JP5282702B2 - Appearance inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a visual inspection apparatus for light emitting diode chips, capable of efficiently and reliably removing defective chips than heretofore and significantly reducing a time required for occurrence of removal missing, inspection and removal as a result. <P>SOLUTION: The visual inspection apparatus is used to inspect the external appearance of a light emitting diode chip, and it includes at least a holding means to expand and hold a chip on an adhesive sheet, a defective chip detection means comprised of at least illumination and an image camera, and a defective chip removal means for removing a defective chip detected by the defective chip detection means. The holding means includes the defective chip detection means and a holding means moving means for moving a chip in parallel in either one direction of x and y directions in the xy plane between the defective chip removal means and itself. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an appearance inspection apparatus used for inspecting the appearance of a light emitting diode chip and removing a defective chip.

  When manufacturing a light-emitting diode using a semiconductor crystal such as GaP, GaAs, GaAsP, GaAlAs, or AlGaInP, the light-emitting diode chip mounted on the adhesive sheet after dicing or etching the semiconductor crystal An appearance inspection is generally performed (see, for example, Patent Document 1).

  As shown in FIG. 8, at the time of this visual inspection, the chip 21a holds a resin ring for semiconductor (for example, a grip ring or a dicing ring) having a size of 200 to 300 μm square and a diameter of about 5 inches (125 mm). They are lined up on the adhesive sheet 21b of the PVC base material stretched around the means 22. The distance between the chips is about 200 μm. The number is usually about 2 to 40,000.

Here, a chip appearance inspection apparatus and an inspection method using the same will be described with reference to the drawings. FIG. 6 is a diagram showing an example of a schematic of a conventional appearance inspection apparatus.
The appearance inspection apparatus 20 includes a holding unit 22 for expanding and holding the chip 21a on the adhesive sheet 21b, a mechanism A20a including a defective chip detecting unit 23 including an illumination 23a and an image camera 23b, and a defective chip detecting unit. The mechanism B20b including the defective chip removing means 24 for removing the defective chip detected by the head 23, the starter cassette 28a for transporting the chip from the previous process, the recovery unit cassette 28b for transporting the chip to the next process, were inspected. A temporary storage unit 28c for temporarily storing chips is provided.

A light-emitting diode chip appearance inspection method using such an appearance inspection apparatus will be briefly described.
As shown in FIG. 7, first, the adhesive sheet on which the diced light emitting diode chips are mounted is loaded from the starter cassette 28a to the mechanism A 20a (defective chip detecting means 23).
Thereafter, the adhesive sheet on which the chip is mounted is attached to the holding means 22 and expanded, and the xy coordinates and the angle θ are adjusted and aligned.

Then, as shown in FIG. 9, the chip 21a is illuminated by the illumination 23a, the state of the reflected light is observed by the image camera 23b, etc., the defective chip is detected, and the defective chip is marked. In addition to the marking, the position coordinates in the adhesive sheet are also stored. Moreover, an operator may detect a defective chip visually.
Thereafter, the chips are moved together with the holding means 22 from the defective chip detecting means 23 to the temporary storage unit 28c.
The flow from the loading of the movement from the start cassette to the temporary storage is performed for all the sheets in the cassette.

Then, the temporary storage unit 28 c moves to the mechanism B 20 b including the defective chip removing unit 24.
Then, the defective chip removing means 24 removes the defective chip from the adhesive sheet after confirming the origin in the adhesive sheet, confirming the position of the defective chip, and performing alignment.
Then, the holding means 22 that expands the adhesive sheet from which the defective chip has been removed is moved from the defective chip removing means 24 to the recovery unit cassette 28b. By performing this for all the sheets in the temporary storage unit 28c, the appearance inspection of the light emitting diode chip is completed.

  Conventionally, in an appearance inspection in one cassette unit, which has been performed by the above-described appearance inspection apparatus, since all the number of sheets contained in a normal cassette are inspected, the defective chip detection means reaches the defective chip removal means. It usually takes several hours to 10 hours to do so.

JP 2009-21572 A

However, when an operator performs an appearance inspection using a stereomicroscope or the like, it takes a long time, accumulates fatigue, and there is a very high possibility that a defective chip is not detected, which is not a practical method.
By detecting a defective chip with a machine for evaluating the presence of a defect from the appearance, such as a particle counter, it is possible to reduce detection omissions and burden on the operator, and the efficiency increases, but another problem occurs.

In some cases, inspection is performed by an appearance evaluation machine, and an ink mark is attached to a defective chip before shipment. However, drying of the ink is slow, and stains due to the ink itself may be defective. Inversely, ink may be taken out, and a defective chip will be recognized as a non-defective product.
Moreover, although the reliability increases by completely removing the defective appearance chip, since it takes a long time for the person to remove it, a dedicated remover is generally used. This is performed, for example, by pushing up the chip from the back side of the pressure-sensitive adhesive sheet, and vacuum-sucking the chip from the surface with a collet and removing it.
However, a problem also occurs when a defective chip is removed by a removing device.

The pressure-sensitive adhesive sheet is usually made of polyvinyl chloride, and its thickness is as thin as about 100 μm. Therefore, when transferring a chip sheet (showing the pressure-sensitive adhesive sheet on which the above-mentioned chip is mounted), when the tension is evaluated by an appearance evaluation machine, May change. As a result, the position of the defective chip may be different due to elongation or distortion of the adhesive sheet, and the detection position may be shifted. In addition, the elongation changes depending on the temperature, which is a problem.
Further, it is necessary to redo the origin of the xy address and the angle θ address on the physical xy plane on the chip sheet. Further, in order to accurately pick up the chip, it is necessary to measure and store the address as the center or the center of gravity when capturing an image from the upper surface of the chip. However, since it was necessary to perform image processing and calculation using the image camera again because of the transfer, the time loss was large and the yield was affected.

In the first place, the chips are not arranged in a straight line on the adhesive sheet, but there are staggered lateral shifts and rotations, and the center of gravity and position of the chips shift at the time of removal. There is also a time loss due to the rework of image recognition. Further, when removing the defective chip, the defective chip is pushed from the back surface of the pressure-sensitive adhesive sheet with a needle and peeled off from the sheet to be removed. At this time, if the sheet is slack, there are problems such that it becomes difficult for the needle to pierce the sheet, the sheet extends, the vertical position of the chip goes wrong, and the sheet does not peel off.
In addition, since the address changes due to the extension of the adhesive sheet when the sheets are repositioned, there is a deviation from the address at the time of inspection by the inspection machine, and it is difficult to accurately remove defective products.

  The present invention has been made in view of the above problems, and can efficiently and reliably remove defective chips as compared with the prior art, thereby greatly reducing the occurrence rate of removal leakage and the time required for inspection and removal. An object of the present invention is to provide an appearance inspection apparatus for a light emitting diode chip that can be reduced.

  In order to solve the above problems, the present invention is an apparatus for inspecting the appearance of a light-emitting diode chip, comprising at least a holding means for expanding and holding the chip on the adhesive sheet, and at least an illumination and an image camera. A defective chip detecting means; and a defective chip removing means for removing the defective chip detected by the defective chip detecting means; and the holding means is provided between the defective chip detecting means and the defective chip removing means. And a holding means moving means for parallelly moving in the xy plane in either the x direction or the y direction.

Thus, the holding means for expanding and holding the chip on the adhesive sheet translates between the defective chip detecting means and the defective chip removing means in either the x or y direction of the xy plane. The appearance inspection device of the light emitting diode chip can be made.
Thereby, it is possible to move the chip sheet (showing the above-mentioned adhesive sheet on which the chip is mounted) from the defective chip detecting means to the defective chip removing means without re-loading. Therefore, it is possible to prevent the tension of the adhesive sheet from changing between detection and removal of a defective chip, detection of a defective chip or a reference chip on the chip sheet, xy address on a physical xy plane, The work of redoing the origin of the address such as the angle θ becomes unnecessary, and the time required for removal can be reduced.
Further, since the defective chip on the chip sheet, the xy address on the physical xy plane of the reference chip, and the address such as the angle θ are hardly shifted, the defective chip can be removed with high accuracy. That is, the possibility of occurrence of removal omission can be greatly reduced, and it is possible to provide an appearance inspection apparatus that can perform reliable removal and achieve a significant improvement in yield and work efficiency.

Here, the holding means moving means preferably uses a ball screw, and the pitch width of the ball screw is preferably 0.5 to 2 mm.
Thus, if the holding means moving means is a ball screw, the holding means holding the light emitting diode chip is set to either the x direction or the y direction in the xy plane between the defective chip detecting means and the defective chip removing means. The parallel movement in the direction can be performed with high accuracy, and if the pitch width is 0.5 to 2 mm, the accuracy of the parallel movement can be further increased. Therefore, the deviation in detecting and removing a defective chip can be made smaller, and it can contribute to removing the defective chip with higher accuracy.

The appearance inspection apparatus further includes a position storage unit that stores the position of the defective chip detected by the defective chip detection unit, and the defective chip removal unit is a chip at a position stored in the position storage unit. Is preferably removed.
As described above, it is provided with position storage means for storing the position of the defective chip detected by the defective chip detection means, and the defective chip removal means removes the chip at the position stored in the position storage means. Thus, the removal of the defective chip can be started immediately after the movement to the defective chip removing means. Therefore, it can be set as the external appearance inspection apparatus which can perform a removal operation | work more efficiently.

The defective chip removing means is preferably fixed in the xy direction.
As described above, the defective chip removing means is fixed in the xy direction (there is a vertical escape mechanism in the z-axis direction), so there is no need to provide a moving mechanism other than the holding means moving means. Maintenance is easy, and the number of components is reduced, so that the cost can be reduced.

Furthermore, the chip preferably has a chip size of 150 to 300 μm square.
As described above, the appearance inspection apparatus according to the present invention can detect and remove a defective chip efficiently and reliably without being influenced by the size of the defective chip, and the chip size is 150 to 300 μm square. Even if it is a size, it can be applied sufficiently.

Moreover, it is preferable that the table for mounting the holding means is hollow.
Thus, by making the table on which the holding means is placed hollow, for example, it is very suitable when only the defective chip is pushed up from the back of the adhesive sheet.

The defective chip removing means includes a push-up needle for pushing up the defective chip from the back side of the pressure-sensitive adhesive sheet, a vacuum collet for sucking the pushed-up defective chip, and the defect lifted by the vacuum collet. It is preferable to include a blowing means for blowing the chips in a direction perpendicular to the lifting direction and a suction means for sucking the blown-off defective chips.
Thus, the defective chip removing means, a push-up needle for pushing up the defective chip from the back side of the adhesive sheet, a vacuum collet for adsorbing the pushed-up defective chip, and a blowing means for blowing off the defective chip, By including the suction means for collecting, it is possible to reliably collect only defective chips when removing from the adhesive sheet, and it is possible to more reliably suppress the occurrence of collection leakage.

Further, it is preferable that the vacuum collet is released from vacuum when the defective chip is blown and sucked by the blowing means or the suction means.
In this way, if the vacuum of the vacuum collet is released when the defective chip is blown away, the risk that the defective chip remains sucked into the collet without being blown off can be reduced, It is possible to reliably collect defective chips. Therefore, it is possible to provide an appearance inspection apparatus that can more efficiently remove defective chips. When the defective chip is blown off, not only the release of the vacuum (returning the negative pressure to the normal pressure) but also the blown off with the compressed air using a three-way valve can be performed.

Moreover, it is preferable that the said blowing means shall blow off the said defective chip with the compressed air more than atmospheric pressure.
Thus, by letting the blowing means blow off the defective chip with compressed air of atmospheric pressure or higher, the defective chip can be blown more reliably toward the suction means, and the defective chip can be removed more reliably and easily. Can be done.

And it is preferable that the said suction means shall be arrange | positioned in the position facing the said blowing means.
In this way, it is preferable that the suction means and the blowing means are arranged so as to face each other, which makes it easier to remove and collect defective chips.

Furthermore, it is preferable that the diameter of the suction means is larger than the diameter of the blowing means.
Thus, by making the diameter of the suction means larger than the diameter of the blowing means, the defective chip can be sucked more reliably.

The blowing means preferably has a double piping structure, and the suction means has a larger diameter than the pipe outside the blowing means having the double structure. It is preferable.
In this way, by adopting a double piping structure for the blowing means, for example, the amount of blowing air inside and outside can be changed, and recovery of defective chips becomes easier. Further, by making the diameter of the suction means larger than the outer pipe of the double structure blowing means, the above-described effects can be further enhanced.

  As described above, according to the present invention, the problem relating to the coordinate recognition of the defective chip on the expanded adhesive sheet, and the coordinates of the defective chip generated due to the difference in the tension of the sheet when the adhesive sheet is replaced, are described. It is possible to provide an appearance inspection apparatus in which the problem of misalignment or the like is solved and defective chips can be detected and removed in a shorter time and more efficiently than in the past.

It is the figure which showed an example of the outline of the external appearance inspection apparatus of this invention. It is the figure which showed an example of the test | inspection procedure at the time of performing the external appearance test | inspection of a light emitting diode chip | tip with the external appearance inspection apparatus of this invention. It is the figure which showed an example of the outline of a vacuum collet, a blowing means, and a suction means among the defective chip removal means of this invention. It is the figure which showed another example of the outline of a vacuum collet, a blowing means, and a suction means among the defective chip removal means of this invention. It is the figure which showed an example of the outline of the defective chip detection means of the external appearance inspection apparatus of this invention. It is the figure which showed an example of the outline of the conventional external appearance inspection apparatus. It is the figure which showed an example of the test | inspection procedure at the time of performing the external appearance inspection of a light emitting diode chip with the conventional external appearance inspection apparatus. It is a schematic diagram of the state by which the light emitting diode chip was arrange | positioned and expanded in the center of the adhesive sheet. It is a schematic diagram when the state in the case of the external appearance inspection of a light emitting diode chip is seen from the side.

  Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited thereto. FIG. 1 is a diagram showing an example of an outline of an appearance inspection apparatus according to the present invention.

As shown in FIG. 1, the appearance inspection apparatus 10 according to the present invention has at least a holding means 12 for expanding and holding a chip 11a on an adhesive sheet 11b, and a defective chip detection comprising at least an illumination 13a and an image camera 13b. Means 13 and defective chip removal means 14 for removing the defective chip detected by the defective chip detection means 13 are provided.
Furthermore, the holding unit 12 includes a holding unit moving unit 15 that translates between the defective chip detecting unit 13 and the defective chip removing unit 14 in either the x direction or the y direction in the xy plane. .

  Further, a table 16 for placing the holding means 12, a position storage means 17 for storing the position of the defective chip detected by the defective chip detection means 13, a starter cassette 18a for carrying the chip from the previous process, and the next A recovery unit cassette 18b for carrying chips to the process, a push-up needle 14a for pushing up defective chips from the back side of the adhesive sheet 11b, and the like can be provided.

  This eliminates the need to transfer the chip sheet again when moving from the defective chip detecting means to the defective chip removing means. That is, it is possible to prevent the tension of the adhesive sheet from changing. Further, in order to translate between the defective chip detecting means and the defective chip removing means in either the x direction or the y direction of the xy plane, the x- on the physical xy plane of the chip on the adhesive sheet It is possible to prevent the addresses such as the y address and the angle θ from being shifted. Accordingly, only the parameter in either the x direction or the y direction can be changed between the defective chip detection means and the defective chip removal means, and it is necessary to perform operations such as origin search and chip position correction. Therefore, the removal work time can be greatly shortened.

  In addition, since the position of the defective chip can be hardly shifted from the position detection, the defective chip can be removed with very high accuracy. Therefore, the occurrence of removal leakage is strongly suppressed, and an appearance inspection apparatus capable of reliably sorting non-defective products and defective products can be achieved, and the yield can be improved and the manufacturing cost can be reduced.

The table 16 is preferably a mechanism for chucking the holding means 12 with a vacuum or a mechanism for mechanically pressing the holding means 12. The table 16 is also preferably moved in parallel with the holding means 12 between the defective chip detection means 13 and the defective chip removal means 14 in either the x direction or the y direction in the xy plane.
For the illumination 13a, coaxial illumination, ring illumination, or the like can be used. In addition, it is desirable that the operating temperature range of this visual inspection apparatus be within 10 ° C.
In addition, the movement method from the start part cassette 18a to the defective chip detection means 13 and the movement method from the defective chip removal means 14 to the recovery part cassette are not particularly limited, and may be appropriately selected.
Further, a grip ring or a dicing ring can be used as the holding means 12.
Since these rings are generally used regularly, the cost for preparation is low, and they are easy to handle and are suitable as holding means.

The holding means moving means 15 can use a ball screw.
By using a ball screw as the holding means moving means, when moving the holding means with the light emitting diode chip expanded between the defective chip detecting means and the defective chip removing means, the x of the xy planes High-precision movement can be performed in parallel translation in any one of the direction and the y direction, and the risk of occurrence of displacement in detecting the position of the defective chip can be further reduced.

Moreover, the pitch width of the above-mentioned ball screw can be set to 0.5 to 2 mm.
If the pitch width is 0.5 to 2 mm, the holding means can be moved with higher accuracy, and fine adjustment is possible, so that position correction is easy. Therefore, it is possible to further reduce the positional deviation when detecting and removing the defective chip, and it is possible to remove the defective chip with high accuracy.

Further, it is provided with a position storage means 17 for storing the position of the defective chip detected by the defective chip detection means 13, and the defective chip removal means 14 removes the chip at the position stored in the position storage means 17. Can do.
Thus, if the chip at the position stored by the position storage means is to be removed, the removal of the defective chip can be started immediately after the holding means is moved to the defective chip removal means. Therefore, the removal process is performed more efficiently, and the working efficiency can be further increased.
In addition, an ink mark is given to a defective chip, or an address on an adhesive sheet, for example, a relative number with respect to a reference chip, or a recording medium such as an FD storing data such as a distance on the sheet is stored. Thus, the position data can be transmitted to the defective chip removing means to remove the defective chip.

The defective chip removing means 14 can be fixed in the xy direction.
In this way, by fixing the defective chip removing means in the xy direction (there is a mechanism for escaping vertically in the z-axis direction), there is no need to provide a moving mechanism other than the holding means moving means, and maintenance is easy. Become. Further, the number of components can be reduced, and the cost is reduced.
That is, the mechanism having the removal function is on the same plane as the plane of the xy address to be inspected, and the removal mechanism functions without moving on the xy plane except for the vertical clearance. In other words, even if it has an adjustment mechanism in the xy direction, it is on the same plane as the xy plane of the inspection in the series of inspection-removal operations, and on the xy address of the inspection after the inspection of the chip sheet The vertical mechanism for loading the chip sheet on the fixed removal mechanism, that is, the z-axis direction may be movable.

Further, the table 16 for placing the holding means 12 can be made hollow as shown in FIG.
If the table has a hollow structure, for example, it is very suitable when only the defective chip is pushed up from the back of the pressure-sensitive adhesive sheet. In this case, for example, by installing the push-up needle 14a in the hollow portion of the table 16 and moving the push-up needle directly below the defective chip and then pushing it up, it is possible to push up only the defective chip. Only the chip can be easily removed.
Further, by sucking air in the direction of the arrow by the suction means provided on the table 16, it can be suitable for fixing the adhesive sheet 11 and the holding means 12.

Furthermore, the chip size can be 150 to 300 μm square.
As described above, the appearance inspection apparatus of the present invention can detect and remove a defective chip efficiently and reliably without being influenced by the size or the like of the defective chip. Therefore, even if the chip size is 150 to 300 μm square, it can be sufficiently applied.

As shown in FIG. 3, the defective chip removing means 14 adsorbs the thrust needle 14a for thrusting the defective chip 11a ′ by about 10 to 100 μm from the back side of the adhesive sheet 11b and the pushed defective chip 11a ′. Vacuum collet 14b, blowing means 14c for blowing off the defective chip 11a 'lifted by the vacuum collet 14b in the vertical direction of the lifting direction, and suction means 14d for sucking the blown-off defective chip 11a'. Can be.
If the defective chip removing means has such a mechanism, only the defective chip can be reliably and easily recovered from the pressure-sensitive adhesive sheet, and occurrence of recovery leakage can be further reduced as compared with the conventional case.

Here, it is desirable that the diameter or side length of the tubes of the blowing means 14c and the suction means 14d be 1 cm or less, more preferably 5 mm, thereby optimizing the linear velocity and flow rate of the blowing and suction air. can do.
As the vacuum collet 14b, a commercially available product made of ceramic or the like can be used. In particular, it is desirable to use a three-way valve that can adsorb and release chips by evacuation, release, and compressed air.

Further, the vacuum collet 14b can release the vacuum when the defective chip is blown and sucked by the blowing means 14c or the suction means 14d.
As a result, the risk of occurrence of a problem that the defective chip remains sucked by the collet without being blown off can be reduced. Accordingly, it is possible to further suppress occurrence of defective chip recovery leakage and defective chip lifting errors. When the defective chip is blown off, not only the release of the vacuum (returning the negative pressure to the normal pressure) but also the blown off with the compressed air using a three-way valve can be performed.

And as shown in FIG. 3, the suction means 14d shall be arrange | positioned in the position facing the blowing means 14c.
This makes it easier to collect defective chips from the adhesive sheet.

Furthermore, as shown in FIG. 3, the diameter of the suction means 14d can be larger than the diameter of the blowing means 14c.
As a result, the suction (recovery) of the defective chip can be performed more reliably, and recovery leakage can be further reduced.

Moreover, the blowing means 14c shall blow off a defective chip with the compressed air above atmospheric pressure.
As a result, the defective chip can be blown off more reliably toward the suction means. Therefore, the defective chip can be removed reliably and easily.

As shown in FIG. 4, the blowing means 14c ′ can be a double pipe structure. The diameter of the suction means 14d can be made larger than the outer pipe of the blowing means 14c ′ having a double structure.
If the blowing means is a double piping structure, for example, the amount of blowing air inside and outside can be changed, and it becomes easier to collect defective chips.
If the diameter of the suction means is larger than the outer pipe of the double structure blowing means, the defective chip can be recovered more easily as described above.

An example of a light emitting diode chip appearance inspection method using the appearance inspection apparatus of the present invention as described above will be briefly described below with reference to the drawings. However, the present invention is not limited to this.
FIG. 2 is a diagram showing an example of an inspection procedure when the appearance inspection of the light-emitting diode chip is performed by the appearance inspection apparatus of the present invention.

  First, the adhesive sheet on which the diced light emitting diode chip is mounted is loaded from the start cassette portion 18a to the defective chip detecting means 13.

  Thereafter, the adhesive sheet on which the chip is mounted is attached to the holding means 12 and expanded, and the xy coordinates and the angle θ are adjusted and aligned.

  Next, the defective chip detection means 13 detects the defective chip. At this time, the position of the defective chip in the adhesive sheet 11b can be stored.

  Thereafter, the holding means moving means 15 translates the defective chip detecting means 13 from the defective chip detecting means 13 to either the x direction or the y direction in the xy plane. At this time, the adhesive sheet 11b is kept held by the holding means 12.

Then, the defective chip is removed from the adhesive sheet by the defective chip removing means 14.
It is desirable that this removal be started within 5 minutes after the inspection because of process shortening and work.

  Then, by moving the holding means 12 expanding the adhesive sheet 11b from which the defective chip has been removed from the defective chip removing means 14 to the collecting unit cassette 18b, the appearance inspection of the light emitting diode chip is completed.

  By such a light-emitting diode chip appearance inspection method, it is possible to quickly and accurately sort non-defective chips and defective chips on a sheet, and greatly reduce the time required for the appearance inspection process. be able to.

EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated more concretely, this invention is not limited to these.
(Example)
Using an appearance inspection apparatus as shown in FIG. 1, an appearance inspection of 1000 light emitting diode chips was performed. After the inspection, the time required for each operation and the number of remaining defective chips were evaluated. The results are shown in Table 1.

(Comparative example)
Using an appearance inspection apparatus as shown in FIG. 6, an appearance inspection of 1000 light emitting diode chips was performed. In the same manner as in the example, the time required for each operation after the end of the inspection and the number of remaining defective chips were evaluated. The results are also shown in Table 1.

As shown in Table 1, it was found that in the case of the appearance inspection apparatus of the comparative example, it took slightly less than 4 minutes from the defective chip detection means to the removal of the defective chip as compared with the appearance inspection apparatus of the example.
Further, the occurrence rate of the defective chip leaving error was 0.1% in the appearance inspection apparatus of the embodiment, whereas it was 1.5% in the appearance inspection apparatus of the comparative example, and the defective chip was removed. In view of this, it was found that the appearance inspection apparatus of the present invention is excellent.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

10 ... Appearance inspection device,
11a ... chip, 11a '... defective chip, 11b ... adhesive sheet, 12 ... holding means, 13 ... defective chip detection means, 13a ... illumination, 13b ... image camera, 14 ... defective chip removing means, 14a ... push-up needle, 14b ... Vacuum collet, 14c, 14c '... blowing means, 14d ... suction means, 15 ... holding means moving means, 16 ... table, 17 ... position storage means, 18a ... starter cassette, 18b ... recovery part cassette,
20 ... Visual inspection device, 20a ... Mechanism A, 20b ... Mechanism B,
21a ... chip, 21b ... adhesive sheet, 22 ... holding means, 23 ... defective chip detection means, 23a ... illumination, 23b ... image camera, 24 ... defective chip removal means, 28a ... start cassette, 28b ... collection cassette, 28c ... temporary storage.

Claims (13)

A device for inspecting the appearance of a light-emitting diode chip,
At least a holding means for expanding and holding the chip on the adhesive sheet, a defective chip detecting means comprising at least illumination and an image camera, and a defective chip removing for removing the defective chip detected by the defective chip detecting means Means,
Furthermore, the holding means includes holding means moving means for translating between the defective chip detecting means and the defective chip removing means in either the x direction or the y direction of the xy plane. An appearance inspection apparatus characterized by   The appearance inspection apparatus according to claim 1, wherein the holding means moving means uses a ball screw.   The visual inspection apparatus according to claim 2, wherein the ball screw has a pitch width of 0.5 to 2 mm.   Further, it comprises position storage means for storing the position of the defective chip detected by the defective chip detection means, and the defective chip removal means removes the chip at the position stored in the position storage means. The appearance inspection apparatus according to any one of claims 1 to 3, wherein the appearance inspection apparatus is characterized.   The appearance inspection apparatus according to claim 1, wherein the defective chip removing unit is fixed in the xy direction. Appearance inspection apparatus according to any one of claims 1 to 5, wherein the table for placing the holding means is a hollow. The defective chip removing means includes a push-up needle for pushing up the defective chip from the back side of the adhesive sheet, a vacuum collet for adsorbing the pushed-up defective chip, and the defective chip lifted by the vacuum collet. a blowout unit for blowing the vertical direction lifting, to any one of claims 1 to 6, characterized in that is made of a suction means for sucking the blown defect chips Appearance inspection apparatus as described. 8. The appearance inspection apparatus according to claim 7 , wherein the vacuum collet is configured to release a vacuum when the defective chip is blown and sucked by the blowing means or the suction means. The visual inspection apparatus according to claim 7 or 8 , wherein the blowing means blows off the defective chip with compressed air of atmospheric pressure or higher. The suction means, the appearance inspection apparatus according to any one of claims 7 to 9, characterized in that arranged at a position opposed to the blowout means. Diameter of the suction means, the appearance inspection apparatus according to any one of claims 7 to 10, characterized in that is greater than the diameter of the balloon means. It said balloon means, double appearance inspection apparatus according to any one of claims 7 to 11, characterized in that that is the piping structure. 13. The appearance inspection apparatus according to claim 12 , wherein a diameter of the suction means is larger than a tube outside the blowing means having the double structure.

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