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JP5257653B2 - Electronic circuit equipment - Google Patents
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JP5257653B2 - Electronic circuit equipment - Google Patents

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JP5257653B2
JP5257653B2 JP2008047424A JP2008047424A JP5257653B2 JP 5257653 B2 JP5257653 B2 JP 5257653B2 JP 2008047424 A JP2008047424 A JP 2008047424A JP 2008047424 A JP2008047424 A JP 2008047424A JP 5257653 B2 JP5257653 B2 JP 5257653B2
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connector
circuit board
cavity
base
wall
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JP2009205944A (en
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吉久 小林
哲也 燕
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Nippon Seiki Co Ltd
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Nippon Seiki Co Ltd
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Description

本発明は、コネクタ及び電子部品が実装された回路基板と、コネクタの一部を外部に露出させるとともに、このコネクタの一部を除いたコネクタの他の箇所及び電子部品を包囲する金属製のシールドケースとを備えた電子回路装置に関する。   The present invention relates to a circuit board on which a connector and an electronic component are mounted, and a metal shield that exposes a part of the connector to the outside and surrounds other parts of the connector excluding the connector and the electronic component. The present invention relates to an electronic circuit device including a case.

従来、この種の電子回路装置にあっては、例えば下記特許文献1に記載されているものが知られている。かかる特許文献1に記載の電子回路装置は、コネクタと集積回路やトランジスタをはじめとする各種の電子部品とが配線パターン上に実装(配設)された回路基板と、コネクタの一部であるコネクタの所定箇所を外部に露出させるとともに、前記所定箇所を除いたコネクタの他の箇所及び電子部品(例えば前記集積回路)を包囲するように回路基板に配設される金属製のシールドケース(シールド部材)とを備え、この場合、コネクタは、その外形形状が略直方体形状にて形成され、例えばシールドケーブルからなる配線部材を介して所定の外部機器と接続されてなる。   Conventionally, as this type of electronic circuit device, for example, one described in Patent Document 1 below is known. The electronic circuit device described in Patent Document 1 includes a circuit board on which a connector and various electronic components such as an integrated circuit and a transistor are mounted (arranged) on a wiring pattern, and a connector that is a part of the connector. The metal shield case (shield member) disposed on the circuit board so as to expose the predetermined portion of the connector to the outside and surround other portions of the connector excluding the predetermined portion and the electronic component (for example, the integrated circuit) In this case, the outer shape of the connector is formed in a substantially rectangular parallelepiped shape, and is connected to a predetermined external device via a wiring member made of, for example, a shield cable.

また、シールドケースは、鉄等の導電性材料からなり、略箱形状にて形成され、前記集積回路やコネクタの実装面側が開口した略矩形状の開口部と、この開口部に対応する薄板状の上壁部と、この上壁部を取り巻くように垂下形成される薄板状の4つの側壁部とを備え、コネクタの前記他の箇所及び前記集積回路を覆い隠すように例えば回路基板に設けられたグランドパターン上に実装される。この際、シールドケースの上壁部、4つの側壁部並びに回路基板とで、コネクタの前記他の箇所及び前記集積回路を収容する収容空間が形成されることになる。   The shield case is made of a conductive material such as iron and is formed in a substantially box shape. The integrated circuit or the connector mounting surface side is opened in a substantially rectangular shape, and a thin plate corresponding to the opening. An upper wall portion and four thin plate-like side wall portions hanging down so as to surround the upper wall portion, and are provided on, for example, a circuit board so as to cover the other portion of the connector and the integrated circuit. Mounted on the ground pattern. At this time, a housing space for housing the other portion of the connector and the integrated circuit is formed by the upper wall portion of the shield case, the four side wall portions, and the circuit board.

そして、このように開口部と上壁部と4つの側壁部とを有するように構成されたシールドケースにおいて、4つの側壁部のうち1つの側壁部の下方側(つまり回路基板との当接部分)には、直方体形状のコネクタの前記所定箇所だけを外部に露出させるように(換言すれば直方体形状のコネクタを避けるように)略コの字からなる溝形状にて切り欠き形成された切り欠き部が設けられてなる。つまり、前記1つの側壁部は、コネクタの前記所定箇所をシールドケースの外部に露出させるための略コの字形状からなる切り欠き部を備え、略コの字形状の切り欠き部に、前記所定箇所を露出させるべく直方体形状のコネクタが嵌る構成となっている。
特開平8−293687号公報
In the shield case configured to have the opening, the upper wall, and the four side walls as described above, the lower side of one of the four side walls (that is, the contact portion with the circuit board) ) Is a notch formed in a substantially U-shaped groove shape so that only the predetermined portion of the rectangular parallelepiped connector is exposed to the outside (in other words, avoiding the rectangular parallelepiped connector). A part is provided. That is, the one side wall portion includes a substantially U-shaped notch portion for exposing the predetermined portion of the connector to the outside of the shield case, and the substantially U-shaped notch portion includes the predetermined portion. A rectangular parallelepiped connector is fitted to expose the location.
JP-A-8-293687

上述した特許文献1記載の電子回路装置の場合、金属製のシールドケースに、直方体形状からなるコネクタの一部(前記所定箇所)を外部に露出させるべく略コの字形状の切り欠き部を設け、かかる略コの字形状の切り欠き部に直方体形状のコネクタが嵌る構成となっている。   In the case of the electronic circuit device described in Patent Document 1 described above, a substantially U-shaped notch is provided in a metal shield case to expose a part of the rectangular parallelepiped connector (the predetermined portion) to the outside. The rectangular parallelepiped connector fits into the substantially U-shaped cutout.

この際、直方体形状からなるコネクタの外周壁が、略コの字形状の切り欠き部とクリアランス無く当接するように、コネクタをシールドケースに嵌め込む構成とするのが好ましいが、コネクタの各部や、切り欠き部を含むシールドケースの各部の寸法には、寸法公差が存在するための、前記クリアランスを無くすことはできない。つまり、コネクタの前記外周壁と、シールドケースに設けた切り欠き部との間には微少クリアランスが生じることになる。   At this time, it is preferable that the connector is fitted into the shield case so that the outer peripheral wall of the connector having a rectangular parallelepiped shape is in contact with the substantially U-shaped cutout portion without any clearance, but each part of the connector, Since there is a dimensional tolerance in the dimension of each part of the shield case including the notch, the clearance cannot be eliminated. That is, a minute clearance is generated between the outer peripheral wall of the connector and the notch provided in the shield case.

すると、電子部品(前記集積回路)から発せられる電磁波が、前記微少クリアランスを通過してシールドケース(シールド部材)の外部に漏洩することで、電子回路装置の周辺に配置される他の機器(例えば前記外部機器)に悪影響を及ぼし、これにより他の機器が、電磁波ノイズの影響を受けて誤動作してしまうという問題あった。
そこで本発明は、前述の課題に対して対処するため、シールド部材外部への電磁波漏洩を遮断することで、他の機器が誤動作する虞のない電子回路装置の提供を目的とするものである。
Then, the electromagnetic wave emitted from the electronic component (the integrated circuit) passes through the minute clearance and leaks to the outside of the shield case (shield member), so that other devices (for example, arranged around the electronic circuit device (for example, There is a problem that the external device) is adversely affected and other devices malfunction due to the influence of electromagnetic noise.
In view of the above-described problems, an object of the present invention is to provide an electronic circuit device that prevents other devices from malfunctioning by blocking electromagnetic wave leakage to the outside of a shield member.

本発明は、第1の空洞部を有する導電性材料からなる基部と前記第1の空洞部に連通する第2の空洞部を有する導電性材料からなる円筒部とが一体形成されたコネクタ及び電子部品が配設された回路基板と、前記基部の一部及び前記円筒部を外部に露出させるように形成された切り欠き部を有し、前記基部の一部を除いた前記基部の他の箇所及び前記電子部品を包囲するように前記回路基板に配設される導電性材料からなるシールド部材とを備えた電子回路装置において、前記コネクタには前記基部と離間するように前記第1の空洞部に位置するとともに前記円筒部と離間するように前記第2の空洞部に位置する接続端子と、前記接続端子を挿通させる挿通孔を有するとともに前記第1の空洞部と前記第2の空洞部とを跨いだ状態で前記第1、第2の空洞部に充填される絶縁体とが設けられ、前記基部に形成される導電性材料からなる突起部と、前記切り欠き部の周囲に形成される前記シールド部材の壁部とが当接するように、前記コネクタ及び前記シールド部材を前記回路基板に配設する構成としたことを特徴とする。
The present invention is, first of second cylindrical portion made of a conductive material having a hollow portion and is integrally formed connectors and electronic communicating with base and the first cavity portion made of a conductive material having a hollow portion A circuit board on which components are disposed, and a part of the base part and a notch part formed to expose the cylindrical part to the outside, and other parts of the base part excluding the part of the base part And a shield member made of a conductive material disposed on the circuit board so as to surround the electronic component, wherein the connector has the first cavity portion so as to be separated from the base portion. A connection terminal located in the second cavity so as to be spaced apart from the cylindrical part, an insertion hole through which the connection terminal is inserted, and the first cavity and the second cavity In the state straddling the first An insulator which is filled in the second cavity is provided, and a projecting portion made of a conductive material formed on the base, the wall portion of the shield member is formed around the cutout portion comes The connector and the shield member are arranged on the circuit board so as to come into contact with each other.

また本発明は、第1の空洞部を有する導電性材料からなる基部と前記第1の空洞部に連通する第2の空洞部を有する導電性材料からなる円筒部とが一体形成されたコネクタ及び電子部品が配設された回路基板と、前記基部の一部及び前記円筒部を外部に露出させるように形成された切り欠き部を有し、前記基部の一部を除いた前記基部の他の箇所及び前記電子部品を包囲するように前記回路基板に配設される導電性材料からなるシールド部材とを備えた電子回路装置において、前記コネクタには前記基部と離間するように前記第1の空洞部に位置するとともに前記円筒部と離間するように前記第2の空洞部に位置する接続端子と、前記接続端子を挿通させる挿通孔を有するとともに前記第1の空洞部と前記第2の空洞部とを跨いだ状態で前記第1、第2の空洞部に充填される絶縁体とが設けられ、前記基部には前記切り欠き部の周囲に形成される前記シールド部材の壁部を介在させるような窪み部が設けられ、前記窪み部は、前記壁部を挟んで対向する一対の対向壁を備えてなるとともに、前記一対の対向壁のうちどちらか一方の対向壁と前記壁部とが当接するように、前記コネクタ及び前記シールド部材を前記回路基板に配設する構成としたことを特徴とする。 The present invention, connectors and a cylindrical portion made of a conductive material having a second cavity communicating with the base and the first cavity portion made of a conductive material having a first hollow portion are integrally formed and A circuit board on which an electronic component is disposed; a notch portion formed so as to expose a part of the base portion and the cylindrical portion to the outside; and the other of the base portion excluding the part of the base portion And a shield member made of a conductive material disposed on the circuit board so as to surround the electronic component, the connector has the first cavity so as to be separated from the base portion. The first cavity and the second cavity have a connection terminal located in the second cavity so as to be spaced apart from the cylindrical part, and an insertion hole through which the connection terminal is inserted. In the state straddling and 1, an insulator is filled in the second cavity is provided a recess portion as an intervening wall portion of the shield member is formed around the notch in the base portion is provided, wherein The hollow portion includes a pair of opposing walls that are opposed to each other with the wall portion interposed therebetween, and one of the pair of opposing walls is in contact with the opposing wall and the wall portion. The shield member is arranged on the circuit board.

本発明によれば、初期の目的を達成でき、シールド部材外部への電磁波漏洩を遮断することで、他の機器が誤動作する虞のない電子回路装置を提供できる。   ADVANTAGE OF THE INVENTION According to this invention, the initial objective can be achieved and the electronic circuit device which does not have a possibility that another apparatus may malfunction can be provided by interrupting | blocking electromagnetic wave leakage to the exterior of a shield member.

(第1実施形態)以下、添付図面に基づき、本発明による電子回路装置の第1実施形態を説明する。なお、図1は本発明の第1実施形態による電子回路装置の斜視図、図2は同実施形態による電子回路装置の断面図、図3は図1のA−A断面図、図4は同実施形態による回路基板を取り除いた状態のコネクタとシールド部材の要部背面図である。 (First Embodiment) A first embodiment of an electronic circuit device according to the present invention will be described below with reference to the accompanying drawings. 1 is a perspective view of the electronic circuit device according to the first embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic circuit device according to the same embodiment, FIG. 3 is a cross-sectional view taken along the line AA in FIG. It is a principal part rear view of the connector and shield member of the state which removed the circuit board by an embodiment.

図1において、本実施形態による電子回路装置Cは、回路基板10と、コネクタ20と、金属製のシールドケース(シールド部材)30とから主に構成されてなる。   In FIG. 1, the electronic circuit device C according to the present embodiment is mainly composed of a circuit board 10, a connector 20, and a metal shield case (shield member) 30.

回路基板10は、例えばガラスエポキシ系基材の両面に配線パターン(図示せず)を施した硬質回路基板からなり、集積回路(IC)11や図示省略した抵抗、トランジスタ等の各種の電子部品、並びにコネクタ20が前記配線パターンに導通接続されてなる。このことは、回路基板10(前記配線パターン)には、集積回路11や抵抗、トランジスタ並びにコネクタ20が実装(配設)されていることを意味してなる。   The circuit board 10 is formed of a hard circuit board having wiring patterns (not shown) on both surfaces of a glass epoxy base material, for example, and includes various types of electronic components such as an integrated circuit (IC) 11, resistors and transistors not shown, The connector 20 is electrically connected to the wiring pattern. This means that the integrated circuit 11, the resistor, the transistor, and the connector 20 are mounted (arranged) on the circuit board 10 (the wiring pattern).

なお、本実施形態では、集積回路11やコネクタ20は、回路基板10の表面側に実装された構成となっているものとする。また、本実施形態の場合、回路基板10は、一層の回路基板として構成されているが、例えば回路基板10を二層以上の積層回路基板としてもよい。なお、12は、コネクタ20の後述する一対の接続端子が貫通する第1の孔部、13は、コネクタ20の後述する各棒状端子が貫通する第2の孔部、14は、シールドケース30の後述する一対の第1、第2の足部が貫通する第3の孔部である。   In the present embodiment, the integrated circuit 11 and the connector 20 are configured to be mounted on the surface side of the circuit board 10. In the present embodiment, the circuit board 10 is configured as a single-layer circuit board. However, for example, the circuit board 10 may be a laminated circuit board having two or more layers. Reference numeral 12 denotes a first hole through which a pair of connection terminals described later of the connector 20 penetrates, reference numeral 13 denotes a second hole through which each rod-shaped terminal described later of the connector 20 passes, and reference numeral 14 denotes a shield case 30. A third hole portion through which a pair of first and second foot portions, which will be described later, penetrates.

コネクタ20は、図1、図2に示すように、略L字状をなす内部空間である第1の空洞部21が形成された基部22と、この基部22の右方に位置するように基部22と一体形成され、第1の空洞部21に連通する第2の空洞部23を有する円筒部24と、各空洞部21、23の内部に位置してなる一対の接続端子25と、円筒部24と取り巻くように形成される樹脂ケース26とを備えてなる。   As shown in FIGS. 1 and 2, the connector 20 includes a base portion 22 in which a first cavity portion 21 that is a substantially L-shaped internal space is formed, and a base portion so as to be located to the right of the base portion 22. 22, a cylindrical portion 24 having a second cavity portion 23 communicating with the first cavity portion 21, a pair of connection terminals 25 positioned inside each of the cavity portions 21, 23, and a cylindrical portion 24 and a resin case 26 formed so as to surround it.

基部22は、その外形形状が略直方体形状からなるもので、この場合、導電性材料(例えば真鍮)によって形成されてなる。なお、22aは、基部22における底部22bの四隅から下方に向けて棒状に突出形成された4つの棒状端子であり、各棒状端子22aは、コネクタ20が回路基板10に実装される際、回路基板10の各第2の孔部13を貫通し、この第2の孔部13から突出する各棒状端子22aの突出部分が回路基板10の裏面側に設けられた図示しないグランドパターンと半田付け接続される。   The base portion 22 has a substantially rectangular parallelepiped shape, and in this case, is formed of a conductive material (for example, brass). Reference numeral 22a denotes four rod-like terminals that are formed in a rod shape so as to protrude downward from the four corners of the bottom portion 22b of the base portion 22. Each rod-like terminal 22a is a circuit board when the connector 20 is mounted on the circuit board 10. The protruding portions of the respective rod-like terminals 22a that pass through the second hole portions 13 of the 10 and protrude from the second hole portions 13 are soldered and connected to a ground pattern (not shown) provided on the back side of the circuit board 10. The

また、22cは、基部22の底部22bを除いた基部22の3つの外周壁22dから外方に突出するように基部22と一体形成された略コの字状からなる平板状のフランジ部(突起部)であり、このフランジ部22cは、本実施形態では、導電性材料(例えば真鍮)にて形成され、コネクタ20における長手方向の略中央部分であって、前記長手方向に沿う基部22の前述した3つの外周壁22d箇所に各々設けられてなる。そして、フランジ部22cは、コネクタ20が回路基板10に実装されたときに、フランジ部22cにおけるシールドケース30側に位置する平坦部(平坦面)Fがシールドケース30の後述する壁部と面接触(当接)する構成となっている(図2参照)。   Further, 22c is a flat flange portion (protrusion) having a substantially U-shape integrally formed with the base portion 22 so as to protrude outward from the three outer peripheral walls 22d of the base portion 22 excluding the bottom portion 22b of the base portion 22. In the present embodiment, the flange portion 22c is formed of a conductive material (for example, brass) and is a substantially central portion in the longitudinal direction of the connector 20, and is the aforementioned portion of the base portion 22 along the longitudinal direction. The three outer peripheral walls 22d are provided respectively. When the connector 20 is mounted on the circuit board 10, the flange portion 22 c has a flat portion (flat surface) F located on the shield case 30 side of the flange portion 22 c in surface contact with a later-described wall portion of the shield case 30. (Refer to FIG. 2).

円筒部24は、基部22と同様に、導電性材料(例えば真鍮)からなり、コネクタ20の相手側となる後述するシールドケーブルに備えられる相手側コネクタを樹脂ケース26内に嵌め合わせた際に、前記シールドケーブルの後述するシールド部と導通接続されるようになっている。   The cylindrical portion 24 is made of a conductive material (for example, brass), like the base portion 22, and when a mating connector provided in a shielded cable, which will be described later, which is the mating side of the connector 20 is fitted into the resin case 26, The shield cable is electrically connected to a shield portion described later.

一対の接続端子25は、円筒部24並びに基部22の内部空間(つまり各空洞部21、23内)に位置してなり、第1の空洞部21の形状に対応すべく、円筒部24から基部22の底部22bへと至る際に略90度折り曲げられた折曲部25aを備えてなる。   The pair of connection terminals 25 are located in the inner space of the cylindrical portion 24 and the base portion 22 (that is, in each of the hollow portions 21 and 23), and from the cylindrical portion 24 to the base portion to correspond to the shape of the first hollow portion 21. 22 is provided with a bent portion 25a that is bent approximately 90 degrees when reaching the bottom portion 22b.

かかる折曲部25aは、その先端側が底部22bの下方に突出してなり、コネクタ20が回路基板10に実装される際、折曲部25aの先端側が回路基板10の第1の孔部12を貫通し、この第1の孔部12から突出する折曲部25aの突出端部が回路基板10の裏面側に設けられた前記配線パターンと半田付け接続される。   The bent portion 25a has a tip end projecting below the bottom portion 22b, and when the connector 20 is mounted on the circuit board 10, the tip end side of the bent portion 25a penetrates the first hole 12 of the circuit board 10. The protruding end portion of the bent portion 25 a protruding from the first hole portion 12 is soldered and connected to the wiring pattern provided on the back side of the circuit board 10.

なお、27は、各接続端子25が基部22と円筒部24に接触しないように、円筒部24と基部22との境界付近に対応する各空洞部21、23箇所に充填された絶縁体であり、この絶縁体27は、接続端子25を挿通させる挿通孔27aを有してなる。   Reference numeral 27 denotes an insulator filled in each of the cavity portions 21 and 23 corresponding to the vicinity of the boundary between the cylindrical portion 24 and the base portion 22 so that each connection terminal 25 does not contact the base portion 22 and the cylindrical portion 24. The insulator 27 has an insertion hole 27a through which the connection terminal 25 is inserted.

このように接続端子25が挿通孔27aに挿通固定されることで、接続端子25は、基部22や円筒部24と接触しないように、各空洞部21、23内に位置決め固定される。つまり、接続端子25は、その略中央部分が、絶縁体27によって覆われ、接続端子25の両端側が絶縁体27から露出する構成となる。   By connecting and fixing the connection terminal 25 in the insertion hole 27 a in this way, the connection terminal 25 is positioned and fixed in the hollow portions 21 and 23 so as not to contact the base portion 22 and the cylindrical portion 24. That is, the connection terminal 25 has a configuration in which a substantially central portion is covered with the insulator 27 and both end sides of the connection terminal 25 are exposed from the insulator 27.

このうち、円筒部24側に露出してなる接続端子25の一端側は、コネクタ20の相手側となる後述するシールドケーブルの相手側コネクタが樹脂ケース26内に嵌め合わされることで、図示しない外部機器から出力される所定の信号を受信可能となっている。   Among these, one end side of the connection terminal 25 exposed to the cylindrical portion 24 side is fitted with a mating connector of a shielded cable, which will be described later, which is the mating side of the connector 20, in the resin case 26. A predetermined signal output from the device can be received.

一方、基部22(底部22b)側に露出してなる接続端子25の他端側は、前述した折曲部25aに相当するものであり、前記所定の信号を回路基板10の裏面側に設けた前記配線パターンへと伝送してなる。   On the other hand, the other end side of the connection terminal 25 exposed to the base 22 (bottom 22b) side corresponds to the bent portion 25a described above, and the predetermined signal is provided on the back side of the circuit board 10. It is transmitted to the wiring pattern.

樹脂ケース26は、外形形状が略枠状の前記相手側コネクタを収容可能とするように略枠状に形成され、円筒部24の外周を取り囲むように基部22と所定の固定手段を用いて固定されてなる。そして、前記相手側コネクタが樹脂ケース26内に嵌め合わされることで、前記所定の信号が前記シールドケーブルを介してコネクタ20側(つまり接続端子25)に伝送される。   The resin case 26 is formed in a substantially frame shape so as to accommodate the counterpart connector whose outer shape is a substantially frame shape, and is fixed using a base 22 and a predetermined fixing means so as to surround the outer periphery of the cylindrical portion 24. Being done. And the said other party connector is fitted in the resin case 26, The said predetermined signal is transmitted to the connector 20 side (namely, connection terminal 25) via the said shield cable.

ここで、前記外部機器とコネクタ20とを繋ぐシールドケーブル40(図1参照)について説明する。かかるシールドケーブル40は、前記外部機器から出力される前記所定の信号をコネクタ20側(接続端子25)へと伝送するための2つの信号伝送線41と、この信号伝送線41を取り巻くシールド線42と、このシールド線42をさらに取り巻く絶縁部材43とを備えてなる(図3参照)。なお、この場合、信号伝送線41とシールド線42とが短絡しないように信号伝送線41は、絶縁被膜41aにより覆われてなる。   Here, the shielded cable 40 (see FIG. 1) that connects the external device and the connector 20 will be described. The shielded cable 40 includes two signal transmission lines 41 for transmitting the predetermined signal output from the external device to the connector 20 side (connection terminal 25), and a shield line 42 surrounding the signal transmission line 41. And an insulating member 43 that further surrounds the shield wire 42 (see FIG. 3). In this case, the signal transmission line 41 is covered with an insulating film 41a so that the signal transmission line 41 and the shield line 42 are not short-circuited.

また詳細図示は省略するが、シールド線42は、無数の細い鉄線を束ねた状態で信号伝送線41を覆う構成となっており、信号伝送線41から発せられる電磁波の漏洩を抑制する機能を有する。   Although the detailed illustration is omitted, the shield wire 42 is configured to cover the signal transmission line 41 in a state where innumerable thin iron wires are bundled, and has a function of suppressing leakage of electromagnetic waves emitted from the signal transmission line 41. .

このように構成されたシールドケーブル40は、その一端側が前記外部機器と接続される。また、この一端側とは反対側となる他端側には、コネクタ20の相手側となる相手側コネクタ44が装着されてなり、かかる相手側コネクタ44は、樹脂ケース26内に嵌合可能な外形形状を有してなる。   One end of the shielded cable 40 configured in this way is connected to the external device. Further, a mating connector 44 that is the mating side of the connector 20 is attached to the other end side opposite to the one end side, and the mating connector 44 can be fitted into the resin case 26. It has an outer shape.

なお、相手側コネクタ44は、詳細図示省略するが、コネクタ20(樹脂ケース26)に嵌め合わされた際に、コネクタ20の接続端子25と信号伝送線41との接続状態を維持すべく、信号伝送線41の末端部が配設される雌端子部や、コネクタ20の円筒部24とシールド線42との接続状態を維持すべく、シールド線42と導通接続される導通部等を備えてなる。   Although the detailed illustration of the counterpart connector 44 is omitted, in order to maintain the connection state between the connection terminal 25 of the connector 20 and the signal transmission line 41 when fitted to the connector 20 (resin case 26), signal transmission is performed. In order to maintain the connection state between the cylindrical portion 24 of the connector 20 and the shield wire 42, a female portion where the terminal portion of the wire 41 is disposed, a conductive portion that is conductively connected to the shield wire 42, and the like are provided.

シールドケース30は、鉄等の導電性材料からなり、略箱形状にて形成され、回路基板10の表面側が開放(開口)した略矩形状の開口部31と、この開口部31に対応する薄板状の上壁部32と、この上壁部32を取り巻くように垂下形成される薄板状の4つの側壁部33とを備えてなる。   The shield case 30 is made of a conductive material such as iron, is formed in a substantially box shape, has a substantially rectangular opening 31 whose surface side of the circuit board 10 is open (opened), and a thin plate corresponding to the opening 31 And a thin plate-like four side wall portion 33 formed so as to surround the upper wall portion 32.

なお、以下の説明では、コネクタ20の配設位置に対応する側壁部33を第1の側壁部33a、第1の側壁部33aと相対する側壁部33を第2の側壁部33b、図1中、第1の側壁部33aの左方に隣接する側壁部33を第3の側壁部33c、図1中、第1の側壁部33aの右方に隣接し、第3の側壁部33cと相対する側壁部33を第4の側壁部33dと定義する。   In the following description, the side wall 33 corresponding to the position of the connector 20 is the first side wall 33a, and the side wall 33 opposite to the first side wall 33a is the second side wall 33b. The side wall 33 adjacent to the left side of the first side wall 33a is the third side wall 33c, adjacent to the right side of the first side wall 33a in FIG. 1, and is opposed to the third side wall 33c. The side wall portion 33 is defined as a fourth side wall portion 33d.

そして、コネクタ20の配設位置に対応する第1の側壁部33aの下方には、コネクタ20の基部22を避ける(つまり後述するコネクタ20の一部をシールドケース30の外部に露出させる)ように略コの字形状に切り欠き形成された切り欠き部34が設けられてなる。これにより第1の側壁部33aは、切り欠き部34を取り囲むように切り欠き部34の周囲に逆凹部形状からなる薄板状の壁部35が形成されることになる。   Then, below the first side wall portion 33a corresponding to the position where the connector 20 is disposed, the base portion 22 of the connector 20 is avoided (that is, a part of the connector 20 described later is exposed outside the shield case 30). A cutout portion 34 is formed which is formed in a substantially U-shaped cutout. As a result, the first side wall portion 33 a is formed with a thin plate-like wall portion 35 having a reverse concave shape around the notch portion 34 so as to surround the notch portion 34.

また、第3の側壁部33cは、その底面における両端近傍から下方に突出形成された凸部からなる一対の第1の足部36を備えてなるとともに、第4の側壁部33dは、その底面における両端近傍から下方に突出形成された凸部からなり、一対の第1の足部36と対向する一対の第2の足部37を備えてなる。これら各足部36、37は、回路基板10の各第3の孔部14に対応する位置に形成され、各足部36、37を各第3の孔部14に貫通させ、第3の孔部14から突出する各足部36、37の突出端部を前記グランドパターンに半田付け接続することで、シールドケース30が、集積回路11並びに後述するコネクタ20の他の箇所を包囲するように回路基板10上に搭載される。   The third side wall 33c is provided with a pair of first leg portions 36 each including a convex portion projecting downward from the vicinity of both ends of the bottom surface thereof, and the fourth side wall portion 33d has a bottom surface thereof. And a pair of second legs 37 that are opposed to the pair of first legs 36. These foot portions 36 and 37 are formed at positions corresponding to the respective third hole portions 14 of the circuit board 10, and the respective foot portions 36 and 37 are passed through the respective third hole portions 14 to form third holes. By connecting the protruding end portions of the feet 36 and 37 protruding from the portion 14 to the ground pattern by soldering, the shield case 30 surrounds the integrated circuit 11 and other portions of the connector 20 described later. Mounted on the substrate 10.

以上の各部により電子回路装置Cが構成される。次に、電子回路装置Cを構成する回路基板10、コネクタ20、シールドケース30の組み付け例を説明する。まず、接続端子25(折曲部25a)が第1の孔部12に対応し、且つ棒状端子22aが第2の孔部13に対応するように、回路基板10の上方側にコネクタ20をセットする。次に、この状態からコネクタ20を下方に移動させることで、接続端子25の折曲部25aが第1の孔部12を貫通すると同時に各棒状端子22aが各第2の孔部13を貫通する。   The electronic circuit device C is configured by the above units. Next, an assembly example of the circuit board 10, the connector 20, and the shield case 30 constituting the electronic circuit device C will be described. First, the connector 20 is set on the upper side of the circuit board 10 so that the connection terminal 25 (the bent portion 25a) corresponds to the first hole portion 12 and the rod-shaped terminal 22a corresponds to the second hole portion 13. To do. Next, by moving the connector 20 downward from this state, the bent portion 25a of the connection terminal 25 penetrates the first hole portion 12, and at the same time, each rod-like terminal 22a penetrates each second hole portion 13. .

次に、第1の孔部12から突出する折曲部25aの突出部分と前記配線パターンとが半田付け接続されるとともに、各第2の孔部13から突出する各棒状端子22aの突出部分と前記グランドパターンとが半田付け接続されることで、コネクタ20が回路基板10上に実装される。   Next, the protruding portion of the bent portion 25a protruding from the first hole 12 and the wiring pattern are soldered and connected, and the protruding portion of each rod-like terminal 22a protruding from each second hole 13 The connector 20 is mounted on the circuit board 10 by soldering the ground pattern.

次に、第1、第2の足部36、37が各第3の孔部14に対応し、且つ、コネクタ20の基部22が切り欠き部34に対応するように、シールドケース30をコネクタ20の実装された回路基板10の上方側にセットする。次に、この状態からシールドケース30を下方に移動させることで、第1、第2の足部36、37が各第3の孔部14を貫通するとともに、切り欠き部34が基部22(3つの外周壁22d)を覆うようにシールドケース30が回路基板10上に搭載される。   Next, the shield case 30 is connected to the connector 20 so that the first and second legs 36 and 37 correspond to the third holes 14 and the base 22 of the connector 20 corresponds to the notch 34. Is set on the upper side of the circuit board 10 on which is mounted. Next, by moving the shield case 30 downward from this state, the first and second legs 36 and 37 penetrate the third holes 14 and the notch 34 is formed on the base 22 (3 The shield case 30 is mounted on the circuit board 10 so as to cover the two outer peripheral walls 22d).

次に、各第3の孔部14から突出した各足部36、37の突出部分と前記グランドパターンとが半田付け接続されることで、コネクタ20の一部(この場合、図2中、平坦部Fよりも右方に位置する箇所)を外部に露出させ、且つ、このコネクタ20の前記一部を除いたコネクタ20の他の箇所(この場合、図2中、平坦部Fよりも左方に位置する箇所)並びに集積回路11を包囲するように、シールドケース30が回路基板10上に搭載(配設)される。   Next, the protruding portions of the legs 36 and 37 protruding from the third holes 14 and the ground pattern are soldered and connected, so that a part of the connector 20 (in this case, flat in FIG. 2). 2 and the other part of the connector 20 excluding the part of the connector 20 (in this case, the left side of the flat part F in FIG. 2). The shield case 30 is mounted (arranged) on the circuit board 10 so as to surround the integrated circuit 11.

この際、コネクタ20に一体形成されたフランジ部22cにおけるシールドケース30側に位置する平坦部Fと、第1の側壁部33aに形成された切り欠き部34の周辺(周囲)に位置する壁部35の外壁面とが面接触(当接)する構成となっている(図2、図4参照)。なお、この場合、フランジ部22c、基部22の上壁部分、並びに両側壁部分を構成する前述した3つの外周壁22dから外方に突出形成されている。つまり、図2の断面図では、前記上壁部分から突出形成されたフランジ部22cが図示されており、図4の背面図では、前記両側壁部分から突出形成された2つのフランジ部22cが図示されている。
At this time, the flat portion F located on the shield case 30 side in the flange portion 22c integrally formed with the connector 20 and the wall portion located around (periphery) the notch portion 34 formed in the first side wall portion 33a. The outer wall surface of 35 is in surface contact (contact) (see FIGS. 2 and 4). In this case, the flange portion 22c is formed to project outward from the above-described three outer peripheral walls 22d constituting the upper wall portion and both side wall portions of the base portion 22. That is, in the sectional view of FIG. 2, the flange portion 22c protruding from the upper wall portion is illustrated, and in the rear view of FIG. 4, two flange portions 22c protruding from the both side wall portions are illustrated. Has been.

従って、本例におけるフランジ部22cは、前記上壁部分並びに前記両側壁部分に渡って連続形成されたコの字壁からなる鍔形状をなしており、かかるコの字壁からなるフランジ部22cの平坦部Fが、コの字形状に切り欠き形成された切り欠き部34の周囲に位置してなる壁部35の外壁面と面接触するように、基部22が切り欠き部34によって覆われる構成となっている。   Accordingly, the flange portion 22c in this example has a bowl shape formed of a U-shaped wall continuously formed over the upper wall portion and the both side wall portions, and the flange portion 22c formed of the U-shaped wall of the flange portion 22c. A configuration in which the base portion 22 is covered by the notch portion 34 so that the flat portion F is in surface contact with the outer wall surface of the wall portion 35 located around the notch portion 34 that is notched in a U-shape. It has become.

換言すれば、本実施形態の場合、シールドケース30側においては、略コの字形状にて切り欠き形成された切り欠き部34の周辺に逆凹形状の壁部35が形成されてなり、他方、コネクタ20側においては、底部22bを除いた基部22の3つの外周壁22d箇所から外方に向けてコの字壁からなるフランジ部22cが延長形成されてなる。そして、このコの字壁からなるフランジ部22cの平坦部Fと、この平坦部Fに対応(対向)する壁部35箇所とが面接触(当接)するように、コネクタ20及びシールドケース30が回路基板10上に配設される構成となっている。   In other words, in the case of this embodiment, on the shield case 30 side, a wall portion 35 having a reverse concave shape is formed around the notch portion 34 that is notched in a substantially U shape, On the connector 20 side, a flange portion 22c made of a U-shaped wall is extended and extended outward from the three outer peripheral wall 22d portions of the base portion 22 excluding the bottom portion 22b. Then, the connector 20 and the shield case 30 so that the flat portion F of the flange portion 22c made of the U-shaped wall and the 35 wall portions corresponding to (facing) the flat portion F are in surface contact (contact). Is arranged on the circuit board 10.

このとき、前記面接触領域となるフランジ部22c(平坦部F)、並びにこのフランジ部22c(平坦部F)に対応する壁部35箇所は、ともに導電性材料によって形成されているとともに、回路基板10とシールドケース30とフランジ部22cを含む基部22とで形成される空間部S1は、回路基板10に実装された集積回路11を閉じこめておく閉塞空間を構成してなる(図2参照)。   At this time, the flange portion 22c (flat portion F) serving as the surface contact region and the 35 portions of the wall portion corresponding to the flange portion 22c (flat portion F) are both formed of a conductive material, and the circuit board. A space S1 formed by the base 10, including the shield case 30 and the flange 22c, constitutes a closed space for confining the integrated circuit 11 mounted on the circuit board 10 (see FIG. 2).

そして、集積回路11から電磁波が発せられたとき、かかる電磁波は、コネクタ20やシールドケース30の各部における寸法の公差のバラツキに伴い、例えば切り欠き部34とこれを取り巻く3つの外周壁22dとの間に形成される空間部S1における微少クリアランスS2は通過可能である(図2、図4参照)。ところが、この微少クリアランスS2の周囲には、前記面接触領域が存在しているため、前記電磁波は、電気的に接続された前記面接触領域を通過することができず、前記面接触領域の手前(直前)で遮断される。   When an electromagnetic wave is emitted from the integrated circuit 11, the electromagnetic wave is caused by, for example, the notch 34 and the three outer peripheral walls 22d surrounding the cutout 34 due to variations in dimensional tolerances in each part of the connector 20 and the shield case 30. The minute clearance S2 in the space S1 formed therebetween can pass through (see FIGS. 2 and 4). However, since the surface contact region exists around the minute clearance S2, the electromagnetic wave cannot pass through the electrically connected surface contact region, and is in front of the surface contact region. Blocked at (just before).

従って、本実施形態によれば、フランジ部22c(平坦部F)と、このフランジ部22c(平坦部F)に対応するシールドケース30の壁部35箇所とを面接触させるように、コネクタ20及びシールドケース30を回路基板10上に搭載したことで、集積回路11から発せられる前記電磁波が、空間部S1(シールドケース30)の外部には漏洩しない構成となるため、電子回路装置Cの周辺に配置される他の機器(例えば前記外部機器)が誤動作する虞がなくなる。   Therefore, according to this embodiment, the connector 20 and the flange portion 22c (flat portion F) and the wall portions 35 of the shield case 30 corresponding to the flange portion 22c (flat portion F) are brought into surface contact. Since the shield case 30 is mounted on the circuit board 10, the electromagnetic wave emitted from the integrated circuit 11 does not leak outside the space S1 (shield case 30). There is no possibility of malfunction of other devices (for example, the external devices) arranged.

なお、コネクタ20及びシールドケース30を回路基板10に搭載したとき、前記外部機器から出力される前記所定の信号は、シールドケーブル40の信号伝送線41、コネクタ20の接続端子25を介して回路基板10に設けられた配線パターンへと送られる。また、信号伝送線41を取り巻くシールド線42は、コネクタ20の円筒部24、コネクタ20の基部22(棒状端子22a)を介して回路基板10に設けられた前記グランドパターンと接続されるとともに、円筒部24、基部22のフランジ部22c並びにシールドケース30(足部36、37)を介して前記グランドパターンと接続される。
When the connector 20 and the shield case 30 are mounted on the circuit board 10, the predetermined signal output from the external device is transmitted through the signal transmission line 41 of the shield cable 40 and the connection terminal 25 of the connector 20. 10 is sent to a wiring pattern provided in the circuit 10. The shield wire 42 surrounding the signal transmission line 41 is connected to the ground pattern provided on the circuit board 10 via the cylindrical portion 24 of the connector 20 and the base portion 22 (rod-like terminal 22a) of the connector 20, and is cylindrical. It is connected to the ground pattern via the portion 24, the flange portion 22c of the base portion 22, and the shield case 30 (foot portions 36, 37) .

また本実施形態では、フランジ部22cが、図2、図4に示すような薄板形状にて形成されてなる例について説明したが、フランジ部22cの板厚寸法は任意であり、例えば図2、図4に示すフランジ部22cを樹脂ケース26と当接するような肉厚形状を有する段部(突起部)にて形成してもよい。   Further, in the present embodiment, the example in which the flange portion 22c is formed in a thin plate shape as shown in FIGS. 2 and 4 has been described, but the plate thickness dimension of the flange portion 22c is arbitrary, for example, FIG. The flange portion 22c shown in FIG. 4 may be formed by a stepped portion (projection portion) having a thick shape that comes into contact with the resin case 26.

なお本実施形態では、フランジ部22cにおける平坦部Fと壁部35(第1の側壁部33a)の外壁面とが当接するように、コネクタ20及びシールドケース30が回路基板10上に搭載されてなる例について説明したが、例えば壁部35の外壁面ではなく、壁部35の内壁面と平坦部Fとが当接するように、コネクタ20及びシールドケース30を回路基板10上に搭載する構成としてもよい。また、このように壁部35の前記内壁面とフランジ部22cとを当接させる構成とした場合においても、フランジ部22cの前記板厚寸法はあらゆる寸法に設定可能であることは言うまでもない。   In the present embodiment, the connector 20 and the shield case 30 are mounted on the circuit board 10 so that the flat portion F of the flange portion 22c and the outer wall surface of the wall portion 35 (first side wall portion 33a) abut. As an example, the connector 20 and the shield case 30 are mounted on the circuit board 10 so that the inner wall surface of the wall portion 35 and the flat portion F abut instead of the outer wall surface of the wall portion 35, for example. Also good. Further, even when the inner wall surface of the wall portion 35 and the flange portion 22c are in contact with each other as described above, it goes without saying that the plate thickness dimension of the flange portion 22c can be set to any size.

(第2実施形態)次に、本発明の第2実施形態を図5、図6に基づいて説明するが、前述の第1実施形態と同一もしくは相当個所には同一の符号を用いてその詳細な説明は省略する。なお、図5は、本発明の第2実施形態による電子回路装置の断面図、図6は同第2実施形態による回路基板を取り除いた状態のコネクタとシールド部材の要部背面図である。 (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. 5 and 6. The same reference numerals are used for the same or corresponding parts as in the first embodiment, and the details thereof are used. The detailed explanation is omitted. 5 is a cross-sectional view of the electronic circuit device according to the second embodiment of the present invention, and FIG. 6 is a main part rear view of the connector and the shield member with the circuit board according to the second embodiment removed.

本第2実施形態が、前記第1実施形態と異なる点は、フランジ部22cを廃し、コネクタ20における長手方向の略中央部分となる基部22の底部22bを含む全ての(4つの)外周壁22dに凹溝からなる窪み部28を各々設け、底部22b以外の3つの外周壁22dに形成された3つの窪み部28に後述するコネクタ20の一部を外部に露出させるように壁部35を介在させた点、この3つの窪み部28が壁部35を挟んで対向する一対の第1、第2の対向壁28a、28bを備え、これら対向壁28a、28bのうち第1の対向壁28aと壁部35とが面接触(当接)するように、コネクタ20及びシールドケース30を回路基板10上に搭載した点である。   The second embodiment is different from the first embodiment in that the flange portion 22c is eliminated and all (four) outer peripheral walls 22d including the bottom portion 22b of the base portion 22 which is a substantially central portion of the connector 20 in the longitudinal direction. Each of the recesses 28 is formed with a recess groove 28, and a wall portion 35 is interposed in the three recess portions 28 formed on the three outer peripheral walls 22d other than the bottom portion 22b so that a part of the connector 20 described later is exposed to the outside. The three recesses 28 include a pair of first and second opposing walls 28a and 28b that are opposed to each other with the wall 35 interposed therebetween, and the first opposing wall 28a of the opposing walls 28a and 28b The connector 20 and the shield case 30 are mounted on the circuit board 10 so that the wall 35 is in surface contact (contact).

つまり、コネクタ20には、基部22の底部22bを含む4つの外周壁22dにおける所定位置(具体的には、コネクタ20における長手方向の略中央部分)に凹溝からなる窪み部28がそれぞれ形成されてなる。ここで、図5では、基部22における前記上壁部分並びに底部22bとなる外周壁22d箇所に設けられた窪み部28が図示されており、図6では、基部22における前記両側壁部分となる外周壁22d箇所に設けられた一対の窪み部28が図示されている。   That is, the connector 20 is formed with a recess 28 made of a concave groove at a predetermined position (specifically, approximately the central portion in the longitudinal direction of the connector 20) on the four outer peripheral walls 22d including the bottom 22b of the base portion 22. It becomes. Here, in FIG. 5, the upper wall portion in the base portion 22 and the recessed portion 28 provided at the outer peripheral wall 22 d portion serving as the bottom portion 22 b are illustrated, and in FIG. 6, the outer periphery serving as the both side wall portions in the base portion 22. A pair of depressions 28 provided at the wall 22d are shown.

このように本第2実施形態では、コネクタ20の略中央部分に全周に渡って窪み部28を設けたことにより、コネクタ20は、樹脂ケース26側と、棒状端子22aが位置する基部22側とが肉薄形状からなる連結部29を介して一体形成された構成となる。なお、連結部29は、絶縁体27の外周を取り囲む形状となっていることは言うまでもない。   As described above, in the second embodiment, the recess 20 is provided in the substantially central portion of the connector 20 over the entire circumference, so that the connector 20 has the resin case 26 side and the base 22 side where the rod-shaped terminal 22a is located. And are integrally formed through a connecting portion 29 having a thin shape. Needless to say, the connecting portion 29 has a shape surrounding the outer periphery of the insulator 27.

従って、かかる本第2実施形態によるコネクタ20を回路基板10に実装し、さらにシールドケース30をコネクタ20の実装された回路基板10に搭載したときに、連結部29が切り欠き部34に対応し、且つ連結部29の周囲に位置する窪み部28が切り欠き部34の周囲に位置するシールドケース30の壁部35に対応するように、シールドケース30が回路基板10上に搭載(配設)される構成となる。   Therefore, when the connector 20 according to the second embodiment is mounted on the circuit board 10 and the shield case 30 is mounted on the circuit board 10 on which the connector 20 is mounted, the connecting portion 29 corresponds to the notch portion 34. In addition, the shield case 30 is mounted (arranged) on the circuit board 10 so that the recess 28 positioned around the connecting portion 29 corresponds to the wall portion 35 of the shield case 30 positioned around the notch 34. It becomes the composition to be done.

そして、シールドケース30を回路基板10上に搭載すると、コネクタ20の一部(つまり図5、図6中、第1の側壁部33aよりも右方に位置するコネクタ20箇所)が、シールドケース30の外部に露出する構成となる。この際、窪み部28と壁部35との位置関係に着目すると、窪み部28が、壁部35を挟んで対向する一対の第1、第2の対向壁28a、28bを備え、さらに各対向壁28a、28bのうち棒状端子22a側に位置する第1の対向壁28aとこれに対応する壁部35箇所とが面接触(当接)するように、シールドケース30を回路基板10上に搭載した構成としている。   When the shield case 30 is mounted on the circuit board 10, a part of the connector 20 (that is, 20 connectors located on the right side of the first side wall portion 33 a in FIGS. 5 and 6) is shielded. It becomes the structure exposed outside. At this time, paying attention to the positional relationship between the recess 28 and the wall 35, the recess 28 includes a pair of first and second opposing walls 28 a and 28 b that are opposed to each other with the wall 35 interposed therebetween. The shield case 30 is mounted on the circuit board 10 so that the first opposing wall 28a located on the rod-shaped terminal 22a side of the walls 28a and 28b and the corresponding 35 wall portions are in surface contact (contact). The configuration is as follows.

かかる第2実施形態によれば、コネクタ20の底部22bを除いた3つの外周壁22dには、前述したコネクタ20の一部とこのコネクタ20の一部を除いたコネクタ20の他の箇所(つまり図5、図6中、第1の側壁部33aよりも左方に位置するコネクタ20箇所)との境界部分付近に、切り欠き部34の周辺(周囲)に形成される壁部35を介在させるような窪み部28がそれぞれ設けられてなる。そして、これら3つの窪み部28が、壁部35を挟んで対向する一対の第1、第2の対向壁28a、28bを各々備えてなるとともに、両対向壁28a、28bのうち個々の第1の対向壁28aと壁部35とが面接触(当接)するように、コネクタ20及びシールドケース30を回路基板10上に搭載(配設)する構成とした。   According to the second embodiment, the three outer peripheral walls 22d excluding the bottom portion 22b of the connector 20 have a part of the connector 20 described above and another part of the connector 20 excluding a part of the connector 20 (that is, 5 and 6, a wall portion 35 formed around the periphery (periphery) of the notch portion 34 is interposed in the vicinity of the boundary portion between the first side wall portion 33a and 20 connectors located on the left side of the first side wall portion 33a. Each of such depressions 28 is provided. And these three hollow parts 28 are each provided with a pair of 1st, 2nd opposing wall 28a, 28b which opposes on both sides of the wall part 35, and each 1st among both opposing walls 28a, 28b is included. The connector 20 and the shield case 30 are mounted (arranged) on the circuit board 10 so that the opposing wall 28a and the wall 35 are in surface contact (contact).

従って、空間部S1内に設けられた集積回路11から発せられる電磁波は、前記第1実施形態と同様に、ともに導電性材料からなる第1の対向壁28aと壁部35とが面接触し、且つ、これらが電気的に接続されていることで、空間部S1内に閉じこめられた状態となり、シールドケース30の外部には漏洩しない。つまり、前記電磁波は、第1の対向壁28aと壁部35との面接触部分を通過することができないから、シールドケース30の外部には漏洩しない構成となり、前記第1実施形態と同様の作用効果を得ることができる。   Therefore, the electromagnetic waves emitted from the integrated circuit 11 provided in the space S1 are in surface contact with the first facing wall 28a and the wall 35, both made of a conductive material, as in the first embodiment. And since these are electrically connected, it will be in the state enclosed in space part S1, and it will not leak outside the shield case 30. FIG. That is, since the electromagnetic wave cannot pass through the surface contact portion between the first facing wall 28a and the wall portion 35, the electromagnetic wave does not leak to the outside of the shield case 30, and the same action as in the first embodiment. An effect can be obtained.

また本第2実施形態では、第1の対向壁28aと壁部35とが当接するようにコネクタ20及びシールドケース30を回路基板10上に搭載する構成としたが、例えば第1の対向壁28aではなく樹脂ケース26側に位置する第2の対向壁28bが壁部35と当接するようにコネクタ20及びシールドケース30を回路基板10上に搭載した場合であっても同様の作用効果を得ることができる。   In the second embodiment, the connector 20 and the shield case 30 are mounted on the circuit board 10 so that the first opposing wall 28a and the wall portion 35 are in contact with each other. For example, the first opposing wall 28a is used. Even when the connector 20 and the shield case 30 are mounted on the circuit board 10 so that the second opposing wall 28b positioned on the resin case 26 side is in contact with the wall portion 35, the same effect can be obtained. Can do.

なお前記各実施形態では、空間部S1(前記閉塞空間)に集積回路11が配置されてなる例について説明したが、例えば集積回路11に代えて他の電子部品(例えばトランジスタ)を前記閉塞空間内に配置することも可能である。   In each of the embodiments, the example in which the integrated circuit 11 is arranged in the space portion S1 (the closed space) has been described. However, for example, another electronic component (for example, a transistor) is replaced in the closed space instead of the integrated circuit 11. It is also possible to arrange them.

本発明の第1実施形態による電子回路装置の斜視図である。1 is a perspective view of an electronic circuit device according to a first embodiment of the present invention. 同実施形態による電子回路装置の断面図である。It is sectional drawing of the electronic circuit device by the same embodiment. 図1のA−A断面図である。It is AA sectional drawing of FIG. 同実施形態による回路基板を取り除いた状態のコネクタとシールド部材の要部背面図である。It is a principal part rear view of a connector and a shield member in the state where the circuit board by the embodiment was removed. 本発明の第2実施形態による電子回路装置の断面図である。It is sectional drawing of the electronic circuit apparatus by 2nd Embodiment of this invention. 同第2実施形態による回路基板を取り除いた状態のコネクタとシールド部材の要部背面図である。It is a principal part rear view of the connector and shield member of the state which removed the circuit board by the 2nd embodiment.

符号の説明Explanation of symbols

10 回路基板
11 集積回路
20 コネクタ
22 基部
22b 底部
22c フランジ部(突起部)
22d 外周壁
26 樹脂ケース
28 窪み部
28a 第1の対向壁
28b 第2の対向壁
29 連結部
30 シールドケース(シールド部材)
33 側壁部
33a 第1の側壁部
34 切り欠き部
35 壁部
40 シールドケーブル
F 平坦部(平坦面)
S1 空間部
S2 微少クリアランス
DESCRIPTION OF SYMBOLS 10 Circuit board 11 Integrated circuit 20 Connector 22 Base 22b Bottom 22c Flange part (projection part)
22d outer peripheral wall 26 resin case 28 hollow portion 28a first opposing wall 28b second opposing wall 29 connecting portion 30 shield case (shield member)
33 Side wall portion 33a First side wall portion 34 Notch portion 35 Wall portion 40 Shielded cable F Flat portion (flat surface)
S1 space S2 micro clearance

Claims (2)

第1の空洞部を有する導電性材料からなる基部と前記第1の空洞部に連通する第2の空洞部を有する導電性材料からなる円筒部とが一体形成されたコネクタ及び電子部品が配設された回路基板と、
前記基部の一部及び前記円筒部を外部に露出させるように形成された切り欠き部を有し、前記基部の一部を除いた前記基部の他の箇所及び前記電子部品を包囲するように前記回路基板に配設される導電性材料からなるシールド部材とを備えた電子回路装置において、
前記コネクタには前記基部と離間するように前記第1の空洞部に位置するとともに前記円筒部と離間するように前記第2の空洞部に位置する接続端子と、前記接続端子を挿通させる挿通孔を有するとともに前記第1の空洞部と前記第2の空洞部とを跨いだ状態で前記第1、第2の空洞部に充填される絶縁体とが設けられ、
前記基部に形成される導電性材料からなる突起部と、前記切り欠き部の周囲に形成される前記シールド部材の壁部とが当接するように、前記コネクタ及び前記シールド部材を前記回路基板に配設する構成としたことを特徴とする電子回路装置。
First second connector and the cylindrical portion are integrally formed of electrically conductive material having a cavity and the electronic component is disposed in communication with the base and the first cavity portion made of a conductive material having a hollow portion A circuit board,
A notch portion formed so as to expose a part of the base portion and the cylindrical portion to the outside, the other portion of the base portion excluding a part of the base portion and the electronic component so as to be surrounded In an electronic circuit device comprising a shield member made of a conductive material disposed on a circuit board,
The connector has a connection terminal located in the first cavity portion so as to be separated from the base portion and located in the second cavity portion so as to be separated from the cylindrical portion, and an insertion hole through which the connection terminal is inserted. And an insulator that fills the first and second cavities in a state of straddling the first cavity and the second cavity ,
The connector and the shield member are arranged on the circuit board so that a protrusion made of a conductive material formed on the base and a wall of the shield member formed around the notch are in contact with each other. An electronic circuit device characterized in that it is configured to be installed
第1の空洞部を有する導電性材料からなる基部と前記第1の空洞部に連通する第2の空洞部を有する導電性材料からなる円筒部とが一体形成されたコネクタ及び電子部品が配設された回路基板と、
前記基部の一部及び前記円筒部を外部に露出させるように形成された切り欠き部を有し、前記基部の一部を除いた前記基部の他の箇所及び前記電子部品を包囲するように前記回路基板に配設される導電性材料からなるシールド部材とを備えた電子回路装置において、
前記コネクタには前記基部と離間するように前記第1の空洞部に位置するとともに前記円筒部と離間するように前記第2の空洞部に位置する接続端子と、前記接続端子を挿通させる挿通孔を有するとともに前記第1の空洞部と前記第2の空洞部とを跨いだ状態で前記第1、第2の空洞部に充填される絶縁体とが設けられ、
前記基部には前記切り欠き部の周囲に形成される前記シールド部材の壁部を介在させるような窪み部が設けられ、
前記窪み部は、前記壁部を挟んで対向する一対の対向壁を備えてなるとともに、前記一対の対向壁のうちどちらか一方の対向壁と前記壁部とが当接するように、前記コネクタ及び前記シールド部材を前記回路基板に配設する構成としたことを特徴とする電子回路装置。
First second connector and the cylindrical portion are integrally formed of electrically conductive material having a cavity and the electronic component is disposed in communication with the base and the first cavity portion made of a conductive material having a hollow portion A circuit board,
A notch portion formed so as to expose a part of the base portion and the cylindrical portion to the outside, the other portion of the base portion excluding a part of the base portion and the electronic component so as to be surrounded In an electronic circuit device comprising a shield member made of a conductive material disposed on a circuit board,
The connector has a connection terminal located in the first cavity portion so as to be separated from the base portion and located in the second cavity portion so as to be separated from the cylindrical portion, and an insertion hole through which the connection terminal is inserted. And an insulator that fills the first and second cavities in a state of straddling the first cavity and the second cavity ,
The base is provided with a recess that interposes the wall of the shield member formed around the notch,
The hollow portion includes a pair of opposing walls that are opposed to each other with the wall portion interposed therebetween, and the connector and the one of the pair of opposing walls and the wall portion are in contact with each other. An electronic circuit device characterized in that the shield member is arranged on the circuit board.
JP2008047424A 2008-02-28 2008-02-28 Electronic circuit equipment Expired - Fee Related JP5257653B2 (en)

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