JP5259582B2 - イオン注入のための注入量閉ループ制御 - Google Patents
イオン注入のための注入量閉ループ制御 Download PDFInfo
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- JP5259582B2 JP5259582B2 JP2009513301A JP2009513301A JP5259582B2 JP 5259582 B2 JP5259582 B2 JP 5259582B2 JP 2009513301 A JP2009513301 A JP 2009513301A JP 2009513301 A JP2009513301 A JP 2009513301A JP 5259582 B2 JP5259582 B2 JP 5259582B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
- H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
- H01J2237/24535—Beam current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31703—Dosimetry
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
Description
本発明は一般にイオン注入システムに関し、とりわけ注入量の調節および制御のためのシステムおよび方法に関する。
半導体装置の製造において、イオン注入は不純物またはドーパントを半導体にドーピングすることに利用されている。集積回路の製造過程で、n型またはp型の不純物(extrinsic material)のドーピングを行うために、またはパッシベーション層を形成するために、イオンビームでシリコンウェハを処理することにイオンビーム注入装置が利用されている。半導体にドーピングする際、イオン注入装置は所望の不純物を生産するために、選択されたイオン種を注入する。アンチモン、ヒ素またはリンのようなソース物質から発生するイオンの注入は、n型の不純物ウェハを生じる。ここで、p型の不純物ウェハを所望する場合は、ボロン、ガリウム、またはインジウムのようなソース物質から生成されるイオンが注入される。
本発明のいくつかの態様の基本的な理解のために、本発明の簡単な概要を以下に示す。この概要は、本発明の広い外観ではなく、本発明の鍵または決定的な要素を確認することを意図するものでも、発明の範囲を決めることを意図するものでもない。むしろ、この概要の目的は、後に示すより詳細な説明の前置きとして、簡単な形式で本発明のいくつかの概念を示すものである。
図1は、本発明の一つまたは複数の態様を実行するのに好適な典型的なイオン注入装置を示す平面図である。
本発明を図面を参照しながら詳述する。ここで、全体を通して類似の要素には同じ参照符号を付している。また、描かれた構造は必ずしも正確な縮尺にはなっていない。
Claims (2)
- イオン注入システムの動作の調節方法であって、
上記イオン注入システムに配置されている筐体、ハウジング、または、電極にイオンビームを通過させることで発生する電流を測定することにより電流測定値を取得する工程と、
1つまたは複数のスケール因子によって1つまたは複数の上記電流測定値をスケール補正する工程と、
上記1つまたは複数のスケール補正された電流測定値をフィルタリングする工程と、
上記フィルタリングされた電流測定値を結合し、ターミナルリターン電流を取得する工程と、
上記ターミナルリターン電流に応じて注入量を調節する工程とを含むことを特徴とする調節方法。 - 上記注入量を調節する工程は、スロースキャンスピードを調節する工程を含むことを特徴とする請求項1に記載の調節方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US81043006P | 2006-06-02 | 2006-06-02 | |
| US60/810,430 | 2006-06-02 | ||
| PCT/US2007/012966 WO2007143110A2 (en) | 2006-06-02 | 2007-06-01 | Dose close loop control for ion implantation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010506347A JP2010506347A (ja) | 2010-02-25 |
| JP5259582B2 true JP5259582B2 (ja) | 2013-08-07 |
Family
ID=38626898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009513301A Active JP5259582B2 (ja) | 2006-06-02 | 2007-06-01 | イオン注入のための注入量閉ループ制御 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7557363B2 (ja) |
| EP (1) | EP2030220A2 (ja) |
| JP (1) | JP5259582B2 (ja) |
| KR (1) | KR101354626B1 (ja) |
| CN (1) | CN101461027B (ja) |
| TW (1) | TWI404109B (ja) |
| WO (1) | WO2007143110A2 (ja) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7994488B2 (en) * | 2008-04-24 | 2011-08-09 | Axcelis Technologies, Inc. | Low contamination, low energy beamline architecture for high current ion implantation |
| US8124487B2 (en) * | 2008-12-22 | 2012-02-28 | Varian Semiconductor Equipment Associates, Inc. | Method for enhancing tensile stress and source/drain activation using Si:C |
| US8604418B2 (en) * | 2010-04-06 | 2013-12-10 | Axcelis Technologies, Inc. | In-vacuum beam defining aperture cleaning for particle reduction |
| US20130001414A1 (en) * | 2011-07-01 | 2013-01-03 | Varian Semiconductor Equipment Associates, Inc. | System and method for producing a mass analyzed ion beam for high throughput operation |
| TWI600046B (zh) * | 2012-11-13 | 2017-09-21 | Sumitomo Heavy Industries Ion Technology Co Ltd | Ion implantation apparatus and ion implantation method |
| JP6086845B2 (ja) * | 2013-08-29 | 2017-03-01 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置及びイオン注入方法 |
| US9267982B2 (en) | 2013-02-11 | 2016-02-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Processing apparatus and ion implantation apparatus |
| US11646175B2 (en) * | 2019-02-15 | 2023-05-09 | Axcelis Technologies, Inc. | Method of mixing upstream and downstream current measurements for inference of the beam current at the bend of an optical element for realtime dose control |
| CN111769027B (zh) * | 2019-04-02 | 2024-07-30 | 北京中科信电子装备有限公司 | 一种束流竖直方向角度的测量装置及方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4539217A (en) * | 1984-06-27 | 1985-09-03 | Eaton Corporation | Dose control method |
| US4587433A (en) * | 1984-06-27 | 1986-05-06 | Eaton Corporation | Dose control apparatus |
| JPS6139356A (ja) * | 1984-07-30 | 1986-02-25 | Hitachi Ltd | イオン打込装置 |
| JPH07118292B2 (ja) | 1984-11-09 | 1995-12-18 | 東京エレクトロン株式会社 | イオン注入装置のイオン電流検出方法 |
| JPH0740481B2 (ja) * | 1986-01-31 | 1995-05-01 | 株式会社日立製作所 | イオン打込制御方法 |
| US4922106A (en) * | 1986-04-09 | 1990-05-01 | Varian Associates, Inc. | Ion beam scanning method and apparatus |
| JPH11283552A (ja) * | 1998-03-31 | 1999-10-15 | Tadamoto Tamai | イオン注入装置、イオン注入方法、イオンビーム源、及び可変スリット機構 |
| US5998798A (en) * | 1998-06-11 | 1999-12-07 | Eaton Corporation | Ion dosage measurement apparatus for an ion beam implanter and method |
| GB2339069B (en) * | 1998-07-01 | 2003-03-26 | Applied Materials Inc | Ion implantation beam monitor |
| US6020592A (en) * | 1998-08-03 | 2000-02-01 | Varian Semiconductor Equipment Associates, Inc. | Dose monitor for plasma doping system |
| US6657209B2 (en) * | 2000-09-20 | 2003-12-02 | Axcelis Technologies, Inc. | Method and system for determining pressure compensation factors in an ion implanter |
| JP4071494B2 (ja) * | 2001-12-28 | 2008-04-02 | 松下電器産業株式会社 | イオン照射装置 |
| US6908836B2 (en) * | 2002-09-23 | 2005-06-21 | Applied Materials, Inc. | Method of implanting a substrate and an ion implanter for performing the method |
| JP2005005098A (ja) * | 2003-06-11 | 2005-01-06 | Sumitomo Eaton Noba Kk | イオン注入装置及びその制御方法 |
| US6992308B2 (en) * | 2004-02-27 | 2006-01-31 | Axcelis Technologies, Inc. | Modulating ion beam current |
| US6870170B1 (en) * | 2004-03-04 | 2005-03-22 | Applied Materials, Inc. | Ion implant dose control |
| US7102146B2 (en) * | 2004-06-03 | 2006-09-05 | Axcelis Technologies, Inc. | Dose cup located near bend in final energy filter of serial implanter for closed loop dose control |
| US7365346B2 (en) * | 2004-12-29 | 2008-04-29 | Matsushita Electric Industrial Co., Ltd. | Ion-implanting apparatus, ion-implanting method, and device manufactured thereby |
-
2006
- 2006-10-04 US US11/543,346 patent/US7557363B2/en active Active
-
2007
- 2007-06-01 CN CN2007800205118A patent/CN101461027B/zh active Active
- 2007-06-01 KR KR1020087031530A patent/KR101354626B1/ko not_active Expired - Fee Related
- 2007-06-01 EP EP07795613A patent/EP2030220A2/en not_active Withdrawn
- 2007-06-01 TW TW096119874A patent/TWI404109B/zh active
- 2007-06-01 WO PCT/US2007/012966 patent/WO2007143110A2/en not_active Ceased
- 2007-06-01 JP JP2009513301A patent/JP5259582B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010506347A (ja) | 2010-02-25 |
| CN101461027B (zh) | 2012-12-05 |
| TWI404109B (zh) | 2013-08-01 |
| CN101461027A (zh) | 2009-06-17 |
| WO2007143110A3 (en) | 2008-04-03 |
| TW200814126A (en) | 2008-03-16 |
| US7557363B2 (en) | 2009-07-07 |
| US20070278427A1 (en) | 2007-12-06 |
| KR20090016028A (ko) | 2009-02-12 |
| KR101354626B1 (ko) | 2014-01-22 |
| EP2030220A2 (en) | 2009-03-04 |
| WO2007143110A2 (en) | 2007-12-13 |
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