JP5287006B2 - Electron beam drawing apparatus, electron beam drawing method, master disk manufacturing method, and information recording medium manufacturing method - Google Patents

Description

  The present invention relates to an electron beam drawing apparatus, an electron beam drawing method, a master disk manufacturing method, and an information recording medium manufacturing method, and more particularly, an electron beam drawing apparatus that draws a pattern on a substrate using an electron beam, and the electron beam The present invention relates to an electron beam drawing method using a drawing apparatus, a master manufacturing method for manufacturing a master using the electron beam drawing apparatus, and an information recording medium manufacturing method for manufacturing an information recording medium using the master.

  The amount of data handled by information devices and the like is rapidly increasing against the background of the increasing speed and speed of the Internet, the expansion of various services such as moving picture distribution, and the widespread use of high-definition image receiving / playback devices. In recent years, a large-capacity optical disk or a large-capacity hard disk drive has been actively developed in order to store and use these increasing amounts of data. In particular, recording media such as hard disks are used in portable devices such as mobile phones, portable music recording and playback devices, and video cameras. Track media and patterned media have been introduced.

  As a method of drawing a pattern on a substrate or the like serving as a master disk of the recording medium described above, for example, a drawing method using an electron beam drawing apparatus including an X-θ stage described in Patent Document 1 can be considered. In a drawing method using this type of electron beam drawing apparatus, an arbitrary pattern can be drawn and formed on a substrate along a spiral or concentric track.

JP 2003-317327 A

  In a recording medium used for the hard disk or the like described above, the drawing start position of each concentric track is generally located on the movement trajectory of a recording / reproducing head supported by a swing arm, for example. However, when a pattern is drawn along the circumferential track forming each concentric track as in the prior art, a deflection signal is generated every time the substrate rotates, that is, for each circumferential track. When each pattern is drawn individually, the angle of the substrate when moving the incident position of the electron beam to the drawing start position of the next circumferential track (hereinafter referred to as the next track) corresponds to the drawing start position of the next track. In some cases, the angle of the substrate does not match, and in this case, a disadvantage such as a discontinuous pattern is expected.

  The present invention has been made under such circumstances, and a first object of the present invention is to perform electron beam drawing capable of drawing a pattern continuously and accurately along a concentric track having a plurality of circumferential tracks. An apparatus and an electron beam drawing method are provided.

  The second object of the present invention is to provide a master manufacturing method for manufacturing a master for transferring a pattern formed continuously and accurately along a concentric track having a plurality of circumferential tracks to a recording medium. There is to do.

  A third object of the present invention is to provide an information recording medium manufacturing method for manufacturing an information recording medium in which a pattern is formed continuously and accurately along concentric tracks having a plurality of circumferential tracks. It is in.

From a first aspect, the present invention is directed to a plurality of circumferential tracks including adjacent first and second circumferential tracks having a common center, and each circumferential track that is not collinear through the center. along each circumferential track from the drawing start position, an electron beam lithography system for drawing a sequential pattern, the irradiation device for irradiating the sagittal line electrostatic toward the irradiation position of the base plate surface; the rotating substrate A moving device that moves relative to the irradiation device to move the irradiation position from the reference position along the equal pitch spiral track; and the electron beam irradiated toward the irradiation position on the spiral track And deflecting the electron beam onto one of the circumferential tracks corresponding to the spiral track, and the deflection device is configured such that the substrate is moved from the start of drawing of the first circumferential track. ,Previous The cumulative rotation angle of the substrate based on the reference position at the drawing start position on the first circumferential track, and the cumulative rotation angle of the substrate based on the reference position at the drawing start position on the second circumferential track. When the electron beam is rotated by an angle corresponding to the difference between the first and second circumferential tracks, the incident position of the electron beam is positioned at the drawing start position of the second circumferential track, and each of the first and second circumferential tracks is k. The distance between the position on the spiral track corresponding to the drawing start position on the first and k + 1th circumferential tracks and the reference position and the reference position is R ₀ , the pitch of the spiral track is P, and the irradiation the relative movement speed with respect to the spiral track of the position V, and angle difference of the drawing start position between the first and second circumferential track is taken as Δθte (k), wherein _{R 0 · (2π + Δθte (} k + 1)) V ± P · ((2π ( k + 1) + Σ (n = 0 → k + 1) · Δθte (n)) 2 - (2π · k + Σ (n = 0 → k) · Δθte (n)) 2) / (4π · V The electron beam drawing apparatus deflects the electron beam based on a deflection control signal having a cycle calculated by using () .

According to this, a substrate moving constant velocity along a spiral track with respect to irradiation morphism apparatus, it is possible to draw a pattern continuously accurately along the circumference track.

  Further, from the second viewpoint, the present invention is an electron beam drawing method using the electron beam drawing apparatus of the present invention. According to this, it becomes possible to draw a pattern along the circumferential track continuously and accurately on the substrate that moves at a constant speed along the spiral track with respect to the irradiation device.

  According to a third aspect of the present invention, there is provided an information recording medium master comprising: a step of drawing a pattern on a substrate by the electron beam drawing apparatus of the present invention; and a step of developing the pattern formed on the substrate. It is a manufacturing method.

  According to this, a pattern is continuously and accurately formed on the master along a concentric track having a plurality of circumferential tracks. By using this master, it is possible to transfer a pattern formed continuously and accurately along the concentric tracks having a plurality of circumferential tracks to the information recording medium.

  From a fourth aspect, the present invention is an information recording medium manufacturing method for manufacturing an information recording medium by transferring a pattern to the recording medium using the master disk of the present invention. According to this, a pattern formed continuously and accurately along a concentric track having a plurality of circumferential tracks is transferred to the information recording medium.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a schematic configuration of an electron beam drawing apparatus 100 according to the present embodiment. The electron beam drawing apparatus 100 draws a fine pattern on the surface of the substrate W by irradiating the surface of the substrate W with an electron beam in an environment where the degree of vacuum is about 10 ⁻⁴ Pa, for example. An electron beam drawing apparatus. The electron beam drawing apparatus 100 according to the present embodiment moves the substrate W relative to the irradiation unit 10 described later to move the irradiation position of the irradiation unit 10 along the spiral track STr shown in FIG. by deflecting the electron beam towards the irradiation position, a plurality of circumferentially tracks _CTr 1 exposure on ~CTr _n (drawing) starting position _SP 1 to SP _n that a common center of rotation o of the substrate W, a circular drawing a pattern along the circumferential track _CTr 1 _{~CTr n.} Further, in the present embodiment, the drawing start position on the circumferential track CTr ₁ ~CTr _n shall not on the same straight line passing through the center o.

  As shown in FIG. 1, the electron beam drawing apparatus 100 includes an irradiation unit 10 that irradiates a substrate W with an electron beam, a rotary table unit 30 that includes a rotary table 31 on which the substrate W is placed, and a rotary table unit 30. A rectangular parallelepiped vacuum chamber 40, a pulse signal generation device 21, a format signal generation device 22, a deflection signal generation device 23, a rotation drive control device 25, a feed drive control device 26, and the like. It has a control system and a controller 20 that controls the above-mentioned units in an integrated manner.

  The rotary table unit 30 is disposed on the bottom wall surface inside the vacuum chamber 40. The rotary table unit 30 supports a rotary table 31 on which the substrate W is placed, a rotary mechanism 32 that rotates the rotary table 31 at a predetermined rotational speed around a vertical axis, and a rotary mechanism 32 that is movable in the X-axis direction. A moving stage 34 and a slide unit 33 for driving the moving stage 34 in the X-axis direction with a predetermined stroke are provided.

  The rotary table 31 is a circular plate-like member, and is held by a rotation mechanism 32 so as to be rotatable around a vertical axis.

  The rotation mechanism 32 rotates the rotation table 31 at a predetermined rotation number based on a control signal supplied from the rotation drive control device 25.

  The moving stage 34 supports the rotating mechanism 32 and is held by a slide unit 33 so as to be movable in the X-axis direction.

  The slide unit 33 moves the moving stage 34 in the X axis direction at a predetermined speed based on a control signal supplied from the feed drive control device 26.

  Further, in the rotary table unit 30 configured as described above, the rotation angle of the rotary table 31 and the position of the moving stage 34 are detected by the rotation angle detector 37 and the position detector 38, respectively, and the rotation angle detector 37 is detected. The position detector 38 outputs a pulse signal corresponding to the rotation angle of the rotary table 31 and the position of the moving stage 34.

  The irradiation unit 10 includes a casing 11 whose longitudinal direction is the Z-axis direction, and an electron gun 12, a magnetic lens 13, a blanking electrode 14, and an aperture member 15 that are sequentially arranged from the upper side to the lower side of the casing 11. , A deflection electrode 16 and an objective lens 17.

  The casing 11 is a cylindrical casing that is open at the bottom, and is fitted into an opening formed on the upper surface of the vacuum chamber 40 without any gap from above. And the part located in the inside of the vacuum chamber 40 becomes a taper shape in which the diameter becomes small toward -Z direction.

  The electron gun 12 is disposed inside the casing 11. The electron gun 12 is a thermal field emission type electron gun that emits electrons extracted from the cathode by heat and an electric field, and emits, for example, an electron beam having a diameter of about 20 to 50 nm downward (−Z direction).

  The magnetic field lens 13 is an annular lens disposed below the electron gun 12, and applies power in a focusing direction to an electron beam emitted downward from the electron gun 12.

  The blanking electrode 14 has a pair of rectangular plate-like electrodes arranged so as to face each other at a predetermined interval in the X-axis direction. The blanking electrode 14 receives a blanker control signal Bsig supplied from the format signal generator 22. Accordingly, the electron beam that has passed through the magnetic lens 13 is deflected in the + X direction as indicated by a dotted line in the figure.

  The aperture member 15 is a plate-like member provided with an opening through which an electron beam passes in the center. The aperture member 15 is arranged so that the opening is located near the point where the electron beam that has passed through the blanking electrode 14 converges.

  The deflection electrode 16 is disposed below the aperture member 15. The deflection electrode 16 has a pair of electrodes arranged so as to face each other in the X-axis direction and a pair of electrodes arranged so as to face each other in the Y-axis direction, and generates a deflection signal. In response to a deflection control signal Dsig supplied from the device 23, the electron beam that has passed through the aperture member 15 is deflected in the X-axis direction or the Y-axis direction.

  The objective lens 17 is disposed below the deflection electrode 16 and converges the electron beam that has passed through the deflection electrode 16 onto the surface of the substrate W placed on the rotary table 31.

  In the irradiation unit 10 configured as described above, the electron beam emitted from the electron gun 12 is focused by passing through the magnetic lens 13 and is near the opening (hereinafter referred to as a crossover point) provided in the aperture member 15. ) Is once crossed. Next, the shape of the electron beam that has passed through the crossover point is shaped by passing through the aperture member 15 while diverging. Then, the objective lens 17 converges to a predetermined irradiation position on the surface of the substrate W placed on the rotary table 31.

  Hereinafter, for convenience of explanation, the irradiation position is a position on the substrate W on which an electron beam that is not deflected by the deflection electrode 16 is incident, and refers to a position on the axis of the irradiation unit 10 including the objective lens 17. To do. The position where the electron beam on the substrate W actually enters is referred to as an incident position. In the present embodiment, the relative position between the irradiation unit 10 and the rotary table 31 is adjusted so that the irradiation position described above is positioned on a straight line that passes through the rotation center of the substrate W and is parallel to the X axis.

  In the irradiation unit 10, the blanking electrode 14 is controlled based on the blanker control signal Bsig, and the electron beam is deflected in the X-axis direction, whereby the electron beam is shielded by the aperture member 15, and the electron beam with respect to the substrate W Blanking is being performed. Further, the deflection electrode 16 is controlled based on the deflection control signal Dsig, and the electron beam is deflected in the X-axis direction or the Y-axis direction, so that the irradiation position of the electron beam on the substrate W is adjusted. Yes.

  FIG. 3 is a block diagram of the pulse signal generator 21. As shown in FIG. 3, the pulse signal generation device 21 includes a reference clock generation device 21a, a formatter drive clock generation device 21b, a rotation command pulse generation device 21d, and a feed command pulse generation device 21e.

  The reference clock generation device 21a generates and outputs a reference clock signal CLK having a predetermined frequency that serves as a reference when controlling each device constituting the electron beam drawing apparatus 100.

  The formatter drive clock generator 21b generates a formatter drive clock signal Fclk and a track end signal TEsig based on the reference clock signal CLK under the instruction of the controller 20, and generates a format signal generator 22 and a deflection signal generator 23. To supply.

While feeding the X-axis direction together with the rotating the substrate W, in the case of performing exposure by moving at a constant speed the irradiation position of the electron beam along the spiral track from the exposure start position SP ₁ in FIG. 2, the exposure start position the length L of the spiral track STr between the SP ₁ to the position BP 'on the spiral track is represented by the following formula (1). However, R ₀ is the distance from the rotation center o of the substrate W to the exposure start position SP ₁ , and θ _tot is the total rotation angle of the substrate W until the irradiation position moves from the exposure start position SP ₁ to the position BP ′. Yes, P is the pitch of the spiral track STr. Further, the sign of the two items in the expression (1) is + when the irradiation position is moved from the inside to the outside of the substrate W along the spiral track STr, and from the outside to the inside of the substrate W along the spiral track STr. It is-when moving the irradiation position.

L = R ₀ · (θ _tot ) ± P · (θ _tot ) ² / (4 · π) (1)

When the speed of the upper spiral track irradiation position of the electron beam moves to is V, the time T the irradiation position of the electron beam is moved from the reference position SP ₁ to the position BP 'on the spiral track STr following formula (2) Indicated by

T = L / V
= R ₀ · (θ _tot ) / V ± P · (θ _tot ) ² / (4 · π · V) (2)

The circumferential track CTr _n, when the number of time obtained by dividing the circular arc (first unit track) to a central angle between the first reference angle Δθ and N _1, the angle in which the first reference angle by an integral multiple (an integer double angle) .theta.k Is represented by the following equation (3). Then, the following equation (4) can be derived from the equations (2) and (3). Note that k is an integer consecutive with 0, 1, 2,.

θk = Δθ · k = 2π · k · N ₁ (3)
T · k = 2π · R ₀ · k / (V · N ₁ ) ± π · P · k ² / (V · N ₁ ² ) (4)

  From the above equation (4), the time interval (cycle) at which the unit pattern having the first reference angle Δθ as the central angle is drawn is represented by the following equation (5).

Δt (k) = t · (k + 1) −t (k)
= 2π · R ₀ · / (V · N ₁ )
± π · P · (2k + 1) / (V · N ₁ ² ) (5)

The formula (5) by deflecting the electron beam while moving an irradiation position along the spiral track STr as in this embodiment, along the circumference track CTr _n, the central angle and the first reference angle Δθ The period for forming the unit pattern means that the initial value is given by the following equation (6) and the increase / decrease value is given by the following equation (7). However, R ₁ is a distance of a position on the spiral track corresponding to the exposure start position on the circumference track CTr _n identical central angle region (irradiation position on the spiral track STr) and the rotation center o of the substrate W .

2π · R ₁ · / (V · N ₁ ) ± π · P / (V · N ₁ ² ) (6)
± 2π · P · (V · N ₁ ² ) (7)

  The formatter drive clock generation device 21b of the electron beam drawing apparatus 100 generates a clock signal Fclk that becomes a high level at a period defined by the above equations (6) and (7).

  The deflection clock generation device 21c generates and outputs a deflection clock signal Dclk based on the reference clock signal CLK generated by the reference clock generation device 21a, and the rotation command pulse generation device 21d generates the rotation command pulse signal Tclk. The feed command pulse generator 21e generates and outputs a feed pulse signal Sclk.

  In this embodiment, the rotation drive control device 25 compares the rotation command pulse signal Tclk from the pulse signal generation device 21 with the pulse signal from the rotation angle detector 37, and according to the comparison result. By driving the rotation mechanism 32, the substrate W is rotated at a predetermined rotation speed, and the feed drive control device 26 receives the feed pulse signal Sclk from the pulse signal generation device 21 and the pulse from the position detector 38. By comparing the signal and driving the slide unit 33 according to the comparison result, the substrate W is moved in the X-axis direction at a predetermined speed. In the electron beam drawing apparatus 100, the rotation drive control device 25 and the feed drive control device 26 cooperate in this way, so that the irradiation position of the irradiation unit 10 is a substrate along the spiral track STr shown in FIG. It moves on W at a constant speed.

  The deflection signal generator 23 generates a deflection control signal Dsig from the deflection clock signal Dclk from the pulse signal generator 21 and the track end signal TEsig and supplies the deflection control signal Dsig to the deflection electrode 16.

  As an example, the controller 20 is a control computer including a CPU, a memory for storing programs and parameters for controlling the irradiation unit 10 and the rotary table unit 30. For example, based on an instruction from the user, the controller 20 is configured to supply a substrate to the formatter drive clock generation device 21b, the deflection clock generation device 21c, the rotation command pulse generation device 21d, and the feed command pulse generation device 21e. A command or the like for drawing a pattern for W is supplied. Further, drawing information and the like are supplied to the format signal generator 22.

As described above, in the present embodiment, the drawing start position on the circumferential track _CTr 1 _{~CTr n} is not on the same straight line passing through the center o, for example, drawing start position SP ₁ of the circumferential track CTr ₁ the If based, drawing start position SP ₂ circumferential track CTr _2, as shown in FIG. 4, in the position of the angle -Δθte _1. As can be understood from FIG. 2, the position and angle of the irradiation position when the rotary table 31 is rotated by 2π−Δθte _one rotation after the rotary table 31 is relatively moved along the spiral track STr. Match.

Further, when a reference writing start position SP ₁ of the circumferential track CTr _1, drawing start position SP ₃ circumferential tracks CTr _3, as shown in FIG. 5, in the position of the angle + Δθte _2. As can be understood from FIG. 2, this position is angularly different from the position of the irradiation position when the rotary table 31 is rotated by 4π + Δθte ₂ rotations after the rotary table 31 is relatively moved along the spiral track STr. Match.

In electron beam lithography system 100, from the writing start position SP ₁ on the circumference track CTr ₁ to start drawing a pattern along the circumference track CTr _1, at a position where the substrate is rotated _one 2π-Δθte, electron beam the positioning of the incident position of the electron beam in the circumferential track CTr ₂ above by deflecting the X-axis direction. Specifically, electrons by as shown in FIG. 4, the incident position of the electron beam from the drawing start position SP ₁ on the circumference track CTr ₁ to the marking end position EP ₁ moves further substrate W is rotated when the incident position of the line comes to a position JP _1, to deflect the electron beam is incident electron beam in a circumferential track CTr ₂ to the drawing start position SP ₂ in.

Then, from the writing start position SP ₂ on the circumference track CTr ₂ to start drawing a pattern along the circumference track CTr _2, the substrate is 2π + Δθte ₁ + Δθte ₂ rotating _{((4π + Δθte 2) -} (2π-Δθte 1 )) in position, the incident position of the electron beam is positioned to the circumferential track CTr ₃ above by deflecting the electron beam in the X-axis direction. Specifically, electrons by as shown in FIG. 5, the incident position of the electron beam from the drawing start position SP ₂ on the circumference track CTr ₂ to the marking end position EP ₂ is moved further substrate W is rotated when the incident position of the line comes to a position JP _2, to deflect the electron beam is incident electron beam to the drawing start position SP ₃ circumferential tracks CTr ₃ in.

Thus, as can be seen by reference to Figure 4, a section from the drawing start position SP ₁ of the circumferential track CTr ₁ of the substrate W to EP ₁ is exposed by the electron beam which has been modulated by the blanker control signal Bsig. Then, the electron beam is blanked between the drawing end position EP ₁ and the position JP _{1, and} when the position corresponding to the incident position of the electron beam coincides with the position JP ₁ , the electron beam is transmitted to the deflection control signal. is deflected by Dsig, it enters the drawing start position SP ₂ circumferential track CTr _2.

Next, as can be seen by reference to Figure 5, a section from the drawing start position SP ₂ circumferential track CTr ₂ of the substrate W to the EP ₂ is exposed by the electron beam which has been modulated by the blanker control signal Bsig. Then, between the drawing end position EP ₂ to the position JP ₂ is a state in which the electron beam is blanked, when a position corresponding to the incident position of the electron beam coincides with the position JP _2, the electron beam deflection control signal is deflected by Dsig, enters the drawing start position SP ₃ circumferential tracks CTr _3. Hereinafter, by the same operation is repeated, the substrate W pattern is drawn along the circumference track _CTr 1 _{~CTr n.}

  The above-described deflection operation of the electron beam is performed by applying a deflection control signal Dsig as shown in FIGS. 6 (A) and 6 (B) to the deflection electrode 16. The deflection control signal Dsig shown in FIG. 6A is an example of resetting the deflection control signal Dsig at the drawing start position of the track. The deflection control signal Dsig shown in FIG. In this example, the electron beam is deflected so that the amount of movement of the position is equivalent to the adjacent track pitch.

  The deflection control signal Dsig shown in FIG. 6A is suitable for use when the angle between the drawing start positions between the tracks is small, and the deflection control signal Dsig shown in FIG. This requires a complicated procedure, but is suitable for accurately positioning the electron beam when the angle between the drawing start positions between the tracks is large.

If the angle difference between the drawing start positions between adjacent tracks is Δθte (k), the time t (k) from when drawing is started until the drawing start position of the _kth track CTrk is drawn is Substituting θ _tot (k) = 2π · k + Σ (n = 0 → k) Δθte (n) (where n = 0 → k indicates the integration range n = 0... K) into the above equation (2). The following equation (8) is obtained.

t (k) = L / V
= R ₀ · (2π · k + Σ (n = 0 → k) Δθte (n)) / V
± P · (2π · k + Σ (n = 0 → k) Δθte (n)) ² / (4π · V) (8)

From the above equation (8), the cycle of the deflection control signal Dsig is expressed by the following equation (9).
Δt (k) = t (k + 1) −t (k)
= R ₀ · (2π + Δθte (k + 1)) / V
± P · ((2π · (k + 1) + Σ (n = 0 → k + 1) Δθte (n)) ²
− (2π · k + Σ (n = 0 → k) Δθte (n)) ² ) / (4π · V)
= R ₀ · (2π + Δθte (k + 1)) / V
± P · ((4π · (k + 1) (1 + Σ (n = 0 → k + 1) Δθte (n))
+ (Σ (n = 0 → k + 1) Δθte (n)) ²
−4π · k · Σ (n = 0 → k) Δθte (n)
− (Σ (n = 0 → k) Δθte (n)) ² ) / (4π · V) (9)

Further, Derutashitate a (k), instead of the angular difference between the drawing start position between the adjacent tracks, when the angle to the angle of the drawing start position SP ₁ (reference angle), k-th track CTr from the start of the drawing The time t (k) until the drawing start position of _k is drawn is expressed by the following equation (10) obtained by substituting θ _tot (k) = 2π · k + θte (k) into equation (2). Indicated.

t (k) = L / V
= R ₀ · (2π · k + θte (k)) / V
± P · (2π · k + θte (k)) 2 / (4π · V) (10)

From the above equation (10), the cycle of the deflection control signal Dsig is expressed by the following equation (11).
Δt (k) = t (k + 1) −t (k)
= R ₀ · (2π + θte (k + 1) −θte (k)) / V
± (P · ((2π · (k + 1) + θte (k + 1)) ²
− (2π · k + θte (k)) ² ) / (4π · V)
= R ₀ · (2π + θte (k + 1) θte (k)) / V
± (P · (4π · (k + 1 + θte (k + 1) −θte (k))
+ Θte (k + 1) ² −θte (k) ² ) / (4π · V) (11)

As described above, in the electron beam lithography system 100, from the writing start position SP ₁ on the circumference track CTr ₁ to start drawing a pattern along the circumference track CTr _1, the substrate is 2π-Δθte ₁ rotation in position, to position the incident position of the electron beam in the circumferential track CTr ₂ above by deflecting the electron beam in the X-axis direction. Then, from the writing start position SP ₂ on the circumference track CTr ₂ to start drawing a pattern along the circumference track CTr _2, the substrate is 2π + Δθte ₁ + Δθte ₂ rotating _{((4π + Δθte 2) -} (2π-Δθte 1 )) in position, the incident position of the electron beam is positioned to the circumferential track CTr ₃ above by deflecting the electron beam in the X-axis direction. As a result, the substrate W is moved relative to the irradiation unit 10 along the spiral track STr, and from the drawing start position of each circumferential track that is not on the same straight line passing through the center of the substrate W, along each circumferential track. Pattern can be drawn continuously.

  Furthermore, in the present embodiment, unlike the conventional case, since the electron beam is not positioned on another circumferential track between the drawing start position and the drawing end position of the same circumferential track, Small pits (dots) constituting a pattern can be continuously formed on the track.

  Further, as shown in FIG. 7 as an example, this embodiment is suitable for drawing a pattern continuously along a circumferential track in, for example, four regions defined by boundary lines corresponding to a swing arm. It is.

  The present invention is also suitable for manufacturing discrete track media and patterned media that are being considered for use in hard disk media.

  In addition, a master for manufacturing an information recording medium can be manufactured by drawing a pattern on a substrate using the electron beam drawing apparatus according to the present invention and then developing the substrate. By using this master, an information recording medium on which a pattern is formed can be manufactured.

  As described above, the electron beam drawing apparatus and the electron beam drawing method of the present invention are suitable for drawing a pattern on a substrate. The master production method of the present invention is suitable for producing a master of an information recording medium. The information recording medium manufacturing method of the present invention is suitable for manufacturing an information recording medium.

It is a figure which shows schematic structure of the electron beam drawing apparatus which concerns on one Embodiment of this invention. It is a figure which shows the spiral track and circumferential track which were prescribed | regulated on the substrate surface. It is a block diagram of a pulse signal generation device. It is FIG. (1) for demonstrating the method to position an electron beam to a circumferential track. It is FIG. (2) for demonstrating the method to position an electron beam to a circumferential track. 6A and 6B are diagrams for explaining the deflection control signal. It is a figure which shows the board | substrate with which the sector was prescribed | regulated on the surface.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Irradiation unit, 11 ... Casing, 12 ... Electron gun, 13 ... Magnetic lens, 14 ... Blanking electrode, 15 ... Aperture member, 16 ... Deflection electrode, 17 ... Objective lens, 20 ... Controller, 21 ... Pulse signal generator 21a ... Reference clock generator, 21b ... Formatter drive clock generator, 21c ... Deflection clock generator, 21d ... Rotation command pulse generator, 21e ... Feed command pulse generator, 22 ... Format signal generator, 23 ... Deflection signal Generation device 25 ... Rotation drive control device 26 ... Feed drive control device 30 ... Rotation table unit 31 ... Rotation table 32 ... Rotation mechanism 33 ... Slide unit 34 ... Moving stage 37 ... Rotation angle detector 38 ... position detector, 40 ... vacuum chamber, W ... substrate, CLK ... reference clock signal Fclk: formatter drive clock signal, Bsig: blanker control signal, Dclk: deflection clock signal, Dsig: deflection control signal, Tclk: rotation command pulse signal, TEsig: track end signal, Sclk: feed pulse signal, CTr: circumferential track, STr ... spiral track.

Claims (5)

From a drawing start position of each circumferential track not on the same straight line passing through the center to each circumferential track, on a plurality of circumferential tracks including adjacent first and second circumferential tracks having a common center An electron beam drawing apparatus that sequentially draws a pattern along
An irradiation device for irradiating the sagittal line electrostatic toward the irradiation position of the base plate surface;
A moving device that relatively moves the rotating substrate with respect to the irradiation device, and moves the irradiation position from the reference position along a constant pitch spiral track;
A deflecting device that deflects the electron beam irradiated toward the irradiation position on the spiral track and causes the electron beam to be incident on any of the circumferential tracks corresponding to the spiral track;
In the deflecting device, the cumulative rotation angle of the substrate based on the reference position of the drawing start position on the first circumferential track from the start of drawing of the first circumferential track, and the second circumference When the drawing start position on the track is rotated by an angle corresponding to the difference from the accumulated rotation angle of the substrate based on the reference position, the incident position of the electron beam is moved to the drawing start position of the second circumferential track. Positioning ,
In the positioning, the first and second circumferential tracks are kth and k + 1th circumferential tracks, the position on the spiral track corresponding to the drawing start position on the first circumferential track, and the reference position, respectively. R ₀ , the pitch of the spiral track P, the relative movement speed of the irradiation position with respect to the spiral track V, and the angle difference of the drawing start position between the first and second circumferential tracks Δθte (k )
Expression R ₀ · (2π + Δθte (k + 1)) / V ± P · ((2π (k + 1) + Σ (n = 0 → k + 1) · Δθte (n)) ² − (2π · k + Σ (n = 0 → k) · Δθte (N)) An electron beam drawing apparatus for deflecting the electron beam based on a deflection control signal having a period calculated using ² ) / (4π · V) . The substrate the writing start of the first circumferential track, the drawing start position of the first circumferential track, the accumulated rotation angle of the substrate based on the reference position, the drawing start position of the second circumferential track When the difference from the cumulative rotation angle of the substrate based on the reference position exceeds 2π, the substrate rotates from the start of drawing the first circumferential track to an angle that reaches the difference beyond 2π. The electron beam drawing apparatus according to claim 1 , further comprising a blanking device that blanks the electron beam. Electron beam lithography method using an electron beam drawing apparatus according to claim 1 or 2. A step of drawing a pattern on a substrate by the electron beam drawing apparatus according to any one of claims 1 to 3 ;
Developing a pattern formed on the substrate; and a method for producing an information recording medium master. An information recording medium manufacturing method for manufacturing an information recording medium by transferring a pattern to the recording medium using the master disk according to claim 4 .

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