JP5260435B2 - Electronic component mounting method and electronic component mounting apparatus - Google Patents

Abstract

The present invention provides a mounting method of an electronic component and a mounting device thereof. In the mounting method of electronic component, the electronic component which is held by a holding component that is equipped on a rotatable mounting head is shot through a component identification camera; an identification label which is adhibited on a printed circuit board through a circuit board identification camera; and the electronic component is mounted on the printed circuit board based on a result obtained after performing identification processing to the two shot images. Before the manufacturing operation of the printed circuit board, an offset value relatively to a rotation center of a mounting head in design is calculated beforehand and stored. Before the manufacturing operation of the printed circuit board, the offset value of the circuit board identification camera is calculated and stored. After the manufacturing operation of the printed circuit board, a rotation center of the mounting head is calculated and a deviation value to the offset value is stored; and after the manufacturing operation of the printed circuit board, the deviation value to the offset value of the circuit board identification camera is stored.

Description

  According to the present invention, an electronic component held by a holding means provided on a rotatable mounting head is imaged by a component recognition camera, and a recognition mark attached to a printed circuit board is imaged by a board recognition camera. The present invention relates to an electronic component mounting method and an electronic component mounting apparatus for mounting an electronic component on a printed circuit board based on a result of recognition processing of an image.

  An electronic component mounting method for performing this type of component recognition processing is disclosed in, for example, Japanese Patent Application Laid-Open No. H10-228707. Based on the recognition processing result of the electronic component, the electronic component is mounted on the printed circuit board with high accuracy.

JP 2005-159209 A

  However, as the temperature of the electronic component mounting apparatus rises as a result of continuing the mounting operation of the electronic component mounting apparatus, the positional relationship of the mounting head and the like is shifted. For this reason, an offset value (fixed value) that is a deviation from a preset position (design position) of the center of rotation of the head based on a teaching result performed at the time of adjustment of the electronic component mounting apparatus causes the apparatus temperature to change. It cannot be supported and the mounting accuracy of electronic components is not stable.

  Accordingly, an object of the present invention is to improve the mounting accuracy of electronic components in response to changing device temperatures.

For this reason, according to the first aspect of the present invention, the electronic component held by the holding means provided in the rotatable mounting head is imaged by the component recognition camera, and the recognition mark attached to the printed circuit board is provided on the mounting head. In the mounting method of the electronic component, the image is picked up by the recognition camera, and the mounting head is moved based on the result of the recognition processing of both the captured images, and the electronic component is mounted on the printed circuit board.
Before starting the production operation of the printed circuit board, a first offset value with respect to the rotation center of the mounting head on the design of the rotation center of the mounting head obtained by imaging the mounting head with the component recognition camera is obtained and stored. And
Before starting the production operation of the printed circuit board , the device recognition mark is imaged by the substrate recognition camera to obtain and store a second offset value of the substrate recognition camera,
After starting the production operation of the printed circuit board, the mounting head is imaged with the component recognition camera to determine the rotation center of the mounting head, and the amount of deviation from the first offset value is stored.
After starting the production operation of the printed board, the device reference mark is imaged by the board recognition camera to obtain an offset value of the board recognition camera, and a deviation amount from the second offset value is stored.
Based on the amount of deviation from the stored first offset value and the amount of deviation from the second offset value, the amount of deviation of the rotation center of the mounting head based on the optical axis of the substrate recognition camera is obtained. Based on the amount of deviation, the result of subsequent recognition processing of the electronic component is corrected and mounted on the printed circuit board.

  According to the present invention, it is possible to improve the mounting accuracy of an electronic component in response to a changing device temperature.

It is a schematic plan view of an electronic component mounting apparatus. It is a schematic longitudinal cross-sectional view of an illuminating device. It is a top view of an illuminating device. It is AA sectional drawing of FIG. It is a control block diagram. It is a flowchart figure which concerns on the teaching of the rotation center of the mounting head 6 performed before the production start of a printed circuit board. It is a flowchart figure concerning the teaching of the position of the apparatus reference mark performed before the production start of a printed circuit board. It is a figure which shows the flowchart which concerns on temperature compensation teaching. It is a figure which shows the flowchart which concerns on the timing of temperature compensation teaching. It is explanatory drawing of temperature compensation teaching.

  Hereinafter, an embodiment of an electronic component mounting apparatus 1 for mounting electronic components on a printed circuit board P will be described with reference to FIG. The electronic component mounting apparatus 1 includes a transport device 2 that transports the printed circuit board P, a component supply device 3 that supplies electronic components, and a pair of beams 4A that can be moved in one direction (Y direction) by a Y-axis motor 42. 4B, and a mounting head 6 that is provided with suction nozzles 5 and that can be moved and rotated by an X-axis motor 43 in a direction (X direction) along each of the beams 4A and 4B.

  That is, the mounting head 6 disposed on the beams 4A and 4B is called a high-speed mounting head, and the mounting head 6 is, for example, 12 holding means that are biased downward by respective springs. The suction nozzles 5 are arranged on the circumference with a predetermined interval.

  The suction nozzle 5 can be moved up and down by being driven by a vertical axis motor 46 via a drive circuit 45, and the mounting head 6 is moved around a vertical axis by being driven by a θ axis motor 48 via a drive circuit 47. By rotating, as a result, each suction nozzle 5 of each mounting head 6 can move in the X direction and the Y direction, can rotate around the vertical line, and can move up and down.

  The transport device 2 is disposed at an intermediate portion before and after the electronic component mounting device 1, and includes a substrate supply unit that inherits the printed circuit board P from an upstream device (located on the left side in FIG. 1), and the mounting heads 6. The board positioning unit for positioning and fixing the printed circuit board P supplied from the board supply unit in order to mount the electronic component sucked and held by the suction nozzle 5, and the printed circuit board P on which the electronic component is mounted by the positioning unit are inherited. And a substrate discharging unit that is transported to a downstream device (located on the right side in FIG. 1).

  The component supply device 3 is disposed on both the front side and the rear side of the transport device 2, and is provided with a feeder base 3A that is attached to the device main body of the electronic component mounting device 1, and a plurality of components on the feeder base 3A. And a component supply unit 3B group for supplying various electronic components one by one to the component suction / extraction position.

  Then, the pair of front and rear beams 4A and 4B which are long in the X direction slides on the sliders fixed to the beams 4A and 4B along guides extending in the pair of left and right by driving the Y-axis motor 42. Move in the Y direction individually. The Y-axis motor 42 includes a pair of upper and lower stators fixed along a pair of left and right bases 1A and 1B, and a mover 42A fixed to lower portions of mounting plates provided at both ends of the beams 4A and 4B. It is comprised from the linear motor which consists of.

  The beams 4A and 4B are respectively provided with the mounting heads 6 that move along the guides in the longitudinal direction (X direction) by the X-axis motor 43, and the X-axis motor 43 is provided with each beam 4A. 4B is composed of a linear motor including a pair of front and rear stators fixed to 4B and a mover provided on the mounting head 6 between the stators.

  Accordingly, the mounting heads 6 are provided inside the beams 4A and 4B so as to face each other, and move above the printed circuit board P on the positioning unit of the transport device 2 and the component suction and extraction positions of the component supply unit 3B.

  In addition, each mounting head 6 is provided with a board recognition camera 8 and images a positioning mark attached to the printed board P being positioned. Based on the position of the positioning mark imaged by the board recognition camera 8, the reference position of the printed board is grasped, and the mounting position indicated by the electronic component mounting data is grasped. The substrate recognition camera 8 is disposed at the front of the mounting head 6 so that the rotation center of the mounting head 6 and the center of the substrate recognition camera 8 coincide with each other in the Y-axis direction. You may set up. Reference numeral 10 denotes an illumination unit provided in the electronic component mounting apparatus 1 for irradiating illumination light to the electronic components sucked and held by the suction nozzles 5.

  Next, the lighting unit 10 will be described in detail with reference to FIGS. The device main body 11 of the illumination unit 10 has a rectangular parallelepiped outer shape, and has a through hole 12 that has a circular shape in plan view at the center and a diameter that decreases as it goes downward. Further, when the electronic component D sucked and held by the suction nozzle 5 is a BGA (Ball Grid Array), illumination is performed on the upper part of the inner peripheral surface of the through-hole 12 while being inclined toward the component. BGA lighting LEDs (Light Emitting Diodes) 15 that are a plurality of BGA reflecting illuminating lamps that irradiate light are arranged in parallel across a plurality of rows, for example, four rows along the entire circumference of the inner peripheral surface. . That is, an annular printed board 14A is attached to the uppermost mounting part 13A having an L-shaped cross section so as to be closer to the center as it goes downward, and a horizontal row of rows is mounted on the printed board 14A. A plurality of BGA illumination LEDs 15 are arranged in parallel at predetermined intervals over a plurality of rows, for example, four rows in the horizontal direction (horizontal direction) (four rows in the vertical direction).

  An attachment portion 13B having a diameter smaller than that of the attachment portion 13A is formed below the uppermost attachment portion 13A. The attachment portion 13B is closer to the center as it goes downward and than the printed board 14A. An annular printed circuit board 14B is attached in a state inclined at an angle of about 15 degrees, and a plurality of horizontal rows, for example, three rows in the horizontal direction (horizontal direction) (3 in the vertical direction) are mounted on the printed circuit board 14B. A plurality of general reflection illumination LEDs 16, which are general reflection illumination lamps, are arranged in parallel at predetermined intervals.

  A mounting portion 13C having a smaller diameter than the mounting portion 13B is formed below the mounting portion 13B. The mounting portion 13C is closer to the center as it goes downward and is 15 degrees from the printed board 14B. An annular printed circuit board 14C is attached in a state of being inclined at an angle that is laid down to a certain degree, and a plurality of rows in the horizontal direction, for example, three rows in the horizontal direction (horizontal direction) (three rows in the vertical direction) are mounted on this printed circuit board 14C A plurality of general reflection illumination LEDs 16 are arranged in parallel at predetermined intervals.

  Further, an attachment portion 13D having a smaller diameter than the attachment portion 13C is formed below the attachment portion 13C. The attachment portion 13D is closer to the center as it goes downward and is 15 degrees from the printed board 14C. An annular printed circuit board 14D is attached in a state of being inclined to a certain level, and a plurality of horizontal rows, for example, three rows in the horizontal direction (horizontal direction) (three rows in the vertical direction) are mounted on the printed circuit board 14C. A plurality of general reflection illumination LEDs 16 are arranged in parallel at predetermined intervals.

  Reference numeral 17 denotes a transmission illumination LED mounted on a printed circuit board 14E disposed in each of mounting spaces formed in four corners of the apparatus main body 11 which has a rectangular parallelepiped shape outside the BGA illumination LED 15. 11 irradiates light toward the diffusion plate fixed to the suction nozzle 5 through the openings 18 formed on the top surface 11A of the eleventh surface, and the reflected light is applied to the electronic component D held by the suction nozzle 5 by suction. It is the structure irradiated from above.

  A component recognition camera 20 is disposed below the central portion of the illumination unit 10, and a lens 21, a half mirror 22, and a lens 23 are disposed above the component recognition camera 20, and the lens 23 is used for illumination. It arrange | positions so that the through-hole 12 of the apparatus main body 11 of the unit 10 may be faced. The light emitted from the coaxial illumination LED 25 attached to the printed circuit board 14F is transmitted through the half mirror 22 and half of the light is reflected and rises. The suction nozzle 5 passes through the lens 23 and rises. In this configuration, the electronic component D held by suction is irradiated and the reflected image is captured by the component recognition camera 20 via the lens 21, the half mirror 22, and the lens 23.

  Reference numerals 26 and 26 denote apparatus reference members of the electronic component mounting apparatus 1 formed by depositing a black paint on the glass plate except for the transparent apparatus reference mark 27, and are respectively disposed before and after the illumination apparatus 10. . Then, the light of one of the reference mark illumination LEDs 28 is irradiated to the corresponding apparatus reference member 26 from below, and a transmission image of the apparatus reference mark 27 is captured by the substrate recognition camera 8. Then, any of the front and rear component recognition cameras 20 can image the electronic component sucked and held by the suction nozzle 5 of the mounting head 6 provided on any of the front and rear beams 4A and 4B, and the device reference mark of the device reference member 26 on the back side. 27 is a configuration in which the substrate recognition camera 8 provided on the front beam 4B takes an image, and the apparatus reference mark 27 of the device reference member 26 on the front side is imaged by the substrate recognition camera 8 provided on the back beam 4A. is there.

  Therefore, as will be described later, the illumination unit 10 irradiates the electronic component sucked and held by the suction nozzle 5 of each mounting head 6 with the illumination light, picks up an image with each component recognition camera 20, is recognized, and is sucked. The positional deviation with respect to the rotation center of the nozzle 5 is grasped.

  Next, a description will be given below based on FIG. 5 which is a control block diagram related to imaging control of an electronic component. First, reference numeral 30 denotes a control microcomputer (hereinafter referred to as “control microcomputer”) as a control device that performs overall control of operations related to component mounting operation for mounting electronic components on the printed circuit board P in the electronic component mounting apparatus 1. , A CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and a program stored in the ROM based on data stored in the RAM. The operation related to component mounting is controlled according to the above. In the RAM, productivity is improved based on NC data (mounting data) indicating mounting coordinates of electronic components on the printed circuit board P for each mounting order, component library data that is a feature of electronic components, and the NC data. For this reason, optimization data and the like, which are mounting order data optimized for this purpose, are stored.

  Reference numeral 31 denotes an operator's operation microcomputer (hereinafter referred to as “operation microcomputer”), which includes a CPU, a ROM, and a RAM, and stores the above-described NC data, component library data, optimization data, and the like. The operation microcomputer 31 is connected to an operation monitor 32 and an input device 33 such as a touch panel switch, a keyboard, and a mouse displayed on the monitor 32.

  Reference numeral 35 denotes an image processing microcomputer (hereinafter referred to as “image processing microcomputer”) as an image processing apparatus, which includes a CPU, a ROM, and a RAM, and the above-described component library data and the board recognition camera 8 for capturing an image. Position data (position data of the substrate recognition camera 8 that determines the image capture timing) and the like are stored.

  The control microcomputer 30, the operation microcomputer 31, and the image processing microcomputer 35 do not necessarily have to be separate ones, and one or two microcomputers are used to control the control microcomputer 30, the operation microcomputer 31, and the image processing microcomputer 35. You may make it fulfill a function.

  The control microcomputer 30, the operation microcomputer 31 and the image processing microcomputer 35 are connected via a LAN line 36 and a hub 37. The control microcomputer 30 is connected to an X-axis servo amplifier 38 for the X-axis motor 43 and a Y-axis servo amplifier 39 for the Y-axis motor 42.

  Reference numeral 40 denotes a position monitoring circuit provided with a storage means. A pulse signal corresponding to the moving distance is input from the driven X-axis motor 43 and Y-axis motor 42 (both having an encoder function) to drive the substrate recognition camera 8. Is coincident with the position data (position data of the board recognition camera 8 when the image is captured and stored in the image processing microcomputer 35), a position coincidence signal is issued to the image capture circuit 41. The image capture circuit 41 that has received the position coincidence signal outputs the image capture signal to the board recognition camera 8 and the component recognition camera 20 for exposure, and one reference mark illumination LED 28 and various illumination LEDs of the illumination unit 10 are exposed. It is lit in a predetermined pattern, and images of the installation reference mark 27 and the mounting head 6 (electronic component) are captured (taken).

  Then, as will be described later, the image data of the images captured by the board recognition camera 8 and the component recognition camera 20 is sent to the image processing microcomputer 35 via the image capture circuit 41, subjected to recognition processing, and positioned with respect to the suction nozzle 5. The gap will be grasped.

  Here, teaching (pre-teaching) of the center of rotation of the mounting head 6 performed at the time of adjustment before starting the production of the printed circuit board in the printed circuit board production factory of the electronic component mounting apparatus 1 or in the manufacturing factory of the electronic component mounting apparatus 1 Hereinafter, a description will be given with reference to FIGS. First, the work manager adjusts the optical axis of the component recognition camera 20 and the optical axis of the board recognition camera 8 to coincide. That is, the reference position (origin position) in the X and Y directions of both optical axes is matched by correcting the amount of deviation from the design value of the optical axis of the component recognition camera 20 with respect to the optical axis of the board recognition camera 8.

  Next, the work manager operates the input device 33 to move the mounting head 6 so that the designed rotation center of the mounting head 6 matches the center of the component recognition camera 20. Therefore, the position of the mounting head 6 is fixed at a position where the designed rotation center (design value) of the mounting head 6 coincides with the center of the component recognition camera 20 (the mounting head 6 is stopped).

  At a position where the mounting head 6 is fixed, the work manager operates the input device 33 to drive the θ-axis motor 48 via the drive circuit 47, whereby the glass jig with the recognition mark is attached. After rotating the mounting head 6 in a state where the plurality of suction nozzles 5 are sucked by a predetermined angle, the component recognition camera 20 repeats capturing the recognition mark of the glass jig a plurality of times, and these captured images are displayed. The image processing microcomputer 35 performs recognition processing, and based on the recognition processing result, the control microcomputer 30 obtains the rotation center (pre-teaching) of the mounting head 6 and stores it in its storage means.

  The obtained rotation center of the mounting head 6 stored is the amount of shift in the X and Y directions in the horizontal plane from the design rotation center of the mounting head 6 (offset value of the rotation center of the mounting head 6).

  On the other hand, teaching of the position of the apparatus reference mark 27, which is also performed at the time of adjustment before starting production of the printed circuit board, will be described below with reference to FIGS. First, based on the screen displayed on the operation monitor 32, the work manager adjusts so that the actual rotation center of the mounting head 6 and the center of the component recognition camera 20 coincide with each other. That is, based on the operation of the input device 33, the operation microcomputer 31 controls the X-axis motor 43 and the Y-axis motor 42 via the control microcomputer 30, and is obtained on the center of the component recognition camera 20 by the operation of FIG. After the mounting head 6 is moved so that the actual center of rotation of the mounting head 6 comes, it is adjusted to make the actual center of rotation of the mounting head 6 coincide with the center of the component recognition camera 20.

  In a state where the actual center of rotation of the mounting head 6 and the center of the component recognition camera 20 coincide with each other, the board recognition camera 8 images the device reference mark 27 provided on the device reference member 26, and the imaged device reference. The image processing microcomputer 35 recognizes the mark 27, and based on the recognition processing result, the control microcomputer 30 obtains the position of the apparatus reference mark 27 on the imaging screen of the board recognition camera 8 as the origin, and the self Stored in the storage means.

  The position (pre-teaching) of the apparatus reference mark 27 as a result of this recognition processing is the amount of deviation from the center of the board recognition camera 8, that is, the position deviation amount of the board recognition camera 8 with reference to the apparatus reference mark 27. Offset value.

  The mounting operation of the electronic component on the printed circuit board P after the above teaching is performed at the time of adjustment before starting the production of the printed circuit board P will be described. First, the control microcomputer 30 reads and acquires NC data (mounting data), optimization data, and the like necessary for the production operation of the printed circuit board P stored in the RAM. Then, the production operation is started, and when the printed circuit board P is inherited from the upstream device (not shown) and exists on the substrate supply unit of the transport device 2, the printed circuit board P on the substrate supply unit is transferred to the substrate positioning unit. The printed circuit board P is positioned and fixed.

  When the printed circuit board P is positioned, according to the NC data (mounting data), for example, the back beam 4A is moved in the Y direction by driving the Y-axis motor 42, and the mounting head 6 is moved to the X direction by the X-axis motor 43. The component supply unit 3B that supplies the electronic component of step number 0001 of the NC data is moved to above the component take-out position of the component supply unit 3B, and the suction nozzle 5 is lowered by driving the vertical axis motor to move the electronic component from the component supply unit 3B. Take out. In this case, the mounting head 6 is moved in the X direction and rotated, and each suction nozzle 5 is moved up and down, so that the plurality of suction nozzles 5 can take out up to 12 electronic components from the component supply unit 3B one after another. it can.

  Further, after or after taking out the electronic component by the suction nozzle 5 of the mounting head 6 on the back side, the front side beam 4B is moved in the Y direction by driving the Y axis motor 42 and the X axis motor 43 is driven. As a result, the mounting head 6 on the front side moves in the X direction, moves up to the upper position of the corresponding component supply unit 3B, lowers the suction nozzle 5 by driving the vertical axis motor, and removes electronic components from the component supply unit 3B. Can be taken out.

  And after taking out, the suction nozzle 5 of both the mounting heads 6 is raised, and the image capture by the component recognition camera 20 is started. In this case, the control microcomputer 30 creates optimized data that is mounting order data optimized for improving productivity based on the NC data.

  In this case, in the case of fly imaging in which the suction nozzle 5 that holds and holds the electronic component to be imaged is moving, the control microcomputer 30 determines the position of the mounting head 6 to be imaged in the X direction of the component recognition camera 20. In order to match the position in the direction, the X-axis motor 43 is controlled via the X-axis servo amplifier 38 to move the mounting head 6 in the X direction, and the center of rotation of the mounting head 6 and the center of the component recognition camera 20 are detected. Are arranged on the same Y axis.

  After this arrangement, the control microcomputer 30 outputs a command related to image capture to the image processing microcomputer 35. Then, although fly imaging recognition is performed, the component recognition camera 20 and the beam 4A or 4B are designated, and the position of the designated beam 4A or 4B in the mounting head 6 in the Y direction is monitored.

  That is, the mounting head 6 on the back side or the mounting head 6 on the near side passes above the component recognition camera 20 on the back side or the near side by driving the Y-axis motor 42 of the beam 4A or 4B. Since the position in the Y direction of the board recognition camera 8 on the back side or the near side matches the position in the Y direction of the mounting head 6 on the back side or the near side, the position monitoring circuit 40 has moved from the Y-axis motor 42. When a pulse signal representing a distance is input and coincides with the position data of the board recognition camera 8 (position data in which the offset value of the board recognition camera 8 at the time of adjustment is added to the set position of the board recognition camera 8), image capture is performed. The image capture circuit 41 issues a position coincidence signal, and the image capture circuit 41 that receives this position coincidence signal outputs the image capture signal to the board recognition camera 8 and the component recognition camera 20 for exposure. At the same time to turn on the one reference mark illumination LED28 and various lighting LED of the lighting unit 10.

  In this case, in the illumination unit 10, one of the reference mark illumination LEDs 28 is turned on, and at the same time, the BGA illumination LED 15, the general reflection illumination LED 16, the transmission illumination LED 17, and the coaxial illumination LED 25 are illuminated with a predetermined illumination pattern.

  Accordingly, the image of the apparatus reference mark 27 and the electronic component is simultaneously captured, and image data relating to the captured image is sent from the image capture circuit 41 to the image processing microcomputer 35 to recognize the apparatus reference mark 27 and the electronic component. Processing is performed, and the recognition processing result is sent from the image processing microcomputer 35 to the control microcomputer 30.

  In this case, since the distance between the rotation center of the mounting head 6 and the center of the substrate recognition camera 8 is determined by recognizing the position of the installation reference mark 27 and grasping the position of the installation reference mark 27, the distance is known. The position of the mounting head 6 can be grasped by taking into account the amount of deviation from the design rotation center of the mounting head 6 (the offset value of the rotation center of the mounting head 6 at the time of adjustment described above), and electronic components can be recognized. By processing, the position of the electronic component with respect to the mounting head 6 (suction nozzle 5) can be grasped as a result.

  For this reason, the control microcomputer 30 considers the position recognition result of each electronic component to the mounting coordinates of the electronic component in the NC data, and the electronic component is mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation. . That is, in the X and Y directions, the Y-axis motor 42 and the X-axis motor 43 corresponding to each beam 4A or 4B, the mounting angle by the θ-axis motor, and as a result, each suction nozzle 5 of each mounting head 6 becomes X · The Y direction and the mounting angle are corrected, and each electronic component is mounted on the printed circuit board P while the suction nozzle 5 corrects the positional deviation.

  However, as the temperature of the electronic component mounting apparatus 1 is increased by continuing the mounting operation of the electronic component mounting apparatus 1, each part of the apparatus such as the mounting head 6 and the linear scale is thermally expanded and the positional relationship of the mounting head 6 and the like is reached. Since the deviation occurs, the offset value of the rotation center of the mounting head 6 based on the teaching result performed during the adjustment before the printed circuit board production of the electronic component mounting apparatus 1 cannot cope with the changing apparatus temperature, and the electronic component The mounting accuracy of is not stable.

  Therefore, as shown in FIGS. 8 and 10, teaching for temperature compensation is automatically performed during the production operation of the printed circuit board of the electronic component mounting apparatus. First, the mounting head 6 is moved so that the center of the component recognition camera 20 and the rotation center of the mounting head 6 obtained by teaching performed at the time of adjustment before starting production of the printed circuit board are matched.

  Next, the mounting head 6 is rotated by a predetermined angle by driving the θ-axis motor 48 via the drive circuit 47, and the imaging of the suction nozzle 5 by the component recognition camera 20 is repeated a plurality of times. The image processing microcomputer 35 recognizes the captured image, and the control microcomputer 30 obtains the rotation center of the mounting head 6 based on the recognition processing result, and the rotation of the mounting head 6 obtained by the current temperature compensation teaching. A shift amount (rotation center difference Δ of the mounting head) obtained from the teaching performed at the time of adjustment before the start of production of the center is obtained and stored in its own storage means.

  Further, temperature compensation teaching is performed in a state in which the center of rotation of the mounting head 6 and the center of the component recognition camera 20 obtained by teaching performed at the time of adjustment before starting production of the printed circuit board of the electronic component 1 are matched. In other words, the substrate recognition camera 8 images the device reference mark 27 provided on the device reference member 26, the image processing microcomputer 35 recognizes the imaged device reference mark 27, and the device reference mark 27 is based on the recognition processing result. The position 27 is obtained by the control microcomputer 30 and stored in its own storage means.

  Then, the control microcomputer 30 obtains a deviation amount (apparatus reference mark position difference Δ) with respect to the position of the apparatus reference mark 27 obtained by the teaching before the start of production operation of the position of the apparatus reference mark 27 obtained by the current temperature compensation teaching. Stored in its own storage means.

  Therefore, the mounting head based on the optical axis of the substrate recognition camera 8 is controlled by the control microcomputer 30 from the amount of deviation of the center of rotation of the mounting head 6 and the amount of deviation of the position of the apparatus reference mark 27 obtained by the above temperature compensation teaching. 6 is obtained and stored in its own storage means, and the stored teaching result, which is the amount of deviation, is used for component recognition processing in the subsequent mounting of electronic components. In addition, the temperature compensation teaching is performed as necessary, and in the component recognition processing performed when the electronic component is subsequently mounted, the electronic component is based on the rotation center of the mounting head 6 obtained from the latest temperature compensation teaching result. The displacement of the mounting head 6 relative to the mounting head 6 (the positional shift relative to the mounting position) is calculated. The positional deviation of the recognition processing result with respect to the mounting head 6 is corrected, and the electronic component is mounted at a position where it should be mounted. For this reason, it is possible to improve the mounting accuracy of the electronic component appropriately corresponding to the changing device temperature.

  Next, the timing at which the above-described temperature compensation teaching is performed will be described based on the flowchart of FIG. First, when the operation start switch portion which is the touch panel switch 36 displayed on the monitor 35 is pressed by the work manager and the production operation is started, whether or not the teaching condition 1 for temperature compensation is satisfied is operated. It is determined by the microcomputer 31. In this case, the interval setting time for teaching as the teaching condition 1 is not initially set, but the operation microcomputer 31 determines that the interval setting time has been exceeded.

  Accordingly, the operation microcomputer 31 is controlled so as to execute the temperature compensation teaching described above. From the amount of deviation of the rotation center of the mounting head 6 obtained by this temperature compensation teaching and the amount of deviation of the position of the apparatus reference mark 27, the amount of deviation of the rotation center of the mounting head 6 with respect to the optical axis of the substrate recognition camera 8 Is obtained by the control microcomputer 30 and stored in its own storage means, and this teaching result is utilized for component recognition processing when the electronic component is subsequently mounted.

  Next, the operation microcomputer 31 determines whether or not the teaching condition 2 is satisfied. That is, whether or not the production operation which is the teaching condition 2 is stopped for 5 minutes or more, or whether or not the standby time for waiting for the printed circuit board P on which the electronic component is to be mounted has passed for 5 minutes or more is operated. It is determined by the microcomputer 31.

  In this case, for example, if the printed circuit board has not been stopped for 5 minutes or more or has not waited for 5 minutes or more, the operation microcomputer 31 performs control so that the setting change 2 is performed. That is, the difference between the amount of deviation of the center of rotation of the mounting head 6 obtained by the latest temperature compensation teaching and the amount of deviation of the center of rotation of the mounting head 6 obtained by the previous teaching, that is, the teaching before the start of production operation, is preset. If it is not larger than 50 μm which is a criterion, no particular action is taken. If it is larger than 50 μm, the history is cleared and the teaching interval is changed to 1 minute.

  Next, after performing control to perform this setting change 2, control is performed to perform setting change 3. That is, the displacement amount of the rotation center of the mounting head 6 obtained by the latest temperature compensation teaching and the history of the teaching, that is, the latest past, for example, five times of the temperature compensation teaching of the mounting head 6 except the latest temperature compensation teaching. When the operation microcomputer 31 determines that the difference from the average value of the deviation amount at the center of rotation is larger than 20 μm, which is a preset determination criterion, or the history is less than five times, the setting is not changed. Further, the displacement amount of the rotation center of the mounting head 6 determined by the latest temperature compensation teaching and the history of the teaching, that is, the latest past, for example, five times of the temperature compensation teaching of the mounting head 6 except the latest temperature compensation teaching. When the operation microcomputer 31 determines that the difference from the average value of the deviation amount at the center of rotation is smaller than 20 μm and larger than 10 μm, which is a preset criterion, the teaching interval is changed to 5 minutes. Leave an interval. Further, if the difference between the deviation amount of the rotation center of the mounting head 6 obtained by the latest temperature compensation teaching and the average value of the deviation amount of the rotation center of the mounting head 6 in the teaching history is smaller than 10 μm, the operation microcomputer 31 If it is determined, the teaching interval is changed to 30 minutes, and the teaching interval is further increased.

  Note that each of the above determination criteria and teaching intervals differ depending on the required mounting accuracy of the electronic component, and can be arbitrarily selected and set.

  Then, after this setting change 3 is controlled, the process returns to the beginning. In this case, the teaching interval setting time is left unset, or the teaching history is cleared and the teaching interval setting time is set to 1 minute, 5 minutes, or 30 minutes. For example, the second temperature compensation teaching is executed, and the setting changes 2 and 3 as described above are performed unless the teaching condition 2 is satisfied. When the teaching interval setting time is set to 1 minute, 5 minutes, or 30 minutes, the temperature compensation teaching is executed every time this teaching interval setting time elapses. Setting changes 2 and 3 as described above are performed.

  In this way, when the temperature compensation teaching is executed, the deviation amount of the rotation center of the mounting head 6 obtained by the latest temperature compensation teaching and the average value of the deviation amount of the rotation center of the mounting head 6 in the teaching history, And the teaching interval setting time gradually increases.

  If it is determined that the teaching condition 2 is satisfied, that is, the component mounting operation of the electronic component mounting apparatus 1 is stopped for 5 minutes or more, or the waiting time for the printed circuit board (if there is a printed circuit board, Although it can be mounted, the temperature compensation teaching as described above is executed when 5 minutes elapses (the waiting time because there is no printed circuit board).

  After this execution, the setting change 1, that is, the execution history is cleared and the teaching interval setting time is changed to 1 minute. Therefore, apart from when the difference between the deviation amount of the rotation center of the mounting head 6 obtained by the latest temperature compensation teaching and the average deviation amount of the rotation center of the mounting head 6 in the teaching history is small, The temperature compensation teaching is frequently executed, the difference is quickly reduced in a short time, and the teaching interval setting time is changed to a long time.

  As described above, according to the present invention, it is possible to improve the mounting accuracy of the electronic component by executing the temperature compensation teaching corresponding to the changing device temperature.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 3B Component supply unit 4 Beam 5 Suction nozzle 6 Mounting head 8 Substrate recognition camera 20 Component recognition camera 26 Apparatus reference member 27 Apparatus reference mark 30 Control microcomputer 31 Operation microcomputer 35 Image processing microcomputer

Claims (1)

The electronic component held by the holding means provided on the rotatable mounting head is imaged by the component recognition camera, and the recognition mark attached to the printed circuit board is imaged by the board recognition camera provided on the mounting head. In the mounting method of the electronic component that moves the mounting head based on the result of the recognition processing of both images and mounts the electronic component on the printed circuit board,
Before starting the production operation of the printed circuit board, a first offset value with respect to the rotation center of the mounting head on the design of the rotation center of the mounting head obtained by imaging the mounting head with the component recognition camera is obtained and stored. And
Before starting the production operation of the printed circuit board , the device recognition mark is imaged by the substrate recognition camera to obtain and store a second offset value of the substrate recognition camera,
After starting the production operation of the printed circuit board, the mounting head is imaged with the component recognition camera to determine the rotation center of the mounting head, and the amount of deviation from the first offset value is stored.
After starting the production operation of the printed board, the device reference mark is imaged by the board recognition camera to obtain an offset value of the board recognition camera, and a deviation amount from the second offset value is stored.
Based on the amount of deviation from the stored first offset value and the amount of deviation from the second offset value, the amount of deviation of the rotation center of the mounting head based on the optical axis of the substrate recognition camera is obtained. An electronic component mounting method comprising correcting a result of subsequent electronic component recognition processing based on the amount of deviation and mounting the electronic component on a printed circuit board.

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