second head that is provided for mounting a component on the substrate, has a second imaging device, and is movable above the base independently of the first head unit. 2 base units and a base within a first movement range that is a movement range of the first imaging device of the first head unit and within a second movement range that is a movement range of the second imaging device of the second head unit A plurality of base marks including a first base mark disposed above, and a control device that controls driving of the first head unit, the first image pickup device, the second head unit, and the second image pickup device; The device is the first By imaging at least a first base marked by the respective device and a second imaging device, a first correction value for correcting a relative shift of the coordinate system of the second head unit with respect to the coordinate system of the first head unit, The second correction value for correcting the positional deviation of the control position of the first head unit with respect to the actual position and the third correction value for correcting the positional deviation of the control position of the second head unit with respect to the actual position are configured to be acquired. When the component is mounted on the substrate, the control device images the fiducial mark on the substrate by the first image pickup device, and the mounting of the component on the substrate by the first head unit is performed on the fiducial mark. performed based on the imaging result and the second correction value, Fiduciary Sharma the attachment to the substrate of the component according to the second head unit according to the first imaging device Click imaging result, and is configured to perform, based on the third correction value and the first correction value.

In the mounting machine according to the one aspect, as described above, the first base mark is imaged by both the first imaging device and the second imaging device, so that the second head unit with respect to the coordinate system of the first head unit is captured. By acquiring a first correction value for correcting a relative shift in the coordinate system, a first correction value is acquired using a mark (base mark) fixedly provided on a base that is a heavy object. Therefore, it is possible to suppress a change in the imaging result of the mark (base mark) due to the influence of disturbance. Thereby, when acquiring the 1st correction value, since it can make it difficult to receive the influence of disturbance, the 1st correction value can be acquired correctly. In addition, since the first correction value (position correction data) can be acquired by imaging the base mark originally placed on the base, the calibration substrate is placed and removed in order to obtain the first correction value. There is no need to do. Accordingly, it is not necessary to go through an extra step of placing and removing the calibration board before the mounting operation in order to obtain the first correction value (position correction data), and as a result, the position correction data is acquired. It is possible to suppress a decrease in productivity. In addition, by mounting the component on the substrate by the second head unit based on the imaging result of the fiducial mark by the first imaging device and the first correction value, based on the first correction value obtained accurately. Since the component can be mounted on the substrate by the second head unit, even when the productivity is improved by omitting the fiducial mark imaging step by the second imaging device of the second head unit. The parts can be mounted at the correct positions. In addition, the control device captures at least the first base mark by each of the first imaging device and the second imaging device, whereby the first correction value and the positional deviation of the control position of the first head unit with respect to the actual position are changed. The second correction value to be corrected and the third correction value to correct the positional deviation of the control position of the second head unit with respect to the actual position are configured to be obtained. The mounting of the component on the substrate by one head unit is performed based on the imaging result of the fiducial mark and the second correction value, and the mounting of the component on the substrate by the second head unit is performed on the fiducial mark by the first imaging device. It is configured to perform based on the imaging result, the third correction value, and the first correction value. With this configuration, even when the actual position (actual position) is shifted from the control position (control position) of each of the first head unit and the second head unit, the second correction value and the third Based on the correction value, the control position and the actual position can be corrected to be the same. As a result, the first head unit and the second head unit are controlled so as to mount the component at an accurate position on the board by using the first base mark placed on the base without using the calibration board. Can do.

In the mounting machine according to the above aspect , preferably, the plurality of base marks are added to the first base marks arranged on the base in a region where the first movement range and the second movement range overlap. The second base mark disposed on the base outside the region where the first movement range and the second movement range overlap within the first movement range, and the first movement range and the first within the second movement range . And a third base mark arranged on the base outside the region overlapping with the movement range, and the control device images the first base mark and the second base mark with the first imaging device. The second correction value is acquired, and the third correction value is acquired by imaging the first base mark and the third base mark with the second imaging device. If comprised in this way, a 2nd correction value and a 3rd correction value can be easily acquired simultaneously with acquiring a 1st correction value based on the imaging result of a several base mark.

  In the configuration in which the base mark includes the second base mark and the third base mark, the total number of marks of the first base mark and the second base mark is preferably at least three. The total number of marks of the base mark and the third base mark is at least three. If comprised in this way, a 2nd correction value and a 3rd correction value can be acquired using the point (base mark) of three or more points on a base. Thus, by acquiring the second correction value and the third correction value using three or more points, the first head unit and the first head unit are compared with the case where the correction value is acquired using two or less points. Since the positional deviation of the two head units can be acquired more accurately, more accurate second correction value and third correction value can be acquired.

  In the mounting machine according to the above aspect, the control device is preferably configured so that the first imaging device and the second imaging device both perform the first operation during the mounting operation including the transportation of the substrate and the mounting operation of the component on the substrate. The first correction value is acquired during the mounting operation by imaging the base mark. If comprised in this way, after mounting operation is started compared with the case where a 1st correction value is acquired using a calibration board | substrate before mounting operation is started (before the shift | offset | difference of a coordinate system arises). Since the component mounting operation can be performed based on the first correction value acquired during the mounting operation (after the coordinate system shift starts to occur), the coordinate system shift can be corrected more accurately.

  In the mounting machine that acquires the first correction value during the mounting operation, it is preferable that the control device includes the first base mark multiple times during the mounting operation by both the first imaging device and the second imaging device. The first correction value is acquired and updated a plurality of times during the mounting operation, and when the component is mounted on the board, the control device can detect the component by the second head unit. Mounting on the substrate is performed based on the imaging result of the fiducial mark by the first imaging device and the latest first correction value. With this configuration, the first correction value can be updated a plurality of times during the mounting operation, so the degree of positional deviation between the coordinate system of the first head unit and the coordinate system of the second head unit is implemented. Even when it changes during operation, it is possible to mount the component on the board by the second head unit using the updated first correction value. Accordingly, even when the component is mounted on the substrate by the second head unit using the fiducial mark imaging result of the first imaging device of the first head unit, the component is mounted at a more accurate position. Can do. Note that the case where the degree of positional deviation between the coordinate system of the first head unit and the coordinate system of the second head unit changes during the mounting operation is, for example, when the mounting operation is performed continuously. When the drive mechanism of the first head unit and the second head unit is deformed by heat generated by the friction, the coordinate system of the first head unit and the coordinate system of the second head unit are displaced. It is.

  In this case, preferably, the control device acquires the first correction value during the mounting operation by imaging the first base mark by each of the first imaging device and the second imaging device every time the substrate is transported. It is configured to update with. If comprised in this way, while the 1st head unit and the 2nd head unit are not mounting components, the 1st head unit and the 2nd head unit are moved, and the 1st base mark is imaged, and the 1st Since the correction value can be acquired, the first head mark and the second head unit are moved by interruption while the first head unit and the second head unit are mounting components, and the first base mark is moved. Compared to the case of imaging, the first correction value can be acquired while suppressing an increase in component mounting time.

  In the configuration in which the first correction value is acquired every time the substrate is transported, preferably, the control device has the first imaging device and the first imaging device when the time required for mounting the component on the substrate is shorter than a predetermined time. The first correction value is obtained by imaging the first base mark every time the board is transported by both of the two imaging devices, and the time required for mounting the component on the board is a predetermined time. If it is longer than the first correction value, the first base mark is imaged by both the first imaging device and the second imaging device during the mounting operation of the component on the substrate in addition to the time of carrying the substrate. By doing so, the first correction value is obtained. According to this configuration, when the size of the board to be mounted is small and the time required for mounting a component on one board is short, the coordinates of the first head unit and the second head unit during the mounting operation. Since the shift of the system does not become so large, the component can be mounted on the board by the second head unit on the basis of the first correction value acquired every time of conveyance. In addition, since the size of the board to be mounted is large and the time required for mounting the component on one board is long, the shift of the coordinate system between the first head unit and the second head unit during the mounting operation occurs. If it becomes larger, the first correction value can be acquired not only during transport but also during the mounting operation, and the component can be mounted on the board by the second head unit based on the first correction value. . Thereby, even when the time required for mounting the component on the substrate is longer than the predetermined time, the component can be mounted at an accurate position on the substrate.

It is a top view which shows the surface mounting machine (at the time of mounting of a large sized board | substrate) by 1st Embodiment of this invention. It is a top view which shows the surface mounting machine (at the time of mounting of a small substrate) by 1st Embodiment of this invention. It is a block diagram which shows the surface mounting machine by 1st Embodiment of this invention. It is a figure for demonstrating the correction principle of the shift | offset | difference of the coordinate system of the 1st head unit and 2nd head unit of the surface mounter by 1st Embodiment of this invention. It is a flowchart for demonstrating mounting operation | movement of the surface mounter by 1st Embodiment of this invention. It is a flowchart for demonstrating mounting operation | movement of the surface mounting machine by 2nd Embodiment of this invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

(First embodiment)
First, the structure of the surface mounter 1 according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the surface mounter 1 according to the first embodiment is an apparatus for mounting components on a printed circuit board 100. As shown in FIG. 1, the surface mounter 1 includes a substrate transport conveyor 2 extending in the X direction, and a first head unit 3 and a second head unit 4 that are movable in the XY direction above the substrate transport conveyor 2. ing. The substrate transport conveyor 2, the first head unit 3, and the second head unit 4 are respectively disposed on the base 5. The first head unit 3 disposed on the arrow Y1 direction side and the second head unit 4 disposed on the arrow Y2 direction side are disposed above the substrate transport conveyor 2 on the base 5 so as to face each other. Has been. Further, on the base 5 of the surface mounting machine 1, the first feeder mounting portion 6 disposed at the end on the arrow Y1 direction side and the end on the arrow Y2 direction side on the base 5 are disposed. The 2nd feeder mounting part 7 is provided in the both sides of the board | substrate conveyance conveyor 2. As shown in FIG. In the first feeder placement unit 6 and the second feeder placement unit 7, a plurality of tape feeders 200 for supplying components are arranged in the X direction. The first head unit 3 and the second head unit 4 have a function of acquiring components from the component extraction unit 201 of the tape feeder 200 and mounting components on the printed circuit board 100 on the substrate transport conveyor 2. The components are small electronic components such as ICs, transistors, capacitors, and resistors. The printed circuit board 100 is an example of the “board” in the present invention. Hereinafter, a specific structure of the surface mounter 1 will be described.

  The board transport conveyor 2 transports the printed circuit board 100 carried in from a transport path (not shown) in the X direction, arranges the printed circuit board 100 at a predetermined mounting work position, and unloads the printed circuit board 100 after the mounting work is completed. Have In the first embodiment, the printed circuit board 100 is carried in from the arrow X1 direction side (upstream side) of the substrate transfer conveyor 2 by a conveyance path (not shown), and after the mounting operation, the conveyance (not shown) in the arrow X2 direction side (downstream side) is performed. It is carried out to the road. The substrate transport conveyor 2 includes three transport devices, an entrance transport device 21, a substrate transport device 22, and a substrate transport device 23 arranged in order from the arrow X 1 direction side (upstream side).

  The entrance transfer device 21, the substrate transfer device 22, and the substrate transfer device 23 each have a pair of conveyor portions 21a and 21b, conveyor portions 22a and 22b, and conveyor portions 23a and 23b that face each other in the Y direction. doing. These conveyor parts (21a, 21b, 22a, 22b, 23a and 23b) are configured to convey in the X direction while supporting the printed circuit board 100. In the first embodiment, the entrance transport device 21, the substrate transport device 22, and the substrate transport device 23 are the intervals in the Y direction (conveyors) of each pair of conveyor sections (21a and 21b, 22a and 22b, 23a and 23b). By changing the distance D), the printed circuit board 100 having different widths in the Y direction can be conveyed. Moreover, the board | substrate conveyance apparatus 22 is comprised so that a pair of conveyor parts 22a and 22b can move independently in a Y direction, respectively. Thereby, as shown in FIG. 1, a large printed circuit board 100a having a width W1 is transported to the mounting work position P1 to perform the mounting work, and as shown in FIG. 2, a small printed circuit board 100b having a width W2 is used. Are transferred to the mounting work positions P2 and P3, and the mounting work of the two printed circuit boards 100b can be performed in parallel. The printed circuit board 100a and the printed circuit board 100b are examples of the “substrate” in the present invention.

  Moreover, as shown in FIG. 1, the conveyor part 21b on the arrow Y2 direction side is fixedly installed in the vicinity of the second feeder mounting part 7, and the conveyor part 21a on the arrow Y1 direction side is movable in the Y direction. Is provided. Specifically, the conveyer portion 21b on the arrow Y2 direction side rotatably supports a pair of ball screw shafts 21c extending in the Y direction, and is screwed onto the conveyer portion 21a on the arrow Y1 direction side with the ball screw shaft 21c. A ball nut (not shown) is fixedly provided. Thereby, according to the size (width W1 or W2 of the Y direction) of the printed circuit board 100 conveyed, the conveyor part 21a of the arrow Y1 direction side is moved, and the conveyor space | interval D (interval of the conveyor parts 21a and 21b) is carried out. It is configured so that it can be adjusted. The driving of the ball screw shaft 21c for adjusting the conveyor interval D is performed by transmitting a driving force of a driving motor 23d provided in the substrate transfer device 23.

  As shown in FIG. 1, the substrate transfer device 22 includes a conveyor portion 22a on the arrow Y1 direction side and a conveyor portion 22b on the arrow Y2 direction side, and a pair of ball screws for moving the conveyor portions 22a and 22b in the Y direction. And a shaft 22c. Moreover, the board | substrate conveyance apparatus 22 has the drive motor 22d for moving both the conveyor part 22a and the conveyor part 22b, and the rotation motor 22e for moving the conveyor part 22a.

  As described above, the substrate transfer device 22 can move the conveyor portions 22a and 22b in the Y direction in synchronization with each other while rotating the ball screw shaft 22c by the drive motor 22d. Only the conveyor part 22a can be independently moved in the Y direction by 22e. Thereby, the board | substrate conveyance apparatus 22 can move in the Y direction, and can arrange | position to the mounting operation position P2, while the printed circuit board 100b carried in from the entrance conveyance apparatus 21 is hold | maintained by the conveyor parts 22a and 22b. The mounting work position P2 is a position at which the printed circuit board 100 (conveyors 22a and 22b) is closest to the first feeder placement unit 6. Moreover, in the state which does not hold | maintain the printed circuit board 100a or 100b, it is possible to adjust the space | interval (conveyor space | interval D) of the conveyor parts 22a and 22b according to the magnitude | size (width of a Y direction) of the printed circuit board 100 to convey. It is. Thereby, it is possible to adjust the conveyor space | interval D so that it may correspond to both the width W1 of the large sized printed circuit board 100a shown in FIG. 1, and the width W2 of the small sized printed circuit board 100b shown in FIG. . If both the drive motor 22d and the rotary motor 22e are driven, it is possible to move only the conveyor portion 22b on the arrow Y2 direction side independently.

  The substrate transfer device 23 includes a pair of conveyor portions 23a and 23b facing in the Y direction, a pair of ball screw shafts 23c for adjusting the interval between the conveyor portions 23a and 23b (conveyor interval D), the ball screw shaft 23c, and the inlet transfer. And a drive motor 23 d for rotating the ball screw shaft 21 c of the device 21.

  Further, a ball nut (not shown) that is screwed with the ball screw shaft 23c is fixedly provided on the conveyor portion 23a on the arrow Y1 direction side. By rotating the ball screw shaft 23c, the conveyor portion 23a on the arrow Y1 direction side is configured to move in the Y direction. Thereby, the board | substrate conveyance apparatus 23 moves the conveyor part 23a of the arrow Y1 direction side according to the magnitude | size (width | variety of a Y direction) of the printed circuit board 100 conveyed, The conveyor space | interval D of the conveyor parts 23a and 23b (Refer to FIG. 1) can be adjusted.

  Thus, the board | substrate conveyance conveyor 2 hold | maintains the large sized printed circuit board 100a using both the board | substrate conveyance apparatus 22 and the board | substrate conveyance apparatus 23 according to the magnitude | size of the printed circuit board 100 (100a, 100b) to mount. In addition, each of the substrate transfer device 22 and the substrate transfer device 23 can hold a small printed circuit board 100b. In a state where the small printed circuit board 100b is mounted on each of the circuit board transport apparatus 22 and the circuit board transport apparatus 23, the printed circuit board 100b to be mounted is moved by moving the conveyor portions 22a and 22b of the circuit board transport apparatus 22 in the arrow Y1 direction. Can be held at the mounting work position P2 close to the tape feeder 200 on the arrow Y1 direction side, and the printed circuit board 100b can be held at the mounting work position P3 in the board transport device 23.

  As shown in FIG. 1, the first head unit 3 on the arrow Y1 direction side and the second head unit 4 on the arrow Y2 direction side have the same configuration and are arranged to face each other. The first head unit 3 and the second head unit 4 are configured to be movable in the X direction along head unit support portions 81 and 82 extending in the X direction, respectively. Specifically, as shown in FIG. 1, the head unit support portion 81 includes a ball screw shaft 81a extending in the X direction, a servo motor 81b for rotating the ball screw shaft 81a, and a guide rail (not shown) in the X direction. have. The first head unit 3 has a ball nut 3a to which a ball screw shaft 81a is screwed. Similarly, the head unit support portion 82 includes a ball screw shaft 82a extending in the X direction, a servo motor 82b for rotating the ball screw shaft 82a, and a guide rail (not shown) in the X direction. The second head unit 4 has a ball nut 4a to which a ball screw shaft 82a is screwed. The first head unit 3 and the second head unit 4 move in the X direction with respect to the head unit support portions 81 and 82 by rotating the ball screw shafts 81a and 82a by the servo motors 81b and 82b, respectively. It is configured.

  These head unit support portions 81 and 82 are movable in the Y direction along a pair of fixed rail portions 9 extending in the Y direction provided on the base 5 so as to straddle the substrate transport conveyor 2. It is configured. Specifically, the pair of fixed rail portions 9 includes guide rails 9a that support both end portions of the head unit support portions 81 and 82 so as to be movable in the Y direction, and the inside of the fixed rail portion 9 along the Y direction. And a stator (not shown) composed of a plurality of permanent magnets arranged in a row. Further, at both ends of each of the head unit support portions 81 and 82, a mover (not shown) made of a field coil is provided in the vicinity of the stator. That is, a linear motor is constituted by the mover (field coil) provided in each head unit support part 81 and 82 and the common stator (permanent magnet) provided in the pair of fixed rail parts 9. Yes. The head unit support portions 81 and 82 are configured to move in the Y direction along the guide rail 9a by controlling the current supplied to the mover (field coil). With such a configuration, the first head unit 3 and the second head unit 4 are each configured to be able to move on the base 5 in the XY directions.

  The first head unit 3 and the second head unit 4 are each provided with ten mounting head portions 3b and 4b arranged in a row in the X direction. A suction nozzle (not shown) for sucking and mounting components is attached to each of the mounting head portions 3b and 4b at the tip (lower end) so as to protrude downward. Further, each of the mounting head portions 3b and 4b includes a negative pressure generator (not shown) for generating a negative pressure state at the tip of the suction nozzle (not shown), and the suction nozzle in the vertical direction (Z direction). A lifting device (not shown) such as a servo motor to be moved is provided. The suction nozzles of the mounting head portions 3b and 4b can suck and hold the components supplied from the tape feeder 200 at the tip by generating a negative pressure state at the tip. The mounting head portions 3b and 4b are configured to be able to individually switch between generation of a negative pressure state, release, and generation of a positive pressure state.

  Further, the suction nozzles of the respective mounting head portions 3b and 4b are moved in the vertical direction (Z direction) with respect to the first head unit 3 (second head unit 4) by an elevating device (not shown). The components are transported with the suction nozzle positioned at the raised position, and the components are sucked from the tape feeder 200 and mounted on the printed circuit board 100 with the suction nozzle positioned at the lowered position. Yes. The mounting head portions 3b and 4b are configured to be able to rotate the suction nozzle itself about its axis by a nozzle rotating device (not shown) such as a servomotor. Thereby, in the surface mounter 1, it is possible to adjust the attitude | position (direction in a horizontal surface) of the components hold | maintained at the front-end | tip of a nozzle by rotating a suction nozzle in the middle of conveying a component.

  Also, substrate imaging devices 3c and 4c are attached to the side of the first head unit 3 on the arrow X1 direction side and the side of the second head unit 4 on the arrow X2 direction side, respectively. The board imaging devices 3c and 4c are constituted by CCD area cameras, and are attached with the imaging direction directed downward (Z2 direction) from the first head unit 3 (second head unit 4). The board imaging devices 3c and 4c are configured to recognize the position of the printed circuit board 100 by imaging the fiducial mark 150 provided on the surface of the printed circuit board 100 when components are mounted. The board imaging device 3c of the first head unit 3 is configured to move within a moving range A indicated by a dotted line in FIGS. 1 and 2 as the first head unit 3 moves in the XY direction. The board imaging device 4c of the second head unit 4 is configured to move in the movement range B as the second head unit 4 moves in the XY direction. The movement range A and the movement range B are examples of the “first movement range” and the “second movement range” in the present invention, respectively. The substrate imaging devices 3c and 4c are examples of the “first imaging device” and the “second imaging device” of the present invention, respectively.

  As shown in FIG. 1, at the time of component mounting on a large printed circuit board 100a, the first head unit 3 and the second head unit 4 are controlled by a control device 101, which will be described later, and one print placed at the mounting work position P1. Component mounting is performed on the board 100a. In addition, as shown in FIG. 2, when the small printed circuit board 100b is mounted on the component, the first head unit 3 and the second head unit 4 are mounted on the printed circuit board 100b disposed at the mounting work positions P2 and P3, respectively. It can be installed. Here, the printed circuit board 100b held by the circuit board transport device 22 is arranged in the mounting work position P2 in the vicinity of the tape feeder 200 on the first head unit 3 side (arrow Y1 direction side) by moving in the arrow Y1 direction. Is done. At the time of component mounting, as shown in FIG. 2, the first head unit 3 reciprocates between the component take-out portion 201 of the tape feeder 200 and the upper side of the printed board 100b, so that the board conveying device 22 moves the printed board 100b along the arrow Y1. By approaching the direction-side tape feeder 200, it is possible to shorten the time required for the mounting operation. The printed circuit board 100b held by the substrate transport device 23 is disposed at the mounting work position P3 in the vicinity of the tape feeder 200 on the second head unit 4 side (arrow Y2 direction side).

  The operation of the surface mounter 1 is controlled by the control device 101 shown in FIG. The control device 101 includes a main control unit 102, a drive control unit 103, an image processing unit 104, a valve control unit 105, and a storage unit 106. Further, the control device 101 includes a display unit 107 such as a liquid crystal display device and an input unit 108 such as a keyboard.

  The main control unit 102 includes a CPU that executes logical operations. The main control unit 102, according to the program stored in the ROM of the storage unit 106, via the drive control unit 103, the first head unit 3, the second head unit 4, the inlet transport device 21 of the substrate transport conveyor 2, the substrate transport The operation of the device 22 and the substrate transfer device 23 is controlled, and the substrate imaging device 3c of the first head unit 3 and the substrate imaging device 4c of the second head unit 4 are controlled via the image processing unit 104, respectively. Has been. In addition, the main control unit 102 controls the negative pressure generator provided in each of the first head unit 3 and the second head unit 4 via the valve control unit 105, thereby performing the component suction operation by the suction nozzle. Configured to control. Further, the main control unit 102 reads the board data 106a stored in the storage unit 106, the size (width W1, W2) of the printed circuit board 100 (100a, 100b) to be mounted, and the fiducial mark of the printed circuit board 100. 150 position information and the like are acquired. The main control unit 102 is configured to adjust the conveyor interval D of the entrance transport device 21, the substrate transport device 22, and the substrate transport device 23 based on the acquired size of the printed circuit board 100 (100a, 100b). ing. In this way, at the time of mounting, the main control unit 102 provides these drive control units 103 so that components are sequentially mounted at predetermined mounting positions on the printed circuit board 100 according to the mounting program stored in the storage unit 106. The image processing unit 104, the valve control unit 105, and the storage unit 106 are configured to be controlled.

  Based on the control signal output from the main control unit 102, the drive control unit 103 is provided with motors (servo motors 81b and 82b (X for moving in the X direction) of each part of the first head unit 3 and the second head unit 4 (X Axis motor), field coil for moving in the Y direction (Y axis motor), servo motor for the lifting device for moving each of the ten suction nozzles of the mounting head portions 3b and 4b in the vertical direction (Z axis) Motor) to control the driving of the ten suction nozzles respectively in the R-axis direction (rotation direction around the central axis of each suction nozzle) and the servo motor (R-axis motor) of the nozzle rotation device. It is configured. Further, the drive control unit 103 is configured based on a control signal output from the main control unit 102 to drive motors (drive motors 23d of the entrance transfer device 21 and the substrate transfer device 23, and the substrate transfer device 22). The driving motor 22d and the rotation motor 22e of the substrate transfer device 22 are controlled to be driven.

  Based on the control signal output from the main control unit 102, the image processing unit 104 reads the imaging signal from the board imaging devices 3c and 4c and a component imaging device (not shown) at a predetermined timing, By performing predetermined image processing, image data suitable for recognizing the component and the fiducial mark 150 of the printed circuit board 100 is generated. These image data are output to the main control unit 102. Based on the image data of the parts, the quality of the parts sucked by each suction nozzle (whether or not it is a defective part), and the position of the suction of the parts by the suction nozzle are shifted. Is calculated and the mounting position is corrected. Further, the main controller 102 is configured to recognize the position of the printed circuit board 100 based on the image data of the fiducial mark 150 of the printed circuit board 100.

  The storage unit 106 includes a ROM (Read Only Memory) that stores a program for controlling the CPU, a RAM (Random Access Memory) that temporarily stores various data during operation of the apparatus, and the like. The storage unit 106 also includes board data 106a such as dimensions of the printed circuit board 100 (100a, 100b) to be mounted, the position of the fiducial mark 150 on the printed circuit board 100, and predetermined printed circuit boards 100 (100a, 100b). ) Is stored. (A mounting program (not shown)) is stored. At the time of mounting, these data are read by the main control unit 102, and the mounting work is performed based on the read data.

  The tape feeder 200 holds a reel (not shown) around which a tape that holds a plurality of components at a predetermined interval is wound. The tape feeder 200 is configured to supply a component from a component extraction unit 201 (see FIG. 1) at the tip of the tape feeder 200 by feeding out a tape that holds the component by rotating a reel. Each tape feeder 200 is fixed to the first feeder placement unit 6 and the second feeder placement unit 7 and has a connector (not shown) provided on the first feeder placement unit 6 and the second feeder placement unit 7. It is comprised so that it may be electrically connected to the control apparatus 101 via. As a result, each of the plurality of tape feeders 200 set in the first feeder placement unit 6 and the second feeder placement unit 7 is connected to the first head unit 3 and the second feeder based on the control signal from the control device 101. The component mounting operation on the printed circuit board 100 by the head unit 4 and the component supply operation for feeding the tape from the reel are synchronized.

  Here, in the first embodiment, five base marks 5a, 5b, 5c, 5d and 5e are fixedly provided on the base 5 which is a heavy object. Of the five base marks 5a to 5e, the three base marks 5a, 5b, and 5c are within the movement range A of the board imaging device 3c of the first head unit 3, that is, the range in which the board imaging device 3c can image. Has been placed. Of the five base marks 5 a to 5 e, the three base marks 5 c, 5 d, and 5 e are disposed within the movement range B of the substrate imaging device 4 c of the second head unit 4. Accordingly, among the five base marks 5 a to 5 e, one base mark 5 c is within the movement range A of the substrate imaging device 3 c of the first head unit 3 and the substrate imaging device 4 d of the second head unit 4. It is arranged within the movement range B. The base marks 5a and 5b are an example of the “second base mark” of the present invention, the base mark 5c is an example of the “first base mark” of the present invention, and the base mark 5d. And 5e are examples of the “third base mark” of the present invention.

  As a more detailed arrangement, the two base marks 5a and 5b imaged only by the first head unit 3 are arranged in the vicinity of the first feeder mounting portion 6 at positions separated in the X direction. The base mark 5a is disposed at the end of the first feeder placement portion 6 on the arrow X1 direction side, and the base mark 5b is closer to the arrow X2 than the center portion of the first feeder placement portion 6 in the X direction. It is arranged on the direction side. In addition, the two base marks 5d and 5e imaged only by the second head unit 4 are arranged in the vicinity of the second feeder mounting portion 7 at positions separated in the X direction. The base mark 5d is disposed at the end of the second feeder placement portion 7 on the arrow X2 direction side, and the base mark 5e is closer to the arrow X1 than the central portion of the first feeder placement portion 6 in the X direction. It is arranged on the direction side.

  In addition, the base mark 5c is closer to the first feeder mounting portion 6 side than the central portion of the first feeder mounting portion 6 and the second feeder mounting portion 7 in the Y direction, and the base mark in the X direction. It is arranged in a region between 5a and 5b and between base marks 5d and 5e. That is, the positional relationship between the base marks 5a to 5e is as follows. Regarding the positional relationship between the three base marks 5a, 5b and 5c imaged by the first head unit 3, the positions of the base marks 5a, 5b and 5c are different from each other in the X-axis direction. The positions of the base marks 5a, 5b and 5c are substantially equal to the base mark 5a and the base mark 5b in the Y-axis direction, while the positions of the base mark 5a (5b) and the base mark 5c are the same. Are different from each other. Further, regarding the positional relationship between the three base marks 5c, 5d and 5e imaged by the second head unit 4, the positions of the base marks 5c, 5d and 5e are different from each other in the X-axis direction. In the Y-axis direction, the base mark 5d and the base mark 5e are substantially equal, but the positions of the base marks 5d (5e) and the base mark 5c are different from each other. Thus, the position of each of at least two base marks among the three base marks (base marks 5a to 5c or base marks 5c to 5e) imaged by one head unit is the X axis. By making them different from each other in both the direction and the Y-axis direction, a positional deviation due to thermal deformation of the drive mechanism of the head unit, which will be described later, can be calculated with high accuracy.

In the first embodiment, the plurality of base marks 5 a to 5 e are periodically displayed every time the printed circuit board 100 to be mounted is conveyed by the board imaging device 3 c of the first head unit 3 and the board imaging device 4 c of the second head unit 4. I am shooting. Specifically, the base marks 5a, 5b and 5c are imaged by the board imaging device 3c of the first head unit 3, and the base marks 5c, 5d and 5e are picked up by the board imaging device 4c of the second head unit 4. Is imaged. Based on the imaging results of the base marks 5a to 5c, the displacement of the drive mechanism of the first head unit 3 and the second head unit 4 due to thermal deformation (the head unit support portions 81 and 82 can be moved in the Y direction). This corrects the heat generated by the mover (field coil) of the linear motor and the positional deviation caused by expansion and extension of the ball screw shaft 81a and the ball screw shaft 82a. That is, the storage unit 106 of the control device 101 stores the image center positions of the captured images of the base marks 5a to 5e in the reference state (the state in which the first head unit 3 and the second head unit 4 are not displaced). ing. When the drive mechanisms of the first head unit 3 and the second head unit 4 are thermally deformed (for example, when the ball screw shafts 81a and 82a are heated by frictional heat and thermally expanded by the mounting operation), the base mark Since the image center positions of the captured images of 5a to 5e are shifted, the image center position of the captured images of the base marks 5a to 5e captured periodically is compared with the image center position in the reference state, so that the image with respect to the reference state Based on the displacement of the center position, the displacement of the first head unit 3 and the second head unit 4 with respect to the respective reference states can be calculated. By acquiring a correction value for correcting the positional deviation of the first head unit 3 every time the printed circuit board 100 is conveyed, the positional deviation of the first head unit 3 is corrected at any time. 3 can be moved. The same applies to the second head unit 4. The correction value for correcting the positional deviation of the first head unit 3 and the correction value for correcting the positional deviation of the second head unit 4 are the “second correction value” and “third correction value” of the present invention, respectively. It is an example.

  In the first embodiment, one of the base marks 5 a to 5 c imaged by the substrate imaging device 3 c of the first head unit 3 and the base mark 5 c imaged by the substrate imaging device 4 c of the second head unit 4. 1 to 5e in common. That is, one base mark 5 c is imaged by both the substrate imaging device 3 c of the first head unit 3 and the substrate imaging device 4 c of the second head unit 4. Based on the captured image of the base mark 5 c by the substrate imaging device 3 c of the first head unit 3 and the captured image by the substrate imaging device 4 c of the second head unit 4, the coordinate system of the first head unit 3 and the second A deviation from the coordinate system of the head unit 4 can be calculated.

  Since the relationship between the coordinate system of the first head unit 3 and the coordinate system of the second head unit 4 is known in the reference state, if the position is specified in the coordinate system of the first head unit 3, the position is It can also be specified in the coordinate system of the second head unit 4. However, the relationship between the coordinate system of the first head unit 3 and the coordinate system of the second head unit 4 is related to the positional deviation due to thermal deformation of the drive mechanism of the first head unit 3 and the second head unit 4 during the mounting operation. Come off. Therefore, when the second head unit 4 is moved to the position based on the position (control position) of the first head unit 3 as the mounting operation is continued, the second head unit 4 is moved to the position accurately. It becomes difficult. In the first embodiment, the deviation of the coordinate system is calculated based on the captured image of the base mark 5c. As a result, the coordinate system of the first head unit 3 and the coordinate system of the second head unit 4 can be matched, so that the image of the fiducial mark 150 of the printed circuit board 100 acquired in the first head unit 3 can be obtained. The result (position information of the printed circuit board 100 in the coordinate system of the first head unit 3) can be used as position information of the printed circuit board 100 in the coordinate system of the second head unit 4. As described above, the imaging of the base mark 5c is performed every time the printed circuit board 100 is transported, so that the coordinate system of the first head unit 3 and the coordinate system of the second head unit 4 are displaced at any time during the mounting operation. Even in this case, it is possible to make the two coordinate systems coincide each time the printed circuit board 100 is transported. Hereinafter, the principle of obtaining a correction value for making the coordinate system of the first head unit 3 coincide with the coordinate system of the second head unit 4 will be described with reference to FIG.

As shown in FIG. 4, a second vector O _A F from the origin O _A of the coordinate system of the first head unit 3 to one fiducial mark F (fiducial mark 150) of the printed circuit board 100 is used as the second head. consider the determination of the vector O _{B F} from the origin O _B of the coordinate system of the head unit 4 up to one fiducial F of the printed circuit board 100. When the vector between the origin O _A O _B of the two coordinate systems and vectors AB, the following equation (1) holds.

Vector O _B F = Vector O _A F−Vector AB (1)
Since the vector AB changes depending on the difference between the degree of positional deviation due to thermal deformation of the first head unit 3 and the degree of positional deviation due to thermal deformation of the second head unit 4, the vector AB during the mounting operation is a known vector in the reference state. AB cannot be used. Therefore, in order to obtain a vector AB that takes into account the deviation of thermal deformation during the mounting operation, the base mark P (base mark 5c) is picked up by the board imaging device 3c of the first head unit 3 and the board imaging of the second head unit 4. Images are taken by both devices 4c. Thereby, the position P (vector O _A P) of the base mark 5 c in the coordinate system of the first head unit 3 and the position P (vector O _B P) of the base mark 5 c in the coordinate system of the second head unit 4 The vector AB can be expressed by the following equation (2) using the vector O _A P and the vector O _B P.

Vector AB = vector O _A P−vector O _B P (2)
Therefore, from the above equations (1) and (2), the vector O _B F indicating the position of the fiducial mark F of the printed circuit board 100 in the coordinate system of the second head unit 4 is the image of the substrate of the first head unit 3. _A vector O _A F indicating the position of the fiducial mark F by the device 3c, a vector O _A P indicating the position of the base mark 5c in the coordinate system of the first head unit 3, and a coordinate system of the second head unit 4 Using the vector O _B P indicating the position of the base mark 5c, it can be expressed as the following equation (3).

Vector O _B F = Vector O _A F + Vector O _B P−Vector O _A P (3)
In the first embodiment, the “vector” is based on the captured images of the base mark 5 c of the board imaging device 3 c of the first head unit 3 and the board imaging device 4 c of the second head unit 4 obtained every time the printed board 100 is conveyed. _A correction value corresponding to “O _B P-vector O _A P” is acquired, and drive control of the second head unit 4 is performed using the correction value. The correction value corresponding to “vector O _B P−vector O _A P” is an example of the “first correction value” in the present invention. The vector of the other fiducial mark R (fiducial mark 150) of the printed circuit board 100 can also be expressed in the same manner as the fiducial mark F.

  Next, the mounting operation of the surface mounter 1 according to the first embodiment of the present invention will be described with reference to FIG. Note that the mounting operation flow of FIG. 5 is a flow of the mounting operation when a component is mounted on one printed circuit board 100. Actually, this mounting operation is performed on the printed circuit boards 100 sequentially carried in. Further, the following mounting operation is a mounting operation in the case where mounting is performed on one printed circuit board 100 using both the first head unit 3 and the second head unit 4 as shown in FIG.

  First, in step S1 of FIG. 5, conveyance of the printed circuit board 100 to be mounted is started. During the transport operation of the printed circuit board 100, the first head unit 3 and the second head unit 4 are on standby.

  Next, in step S2, the first head unit 3 is sequentially moved above the base marks 5a to 5c, and the base marks 5a to 5c are imaged by the board imaging device 3c. In step S3, the positional deviations of the base marks 5a to 5c in the captured images with respect to the respective reference states are calculated, and the correction value (first value) for correcting the deviation of the component mounting position of the first head unit 3 due to the positional deviation. 1 thermal correction value) is acquired.

  In step S4, as in the case of the first head unit 3, the second head unit 4 is sequentially moved above the base marks 5c to 5e, and the base marks 5c to 5e are imaged by the board imaging device 4c. I do. In step S5, the positional deviation of the base marks 5c to 5e in the captured image with respect to each reference state is calculated, and a correction value (first value) for correcting the deviation of the component mounting position of the second head unit 4 due to the positional deviation. 2 heat correction value).

  Next, in step S6, the coordinate system of the first head unit 3 is based on the captured image of the base mark 5c by both the substrate imaging device 3c of the first head unit 3 and the substrate imaging device 4c of the second head unit 4. And a correction value (coordinate system correction value) for matching the coordinate system of the second head unit 4 is acquired. The processing from step S2 to step S6 is performed while the printed circuit board 100 is being conveyed.

  Next, after the conveyance of the printed circuit board 100 is completed in step S7, the operation of mounting components on the printed circuit board 100 is started. First, in step S8, the fiducial mark 150 provided on the printed circuit board 100 to be mounted is imaged by the board imaging device 3c of the first head unit 3. Here, imaging of the fiducial mark 150 by the board imaging device 4c of the second head unit 4 is not performed. In step S9, the first head unit 3 and the second head unit 4 are based on the correction values (first thermal correction value, second thermal correction value, and coordinate system correction value) acquired in steps S3, S5, and S6. Thus, the component mounting operation is performed. Specifically, the first head unit 3 determines the position of the first head unit 3 due to thermal deformation based on the imaging result of the fiducial mark 150 in step S8 and the first thermal correction value obtained in step S3. The mounting operation is performed while correcting the mounting position of the component according to the deviation. Further, the second head unit 4 obtains the imaging result of the fiducial mark 150 by the board imaging device 3c of the first head unit 3 in step S8, the second thermal correction value obtained in step S5, and obtained in step S6. Based on the coordinate system correction value, the mounting operation is performed while correcting the mounting position of the component according to the positional deviation of the second head unit 4 due to thermal deformation.

  Further, in step S10, it is determined whether or not the mounting of the component on the printed circuit board 100 is finished. If not finished, the processes in steps S9 and S10 are repeated. Then, when the mounting of the component on the printed circuit board 100 is completed, the mounting operation is completed. As shown in FIG. 5, when the mounting operation is performed by each of the first head unit 3 and the second head unit 4 on the two small substrates placed at the mounting work positions P2 and P3, Each of the first head unit 3 and the second head unit 4 images the fiducial mark 150 of each small substrate, and the mounting operation is individually performed by each head unit.

  In the first embodiment, as described above, the base mark 5c is imaged by both the substrate imaging device 3c and the substrate imaging device 4c, whereby the coordinate system of the second head unit 4 with respect to the coordinate system of the first head unit 3 is used. By acquiring a coordinate system correction value that corrects the relative displacement of the coordinate system, the coordinate system correction value can be acquired using the base mark 5c fixedly provided on the base 5 that is a heavy object. It is possible to suppress a change in the imaging result of the mark (base mark 5c) due to the influence of disturbance. Thereby, when acquiring a coordinate system correction value, it can be made hard to receive the influence of a disturbance, Therefore A coordinate system correction value can be acquired correctly. In addition, since the coordinate system correction value can be acquired using the base mark 5c originally arranged on the base 5, it is necessary to arrange and remove the calibration board in order to acquire the coordinate system correction value. Absent. Thereby, it is not necessary to go through an extra step of placing and removing the calibration board before the mounting operation, and as a result, it is possible to suppress a decrease in productivity due to the coordinate system correction value acquisition operation. Further, the coordinate system correction accurately obtained by mounting the component on the printed board 100 by the second head unit 4 based on the imaging result of the fiducial mark 150 by the board imaging device 3c and the coordinate system correction value is performed. Since the component can be mounted on the printed circuit board 100 by the second head unit 4 based on the value, productivity can be reduced by omitting the imaging process of the fiducial mark 150 by the circuit board imaging device 4c of the second head unit 4. Even when the improvement is made, it is possible to mount the component at an accurate position of the printed circuit board 100.

  In the first embodiment, as described above, when the component is mounted on the printed circuit board 100, the mounting of the component on the printed circuit board 100 by the first head unit 3 is the result of imaging the fiducial mark 150 and the first. 1 based on the thermal correction value, and mounting the component on the printed circuit board 100 by the second head unit 4 based on the imaging result of the fiducial mark 150 by the board imaging device 3c, the second thermal correction value, and the coordinate system correction value. Is going. With this configuration, even when the actual position (actual position) of each of the first head unit 3 and the second head unit 4 is shifted from the control position (control position), the first thermal correction is performed. The control position and the actual position can be corrected to be the same based on the value and the second heat correction value. As a result, the first head unit 3 and the second head unit are mounted so that the components are mounted at accurate positions on the printed circuit board 100 using the base marks 5a to 5e installed on the base 5 without using the calibration board. 4 can be controlled.

  Further, in the first embodiment, as described above, the first thermal correction value is acquired by imaging the base marks 5a to 5c by the board imaging device 3c, and the base marks 5c to 5e are acquired by the board imaging device 4c. By acquiring the second thermal correction value by imaging, the first thermal correction value and the second thermal correction value are obtained simultaneously with the acquisition of the coordinate system correction value based on the imaging results of the base marks 5a to 5e. Can be easily obtained.

  In the first embodiment, as described above, the first thermal correction value is acquired based on the imaging results of the three base marks 5a to 5c, and based on the imaging results of the three base marks 5c to 5e. By acquiring the second thermal correction value, it is possible to acquire the positional deviation between the first head unit 3 and the second head unit 4 with high accuracy and accuracy, and thus more accurate first thermal correction value and second thermal correction value. The value can be obtained. However, the number of base marks for acquiring the thermal correction value is not limited to three, and may be two or more. That is, the first thermal correction value may be obtained based on the imaging results of the two base marks 5a and 5c, and the second thermal correction value may be obtained based on the imaging results of the two base marks 5c and 5d. When the correction value is acquired at two points, the correction accuracy is lowered as compared with the case of three points, but the correction value can be acquired at high speed.

  In the first embodiment, the base mark 5c is imaged by both the board imaging device 3c and the board imaging device 4c during the mounting operation including the transportation of the printed circuit board 100 and the mounting operation of components on the printed circuit board 100. By doing so, the coordinate system correction value is acquired during the mounting operation. With this configuration, the mounting operation is started as compared with the case where the coordinate system correction value is acquired using the calibration board before the mounting operation is started (before the coordinate system shift occurs). Since the component mounting operation can be performed based on the coordinate system correction value acquired during the subsequent mounting operation (after the coordinate system shift starts to occur), the coordinate system shift can be corrected more accurately. .

  In the first embodiment, as described above, the coordinate system correction value is printed by imaging the base mark 5c every time the printed board 100 is transported by both the board imaging device 3c and the board imaging device 4c. When the board 100 is acquired whenever the board 100 is transported and the parts are mounted on the printed board 100, the mounting of the parts on the printed board 100 by the second head unit 4 is performed by the board imaging device 3c. This is based on the results and the latest coordinate system correction values. With this configuration, the coordinate system correction value can be updated as needed every time the printed circuit board 100 is transported. Therefore, the positional deviation between the coordinate system of the first head unit 3 and the coordinate system of the second head unit 4 Even when the degree changes at any time during the mounting operation, the second head unit 4 can mount the component on the printed circuit board 100 using the updated latest coordinate system correction value. Thereby, even when mounting the component on the printed circuit board 100 by the second head unit 4 using the imaging result of the fiducial mark 150 by the board imaging device 3c of the first head unit 3, the position is more accurate. Parts can be mounted.

  In the first embodiment, as described above, the coordinate system correction value is acquired by imaging the base mark 5c when the printed board 100 is transported by both the board imaging device 3c and the board imaging device 4c. . By configuring in this way, the first head unit 3 and the second head unit 4 are moved while the first head unit 3 and the second head unit 4 are not mounting components, and the first base mark is moved. Since the coordinate system correction value can be acquired by imaging, the first head unit 3 and the second head unit 4 can be interrupted while the first head unit 3 and the second head unit 4 are mounting components. The coordinate system correction value can be acquired while suppressing an increase in the component mounting time as compared with the case where the base mark 5c is captured and moved.

(Second Embodiment)
Next, a mounting machine according to a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, unlike the first embodiment in which the base marks 5a to 5e are imaged every time the printed circuit board 100 is conveyed, an example in which the base marks 5a to 5e are imaged also during the component mounting operation will be described. To do.

  In the second embodiment, the control device 101 captures the base marks 5a to 5e and acquires correction values (first heat correction value, second heat correction value, and coordinate system correction value) when the printed circuit board 100 is transported. At the same time, when the component mounting time is longer than a predetermined time (for example, 5 minutes), imaging of the base marks 5a to 5e and acquisition of correction values are performed by interruption even during the component mounting operation. ing. This predetermined time is set to such an extent that the deviation of the component mounting position caused by the positional deviation of the head unit due to the deformation due to heat falls within the allowable range during the mounting operation. When imaging of the base marks 5a to 5e and acquisition of correction values are performed by interruption, the subsequent component mounting operation is performed based on the latest correction values acquired by interruption. The structure other than the control device 101 of the mounting machine according to the second embodiment is the same as that of the first embodiment.

  Next, the mounting operation of the surface mounter according to the second embodiment will be described with reference to FIG.

  First, in steps S11 to S20, processing similar to that in steps S1 to S10 of the first embodiment is performed.

  If the component mounting is not completed in step S20, it is determined in step S21 whether or not a predetermined time (for example, 5 minutes) has elapsed since the conveyance of the printed circuit board 100 was completed. If the predetermined time has not elapsed, the process returns to step S19, and a component mounting operation is performed.

  When the predetermined time has elapsed, in steps S22 to S26, the same processing as in steps S12 to S16 is performed by interruption during the component mounting operation, so that a new correction value (first heat correction value) is obtained. , The second heat correction value and the coordinate system correction value) are acquired, and the correction value is updated. After that, the process returns to step S19, and the component mounting operation is performed by the first head unit 3 and the second head unit 4 based on the updated correction value.

  In the second embodiment, as described above, when the time required for mounting the component on the printed circuit board 100 is longer than a predetermined time, the coordinate system correction value is added to the component board every time the printed circuit board 100 is conveyed. Even during the mounting operation to the printed board 100, the coordinate system correction value is obtained by imaging the base mark 5c by both the board imaging device 3c and the board imaging device 4c. With this configuration, when the size of the printed circuit board 100 (small printed circuit board 100b) to be mounted is small and the time required for mounting components on one printed circuit board 100 is short, the mounting operation is performed. Since the shift of the coordinate system between the first head unit 3 and the second head unit 4 does not become so large, the mounting of the component on the printed circuit board 100 by the second head unit 4 based on the coordinate system correction value acquired every time of conveyance. It can be performed. Further, the first head unit 3 is mounted during the mounting operation due to the large size of the printed circuit board 100 to be mounted (large printed circuit board 100a) and the long time required for mounting components on one printed circuit board 100. If the deviation of the coordinate system between the second head unit 4 and the second head unit 4 becomes large, the coordinate system correction value is acquired during the mounting operation, and the parts are printed by the second head unit 4 based on the coordinate system correction value. Mounting to the substrate 100 can be performed. Thus, even when the time required for mounting the component on the printed circuit board 100 is longer than a predetermined time, the component can be mounted at an accurate position on the printed circuit board 100.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the example in which the present invention is applied to the mounting machine including the two head units of the first head unit 3 and the second head unit 4 has been shown. The present invention is not limited to this, and the present invention may be applied to a mounting machine including three or more head units that can move independently of each other.

  In the first and second embodiments, the fiducial mark 150 of the printed circuit board 100 is imaged by the board imaging device 3 c of the first head unit 3, and the imaging result is used for the component mounting operation of the second head unit 4. However, the present invention is not limited to this example, and the fiducial mark 150 of the printed circuit board 100 is imaged by the circuit board imaging device 4c of the second head unit 4, and the imaging result is obtained from the first head unit 3. You may use for component mounting operation.

  In the first and second embodiments, the example in which the marks (base marks 5a to 5e) for obtaining the correction values are provided on the base 5, but the present invention is not limited to this, and the base is not limited thereto. Even if it is not directly provided on the base 5, it may be provided on an apparatus or member (for example, a base camera for component recognition or a transport rail of the printed circuit board 100) fixedly arranged on the base 5.

  In the first and second embodiments, the first head unit 3 and the second head unit 4 are driven using a linear motor in the Y-axis direction and driven using a ball screw mechanism in the X-axis direction. Although the example to which the present invention is applied is shown, the present invention is not limited to this, and may be applied to a surface mounter that drives both the Y-axis and the X-axis with a linear motor. You may apply to the surface mounting machine which performs both drive by a ball screw mechanism.

  In the first and second embodiments, the example in which the base marks 5a to 5e are imaged every time the printed circuit board 100 is transported is shown. However, the present invention is not limited to this. When the mounting time of the substrate 100 is short, the base marks 5a to 5e may be imaged every time a plurality of printed circuit boards 100 are conveyed.

  In the second embodiment, the example in which it is determined whether or not a predetermined time has elapsed since the conveyance of the printed circuit board 100 is completed, and the correction value is acquired when the predetermined time has elapsed has been described. However, the present invention is not limited to this, and a new correction value may be acquired after a predetermined time has elapsed since the previous correction value was acquired.

1 Surface mounter (mounter)
3 First head unit 3c Substrate imaging device (first imaging device)
4 Second head unit 4c Substrate imaging device (second imaging device)
5 Base 5a, 5b Base mark (2nd base mark)
5c Base mark (1st base mark)
5d, 5e Base mark (third base mark)
100, 100a, 100b Printed circuit board (board)
101 Control Device 150 Fiducial Mark A First Movement Range B Second Movement Range

Claims (7)

The base,
A first head unit disposed on the base and provided on the substrate having a fiducial mark for mounting a component, and having a first imaging device and movable above the base;
A second head unit provided for mounting a component on the substrate, having a second imaging device and movable above the base independently of the first head unit;
On the base in the first movement range that is the movement range of the first imaging device of the first head unit and in the second movement range that is the movement range of the second imaging device of the second head unit. A plurality of base marks including a first base mark arranged;
A control device that controls driving of the first head unit, the first imaging device, the second head unit, and the second imaging device;
The control device images at least the first base mark by each of the first imaging device and the second imaging device, so that the coordinate system of the second head unit with respect to the coordinate system of the first head unit is A first correction value for correcting a relative deviation, a second correction value for correcting a positional deviation of the control position of the first head unit with respect to the actual position, and a positional deviation of the control position of the second head unit with respect to the actual position. And a third correction value for correcting
When mounting a component on the substrate, the control device images the fiducial mark on the substrate with the first imaging device, and mounts the component on the substrate with the first head unit. Based on the imaging result of the dual mark and the second correction value , the mounting of the component on the substrate by the second head unit is performed on the substrate, the imaging result of the fiducial mark by the first imaging device , and the third correction. A mounter configured to perform based on the value and the first correction value. Said plurality of base marks, in addition to the first base marks arranged on the base in the area overlapping with the second movement range and the first movement range, in the first movement range Of these , the second base mark disposed on the base outside the region where the first movement range and the second movement range overlap, and the first movement range and the second of the second movement range. A third base mark arranged on the base outside the region overlapping with the movement range ,
The control device acquires the second correction value by imaging the first base mark and the second base mark by the first imaging device, and acquires the first base mark by the second imaging device. The mounting machine according to claim 1 , wherein the third correction value is acquired by imaging the third base mark. The total number of marks of the first base mark and the second base mark is at least three,
The mounting machine according to claim 2 , wherein the total number of marks of the first base mark and the third base mark is at least three. The control device images the first base mark by both the first imaging device and the second imaging device during the mounting operation including the transportation of the substrate and the mounting operation of the component on the substrate. it allows the first and the correction value is configured to obtain during the mounting operation, the mounting apparatus according to any one of claims 1-3. The control device captures the first correction value by imaging the first base mark a plurality of times during the mounting operation by both the first imaging device and the second imaging device. It is configured to acquire a plurality of times during operation and update the first correction value,
When the component is mounted on the board, the control device sets the mounting of the component on the board by the second head unit and the latest first imaging result of the fiducial mark by the first imaging device. The mounting machine according to claim 4 , wherein the mounting machine is configured to perform based on a correction value. The control device captures a plurality of the first correction values during the mounting operation by imaging the first base mark every time the substrate is transported by both the first imaging device and the second imaging device. The mounting machine according to claim 5 , wherein the mounting machine is configured to be acquired and updated once. When the time required for mounting the component on the substrate is shorter than a predetermined time, the control device uses the first imaging device and the second imaging device to transfer the first each time the substrate is transported. The first correction value is obtained by imaging the base mark,
When the time required for mounting the component on the board is longer than the predetermined time, the control device also performs the operation of mounting the component on the board in addition to each time the board is transported. The mounting machine according to claim 6 , wherein the first correction value is acquired by imaging the first base mark by both the first imaging device and the second imaging device.

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