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JP5282751B2 - LED bulb - Google Patents
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JP5282751B2 - LED bulb - Google Patents

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JP5282751B2
JP5282751B2 JP2010060706A JP2010060706A JP5282751B2 JP 5282751 B2 JP5282751 B2 JP 5282751B2 JP 2010060706 A JP2010060706 A JP 2010060706A JP 2010060706 A JP2010060706 A JP 2010060706A JP 5282751 B2 JP5282751 B2 JP 5282751B2
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power supply
base
circuit board
input
supply line
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JP2011198489A (en
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徳文 服部
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Toyoda Gosei Co Ltd
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Description

本発明はLED電球の改良に関する。   The present invention relates to improvements in LED bulbs.

省電力及び耐久性等の観点からLED電球が注目されている。例えば既存の白熱電球ではその発光部の寿命が例えば1000時間であるのに対し、LEDモジュールの寿命は4万時間である。
しかしながら、LED電球では、商用電源の交流を整流及び平滑化して直流に変換し、この直流をLEDモジュールへ印加しなければならいない。交流を整流化する手段としてブリッジ回路、平滑化する手段として電解コンデンサが用いられる。かかる電源回路はLED電球の筐体内へ内蔵される。LED電球から充分な光量を引き出すとき、LEDモジュールから大きな発熱があり、この熱が平滑化用の電解コンデンサの寿命に影響を及ぼす。LEDモジュールが長寿命であるにもかかわらず、電解コンデンサの熱劣化がLED電球としての寿命を低下させる原因となっている。
そこで従来では、LED電球の筐体を放熱性の材料(アルミ合金等)で形成するとともにその筐体にフィンを設けている。更には、熱劣化しやすい電解コンデンサを筐体の口金部(LEDモジュールから最も離れている)へ配置させることが提案されている(特許文献1及び特許文献2参照)
LED bulbs are attracting attention from the viewpoints of power saving and durability. For example, in the existing incandescent lamp, the lifetime of the light emitting part is 1000 hours, for example, whereas the lifetime of the LED module is 40,000 hours.
However, in the LED light bulb, the AC of the commercial power supply must be rectified and smoothed to be converted into DC, and this DC must be applied to the LED module. A bridge circuit is used as means for rectifying alternating current, and an electrolytic capacitor is used as means for smoothing. Such a power supply circuit is built in the housing of the LED bulb. When a sufficient amount of light is extracted from the LED bulb, there is a large amount of heat generated from the LED module, and this heat affects the life of the electrolytic capacitor for smoothing. Despite the long life of the LED module, the thermal deterioration of the electrolytic capacitor is a cause of reducing the life of the LED bulb.
Therefore, conventionally, the housing of the LED bulb is formed of a heat dissipating material (aluminum alloy or the like) and fins are provided on the housing. Furthermore, it has been proposed to dispose an electrolytic capacitor that is likely to be thermally deteriorated in the base part of the housing (the furthest away from the LED module) (see Patent Document 1 and Patent Document 2).

特開2000−106028号公報JP 2000-106028 A 特開2009−206104号公報JP 2009-206104 A

電源回路の電解コンデンサを口金部に配置すると、LEDモジュールから電解コンデンサが離隔されるので、LEDモジュールからの熱影響を低減できる。
しかしながら、電源回路において一つの要素である電解コンデンサの設置場所が固定されると、他の要素(ブリッジ回路、抵抗等)の配置が制限される。更には、LEDモジュールや口金に対する配線にも制限が課される。
When the electrolytic capacitor of the power supply circuit is arranged in the base part, the electrolytic capacitor is separated from the LED module, so that the thermal influence from the LED module can be reduced.
However, when the installation location of the electrolytic capacitor, which is one element in the power supply circuit, is fixed, the arrangement of other elements (bridge circuit, resistor, etc.) is limited. Furthermore, restrictions are imposed on the wiring for the LED module and the base.

かかる制限が課せられるもとにおいて、本発明者は回路基板における各要素の配置並びに回路基板の電源線(入力線及び出力線)の最適化を図るべく、鋭意検討を重ねてきた。
その結果、下記の本発明に想到した。即ち、
交流電源に接続されるLED電球であって、
LEDモジュールと、
一端側に前記LEDモジュールを配置し、他端側に口金を配置する筐体部と、
前記口金へ接続される入力部、ブリッジ回路、電解コンデンサ及び前記LEDモジュールへ接続される出力部を有し、前記筐体部へ内蔵される回路基板と、を備え、
前記回路基板の一端に前記電解コンデンサが実装されて前記筐体部の口金内に位置し、前記ブリッジ回路は前記回路基板の他端側に配置され、かつ前記入力部は前記ブリッジ回路側に配置され、前記出力部は前記電解コンデンサ側に配置され、
前記入力部と前記口金とが入力電源線で連結され、前記出力部と前記LEDモジュールとが出力電源線で連結され、前記入力電源線と前記出力電源線とは前記回路基板から離隔した空中配線である、ことを特徴とするLED電球。
Under such restrictions, the inventor has intensively studied in order to optimize the arrangement of each element on the circuit board and the power supply lines (input lines and output lines) of the circuit board.
As a result, the inventors have arrived at the present invention described below. That is,
An LED bulb connected to an AC power source,
An LED module;
A housing part in which the LED module is disposed on one end side and a base is disposed on the other end side;
An input unit connected to the base, a bridge circuit, an electrolytic capacitor, and an output unit connected to the LED module, and a circuit board built in the housing unit,
The electrolytic capacitor is mounted on one end of the circuit board and is located in the base of the housing part, the bridge circuit is arranged on the other end side of the circuit board, and the input part is arranged on the bridge circuit side The output part is disposed on the electrolytic capacitor side,
The input unit and the base are connected by an input power line, the output unit and the LED module are connected by an output power line, and the input power line and the output power line are separated from the circuit board. An LED bulb characterized by that.

このように規定されるこの発明の第1の局面によれば、電解コンデンサが筐体部の口金内に配置されるので、LEDモジュールからの熱影響が低減されることはもとより、ブリッジ回路側(即ちLEDモジュール側)に入力部がありこの入力部と筐体部の口金とが入力電源線で連結され、他方電解コンデンサ側(即ち口金側)に出力部がありこの出力部とLEDモジュールとが出力電源線で連結される。
回路基板において入力部がLEDモジュール側(即ち、その連結先の口金から遠い部分)に配置され、出力部がその連結先の口金側(即ち、その連結先のLEDモジュールから遠い部分)に配置されているため、入力電源線と出力電源線とはクロスすることとなる。
これら入力電源線と出力電源線とを回路基板上にパターン成形することも考えられる。しかしながら、電源線には大きな電流が流されるのでそのパターンは比較的広幅となる。他方、筐体部には放熱用フィンを形成すること等の要請から、その内部空間の幅が制限されている。このような内部空間へ内蔵される回路基板の幅も制限されるので、当該回路基板において回路パターンとして広幅の電源線をクロスさせることは困難である。そこでこの発明の第1の局面では入力電源線と出力電源線とを空中配線することとした。一般的に筐体部は円筒形であるため、その幅は狭くても、立体的にみれば空間が存在する。その空間へ入力電源線と出力電源線とを配置することにより、回路基板の設計自由度を向上させる。
According to the first aspect of the present invention thus defined, since the electrolytic capacitor is disposed in the base of the housing portion, not only the thermal influence from the LED module is reduced, but also the bridge circuit side ( That is, there is an input section on the LED module side, and the input section and the base of the housing section are connected by an input power line, while the output section is on the other side of the electrolytic capacitor (that is, the base side). Connected by output power line.
In the circuit board, the input part is arranged on the LED module side (that is, the part far from the base of the connection destination), and the output part is arranged on the base side of the connection destination (that is, the part far from the LED module of the connection destination). Therefore, the input power supply line and the output power supply line cross each other.
It is also conceivable to pattern these input power lines and output power lines on a circuit board. However, since a large current flows through the power supply line, the pattern becomes relatively wide. On the other hand, the width of the internal space is limited due to a requirement for forming a heat radiation fin in the housing. Since the width of the circuit board built in such an internal space is also limited, it is difficult to cross a wide power supply line as a circuit pattern on the circuit board. Therefore, in the first aspect of the present invention, the input power supply line and the output power supply line are wired in the air. Since the casing is generally cylindrical, even if the width is narrow, there is a space when viewed three-dimensionally. Arranging the input power supply line and the output power supply line in the space improves the design freedom of the circuit board.

この発明の第2の局面は次のように規定される。即ち、
第1の局面に規定のLED電球において、前記入力電源線と前記出力電源線とは前記回路基板の一側に配置される。
このように規定される第2の局面のLED電球によれば、互いにクロスする入力電源線と出力電源線とが回路基板の一側に集められている。これにより、筐体内の狭い空間において空中配線された入力電源線と出力電源線とがコンパクトにまとめられて他の要素との干渉を低減できる。
The second aspect of the present invention is defined as follows. That is,
In the LED light bulb defined in the first aspect, the input power supply line and the output power supply line are disposed on one side of the circuit board.
According to the LED bulb of the second aspect thus defined, the input power supply lines and the output power supply lines that cross each other are collected on one side of the circuit board. As a result, the input power supply line and the output power supply line wired in the air in a narrow space in the housing are collected in a compact manner, and interference with other elements can be reduced.

この発明の第3の局面は次のように規定される。即ち、
第2の局面に規定LED電球において、前記入力電源線は前記出力電源線より剛性が高い。
回路基板の一側にまとめられる電源線において一方の剛性を他方のそれより高くすることにより、一方の電源線が芯となるので、両者をまとめることが容易になり、またまとめた後も安定する。ここに、入力電源線はその先端部を口金の貫通孔から突出させ、その後口金へ溶接される。そこで、入力部と口金とを繋ぐ入力電源線の剛性を高めておくと(換言すれば入力電源線を座屈しがたくしておくと)、回路基板を筐体へ組み付けるときに入力電源線の先端が口金の内周面にガイドされて、当該口金の貫通孔から自動的に突出することとなり、組み付け作業が容易になる。
The third aspect of the present invention is defined as follows. That is,
In the prescribed LED light bulb according to the second aspect, the input power line is more rigid than the output power line.
By making one of the power supply lines integrated on one side of the circuit board higher in rigidity than that of the other, one power supply line becomes the core, making it easy to combine the two and stabilizing after the integration . Here, the front end of the input power line protrudes from the through hole of the base, and is then welded to the base. Therefore, if the rigidity of the input power supply line connecting the input unit and the base is increased (in other words, the input power supply line is not easily buckled), the tip of the input power supply line is attached when the circuit board is assembled to the housing. Is guided by the inner peripheral surface of the base and automatically protrudes from the through-hole of the base, facilitating the assembly work.

この発明の実施形態のLED電球の正面図である。It is a front view of the LED bulb of embodiment of this invention. LED電球の縦断面図である。It is a longitudinal cross-sectional view of an LED bulb. 同じく横断面図である。It is a cross-sectional view similarly. 口金の部分拡大断面図である。It is a partial expanded sectional view of a nozzle | cap | die.

以下、この発明の実施形態のLED電球について説明する。
実施形態のLED電球1は、図1に示すように筐体部10と透光性カバー50とを備える。筐体部10は筒状の外筒部11、該該当部11へ挿入される樹脂ケース13及び樹脂ケース13の先端側に取り付けられる口金15を備えている。
外筒部11は熱伝導性の高い金属材料(アルミ合金)で形成され、その周面にはフィン12が立設されて放熱効率の向上を図っている。
樹脂ケース13は絶縁性かつ耐熱性の高い合成樹脂(フッ素樹脂やポリアミド等)からなり、その大径部が外筒部11の内周面へ隙間なく嵌合されている(図2参照)。樹脂ケース13の小径部には口金15が嵌合されている。樹脂ケース13の内周には後述する回路基板20を差し込む溝14が形成されている。
口金15は、一般的なソケットに螺合可能な形状でありその中央部には貫通孔16が形成される。この貫通孔へ入力電源線31が挿通される。
Hereinafter, an LED bulb according to an embodiment of the present invention will be described.
The LED bulb 1 according to the embodiment includes a housing unit 10 and a translucent cover 50 as shown in FIG. The housing part 10 includes a cylindrical outer cylinder part 11, a resin case 13 inserted into the corresponding part 11, and a base 15 attached to the distal end side of the resin case 13.
The outer cylinder portion 11 is formed of a metal material (aluminum alloy) having high thermal conductivity, and fins 12 are provided upright on the peripheral surface of the outer cylinder portion 11 to improve heat dissipation efficiency.
The resin case 13 is made of a synthetic resin (fluororesin, polyamide, etc.) having high insulation and heat resistance, and the large diameter portion thereof is fitted to the inner peripheral surface of the outer cylinder portion 11 without any gap (see FIG. 2). A base 15 is fitted into the small diameter portion of the resin case 13. A groove 14 into which a circuit board 20 described later is inserted is formed on the inner periphery of the resin case 13.
The base 15 has a shape that can be screwed into a general socket, and a through hole 16 is formed at the center thereof. The input power line 31 is inserted through this through hole.

符号20は樹脂ケース13に挿入される回路基板である。この回路基板20の周縁部が樹脂ケース13の内周面に形成された溝14に差し込まれる。回路基板20はポリアミド等の耐熱性樹脂で形成されている。回路基板20にはLEDモジュール51の電源回路を構成する各種要素がマウントされている。電源回路は入力された交流を整流するためのブリッジ回路21とその後それを平滑化するための電解コンデンサ22とを電流の流れ方向に配置する。従って、回路基板20において交流電源が入力される入力部24はブリッジ回路21の近くに配置され、LEDモジュール51へ直流電流を印加する出力部25は電解コンデンサ22の近くに配置される。
この例では、電解コンデンサ22は回路基板20の一端に配置されて筐体部10における口金15の内部に配置される。これにより、電解コンデンサ22とLEDモジュール51との間に最も長い距離を取ることができ、電解コンデンサ22に対するLEDモジュール51からの熱影響を最も小さくすることができる。
Reference numeral 20 denotes a circuit board inserted into the resin case 13. The peripheral edge of the circuit board 20 is inserted into a groove 14 formed on the inner peripheral surface of the resin case 13. The circuit board 20 is made of a heat resistant resin such as polyamide. Various elements constituting the power supply circuit of the LED module 51 are mounted on the circuit board 20. In the power supply circuit, a bridge circuit 21 for rectifying an input alternating current and an electrolytic capacitor 22 for smoothing the bridge circuit 21 are arranged in the direction of current flow. Accordingly, the input unit 24 to which AC power is input in the circuit board 20 is disposed near the bridge circuit 21, and the output unit 25 that applies a direct current to the LED module 51 is disposed near the electrolytic capacitor 22.
In this example, the electrolytic capacitor 22 is disposed at one end of the circuit board 20 and is disposed inside the base 15 in the housing unit 10. Thereby, the longest distance can be taken between the electrolytic capacitor 22 and the LED module 51, and the thermal influence from the LED module 51 on the electrolytic capacitor 22 can be minimized.

その結果、図2で明らかなように、入力部24は口金15から遠い位置となり、同様に出力部25はLEDモジュール51から遠い位置となる。
そして、この例では、入力部24と口金15との間に入力電源線31が懸架される。即ち、入力電源線31はその両端のみで固定され、他の部分は回路基板21から浮いた状態である。ここに入力電源線31は一対のコード31−1、31−2からなり(図3参照)、組み付け時には図4の状態でコード31−1が口金15の貫通孔16を挿通し、コード31−2は口金15と樹脂ケース13との間から引出される。
出力部25とLEDモジュール51との間には出力電源線33が懸架される。即ち、入力電源線31はその両端のみで固定され、他の部分は回路基板21から浮いた状態である。出力電源線33は一対のコード33−1、33−3からなる。
As a result, as is apparent from FIG. 2, the input unit 24 is located far from the base 15, and similarly, the output unit 25 is located far from the LED module 51.
In this example, the input power line 31 is suspended between the input unit 24 and the base 15. That is, the input power supply line 31 is fixed only at both ends thereof, and the other part is in a state of floating from the circuit board 21. Here, the input power line 31 includes a pair of cords 31-1, 31-2 (see FIG. 3). When assembled, the cord 31-1 passes through the through hole 16 of the base 15 in the state of FIG. 2 is drawn from between the base 15 and the resin case 13.
An output power line 33 is suspended between the output unit 25 and the LED module 51. That is, the input power supply line 31 is fixed only at both ends thereof, and the other part is in a state of floating from the circuit board 21. The output power line 33 includes a pair of cords 33-1 and 33-3.

この入力部24がその連結先である口金15から遠くかつLEDモジュール51に近い位置にあり、他方、出力部25もその連結先であるLEDモジュール51から遠くかつ口金15に近い位置にあるので、入力電源線31と出力電源線33とは交差することとなる。
このとき、入力部24と出力部25とが回路基板20において片側に偏って配置されているので、入力電源線31と出力電源線33とを結束しやすくなる。
また、入力電源線31を出力電源線33より太くしその剛性を高くすることにより、入力電源線が芯となって、両者をまとめる作業(結束作業)が容易になる。更には、入力電源線31はその先端を口金15の貫通孔16から突出させる必要があるが、その剛性(即ち耐座屈性)を強くすることにより突出させる作業が容易となる。即ち、入力電源線31及び出力電源線33を取り付け、その一側にまとめた状態で回路基板20を筐体部10の大径側から挿入したとき、一側に偏った入力電源線31であってもその剛性により先端部が口金15の内周面に案内されて口金15先端の貫通孔16を自動的に挿通する。出力電源線33はその剛性を小さくしてあるので、入力電源線31の先端が貫通孔16へ自動的に案内されることを阻害することがない。
作業効率の観点から入力電源線31の先端部を最初に口金15へ半田付けし、その後に出力電源線33の先端部をLEDモジュール51へ半田付けするが、後操作となる出力電源線33の剛性を低くしておくことによりその取扱が容易になる。
この例において、入力電源線31に使うコードの種類(径)はAWG22(0.64mm)であり、出力電源線33に使うコードの種類(径)はAWG28(0.32mm)である。
Since the input unit 24 is far from the base 15 that is the connection destination and close to the LED module 51, the output unit 25 is also far from the LED module 51 that is the connection destination and close to the base 15. The input power supply line 31 and the output power supply line 33 cross each other.
At this time, since the input unit 24 and the output unit 25 are arranged so as to be biased to one side in the circuit board 20, the input power supply line 31 and the output power supply line 33 can be easily bundled.
Further, by making the input power supply line 31 thicker than the output power supply line 33 and increasing its rigidity, the input power supply line becomes a core, and the work of bundling them together (bundling work) becomes easy. Furthermore, although it is necessary to make the front end of the input power supply line 31 protrude from the through hole 16 of the base 15, it is easy to make the input power line 31 protrude by increasing its rigidity (ie, buckling resistance). That is, when the input power supply line 31 and the output power supply line 33 are attached and the circuit board 20 is inserted from the large diameter side of the casing 10 in a state where the input power supply line 31 and the output power supply line 33 are combined, the input power supply line 31 is biased to one side. However, the tip is guided by the inner peripheral surface of the base 15 due to its rigidity, and the through hole 16 at the tip of the base 15 is automatically inserted. Since the output power supply line 33 has a reduced rigidity, it does not hinder the front end of the input power supply line 31 from being automatically guided to the through hole 16.
From the viewpoint of work efficiency, the tip of the input power supply line 31 is first soldered to the base 15, and then the tip of the output power supply line 33 is soldered to the LED module 51. The handling becomes easy by keeping the rigidity low.
In this example, the type (diameter) of the cord used for the input power supply line 31 is AWG22 (0.64 mm), and the type (diameter) of the cord used for the output power supply line 33 is AWG28 (0.32 mm).

透光性カバー50は白濁した材料(ガラスや合成樹脂)で形成される。符号53は仕切り板であり筐体部10の大径側開口部を閉塞し、その中央にLEDモジュール51を固定する。
LEDモジュール51は単一若しくは複数のLEDを備える。このLEDには任意の発光色のものを選択することができるが、好ましくは白色発光のLEDが好ましい。
The translucent cover 50 is formed of a cloudy material (glass or synthetic resin). Reference numeral 53 denotes a partition plate that closes the large-diameter side opening of the housing 10 and fixes the LED module 51 at the center thereof.
The LED module 51 includes a single or a plurality of LEDs. The LED can be of any light emitting color, but is preferably a white light emitting LED.

この発明は、上記発明の実施の形態及び実施例の説明に何ら限定されるものではない。特許請求の範囲の記載を逸脱せず、当業者が容易に想到できる範囲で種々の変形態様もこの発明に含まれる。   The present invention is not limited to the description of the embodiments and examples of the invention described above. Various modifications may be included in the present invention as long as those skilled in the art can easily conceive without departing from the description of the scope of claims.

Claims (3)

交流電源に接続されるLED電球であって、
LEDモジュールと、
一端側に前記LEDモジュールを配置し、他端側に口金を配置する筐体部と、
前記口金へ接続される入力部、ブリッジ回路、電解コンデンサ及び前記LEDモジュールへ接続される出力部を有し、前記筐体部へ内蔵される回路基板と、を備え、
前記回路基板の一端に前記電解コンデンサが実装されて前記筐体部の口金内に位置し、前記ブリッジ回路は前記回路基板の他端側に配置され、かつ前記入力部は前記ブリッジ回路側に配置され、前記出力部は前記電解コンデンサ側に配置され、
前記入力部と前記口金とが入力電源線で連結され、前記出力部と前記LEDモジュールとが出力電源線で連結され、前記入力電源線と前記出力電源線とは前記回路基板から離隔した空中配線である、ことを特徴とするLED電球。
An LED bulb connected to an AC power source,
An LED module;
A housing part in which the LED module is disposed on one end side and a base is disposed on the other end side;
An input unit connected to the base, a bridge circuit, an electrolytic capacitor, and an output unit connected to the LED module, and a circuit board built in the housing unit,
The electrolytic capacitor is mounted on one end of the circuit board and is located in the base of the housing part, the bridge circuit is arranged on the other end side of the circuit board, and the input part is arranged on the bridge circuit side The output part is disposed on the electrolytic capacitor side,
The input unit and the base are connected by an input power line, the output unit and the LED module are connected by an output power line, and the input power line and the output power line are separated from the circuit board. An LED bulb characterized by that.
前記入力電源線と前記出力電源線とは前記回路基板の一側に配置される、ことを特徴とする請求項1に記載のLED電球。   The LED light bulb according to claim 1, wherein the input power line and the output power line are disposed on one side of the circuit board. 前記入力電源線は前記出力電源線より剛性が高い、ことを特徴とする請求項2に記載のLED電球。   The LED light bulb according to claim 2, wherein the input power line has higher rigidity than the output power line.
JP2010060706A 2010-03-17 2010-03-17 LED bulb Expired - Fee Related JP5282751B2 (en)

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